US9585252B2 - Driving printed circuit board for display device and display device having the same - Google Patents

Driving printed circuit board for display device and display device having the same Download PDF

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Publication number
US9585252B2
US9585252B2 US14/846,234 US201514846234A US9585252B2 US 9585252 B2 US9585252 B2 US 9585252B2 US 201514846234 A US201514846234 A US 201514846234A US 9585252 B2 US9585252 B2 US 9585252B2
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pads
dummy
ground pad
signal
dummy ground
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US20160073498A1 (en
Inventor
Inho Yeo
KyongShik JEON
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LG Display Co Ltd
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LG Display Co Ltd
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Assigned to LG DISPLAY CO., LTD. reassignment LG DISPLAY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: JEON, KYONGSHIK, YEO, INHO
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Priority to US15/410,485 priority Critical patent/US9961763B2/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13458—Terminal pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/13306—Circuit arrangements or driving methods for the control of single liquid crystal cells
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09709—Staggered pads, lands or terminals; Parallel conductors in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display

Definitions

  • the present disclosure relates to a driving printed circuit board for a display device and a display device having the driving printed circuit board for a display device, and more particularly to a driving printed circuit board (PCB) for connecting an electronic device for a display device to a display panel, and a display device having the driving PCB.
  • PCB driving printed circuit board
  • LCD liquid crystal display
  • PDP plasma display panel
  • OLED organic light emitting diode display device
  • An LCD includes an array substrate including a thin film transistor, an upper substrate including a color filter, a black matrix and/or the like, and a liquid crystal material layer formed between the array substrate and the upper substrate.
  • the LCD is a device in which an arrangement state of a liquid crystal layer is controlled according to an electric field applied to both electrodes of a pixel area. Therefore, transmittance of light is controlled, and thus an image is displayed.
  • a display panel of the LCD is defined as an active area (AA), which provides an image to a user, and a non-active area (NA), which is adjacent to the AA.
  • the display panel is commonly manufactured by combining a first substrate with a second substrate.
  • the first substrate is the array substrate, in which the pixel area is defined by the forming of the thin film transistor.
  • the second substrate is the upper substrate, in which the black matrix and/or the color filter layer are formed.
  • the array substrate or the first substrate in which the thin film transistor is formed includes a plurality of gate lines (GLs) extending in a first direction, and a plurality of data lines (DLs).
  • One pixel area e.g., P
  • a gate electrode or a source electrode of each thin film transistor may be connected to each gate line and data line.
  • a gate driving unit i.e., a gate driving circuit
  • a data driving circuit or the like is formed in the NA or outside of the panel.
  • the gate driving circuit may be formed on the NA of the display panel in a process of forming various signal lines and a pixel of the display panel.
  • the gate driving circuit may be implemented as a gate in panel (GIP) type in which the gate driving circuit is included in the panel.
  • GIP gate in panel
  • the gate driving circuit and the data driving circuit may be included in the same driver IC and may be separately disposed under the display panel.
  • the display panel including the data driving circuit may be expressed as a liquid crystal monitor.
  • the liquid crystal monitor is connected to a customer system such as a mobile phone, a PC, or a tablet PC, receives a data signal from the customer system, and is operated as a display device for the customer system.
  • a driving printed circuit board which is connected to the liquid crystal monitor to provide various signals to the gate driving circuit and the data driving circuit included in the liquid crystal monitor, is provided.
  • Various driving elements including a timing controller are mounted on the driving printed circuit board.
  • One end of the driving printed circuit board (PCB) is coupled to the liquid crystal monitor through a flexible printed circuit board (FPC) or a flexible circuit film, and another end of the driving PCB is connected to a connection unit of the customer system through a connector (i.e., CNT) unit in which various terminals or pads are formed.
  • a connector i.e., CNT
  • At least one dummy ground pad may be formed in the connector (i.e., CNT) unit of the driving PCB for the customer system. Some of the ground pads may not be electrically connected to a ground, and may be floated.
  • the ground pad floated in the connector (i.e., CNT) unit of the driving PCB for the customer system may possess a static electricity or an external inflow charge, and then the static electricity or the external inflow charge may flow into the liquid crystal monitor while connecting the driving PCB with the customer system.
  • the ground pad may bring about various defects to the liquid crystal monitor.
  • the electronic device connection unit includes a substrate.
  • a plurality of signals pads on the substrate are configured to send signals from an electronic device to a driving printed circuit board (PCB).
  • One or more active ground pads on the substrate are configured to connect at least the driving PCB to a reference voltage of the electronic device.
  • One or more dummy ground pads are disposed on the substrate without extending onto the driving PCB.
  • the one or more dummy ground pads are configured to connect to the reference voltage of the electronic device.
  • One or more connectors are connected to the one or more dummy ground pads, where each of the one or more connectors is configured to electronically couple at least a subset of the one or more dummy ground pads to the one or more active ground pads.
  • a driving printed circuit board (PCB) coupling a display panel to an electronic device is also provided.
  • the driving PCB includes a substrate and a plurality of signal lines disposed on the substrate. The signal lines are configured to receive signals from the electronic device for driving the display panel.
  • the driving PCB also includes one or more ground metal patterns on the substrate, and applies a reference voltage to the one or more ground metal patterns.
  • An electronic device connection unit of the driving PCB is configured to connect the driving PCB to the electronic device.
  • the electronic device connection unit includes a plurality of signal pads on the substrate and coupled to the signal lines of the driving PCB. The signal pads are configured to send signals from the electronic device to the driving PCB.
  • One or more active ground pads on the substrate are coupled to the ground metal patterns of the driving PCB, where the one or more active ground pads are configured to connect at least the driving PCB to a reference voltage of the electronic device.
  • One or more dummy ground pads of the electronic device connection unit, disposed on the substrate without extending onto the driving PCB, are configured to connect to the reference voltage of the electronic device.
  • One or more connectors are connected to the one or more dummy ground pads. Each of the one or more connectors is configured to electrically couple at least a subset of the one or more dummy ground pads to the one or more active ground pads.
  • the electronic device connection unit includes a substrate and a plurality of signal pads on the substrate.
  • the signal pads are configured to send signals from an electronic device to a driving printed circuit board (PCB).
  • One or more active ground pads on the substrate are configured to connect at least the driving PCB to a reference voltage of the electronic device.
  • One or more dummy ground pads are disposed on the substrate without extending onto the driving PCB.
  • the one or more dummy ground pads are configured to connect to the reference voltage of the electronic device.
  • One or more connectors are connected to the dummy ground pads. Each of the connectors is configured to electrically couple at least a subset of the one or more dummy ground pads to the one or more active ground pads.
  • FIGS. 1A and 1B are configuration diagrams of a display device including a display panel, a customer system and a driving printed circuit board which connects the display panel to the customer system;
  • FIGS. 2 and 3 are views for a customer system connector unit of a driving PCB applied to an embodiment of the present disclosure, FIG. 2 is an enlarged plan view of the customer system connector unit, and FIG. 3 is an equivalent circuit diagram for the customer system connector;
  • FIG. 4 is an enlarged plan view of the customer system connector unit of the driving PCB according to an embodiment of the present disclosure
  • FIG. 5 is an enlarged plan view of a customer system connector unit of a driving PCB according to another embodiment of the present disclosure.
  • FIG. 6 is an enlarged plan view of a customer system connector unit of a driving PCB according to another embodiment of the present disclosure.
  • first”, “second”, “A”, “B”, “(a)”, “(b)” and the like may be used.
  • Each of these terminologies is not used to define an essence, order or sequence of a corresponding component but used merely to distinguish the corresponding component from other component(s).
  • another structural element may “be connected to”, “be coupled to”, or “be in contact with” the structural elements as well as that the certain structural element is directly connected to or is in direct contact with another structural element.
  • FIGS. 1A and 1B are configuration diagrams of a display device including a display panel, a customer system and a driving printed circuit board which connects the display panel to the customer system.
  • a detailed configuration diagram of a display device to which an embodiment of the present disclosure may be applied may include a display panel 110 , a customer system 120 such as a user terminal, a test device, or the like, and a driving printed circuit board (PCB) 200 .
  • the driving PCB 200 may connect the display panel with the customer system, and may include a connector unit connected to the customer system.
  • various driving elements of a display device may be mounted on the driving PCB 200 .
  • the display panel 110 may be a liquid crystal display panel, but is not limited thereto. That is, the display panel 110 may be another type of display panel such as an organic light emitting diode (OLED) display device, a plasma display panel (PDP) and the like.
  • OLED organic light emitting diode
  • PDP plasma display panel
  • a type of a display panel which may be connected to the driving PCB 200 according to an embodiment of the present disclosure is not limited to a specific type.
  • the display panel according to an embodiment of the present disclosure is regarded as the liquid crystal display panel.
  • the liquid crystal display panel which is the display panel 110 includes an array substrate as a lower substrate, a color filter substrate as an upper substrate, and a liquid crystal layer injected between the array substrate and the color filter substrate.
  • the array substrate includes a plurality of gate lines, a plurality of data lines, and a plurality of thin film transistors.
  • the color filter substrate includes a color filter and a black matrix.
  • a plurality of pixels P which are defined as crossing areas of the gate lines GL and the data lines DL are formed in the display panel 110 . That is, in the lower array substrate, the data lines and the gate lines cross, and the pixels including m*n (each of m and n is a positive integer) liquid crystal cells (i.e., Clc) are formed in a matrix type. In the display panel 110 , k (k is a positive integer) dummy lines (not shown) may be further formed.
  • Each liquid crystal cell i.e., Clc
  • Clc includes a thin film transistor (TFT), a pixel electrode connected to the TFT, a storage capacitor Cst, and the like.
  • the liquid crystal cell (Clc) is driven by a voltage difference between a pixel electrode and a common electrode, adjusts transmittance of incident light, and thus implements a display image corresponding to an image data.
  • the pixel electrode charges a data voltage through the TFT
  • the common electrode receives a common voltage (i.e., Vcom).
  • the black matrix, the color filter and the common electrode are formed on an upper glass substrate of the display panel 110 .
  • the common electrode is formed on the upper glass substrate in a vertical electric field driving method such as a TN mode and a VA mode.
  • the common electrode may be formed on a lower glass substrate together with the pixel electrode in a horizontal electric field driving method such as an IPS mode or an FFS mode.
  • a gate driving circuit 112 for providing a gate output signal (i.e., Vout) to a gate line may be directly formed on the lower substrate of the display panel through a TFT array process according to a gate in panel (GIP) method.
  • GIP gate in panel
  • the gate driving circuit 112 may be formed in the non-active area (NAA) outside the active area (AA) of the display panel 110 , and may be symmetrically formed at left and right sides (or upper and lower sides) of the panel, but is not limited thereto.
  • the driving PCB 200 is a printed circuit board including a driving element such as a timing controller (i.e., T-CON) and a data driving circuit (i.e., D-IC).
  • the driving PCB 200 may include a main substrate area 210 on which the driving element and various signal lines are formed, and a connector unit disposed at both sides of the main substrate area 210 .
  • the connector unit may include a display panel connection unit 220 and a customer system connector unit 230 .
  • the display panel connection unit 220 is for connecting the driving PCB 200 to the display panel 110 through a flexible PCB (FPCB), a tape carrier package (TCP) or the like at one end of the driving PCB 200 .
  • the customer system connector unit 230 is for connecting the driving PCB 200 to a customer system such as a user terminal or test equipment.
  • the driving PCB 200 may be manufactured as a type of the FPCB.
  • the driving PCB 200 includes the timing controller (i.e., T-CON), the data driving circuit (i.e., D-IC), and the like, but is not limited thereto.
  • the driving circuit may be not included in the display panel 110 , and all driving circuit elements such as the timing controller, the gate driving circuit and the data driving circuit may be mounted on the driving PCB 200 which connects the display panel with the customer system 120 .
  • the display panel 110 may be a display panel of a chip on glass (COG) or a gate in panel (GIP) structure in which the gate driving circuit element is directly formed in the NA disposed at one side of the display panel 110 .
  • COG chip on glass
  • GIP gate in panel
  • the gate driving circuit 112 may be formed in the display panel 110 and the data driving circuit (i.e., D-IC) 114 may be mounted in the display panel or a separate FPCB.
  • the gate driving circuit or the data driving circuit may not be included, and other driving elements necessary to drive the display panel may be included.
  • the driving PCB 200 included in an embodiment of the present disclosure should be understood as a concept including all types of PCB, printed circuit film or the like, which include at least one element necessary to drive the display panel and is for connecting the display panel 110 or the liquid crystal monitor (LCM) to the customer system.
  • PCB printed circuit film or the like
  • the driving PCB 200 includes the customer system connector unit 230 to be connected to the connection unit of the customer system 120 , in addition to the main substrate area 210 in which the driving element and the like are disposed.
  • the customer system connector unit 230 of the driving PCB 200 may include a signal pad and a ground pad.
  • the signal pad is formed at an end portion of a plurality of signal lines extending from the main substrate area 210 .
  • the ground pad extends from a ground pattern formed in the main substrate area.
  • the customer system connector unit 230 of the driving PCB 200 may include a plurality of dummy ground pads. When the customer system connector unit 230 of the driving PCB 200 is connected to the customer system, a ground signal is applied to the plurality of dummy ground pads, and the plurality of dummy ground pads are floated when considering only the driving PCB 200 .
  • the dummy ground pad When the dummy ground pad is connected to the customer system, since the dummy ground pad electrically receives a ground signal, the dummy ground pad may play a role of increasing an electrical stability of various signal lines, especially a pair of signal lines. However, when the dummy ground pad is not connected to the customer system, an external charge due to an electrostatic discharge (ESD), an electrical overstress (EOS) or the like may be stored in the dummy ground pad, and then the external charge may flow into an adjacent pad. Thus, the dummy ground pad may bring about electrical damage to the display panel.
  • ESD electrostatic discharge
  • EOS electrical overstress
  • a driving PCB for connecting a display panel and a customer system.
  • the driving PCB includes a main substrate area including at least one display panel driving element, and a customer system connector unit formed at one end of the main substrate area and connected to a connection unit of the customer system.
  • the customer system connector unit includes at least one dummy ground pad, and a connection line electrically connecting at least one of dummy ground pads to an adjacent ground pad.
  • FIGS. 2 and 3 are views for a customer system connector unit of a driving PCB.
  • FIG. 2 is an enlarged plan view of the customer system connector unit
  • FIG. 3 is an equivalent circuit diagram for the customer system connector.
  • a plurality of signal lines 310 and 320 are formed in the main substrate area 210 .
  • a plurality of signal pads 360 are extended from the signal lines and formed in an end portion of the signal lines.
  • a plurality of ground metal patterns 330 are formed in the main substrate area 210 , and a ground signal is applied to the ground metal pattern in the driving PCB. Meanwhile, a ground pad 370 directly extending from the ground metal pattern 330 is formed in the customer system connector unit 230 .
  • the signal lines may include, for example, a single signal line 310 such as a high potential voltage signal (e.g., VDD), and a pair of signal lines 320 and 320 ′ for providing a pair of differential signals.
  • a single signal line 310 such as a high potential voltage signal (e.g., VDD)
  • a pair of signal lines 320 and 320 ′ for providing a pair of differential signals.
  • the pair of signal lines 320 and 320 ′ may be, for example, signal lines for providing a DO negative (DON) and a DO positive (DOP) signals, signal lines for providing a clock negative (CLKN) and a clock positive (CLKP) signals, or the like.
  • the pair of signal lines are adjacently disposed so as to maximize a transmission characteristic, as a circuit type recently used often to change a parallel structure to a serial structure.
  • electromagnetic Interference is reduced by providing a ground signal to an adjacent area of the pair signal line to form a balanced electromagnetic field (EMF).
  • a plurality of the pair of signal lines 320 and 320 ′ are formed in the main substrate area of the driving PCB 200 , and a pair of signal pads 322 and 322 ′ are formed at the end portions of each of the plurality of the pairs of signal lines 320 and 320 ′.
  • Corresponding signals are applied to the pair of signal pads 322 from the customer system, and the signals are applied to the driving PCB 200 and the display panel 110 along the pair of signal lines 320 and 320 ′.
  • a dummy ground pad 380 is formed between a pair of signal pads 322 and 322 ′ for an electrical stability of the pair of signal lines.
  • the driving PCB 200 is connected to the customer system 120 , since the ground signal is applied to the dummy ground pad from the customer system, the dummy ground pad secures the electrical stability of the pair of signal pads or the differential signal applied to the pair of signal pads.
  • At least one other dummy ground pad may be formed between a pair of signal pads and adjacent to another pair of signal pads.
  • the dummy ground pad formed between a pair of signal pads 320 and 320 ′ is distinguished and described as a first dummy ground pad 380
  • two dummy ground pads disposed between adjacent pairs of signal pads are distinguished and described as a second dummy ground pad 390 .
  • the first dummy ground pad 380 and the second dummy ground pad 390 When the first dummy ground pad 380 and the second dummy ground pad 390 are connected to the customer system, the first dummy ground pad 380 and the second dummy ground pad 380 receive the ground signal from the customer system, and thus improve the electrical stability of the pair of signal lines and the like. However, before the first dummy ground pad 380 and the second dummy ground pad 390 are connected to the customer system, the first dummy ground pad 380 and the second dummy ground pad 390 are electrically floated based on the driving PCB.
  • the single signal pad 360 and the pair of signal pads 322 which are signal pads to which various signals are applied are shown in white without a shadow
  • the ground metal pattern 330 formed in the main substrate and the ground pad 370 directly extending from the ground metal pattern 330 are shown as a deviant crease line shadow
  • the first dummy ground pad 380 and the second dummy ground pad 390 are shown as a gray area.
  • the first dummy ground pad 380 and the second dummy ground pad 390 are metal patterns electrically floated before the first dummy ground pad 380 and the second dummy ground pad 390 are connected to the customer system. Therefore, the first dummy ground pad 380 and the second dummy ground pad 390 may possess a static charge or other abnormal charges generated in the outside, and then the abnormal external charges possessed in the first dummy ground pad 380 and the second dummy ground pad 390 may flow into an adjacent pad and the like. Thus, the abnormal external charge may damage elements in the driving PCB or the display panel.
  • the dummy ground pad formed in the customer system connector unit of the driving PCB connecting the display panel to the customer system is coupled to an adjacent ground pad to resolve the above-mentioned problems.
  • FIG. 4 is an enlarged plan view of the customer system connector unit 230 of the driving PCB according to an embodiment of the present disclosure.
  • the driving PCB by an embodiment of the present disclosure is provided to connect the display panel 110 to the customer system 120 .
  • the driving PCB includes the main substrate area 210 including at least one display panel driving element, and the customer system connector unit 230 formed at one end of the main substrate area and connected to a connection unit of the customer system.
  • the customer system connector unit 230 includes at least one dummy ground pad, and at least one of the dummy ground pads is electrically connected to an adjacent ground pad through a connection line.
  • At least one single signal line 310 and at least one pair of signal lines 320 and 320 ′ are formed in the main substrate area 210 , and at least one ground metal pattern 330 is formed between signal lines.
  • the pair of signal pads 322 and 322 ′ extending from the pair of signal lines are formed, the first dummy ground pad 380 disposed between the two signal pads included in a pair of signal pads is formed, and two second dummy ground pads 390 are formed between adjacent pairs of signal pads, i.e between one pair of signal pads and adjacent to another pair of signal pads.
  • the ground pad 370 directly extending from the ground metal pattern 330 of the main substrate area is also formed in the customer system connector unit 230 of the driving PCB 200 .
  • the second dummy ground pad 390 is electrically connected to the ground metal pattern 330 disposed on the main substrate area through an additional connection line 420 , and the first dummy ground pad 380 is connected to the adjacent second dummy ground pad 390 through the connection line 410 .
  • the second dummy ground pad 390 connected to the ground metal pattern 330 through the additional connection line 420 performs as a type of ground pad function and the first dummy ground pad disposed between two signal pads 322 and 322 ′ included in the pair of signal pads is connected to the ground pad through the connection line 410 , the first and second dummy ground pads are taken out of a floating state.
  • both of the first and second dummy ground pads 380 and 390 are electrically connected to the ground metal pattern to which the ground signal is applied in the driving PCB 200 , the first and second dummy ground pads 380 and 390 are taken out of the floating state. Therefore, although the driving PCB 200 is not connected to the customer system, damage of the display panel or the driving circuit unit from the external electrical shock such as ESD or EOS may be prevented.
  • the dummy ground pad is electrically grounded even when the driving PCB 200 is not connected to the customer system 120 . Therefore, although the dummy ground pad may accumulate abnormal charge when the driving PCB 200 is not connected to the customer system 120 , the connections to the ground metal patterns of the driving PCB 200 dissipate the abnormal charge from the dummy ground pads to reduce damage to the driving PCB 200 .
  • FIG. 5 is an enlarged plan view of a customer system connector unit 230 of a driving PCB 200 according to another embodiment of the present disclosure.
  • FIG. 5 has a similar configuration to the embodiment of FIG. 4 , and only a position where an additional connection line 420 ′ is formed is different from that of the embodiment of FIG. 4 .
  • the additional connection line 420 for electrically connecting the second dummy ground pads 390 which are two dummy ground pads disposed between the adjacent pairs of signal pads 322 and 322 ′, to the ground connects the second dummy ground pads 390 directly to the ground metal pattern 330 of the driving PCB.
  • both of the first and second dummy ground pads 380 and 390 are electrically coupled to the ground metal pattern to which the ground signal is applied in the driving PCB 200 , even though the driving PCB is not connected to the customer system, the electrical damage of the display panel and the like from external electrical shock may be prevented.
  • FIG. 6 is an enlarged plan view of a customer system connector unit 230 of a driving PCB 200 according to another embodiment of the present disclosure.
  • the first dummy ground pad 380 is connected to only the second dummy ground pad 390 adjacent to the first dummy ground pad 380
  • the first dummy ground pad 380 which is disposed between the two signal pads 322 and 322 ′ included in a pair of signal pads and is floated, is directly connected to the ground pad 370 adjacent to the first dummy ground pad 380 .
  • the customer system connector unit may include a first connection line 630 for directly connecting the first dummy ground pad 380 to the ground pad 370 adjacent to the first dummy ground pad 380 , and a second connection line 610 connecting the first dummy ground pad 380 to the second dummy ground pad 390 electrically connected to the ground metal pattern 330 through the additional connection line 420 .
  • the customer system connector unit 230 of the driving PCB 200 connecting the display panel 110 to the customer system 120 includes at least one floated dummy ground pad, and the dummy ground pads are each electrically coupled to an adjacent ground pad through connection lines.
  • the dummy ground pad is the first dummy ground pad 380 disposed between the pair of signal pads 322 and 322 ′ respectively attached to the corresponding end of the pair of signal lines formed in the main substrate area 210 of the driving PCB 200 .
  • the above-mentioned ground pad may be the first ground pad 370 directly extending from the ground metal pattern 330 , which is formed in the main substrate area, and may be the adjacent second dummy ground pad 390 electrically coupled to the ground metal pattern 330 or the first ground pad 370 through the additional line.
  • the second dummy ground pad 390 is disposed between at least two pairs of signal pads, and is connected to the ground metal pattern 330 or the first ground pad 370 through the additional connection lines 420 and 420 ′, the second dummy ground pad 390 acts as a type of a ground pad.
  • connection line for electrically coupling the first dummy ground pad 380 to a ground area may include a first connection line 630 directly connecting the first dummy ground pad 380 to the first ground pad 370 , and a second connection line 610 connecting the first dummy ground pad 380 to the second dummy ground pad 390 adjacent to the first dummy ground pad 380 , in this case, the second dummy ground pad is electrically coupled to the ground metal pattern through the additional connection line.
  • the dummy ground pads 380 and 390 defined in embodiments of the present disclosure should be understood as all pads to which the ground signal is electrically applied in order to provide the electrical stability of the pair of signal lines and the like when the driving PCB 200 is connected to the customer system 120 , and which are floated when the driving PCB 200 is not connected to the customer system 120 .
  • the plurality of dummy ground pads which are floated in order to provide the electrical stability when the driving PCB is connected to the customer system are included in the connector unit of the driving PCB, and the plurality of dummy ground pads are electrically coupled to the ground area, the plurality of dummy ground pads are taken out of the floating state. Therefore, even in the state in which the driving PCB is not connected to the customer system, the damage of the display panel or the driving circuit unit from the external electrical shock such as ESD, EOS, and the like may be prevented.

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KR20210046885A (ko) * 2019-10-18 2021-04-29 삼성전자주식회사 이미지 센서, 카메라 모듈, 및 전자 기기
CN113345322A (zh) * 2020-03-02 2021-09-03 元太科技工业股份有限公司 显示面板的走线结构
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US9961763B2 (en) 2018-05-01
US20160073498A1 (en) 2016-03-10
US20170135201A1 (en) 2017-05-11
KR102194484B1 (ko) 2020-12-24
CN105404063B (zh) 2018-09-04
KR20160029958A (ko) 2016-03-16
CN105404063A (zh) 2016-03-16

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