US8253158B2 - Organic electroluminescence display and method for manufacturing the same - Google Patents

Organic electroluminescence display and method for manufacturing the same Download PDF

Info

Publication number
US8253158B2
US8253158B2 US13/136,846 US201113136846A US8253158B2 US 8253158 B2 US8253158 B2 US 8253158B2 US 201113136846 A US201113136846 A US 201113136846A US 8253158 B2 US8253158 B2 US 8253158B2
Authority
US
United States
Prior art keywords
light emitting
emitting layer
layer
organic
underlayer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US13/136,846
Other languages
English (en)
Other versions
US20120025192A1 (en
Inventor
Takahisa Shimizu
Shohei Kimura
Tatsuya Midorikawa
Shinya Abe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toppan Inc
Original Assignee
Toppan Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toppan Printing Co Ltd filed Critical Toppan Printing Co Ltd
Assigned to TOPPAN PRINTING CO., LTD. reassignment TOPPAN PRINTING CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SHIMIZU, TAKAHISA, KIMURA, SHOHEI, MIDORIKAWA, TATSUYA, ABE, SHINYA
Publication of US20120025192A1 publication Critical patent/US20120025192A1/en
Application granted granted Critical
Publication of US8253158B2 publication Critical patent/US8253158B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/17—Passive-matrix OLED displays
    • H10K59/173—Passive-matrix OLED displays comprising banks or shadow masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Definitions

  • the present invention is related to an organic electroluminescence display and a method for manufacturing an electroluminescence display.
  • An organic EL (Electro Luminescence) element emits light when a current is supplied to a light emitting medium layer between two opposed electrodes, and, in order to achieve efficient light emission, it is important to keep a film thickness of the light emitting medium layer to about 100 nm. Further, in the case of forming a display from the organic EL element, it is necessary to perform patterning on the organic EL element with high definition.
  • a low molecular material and a high molecular material can be used as the organic light emitting material for the light emitting layer formed on a substrate or the like.
  • the low molecular material is subjected to resistive heating vapor deposition and the like to form a thin film, and at the same time the patterning is performed by using a microscopically patterned mask.
  • this method has a problem in that patterning accuracy is reduced with an increase in size of a substrate.
  • the high molecular material has recently been used as the organic light emitting material, and a method of forming a thin film by wet coating with a coating liquid obtained by dispersing or dissolving the organic light emitting material into a solvent has been tried.
  • Spin coating, bar coating, projection coating, dip coating, and the like are known as the wet coating method for the thin film formation.
  • the wet coating methods have difficulty in realizing high definition patterning and color coding with R, G, and B, and it is considered that the thin film is most effectively formed by a printing process that is capable of achieving excellent color coding and patterning.
  • a glass substrate is often used as a substrate in an organic electroluminescence element or a display.
  • a method which uses a metal hard printing plate such as a gravure printing method is unsuitable.
  • Offset printing which uses a rubber blanket having elasticity and a relief printing method which uses a rubber printing plate and photosensitive resin printing plate having elasticity are suitable.
  • a method (Japanese Patent Laid-Open No. 2001-93668 Official Gazette) using offset printing and a method (Japanese Patent Laid-Open No. 2001-155858 Official Gazette) using relief printing are actually proposed as an attempt to achieve these printing methods.
  • a cylindrically pressing type relief printing machine comprises a cylinder type blanket cylinder and a flat surface table (not illustrated in the figure) which is fixed and placed at a predetermined position.
  • this machine includes the following components: a flat surface table for horizontally fixing a flat relief printing plate at a predetermined position; a flat surface table for horizontally fixing a substrate (a substrate to be printed) at a predetermined position; an ink supplying roller which attaches an ink on a top surface by moving, rotating and touching on a surface of a relief printing plate placed and fixed on a surface table for fixing a relief printing plate; and a blanket cylinder, wherein an ink on the top surface is transferred to a blanket which has a surface is made of rubber, by rotation and movement of the blanket rotating on a surface of a relief printing plate in a stand by mode of an ink supplying roller, and further an ink transferred on a surface of a blanket is transferred to a substrate (a substrate to be printed) by the rotation and movement of a blanket
  • an ink of a viscous type in other words, thixotropy type
  • a liquid type used for a relief printing method has the most suitable viscosity and surface tension.
  • a viscosity modifier such as a thickener or a surface activating agent for adjusting a surface tension is generally added to a liquid type ink.
  • solubility thereof may be limited or impurity may be not preferably included therein.
  • an organic light emitting material is dispersed or dissolved in a solvent such as water, alcohol or an organic solvent (including a binder resin if necessary), thereby an ink for printing or coating is made.
  • a solvent such as water, alcohol or an organic solvent (including a binder resin if necessary)
  • a display panel for use in mobile terminals such as a mobile phone, PDA (personal digital assistant) needs a high definition display of 100 ppi or more.
  • the distance between pixels is short, for example, 40-10 ⁇ m. Therefore, in the case where positional accuracy during printing is poor, a printing pattern may be shifted near to an adjacent pixel and solidify.
  • a solidified printed pattern may be dissolved again in an approaching printing ink, and color mixture frequently occurs.
  • a phenomenon of energy transfer causes a material having a long light emitting wavelength to be preferentially emitted in an organic EL element. That is, in the case where blue having a short wavelength is mixed with red having a long wavelength, the color of the light which is emitted shifts significantly from blue, and the color of the light emitted is close to white.
  • a light emitting layer by a printing method is significantly influenced by the wettability of a surface of a region to be formed. Therefore, in the case where a layer directly below (hereinafter, an underlayer) of a light emitting layer is conventionally formed only inside a pixel of a partition wall substrate, wettability of an upper surface of a partition wall which is not printed is different from wettability inside a pixel. Therefore, a film thickness of a light emitting layer can not be stably uniform.
  • a film forming state of the light emitting layer changes depending on the film forming state of the underlayer. That is, if a film thickness of an underlayer is not uniform, concave and convex of a surface or non-uniform wettability of a surface produce a light emitting layer of having a non-uniform film thickness and thereby, uneven light emitting occurs.
  • the present invention provides an organic electroluminescence display and a method for manufacturing the display, the display having the following merits. Shift of chromaticity minimized as much as possible, a light emitting layer having a uniform film thickness is formed and thereby, a uniform and stable light is emitted and production yield is improved.
  • the first aspect of the present invention is an organic electroluminescence display, including:
  • the second aspect of the present invention is the organic electroluminescence display according to the first aspect
  • the third aspect of the present invention is a method for manufacturing an organic electroluminescence display
  • the method including:
  • the fourth aspect of the present invention is the method for manufacturing an organic electroluminescence display according to the third aspect, wherein, in the fourth step, the first light emitting layer is formed by forming a pattern using an ink including a first colorant emitting light of the first wavelength, and wherein in the fifth step, after the first light emitting layer is solidified, the second light emitting layer is formed by forming a pattern using an ink including a second colorant emitting light of the second wavelength.
  • the fifth aspect of the present invention is the method for manufacturing an organic electroluminescence display according to the fourth aspect, wherein, in the fourth step and fifth steps, the first and second light emitting layers are formed by transferring the ink including the first colorant and the ink including the second colorant, respectively, from a transfer body to the substrate.
  • the sixth aspect of the present invention is the method for manufacturing an organic electroluminescence display according to the fifth aspect, wherein a width of a pattern of the ink transferred from the transfer body to the substrate is longer than a distance between adjacent partition walls.
  • the seventh aspect of the present invention is the method for manufacturing an organic electroluminescence display according to the third aspect, wherein, in the fifth step, the second light emitting layer is formed so as to overlap the first light emitting layer wherein an overlapping point of the first light emitting layer and the second light emitting layer is above the underlayer formed on the partition wall.
  • the eighth aspect of the present invention is the method for manufacturing an organic electroluminescence display according to the third aspect, wherein the first light emitting layer and the second light emitting layer are formed by a relief printing method.
  • the ninth aspect of the present invention is the method for manufacturing an organic electroluminescence display according to the third aspect, wherein, in the third step, the underlayer is formed by a relief printing method.
  • FIG. 1 is a cross sectional diagram of a relief printing plate used in an apparatus for manufacturing an organic EL display.
  • FIG. 2 is a schematic diagram of an apparatus for manufacturing an organic EL display.
  • FIG. 3 is a cross sectional diagram showing a structure of an organic EL display 100 a.
  • FIG. 4 is a cross sectional diagram showing a structure of an organic EL display 100 b.
  • FIG. 5 is a diagram showing a method for manufacturing an organic EL display 100 a of FIG. 3 .
  • FIG. 6 is a diagram showing a method for manufacturing an organic EL display 100 a of FIG. 3 .
  • FIG. 7 is a diagram showing another method for manufacturing an organic EL display 100 a of FIG. 3 .
  • FIG. 8 is a diagram showing another method for manufacturing an organic EL display 100 a of FIG. 3 .
  • FIG. 9 is a planar view diagram showing a structure of an organic EL display 100 a of FIG. 3 .
  • FIG. 10 is a planar view diagram showing another structure of an organic EL display 100 a of FIG. 3 .
  • FIG. 11 is a planar view diagram showing a step of forming an underlayer of an organic EL display.
  • FIG. 12 is a photograph of emitted light from an organic EL display manufactured in Example 1 and 2 of the present invention.
  • FIG. 13 is a photograph of emitted light from an organic EL display manufactured in Comparative Example 1.
  • FIG. 14 is a cross sectional diagram showing a cause of a color mixture in an organic EL display manufactured in Comparative Example 1.
  • FIG. 15 is a cross sectional diagram showing a cause of a color mixture in an organic EL display manufactured in Comparative Example 1.
  • 1 a . . . a base material layer of a relief printing plate 1 b . . . a convex part forming material layer, 2 . . . an ink tank, 3 . . . an ink ejection part, 4 a . . . an ink, 5 . . . an anilox roll, 6 . . . a plate cylinder, 7 . . . a body to be printed, 8 . . . a platen for fixing a body to be printed, 9 . . . a doctor, 10 . . . a substrate, 11 a , 11 b , 11 c and 11 d . . .
  • a partition wall 12 a , 12 b and 12 c . . . a first electrode, 13 . . . a hole transport layer, 14 R, 14 G and 14 B . . . a light emitting layer, 15 . . . a second electrode, 16 . . . a sealing resin, 17 . . . a sealing substrate, 18 . . . an underlayer, 19 . . . an organic electroluminescence element, 100 a and 100 b . . . an organic electroluminescence display, S . . . a relief printing plate.
  • FIG. 1 is a sectional side view of a relief printing plate for manufacturing an organic EL display of one embodiment of the present invention.
  • 1 a is a base material layer of a relief printing plate
  • 1 b is a convex part forming material layer (a convex part) on the base material layer 1 a .
  • a relief printing plate S is comprised of both the base material layer 1 a and the convex part forming material layer 1 b.
  • Rubbers such as butadiene acrylonitrile rubber, silicone rubber, isoprene rubber, styrene-butadiene rubber, butadiene rubber, chloroprene rubber, isobutylene-isoprene rubber, acrylonitrile rubber, ethylene propylene rubber and urethane rubber, synthetic resins such as polyethylen, polystyrene, polybutadiene, polyvinyl chloride, polyvinylidene chloride, polyvinyl acetate, polyamide, polyethersulfone, polyethylene terephthalate, polyethylenenaphthalate, polyethersulfone, polyvinyl alcohol and copolymer thereof, and natural polymers such as cellulose can be used for the convex part forming material layer 1 b.
  • a material including a water-soluble polymer as a main component should be used, since the material has high resistance to an organic solvent which constitutes a solution or a dispersion of an organic light emitting material which is a component of an ink.
  • a coating ink liquid of an organic light emitting material which is one of electronic materials a material which has the merit the lower the boiling point is, the easier the drying process is performed is used.
  • a solvent which has a very low boiling point is used, an ink is dried on an upper part of the relief printing plate. Therefore, ink is reasonably mixed with a solvent having a boiling point of 130 degrees Celsius or more. Thereby, ink is prevented from drying.
  • solvents having a boiling point of 130 degrees Celsius or more include 2,3-dimethylanisole, 2,5-dimethylanisole, 2,6-dimethylanisole, trimethyl anisole, tetralin, methyl benzoate, ethyl benzoate, cyclohexylbenzene, n-amyl benzene, tert-amyl benzene, diphenyl ether and dimethyl sulfoxide.
  • solvents having a boiling point of 130 degrees Celsius or more include 2,3-dimethylanisole, 2,5-dimethylanisole, 2,6-dimethylanisole, trimethyl anisole, tetralin, methyl benzoate, ethyl benzoate, cyclohexylbenzene, n-amyl benzene, tert-amyl benzene, diphenyl ether and dimethyl sulfoxide.
  • One or a plurality of solvent can be selected among them.
  • Light emitting materials dissolving in the above solvents obtainable by dissolving a low molecular fluorescent dye into a polymer such as polystyrene, polymethylmethacrylate, polyvinylcarbazole and polymer light emitters such as a polyphenylenevinylene (PPV) derivative and a polyalkylfluorene (PAF) derivative are usable.
  • a polymer such as polystyrene, polymethylmethacrylate, polyvinylcarbazole and polymer light emitters such as a polyphenylenevinylene (PPV) derivative and a polyalkylfluorene (PAF) derivative
  • the high molecular light emitting materials Since it is possible to form a film from these high molecular (polymer) light emitting materials (high molecular light emitting materials for EL elements) by a coating process or a printing process by dissolving the high molecular material into a solvent to make an ink, the high molecular light emitting materials have advantages of enabling film formation under atmosphere conditions and low installation costs as compared to the cost of manufacturing the organic EL display using the low molecular materials.
  • a relief printing plate S can be used for a relief printing plate S.
  • a flexo printing plate or a resin type relief printing plate which is commercially available can be used for a relief printing plate S.
  • a method for forming a relief printing plate is as follows.
  • a material of a convex part forming material layer 1 b on a base material layer 1 a is pattern-exposed and cured using a photo mask.
  • An uncured resin is washed away in developing.
  • Relief formation can be performed by a photolithography method (after developing, drying and exposure are performed, thereby a relief of a predetermined pattern is formed), a laser ablation method, a cutting operation or well-known methods.
  • a printing machine equipped with a relief printing plate can be used for printing in a relief printing method.
  • a relief printing plate can be equipped with a cylindrically pressing type relief printing machine or a cylindrically pressing type relief offset printing machine to perform printing.
  • FIG. 2 is a schematic diagram of an apparatus for manufacturing an organic EL display of an embodiment of the present invention.
  • An apparatus for manufacturing an organic EL display shown in FIG. 2 is a cylindrically pressing type relief printing machine.
  • the machine has an ink tank 2 , ink ejecting part 3 (chamber) which supplies an ink, anilox roll 5 which rotates in a direction shown by the arrow D 1 , the anilox roll 5 comprising a hard type roll made of a metal or a resin, or a soft type elastic roll, and plate cylinder 6 which rotates in a direction shown by the arrow D 2 , the plate cylinder being capable of having a relief printing plate S (see FIG. 1 ) thereon.
  • a platen 8 which moves reciprocating a substrate in a direction shown by an arrow D 3 (in a horizontal direction) is arranged under the plate cylinder 6 , and a body to be printed 7 is fixing upon the platen 8 .
  • An ink including a red light emitting colorant, an ink including a green light emitting colorant and an ink including a blue light emitting colorant are contained in the ink tank 2 .
  • Inks of the respective light emitting colorants are individually sent from the ink tank 2 to the ink ejection part 3 , in which color mixture does not occur.
  • the anilox roll 5 is near the ink ejection part 3 and rotates while the anilox roll 5 is in contact with a relief printing plate.
  • ink 4 a ejected from the ink ejection part 3 to a surface of the anilox roll 5 is scraped and becomes uniform in film thickness. That is, ink 4 a of uniform film thickness is transferred to a surface of the anilox roll 5 . Thereafter, ink 4 a of uniform film thickness on a surface of the anilox roll is transferred to a top surface of the convex part 1 b of the relief printing plate arranged on the plate cylinder 6 .
  • the platen 8 for fixing a body to be printed and the body 7 to be printed are horizontally moved towards the left in FIG. 2 for a printing start position, while a position adjustment mechanism adjusts a phase position between a convex pattern comprised of the convex part 1 b of the relief printing plate and the body 7 to be printed.
  • the platen 8 for fixing a body to be printed is horizontally moved towards the left in the figure in accordance with a rotating speed of the plate cylinder 6 , while a surface of the body 7 to be printed touches the convex part 1 b of the relief printing plate S on the plate cylinder 6 at a predetermined pressure.
  • a convex pattern comprised of an ink is printed on a surface of the body 7 to be printed, the ink being on a top surface of the convex part S of the relief printing plate.
  • the body 7 to be printed is printed, the body 7 is removed from the platen 8 for fixing a body to be printed. Thereafter, the next body 7 to be printed is fixed on the platen 8 for fixing a body to be printed. Printing is performed by repeating this operation.
  • FIG. 3 is a cross-sectional diagram showing a structure of an organic EL display 100 a of one embodiment of the present invention.
  • Partition walls 11 a , 11 b , 11 c and 11 d having cross trapezoidal section surfaces are formed on a substrate 10 wherein the partition walls are separated from each other by a predetermined distance.
  • substrate 10 can include TFTs (thin film transistors).
  • First electrodes 12 a (layer-shaped) which are pixel electrodes are respectively formed on substrate 10 between partition walls 11 a and 11 b , between partition walls 11 b and 11 c and between partition wall 11 c and 11 d .
  • a layer-shaped hole transport layer 13 is formed entirely above partition walls 11 a , 11 b , 11 c , 11 d and first electrodes 12 a , 12 b , 12 c . Further, a layer-shaped underlayer 18 is formed entirely above partition walls 11 a , 11 b , 11 c , 11 d and the hole transport layer 13 .
  • a light emitting layer 14 B is formed on an underlayer 18 above partition walls 11 a , 11 b and the hole transport layer 13 by applying an ink including an organic light emitting material including a colorant which emits blue light.
  • a light emitting layer 14 G is formed on an underlayer 18 above partition walls 11 c , 11 d and the hole transport layer 13 by applying an ink including an organic light emitting material including a colorant which emits green light.
  • a light emitting layer 14 R is formed on an underlayer 18 above partition walls 11 b , 11 c and the hole transport layer 13 by applying an ink including an organic light emitting material including a colorant which emits red light.
  • the light emitting layer 14 R overlaps the light emitting layer 14 B above the partition wall 11 b .
  • the light emitting layer 14 R overlaps the light emitting layer 14 G above the partition wall 11 c .
  • the light emitting layer 14 G overlaps the light emitting layer 14 B above the partition wall 11 d.
  • a layer-shaped second electrode 15 (a counter electrode) is formed on light emitting layers 14 B, 14 G and 14 R.
  • a layer of a sealing resin 16 is formed on the second electrode 15 .
  • a sealing substrate 17 is formed on the sealing resin 16 .
  • a region between partition walls 11 a and 11 b , a region between partition walls 11 b and 11 c and a region between partition walls 11 c and 11 d are organic EL elements.
  • a substrate 10 is prepared. Trapezoidal partition walls 11 a , 11 b , 11 c and 11 d are formed on the substrate 10 so as to be between adjacent organic EL elements, in which there is a predetermined space between partition walls.
  • layers of first electrodes 12 a , 12 b and 12 c are formed at regions between partition walls 11 a , 11 b , 11 c and 11 d .
  • the hole transport layer 13 is formed on partition walls 11 a , 11 b , 11 c and 11 d and first electrodes 12 a , 12 b and 12 c .
  • the underlayer 18 is formed on an entire surface including surfaces of partition walls 11 a , 11 b , 11 c and 11 d and a surface of the hole transport layer 13 .
  • the light emitting layer 14 B is formed by applying a pattern of an ink 4 a including a colorant which emits blue light to both a region on partition walls 11 a , 11 b and a region between partition walls 11 a , 11 b .
  • a pattern of the ink 4 a including a colorant which emits green light having a longer wavelength than blue is applied to both region on partition walls 11 c , 11 d and a region between partition walls 11 c , 11 d so that the ink 4 a at least partially overlaps the light emitting layer 14 B. In this way, a light emitting layer 14 G is formed.
  • the ink 4 a including a colorant which emits green light is solidified and dried, a pattern of the ink 4 a including a colorant which emits red light having a longer wavelength than green is applied to both region on partition walls 11 b , 11 c and a region between partition walls 11 b , 11 c so that the ink 4 a at least partially overlaps the light emitting layer 14 B or the light emitting layer 14 G. In this way, the light emitting layer 14 R is formed.
  • a layer of a second electrode 15 is formed on light emitting layers 14 R, 14 G and 14 B. Then, a layer of a sealing resin 16 is formed on the second electrode 15 . Thereafter, a sealing substrate 17 is arranged on a layer of the sealing resin 16 .
  • the ink 4 a can be applied to an entire surface on partition walls 11 a , 11 b , 11 c and 11 d .
  • the following advantages (A1), (A2) and (A3) can be obtained.
  • Light emitting layers 14 R, 14 G and 14 G have an insulating property. Therefore, a leakage current from first electrodes 12 a , 12 b , 12 c , the second electrode 15 or the hole transport layer 13 can be cut off.
  • An organic EL element for an organic EL display 100 a includes a conductive organic light emitting medium layer (light emitting layers 14 R, 14 G, 14 B in FIG. 3 ), electrode layers (electrodes 12 a , 12 b , 12 c in FIG. 3 ) and a counter electrode 15 (a second electrode 15 in FIG. 3 ) arranged at both sides of the organic light emitting medium layer.
  • the element is manufactured as follows. An electrode layer, an organic light emitting medium layer, a counter electrode layer are formed on a substrate 10 in this order. A voltage is applied to the organic light emitting medium layer, thereby an electron and a hole are injected and recombined. At the time of recombination, the organic light emitting medium layer emits light.
  • a hole transport layer 13 is arranged between electrode layers (first electrodes 12 a , 12 b , 12 c ) and organic light emitting medium layers (light emitting layers 14 R, 14 G, 14 B).
  • an electron transport layer can be arranged between a counter electrode (a second electrode 15 ) and organic light emitting layers (light emitting layers 14 R, 14 G, 14 B).
  • the organic EL display 100 a of this embodiment is described in detail in order beginning from a substrate 10 .
  • the substrate 10 is as follows.
  • a thin film transistor (TFT) is formed on a glass or quartz, a plastic film such as polyethersulfone or polycarbonate.
  • a thin film transistor is not especially shown in Figures.
  • Well-known thin film transistors can be used as the thin film transistor provided on the substrate 10 .
  • a thin film transistor having the active layer where a source/drain region and a channel area are formed, the gate insulating film and the gate electrode is exemplified.
  • Configuration of a thin film transistor is not limited to this configuration.
  • staggered type, reverse staggered type, top gate type, and coplanar type are exemplified.
  • the organic EL display 100 a can be an active matrix type or a passive matrix type.
  • an active matrix type thin film transistors are formed for respective pixels, and respective pixels independently emit light.
  • a passive matrix type stripe-shaped anodes and cathodes are perpendicular to each other, and light is emitted at the intersection points.
  • the active layer used for a thin film transistor is not particularly limited, but can be formed with, for example, an inorganic semiconductor material such as amorphous silicon, polycrystalline silicon, microcrystalline silicon or cadmium selenide, or an organic semiconductor material such as a thiophene oligomer or poly(p-phenylenevinylene).
  • an inorganic semiconductor material such as amorphous silicon, polycrystalline silicon, microcrystalline silicon or cadmium selenide
  • an organic semiconductor material such as a thiophene oligomer or poly(p-phenylenevinylene).
  • the active layer may be formed by, for example, a method which comprises laminating amorphous silicon by a plasma CVD method and subjecting to ion doping; a method which comprises forming amorphous silicon by an LPCVD method using a SiH 4 gas, obtaining polysilicon through crystallization of the amorphous silicon by a solid phase growth process, followed by subjecting to ion doping by an ion implantation process; a method which comprises forming amorphous silicon by an LPCVD method using a Si 2 H 6 gas or by a PECVD method using a SiH 4 gas, annealing with a laser such as excimer laser, crystallizing the amorphous silicon to obtain polysilicon, followed by subjecting to ion doping by an ion doping process (low temperature process); a method which comprises laminating polysilicon by a low pressure CVD method or an LPCVD method, thermal oxidation at 1000° C. or higher to form the gate insulating film,
  • a gate insulating film which has been generally used as the gate insulating film can be used, and for example, SiO 2 formed by a PECVD method or an LPCVD method; SiO 2 obtained by subjecting a polysilicon film to thermal oxidation; or the like may be used.
  • a gate electrode which has been generally used as the gate electrode can be used, and examples thereof include metals such as aluminum and copper; high melting point metals such as titanium, tantalum and tungsten; polysilicon; silicide and polycide of a high melting point metal; and the like.
  • the thin film transistor may have a single gate structure, a double gate structure, or a multi gate structure having three or more gate electrodes. In addition, it may also have an LDD structure or an offset structure. Moreover, two or more thin film transistors may be disposed in one picture element.
  • the thin film transistor must be connected so as to function as a switching element of the organic EL element, and the drain electrode of the transistor is electrically connected to the first electrode ( 12 a , 12 b and 12 c ) of the organic EL element.
  • the connection of the thin film transistor and the drain electrode and the first electrode of the organic EL element may be carried out via a connection wire formed in the contact hole that penetrates into the planarized film.
  • the first electrode ( 12 a , 12 b , 12 c ) is formed on a substrate 10 , and patterning thereof is performed according to necessity.
  • the first electrode is sectioned by a partition wall ( 11 a , 11 b , 11 c , 11 d ), and becomes the first electrode corresponding to each pixel.
  • a material of the first electrode which can be used is any one of: metal complex oxides such as ITO (indium-tin complex oxide), indium-zinc complex oxide and zinc-aluminum complex oxide; metal materials such as gold and platinum; and fine grain dispersion films produced by dispersing fine grains of such a metal oxide or a metal material in an epoxy resin or an acrylic resin and laminating the dispersion to form a monolayer or multilayers.
  • metal complex oxides such as ITO (indium-tin complex oxide), indium-zinc complex oxide and zinc-aluminum complex oxide
  • metal materials such as gold and platinum
  • fine grain dispersion films produced by dispersing fine grains of such a metal oxide or a metal material in an epoxy resin or an acrylic resin and laminating the dispersion to form a monolayer or multilayers.
  • a metal material such as Ag or Al on which an ITO film is formed can be used. If necessary, in order to reduce wire resistance of the first electrode, a metal material such as Cu or Al can be added as an assisting electrode.
  • the following methods can be used for a formation method of the first electrode depending on the material: dry methods such as resistance heating evaporation method, electron-beam evaporation technique, reactivity evaporation method, ion plating method and sputtering method; and wet methods such as the gravure process and screen printing. Using these methods, the first electrode is formed on the substrate 10 .
  • dry methods such as resistance heating evaporation method, electron-beam evaporation technique, reactivity evaporation method, ion plating method and sputtering method
  • wet methods such as the gravure process and screen printing.
  • the first electrode is formed on the substrate 10 .
  • the formation method of the first electrode is not limited to these.
  • Existing patterning methods such as mask evaporation method, photolithography method, wet etching method and dry etching method can be used for a patterning method of the first electrode layer ( 12 a , 12 b and 12 c ), depending on a material and a film formation method.
  • the product with a TFT should be formed so that a pixel electrode is electrically connected to a corresponding pixel in a lower layer.
  • Partition walls ( 11 a , 11 b , 11 c and 11 d ) can be formed so as to section a light emitting area corresponding to a respective pixel.
  • first electrode layers are generally formed for respective pixels and the respective pixel tends to occupy as large an area as possible. Therefore, the most preferable shape of a partition wall to be formed so as to cover an edge of a pixel electrode is basically a grid shape where a partition wall sections at the shortest distance of respective first electrode layers.
  • a photosensitive resin for forming partition walls can be a positive resist or a negative resist.
  • a photosensitive resin having an insulating property can be used.
  • a partition wall does not have a sufficient insulating property, if a voltage is applied to a pixel, current flows to an adjacent pixel, a partition wall being arranged between the pixel and the adjacent pixel, through a partition wall. Therefore, display failure occurs.
  • Examples of a photosensitive resin for forming a partition wall include a resin such as a polyimide system, an acrylic resin system, a novolac resin system, a fluorene system. However, the Examples are not limited to these.
  • a light shielding material can be included in a photosensitive resin.
  • a method for forming partition walls can be a conventional method as follows. An inorganic film is uniformly formed on a base body and masked by a resist. Thereafter, dry etching is performed. Alternatively, a photosensitive resin is formed on a base body. Thereafter, a predetermined pattern is formed by a photolithography method. If necessary, an water-repellent agent can be added, or it is irradiated with plasma or UV. Thereby, it can have a liquid-repellent property.
  • a preferable height of a partition wall is equal to or more than 0.1 ⁇ m and equal to or less than 10 ⁇ m. More preferably, it is 0.5-2 ⁇ m. In the case where a height of a partition wall is more than 10 ⁇ m, formation of a counter electrode and sealing are prevented. In the case where a height of a partition wall is less than 0.1 ⁇ m, a partition wall can not fully cover an edge of a first electrode layer, or short circuit between adjacent pixels and a color mixture may occur in the case of forming of a light emitted medium layer.
  • the second electrode 15 is formed on an organic light emitting medium layer.
  • the material discussed below can be used.
  • the material can be of a type with high electron injection efficiency to an organic light emitting medium layer and low work function.
  • the second electrode 15 can include a metal such as Mg, Al, Yb.
  • the following layer stack may be put in a boundary surface of the luminescent medium.
  • the layer stack is that with a chemical compound of about 1 nm thicknesses such as Li and oxidation Li, LiF and Al and Cu of stability and/or high conductivity. Stability should be balanced with electron injection efficiency. Therefore an alloy system may be used.
  • An alloy of more than one kind of metal such as Li, Mg, Ca, Sr, La, Ce, Er, Eu, Sc, Y, and Yb that have a low work function, and metallic elements such as Ag, Al, and Cu which are stable can be used.
  • alloys such as MgAg, AlLi, and CuLi can be used.
  • materials are not limited to these.
  • a metal material such as Ag or Al can be formed as a reflection layer.
  • a resistance heating evaporation coating method, an electron beam-evaporation coating method, a reactive deposition method, an ion plating method, or a sputtering method can be used for the method of forming the second electrode 15 .
  • the method for forming the second electrode 15 is not limited to these.
  • An organic light emitting medium layer may include only a single layer of an organic light emitting layer.
  • An organic light emitting medium layer may have a laminated structure combined with an organic light emitting layer and a layer to assist light emitting such as a hole transport layer, a hole injection layer, an electron transport layer and an electron injection layer.
  • the layer which assists light emitting such as a hole transport layer, a hole injection layer, an electron transport layer and an electron injection layer is selected appropriately.
  • the following materials can be used for a light emitting material which is used for an organic light emitting layer of an organic EL element: a low molecular light emitting coloring matter such as coumarin system, perylene system, pyran system, anthrone system, porphyrin system, quinacridon system, N,N′-dialkyl permutation quinacridon system, naphthalimido system, N,N′-diaryl permutation pyrrolo pyrrole series, iridium complex system, platinum complex system or europium complex system is dissolved in or copolymerized with polymers such as PS, polymethyl methacrylate or polyvinyl carbazole.
  • polymer light emitting materials such as poly arylene system, PAV [polyarylenevinylene] system or poly fluorene system can be used.
  • low molecular type luminescent materials which are scattered in a polymeric material can be used: coumarin corollary fluorescent substance, perylene corollary fluorescent substance, pyran type fluorescent substance, anthrone corollary fluorescent substance, porphyrin corollary fluorescent substance, quinacridon corollary fluorescent substance, N,N′-dialkyl displacement quinacridon corollary fluorescent substance, naphthalimido corollary fluorescent substance, N,N′-diaryl displacement pyrrolo pyrrole series fluorescent substance and phosphorescence fluor such as Ir chelate.
  • Polystyrene, polymethyl methacrylate and polyvinylcarbazole can be used as a polymeric material.
  • polyarylene type poly arylenevinylene type, poly fluorene, polyphenylene vinylene, polyparaphenylene vinylene, polythiophene, and polyspiro can be used as polymer light emitting material.
  • materials in which the polymer light emitting material is dispersed in the low molecular material or co-polymerized low molecular material, or other existing light emitting material can be used.
  • Materials generally used for a hole transport material can be used for a material of a hole transport layer 13 .
  • Copper phthalocyanine and the derivative, and Low molecular weight material such as the following aromatic amine system can be used: 1,1-bis((4-di-p-tolylamino phenyl)Cyclohexane)cyclohexane; and N,N′-diphenyl-N,N′-bis((3-methylphenyl))-1,1′-biphenyl-4,4′-diamine; and N,N′-di(one-naphthyl)-N,N′-diphenyl-1,1′-biphenyl-4,4′-diamine.
  • the following high molecular weight materials are preferable: a polyaniline derivative; a polythiophene derivative; a polyvinylcarbazole (PVK) derivative; and a mixture (PEDOT/PSS) of poly (3,4-ethylenedioxythiophene) (PEDOT) and polystyrene sulfonic acid (PSS).
  • a polyaniline derivative a polythiophene derivative
  • PVK polyvinylcarbazole
  • PES polystyrene sulfonic acid
  • a low-molecular material showing a charge transport property such as aryl amines, carbazoles, aryl sulfide, thiophenes or phthalocyanines is mixed with an electroconductive polymer such as poly arylene system such as polyparaphenylene (PPP) or PAV [polyarylenevinylene] system such as polyphenylene vinylene (PPV) or polymers such as polystyrene (PS).
  • PPP polyparaphenylene
  • PAV polyarylenevinylene
  • PS polystyrene
  • inorganic materials can be used for the hole transport layer 13 .
  • Alkali metal such as Li, Na, K, Rb, Ce and Fr
  • alkaline earth metallic elements such as Mg, Ca, Sr and Ba
  • lanthanoid system element such as La, Ce, Pr, Nd, Sm, Eu, Gd, Db, Dy, Ho, Er, Tm, Yb and Lu
  • actinoid system element such as Th
  • metallic elements such as Sc, Ti, V, Cr, Fe, Co, Ni, Cu, Zn, lateral, Ar, Nb, Mo, Ru, Pd, Ag, Cd, Hf, Ta, W, Re, Os, Ir, Pt, Au, Al, Ga, In, Sn, Tl, Pb and Bi
  • half metallic elements such as B, Si, Ge, As, Sb and Te
  • alloys thereof and inorganic compounds thereof such as oxide, carbide, nitride, boride, sulfide and halide.
  • molybdenum oxide can be easily used in film formation.
  • a hole injection function from a hole injection electrode is high. Its function is superior in that a hole is stably transported.
  • it is known as a useful material as a hole transport material or an electron injection material.
  • an inorganic material for a hole transport material
  • metal oxides such as Cu 2 O, Cr 2 O 3 , Mn 2 O 3 , FeOx(x ⁇ 0.1), NiO, CoO, Pr 2 O 3 , Ag 2 O, MoO 2 , Bi 2 O 3 , ZnO, TiO 2 , SnO 2 , ThO 2 , V 2 O 5 , Nb 2 O 5 , Ta 2 O 5 , MoO 3 , WO 3 and MnO 2
  • a material is not limited to the above materials.
  • an organic material for example, a polyaniline derivative, a polythiophene derivative, a polyvinylcarbazole (PVK) derivative, poly(3,4-ethylenedioxythiophene) or the like is dissolved or dispersed into a solvent to obtain a positive hole transport material ink, and it is possible to form a hole transport layer by applying the ink on the entire surface of a first electrode and a partition wall by a spin coat method or various printing methods.
  • a material is not limited to the above materials.
  • an underlayer 18 is formed between an organic light emitting layer and a hole transport layer of an organic EL element.
  • an underlayer is formed at a region including a first electrode and a partition wall, wettablity of an electrode and a partition wall is uniform.
  • an ink of an organic light emitting material spreads uniformly. Therefore, a film thickness of an organic light emitting layer becomes uniform.
  • such an underlayer increases hole transport properties and acts as a buffer layer blocking an electron from a second electrode. Thereby, a light emitting efficiency of an organic light emitting layer is increased, and driving life time is extended.
  • oxide, nitride and oxynitride of Cr, W, V, Nb, Ta, Mo, Ti, Zr, Hr, Sc, Y, Mn, Fe, Ru, Os, Co, Ni, Cu, Zn, Cd or the like can be formed by a vacuum evaporation method. In this case, if an arbitrary shadow mask is used, formation is possible at one time. If an underlayer comprised of an inorganic material is arranged, a stable organic EL element superior in stability or resistance can be obtained.
  • polyvinylcarbazole derivative of polyvinylcarbazole, polyarylene derivative having aromatic amine at a main chain or a side chain, and polymers having aromatic amine such as aryl amine derivative and triphenyl diamine derivative can be used.
  • aromatic amine such as aryl amine derivative and triphenyl diamine derivative
  • solubility in an organic light emitting ink solvent such as toluene or xylene is preferably low, for example, 1 wt % or less.
  • an underlayer material having a wettability such that a contact angle of an underlayer and an organic light emitting material ink is 0-15 degrees is preferably selected.
  • a relief printing method superior in pattern formation accuracy and uniformity of a film thickness is preferable. Patterning at a pixel part is not necessary for the underlayer in the present invention. Therefore, general coating methods such as a spin coat method or bar coat method can be used. However, a relief printing method is preferable in order that a part of a fetch wire or a part for connecting to a driver is not covered.
  • an underlayer is formed by a relief printing method
  • stripe-shaped convex parts of a resin relief printing plate are set to correspond to lines comprised of aligned RGB pixels so that the stripe is perpendicular to a direction of a long side of a RGB pixel, and an underlayer ink is transferred to a substrate.
  • an underlayer can be formed on the entire surface of a pixel and a partition wall.
  • an underlayer is formed on an organic EL element and a partition wall in a direction of a short side of an organic EL element.
  • wettability of a light emitting layer forming region becomes uniform, and a light emitting layer of a uniform film thickness can be formed.
  • a second light emitting layer is formed so as to partially overlap a first light emitting layer. Therefore, wettability of an underlayer is set higher than wettability of a first light emitting layer, thereby a second light emitting layer of a uniform film thickness can be formed.
  • Representative examples of a material of an electron transport layer include 2-(4-biphenyl)-5-(4-t-butylphenyl)-1,3,4-oxadiazole, 2,5-bis(1-naphthyl)-1,3,4-oxadiazole, Oxadiazoles, Bis(10-hydroxybenzo[h]quinolinate)beryllium complex, triazole compound, and combinations thereof.
  • the materials can be deposited by a sputtering method, a CVD method or the like. In the case where these materials are low molecular type, the materials can be deposited by a vaporization method.
  • these materials can be dissolved or dispersed in a single solvent or a mixed solvent selected from toluene, xylene, acetone, anisole, methyl anisole, dimethylanisole, benzoic ether, methyl benzoate, mesitylene, tetralin, amyl benzene, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, methanol, ethanol, isopropyl alcohol, ethyl acetate, butyl acetate, water or the like so as to be a coating liquid, and the liquid is applied by a coating method such as a spin coat method, a curtain coat method, a bar coat method, a wire coat method and a slit coat method, or a printing method such as a letterpress printing (flexographic printing method), an intaglio offset printing, a letterpress reverse offset printing, an ink jet printing and an intaglio printing method.
  • a coating method
  • an organic EL display with a structure shown in FIG. 3 is described.
  • the present invention is not limited to this structure.
  • a structure of an organic EL display can have the structure as shown in FIG. 4 described below.
  • FIG. 4 is a cross sectional view showing a structure of an organic EL display 100 b of a modified embodiment of the present invention.
  • the same symbol is used for the same part shown in FIG. 3 while explanation of the same part is omitted.
  • partition walls 11 a , 11 b , 11 c and 11 d are not formed on the substrate 10 .
  • the hole transport layer 13 is formed on the substrate 10 and first electrodes 12 a , 12 b , 12 c , that is, on the entire surface of an element.
  • first electrodes 12 a , 12 b , 12 c that is, on the entire surface of an element.
  • FIGS. 5 and 6 show a method for manufacturing the organic EL display 100 a ( FIG. 3 ) of one embodiment of the present invention.
  • FIGS. 5 and 6 show a process in which a light emitting layer 14 R is formed on an underlayer between partition walls 11 b and 11 c .
  • not only the light emitting layer 14 R but also light emitting layers 14 G and 14 B can be formed by the same method as FIGS. 5 and 6 .
  • light emitting layers 14 R, 14 B and 14 G of the organic EL display 100 b ( FIG. 4 ) can be formed by the same method as FIGS. 5 and 6 .
  • FIG. 5 is a partial enlarged view of FIG. 2 .
  • a body to be printed 7 of FIG. 2 corresponds to the substrate 10 , partition walls 11 a , 11 b , 11 c and 11 d , first electrodes 12 a , 12 b and 12 c and the hole transport layer 13 of FIG. 5 .
  • An ink 4 a is arranged on a surface of a relief printing plate forming material layer 1 b fixed on a plate cylinder 6 by an anilox roll.
  • a width W 2 of a relief printing part forming material layer 1 b is narrower than a distance between partition walls W 1 .
  • the plate cylinder 6 rotates, and a convex part forming material layer 1 b reaches a position between the partition wall 11 b and the partition wall 11 c .
  • a platen 8 for fixing a body to be printed (not illustrated in FIGS. 5 and 6 ) makes the substrate 10 etc. contact with the ink 4 a .
  • ink 4 a contacts the hole transport layer 13 on partition walls 11 b , 11 c and the first electrode 12 b .
  • a pattern is formed. (See FIG. 7 ).
  • the ink 4 a can be applied using the apparatus shown in FIGS. 7 and 8 .
  • FIGS. 7 and 8 are figures showing another example of a method for manufacturing the organic EL display 100 a ( FIG. 3 ) of one embodiment of the present invention.
  • FIGS. 7 and 8 as well as FIGS. 5 and 6 show a process in which the light emitting layer 14 R is formed on the hole transport layer 13 between the partition wall 11 b and the partition wall 11 c .
  • identical parts in FIGS. 5 and 6 have identical symbols. The explanation thereof is omitted.
  • a width W 3 of the convex part forming material layer 1 b is wider than a distance W 1 between partition walls. This is a difference point from FIGS. 5 and 6 .
  • a width obtained by adding a width W 2 between partition walls to the distance W 1 between partition walls is necessary to be wider than a width of an ink pattern to be transferred so that the ink 4 a does not flow to an adjacent pixel region. More preferably, a width of an ink pattern is equal to or narrower than W 1 +W 2 .
  • the above described width or distance is preferably defined as follows. In the case where a line pattern of a light emitting layer is printed, length is measured according to a cross section surface perpendicular to a direction of the printed line. In the case where a dot pattern is printed, length is measured according to a cross section surface perpendicular in a direction of a short side of the dot pattern. (see FIGS. 9 and 10 described below.)
  • the width W 3 of the convex part forming material layer 1 b becomes wider, it becomes difficult to apply the ink 4 a between partition walls.
  • the ink 4 a is not filled only between partition walls 11 b , 11 c and the ink 4 a is formed on partition walls 11 b , 11 c , or, the ink 4 a flows to an adjacent organic EL element (here, a region between partition walls 11 a , 11 b , or a region between partition walls 11 c , 11 d ), since an ink of a longer wavelength is applied above an ink of a shorter wavelength, even if position adjustment between the convex part forming material layer 1 b and the substrate 10 is slightly misaligned, color mixture between adjacent pixels can be prevented.
  • FIG. 9 is a planar view showing a structure of the organic EL display 100 a ( FIG. 3 ) of one embodiment of the present invention.
  • partition walls 11 a , 11 b , 11 c , 11 d . . . , first electrodes 12 a , 12 b , 12 c , . . . , the hole transport layer 13 , . . . , the underlayer 18 , light emitting layers 14 R, 14 G and 14 B are formed on the substrate 10 .
  • the second electrode 15 , the sealing resin 16 and the sealing substrate 17 are not formed.
  • organic EL elements are formed on the substrate 10 of the organic EL display 100 a .
  • organic EL elements in a first row a fourth row and a seventh row, light emitting layers 14 R are formed.
  • organic EL elements in a second row and a fifth row light emitting layers 14 B are formed and in organic EL elements in a third row and a sixth row, light emitting layers 14 G are formed.
  • two light emitting layers overlap each other at a border region between respective rows.
  • the light emitting layer 14 G overlaps the light emitting layer 14 B at a border region between 2 nd row and 3 rd row.
  • the light emitting layer 14 R overlaps the light emitting layer 14 G at a border region between 3 rd row and 4 th row.
  • the light emitting layer 14 R overlaps the light emitting layer 14 B at a border region between 1 st row and 2 nd row.
  • Stripe-shaped underlayers 18 are formed so as to cover a side of a partition wall wherein, at the side, light emitting layers overlap each other. That is, in FIG.
  • stripe-shaped underlayers 19 are formed in a direction of a short side of a pixel so as to cover both respective pixels and partition walls between pixels.
  • Stripe-shaped light emitting layers 14 R, 14 G and 14 B are formed so as to be perpendicular to a direction of the stripe-shaped underlayer.
  • the overlapping portion of light emitting layers is located on the underlayer, thereby wettability is improved and a very flat light emitting layer can be formed.
  • an underlayer can be uniformly formed by a printing method such as a relief printing method, compared with the case where an underlayer is entirely formed.
  • an underlayer in the case where an underlayer is stripe-shaped, an underlayer can be formed only on a pixel region on an electrode layer and an overlapping portion of light emitting layers on a partition wall. Therefore, in the case where an inorganic material with a low electric resistance is used, leakage current can be controlled.
  • an ink of a light emitting layer is formed for respective rows. However, the embodiment is not limited to these. For example, inks for forming respective light emitting layers can be applied as shown in FIG. 10 .
  • FIG. 10 is a planar view of another example of a structure of the organic EL display 100 a ( FIG. 3 ) of one embodiment of the present invention.
  • FIG. 10 is different from FIG. 9 in which light emitting layers are formed for respective rows of organic EL elements.
  • respective light emitting layers are formed for respective elements of organic EL elements.
  • two light emitting layers overlap each other at a border region of an organic EL element.
  • the light emitting layer 14 G overlaps the light emitting layer 14 B at a border region between 2 nd row and 3 rd row of organic EL element.
  • the light emitting layer 14 R overlaps the light emitting layer 14 G at a border region between 3 rd row and 4 th row of organic EL elements.
  • the light emitting layer 14 R overlaps the light emitting layer 14 B at a border region between 1 st row and 2 nd row of organic EL element.
  • stripe-shaped underlayers 10 are formed in a direction of a short side of a pixel so that a side of a partition wall in which light emitting layers overlap each other is a long side of a pixel.
  • Light emitting layers are formed in an order in which a light emitting layer emitting light of a longer wavelength is formed earlier.
  • 14 R first
  • 14 B(last) In this case, for example, when an ink of the light emitting layer 14 B is applied, a previously applied ink of the light emitting layer 14 R or the light emitting layer 14 G is dissolved in an ink of the light emitting layer 14 B.
  • light emitting layers 14 R, 14 G and 14 B are applied not only to a region sandwiched by partition walls but also to a top face of a partition wall. Therefore, even if a printing position of the ink 4 a for a light emitting layer is slightly shifted, the entire surface of the region sandwiched by partition walls is applied by the ink 4 a . Therefore, position adjustment between the plate cylinder 6 ( FIG. 2 ) and the body to be printed 7 (a substrate 10 : FIG. 2 ) does not have to be perfectly accurate.
  • a film thickness of an ink of a light emitting layer in which the ink is applied to a region sandwiched by partition walls can be adjusted to be uniform.
  • FIG. 11 is a planar view showing a structure of an organic EL display of one embodiment of the present invention.
  • partition walls 11 a , 11 b , 11 c , 11 d , . . . , first electrodes 12 a , 12 b , 12 c , . . . , the hole transport layer 13 . . . , and the underlayer 18 are formed on the substrate 10 .
  • light emitting layers 14 R, 14 G, 14 B, the second electrode 15 , the sealing resin 16 and the sealing substrate 17 are not formed.
  • FIG. 11 shows a state of an underlayer directly under a light emitting layer of FIGS. 9 and 10 .
  • An underlayer is formed on the entire surface of a partition wall and an organic EL element, along a row of a direction of a short side of a partition wall and an organic EL element.
  • wettability of a surface of a partition wall and an organic EL element can be even, thereby a film thickness of a first light emitting layer formed directly above the partition wall and the organic EL element can be uniform.
  • cross-section of partition walls 11 a , 11 b , 11 c and 11 d is a trapezoidal shape and a tapered shape.
  • respective light emitting layers 14 R, 14 G and 14 B are continuously formed without breaking on partition walls 11 a , 11 b , 11 c and 11 d .
  • cross-sections of partition walls in the above embodiment can be an inverse tapered shape.
  • a height of partition walls 11 a , 11 b , 11 c and 11 d is preferably 0.1-5 ⁇ m. More preferably, it is 0.5-2 ⁇ m. If partition walls 11 a , 11 b , 11 c and 11 d are too low, an ink may flow to an adjacent pixel and a color mixture may occur. If partition walls 11 a , 11 b , 11 c and 11 d are too high, disconnection may occur when the second electrode 15 is formed.
  • Light emitting layers 14 R, 14 G and 14 B in the above embodiments can be formed by a relief printing method (a flexo printing method), an intaglio offset printing method, a reverse offset type relief printing method, an ink jet printing method and an intaglio printing method (a gravure offset printing method). If these methods are used, respective light emitting layers 14 R, 14 G and 14 B can be formed on the entire surface of an organic EL element by using respective identical light emitting materials. Therefore, processes for forming light emitting layers 14 R, 14 G and 14 B can be simplified and productivity can be improved.
  • the substrate 10 can be subjected to surface processing such as UV processing and plasma processing. Wettability of partition walls 11 a , 11 b , 11 c and 11 d and a surface inside a pixel can be uniform, therefore a film thickness of light emitting layers 14 R, 14 G and 14 B can be uniform.
  • the above described embodiments are an active matrix type organic EL display. However, the present invention is not limited to these. The present invention can be applied to a passive matrix type organic EL display.
  • the above described embodiments have light emitting layers comprised of red color, green color and blue color. However, the present invention is not limited to these.
  • light emitting layers can be comprised of four colors of red color, green color, blue color and yellow color. In this case, the order of printing a light emitting layer on a substrate 10 is blue color, green color, yellow color and red color.
  • the sealing resin 16 is preferably formed on a sealing substrate 17 . However, the sealing resin 16 can be directly formed on the substrate 10 side.
  • sealing substrate 17 It is necessary for the permeability of moisture and oxygen in the sealing substrate 17 to be low.
  • ceramics such as alumina, silicon nitride and boron nitride, glass such as no-alkali glass and alkali glass, quartz, and humidity resistance film are exemplified as an example of the sealing substrate material.
  • a material is not limited to these.
  • the following humidity resistance film is exemplified: a film in which SiOx is formed by a CVD method on both sides thereof a film in which a film having a low permeability of moisture and oxygen and a hydrophilic film are laminated; and a film in which water a absorption agent was applied thereon, the film having a low permeability of moisture and oxygen. It is preferable for a water vapor permeation rate of the humidity resistance film to be equal to or less than 10 ⁇ 6 g/m 2 /day.
  • a photo-curing adhesive property resin a heat curing adhesive property resin and two fluid hardening adhesive property resins including an epoxy type resin, acrylic resin, silicone oil or the like, acrylic resin such as ethylene ethylacrylate (EEA) polymer, vinyl resins such as ethylene vinyl acetate (EVA), thermoplastic resin such as polyamide, synthetic rubber, and thermoplasticity adhesive property resins such as acid denatured substances of polyethylen or polypropylene.
  • ESA ethylene ethylacrylate
  • EVA ethylene vinyl acetate
  • thermoplastic resin such as polyamide, synthetic rubber
  • thermoplasticity adhesive property resins such as acid denatured substances of polyethylen or polypropylene.
  • An example of a method for forming the sealing resin 16 on the sealing substrate 17 is shown below: solvent solution method, pushing out laminate method, fusion/hot melt method, calender method, discharge jet application method, screen printing, vacuum laminate method and heated roll laminate method.
  • a material having hygroscopicity and a property to absorb oxygen can be incorporated into the sealing resin 16 if necessary.
  • the thickness of the sealing resin 16 formed on the sealing substrate 17 is decided by the size and configuration of a sealed organic EL display. About 5-500 ⁇ m is desirable for the thickness of the sealing resin 16 .
  • the substrate 10 is arranged on the sealing substrate 17 .
  • contact bonding is preferably performed only by a heating roller.
  • a heat curing type adhesion resin it is desirable that a heat curing type adhesion resin be heated and hardened at a curing temperature after the resin is attached by pressure using a heating roller.
  • a photo-curing-related adhesion resin sealing is performed by pressure using a roller. Thereafter, a photo-curing-related adhesion resin can be cured by irradiating light.
  • a process where the substrate 10 is arranged on the sealing substrate 17 through the sealing resin 16 is performed under a vacuum condition or in an inactive gas atmosphere so that oxygen or water which degrades an organic EL display is not included in the sealing resin 16 .
  • an inactive gas a rare gas such as argon can be used.
  • nitrogen is preferably used in view of easy handling or cost.
  • An organic electroluminescence display and a method for manufacturing the display have the following effects. Chromaticity deviation due to ink mixture is minimized as small as possible. A light emitting layer of a uniform film thickness is formed. Therefore, a uniform and stable light can be emitted. Further, yield in production can be improved.
  • a second light emitting layer emitting a light of a second wavelength longer than a first wavelength overlaps a first light emitting layer emitting a light of a first wavelength. Therefore, even if a colorant included in a first light emitting layer flows in a second light emitting layer, a colorant of a second light emitting layer which has a lower energy lower than that of a colorant of a first electrode preferentially emits light. Thereby, a color mixture can be prevented.
  • an underlayer (a buffer layer) formed between a hole transport layer and a light emitting layer has an effect that a hole transport property is improved and an effect that an electron moved from a second electrode side is blocked. Therefore, efficiency or life-time of an organic electroluminescence can be improved.
  • an underlayer (a buffer layer) is formed between a hole transport layer and a light emitting layer. Therefore, it is expected that an effect that a hole transport property is improved and an effect that an electron moved from an second electrode side is blocked are obtained. Therefore, efficiency or life-time of an organic electroluminescence can be improved.
  • a second light emitting layer emitting light of a second wavelength longer than a first wavelength is formed so that a second light emitting layer overlaps a first light emitting layer.
  • a colorant included in a first light emitting layer flows in a second light emitting layer, a colorant of a second light emitting layer which has a lower energy than that of a colorant of a first electrode preferentially emits light. Thereby, a color mixture can be prevented.
  • a pattern of a first electrode is formed, and its first light emitting layer is solidified and dried. Thereafter, a pattern of a second light emitting layer is formed. Therefore, an amount of a first colorant flowing in a second light emitting layer can be reduced. Thereby, color mixture is not easily generated.
  • respective light emitting layers can be applied to the entire surface of an organic EL element using identical light emitting materials. Therefore, a process for forming a light emitting layer can be simplified, thereby productivity can be improved.
  • a width of an ink pattern is wider than a distance between partition walls. Therefore, an ink can be surely applied on a pixel region between partition walls, and a light emitting layer superior in flatness of a film thickness can be formed.
  • a light emitting layer can be formed having superior pattern formation accuracy and uniformity of a film thickness.
  • a hole transport layer is formed on the entire surface of a first electrode and a partition wall. Further, an underlayer is formed thereon. Therefore, wettability of a surface inside a partition wall can be uniform, and a film thickness of an organic light emitting layer formed thereof can be uniform.
  • an underlayer can be formed only at a necessary pixel part by a relief printing method.
  • a film thickness or a wet property of an underlayer can be uniform. Therefore, a film thickness of a light emitting layer formed on an underlayer can be uniform, and uneven light emitting can be reduced.
  • an underlayer having good wettability is used, thereby an organic light emitting layer having a uniform film thickness can be formed.
  • a polymer fluorescent substance (or, a polymer fluorescent substance and a polymer resin as a binder) was dissolved in a solvent so that a concentration of a coating liquid ink was 2.0 wt %.
  • a coating ink for forming an organic light emitting medium layer was prepared.
  • three colors of R, G and B comprised of polyfluorene derivative were used in a polymer fluorescent substance as light emitting materials.
  • a composition of an ink solvent included 88 wt % of xylene (boiling point: 139 degrees Celsius) and 10 wt % of tetralin (boiling point: 202 degrees Celsius).
  • a base material for forming a transparent electrode (a product of GEOMATEC Corporation) was prepared.
  • the base material was as follows: on a square glass substrate having a thickness of 0.4 mm (length of a side of the glass substrate was 150 mm), an ITO film with a circuit pattern having surface resistivity of 15 ⁇ was formed.
  • a partition wall was as follows: a positive resist (ZWD6216-6, a product of ZEON CORPORATION) was formed on a surface of an ITO pattern formed side of the substrate by a spin coater so as to have a thickness of 2 ⁇ m. Thereafter, a taper shaped partition wall is formed by a photolithography method, thereby the ITO film pattern was sectioned.
  • the width in a direction of pattern formation described later was 15 ⁇ m, and a distance W 1 between the partition walls was 32 ⁇ m.
  • a pattern of molybdenum oxide film of 50 nm thickness was formed by a vacuum vaporization method using a shadow mask as a hole transport layer.
  • the film formation was performed so that the pattern region is the entire surface of a display region.
  • the film formation was performed using a metal mask with an opening of 120 mm ⁇ 100 mm.
  • poly(2,7-(9,9-di-octyl fluorene))-alt-(1,4-phenylene-((4-sec-butylphenyl)imino)-1,4-phenylene) (TFB) was formed by a relief printing method. Stripe underlayers perpendicular to a long side direction of the partition wall and the RGB pixels were formed by printing. As a result, the underlayers were formed at the entire surface of the pixel parts and partition walls sectioning the pixel parts on the substrate. Thereby, a substrate to be printed was manufactured.
  • a square glass substrate having a thickness of 0.7 mm and a side of 40 mm was used as a substrate.
  • An underlayer film formation ink was applied thereon by a spin coat method.
  • a contact angle of water (or a solvent for forming a light emitting layer) and an interlayer film was measured using the substrate.
  • the substrate before the underlayer film formation ink was applied was irradiated with ultra violet rays for 3 min. using a UV/O 3 cleaning apparatus (a product of ORC MANUFACTURING CO., LTD.) as a pre-process.
  • the substrate was quickly moved onto a hot plate of 200 degrees Celsius, and baking was performed for 15 min. In this case, a film thickness of the underlayer after drying was about 20 nm.
  • a molybdenum oxide film In the case where a molybdenum oxide film was formed, the same glass substrate was used. A film of molybdenum oxide of 40 nm thickness was formed by a sputtering method. In the case of a molybdenum oxide film, a contact angle was measured by the same method.
  • Table 1 shows the results of contact angles between an under layer and molybdenum oxide film.
  • an underlayer has very strong water-repellent properties compared with a molybdenum oxide film.
  • An underlayer has very good wettability for a solvent for forming a light emitting layer.
  • wetterabilities for a solvent for forming a light emitting layer are respectively different. This suggests that a printing stability of an organic light emitting layer is poor in the case where an underlayer is not formed on a partition wall.
  • the effects of the present invention are as follows: in the case where an underlayer is formed on the entire region of a pattern part of a partition wall substrate, wettability of a partition wall is equal to wettability inside a pixel. Thereby, a film thickness of an organic light emitting layer becomes uniform and uneven light emitting is reduced.
  • a base material 1 a was a polyethylene terephthalate (PET) base material of 0.3 mm thickness.
  • PET polyethylene terephthalate
  • a forming layer of a convex part 1 b was formed on the base material 1 a .
  • the forming layer of the convex part 1 b was as follows: a photosensitive water-soluble polymer (a water-soluble resin) was heated and melted at 150 degrees Celsius. This was applied by a spin coat method so as to have a thickness of 0.1 ⁇ m.
  • a relief printing plate S shown in FIG. 1 was equipped and fixed on a surface of a plate cylinder 6 of a cylinder type relief printing machine (See FIG. 2 ), and a body to be printed 7 (a substrate to be printed) is placed and fixed to a platen 8 for fixing a body to be printed.
  • an anilox roll 5 of 500 lines/inch and a plate cylinder 6 were rotated.
  • a coating ink 4 a for forming an organic light emitting medium layer was uniformly supplied to a surface of the anilox roll 5 (an ink supplying roller).
  • the ink 4 a is supplied to a top surface of a convex part of a relief printing plate through an anilox roll.
  • printing of a pattern-shaped coating ink 4 a on the top surface was performed in which printing corresponded to an ITO pattern of the body to be printed 7 (the substrate to be printed).
  • first time printing consisted of forming a pattern of a coating ink including a blue light emitting colorant.
  • band gaps of respective light emitting colorants are as follows: a red light emitting colorant is 2.01 eV, a green light emitting colorant is 2.38 eV, and a blue light emitting colorant is 2.72 eV. In this way, a colorant having a large band gap has a short light emitting wavelength.
  • a coating ink 4 a was dried for 5 hours at 150 degrees Celsius. Barium of 7 nm and aluminum of 150 nm were formed on an organic light emitting medium layer which was formed using a coating ink 4 a.
  • a stripe-shaped film of poly(3,4) ethylenedioxy thiophene/polystyrene sulfonate (PEDOT/PSS) of 100 nm thickness was formed as a hole transport layer by a spin coater so that the stripe was perpendicular to a direction of a long side of a partition wall and RGB pixels.
  • This thin film of PEDOT/PSS was dried for 1 hr. in a reduced pressure at 180 degrees Celsius.
  • An organic EL display was manufactured by the same method as Example 1 except for the above.
  • An organic EL display was manufactured by the same method as Example 1 except that forming a pattern by printing a coating liquid including a red light emitting colorant, forming a pattern by printing a coating liquid including a green light emitting colorant and forming a pattern by printing a coating liquid including a blue light emitting colorant were performed in this order.
  • a width of a partition wall in a direction of printing of an organic light emitting medium layer was about 22 ⁇ m, and distance W 1 between partition walls was 25 ⁇ m.
  • a pattern of an organic light emitting medium layer was formed using a coating ink, position adjustment was performed, and a pattern-shaped coating ink on a top surface of a convex part was printed so that the convex part covers an opening of a pixel.
  • An organic EL display was manufactured by the same process as Example 1 except for the above.
  • a width of a partition wall in a direction of printing of an organic light emitting medium layer was about 22 ⁇ m, and distance W 1 between partition walls was 25 ⁇ m, the same as Example 3.
  • An organic EL display was manufactured by the same process as Example 1 except for the above.
  • FIG. 12 is a photograph of emitted light of an organic EL display manufactured in Examples 1 and 2 of the present invention. That is, FIG. 12 shows a case where a light emitting layer 14 R, a light emitting layer 14 G and a light emitting layer 14 B were formed in this order.
  • FIG. 13 is a photograph of emitted light of an organic EL display manufactured in Comparative Example 1. That is, FIG. 13 shows a case where a light emitting layer 14 R, a light emitting layer 14 G and a light emitting layer 14 B were formed in this order.
  • a voltage was applied to an organic EL display manufactured in Examples 1 and 2 through an ITO film.
  • an organic light emitting medium layer had an even film thickness, and uneven emitted light was not observed as shown in FIG. 12 .
  • a voltage was applied to an organic EL display manufactured in Comparative Example 1 through an ITO film, and when the state of emitted light was confirmed, colors of emitted light were different in some spots, that is, uneven as a whole and color mixtures occurred.
  • FIGS. 14 and 15 show a cause of color mixtures in an organic EL display manufactured in Comparative Example 1.
  • a cause of color mixtures in an organic EL display manufactured in Comparative Example 1 is as follows: as shown in FIG. 14 , a newly coated ink (here, a light emitting layer 14 B) dissolves a pre-coated solidified ink (here, a light emitting layers 14 R and 15 G) and pulls the pre-coated solidified ink inside a pixel.
  • a portion 50 (See FIG. 15 ) in which a light emitting colorant of an adjacent pixel is mixed, had color changes and this change causes uneven emitted light.
  • Example 3 a color mixture of emitted light was not observed.
  • Example 3 overlapping occurred on all partition walls sandwiched by pixels. Light emitted layers covered the entire element.
  • Example 4 overlapping portions and non-overlapping portions on a partition wall were produced and in Example 3, a film thickness roughness was small and light emitting was even compared with Example 4.
  • the present invention is useful for manufacturing a high definition display.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
US13/136,846 2009-02-16 2011-08-12 Organic electroluminescence display and method for manufacturing the same Active US8253158B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009032503 2009-02-16
JP2009-032503 2009-02-16
PCT/JP2010/051810 WO2010092931A1 (ja) 2009-02-16 2010-02-08 有機エレクトロルミネッセンスディスプレイ及びその製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2010/051810 Continuation WO2010092931A1 (ja) 2009-02-16 2010-02-08 有機エレクトロルミネッセンスディスプレイ及びその製造方法

Publications (2)

Publication Number Publication Date
US20120025192A1 US20120025192A1 (en) 2012-02-02
US8253158B2 true US8253158B2 (en) 2012-08-28

Family

ID=42561773

Family Applications (1)

Application Number Title Priority Date Filing Date
US13/136,846 Active US8253158B2 (en) 2009-02-16 2011-08-12 Organic electroluminescence display and method for manufacturing the same

Country Status (3)

Country Link
US (1) US8253158B2 (ja)
JP (1) JP4803321B2 (ja)
WO (1) WO2010092931A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140103309A1 (en) * 2012-10-15 2014-04-17 Samsung Display Co., Ltd. Organic light emitting display device and manufacturing method thereof

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4803321B2 (ja) * 2009-02-16 2011-10-26 凸版印刷株式会社 有機エレクトロルミネッセンスディスプレイ及びその製造方法
JP2011204524A (ja) * 2010-03-26 2011-10-13 Sumitomo Chemical Co Ltd 発光装置の製造方法
JP6106938B2 (ja) * 2011-03-30 2017-04-05 凸版印刷株式会社 有機ｅｌ素子の製造方法及び有機ｅｌ素子
JP2014026902A (ja) 2012-07-30 2014-02-06 Sony Corp 表示装置、表示装置の製造方法および電子機器
JP2015060780A (ja) * 2013-09-20 2015-03-30 株式会社東芝 表示装置の製造方法及び製造システム
KR102136789B1 (ko) * 2014-06-17 2020-07-23 삼성디스플레이 주식회사 유기 발광 소자
CN107632454B (zh) * 2017-11-10 2020-07-28 北京京东方显示技术有限公司 显示面板、显示装置、显示面板的制作方法及驱动方法
CN111357392A (zh) * 2017-11-28 2020-06-30 堺显示器制品株式会社 有机el发光元件及其制造方法

Citations (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1167454A (ja) 1997-08-27 1999-03-09 Futaba Corp マルチカラー有機エレクトロルミネッセンス素子及びその製造方法
US6420200B1 (en) * 1999-06-28 2002-07-16 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing an electro-optical device
US20030178935A1 (en) * 2001-06-27 2003-09-25 Teiichiro Nishimura Electroluminescent element
US20040077113A1 (en) * 2002-07-09 2004-04-22 Semiconductor Energy Laboratory Co., Ltd. Production apparatus and method of producing a light-emitting device by using the same apparatus
US20040202778A1 (en) * 2002-11-26 2004-10-14 Masao Nishiguchi Method of manufacturing organic electroluminescence device
US20050140288A1 (en) * 2003-12-26 2005-06-30 Koji Suzuki Display device and method and apparatus for manufacturing display device
US20060220537A1 (en) * 2005-03-31 2006-10-05 Koji Takeshita Organic electroluminescent device and a manufacturing method of an organic electroluminescent device
US20060244369A1 (en) * 2005-03-31 2006-11-02 Kitazume Eiichi Organic electroluminescent device and the manufacturing method
US20060257686A1 (en) * 2005-05-13 2006-11-16 Takahisa Shimizu Functional ink for relief printing and organic electroluminescence device and the manufacturing method
US20060269657A1 (en) * 2005-05-27 2006-11-30 Takahisa Shimizu Organic luminescence ink and an organic electroluminescence element
US20060280859A1 (en) * 2005-06-10 2006-12-14 Takahisa Shimizu Manufacturing method of an organic electroluminescent device and an organic electroluminescent device
US20070031587A1 (en) * 2005-03-08 2007-02-08 Koji Takeshita Manufacturing method of an organic electroluminescence device
US20070046185A1 (en) * 2005-08-26 2007-03-01 Kim Byung H Organic light emitting display and method for fabricating the same
US20070066179A1 (en) * 2005-09-22 2007-03-22 Akio Nakamura Manufacturing method of a printed matter and a printed matter
US20070071884A1 (en) * 2005-09-27 2007-03-29 Koji Takeshita Electroluminescent element and a method of manufacturing the same
JP2007115465A (ja) 2005-10-19 2007-05-10 Toppan Printing Co Ltd 有機エレクトロルミネッセンス素子
US20070164671A1 (en) * 2003-10-20 2007-07-19 Semiconductor Energy Laboratory Co., Ltd. Light-Emitting Device and Method for Manufacturing Light-Emitting Device
US20070190236A1 (en) * 2006-02-15 2007-08-16 Koji Murata Organic electroluminescent element and the manufacturing method
JP2007227023A (ja) * 2006-02-21 2007-09-06 Toppan Printing Co Ltd 有機エレクトロルミネッセンス材料を含有する塗工液の印刷方法
US20070281575A1 (en) * 2006-05-12 2007-12-06 Toppan Printing Co., Ltd. Method for producing organic EL display panel
US20080032039A1 (en) * 2006-08-07 2008-02-07 Toppan Printing Co., Ltd. Method of manufacturing organic electroluminescence device
JP2008041747A (ja) 2006-08-02 2008-02-21 Matsushita Electric Ind Co Ltd 有機エレクトロルミネッセント発光装置およびその製造方法
US20080122351A1 (en) * 2006-11-28 2008-05-29 Toppan Printing Co., Ltd. Organic electroluminescence display and method of manufacturing the same
US7411344B2 (en) * 2003-06-17 2008-08-12 Semiconductor Energy Laboratory Co., Ltd. Display device and electronic apparatus
US7414361B2 (en) * 2004-03-03 2008-08-19 Seiko Epson Corporation Light-emitting device and electronic apparatus having a roughing face formed on partition wall
JP2008192311A (ja) 2005-05-16 2008-08-21 Sharp Corp 有機エレクトロルミネッセンス素子の製造方法
US20080231179A1 (en) * 2007-03-23 2008-09-25 Toppan Printing Co., Ltd. Organic Electroluminescence Element and Display Using the Same
US20080311426A1 (en) * 2007-06-18 2008-12-18 Toppan Printing Co., Ltd. Organic EL Display and Method for Manufacturing the Same
JP2009032503A (ja) * 2007-07-26 2009-02-12 Toyota Motor Corp 複合電解質膜、複合電解質膜の製造方法、及び固体高分子型燃料電池
US20090072724A1 (en) * 2007-09-14 2009-03-19 Seiko Epson Corporation Organic electroluminescent apparatus and elctronic appratus
US20090128014A1 (en) * 2007-11-16 2009-05-21 Toppan Printing Co. Organic EL Display Device and Method for Manufacturing the Same
US7541734B2 (en) * 2003-10-03 2009-06-02 Semiconductor Energy Laboratory Co., Ltd. Light emitting device having a layer with a metal oxide and a benzoxazole derivative
US20090160322A1 (en) * 2007-05-28 2009-06-25 Panasonic Corporation Organic el device and display
US7583020B2 (en) * 2002-12-12 2009-09-01 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device, film-forming method and manufacturing apparatus thereof, and cleaning method of the manufacturing apparatus
US7605535B2 (en) * 2004-11-22 2009-10-20 Seiko Epson Corporation Electroluminescent device and electronic apparatus
US20100079067A1 (en) * 2008-09-29 2010-04-01 Toppan Printing Co., Ltd Organic EL Display Panel and Method for Manufacturing Thereof
WO2010092931A1 (ja) * 2009-02-16 2010-08-19 凸版印刷株式会社 有機エレクトロルミネッセンスディスプレイ及びその製造方法
US7839081B2 (en) * 2006-01-11 2010-11-23 Seiko Epson Corporation Emissive device and electronic apparatus having light transmitting portions of light shielding layer being smaller than partition opening
US7948160B2 (en) * 2006-01-27 2011-05-24 Tohoku Pioneer Corporation Optical device and manufacturing method of the optical device
US20110121719A1 (en) * 2009-11-25 2011-05-26 Shuhei Yokoyama Organic el device and manufacturing method thereof
US7977873B2 (en) * 2006-01-31 2011-07-12 Kyocera Corporation Electroluminescent device having protective layers for sealing
US7999463B2 (en) * 2004-09-13 2011-08-16 Semiconductor Energy Laboratory Co., Ltd. Light emitting device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4378186B2 (ja) * 2004-02-06 2009-12-02 キヤノン株式会社 有機ｅｌ素子アレイ
WO2006100889A1 (ja) * 2005-03-23 2006-09-28 Konica Minolta Holdings, Inc. 有機ｅｌ層の形成方法
JP4747637B2 (ja) * 2005-03-31 2011-08-17 凸版印刷株式会社 有機ｅｌディスプレイパネルの製造方法
JP2009230956A (ja) * 2008-03-21 2009-10-08 Toppan Printing Co Ltd 有機エレクトロルミネッセンス表示装置の製造方法
JP4885906B2 (ja) * 2008-05-16 2012-02-29 パナソニック株式会社 発光装置の製造方法

Patent Citations (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1167454A (ja) 1997-08-27 1999-03-09 Futaba Corp マルチカラー有機エレクトロルミネッセンス素子及びその製造方法
US6420200B1 (en) * 1999-06-28 2002-07-16 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing an electro-optical device
US20030178935A1 (en) * 2001-06-27 2003-09-25 Teiichiro Nishimura Electroluminescent element
US20040077113A1 (en) * 2002-07-09 2004-04-22 Semiconductor Energy Laboratory Co., Ltd. Production apparatus and method of producing a light-emitting device by using the same apparatus
US20070218797A1 (en) * 2002-07-09 2007-09-20 Semiconductor Energy Laboratory Co., Ltd. Production apparatus and method of producing a light-emitting device by using the same apparatus
US20040202778A1 (en) * 2002-11-26 2004-10-14 Masao Nishiguchi Method of manufacturing organic electroluminescence device
US7583020B2 (en) * 2002-12-12 2009-09-01 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device, film-forming method and manufacturing apparatus thereof, and cleaning method of the manufacturing apparatus
US7880380B2 (en) * 2003-06-17 2011-02-01 Semiconductor Energy Laboratory Co., Ltd. Display device and electronic apparatus
US7411344B2 (en) * 2003-06-17 2008-08-12 Semiconductor Energy Laboratory Co., Ltd. Display device and electronic apparatus
US20090206726A1 (en) * 2003-10-03 2009-08-20 Semiconductor Energy Laboratory Co., Ltd. Light emitting device
US7541734B2 (en) * 2003-10-03 2009-06-02 Semiconductor Energy Laboratory Co., Ltd. Light emitting device having a layer with a metal oxide and a benzoxazole derivative
US20070164671A1 (en) * 2003-10-20 2007-07-19 Semiconductor Energy Laboratory Co., Ltd. Light-Emitting Device and Method for Manufacturing Light-Emitting Device
US7850501B2 (en) * 2003-10-20 2010-12-14 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device and method for manufacturing light-emitting device
US20100124796A1 (en) * 2003-10-20 2010-05-20 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device and method for manufacturing light-emitting device
US20050140288A1 (en) * 2003-12-26 2005-06-30 Koji Suzuki Display device and method and apparatus for manufacturing display device
US7414361B2 (en) * 2004-03-03 2008-08-19 Seiko Epson Corporation Light-emitting device and electronic apparatus having a roughing face formed on partition wall
US7999463B2 (en) * 2004-09-13 2011-08-16 Semiconductor Energy Laboratory Co., Ltd. Light emitting device
US7605535B2 (en) * 2004-11-22 2009-10-20 Seiko Epson Corporation Electroluminescent device and electronic apparatus
US20070031587A1 (en) * 2005-03-08 2007-02-08 Koji Takeshita Manufacturing method of an organic electroluminescence device
US20060220537A1 (en) * 2005-03-31 2006-10-05 Koji Takeshita Organic electroluminescent device and a manufacturing method of an organic electroluminescent device
US20060244369A1 (en) * 2005-03-31 2006-11-02 Kitazume Eiichi Organic electroluminescent device and the manufacturing method
US20060257686A1 (en) * 2005-05-13 2006-11-16 Takahisa Shimizu Functional ink for relief printing and organic electroluminescence device and the manufacturing method
JP2008192311A (ja) 2005-05-16 2008-08-21 Sharp Corp 有機エレクトロルミネッセンス素子の製造方法
US20060269657A1 (en) * 2005-05-27 2006-11-30 Takahisa Shimizu Organic luminescence ink and an organic electroluminescence element
US20060280859A1 (en) * 2005-06-10 2006-12-14 Takahisa Shimizu Manufacturing method of an organic electroluminescent device and an organic electroluminescent device
US20070046185A1 (en) * 2005-08-26 2007-03-01 Kim Byung H Organic light emitting display and method for fabricating the same
US7825584B2 (en) * 2005-08-26 2010-11-02 Samsung Mobile Display Co., Ltd. Organic light emitting display device and method for fabricating the same
US20070066179A1 (en) * 2005-09-22 2007-03-22 Akio Nakamura Manufacturing method of a printed matter and a printed matter
US20070071884A1 (en) * 2005-09-27 2007-03-29 Koji Takeshita Electroluminescent element and a method of manufacturing the same
US7786667B2 (en) * 2005-10-19 2010-08-31 Toppan Printing Co., Ltd. Organic electroluminescent element comprising a luminescent assist layer
JP2007115465A (ja) 2005-10-19 2007-05-10 Toppan Printing Co Ltd 有機エレクトロルミネッセンス素子
US7839081B2 (en) * 2006-01-11 2010-11-23 Seiko Epson Corporation Emissive device and electronic apparatus having light transmitting portions of light shielding layer being smaller than partition opening
US7948160B2 (en) * 2006-01-27 2011-05-24 Tohoku Pioneer Corporation Optical device and manufacturing method of the optical device
US7977873B2 (en) * 2006-01-31 2011-07-12 Kyocera Corporation Electroluminescent device having protective layers for sealing
US20070190236A1 (en) * 2006-02-15 2007-08-16 Koji Murata Organic electroluminescent element and the manufacturing method
JP2007227023A (ja) * 2006-02-21 2007-09-06 Toppan Printing Co Ltd 有機エレクトロルミネッセンス材料を含有する塗工液の印刷方法
US20070281575A1 (en) * 2006-05-12 2007-12-06 Toppan Printing Co., Ltd. Method for producing organic EL display panel
JP2008041747A (ja) 2006-08-02 2008-02-21 Matsushita Electric Ind Co Ltd 有機エレクトロルミネッセント発光装置およびその製造方法
US20080032039A1 (en) * 2006-08-07 2008-02-07 Toppan Printing Co., Ltd. Method of manufacturing organic electroluminescence device
US20080122351A1 (en) * 2006-11-28 2008-05-29 Toppan Printing Co., Ltd. Organic electroluminescence display and method of manufacturing the same
US20080231179A1 (en) * 2007-03-23 2008-09-25 Toppan Printing Co., Ltd. Organic Electroluminescence Element and Display Using the Same
US7723916B2 (en) * 2007-03-23 2010-05-25 Toppan Printing Co., Ltd. Organic electroluminescence element and display using the same
US20090160322A1 (en) * 2007-05-28 2009-06-25 Panasonic Corporation Organic el device and display
US20080311426A1 (en) * 2007-06-18 2008-12-18 Toppan Printing Co., Ltd. Organic EL Display and Method for Manufacturing the Same
JP2009032503A (ja) * 2007-07-26 2009-02-12 Toyota Motor Corp 複合電解質膜、複合電解質膜の製造方法、及び固体高分子型燃料電池
US7884541B2 (en) * 2007-09-14 2011-02-08 Seiko Epson Corporation Organic electroluminescent apparatus and electronic apparatus
US20090072724A1 (en) * 2007-09-14 2009-03-19 Seiko Epson Corporation Organic electroluminescent apparatus and elctronic appratus
US20090128014A1 (en) * 2007-11-16 2009-05-21 Toppan Printing Co. Organic EL Display Device and Method for Manufacturing the Same
US20100079067A1 (en) * 2008-09-29 2010-04-01 Toppan Printing Co., Ltd Organic EL Display Panel and Method for Manufacturing Thereof
US8040056B2 (en) * 2008-09-29 2011-10-18 Toppan Printing Co., Ltd. Organic EL display panel and method for manufacturing thereof
WO2010092931A1 (ja) * 2009-02-16 2010-08-19 凸版印刷株式会社 有機エレクトロルミネッセンスディスプレイ及びその製造方法
US20110121719A1 (en) * 2009-11-25 2011-05-26 Shuhei Yokoyama Organic el device and manufacturing method thereof

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
International Preliminary Report on Patentability for International Application No. PCT/JP 2010/051810, mailed Sep. 22, 2011, 7 pgs.

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140103309A1 (en) * 2012-10-15 2014-04-17 Samsung Display Co., Ltd. Organic light emitting display device and manufacturing method thereof
US9444073B2 (en) * 2012-10-15 2016-09-13 Samsung Display Co., Ltd. Organic light emitting display device and manufacturing method thereof

Also Published As

Publication number Publication date
JPWO2010092931A1 (ja) 2012-08-16
US20120025192A1 (en) 2012-02-02
JP4803321B2 (ja) 2011-10-26
WO2010092931A1 (ja) 2010-08-19

Similar Documents

Publication Publication Date Title
US8253158B2 (en) Organic electroluminescence display and method for manufacturing the same
TWI458388B (zh) 有機電致發光顯示器及其製法
US7723916B2 (en) Organic electroluminescence element and display using the same
US8002601B2 (en) Organic electroluminescent device and the manufacturing method
US7910287B2 (en) Relief printing plate, and method for manufacturing electronic circuit pattern, organic electroluminescence device and organic electronic device by using the same
JP2007087785A (ja) 印刷体の製造方法及び印刷体
JP2007115465A (ja) 有機エレクトロルミネッセンス素子
JP2007095521A (ja) 有機エレクトロルミネッセンス素子の製造方法
JP5569023B2 (ja) 有機エレクトロルミネッセンス素子及びその製造方法
US7915824B2 (en) Organic EL display device and method for manufacturing the same
US8932098B2 (en) Relief printing plate and method for producing organic EL device using the same
US7485023B2 (en) Organic electroluminescent device having partition wall and a manufacturing method of the same by relief printing method
JP5604857B2 (ja) 印刷用凸版並びにそれを用いた有機エレクトロルミネッセンス素子の製造方法及び有機エレクトロルミネッセンス素子
JP2009078501A (ja) 凸版印刷によるパターン形成方法、および有機機能性素子の製造方法
JP5298489B2 (ja) 有機ｅｌ素子及びその製造方法
JP2013105694A (ja) 有機エレクトロルミネッセンス素子及びその製造方法
JP5663853B2 (ja) 有機ｅｌパネル及びその製造方法
JP2007095519A (ja) 有機エレクトロルミネッセンス素子とその製造方法
JP4940831B2 (ja) 有機ｅｌ素子の製造方法および有機ｅｌ素子
JP2009158585A (ja) 有機エレクトロルミネッセンス表示装置及びその製造方法
JP5671784B2 (ja) 印刷用凸版及びその印刷用凸版を用いた電子デバイスの製造方法並びに有機エレクトロルミネッセンス素子
JP2008166016A (ja) 有機機能性素子の製造方法
JP2011187364A (ja) 有機エレクトロルミネッセンス素子およびその製造方法
JP2011204504A (ja) 有機ｅｌ表示装置の製造方法及び有機ｅｌ表示装置
JP2009147051A (ja) パターン形成用凸版及びそれを用いて製造した有機ｅｌ素子

Legal Events

Date Code Title Description
AS Assignment

Owner name: TOPPAN PRINTING CO., LTD., JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:SHIMIZU, TAKAHISA;KIMURA, SHOHEI;MIDORIKAWA, TATSUYA;AND OTHERS;SIGNING DATES FROM 20110725 TO 20110801;REEL/FRAME:026827/0661

STCF Information on status: patent grant

Free format text: PATENTED CASE

FPAY Fee payment

Year of fee payment: 4

MAFP Maintenance fee payment

Free format text: PAYMENT OF MAINTENANCE FEE, 8TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1552); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

Year of fee payment: 8

FEPP Fee payment procedure

Free format text: MAINTENANCE FEE REMINDER MAILED (ORIGINAL EVENT CODE: REM.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY