US7049253B1 - Glass cloth and printed wiring board - Google Patents

Glass cloth and printed wiring board Download PDF

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Publication number
US7049253B1
US7049253B1 US10/031,183 US3118301A US7049253B1 US 7049253 B1 US7049253 B1 US 7049253B1 US 3118301 A US3118301 A US 3118301A US 7049253 B1 US7049253 B1 US 7049253B1
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US
United States
Prior art keywords
yarn
glass cloth
warp
yarns
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US10/031,183
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English (en)
Inventor
Yasuyuki Kimura
Yoshinori Gondoh
Yoshinobu Fujimura
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Asahi Schwebel Co Ltd
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Asahi Schwebel Co Ltd
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Assigned to ASAHI-SCHWEBEL CO., LTD. reassignment ASAHI-SCHWEBEL CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: FUJIMURA, YOSHINOBU, GONDOH, YOSHINORI, KIMURA, YASUYUKI
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    • D—TEXTILES; PAPER
    • D03—WEAVING
    • D03D—WOVEN FABRICS; METHODS OF WEAVING; LOOMS
    • D03D15/00—Woven fabrics characterised by the material, structure or properties of the fibres, filaments, yarns, threads or other warp or weft elements used
    • D03D15/20—Woven fabrics characterised by the material, structure or properties of the fibres, filaments, yarns, threads or other warp or weft elements used characterised by the material of the fibres or filaments constituting the yarns or threads
    • D03D15/242—Woven fabrics characterised by the material, structure or properties of the fibres, filaments, yarns, threads or other warp or weft elements used characterised by the material of the fibres or filaments constituting the yarns or threads inorganic, e.g. basalt
    • D03D15/267—Glass
    • D—TEXTILES; PAPER
    • D03—WEAVING
    • D03D—WOVEN FABRICS; METHODS OF WEAVING; LOOMS
    • D03D1/00—Woven fabrics designed to make specified articles
    • D03D1/0082—Fabrics for printed circuit boards
    • D—TEXTILES; PAPER
    • D03—WEAVING
    • D03D—WOVEN FABRICS; METHODS OF WEAVING; LOOMS
    • D03D13/00—Woven fabrics characterised by the special disposition of the warp or weft threads, e.g. with curved weft threads, with discontinuous warp threads, with diagonal warp or weft
    • D03D13/008—Woven fabrics characterised by the special disposition of the warp or weft threads, e.g. with curved weft threads, with discontinuous warp threads, with diagonal warp or weft characterised by weave density or surface weight
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • D—TEXTILES; PAPER
    • D10—INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEXTILES
    • D10B—INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEXTILES
    • D10B2101/00—Inorganic fibres
    • D10B2101/02—Inorganic fibres based on oxides or oxide ceramics, e.g. silicates
    • D10B2101/06—Glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/029—Woven fibrous reinforcement or textile
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/30—Woven fabric [i.e., woven strand or strip material]
    • Y10T442/3065—Including strand which is of specific structural definition
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/30—Woven fabric [i.e., woven strand or strip material]
    • Y10T442/3065—Including strand which is of specific structural definition
    • Y10T442/3089—Cross-sectional configuration of strand material is specified
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/30—Woven fabric [i.e., woven strand or strip material]
    • Y10T442/3065—Including strand which is of specific structural definition
    • Y10T442/3089—Cross-sectional configuration of strand material is specified
    • Y10T442/3114—Cross-sectional configuration of the strand material is other than circular

Definitions

  • a printed wiring board is constituted by laminating a plurality of insulating substrates, each carrying a conductive layer, with each other.
  • the conductive layer provided between the insulation substrates is electrically connected to other optional conductive layers positioned on the upper or lower insulation substrates via conductive holes called through-holes, inner holes or blind holes.
  • a printed wiring board must be densely loaded with electronic elements. For the purpose of increasing the wiring density, the diameters of the via holes must be reduced.
  • the adhessiveness of a glass cloth with a matrix resin can be improved by selecting a surface treatment agent, the distribution of glass fibers can be made uniform by the fiber-opening treatment and the heat durability can be improved by selecting a matrix resin having a high glass transition point (Tg).
  • an insulation substrate for a printed wiring board is a composite material consisting of a matrix resin composed of organic material and a glass cloth composed of inorganic material, wherein the organic and inorganic materials unevenly exist. Accordingly, the respective materials are unevenly processed during the boring with a laser beam to roughen the inner wall of the hole and deteriorate the reliability of the plating conductivity. This is because the organic material portion and the inorganic material portion have different physical properties such as absorptivity of laser beam energy, decomposition temperature or heat-dispersibility.
  • the process conditions are properly selected to have well-bored holes.
  • the insulation substrate in which the organic matrix resin and the inorganic glass cloth are unevenly distributed in the surface direction an improvement in process uniformity of the bored holes has not yet been achieved.
  • An object of the present invention is to provide a glass cloth capable of being bored by a drill or, particularly, by a laser beam to have uniform micro-holes such as through-holes, inner via-holes or blind via-holes in a high-density printed wiring board, and a printed wiring board using such a glass cloth as a substrate.
  • a width A of a cross-section of the yarn is a distance A shown in FIG. 1 .
  • a glass cloth is generally of a plain weave structure in which warp yarns and weft yarns are positioned alternately above and beneath the other and there are three kinds of portions in the glass cloth; a portion at which warp and weft yarns are overlapped with each other, a portion in which either one of warp and weft yarns exists, and a portion, in which no glass yarns exist, called a basket hole and which is encircled with the warp yarns and the weft yarns.
  • a basket hole which is encircled with the warp yarns and the weft yarns.
  • a distance between adjacent yarn in one group is influenced by a thickness of a yarn transverse thereto because the warp and weft yarns are alternately positioned above and beneath the other.
  • a state wherein gaps are minimized simultaneously between the adjacent yarns in both the warp and weft yarn groups that is, a state of yarns arranged with substantially no gap is defined by the following equation (3): ( A+Bc ) ⁇ C/ 1000 ⁇ 25 (3) wherein A is a width ( ⁇ m) of the yarn, Bc is a thickness ( ⁇ m) of the yarn transverse to the former yarn and C is a weaving density (ends/25 mm) of the former yarn.
  • 28 ⁇ (A+Bc) ⁇ C/1000 ⁇ 25 is satisfied. That is, if a left side of the equation is smaller than 25 (mm) which is a unit length representing the weaving density of the glass cloth, it means that a gap exists, between the adjacent yarns, which is larger than a thickness of a yarn transverse to the former yarns. Such a gap is solely filled with a resin layer to adversely effect the processibility of the glass cloth. When a laser beam is used, it is difficult to have uniform holes bored thereby since the resin portion and the glass portion are different in processibility. Contrarily, if the result exceeds 28 (mm), the undulation of the other yarn group is suppressed to cause the adverse effect on the uniformity of the glass cloth in the thickness-wise direction as well as to deteriorate the smoothness thereof.
  • the yarn is preferably sufficiently flattened.
  • the sufficient flattening used in this text is defined as follows:
  • the flattened state of the yarn is also influenced by the weaving density of the yarn; that is, the higher the weaving density, the smaller the gap between the adjacent yarns, whereby a less space is left to allow the yarn to widen. Contrarily, the lower the weaving density, the larger the gap, whereby a more space is left to allow the yarn to widen.
  • both the warp and weft yarns have Ft of 0.75 or more, all the surface of the glass cloth is completely covered with the flattened warp and weft yarns, and thus the distribution of glass fibers in the glass cloth becomes uniform to facilitate the processibility thereof.
  • Ft is 0.8 or more, the flattening is more sufficient and uniform.
  • the glass cloth is as a whole covered with the flattened yarns and, thus the glass fibers are uniformly distributed in the glass cloth to facilitate the processibility of the glass cloth.
  • Ft is 1.2 or more, the flattening and the uniformity become sufficient.
  • the weaving density and the widening of the yarn are closely related to each other, and an optimum glass cloth having suitable basis weight and thickness can be selected in accordance with the requirements for the layered structure of the laminated board.
  • a warp-wise weaving density (hereinafter represented by Ct (ends/25 mm)) and a weft-wise weaving density (hereinafter represented by Cy (ends/25 mm)) satisfy the following equation (9), a glass cloth satisfying the recent demand for the warp- and weft-wise uniformity of the laminated board is obtainable. Further, to suppress the weft-wise shrinkage of the woven glass cloth, the following equation (10) is preferably satisfied. 0.9 ⁇ Ct/Cy ⁇ 1.1 (9) 1.0 ⁇ Ct/Cy ⁇ 1.1 (10)
  • a nominal diameter of a glass fiber is E or less, preferably D or less as defined by JIS-R-3413 in view of the boring of micro-holes.
  • the glass fiber yarn used for manufacturing the glass cloth according to the present invention is twisted at a smaller number of twists in a unit length in a range from 0.5 turns/25 mm or less, preferably in a range from 0.3 to 0 turns/25 mm than the conventional glass fiber yarn having the number of twists in a range from 0.7 to 1.0 turns/25 mm.
  • the twisted yarn can easily widen to form a fabric structure in which every adjacent yarn in the warp and weft is substantially in close contact with another with substantially no gap.
  • the yarn is liable to flatten so that the cross-section thereof approaches that of a flat sheet rather than an oval shape, whereby the distribution of the glass fibers in the glass cloth becomes more uniform.
  • the flattening of glass cloth may be enhanced by a fiber-opening process, for example, by the application of hydraulic pressure due to a water flow, the high-frequency vibration through a liquid medium, the injection of fluid having a surface pressure or the roll pressure, whereby the width of the twisted yarn becomes more broad to result in a fabric structure in which adjacent yarns are arranged with substantially no gap in both the warp- and weft-wise directions.
  • the yarn is flattened to have a cross-section similar to that of a flat sheet rather than an oval shape, whereby the distribution of the glass fibers in the glass cloth becomes more uniform, which effect is the same as that obtained by using a yarn having a smaller number of twists.
  • a glass cloth prepared from glass fiber yarns applied with an organic lubricant or having a binder or a sizing agent conventionally used in the weaving process may be effectively flattened by the combination of these means. Also, a combination of both the means is particularly effective.
  • E glass non-alkali glass
  • S glass S glass or high-dielectric constant glass
  • the printed circuit board according to the present invention may be produced in accordance with a conventional method.
  • the glass cloth is impregnated with a matrix resin such as epoxy resin to form a resin-impregnated prepreg.
  • a matrix resin such as epoxy resin
  • a plurality of such prepregs are laminated together, or one or more of them is layered on an inner-layer core sheet, and heated and pressed to be integral with each other, which process is repeated if necessary.
  • Resins used for preparing the printed wiring board include thermosettable resin such as epoxy resin, unsaturated polyester resin, polyimide resin, bismaleimidetriazine (BT) resin or cyanate resin, thermoplastic resin such as polyphenylene oxide (PPO) resin, polyetherimide resin or fluorine resin, and mixtures thereof.
  • An inorganic filler such as aluminum hydroxide may be mixed with the above resin.
  • FIG. 1 is a schematic illustration for describing the relationship between glass fiber yarns constituting a glass cloth and a width and a thickness of the cross-section of warp and weft yarns, wherein A denotes a width of the yarn cross-section and B denotes a yarn thickness.
  • a method for measuring physical properties of a glass cloth, a width and a thickness of a cross-section of a glass fiber yarn, a method for preparing a laminated board from the glass cloth and a test method are as follows:
  • the glass cloth was embedded in cold-setting epoxy resin, and cut and polished so that a cross-section of the glass fiber yarn appeared, and a photograph was taken by an electron microscope (Type S-570 manufactured by K.K. HITACHI SEISAKUSHO), from which the width and the thickness were measured.
  • a 0.4 mm thick sheet clad with 35 ⁇ m thick copper foil on both sides was subjected to a blacking treatment to become an inner-layer core sheet. Then, the glass cloth was impregnated with epoxy resin varnish, and dried to become a prepreg. A pair of such prepregs were layered on opposite sides of the core sheet, respectively. Copper foil of 18 ⁇ m thick was layered on the respective side thereof, and heated and pressed at 175° C. and 40 kg/cm 2 to result in a laminated board.
  • a laminated board was prepared by the method described in 3 above and bored with micro-holes solely in the surface layer thereof by means of a carbon-oxide gas laser under the condition of a diameter of 0.145 mm ⁇ , a frequency of 500 Hz, a pulse energy of 18 J/cm 2 and a shot number of 6 (using Type LAVIA 1000 TW manufactured by SUMITOMO JUKIKAI KOGYO Co. Ltd.).
  • the estimated characteristics were the roughness of the inner wall and the reproducibility of the hole.
  • the roughness of the inner wall is represented by the difference in height between convex and concave portions in the inner wall of the hole, and the reproducibility is represented by a standard deviation of the diameters of the bottoms of the holes.
  • a glass cloth was woven by an air jet loom from warp and weft yarns of C1200 1/0 1.0 Z at a warp density of 69 ends/25 mm and a weft density of 69 ends/25 mm.
  • the resultant gray fabric was continuously subjected to a flattening treatment through a press roll at a line pressure of 300 N/cm and then to a fiber-opening treatment by a high-pressure water spray at a pressure of 200N/cm 2 . Thereafter, the glass cloth was desized at 400° C. for 24 hours.
  • the glass cloth was dipped into a solution of silane coupler (SZ6032, manufactured by Toray•Dow Corning K.K.) as a surface treatment agent, squeezed and dried at 120° C. for 1 minute to result in the finished glass cloth having a basis weight of 24 g/m 2 and a thickness of 0.028 mm.
  • silane coupler SZ6032, manufactured by Toray•Dow Corning K.K.
  • a glass cloth was woven by an air jet loom from warp and weft yarns of C900 1/0 1.0 Z at a warp density of 69 ends/25 mm and a weft density of 69 ends/25 mm.
  • the resultant gray fabric was subjected to a fiber-opening treatment by a high-pressure water spray at a pressure of 200N/cm 2 . Thereafter, the glass cloth was desized at 400° C. for 24 hours.
  • the glass cloth was subjected to a surface treatment in the same manner as in Example 1 to result in the finished glass cloth having a basis weight of 30 g/m 2 and a thickness of 0.030 mm.
  • a laminated board was prepared as described above.
  • a glass cloth was woven by an air jet loom from warp and weft yarns of D900 1/0 1.0 Z at a warp density of 69 ends/25 mm and a weft density of 69 ends/25 mm.
  • the resultant gray fabric was subjected to a fiber-opening treatment by a high-pressure water spray at a pressure of 150N/cm 2 . Thereafter, the glass cloth was desized at 400° C. for 24 hours.
  • the glass cloth was subjected to a surface treatment in the same manner as in Example 1 to result in the finished glass cloth having a basis weight of 30 g/m 2 and a thickness of 0.032 mm.
  • a laminated board was prepared as described above.
  • a glass cloth was woven by an air jet loom from warp and weft yarns of D450 1/0 0.3 Z at a warp density of 54 ends/25 mm and a weft density of 54 ends/25 mm.
  • the resultant gray fabric was subjected to a fiber-opening treatment by a high-pressure water spray at a pressure of 300N/cm 2 . Thereafter, the glass cloth was desized at 400° C. for 24 hours.
  • the glass cloth was subjected to a surface treatment in the same manner as in Example 1 to result in the finished glass cloth having a basis weight of 48 g m 2 and a thickness of 0.042 mm. Therefrom, a laminated board was prepared as described above.
  • a glass cloth was woven by an air jet loom from warp and weft yarns of D450 1/0 1.0 Z at a warp density of 60 ends/25 mm and a weft density of 46 ends/25 mm. Thereafter, the glass cloth was desized at 400° C. for 24 hours.
  • the glass cloth was subjected to a surface treatment in the same manner as in Example 1 to result in the finished glass cloth having a basis weight of 48 g/m 2 and a thickness of 0.055 mm.
  • a laminated board was prepared as described above.
  • a glass cloth was woven by an air jet loom from warp and weft yarns of D900 1/0 1.0 Z at a warp density of 56 ends/25 mm and a weft density of 56 ends/25 mm. Thereafter, the glass cloth was desized at 400° C. for 24 hours.
  • the glass cloth was subjected to a surface treatment in the same manner as in Example 1 to result in the finished glass cloth having a basis weight of 25 g/m 2 and a thickness of 0.038 mm.
  • a laminated board was prepared as described above.
  • Example 1 4.5 4.5 100 100 69 69 1.0 161 352 18 11 12 26 0.99 2.16 1.8 3.5
  • Example 2 4.5 4.5 144 144 69 69 1.0 204 354 18 15 15 26 0.86 1.51 2.1
  • Example 3 5 5 100 100 69 69 1.0 214 356 19 16 16 26 1.18 1.97 4.5 4.4
  • Example 4 5 5 200 200 54 54 1.0 386 464 27 19 22 27 0.83 1.00 7.4 5.4
  • the present invention it is possible to improve the processibility of a printed wiring board particularly when a laser beam is used for boring micro-holes (that is, the roughness of the inner wall, the reproducibility and the roundness of the micro-holes are improved). Since the glass fibers are uniformly distributed in the glass cloth, a required printed wiring board for high-density wiring, capable of uniformly and reproducibly being bored with small via-holes, is provided.

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  • Engineering & Computer Science (AREA)
  • Textile Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Woven Fabrics (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
US10/031,183 1999-04-05 2000-02-04 Glass cloth and printed wiring board Expired - Lifetime US7049253B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP9723399 1999-04-05
PCT/JP2000/000631 WO2000060153A1 (en) 1999-04-05 2000-02-04 Glass cloth and printed wiring board

Publications (1)

Publication Number Publication Date
US7049253B1 true US7049253B1 (en) 2006-05-23

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US10/031,183 Expired - Lifetime US7049253B1 (en) 1999-04-05 2000-02-04 Glass cloth and printed wiring board

Country Status (8)

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US (1) US7049253B1 (ko)
EP (1) EP1176239B1 (ko)
KR (1) KR100475217B1 (ko)
CN (1) CN1329575C (ko)
AU (1) AU2326700A (ko)
HK (1) HK1050034A1 (ko)
TW (1) TW507477B (ko)
WO (1) WO2000060153A1 (ko)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080271806A1 (en) * 2002-09-20 2008-11-06 Asahi-Schwebel Co., Ltd. Glass cloth and film substrate using the same
US20100200663A1 (en) * 2007-03-26 2010-08-12 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
US20100259910A1 (en) * 2006-03-30 2010-10-14 Kyocera Corporation Circuit Board and Mounting Structure
CN102733033A (zh) * 2011-04-07 2012-10-17 建滔（连州）玻璃纤维有限公司 一种超低捻电子级玻璃纤维布的生产方法
US20180023225A1 (en) * 2016-07-21 2018-01-25 International Business Machines Corporation Glass cloth including attached fibers
US11746447B2 (en) * 2019-08-27 2023-09-05 Nitto Boseki Co., Ltd. Glass cloth, prepreg, and glass fiber-reinforced resin molded product

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Publication number Priority date Publication date Assignee Title
JP5275533B2 (ja) * 2000-12-22 2013-08-28 日立化成株式会社 金属箔張り積層板及びプリプレグ
JP3974797B2 (ja) * 2002-02-28 2007-09-12 日東紡績株式会社 ガラスクロスの製造方法及びガラスクロス
JP2006052473A (ja) * 2002-08-29 2006-02-23 Asahi Schwebel Co Ltd ガラスクロス及びプリント配線板
FR2875821B1 (fr) * 2004-09-24 2006-12-01 Didier Mouraret Tissu absorbant acoustique
JP4885591B2 (ja) * 2006-03-30 2012-02-29 京セラ株式会社 配線基板用織布およびプリプレグ
JP4908240B2 (ja) * 2007-01-16 2012-04-04 旭化成イーマテリアルズ株式会社 積層板補強用有機繊維織布
KR101051634B1 (ko) * 2009-04-28 2011-07-26 제일모직주식회사 디스플레이 패널용 플렉서블 기판 및 그 제조 방법
CN102733039A (zh) * 2011-04-07 2012-10-17 建滔（连州）玻璃纤维有限公司 一种高性能电子级玻璃纤维布及制造方法

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JPH09111577A (ja) 1995-10-16 1997-04-28 Nitto Boseki Co Ltd ガラスクロス、プリプレグ、積層板及び多層プリント配線板
US5662990A (en) 1994-07-19 1997-09-02 Gividi Italia S.P.A. Glass fabric produced with zero-twist yarn
JPH1037038A (ja) 1996-07-23 1998-02-10 Asahi Shiyueebell Kk ガラスクロス
JPH10272733A (ja) 1997-03-31 1998-10-13 Hitachi Chem Co Ltd 金属張積層板の製造方法
JPH1161596A (ja) 1997-08-08 1999-03-05 Asahi Schwebel Co Ltd ガラスクロス及びその積層板
JPH11315446A (ja) 1998-02-27 1999-11-16 Asahi Schwebel Co Ltd ガラスクロス及びプリント配線板

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Publication number Priority date Publication date Assignee Title
US5217796A (en) * 1985-02-19 1993-06-08 Nitto Boseki Co., Ltd. Woven material of inorganic fiber and process for making the same
JPH05286065A (ja) 1992-04-14 1993-11-02 Unitika Ltd 補強用無機繊維織布及びそれを用いた多層プリント配線板
US5662990A (en) 1994-07-19 1997-09-02 Gividi Italia S.P.A. Glass fabric produced with zero-twist yarn
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US20080271806A1 (en) * 2002-09-20 2008-11-06 Asahi-Schwebel Co., Ltd. Glass cloth and film substrate using the same
US7640951B2 (en) * 2002-09-20 2010-01-05 Asahi-Schwebel Co., Ltd. Glass cloth and film substrate using the same
US20100259910A1 (en) * 2006-03-30 2010-10-14 Kyocera Corporation Circuit Board and Mounting Structure
US8446734B2 (en) * 2006-03-30 2013-05-21 Kyocera Corporation Circuit board and mounting structure
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US8338931B2 (en) * 2007-03-26 2012-12-25 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and product tracing system utilizing the semiconductor device having top and bottom fibrous sealing layers
CN102733033A (zh) * 2011-04-07 2012-10-17 建滔（连州）玻璃纤维有限公司 一种超低捻电子级玻璃纤维布的生产方法
US20180023225A1 (en) * 2016-07-21 2018-01-25 International Business Machines Corporation Glass cloth including attached fibers
US10801137B2 (en) * 2016-07-21 2020-10-13 International Business Machines Corporation Glass cloth including attached fibers
US11746447B2 (en) * 2019-08-27 2023-09-05 Nitto Boseki Co., Ltd. Glass cloth, prepreg, and glass fiber-reinforced resin molded product

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EP1176239A4 (en) 2005-11-16
EP1176239B1 (en) 2015-07-01
CN1349573A (zh) 2002-05-15
TW507477B (en) 2002-10-21
KR20010103052A (ko) 2001-11-17
CN1329575C (zh) 2007-08-01
HK1050034A1 (en) 2003-06-06
EP1176239A1 (en) 2002-01-30
WO2000060153A1 (en) 2000-10-12
KR100475217B1 (ko) 2005-03-10
AU2326700A (en) 2000-10-23

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