US6867475B2 - Semiconductor device with an inductive element - Google Patents

Semiconductor device with an inductive element Download PDF

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US6867475B2
US6867475B2 US10/460,403 US46040303A US6867475B2 US 6867475 B2 US6867475 B2 US 6867475B2 US 46040303 A US46040303 A US 46040303A US 6867475 B2 US6867475 B2 US 6867475B2
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semiconductor substrate
region
inductor element
high resistance
resistance region
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US20040004255A1 (en
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Tetsuo Yoshimura
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Fujitsu Semiconductor Ltd
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Fujitsu Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/40—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00 with at least one component covered by groups H10D10/00 or H10D18/00, e.g. integration of IGFETs with BJTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/20—Inductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers

Definitions

  • the present invention relates to a semiconductor device such as a cellular phone, a PDA or others (Personal Digital Assistant) used in a frequency band from a few MHz to a few GHz, and a method for producing the same, particularly, to a semiconductor device including bipolar devices, MOS devices and other active elements carrying passive elements like inductor elements, and a method for producing the same.
  • a semiconductor device such as a cellular phone, a PDA or others (Personal Digital Assistant) used in a frequency band from a few MHz to a few GHz
  • a semiconductor device including bipolar devices, MOS devices and other active elements carrying passive elements like inductor elements, and a method for producing the same.
  • an electronic circuit device is formed by mounting inductors, condensers or other passive elements together with active elements on an electronic circuit board.
  • reduction of sizes, thicknesses, or weights of electronic circuit devices is being strongly demanded, especially for cellular phones and PDAs.
  • studies and developments have been made in regard to further increasing compactness and degree of integration of electronic circuit devices.
  • the MMIC monolithic microwave integrated circuit
  • the MMIC is a high frequency integrated circuit obtained by forming active elements such as transistors, and passive elements such as resistors and inductors integrally in a semiconductor process.
  • FIG. 1 is a perspective view of a CMOS device of the related art with an inductor element formed therein.
  • the CMOS device 100 comprises MOS transistors 102 and element separation regions 103 formed on a semiconductor substrate 101 , an interconnection structure 104 formed on the semiconductor substrate 101 and connected to MOS transistors 102 , and an inductor element 105 formed on the interconnection structure 104 in a spiral shape.
  • the larger the Q-value (Quality factor) of an inductor element the higher the performance thereof.
  • the Q-value of the inductor element 105 decreases.
  • the resistivity of the semiconductor substrate 101 is low, the change of the magnetic field generated by the inductor element 105 induces an eddy current in the semiconductor substrate 101 . This eddy current flows in a direction hindering the change of the magnetic field generated by the inductor element, therefore lowering the Q-value.
  • FIG. 3 shows the relation between the Q-value of the inductor element and the resistivity of the substrate.
  • FIGS. 4A through 4C show a fabrication process of a CMOS device.
  • silicon dioxide is buried into the silicon substrate 111 , which has a substrate resistivity of, for example, 1 k ⁇ cm, and element separation regions 112 having a depth of 300 nm are formed to separate device regions 113 A and 113 B.
  • one device region 113 B is covered by a resist. Then by ion-implantation, p-type dopant ions B + are accelerated to 300 keV and are implanted into the other device region 113 A at a density of 1 ⁇ 10 13 cm ⁇ 2 to form a p-well region 114 .
  • the resist is removed, and by using a mask inverted to that used in the above resist step, the device region 113 A for the p-well region 114 and others are masked.
  • n-type dopant ions P + are implanted to form an n-well region 115 .
  • an impurity diffusion region 116 is also formed below the un-masked region 112 C.
  • a gate oxide film 117 is deposited to a thickness of 2 nm in the device regions, and above it, a poly-silicon film is deposited to a thickness of 180 nm, then gate electrodes 118 are formed by a resist process.
  • a 100 nm thick silicon dioxide film is formed, and etch-back is performed by RIE (reactive ion etching) to form sidewalls 119 .
  • RIE reactive ion etching
  • the inter-layer insulating film 121 and plugs 122 , and the interconnection layer 123 are formed. Then, polishing and flattening are carried out by CMP (Chemical Mechanical Polishing) to form a multilayer interconnection structure.
  • CMP Chemical Mechanical Polishing
  • a film made of Al or other metals is deposited by sputtering on the multilayer interconnection structure to a thickness of 150 nm, and a spiral shape inductor element 124 is formed by photolithography and dry-etching. In this way, a CMOS device having an inductor element on the surface thereof is formed.
  • the impurity diffusion region 116 is also formed below the element separation region 112 C.
  • the semiconductor substrate 111 in an intrinsic state has a high resistivity, in such impurity diffused regions, the semiconductor substrate 111 turns to be conductive. So below the element separation region 112 C, an eddy current is induced by the AC (alternative current) magnetic field generated by the inductor element 124 . As the eddy current flows in a direction hindering the change of the magnetic field, there arises the aforesaid problem that the Q-value thereof degrades.
  • a more specific object of the present invention is to provide a semiconductor device able to suppress and prevent the occurrence of an eddy current induced by a magnetic field of an inductor element, and thus able to prevent degradation of performance of the inductor element, and a method for producing the same.
  • a semiconductor device comprising a semiconductor substrate having a predetermined substrate resistivity, a device region formed in the semiconductor substrate, impurity diffusion regions formed in the device region, an inductor element formed on a first surface of the semiconductor substrate; and a high resistance region formed in the semiconductor substrate facing the inductor element, which has a resistivity higher than that of the semiconductor substrate.
  • an eddy current is not induced by the magnetic field of the inductor element below the inductor element because of the high resistivity of the high resistance region.
  • the high resistance region is formed at a position farther than the impurity diffusion regions relative to the first surface of the semiconductor substrate.
  • the high resistance region is formed at a position farther than the impurity diffusion region relative to the surface of the semiconductor substrate, in other words, deeper than the impurity diffusion region relative to the surface of the semiconductor substrate, in the semiconductor substrate, impurity diffusion regions are not formed below the high resistance region, thus the resistivity of this region is higher than that of the impurity diffusion region. Therefore, induction of an eddy current can hardly happen even below the high resistance region, and this enables prevention of degradation of performance of the inductor element caused by eddy current induction.
  • the high resistance region is formed in such a way that there is not any said impurity region existing between said high resistance region and a region of said semiconductor substrate having the substrate resistivity.
  • the above invention there is not any impurity diffusion region formed below the high resistance region in the semiconductor substrate. Therefore, induction of an eddy current can hardly happen in the semiconductor substrate having a resistivity higher than the impurity regions, and this enables prevention of degradation of the performance of the inductor element caused by induction of the eddy current.
  • the high resistance region includes grooves. Due to the grooves in the high resistance region, even an eddy current is generated in this region, the eddy current can be divided.
  • the high resistance region may have a porous portion. Since a porous material provides a space of a complicated shape, it is difficult for an eddy current to form a closed circuit in the material, therefore induction of an eddy current is suppressed.
  • a depressed portion is formed on a second surface of the semiconductor substrate facing said inductor element.
  • a depressed portion is formed on a second surface of the semiconductor substrate facing said inductor element, for example, on a rear surface of the semiconductor substrate. Due to this, the volume of the semiconductor substrate where the eddy current induction occurs is reduced, so the eddy current is suppressed. This enables prevention of degradation of the performance of the inductor element caused by induction of the eddy current.
  • a method for producing a semiconductor device comprising the steps of forming a high resistance region in a semiconductor substrate, said high resistance region having a resistivity higher than that of the semiconductor substrate, forming a transistor in a device region formed around the high resistance region, and forming an inductor element on the high resistance region, wherein in the step of forming a transistor, the high resistance region is masked when implanting impurity elements to the device region.
  • the high resistance region is masked while impurity elements are implanted to the device region. So, impurity elements are implanted to the high resistance region, and this region remains a high resistance region. Due to this, induction of an eddy current is suppressed.
  • FIG. 1 is a perspective view of a CMOS device of the related art with an inductor element formed therein;
  • FIG. 2 is a schematic view for explaining induction of an eddy current by the magnetic field of an inductor element
  • FIG. 3 is a view showing the relation between Q-value and the substrate resistivity
  • FIGS. 4A through 4C are views showing a process for fabricating the CMOS device of the related art
  • FIG. 5 is a perspective view of a CMOS device according to a first embodiment of the present invention.
  • FIG. 6 is a sectional view of the CMOS device according to the first embodiment
  • FIGS. 7A through 7D are views showing a process for fabricating the CMOS device according to the first embodiment (part 1);
  • FIGS. 8E and 8F are views showing the process for fabricating the CMOS device according to the first embodiment (part 2);
  • FIG. 9 is a sectional view of the CMOS device according to a second embodiment of the present invention.
  • FIGS. 10A and 10B are views showing a process for fabricating the CMOS device according to the second embodiment
  • FIGS. 11A and 11B are views showing a process for fabricating a CMOS device according to a modification to the second embodiment
  • FIG. 12 is a sectional view of the CMOS device according to a third embodiment of the present invention.
  • FIGS. 13A through 13C are views showing a process for fabricating the CMOS device according to the third embodiment
  • FIG. 14 is a perspective view of the CMOS device according to a fourth embodiment of the present invention.
  • FIG. 15 is a sectional view of the CMOS device according to the fourth embodiment of the present invention.
  • FIG. 16 is a flow chart showing an example of a design method according to a fifth embodiment of the present invention.
  • FIGS. 17A and 17B are views showing a fabrication process utilizing the design method according to the fifth embodiment.
  • FIG. 18 is a flow chart showing an example of a design method according to a modification to the fifth embodiment of the present invention.
  • the present embodiment relates to an example of a CMOS device in which a high resistance region just below an inductor element is formed deeper than an impurity diffusion region.
  • FIG. 5 is a perspective view of the CMOS device of the first embodiment of the present invention
  • FIG. 6 is a sectional view of the same.
  • the CMOS device 10 of the present embodiment comprises a semiconductor substrate 11 , element separation regions 12 formed on the semiconductor substrate 11 , device regions 13 A and 13 B separated by the element separation regions 12 , p-channel and n-channel MOS transistors 14 A and 14 B formed in the device regions 13 A and 13 B, plugs 16 and an interconnection layer 17 connected to the p-channel and n-channel MOS transistors 14 A and 14 B, an interlayer insulating film 18 , and an inductor element 19 in connection with the plugs 16 or the interconnection layer 17 .
  • a high resistance region 20 just below the inductor element 19 is formed deeper than the well regions 21 A and 21 B of the p-channel and n-channel MOS transistors 14 A and 14 B.
  • the semiconductor substrate 11 is formed from silicon of a resistivity (specific resistance), for example, 1 k ⁇ cm. From the point of view of suppressing the eddy current induced by the magnetic field of the inductor element 19 , higher substrate resistivity is preferable.
  • the p-channel MOS transistor 14 A comprises a n-well region 21 A formed by diffusing n-type dopant ions in the semiconductor substrate 11 , source and drain regions 22 A and 22 B formed by diffusing p-type dopant ions, gate insulating films 23 formed from a 2 nm thick silicon dioxide film on the surface of the semiconductor substrate 11 , gate electrodes 24 formed from a 180 nm poly-silicon film, and sidewall insulating films 25 .
  • n-type dopant ions for example, P + ions
  • n-well region 21 A By ion-implantation, n-type dopant ions, for example, P + ions, are accelerated to 600 keV and are implanted into the n-well region 21 A at a density of 1 ⁇ 10 13 cm ⁇ 2 .
  • the depth of the n-well for example, is 1000 nm or so from the surface of the semiconductor substrate 11 .
  • the n-channel MOS transistor 14 B comprises a p-well region 21 B formed by diffusing dopant ions having opposite conductivity to the p-channel MOS transistor, source and drain regions 22 C and 22 D formed by diffusing n-type dopant ions, gate insulating films 23 formed from a 2 nm thick silicon dioxide film on the surface of the semiconductor substrate 11 , gate electrodes 24 formed from a 180 nm poly-silicon film, and sidewall insulating films 25 .
  • p-type dopant ions for example, B + ions
  • p-type dopant ions for example, B + ions
  • the depth of the p-well is 1000 nm or so from the surface of the semiconductor substrate 11 .
  • the specific resistances of the n-well 21 A and p-well 21 B turn to be several tens ⁇ cm, lower than that of the semiconductor substrate 11 .
  • the interconnection structure includes the plugs 16 formed by tungsten (W) connecting the MOS transistors and their interconnections, the interconnection layer 17 is formed of about 150 nm aluminum (Al) or another metal film, and the interlayer insulating film 18 is formed from a 300 nm silicon dioxide.
  • the inductor element 19 is formed, for example, in a spiral shape on the interconnection structure, and the two ends thereof are connected to the interconnection layer 17 by the plugs 16 .
  • the inductor element 19 is formed from 150 nm aluminum (Al) or another metal film. Specifically, the inductor element 19 is from 40,000 ⁇ m2 to 250,000 ⁇ m2 in area, and 135 nm to 165 nm in thickness. Note that, for the inductor element 19 , besides the spiral shape inductor, a meandering inductor or others can also be used.
  • the high resistance region 20 is formed in the semiconductor substrate 11 and just below the inductor element 19 .
  • the high resistance region 20 is formed by burying insulating materials such as silicon dioxide films, silicon nitride oxide films, or silicon nitride films in trenches formed in the semiconductor substrate 11 .
  • the high resistance region 20 is formed deeper than the element separation regions 12 , and deeper than the lower ends of the p-well 21 B and the n-well 21 A.
  • the depth of the high resistance region 20 for example, is set to be 1200 nm to 1500 nm from the surface of the semiconductor substrate 11 . That is, impurity regions are not formed below the high resistance region 20 . For this reason, the electrical resistivity of the region below the high resistance region 20 is equivalent to the substrate resistivity, that is, higher than the electrical resistivity of the p-well 21 B and n-well 21 A.
  • FIGS. 7A through 7D and FIGS. 8E and 8F are views showing a process for fabricating the CMOS device according to the first embodiment.
  • a trench 11 - 1 of a depth of 1000 nm is formed.
  • the depth of the trench 11 - 1 is selected so that its sum with the depth to be polished away in the next step is greater than the depths of the n-well 21 A and the p-well 21 B that are explained later.
  • a trench 11 - 3 of a depth of 300 nm is formed, and trenches 11 - 2 A and 11 - 2 B for separating MOS transistors are also formed at the same time.
  • a 1300 nm deep trench 11 - 3 is formed in the semiconductor substrate 11 just below the inductor element.
  • a silicon dioxide film is deposited to a thickness of 1600 nm, and trenches 11 - 2 A, 11 - 2 B, 11 - 3 are buried by the silicon dioxide.
  • the silicon dioxide film is polished by CMP until the semiconductor substrate 11 is exposed.
  • a resist process by a resist process, patterning is performed using a p-well mask to cover the surface of the substrate with a resist 31 except the region where the n-channel MOS transistor 14 B is to be formed.
  • B + dopant ions are accelerated to 300 keV and are implanted into the device region 13 B at a density of 1 ⁇ 10 13 cm ⁇ 2 to form the p-well region 21 B.
  • B + dopant ions are accelerated to a predetermined range from 285 keV to 315 keV, and are diffused to a depth from 700 nm to 1000 nm relative to the surface of the semiconductor substrate 11 to form the p-well region 21 B.
  • resist 31 is removed, and by using an n-well mask that is obtained by inverting the p-well mask used in the above photolithography step, the device region where the p-well region 21 B has been formed is covered with a resist 32 .
  • P + dopant ions are accelerated to 600 keV and are implanted into the device region 13 A at a density of 1 ⁇ 10 13 cm ⁇ 2 to form the n-well region 21 A.
  • P + dopant ions are accelerated to a predetermined range from 570 keV to 630 keV, and are diffused to a depth from 700 nm to 1000 nm relative to the surface of the semiconductor substrate 11 to form the n-well region 21 A.
  • the dopant ions are also implanted into the high resistance region 20 .
  • the high resistance region 20 is formed deeper than the depth that the dopant ions can reach, that is, deeper than the n-well and p-well, consequently, there is no impurity diffusion region formed in the semiconductor substrate below the high resistance region 20 .
  • annealing is performed for 10 seconds at 1000° C. for activation.
  • a gate oxide film 23 is deposited to a thickness of 2 nm by thermally oxidizing the surface of the semiconductor substrate 11 , and on the gate oxide film 23 , a 180 nm thick poly-silicon film is formed by CVD.
  • the gate electrode 24 is formed by dry-etching after patterning using photolithography.
  • one device region 13 B is masked.
  • BF 2 + dopant ions are accelerated to 10 keV and are implanted into the other device region 13 A at a density of 1 ⁇ 10 14 cm ⁇ 2 to form a p-type LDD (Light Doped Drain) region (not shown).
  • + dopant ions are accelerated to 10 keV and are implanted into the other device region 13 A at a density of 1 ⁇ 10 14 cm ⁇ 2 to form an n-type LDD region (not shown).
  • a 100 nm silicon dioxide film is formed by CVD, and etch-back is performed by RIE to form sidewalls 25 .
  • source and drain regions 22 A through 22 D are formed.
  • step shown in FIG. 8E by RTA (Rapid Thermal Annealing), heat treatment is performed for three seconds at 1000° C. for activation.
  • RTA Rapid Thermal Annealing
  • a silicon dioxide film is deposited on the surface of the substrate to a thickness of 300 nm by CVD.
  • flattening is carried out by CMP to form the inter-layer insulating film 18 A.
  • contact holes are opened by photolithography and dry etching, and a tungsten film is deposited to a thickness of 300 nm by CVD, and then polishing is performed by CMP to form plugs 16 in the contact holes.
  • a 150 nm Al film is formed by sputtering, and the interconnection layer 17 is formed by photolithography and dry etching.
  • a 300 nm silicon dioxide film is formed by CVD, and flattening is carried out by CMP to form the inter-layer insulating film 18 B. Then the interconnection layer 17 and the plugs 16 are formed in the same way as shown above.
  • an Al or other metal films is deposited on the interconnection structure to a thickness of 150 nm by sputtering, and a spiral shape inductor element 19 is formed by photolithography and dry-etching.
  • CMOS device 10 of the present embodiment is formed.
  • the high resistance region 20 just below the inductor element 19 is formed deeper than the lower ends of the p-well and n-well 21 that are impurity regions.
  • the high resistance region 20 is an insulating body, it prevents induction of an eddy current, so below the high resistance region 20 , impurity regions are not formed, and the high substrate resistivity prevents induction of an eddy current. Accordingly, performance degradation of the inductor element 19 can be prevented.
  • the present embodiment relates to an example of a CMOS device in which a division pattern including a number of grooves is formed on the bottom surface of a high resistance region just below an inductor element.
  • the present embodiment is the same as the first embodiment except for the formation of the division pattern.
  • FIG. 9 is a sectional view of the CMOS device according to the second embodiment of the present invention.
  • the same reference numerals are assigned to the same elements with those explained previously, and explanations thereof will be omitted.
  • the CMOS device 40 of the present embodiment comprises a semiconductor substrate 11 , element separation regions 12 formed on the semiconductor substrate 11 , device regions 13 A and 13 B separated by the element separation regions 12 , p-channel and n-channel MOS transistors 14 A and 14 B formed in the device regions 13 A and 13 B, plugs 16 and an interconnection layer 17 connected to the p-channel and n-channel MOS transistors 14 A and 14 B, an interlayer insulating film 18 , and an inductor element 19 in connection with the plugs 16 or the interconnection layer 17 .
  • a number of grooves 41 - 1 are formed on the bottom surface of the high resistance region 41 just below the inductor element 19 .
  • the grooves 41 - 1 at the bottom of the high resistance region 41 just below the inductor element 19 are formed to be 0.1 ⁇ m to 200 ⁇ m in width for each (preferably 1.0 ⁇ m to 2.0 ⁇ m), and 0.1 ⁇ m to 50 ⁇ m in intervals between grooves (preferably 0.5 ⁇ m to 1.0 ⁇ m), and 1200 nm to 1400 nm in depth from the surface of the semiconductor substrate 11 , and are formed at least along one direction inside the surface of the semiconductor substrate 11 .
  • an insulating material like the silicon dioxide film as in the first embodiment.
  • impurity diffusion regions 42 are formed.
  • the impurity diffusion region 42 is formed to extend to approximately the same depth as the n-well region 21 A.
  • FIGS. 10A and 10B are views showing a process for fabricating the CMOS device according to the second embodiment. Below, overlapping explanations with the first embodiment will be omitted.
  • trenches 11 - 4 of a depth of 1000 nm are formed.
  • the trenches 11 - 4 are set to be 900 nm to 1100 nm in depth, 0.1 ⁇ m to 200 ⁇ m (preferably 1.0 ⁇ m to 2.0 ⁇ m) in width for each, and 0.1 ⁇ m to 50 ⁇ m (preferably 0.5 ⁇ m to 1.0 ⁇ m) in intervals between grooves.
  • Such trenches 11 - 4 are formed in the silicon substrate 11 just below the inductor element 19 .
  • a trench 11 - 5 of a depth of 300 nm is formed.
  • the depth of the trench 11 - 5 which is cut to contain the aforesaid trenches 11 - 4 , is 1200 nm to 1400 nm from the surface of the semiconductor substrate 11 to the bottom of the grooves 41 - 1 .
  • trenches 11 - 2 for separating MOS transistors are also formed.
  • a silicon dioxide film is deposited to a thickness of 1600 nm, and is then polished and flattened by CMP to form the high resistance region 41 and the element separation regions 12 .
  • p-well and n-well regions 21 are formed.
  • a resist mask is not formed in the high resistance region 41 , so the n-type impurity diffusion region 42 is formed between the grooves 41 - 1 in the high resistance region 41 .
  • the high resistance region 41 just below the inductor element 19 is formed to have a number of grooves 41 - 1 on its bottom surface, thereby the induced eddy current is divided, and the induction of the eddy current is suppressed. Further, because of the grooves at the bottom of the high resistance region, dishing or other local depressions generated during the flattening step by CMP can be reduced.
  • n-type dopant ions are implanted without a resist mask formed in the high resistance region 41 when forming the n-well region 21 A, but as shown in steps in FIGS. 11A and 11B , a resist mask may also be formed in the high resistance region 41 .
  • FIGS. 11A and 11B are views showing a process for fabricating a CMOS device according to a modification to the second embodiment.
  • a p-well region 21 B is formed.
  • the device region 13 A on the side of the n-well region 21 A and the high resistance region 41 are masked by the resist 31 , and by ion-implantation, B + dopant ions are accelerated to 300 keV and are implanted into the device region 13 B at a density of 1 ⁇ 10 13 cm ⁇ 2 to form the p-well region 21 B.
  • resist 31 is removed, and the device region 13 B on the side of the p-well region 21 B and the high resistance region 41 are masked by the resist 33 .
  • P + dopant ions are accelerated to 600 keV and are implanted into the device region 13 A at a density of 1 ⁇ 10 13 cm ⁇ 2 to form the n-well region 21 A.
  • this substrate region is of the substrate resistivity and is in a high resistivity condition, so induction of an eddy current can hardly occur, and the induction of an eddy current is suppressed. Therefore, performance degradation of the inductor element 19 can be prevented.
  • the present embodiment relates to an example of a CMOS device in which a porous layer is formed in a high resistance region just below an inductor element.
  • the present embodiment is the same as the first embodiment except for the formation of the porous layer.
  • FIG. 12 is a sectional view of the CMOS device according to the third embodiment of the present invention.
  • the same reference numerals are assigned to the same elements with those explained previously, and explanations thereof will be omitted.
  • the CMOS device 50 of the present embodiment comprises a semiconductor substrate 11 , element separation regions 12 formed on the semiconductor substrate 11 , device regions 13 A and 13 B separated by the element separation regions 12 , p-channel and n-channel MOS transistors 14 A and 14 B formed in the device regions 13 A and 13 B, plugs 16 and an interconnection layer 17 connected to the p-channel and n-channel MOS transistors 14 A and 14 B, an interlayer insulating film 18 , and an inductor element 19 in connection with the plugs 16 or the interconnection layer 17 .
  • a porous layer 52 is formed in the high resistance region 51 just below the inductor element 19 .
  • the porous layer 52 is obtained by converting the silicon of a portion of the semiconductor substrate 11 into a porous condition.
  • its thickness is set to be 900 nm to 1100 nm. Since porous silicon forms a space of a complicated shape, it is difficult for an eddy current to form a closed circuit in this material, and induction of an eddy current is suppressed. Therefore, performance degradation of an inductor element can be prevented.
  • FIGS. 13A through 13C are views showing a process for fabricating the CMOS device according to the third embodiment.
  • trenches 11 - 2 A, 11 - 2 B, 11 - 6 are formed to be of a depth of 300 nm. These trenches are formed for the element separation regions 12 and the high resistance region 51 just below the inductor element 19 .
  • a resist 34 is formed by photolithography with an opening in the portion corresponding to the trench 11 - 6 just below the inductor element 19 .
  • the porous layer 52 is formed in the opening 34 - 1 in the semiconductor substrate 11 .
  • the conversion current is set to be 100 mA/cm 2 , and the conversion current is supplied for about 12 minutes in the semiconductor substrate 11 .
  • a porous layer 52 of a thickness of 1000 nm is formed.
  • a silicon dioxide film is deposited to a thickness of 400 nm, and is then polished and flattened by CMP to form the high resistance region 51 and the element separation regions 12 .
  • the element separation region just below the inductor element is formed at the same depth with the element separation regions for separating MOS transistor. Therefore, occurrence of dishing or other local depressions generated during the flattening step by CMP can be reduced.
  • the present embodiment relates to an example of a CMOS device in which the rear surface of the semiconductor substrate just below an inductor element is ground and removed.
  • FIG. 14 is a perspective view of the CMOS device according to the fourth embodiment of the present invention
  • FIG. 15 is a sectional view of the same.
  • the same reference numerals are assigned to the same elements with those explained previously, and explanations thereof will be omitted.
  • the CMOS device 60 of the present embodiment comprises a semiconductor substrate 11 , element separation regions 12 formed on the semiconductor substrate 11 , device regions 13 A and 13 B separated by the element separation regions 12 , p-channel and n-channel MOS transistors 14 A and 14 B formed in the device regions 13 A and 13 B, plugs 16 and an interconnection layer 17 connected to the p-channel and n-channel MOS transistors 14 A and 14 B, an interlayer insulating film 18 , and an inductor element 19 in connection with the plugs 16 or the interconnection layer 17 .
  • a recess 62 is provided on the rear surface of the semiconductor substrate 11 corresponding to the inductor element 19 to have an area equal to or greater than the area occupied by the inductor element 19 .
  • the recess 62 can be formed in the following way.
  • positioning holes are formed beforehand to penetrate the semiconductor substrate 11 from its major surface to its rear surface. These holes can be used as position references for masks during the resist process on the rear surface of the semiconductor substrate 11 corresponding to the inductor element 19 . Note that patterning can also be performed on the rear surface of the semiconductor substrate 11 using a two-side aligner.
  • the step of grinding the rear surface of the semiconductor substrate 11 can be carried out either before formation of the element separation regions 12 , or after formation of the inductor element.
  • the depth of the high resistance region 61 is set to be the same as that of element separation regions 12 for separating MOS transistors, but as in the first embodiment, the high resistance region 61 just below the inductor element 19 can be formed even deeper, and this reduces the amount of grinding for forming the recess 62 .
  • a number of the recesses 62 may be provided.
  • on the rear surface and grooves in a grating manner can be formed over the area equal to or greater than that occupied by the inductor element 19 . It is preferable that the bottom of each groove reach the high resistance region 61 , so that the induced eddy current is divided.
  • the present embodiment relates to an example of a method for designing a mask for patterning a resist when forming an impurity region during fabrication of a CMOS device.
  • FIG. 16 is a flow chart showing an example of a design method according to the fifth embodiment of the present invention. Below, explanations will be given with reference to FIG. 16 .
  • a pattern of the substrate region including the device region, the element separation region and others is generated by well-known methods (step 201 ).
  • mask data for making an opening only in a portion for forming a p-well is generated (step 202 ).
  • mask data for making an opening only in a portion for forming an n-well is generated (step 203 ).
  • FIGS. 17A and 17B show an example of patterning a resist by photolithography after making masks using the p-well mask data and n-well mask data generated by the above method.
  • the CMOS device 40 of the second embodiment will be taken as an example.
  • the n-well device region 13 A and the high resistance region 41 are covered by the resist 35 .
  • a p-type impurity element is implanted to form a p-well region 21 B.
  • the p-well device region 13 B and the high resistance region 41 are covered by the resist 36 .
  • an n-type impurity element is implanted to form an n-well region 21 A.
  • a mask can be designed in the following way.
  • FIG. 18 is a flow chart showing another example of a design method according to the present embodiment. Below, explanations will be made with reference to FIG. 18 .
  • CMOS device circuit design data a pattern of the substrate region including the device region, the element separation region and others is generated by well-known methods (step 211 ).
  • p-well mask data mask data for making an opening only in a portion for forming a p-well is generated (referred to as p-well mask data) (step 212 ).
  • n-well mask data mask data for making an opening in other than the portion for forming the p-well is generated (step 213 ).
  • inductor device region data is generated (step 214 ) and is appended to and combined with the n-well mask data (step 215 ). In this way, both p-well mask data and n-well mask data are generated.
  • Masks made by using data generated in this way have the same effects as the fifth embodiment. Further, when generating mask data in this way, the amount of the inductor device region data is much smaller than that of the n-well data. So, comparing with the case in which p-well data and n-well data are generated separately, design work using CAD or others can be greatly reduced.
  • CMOS devices are described as an example in the above embodiments, the present invention is also applicable to BiCMOS devices, and Si bipolar devices.
  • the present invention by forming a high resistance region in a semiconductor substrate at a position deeper than an impurity diffusion region, it becomes possible to suppress induction of an eddy current in the high resistance region caused by the magnetic field created by an inductor element provided on the semiconductor substrate.
  • the eddy current can be divided.
  • a semiconductor device able to prevent performance degradation of the inductor element can be provided.

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  • Semiconductor Integrated Circuits (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Element Separation (AREA)
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US8652934B1 (en) * 2012-12-26 2014-02-18 Micron Technology, Inc. Semiconductor substrate for photonic and electronic structures and method of manufacture
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CN107658288B (zh) * 2014-11-21 2020-02-07 威锋电子股份有限公司 集成电路装置
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KR20040004153A (ko) 2004-01-13
US20040004255A1 (en) 2004-01-08
TW200401407A (en) 2004-01-16
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CN1485919A (zh) 2004-03-31

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