US3823771A - Cooling box for installation in stacks of disk-cells - Google Patents

Cooling box for installation in stacks of disk-cells Download PDF

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Publication number
US3823771A
US3823771A US00311568A US31156872A US3823771A US 3823771 A US3823771 A US 3823771A US 00311568 A US00311568 A US 00311568A US 31156872 A US31156872 A US 31156872A US 3823771 A US3823771 A US 3823771A
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US
United States
Prior art keywords
cooling
connector
disk
pots
stacks
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US00311568A
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English (en)
Inventor
K Ludwig
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
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Siemens AG
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Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
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Publication of US3823771A publication Critical patent/US3823771A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • ABSTRACT A flat cooling. box for capsuled disk-cells is disclosed consisting of two round cooling pots at both sides of a flat connecting piece, provided with concentric annular grooves for cooling fluid and current supply. lnflow and outflow channels are directed through the center of the circle with symmetrical passages in communication with the annular grooves. The cooling pots are connected with their connecting piece through annular riveting.
  • This invention is concerned with a cooling box for installation in stacks of disk-cells and consists of two round cooling pots having their flat heat-transmitting surfaces at both sides of a platelike connector hermetically joined thereto, for connecting the device to cooling-fluid connectors and current connectors, in which the connecting piece has inflow and outflow channels directed from its edge to its interior, with each having its outlet in a passage perpendicular thereto and going through the wall-thickness of the connecting piece, with which the fluid-distributors of the two cooling pots are in communication.
  • a known cooling box of this type (German Exhibited Text DT-OS 1,914,790) has a substantially rectangular connecting plate, which carries the two cooling 'pots. These cooling pots have relatively wide and thick flanges at their periphery, which serve to fasten them to the connecting piece. The part of the cooling pots projecting above the connecting piece is used as a current-connection. In the interior of the cooling pots a fluid-distributor is located. This distributor is formed of a number of webs, which are connected to each other by means of a central and an eccentric passage so that a great pressure-drop prevails in the'i'nterior of the cooling pot and, moreover, the heat-exchange area is limited.
  • the fundamental problem solved by the invention is to save material and simplify manufacture while making a cooling box having a relatively large heatexchanger surface over which the cooling fluid flows and a relatively smaller pressure drop to thus diminish the heat buildup in the cooling box.
  • the solution of the problem posed is achieved by'using a connecting piece having a round plate with inflow and outflow channels directed through and aligned with the center of the circle, and having passages disposed symmetrically of the center of. the circle. Further it carries axial rimprojections on both sides which by annular riveting are brought into engagement with radial projections from the cooling pots.
  • the cooling pots have in their interior, concentric, continuous, annular channels that extend to the faces-and are in communication with the passages.
  • the flat heat-transfer surfaces of the cooling pot are formed as annular surfaces extending from the outer rim of the cooling pot to the middle zone and are offset from one another.
  • the annular surfaces and the annular channels permit the manufacture of the cooling pots on automatic lathes.
  • the connecting piece can also be produced from bar material in automatic lathes, needing only a subsequent machining in boring machines.
  • FIG. 1 illustrates a side view of a cooling box, a portion of which is illustrated as a cross sectional view
  • FIG. 2 illustrates a plan view of a connecting piece
  • FIG. 3 illustrates a cross sectional view of a cooling pot
  • FIG. 4 illustrates a plan view of the device of FIG. 1.
  • the cooling box which is held at both sides in electric contact with adjacent disk-cells (not shown), consists of a central round connecting piece 1 having parallel faces 6. and 7, carrying axial rim-projections 6a and 7a, by which, through annular riveting, it is connected with the two round cooling pots 8 and 9.
  • the fluid-tight arrangement isobtained by conventional seal-rings inserted in annular grooves in the cooling pots.
  • the round connecting piece 1 has two inflow and outflow channels 2 and 3, directed to, and aligned with, the center of the circle, and into which are screwed the connector-pieces 2a and 3a. Passages 4 and 5 are provided symmetrical to the center of the circle, and, perpendicular to the inflow and outflow channels 2 and 3.
  • the passages 4 and 5 thereupon pass through the wall thickness of the connecting piece.
  • In the interior of the cooling pots 8 and 9 are continuous concentric annular channels 10, which extend to the faces 6 and 7 of the connecting piece, and are connected to the passages 4 and 5.
  • Each cooling pot 8 and 9 has annular surfaces 8b and 9b protruding from the rim and middle zone. In the event of tilting of the contact surfaces, these surfaces keep the mechanical bending stress on the sensitive thyristor disks so small that breakage of the disk is avoided. The electrical and thermal transfer resistance .is hereby scarcely impaired.
  • a current-connector 13 can be screwed on, making it possible to have a series and/or parallel hook-up of the disk-cells.
  • a cooling box for installation in stacks of disk-cells comprising,
  • the cooling pots having continuous concentric circular channels therein, the center of which is the center of the disk, said circular channels connecting the internal inlet and outlet passages of the connector to provide coolant distribution within the cooling pots.
  • cooling box for installation in stacks of diskcells as in claim 3 wherein the cooling pot is formed of machined annular channels and round heat transmitting surface.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Rectifiers (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
US00311568A 1971-12-04 1972-12-04 Cooling box for installation in stacks of disk-cells Expired - Lifetime US3823771A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2160302A DE2160302C3 (de) 1971-12-04 1971-12-04 Kühldose zum Einbau in Scheibenzellenstapel

Publications (1)

Publication Number Publication Date
US3823771A true US3823771A (en) 1974-07-16

Family

ID=5827055

Family Applications (1)

Application Number Title Priority Date Filing Date
US00311568A Expired - Lifetime US3823771A (en) 1971-12-04 1972-12-04 Cooling box for installation in stacks of disk-cells

Country Status (14)

Country Link
US (1) US3823771A (xx)
JP (1) JPS5145229B2 (xx)
BE (1) BE792068A (xx)
CA (1) CA987027A (xx)
CH (1) CH548670A (xx)
DE (1) DE2160302C3 (xx)
DK (1) DK143625C (xx)
FR (1) FR2162074B1 (xx)
GB (1) GB1405604A (xx)
IT (1) IT971389B (xx)
NL (1) NL7215169A (xx)
NO (1) NO131810C (xx)
SE (1) SE374978B (xx)
ZA (1) ZA728262B (xx)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3999105A (en) * 1974-04-19 1976-12-21 International Business Machines Corporation Liquid encapsulated integrated circuit package
DE2758166A1 (de) * 1977-02-18 1978-08-24 Ckd Praha Leistungshalbleiterbauelement
US4159740A (en) * 1977-08-29 1979-07-03 Amf Incorporated Direct expansion jacket for horizontal dough mixers
US4161980A (en) * 1976-09-24 1979-07-24 Siemens Aktiengesellschaft Cooling capsule for thyristors
US4188996A (en) * 1977-05-04 1980-02-19 Ckd Praha, Oborovy Podnik Liquid cooler for semiconductor power elements
US4366497A (en) * 1979-06-29 1982-12-28 Siemens Aktiengesellschaft Cooling capsule for disc-shaped semiconductor components
US4520384A (en) * 1981-09-19 1985-05-28 Bbc Aktiengesellschaft Brown, Boveri & Cie. Power semiconductor component for cooling by boiling or liquids
US4520383A (en) * 1981-09-19 1985-05-28 Bbc Aktiengesellschaft Brown, Boveri & Cie. Power semiconductor component for boiling cooling
US4521170A (en) * 1981-09-19 1985-06-04 Brown, Boveri & Cie. Ag Power semiconductor component for liquid cooling
US5983991A (en) * 1997-06-30 1999-11-16 Franks; James W. Tissue chuck
US6111749A (en) * 1996-09-25 2000-08-29 International Business Machines Corporation Flexible cold plate having a one-piece coolant conduit and method employing same
US11412637B2 (en) * 2019-05-31 2022-08-09 Abb Schweiz Ag Apparatus for conducting heat

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2606157C2 (de) * 1976-02-17 1983-11-10 Brown, Boveri & Cie Ag, 6800 Mannheim Verbindung von Kühldose einer Kühleinrichtung mit einer Kühlflüssigkeitszuleitung oder- ableitung
DE2609512C2 (de) * 1976-03-08 1982-11-25 Siemens Ag, 1000 Berlin Und 8000 Muenchen Gasisolierte Thyristoranordnung
DE2640000C2 (de) * 1976-09-04 1986-09-18 Brown, Boveri & Cie Ag, 6800 Mannheim Zylindrische Kühldose mit gegenüberliegenden Ein- und Ausflußöffnungen für flüssigkeitsgekühlte Leistungshalbleiterbauelemente und Verfahren zur Herstellung derselben
DE2826898A1 (de) * 1978-06-19 1980-01-03 Siemens Ag Kuehlkoerper fuer elektrische bauelemente
JPS5610948A (en) * 1979-07-06 1981-02-03 Hitachi Ltd Water cooling fin for semiconductor element
FR2524760B1 (fr) * 1982-03-30 1986-10-10 Auxilec Piece de maintien pour semiconducteur, et dispositif de puissance a semiconducteur comportant une telle piece
DE3818428C2 (de) * 1987-11-27 1993-11-04 Asea Brown Boveri Kuehldose zum abfuehren der verlustwaerme von halbleiterelementen
DE3740235C2 (de) * 1987-11-27 1994-03-10 Asea Brown Boveri Kühldose zum Abführen der Verlustwärme von Halbleiterelementen
DE3740233A1 (de) * 1987-11-27 1989-06-08 Asea Brown Boveri Kuehldose zum abfuehren der verlustwaerme von halbleitern
DE4322932A1 (de) * 1993-07-09 1995-01-19 Abb Patent Gmbh Flüssigkeitskühlkörper mit Isolierscheiben, elektrischen Anschlußblechen und einem Isolationsring

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2179293A (en) * 1938-08-25 1939-11-07 Westinghouse Electric & Mfg Co Cooled contact rectifier
US2504281A (en) * 1946-04-18 1950-04-18 Ericsson Telefon Ab L M Device for condensers
US2942165A (en) * 1957-01-03 1960-06-21 Gen Electric Liquid cooled current rectifiers
DE1914790A1 (de) * 1969-03-22 1970-10-01 Siemens Ag Fluessigkeitsgekuehlte Baugruppe mit Scheibenzellen

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE967450C (de) * 1952-08-27 1957-11-14 Siemens Ag Kuehleinrichtung fuer Trockengleichrichter mit Kuehlkanaelen
FR1479193A (fr) * 1965-05-13 1967-04-28 Siemens Ag Dispositif de refroidissement de cellules semiconductrices

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2179293A (en) * 1938-08-25 1939-11-07 Westinghouse Electric & Mfg Co Cooled contact rectifier
US2504281A (en) * 1946-04-18 1950-04-18 Ericsson Telefon Ab L M Device for condensers
US2942165A (en) * 1957-01-03 1960-06-21 Gen Electric Liquid cooled current rectifiers
DE1914790A1 (de) * 1969-03-22 1970-10-01 Siemens Ag Fluessigkeitsgekuehlte Baugruppe mit Scheibenzellen

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3999105A (en) * 1974-04-19 1976-12-21 International Business Machines Corporation Liquid encapsulated integrated circuit package
US4161980A (en) * 1976-09-24 1979-07-24 Siemens Aktiengesellschaft Cooling capsule for thyristors
DE2758166A1 (de) * 1977-02-18 1978-08-24 Ckd Praha Leistungshalbleiterbauelement
US4188996A (en) * 1977-05-04 1980-02-19 Ckd Praha, Oborovy Podnik Liquid cooler for semiconductor power elements
US4159740A (en) * 1977-08-29 1979-07-03 Amf Incorporated Direct expansion jacket for horizontal dough mixers
US4366497A (en) * 1979-06-29 1982-12-28 Siemens Aktiengesellschaft Cooling capsule for disc-shaped semiconductor components
US4520384A (en) * 1981-09-19 1985-05-28 Bbc Aktiengesellschaft Brown, Boveri & Cie. Power semiconductor component for cooling by boiling or liquids
US4520383A (en) * 1981-09-19 1985-05-28 Bbc Aktiengesellschaft Brown, Boveri & Cie. Power semiconductor component for boiling cooling
US4521170A (en) * 1981-09-19 1985-06-04 Brown, Boveri & Cie. Ag Power semiconductor component for liquid cooling
US6111749A (en) * 1996-09-25 2000-08-29 International Business Machines Corporation Flexible cold plate having a one-piece coolant conduit and method employing same
US5983991A (en) * 1997-06-30 1999-11-16 Franks; James W. Tissue chuck
US11412637B2 (en) * 2019-05-31 2022-08-09 Abb Schweiz Ag Apparatus for conducting heat

Also Published As

Publication number Publication date
NO131810B (xx) 1975-04-28
DE2160302B2 (de) 1974-11-07
SE374978B (xx) 1975-03-24
DK143625B (da) 1981-09-14
DE2160302C3 (de) 1975-07-17
NO131810C (xx) 1975-08-06
ZA728262B (en) 1973-07-25
NL7215169A (xx) 1973-06-06
BE792068A (fr) 1973-05-29
IT971389B (it) 1974-04-30
FR2162074B1 (xx) 1977-04-22
CH548670A (de) 1974-04-30
DK143625C (da) 1982-02-22
CA987027A (en) 1976-04-06
FR2162074A1 (xx) 1973-07-13
GB1405604A (en) 1975-09-10
JPS5145229B2 (xx) 1976-12-02
DE2160302A1 (de) 1973-06-07
JPS4873078A (xx) 1973-10-02

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