FR2162074A1 - - Google Patents

Info

Publication number
FR2162074A1
FR2162074A1 FR7242452A FR7242452A FR2162074A1 FR 2162074 A1 FR2162074 A1 FR 2162074A1 FR 7242452 A FR7242452 A FR 7242452A FR 7242452 A FR7242452 A FR 7242452A FR 2162074 A1 FR2162074 A1 FR 2162074A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7242452A
Other languages
French (fr)
Other versions
FR2162074B1 (xx
Inventor
K Ludwig
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of FR2162074A1 publication Critical patent/FR2162074A1/fr
Application granted granted Critical
Publication of FR2162074B1 publication Critical patent/FR2162074B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Rectifiers (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
FR7242452A 1971-12-04 1972-11-29 Expired FR2162074B1 (xx)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2160302A DE2160302C3 (de) 1971-12-04 1971-12-04 Kühldose zum Einbau in Scheibenzellenstapel

Publications (2)

Publication Number Publication Date
FR2162074A1 true FR2162074A1 (xx) 1973-07-13
FR2162074B1 FR2162074B1 (xx) 1977-04-22

Family

ID=5827055

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7242452A Expired FR2162074B1 (xx) 1971-12-04 1972-11-29

Country Status (14)

Country Link
US (1) US3823771A (xx)
JP (1) JPS5145229B2 (xx)
BE (1) BE792068A (xx)
CA (1) CA987027A (xx)
CH (1) CH548670A (xx)
DE (1) DE2160302C3 (xx)
DK (1) DK143625C (xx)
FR (1) FR2162074B1 (xx)
GB (1) GB1405604A (xx)
IT (1) IT971389B (xx)
NL (1) NL7215169A (xx)
NO (1) NO131810C (xx)
SE (1) SE374978B (xx)
ZA (1) ZA728262B (xx)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3999105A (en) * 1974-04-19 1976-12-21 International Business Machines Corporation Liquid encapsulated integrated circuit package
DE2606157C2 (de) * 1976-02-17 1983-11-10 Brown, Boveri & Cie Ag, 6800 Mannheim Verbindung von Kühldose einer Kühleinrichtung mit einer Kühlflüssigkeitszuleitung oder- ableitung
DE2609512C2 (de) * 1976-03-08 1982-11-25 Siemens Ag, 1000 Berlin Und 8000 Muenchen Gasisolierte Thyristoranordnung
DE2640000C2 (de) * 1976-09-04 1986-09-18 Brown, Boveri & Cie Ag, 6800 Mannheim Zylindrische Kühldose mit gegenüberliegenden Ein- und Ausflußöffnungen für flüssigkeitsgekühlte Leistungshalbleiterbauelemente und Verfahren zur Herstellung derselben
DE2643072C2 (de) * 1976-09-24 1982-06-03 Siemens AG, 1000 Berlin und 8000 München Kühldose für Thyristoren
CS190866B1 (en) * 1977-02-18 1979-06-29 Petr Novak High-capacity semiconductor detail
US4188996A (en) * 1977-05-04 1980-02-19 Ckd Praha, Oborovy Podnik Liquid cooler for semiconductor power elements
US4159740A (en) * 1977-08-29 1979-07-03 Amf Incorporated Direct expansion jacket for horizontal dough mixers
DE2826898A1 (de) * 1978-06-19 1980-01-03 Siemens Ag Kuehlkoerper fuer elektrische bauelemente
DE2926342C2 (de) * 1979-06-29 1982-10-28 Siemens AG, 1000 Berlin und 8000 München Kühldose für scheibenförmige Halbleiterbauelemente
JPS5610948A (en) * 1979-07-06 1981-02-03 Hitachi Ltd Water cooling fin for semiconductor element
EP0075036B1 (de) * 1981-09-19 1986-10-15 BROWN, BOVERI & CIE Aktiengesellschaft Mannheim Leistungshalbleiterbauelement für Flüssigkeitskühlung
DE3137407A1 (de) * 1981-09-19 1983-04-07 BBC Aktiengesellschaft Brown, Boveri & Cie., 5401 Baden, Aargau Leistungshalbleiterbauelement fuer siedekuehlung
DE3137408A1 (de) * 1981-09-19 1983-04-07 BBC Aktiengesellschaft Brown, Boveri & Cie., 5401 Baden, Aargau Leistungshalbleiterbauelement fuer siedekuehlung oder fluessigkeitskuehlung
FR2524760B1 (fr) * 1982-03-30 1986-10-10 Auxilec Piece de maintien pour semiconducteur, et dispositif de puissance a semiconducteur comportant une telle piece
DE3740235C2 (de) * 1987-11-27 1994-03-10 Asea Brown Boveri Kühldose zum Abführen der Verlustwärme von Halbleiterelementen
DE3740233A1 (de) * 1987-11-27 1989-06-08 Asea Brown Boveri Kuehldose zum abfuehren der verlustwaerme von halbleitern
DE3818428C2 (de) * 1987-11-27 1993-11-04 Asea Brown Boveri Kuehldose zum abfuehren der verlustwaerme von halbleiterelementen
DE4322932A1 (de) * 1993-07-09 1995-01-19 Abb Patent Gmbh Flüssigkeitskühlkörper mit Isolierscheiben, elektrischen Anschlußblechen und einem Isolationsring
US6111749A (en) * 1996-09-25 2000-08-29 International Business Machines Corporation Flexible cold plate having a one-piece coolant conduit and method employing same
US5983991A (en) * 1997-06-30 1999-11-16 Franks; James W. Tissue chuck
EP3745834A1 (en) * 2019-05-31 2020-12-02 ABB Schweiz AG Apparatus for conducting heat

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH319751A (de) * 1952-08-27 1957-02-28 Siemens Ag Kühleinrichtung für Trockengleichrichter, die z. B. mit Wasser als flüssigem Kühlmittel arbeitet
FR1479193A (fr) * 1965-05-13 1967-04-28 Siemens Ag Dispositif de refroidissement de cellules semiconductrices

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2179293A (en) * 1938-08-25 1939-11-07 Westinghouse Electric & Mfg Co Cooled contact rectifier
US2504281A (en) * 1946-04-18 1950-04-18 Ericsson Telefon Ab L M Device for condensers
US2942165A (en) * 1957-01-03 1960-06-21 Gen Electric Liquid cooled current rectifiers
DE1914790A1 (de) * 1969-03-22 1970-10-01 Siemens Ag Fluessigkeitsgekuehlte Baugruppe mit Scheibenzellen

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH319751A (de) * 1952-08-27 1957-02-28 Siemens Ag Kühleinrichtung für Trockengleichrichter, die z. B. mit Wasser als flüssigem Kühlmittel arbeitet
FR1479193A (fr) * 1965-05-13 1967-04-28 Siemens Ag Dispositif de refroidissement de cellules semiconductrices

Also Published As

Publication number Publication date
JPS5145229B2 (xx) 1976-12-02
DK143625C (da) 1982-02-22
GB1405604A (en) 1975-09-10
DE2160302A1 (de) 1973-06-07
DK143625B (da) 1981-09-14
SE374978B (xx) 1975-03-24
NO131810C (xx) 1975-08-06
FR2162074B1 (xx) 1977-04-22
CH548670A (de) 1974-04-30
IT971389B (it) 1974-04-30
NO131810B (xx) 1975-04-28
JPS4873078A (xx) 1973-10-02
NL7215169A (xx) 1973-06-06
DE2160302B2 (de) 1974-11-07
BE792068A (fr) 1973-05-29
ZA728262B (en) 1973-07-25
CA987027A (en) 1976-04-06
DE2160302C3 (de) 1975-07-17
US3823771A (en) 1974-07-16

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Legal Events

Date Code Title Description
ST Notification of lapse