NO131810B - - Google Patents
Download PDFInfo
- Publication number
- NO131810B NO131810B NO4434/72A NO443472A NO131810B NO 131810 B NO131810 B NO 131810B NO 4434/72 A NO4434/72 A NO 4434/72A NO 443472 A NO443472 A NO 443472A NO 131810 B NO131810 B NO 131810B
- Authority
- NO
- Norway
- Prior art keywords
- cooling
- bowls
- edge
- ring
- passages
- Prior art date
Links
- 238000001816 cooling Methods 0.000 claims description 35
- 239000007788 liquid Substances 0.000 claims description 5
- 239000000110 cooling liquid Substances 0.000 claims description 3
- 238000009434 installation Methods 0.000 claims description 2
- 230000005611 electricity Effects 0.000 claims 1
- 230000007704 transition Effects 0.000 claims 1
- 239000002826 coolant Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 238000007688 edging Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000010512 thermal transition Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Rectifiers (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2160302A DE2160302C3 (de) | 1971-12-04 | 1971-12-04 | Kühldose zum Einbau in Scheibenzellenstapel |
Publications (2)
Publication Number | Publication Date |
---|---|
NO131810B true NO131810B (xx) | 1975-04-28 |
NO131810C NO131810C (xx) | 1975-08-06 |
Family
ID=5827055
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NO4434/72A NO131810C (xx) | 1971-12-04 | 1972-12-01 |
Country Status (14)
Country | Link |
---|---|
US (1) | US3823771A (xx) |
JP (1) | JPS5145229B2 (xx) |
BE (1) | BE792068A (xx) |
CA (1) | CA987027A (xx) |
CH (1) | CH548670A (xx) |
DE (1) | DE2160302C3 (xx) |
DK (1) | DK143625C (xx) |
FR (1) | FR2162074B1 (xx) |
GB (1) | GB1405604A (xx) |
IT (1) | IT971389B (xx) |
NL (1) | NL7215169A (xx) |
NO (1) | NO131810C (xx) |
SE (1) | SE374978B (xx) |
ZA (1) | ZA728262B (xx) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3999105A (en) * | 1974-04-19 | 1976-12-21 | International Business Machines Corporation | Liquid encapsulated integrated circuit package |
DE2606157C2 (de) * | 1976-02-17 | 1983-11-10 | Brown, Boveri & Cie Ag, 6800 Mannheim | Verbindung von Kühldose einer Kühleinrichtung mit einer Kühlflüssigkeitszuleitung oder- ableitung |
DE2609512C2 (de) * | 1976-03-08 | 1982-11-25 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Gasisolierte Thyristoranordnung |
DE2640000C2 (de) * | 1976-09-04 | 1986-09-18 | Brown, Boveri & Cie Ag, 6800 Mannheim | Zylindrische Kühldose mit gegenüberliegenden Ein- und Ausflußöffnungen für flüssigkeitsgekühlte Leistungshalbleiterbauelemente und Verfahren zur Herstellung derselben |
DE2643072C2 (de) * | 1976-09-24 | 1982-06-03 | Siemens AG, 1000 Berlin und 8000 München | Kühldose für Thyristoren |
CS190866B1 (en) * | 1977-02-18 | 1979-06-29 | Petr Novak | High-capacity semiconductor detail |
US4188996A (en) * | 1977-05-04 | 1980-02-19 | Ckd Praha, Oborovy Podnik | Liquid cooler for semiconductor power elements |
US4159740A (en) * | 1977-08-29 | 1979-07-03 | Amf Incorporated | Direct expansion jacket for horizontal dough mixers |
DE2826898A1 (de) * | 1978-06-19 | 1980-01-03 | Siemens Ag | Kuehlkoerper fuer elektrische bauelemente |
DE2926342C2 (de) * | 1979-06-29 | 1982-10-28 | Siemens AG, 1000 Berlin und 8000 München | Kühldose für scheibenförmige Halbleiterbauelemente |
JPS5610948A (en) * | 1979-07-06 | 1981-02-03 | Hitachi Ltd | Water cooling fin for semiconductor element |
DE3137407A1 (de) * | 1981-09-19 | 1983-04-07 | BBC Aktiengesellschaft Brown, Boveri & Cie., 5401 Baden, Aargau | Leistungshalbleiterbauelement fuer siedekuehlung |
EP0075036B1 (de) * | 1981-09-19 | 1986-10-15 | BROWN, BOVERI & CIE Aktiengesellschaft Mannheim | Leistungshalbleiterbauelement für Flüssigkeitskühlung |
DE3137408A1 (de) * | 1981-09-19 | 1983-04-07 | BBC Aktiengesellschaft Brown, Boveri & Cie., 5401 Baden, Aargau | Leistungshalbleiterbauelement fuer siedekuehlung oder fluessigkeitskuehlung |
FR2524760B1 (fr) * | 1982-03-30 | 1986-10-10 | Auxilec | Piece de maintien pour semiconducteur, et dispositif de puissance a semiconducteur comportant une telle piece |
DE3740233A1 (de) * | 1987-11-27 | 1989-06-08 | Asea Brown Boveri | Kuehldose zum abfuehren der verlustwaerme von halbleitern |
DE3818428C2 (de) * | 1987-11-27 | 1993-11-04 | Asea Brown Boveri | Kuehldose zum abfuehren der verlustwaerme von halbleiterelementen |
DE3740235C2 (de) * | 1987-11-27 | 1994-03-10 | Asea Brown Boveri | Kühldose zum Abführen der Verlustwärme von Halbleiterelementen |
DE4322932A1 (de) * | 1993-07-09 | 1995-01-19 | Abb Patent Gmbh | Flüssigkeitskühlkörper mit Isolierscheiben, elektrischen Anschlußblechen und einem Isolationsring |
US6111749A (en) * | 1996-09-25 | 2000-08-29 | International Business Machines Corporation | Flexible cold plate having a one-piece coolant conduit and method employing same |
US5983991A (en) * | 1997-06-30 | 1999-11-16 | Franks; James W. | Tissue chuck |
EP3745834A1 (en) * | 2019-05-31 | 2020-12-02 | ABB Schweiz AG | Apparatus for conducting heat |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2179293A (en) * | 1938-08-25 | 1939-11-07 | Westinghouse Electric & Mfg Co | Cooled contact rectifier |
US2504281A (en) * | 1946-04-18 | 1950-04-18 | Ericsson Telefon Ab L M | Device for condensers |
DE967450C (de) * | 1952-08-27 | 1957-11-14 | Siemens Ag | Kuehleinrichtung fuer Trockengleichrichter mit Kuehlkanaelen |
US2942165A (en) * | 1957-01-03 | 1960-06-21 | Gen Electric | Liquid cooled current rectifiers |
FR1479193A (fr) * | 1965-05-13 | 1967-04-28 | Siemens Ag | Dispositif de refroidissement de cellules semiconductrices |
DE1914790A1 (de) * | 1969-03-22 | 1970-10-01 | Siemens Ag | Fluessigkeitsgekuehlte Baugruppe mit Scheibenzellen |
-
1971
- 1971-12-04 DE DE2160302A patent/DE2160302C3/de not_active Expired
-
1972
- 1972-11-01 CH CH1591572A patent/CH548670A/xx not_active IP Right Cessation
- 1972-11-09 NL NL7215169A patent/NL7215169A/xx not_active Application Discontinuation
- 1972-11-22 ZA ZA728262A patent/ZA728262B/xx unknown
- 1972-11-28 GB GB5501672A patent/GB1405604A/en not_active Expired
- 1972-11-29 FR FR7242452A patent/FR2162074B1/fr not_active Expired
- 1972-11-29 BE BE792068D patent/BE792068A/xx unknown
- 1972-11-30 IT IT32304/72A patent/IT971389B/it active
- 1972-11-30 DK DK598172A patent/DK143625C/da active
- 1972-12-01 CA CA158,413A patent/CA987027A/en not_active Expired
- 1972-12-01 SE SE7215688A patent/SE374978B/xx unknown
- 1972-12-01 JP JP47121108A patent/JPS5145229B2/ja not_active Expired
- 1972-12-01 NO NO4434/72A patent/NO131810C/no unknown
- 1972-12-04 US US00311568A patent/US3823771A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPS5145229B2 (xx) | 1976-12-02 |
FR2162074A1 (xx) | 1973-07-13 |
DE2160302B2 (de) | 1974-11-07 |
JPS4873078A (xx) | 1973-10-02 |
SE374978B (xx) | 1975-03-24 |
DK143625C (da) | 1982-02-22 |
BE792068A (fr) | 1973-05-29 |
DK143625B (da) | 1981-09-14 |
US3823771A (en) | 1974-07-16 |
DE2160302C3 (de) | 1975-07-17 |
DE2160302A1 (de) | 1973-06-07 |
NO131810C (xx) | 1975-08-06 |
ZA728262B (en) | 1973-07-25 |
CH548670A (de) | 1974-04-30 |
NL7215169A (xx) | 1973-06-06 |
GB1405604A (en) | 1975-09-10 |
FR2162074B1 (xx) | 1977-04-22 |
IT971389B (it) | 1974-04-30 |
CA987027A (en) | 1976-04-06 |
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