US3785939A - Tin/lead plating bath and method - Google Patents
Tin/lead plating bath and method Download PDFInfo
- Publication number
- US3785939A US3785939A US00083229A US3785939DA US3785939A US 3785939 A US3785939 A US 3785939A US 00083229 A US00083229 A US 00083229A US 3785939D A US3785939D A US 3785939DA US 3785939 A US3785939 A US 3785939A
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- United States
- Prior art keywords
- per liter
- grams per
- bath
- tin
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007747 plating Methods 0.000 title abstract description 17
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title description 44
- 238000000034 method Methods 0.000 title description 20
- 150000003934 aromatic aldehydes Chemical class 0.000 abstract description 20
- 229910000978 Pb alloy Inorganic materials 0.000 abstract description 19
- 150000004982 aromatic amines Chemical class 0.000 abstract description 16
- 239000004094 surface-active agent Substances 0.000 abstract description 15
- RVPVRDXYQKGNMQ-UHFFFAOYSA-N lead(2+) Chemical compound [Pb+2] RVPVRDXYQKGNMQ-UHFFFAOYSA-N 0.000 abstract description 14
- IUTCEZPPWBHGIX-UHFFFAOYSA-N tin(2+) Chemical compound [Sn+2] IUTCEZPPWBHGIX-UHFFFAOYSA-N 0.000 abstract description 13
- 238000004070 electrodeposition Methods 0.000 abstract description 6
- 150000001299 aldehydes Chemical class 0.000 abstract description 3
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 abstract description 2
- 239000000203 mixture Substances 0.000 description 25
- 229910001128 Sn alloy Inorganic materials 0.000 description 18
- 239000002253 acid Substances 0.000 description 17
- -1 aliphatic aldehyde Chemical class 0.000 description 14
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 12
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 12
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 11
- 239000004327 boric acid Substances 0.000 description 11
- YSFBEAASFUWWHU-UHFFFAOYSA-N 2,4-dichlorobenzaldehyde Chemical compound ClC1=CC=C(C=O)C(Cl)=C1 YSFBEAASFUWWHU-UHFFFAOYSA-N 0.000 description 8
- 229910045601 alloy Inorganic materials 0.000 description 8
- 239000000956 alloy Substances 0.000 description 8
- 150000001412 amines Chemical class 0.000 description 8
- 235000014113 dietary fatty acids Nutrition 0.000 description 8
- 229930195729 fatty acid Natural products 0.000 description 8
- 239000000194 fatty acid Substances 0.000 description 8
- 150000004665 fatty acids Chemical class 0.000 description 8
- 238000013019 agitation Methods 0.000 description 7
- 238000009472 formulation Methods 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 6
- JWAZRIHNYRIHIV-UHFFFAOYSA-N 2-naphthol Chemical compound C1=CC=CC2=CC(O)=CC=C21 JWAZRIHNYRIHIV-UHFFFAOYSA-N 0.000 description 6
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 6
- 238000009713 electroplating Methods 0.000 description 6
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 6
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 6
- IIACRCGMVDHOTQ-UHFFFAOYSA-M sulfamate Chemical compound NS([O-])(=O)=O IIACRCGMVDHOTQ-UHFFFAOYSA-M 0.000 description 6
- FPYUJUBAXZAQNL-UHFFFAOYSA-N 2-chlorobenzaldehyde Chemical compound ClC1=CC=CC=C1C=O FPYUJUBAXZAQNL-UHFFFAOYSA-N 0.000 description 5
- 239000000654 additive Substances 0.000 description 5
- 239000011260 aqueous acid Substances 0.000 description 5
- 230000005496 eutectics Effects 0.000 description 5
- 150000004992 toluidines Chemical class 0.000 description 5
- JJYPMNFTHPTTDI-UHFFFAOYSA-N 3-methylaniline Chemical compound CC1=CC=CC(N)=C1 JJYPMNFTHPTTDI-UHFFFAOYSA-N 0.000 description 4
- 125000004432 carbon atom Chemical group C* 0.000 description 4
- 239000002659 electrodeposit Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- ITPDYQOUSLNIHG-UHFFFAOYSA-N Amiodarone hydrochloride Chemical compound [Cl-].CCCCC=1OC2=CC=CC=C2C=1C(=O)C1=CC(I)=C(OCC[NH+](CC)CC)C(I)=C1 ITPDYQOUSLNIHG-UHFFFAOYSA-N 0.000 description 3
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N Butyraldehyde Chemical compound CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- 239000001828 Gelatine Substances 0.000 description 3
- 239000001888 Peptone Substances 0.000 description 3
- 108010080698 Peptones Proteins 0.000 description 3
- 229950011260 betanaphthol Drugs 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 239000012141 concentrate Substances 0.000 description 3
- 238000001914 filtration Methods 0.000 description 3
- 229920000159 gelatin Polymers 0.000 description 3
- 235000019322 gelatine Nutrition 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 235000019319 peptone Nutrition 0.000 description 3
- 229920002451 polyvinyl alcohol Polymers 0.000 description 3
- 235000019422 polyvinyl alcohol Nutrition 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 235000013162 Cocos nucifera Nutrition 0.000 description 2
- 244000060011 Cocos nucifera Species 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 description 2
- NBBJYMSMWIIQGU-UHFFFAOYSA-N Propionic aldehyde Chemical compound CCC=O NBBJYMSMWIIQGU-UHFFFAOYSA-N 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 239000002671 adjuvant Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- HQABUPZFAYXKJW-UHFFFAOYSA-N butan-1-amine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 description 2
- 239000002738 chelating agent Substances 0.000 description 2
- 238000002845 discoloration Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- RNVCVTLRINQCPJ-UHFFFAOYSA-N o-toluidine Chemical compound CC1=CC=CC=C1N RNVCVTLRINQCPJ-UHFFFAOYSA-N 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000010802 sludge Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- KJPRLNWUNMBNBZ-QPJJXVBHSA-N (E)-cinnamaldehyde Chemical compound O=C\C=C\C1=CC=CC=C1 KJPRLNWUNMBNBZ-QPJJXVBHSA-N 0.000 description 1
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- 241000282320 Panthera leo Species 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- IKHGUXGNUITLKF-XPULMUKRSA-N acetaldehyde Chemical compound [14CH]([14CH3])=O IKHGUXGNUITLKF-XPULMUKRSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000003172 aldehyde group Chemical group 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000004996 alkyl benzenes Chemical class 0.000 description 1
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 150000003935 benzaldehydes Chemical class 0.000 description 1
- LGCAEZFHFWVARK-UHFFFAOYSA-N boric acid;lead Chemical compound [Pb].OB(O)O LGCAEZFHFWVARK-UHFFFAOYSA-N 0.000 description 1
- 238000005282 brightening Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229940117916 cinnamic aldehyde Drugs 0.000 description 1
- KJPRLNWUNMBNBZ-UHFFFAOYSA-N cinnamic aldehyde Natural products O=CC=CC1=CC=CC=C1 KJPRLNWUNMBNBZ-UHFFFAOYSA-N 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical class CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 1
- 239000006023 eutectic alloy Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000011630 iodine Substances 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 239000001630 malic acid Substances 0.000 description 1
- 235000011090 malic acid Nutrition 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- MGFYIUFZLHCRTH-UHFFFAOYSA-N nitrilotriacetic acid Chemical compound OC(=O)CN(CC(O)=O)CC(O)=O MGFYIUFZLHCRTH-UHFFFAOYSA-N 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical class CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 1
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- IIACRCGMVDHOTQ-UHFFFAOYSA-N sulfamic acid Chemical class NS(O)(=O)=O IIACRCGMVDHOTQ-UHFFFAOYSA-N 0.000 description 1
- 229910001432 tin ion Inorganic materials 0.000 description 1
- 238000004448 titration Methods 0.000 description 1
- HGBOYTHUEUWSSQ-UHFFFAOYSA-N valeric aldehyde Natural products CCCCC=O HGBOYTHUEUWSSQ-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
- C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/34—Electroplating: Baths therefor from solutions of lead
- C25D3/36—Electroplating: Baths therefor from solutions of lead characterised by the organic bath constituents used
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
Definitions
- a plating bath for electrodeposition of tin/lead alloys contains stannous ion, lead ion, a fiuoborate, fluosilicate or sulfamate radical and, as a brightener system, a nonionic polyoxyalkylated surfactant, a lower aliphatic aldehyde, an aliphatic or aromatic amine and an aromatic aldehyde, the pH of the bath being less than about 3.0.
- Electrodeposited tin/lead alloys of different compositions are valuable in a number of applications including the provision of bearing contact surfaces (for which a 7/93 tin/lead alloy is typically used) and the provision of surfaces for solding such as on printed circuit boards and the like (for which alloys of 60/40 tin lead are desired).
- bearing contact surfaces for which a 7/93 tin/lead alloy is typically used
- surfaces for solding such as on printed circuit boards and the like (for which alloys of 60/40 tin lead are desired).
- a number of formulations have been suggested for use in producing solder plate, it is believed that a significant need remains for a bath this is capable of producing a high quality tin/lead deposit having a composition at or near the eutectic value for the alloy (about 63/37), as it optimum for soldering purposes.
- Another object is to provide workpieces having an optimum tin/lead alloy electrodeposit for soldering, where the composition is at or near the eutectic point for tin/lead alloys and is at least relatively bright.
- Still another object is to provide an electroplating method for the production of high quality tin/lead alloy deposits, Which method is efficient and effective, is conducted under convenient conditions, and is capable of producing bright solderplate deposits.
- tin/lead alloys comprising about 5.0 to 80.0, and preferably about 45.0 to 65.0, grams per liter of stannous ion; about 85.0 to 10.0, and preferably about 35.0 to 15.0, grams per liter of lead ion; and at least about 100.0, and preferably at least about 150.0, grams per liter of a radical selected from the group consisting of fluoborate, fluosilicate, and sulfamate.
- the bath also includes, as a brightener system, at least about 5.0 grams per liter of a nonionic polyoxyalkylated surfactant, at least about 4.0 grams per liter of a lower aliphatic aldehyde containing 1 to 4 carbon atoms, at
- the bath has a pH of less than about 3.0.
- the amount of the components of the brighteners system are 10.0 to 30.0, 5.0 to 15.0, and 0.4 to 1.5. grams per liter, respectively, and the pH of the bath is most desirably below about 1.0.
- the brightener system of the bath includes at least about 2.0 grams per liter of an aromatic amine, and the aromatic aldehyde is ring-halogenated.
- the aromatic aldehyde is either 2,4-dichlorobenzaldehyde or orthochlorobenzaldehyde, and it is used in an amount of about 0.5 to 2.0 grams per liter.
- the bath utilizes the fiuoborate radical, as is preferred, it desirably also contains at least about 50.0 grams per liter of free fluoboric acid and at least'about 10.0. grams per liter of free boric acid.
- the aromatic amine employed is desirably selected from the group consisting of toluidines and aniline, and is preferably either orthoor meta-toluidine included in an amount of about 3.0. to 12.0 grams per liter.
- the lower aliphatic aldehyde that is used is preferably formaldehyde, and it is preferably present in an amount of about 5.0 to 15.0 grams per liter.
- the bath may additionally include about 0.5 to 7.5 grams per liter of an additive selected from the class consisting of peptone, resorcinol, glue, gelatine, betanaphthol, polyvinyl alcohol, cresylic acid, and mixtures thereof.
- it includes about 0.5 to 2.0. grams per liter of cresylic acid.
- Certain objects of the invention are also readily attained in a method of electroplating tin/lead alloys wherein a bath having a composition as hereinbefore described is first prepared. The bath is maintained at a temperature of at least about 50 Fahrenheit, and a workpiece having a metallic surface and at least one anode to provide the necessry tin and lead anodic supply are immersed therein. Thereafter, a voltage is applied across the anode and the workpiece to deposit tin and lead on the metallic surface, and the voltage applied provides a current density at the workpiece of about 10 to 200 amperes per square foot.
- an alloy anode having a composition of approximately 60.0 percent by weight of tin and 40.0 percent by weight of lead.
- at least two anodes may be immersed in the bath, one of which consists essentially of tin and the other of which consists essentially of lead, with the method including the step of apportioning the current between the anodes so as to deposit tin and lead upon the workpiece in the desired proportions.
- the bath electroylte is preferably provided by the fluoborate, fluosilicate, or sulfamate salts of tin and lead, although other salts may be used to furnish all or a portion of the tin and lead ions, and the desired radical may be provided by a suitable acid, such as fluoboric. It should be appreciated that the foregoing terms are used generically herein, and may encompass the more complex salts such as the phenolsulfamate compounds.
- the amount of stannous ion provided must be in the range of about 5.0 to 80.0 grams per liter and the amount of lead ion employed therewith must range from about 85.0 to 10.0 grams per liter.
- the amount of stannous ion will exceed the lead ion and will be in the range of about 45.0 to 65.0 grams per liter, with the amount of lead ranging from about 35.0 to 15.0 grams per liter.
- a most desirable feature of the invention is that it enables the formation of electrodeposits of solder having a composition at or near the eutectic point for tin/lead alloys, and the most desirable range of the ions in the bath therefor is about 53.0 to 57.0 grams of stannous ion per liter and about 27.0 to 23.0 grams of lead ion per liter.
- the fiuoborate baths are preferred and, to be satisfactory, must contain at least about 100.0 grams per liter of the fiuoborate radical; preferably the amount of the radical will be not less than about 150.0 grams per liter. Such a bath should contain at least about 50.0 grams per liter of fluoboric acid and at least about 10.0 grams per liter of boric acid.
- a typical make-up formula (brightening system and additives omitted) for a liter bath, that has performed well, is as follows (percentages expressed being by weight):
- the foregoing formulation provides about 60.0 grams per liter of total tin (about 55.0 grams per liter of stannous ion and about 5.0 grams per liter of stannic ion) about 25.0 grams per liter of lead ion, about 100.0 grams per liter of fluoboric acid (absolute), and about 25.0 grams per liter of boric acid.
- the foregoing type of make-up formulation (be it of the fluoboric, fluosilicate, or sulfamate variety) must also contain a brightener system comprised of at least about 5.0 grams per liter of nonionic polyoxyalkylated surfactant, at least about 4.0 grams per liter of a lower aliphatic aldehyde, and at least about 0.25 gram per lited of an aromatic aldehyde.
- the amounts of the foregoing components will be about 10.0 to 30.0, 5.0 to 15.0, and 0.4 to 1.5, grams per liter, respectively.
- any surface active polyoxyalkylated compound that is soluble in the bath may be employed, and a wide variety of such materials are commercially available under a number of different trademarks.
- the polyethoxylated fatty acid monoalkanolamides and related amines, and the polyethoxylated alkylphenols have performed particularly effectively.
- Exemplary of the olyethoxylated fatty acid monoethanolamides that may be used to advantage are the cocoanut fatty acid and lauric acid derivatives sold by Stepan Chemical Company of Northfield, Ill. under the trademarks Amidox C5 and Amidox L-5, respectively.
- polyethoxylated alkylphenol surfactants that may advantageously be used is the ethoxylated nonylphenol derivative sold by Onyx Chemical Company of Jersey City, N.J., under the trademark Neutronyx 675. Substitution of similar materials is contemplated and encompassed within the scope of the invention, and specific alternative surfactants will be apparent to those skilled in the art, in view of the foregoing disclosure.
- aldehyde constituent it should contain 1 to 4 carbon atoms and, although acetaldehyde, butyraldehyde and propionaldehyde may be employed, formaldehyde is preferred.
- composition of the aromatic aldehyde may also vary considerably within the scope of the invention. Although it may be feasible to use unsubstituted and alkyl substituted benzene nuclei, and multicarbon chain aldehyde groups, including benzaldehyde, tolualdehyde, cinnamaldehyde, etc., the ring-halogenated benzaldehydes are preferred, and particularly desirable results have been found to result from the use of either ortho-chlorobenzaldehyde or 2,4-dichlorobenzaldehyde.
- At least one lower aliphatic aldehyde and at least one aromatic aldehyde be employed therein; combinations of two or more of each species of aldehyde may also be employed in some instances.
- a particularly desirable adjuvant is a compound furnishing an amine group, including both aliphatic and aromatic amines.
- aliphatic amines such as butylamine and the like have been effective, particularly outstanding improvements have been noted to result from the inclusion of aromatic amines, and especially from the use of ortho-toluidine, meta-toluidine and aniline.
- the amine should be used in an amount of no less than about 2.0 grams per liter; preferably the amount will be between 3.0 and 12.0 grams per liter, and most desirably about 4.0 grams per liter thereof will be used.
- auxiliary surfactants such as the polyvinyl alcohols, peptone, resorcinol, glue, gelatine, beta-naphthol, etc., which should usually be added in amounts of about 0.5 to 7.5 grams per liter. It has been found that use of about 0.5 to 5.0 grams per liter of cresylic acid is a particularly desirable expedient since it improves the smoothness of the deposits obtained to a considerable degree.
- a chelating agent such as citric acid, malic acid, or the aminopolyacetic acids (e.g. ethylenediamine tetraacetic acid, ethylenetriamine pentaacetic acid, nitrilotriacetic acid).
- chelating agents when employed, are generally included in an amount of about 5.0 to 20.0 grams per liter.
- a solvent solution thereof to facilitate formulation of the bath.
- the various solvents that may be employed are the lowe molecular weight alcohols (methanol, ethanol, and propanol) and the low molecular weight glycol ethers (ethylene glycol monoethyl ether, etc.).
- the component will be added as a 0.1 to 5.0 and preferably as a 0.5 to 2.0 percent by weight solution so as to obtain a stable solvent solution which may be readily dispersed in the acid bath.
- a typical brightener system found to produce outstanding bright solder plate deposits, in combination with the typical make-up formulation hereinbefore described, has the following composition, on a liter basis:
- the baths of the present invention are operable over a fairly wide range of cathode current density, depending upon other factors such as temperature, agitation, etc. More specifically, the operable range is about 10.0 to 200.0 amperes per square foot (a.s.f.) and preferably about 20.0 to 120.0 a.s.f., with a narrower range of 25.0 to 35.0 a.s.f. being most desirable for the production of deposits having a substantially eutectic composition.
- the plating efficiency is generally quite high and will range up to about percent under optimum conditions, based upon the theoretical rate of deposition, and bright deposits of excellent quality can best be produced at a bath efiiciency in excess 70 percent.
- the applied voltage should be about 0.2 to 5.0 volts and preferably 0.5 to 4.0 volts.
- the baths should be operated at a temperature of at least about 50 Fahrenheit, and preferably from about 60 to 90 Fahrenheit. Operation below about 50 Fahrenheit tends to be inefficient and to produce undesirable deposits, whereas temperatures higher than about 90 Fahrenheit tend to cause oxidation of the tin ion to the stannic state and to produce dull, rough and generally unacceptable deposits; furthermore, the bath is consumed at an excessive rate at temperatures that are unduly high.
- any metallic substrate or metal-surfaced article which can be plated with tin using prior art baths may be coated in accordance with the present invention.
- good deposits may be produced upon articles of copper, nickel, iron, steel, etc.
- relatively pure anodes of the metals are employed, and either tin/ lead alloy anodes or separate tin anodes and lead anodes may be used.
- the composition of the anode has a significant effect upon the composition of the deposit, and that it is generally desirable to employ an anode having a proportion of metal approximating that desired in the plated alloy.
- the composition of the deposit may also be controlled by use of separate anodes of tin and lead, to which the current may be proportioned appropriately.
- Some agitation is desirable to obtain high quality, uniform deposits and to avoid development of sludge or film, and plating at high current densities and temperatures may be improved by more intense agitation.
- excessively high rates of agitation are undesirable because they can cause excessive consumption of the bath and impose limitations upon the current densities at which brightness is achieved.
- agitation of the bath itself desirable but agitation of the cathode may be beneficial in obtaining a uniform plate and enabling extension of the range of satisfactory current density.
- the process is adapated to still plating and barrel plating apparatus with equal efficacy, and may be used for strip, Wire and connector strip.
- Use of the bath and process is particularly significant with respect to connector strip, printed circuit boards, and the like because of the excellent solderability of the plate produced.
- Filtration of the bath is not essential but will normally be beneficial when contamination of the bath is encountered due to air-borne impurities and carryover from other finishing operations; preferably, it will be effected on a continuous basis.
- Various filtering media may be utilized including fabrics, such as of polypropylene, and other conventional filtering materials.
- the depletion of the various components of the bath is best corrected by analysis for the several components on a periodic basis which can be established for a given facility.
- an iodine titration technique may be used; the lead content may be checked by precipitation with dilute surfuric acid.
- the amount of the surfactant and other components may be best evaluated by testing a sample of the bath in a suitable test cell, and a suitable schedule may be established .for a given facility and workpiece.
- Example 1 An aqueous plating bath was prepared by admixing, with water, sutficient quantities of stannous and lead fluoborate concentrates (as set forth in the typical makeup formula hereinbefore recited) fluoboric acid, and boric acid, to provide 55.0 grams per liter of stannous tin (as metal), 100.0 grams per liter of fluoboric acid about 25.0 grams per liter of lead ion (as metal) and 25.0 grams per liter of boric acid.
- stannous and lead fluoborate concentrates as set forth in the typical makeup formula hereinbefore recited
- the bath also contained a brightener system consisting of about 15.0 milliliters per liter of an ethoxylated coconut fatty acid monoethanolamide containing 5 moles of ethylene oxide per mole of amide (sold by Stepan Chemical Company of Northfield, Ill. under the trademark Amidox C-5), about 6.0 milliliters per liter of ortho-toluidine, about 30.0 milliliters per liter of 37.0 percent formaldehyde, and about 6.0 milliliters per liter of a 10.0 percent methanol solution of 2,4-dichlorobenzaldehyde. About 7.5 milliliters per liter of a 10.0 percent methanol solution of cresylic acid was also included in the bath to improve the smoothness of the deposit, and the pH of the bath was less than 1.0.
- a brightener system consisting of about 15.0 milliliters per liter of an ethoxylated coconut fatty acid monoethanolamide containing 5 moles of ethylene oxide per mole of
- Plating was effected in a Hull cell at room temperature, using as the anode an alloy of 60/40 tin/lead.
- the bright plating current density range was found to extend from about 10 to more than 120 amperes per square foot. Even below 10 a.s.f. the deposits were of good quality, albeit with a slightly milky appearance.
- Example 2 In a series of barrel plating runs, the same formulation as was used in Example 1 is employed, the temperature and current density being varied to demonstrate the characteristics of the bath. As a result, it is found that the optimum temperature of operation is about 70-85 Fahrenheit; higher temperatures are found to be less desirable since oxidation of tin to the stannic state is more pronounced and since operation is required within a higher current density range for bright deposits. At current densities of less than about 75 a.s.f., metal efiiciency is found to be considerably higher than about percent; at a current density of about 30 a.s.f. a nearly eutectic alloy, containing about 64 percent of tin, is produced. Mild agitation during plating is found to result in deposits of excellent appearance, the covering power is outstanding, and the throwing power of the bath appears to be very good, particularly for an acidic system.
- the present invention provides a novel electroplating bath that is capable of producing relatively bright deposits of tin/ lead alloy.
- the bath pro prises such deposits with good current efliciency and good covering power, and it is operable: over a broad range of current densities.
- the invention provides workpieces having at least relatively bright tin/lead alloy electrodeposits in which the composition is at or near the eutectic point for such alloys, as is optimum :for soldering, and the method provided is efiicient and efiective, may be conducted under convenient conditions, and is capable of producing high quality deposits, as previously described.
- An aqueous acid plating bath for electro-deposition of tin/ lead alloys comprising about 5 .0 to 80.0 grams per liter of stannous ion; about 85.0 to 10.0 grams per liter of lead ion; at least about 100.0 grams per liter of a radical selected from the group consisting of fluoborate, fluosilicate and sulfamate; and, as a brightener system, at least about 5.0 grams per liter of a nonionic polyoxyalkylated surfactant, at least about 4.0 grams per liter of a lower aliphatic aldehyde containing 1 to 4 carbon atoms, at least about 0.25 gram per liter of said bath of an aromatic aldehyde and at least about 2.0 grams per liter of said bath an amine, said bath having a pH of less than about 3.0.
- the bath of claim 1 containing about 45.0 to 65.0 grams per liter of stannous ion and about 35.0 to 15.0 grams per liter of lead ion.
- said amine is furnished by about 3.0 to 12.0 grams per liter of an aromatic amine selected from thec class consisting of orthoand metatoluidines, wherein said surfactant is selected from the class consisting of ethoxylated fatty acid monoalkanolamides and ethoxylated alkylphenols and is present in an amount of about 10.0 to 30.0 grams per liter, and wherein said aromatic aldehyde is selected from the group consisting of 2,4-dichlorobenzaldehyde and ortho-chlorobenzaldehyde and is present in an amount of about 0.4 to
- the bath of claim 4 additionally including about 0.5 to 2.0 grams per liter of cresylic acid.
- aromatic amine is selected from the group consisting of toluidines and aniline, and wherein said lower aliphatic aldehyde is formaldehyde.
- the bath of claim 1 additionally including about 0.5 to 7.5 grams per liter of an additive selected from the class consisting of peptone, resorcinol, glue, gelatine, betanaphthol, polyvinyl alcohol, cresylic acid, and mixtures thereof.
- an additive selected from the class consisting of peptone, resorcinol, glue, gelatine, betanaphthol, polyvinyl alcohol, cresylic acid, and mixtures thereof.
- an aqueous acid plating bath comprising about 5.0-80.0 grams per liter of stannous ion, about 85.0-10.0 grams per liter of lead ion, at least about 100 grams per liter of a radical selected from the group consisting of fluoborate, fluosilicate and sulfamate and, as a brightener system, at least about 5.0 grams per liter of a nonionic polyoxyalkylated surfactant, at least about 4.0 grams per liter of a lower aliphatic aldehyde containing 1 to 4 carbon atoms, at least about 0.25 grams per liter of said bath of an aromatic aldehyde and at least about 2.0 grams per liter of said bath of an amine, said bath having a pH of less than about 3.0.
- said amine is an aromatic amine selected from the group consisting of toluidines and aniline, wherein said lower aliphatic aldehyde is formaldehyde, and wherein said radical is fluoborate and wherein said pH is less than about 1.0.
- said aromatic amine is selected from the group consisting of orthoand meta-toluidines
- said surfactant is selected from the class consisting of ethoxylated fatty acid monoalkanolamides and ethoxylated alkylphenols and is present in an amount of about 10.0 to 30.0 grams per liter
- said aromatic aldehyde is selected from the group consisting of 2,4-dichlorobenzaldehyde and orthochlorobenzaldehyde and is present in an amount of about 0.4 to 1.5 grams per liter.
- An aqueous acid bath for electrodeposition of tin/ lead alloys comprising about 5.0 to 80.0 grams per liter of stannous ion; about 85.0 to 10.0 grams per liter of lead ion; at least about 100.0 grams per liter of a radical selected from the group consisting of fiuoborate, fluosilicate and sulfamate; and, as a brightener system, at least about 5.0 grams per liter of a surfactant selected from the class consisting of ethyloxylated fatty acid monoalkanolamides and ethyloxylated alkylphenols, at least about 4.0 grams per liter of formaledhyde, at least about 2.0 grams per liter of an aromatic amine selected from the group con sisting of toluidines and aniline, and at least about 0.25 gram per liter of a ring-halogenated aromatic aldehyde, said bath having a pH of less than about 3.0.
- the bath of claim 19 containing about 45.0 to 65.0 grams per liter of stannous ion, about 35.0 to 15.0 grams per liter of lead ion, about 5.0 to 15.0 grams per liter of formaldehyde, about 3.0 to 12.0 grams per liter of said aromatic amine, about 10.0 to 30.0 grams per liter of said surfactant, and about 0.4 to 1.5 grams per liter of said aromatic aldehyde.
- aqueous acid bath comprising about 5.0 to 80.0 grams per liter of stannous ion; about 85.0 to 10.0 grams per liter of lead ion; at least about 100.0 grams per liter of a radical selected from the group consisting of fluoborate, fluosilicate and sulfamate; and, as a brightener system, at least about 5.0 grams per liter of a surfactant selected from the class consisting of ethyloxylated fatty acid monoalkanolamides and ethyloxylated alkylphenols, at least about 4.0 grams per liter of formaldehyde, at least about 2.0 grams per liter of an aromatic amine selected from the group consisting of toluidines and aniline, and at least about 0.25 grams per liter of a ring-halogenated aromatic aldehyde, said bath having a pH of less than about 3.0.
- aromatic amine is selected from the group consisting of orthoand meta-toluidines, wherein said aromatic aldehyde is selected from the group consisting of 2,4-dichlorobenzaldehyde and ortho-chlorobenzalclehyde, and wherein said bath has a pH less than about 1.0.
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US8322970A | 1970-10-22 | 1970-10-22 | |
US16010971A | 1971-07-06 | 1971-07-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
US3785939A true US3785939A (en) | 1974-01-15 |
Family
ID=26769076
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US00083229A Expired - Lifetime US3785939A (en) | 1970-10-22 | 1970-10-22 | Tin/lead plating bath and method |
US00160109A Expired - Lifetime US3769182A (en) | 1970-10-22 | 1971-07-06 | Bath and method for electrodepositing tin and/or lead |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US00160109A Expired - Lifetime US3769182A (en) | 1970-10-22 | 1971-07-06 | Bath and method for electrodepositing tin and/or lead |
Country Status (8)
Country | Link |
---|---|
US (2) | US3785939A (enrdf_load_stackoverflow) |
AU (1) | AU458608B2 (enrdf_load_stackoverflow) |
CA (1) | CA972704A (enrdf_load_stackoverflow) |
DE (1) | DE2152785C2 (enrdf_load_stackoverflow) |
FR (1) | FR2111779B1 (enrdf_load_stackoverflow) |
GB (1) | GB1368318A (enrdf_load_stackoverflow) |
MY (1) | MY7500186A (enrdf_load_stackoverflow) |
SE (1) | SE392132B (enrdf_load_stackoverflow) |
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US3875029A (en) * | 1974-02-19 | 1975-04-01 | R O Hull & Company Inc | Plating bath for electrodeposition of bright tin and tin-lead alloy |
US4053372A (en) * | 1975-10-09 | 1977-10-11 | Amp Incorporated | Tin-lead acidic plating bath |
US4118289A (en) * | 1973-06-28 | 1978-10-03 | Minnesota Mining And Manufacturing Company | Tin/lead plating bath and method |
US4135991A (en) * | 1977-08-12 | 1979-01-23 | R. O. Hull & Company, Inc. | Bath and method for electroplating tin and/or lead |
US4347107A (en) * | 1981-04-02 | 1982-08-31 | Hooker Chemicals & Plastics Corp. | Electroplating tin and tin alloys and baths therefor |
DE3228911A1 (de) * | 1981-09-08 | 1983-03-24 | Occidental Chemical Corp., 48089 Warren, Mich. | Bad fuer die galvanische abscheidung einer zinn-blei-legierung |
US4582576A (en) * | 1985-03-26 | 1986-04-15 | Mcgean-Rohco, Inc. | Plating bath and method for electroplating tin and/or lead |
US4701244A (en) * | 1983-12-22 | 1987-10-20 | Learonal, Inc. | Bath and process for electroplating tin, lead and tin/alloys |
US4717460A (en) * | 1983-12-22 | 1988-01-05 | Learonal, Inc. | Tin lead electroplating solutions |
US4765871A (en) * | 1981-12-28 | 1988-08-23 | The Boeing Company | Zinc-nickel electroplated article and method for producing the same |
US4844780A (en) * | 1988-02-17 | 1989-07-04 | Maclee Chemical Company, Inc. | Brightener and aqueous plating bath for tin and/or lead |
US4871429A (en) * | 1981-09-11 | 1989-10-03 | Learonal, Inc | Limiting tin sludge formation in tin or tin/lead electroplating solutions |
US4880507A (en) * | 1987-12-10 | 1989-11-14 | Learonal, Inc. | Tin, lead or tin/lead alloy electrolytes for high speed electroplating |
US4885064A (en) * | 1989-05-22 | 1989-12-05 | Mcgean-Rohco, Inc. | Additive composition, plating bath and method for electroplating tin and/or lead |
US5066367A (en) * | 1981-09-11 | 1991-11-19 | Learonal Inc. | Limiting tin sludge formation in tin or tin/lead electroplating solutions |
US5094726A (en) * | 1981-09-11 | 1992-03-10 | Learonal, Inc. | Limiting tin sludge formation in tin or tin-lead electroplating solutions |
US5174887A (en) * | 1987-12-10 | 1992-12-29 | Learonal, Inc. | High speed electroplating of tinplate |
WO1993009276A1 (en) * | 1991-11-01 | 1993-05-13 | National-Standard Company | Age resistant solder coatings |
US5560813A (en) * | 1994-09-09 | 1996-10-01 | National Science Council | Solder electroplating solution containing gelatin |
US5698087A (en) * | 1992-03-11 | 1997-12-16 | Mcgean-Rohco, Inc. | Plating bath and method for electroplating tin and/or lead |
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US3749649A (en) * | 1971-12-16 | 1973-07-31 | M & T Chemicals Inc | Bright tin-lead alloy plating |
US3926749A (en) * | 1971-12-20 | 1975-12-16 | M & T Chemicals Inc | Tin-lead alloy plating |
CA1077430A (en) * | 1975-11-28 | 1980-05-13 | Minnesota Mining And Manufacturing Company | Electroplating bath for the electrodeposition of tin and tin/cadmium deposits |
US4207148A (en) * | 1975-11-28 | 1980-06-10 | Minnesota Mining And Manufacturing Company | Electroplating bath for the electrodeposition of tin and tin/cadmium deposits |
US4067781A (en) * | 1977-01-10 | 1978-01-10 | Rapids Felix R | Method for electroplating |
GB2013241B (en) * | 1977-11-16 | 1982-03-24 | Dipsol Chem | Electroplating bath for depositing tin or tin alloy with brightness |
US4640746A (en) * | 1984-10-11 | 1987-02-03 | Learonal, Inc. | Bath and process for plating tin/lead alloys on composite substrates |
DE3440668A1 (de) * | 1984-11-07 | 1986-05-07 | Dr.-Ing. Max Schlötter GmbH & Co KG, 7340 Geislingen | Verfahren zur erhaltung der loetbarkeit von bleizinn-ueberzuegen |
US4681670A (en) * | 1985-09-11 | 1987-07-21 | Learonal, Inc. | Bath and process for plating tin-lead alloys |
US4849059A (en) * | 1988-09-13 | 1989-07-18 | Macdermid, Incorporated | Aqueous electroplating bath and method for electroplating tin and/or lead and a defoaming agent therefor |
US5346607A (en) * | 1992-09-30 | 1994-09-13 | Weirton Steel Corporation | Electrolytic tinplating and product |
DE4422756C1 (de) * | 1994-06-29 | 1995-04-20 | Goldschmidt Ag Th | Selbstregulierende, saure Elektrolyte zur Tauchverzinnung von Aluminiumlegierungen |
US6582582B2 (en) | 2001-03-09 | 2003-06-24 | Donald Becking | Electroplating composition and process |
US6562221B2 (en) | 2001-09-28 | 2003-05-13 | David Crotty | Process and composition for high speed plating of tin and tin alloys |
EP1342817A3 (en) * | 2002-03-05 | 2006-05-24 | Shipley Co. L.L.C. | Limiting the loss of tin through oxidation in tin or tin alloy electroplating bath solutions |
US7273540B2 (en) * | 2002-07-25 | 2007-09-25 | Shinryo Electronics Co., Ltd. | Tin-silver-copper plating solution, plating film containing the same, and method for forming the plating film |
JP5622360B2 (ja) * | 2009-01-16 | 2014-11-12 | ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. | 電気錫めっき液および電気錫めっき方法 |
US8834958B2 (en) | 2011-07-08 | 2014-09-16 | The United States Of America As Represented By The Secretary Of The Army | Process of making negative electrode |
GB201815262D0 (en) * | 2018-09-19 | 2018-10-31 | Lankem Ltd | Composition and method |
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US2460252A (en) * | 1946-02-09 | 1949-01-25 | Harshaw Chem Corp | Lead-tin alloy plating |
BE508197A (enrdf_load_stackoverflow) * | 1951-01-12 | |||
US2773819A (en) * | 1954-01-13 | 1956-12-11 | Harshaw Chem Corp | Electrodeposition of lead |
AT252681B (de) * | 1963-08-28 | 1967-03-10 | Max Schloetter Fa Dr Ing | Galvanische Bäder zur elektrolytischen Abscheidung blanker bis glänzender Zinnschichten |
NL134963C (enrdf_load_stackoverflow) * | 1963-08-28 | |||
NL128321C (enrdf_load_stackoverflow) * | 1965-02-13 | |||
GB1151460A (en) * | 1967-10-09 | 1969-05-07 | Motohiko Kanai | Improvements in and relating to the Electroplating of Tin-Lead Alloy |
US3661730A (en) * | 1969-09-22 | 1972-05-09 | Kazuo Nishihara | Process for the formation of a super-bright solder coating |
-
1970
- 1970-10-22 US US00083229A patent/US3785939A/en not_active Expired - Lifetime
-
1971
- 1971-07-06 US US00160109A patent/US3769182A/en not_active Expired - Lifetime
- 1971-10-20 SE SE7113286A patent/SE392132B/xx unknown
- 1971-10-21 CA CA125,761A patent/CA972704A/en not_active Expired
- 1971-10-21 AU AU34842/71A patent/AU458608B2/en not_active Expired
- 1971-10-22 FR FR7138136A patent/FR2111779B1/fr not_active Expired
- 1971-10-22 DE DE2152785A patent/DE2152785C2/de not_active Expired
- 1971-11-22 GB GB4925671A patent/GB1368318A/en not_active Expired
-
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- 1975-12-30 MY MY186/75A patent/MY7500186A/xx unknown
Cited By (156)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4118289A (en) * | 1973-06-28 | 1978-10-03 | Minnesota Mining And Manufacturing Company | Tin/lead plating bath and method |
US3875029A (en) * | 1974-02-19 | 1975-04-01 | R O Hull & Company Inc | Plating bath for electrodeposition of bright tin and tin-lead alloy |
US4053372A (en) * | 1975-10-09 | 1977-10-11 | Amp Incorporated | Tin-lead acidic plating bath |
US4135991A (en) * | 1977-08-12 | 1979-01-23 | R. O. Hull & Company, Inc. | Bath and method for electroplating tin and/or lead |
US4347107A (en) * | 1981-04-02 | 1982-08-31 | Hooker Chemicals & Plastics Corp. | Electroplating tin and tin alloys and baths therefor |
DE3228911A1 (de) * | 1981-09-08 | 1983-03-24 | Occidental Chemical Corp., 48089 Warren, Mich. | Bad fuer die galvanische abscheidung einer zinn-blei-legierung |
US5094726A (en) * | 1981-09-11 | 1992-03-10 | Learonal, Inc. | Limiting tin sludge formation in tin or tin-lead electroplating solutions |
US4871429A (en) * | 1981-09-11 | 1989-10-03 | Learonal, Inc | Limiting tin sludge formation in tin or tin/lead electroplating solutions |
US5066367A (en) * | 1981-09-11 | 1991-11-19 | Learonal Inc. | Limiting tin sludge formation in tin or tin/lead electroplating solutions |
US4765871A (en) * | 1981-12-28 | 1988-08-23 | The Boeing Company | Zinc-nickel electroplated article and method for producing the same |
US4717460A (en) * | 1983-12-22 | 1988-01-05 | Learonal, Inc. | Tin lead electroplating solutions |
US4701244A (en) * | 1983-12-22 | 1987-10-20 | Learonal, Inc. | Bath and process for electroplating tin, lead and tin/alloys |
US4582576A (en) * | 1985-03-26 | 1986-04-15 | Mcgean-Rohco, Inc. | Plating bath and method for electroplating tin and/or lead |
US4880507A (en) * | 1987-12-10 | 1989-11-14 | Learonal, Inc. | Tin, lead or tin/lead alloy electrolytes for high speed electroplating |
US5174887A (en) * | 1987-12-10 | 1992-12-29 | Learonal, Inc. | High speed electroplating of tinplate |
US4844780A (en) * | 1988-02-17 | 1989-07-04 | Maclee Chemical Company, Inc. | Brightener and aqueous plating bath for tin and/or lead |
US4885064A (en) * | 1989-05-22 | 1989-12-05 | Mcgean-Rohco, Inc. | Additive composition, plating bath and method for electroplating tin and/or lead |
WO1993009276A1 (en) * | 1991-11-01 | 1993-05-13 | National-Standard Company | Age resistant solder coatings |
US5698087A (en) * | 1992-03-11 | 1997-12-16 | Mcgean-Rohco, Inc. | Plating bath and method for electroplating tin and/or lead |
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Also Published As
Publication number | Publication date |
---|---|
AU3484271A (en) | 1973-05-03 |
FR2111779A1 (enrdf_load_stackoverflow) | 1972-06-09 |
CA972704A (en) | 1975-08-12 |
US3769182A (en) | 1973-10-30 |
DE2152785C2 (de) | 1982-07-01 |
AU458608B2 (en) | 1975-03-06 |
SE392132B (sv) | 1977-03-14 |
FR2111779B1 (enrdf_load_stackoverflow) | 1975-02-07 |
GB1368318A (en) | 1974-09-25 |
DE2152785A1 (de) | 1972-05-04 |
MY7500186A (en) | 1975-12-31 |
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