SE392132B - Surt, vattenhaltigt elektropleteringsblad for paforing av tenn, bly eller legeringar av tenn och bly - Google Patents
Surt, vattenhaltigt elektropleteringsblad for paforing av tenn, bly eller legeringar av tenn och blyInfo
- Publication number
- SE392132B SE392132B SE7113286A SE1328671A SE392132B SE 392132 B SE392132 B SE 392132B SE 7113286 A SE7113286 A SE 7113286A SE 1328671 A SE1328671 A SE 1328671A SE 392132 B SE392132 B SE 392132B
- Authority
- SE
- Sweden
- Prior art keywords
- tinn
- lead
- electropletation
- aquatic
- painting
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
- C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/34—Electroplating: Baths therefor from solutions of lead
- C25D3/36—Electroplating: Baths therefor from solutions of lead characterised by the organic bath constituents used
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US8322970A | 1970-10-22 | 1970-10-22 | |
US16010971A | 1971-07-06 | 1971-07-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
SE392132B true SE392132B (sv) | 1977-03-14 |
Family
ID=26769076
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE7113286A SE392132B (sv) | 1970-10-22 | 1971-10-20 | Surt, vattenhaltigt elektropleteringsblad for paforing av tenn, bly eller legeringar av tenn och bly |
Country Status (8)
Country | Link |
---|---|
US (2) | US3785939A (sv) |
AU (1) | AU458608B2 (sv) |
CA (1) | CA972704A (sv) |
DE (1) | DE2152785C2 (sv) |
FR (1) | FR2111779B1 (sv) |
GB (1) | GB1368318A (sv) |
MY (1) | MY7500186A (sv) |
SE (1) | SE392132B (sv) |
Families Citing this family (51)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3749649A (en) * | 1971-12-16 | 1973-07-31 | M & T Chemicals Inc | Bright tin-lead alloy plating |
US3926749A (en) * | 1971-12-20 | 1975-12-16 | M & T Chemicals Inc | Tin-lead alloy plating |
GB1469547A (en) * | 1973-06-28 | 1977-04-06 | Minnesota Mining & Mfg | Tin/lead electr-plating baths |
US3875029A (en) * | 1974-02-19 | 1975-04-01 | R O Hull & Company Inc | Plating bath for electrodeposition of bright tin and tin-lead alloy |
US4053372A (en) * | 1975-10-09 | 1977-10-11 | Amp Incorporated | Tin-lead acidic plating bath |
US4207148A (en) * | 1975-11-28 | 1980-06-10 | Minnesota Mining And Manufacturing Company | Electroplating bath for the electrodeposition of tin and tin/cadmium deposits |
CA1077430A (en) * | 1975-11-28 | 1980-05-13 | Minnesota Mining And Manufacturing Company | Electroplating bath for the electrodeposition of tin and tin/cadmium deposits |
US4067781A (en) * | 1977-01-10 | 1978-01-10 | Rapids Felix R | Method for electroplating |
US4135991A (en) * | 1977-08-12 | 1979-01-23 | R. O. Hull & Company, Inc. | Bath and method for electroplating tin and/or lead |
GB2013241B (en) * | 1977-11-16 | 1982-03-24 | Dipsol Chem | Electroplating bath for depositing tin or tin alloy with brightness |
US4347107A (en) * | 1981-04-02 | 1982-08-31 | Hooker Chemicals & Plastics Corp. | Electroplating tin and tin alloys and baths therefor |
SE8204505L (sv) * | 1981-09-08 | 1983-03-09 | Occidental Chem Co | Elektropletering for avsettning av tenn-blylegeringar pa olika underlag |
US5094726B1 (en) * | 1981-09-11 | 1993-12-21 | I. Nobel Fred | Limiting tin sludge formation in tin or tin/lead electroplating solutions |
US4871429A (en) * | 1981-09-11 | 1989-10-03 | Learonal, Inc | Limiting tin sludge formation in tin or tin/lead electroplating solutions |
US5066367B1 (en) * | 1981-09-11 | 1993-12-21 | I. Nobel Fred | Limiting tin sludge formation in tin or tin/lead electroplating solutions |
US4765871A (en) * | 1981-12-28 | 1988-08-23 | The Boeing Company | Zinc-nickel electroplated article and method for producing the same |
US4701244A (en) * | 1983-12-22 | 1987-10-20 | Learonal, Inc. | Bath and process for electroplating tin, lead and tin/alloys |
US4717460A (en) * | 1983-12-22 | 1988-01-05 | Learonal, Inc. | Tin lead electroplating solutions |
US4640746A (en) * | 1984-10-11 | 1987-02-03 | Learonal, Inc. | Bath and process for plating tin/lead alloys on composite substrates |
DE3440668A1 (de) * | 1984-11-07 | 1986-05-07 | Dr.-Ing. Max Schlötter GmbH & Co KG, 7340 Geislingen | Verfahren zur erhaltung der loetbarkeit von bleizinn-ueberzuegen |
US4582576A (en) * | 1985-03-26 | 1986-04-15 | Mcgean-Rohco, Inc. | Plating bath and method for electroplating tin and/or lead |
US4681670A (en) * | 1985-09-11 | 1987-07-21 | Learonal, Inc. | Bath and process for plating tin-lead alloys |
EP0319997B1 (en) * | 1987-12-10 | 1995-10-04 | LeaRonal, Inc. | Tin, lead or tin/lead alloy electrolytes for high speed electroplating |
US5174887A (en) * | 1987-12-10 | 1992-12-29 | Learonal, Inc. | High speed electroplating of tinplate |
US4844780A (en) * | 1988-02-17 | 1989-07-04 | Maclee Chemical Company, Inc. | Brightener and aqueous plating bath for tin and/or lead |
US4849059A (en) * | 1988-09-13 | 1989-07-18 | Macdermid, Incorporated | Aqueous electroplating bath and method for electroplating tin and/or lead and a defoaming agent therefor |
US4885064A (en) * | 1989-05-22 | 1989-12-05 | Mcgean-Rohco, Inc. | Additive composition, plating bath and method for electroplating tin and/or lead |
AU2927392A (en) * | 1991-11-01 | 1993-06-07 | National-Standard Company | Age resistant solder coatings |
US5698087A (en) * | 1992-03-11 | 1997-12-16 | Mcgean-Rohco, Inc. | Plating bath and method for electroplating tin and/or lead |
US5346607A (en) * | 1992-09-30 | 1994-09-13 | Weirton Steel Corporation | Electrolytic tinplating and product |
DE4422756C1 (de) * | 1994-06-29 | 1995-04-20 | Goldschmidt Ag Th | Selbstregulierende, saure Elektrolyte zur Tauchverzinnung von Aluminiumlegierungen |
US5560813A (en) * | 1994-09-09 | 1996-10-01 | National Science Council | Solder electroplating solution containing gelatin |
US6175752B1 (en) * | 1998-04-30 | 2001-01-16 | Therasense, Inc. | Analyte monitoring device and methods of use |
US9066695B2 (en) * | 1998-04-30 | 2015-06-30 | Abbott Diabetes Care Inc. | Analyte monitoring device and methods of use |
US8688188B2 (en) | 1998-04-30 | 2014-04-01 | Abbott Diabetes Care Inc. | Analyte monitoring device and methods of use |
US8465425B2 (en) | 1998-04-30 | 2013-06-18 | Abbott Diabetes Care Inc. | Analyte monitoring device and methods of use |
US8480580B2 (en) | 1998-04-30 | 2013-07-09 | Abbott Diabetes Care Inc. | Analyte monitoring device and methods of use |
US20080076997A1 (en) * | 1998-04-30 | 2008-03-27 | Abbott Diabetes Care, Inc. | Analyte monitoring device and methods of use |
US6949816B2 (en) | 2003-04-21 | 2005-09-27 | Motorola, Inc. | Semiconductor component having first surface area for electrically coupling to a semiconductor chip and second surface area for electrically coupling to a substrate, and method of manufacturing same |
US8346337B2 (en) * | 1998-04-30 | 2013-01-01 | Abbott Diabetes Care Inc. | Analyte monitoring device and methods of use |
US8974386B2 (en) | 1998-04-30 | 2015-03-10 | Abbott Diabetes Care Inc. | Analyte monitoring device and methods of use |
US6560471B1 (en) | 2001-01-02 | 2003-05-06 | Therasense, Inc. | Analyte monitoring device and methods of use |
US6582582B2 (en) | 2001-03-09 | 2003-06-24 | Donald Becking | Electroplating composition and process |
US7041468B2 (en) * | 2001-04-02 | 2006-05-09 | Therasense, Inc. | Blood glucose tracking apparatus and methods |
US6562221B2 (en) | 2001-09-28 | 2003-05-13 | David Crotty | Process and composition for high speed plating of tin and tin alloys |
JP2004002970A (ja) * | 2002-03-05 | 2004-01-08 | Shipley Co Llc | スズ又はスズ合金電気メッキ浴液における酸化によるスズ損失の制限 |
US7273540B2 (en) * | 2002-07-25 | 2007-09-25 | Shinryo Electronics Co., Ltd. | Tin-silver-copper plating solution, plating film containing the same, and method for forming the plating film |
AU2003303597A1 (en) | 2002-12-31 | 2004-07-29 | Therasense, Inc. | Continuous glucose monitoring system and methods of use |
US20080071157A1 (en) * | 2006-06-07 | 2008-03-20 | Abbott Diabetes Care, Inc. | Analyte monitoring system and method |
JP5622360B2 (ja) * | 2009-01-16 | 2014-11-12 | ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. | 電気錫めっき液および電気錫めっき方法 |
US8834958B2 (en) | 2011-07-08 | 2014-09-16 | The United States Of America As Represented By The Secretary Of The Army | Process of making negative electrode |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2460252A (en) * | 1946-02-09 | 1949-01-25 | Harshaw Chem Corp | Lead-tin alloy plating |
BE508197A (sv) * | 1951-01-12 | |||
US2773819A (en) * | 1954-01-13 | 1956-12-11 | Harshaw Chem Corp | Electrodeposition of lead |
AT252681B (de) * | 1963-08-28 | 1967-03-10 | Max Schloetter Fa Dr Ing | Galvanische Bäder zur elektrolytischen Abscheidung blanker bis glänzender Zinnschichten |
NL124247C (sv) * | 1963-08-28 | |||
NL128321C (sv) * | 1965-02-13 | |||
GB1151460A (en) * | 1967-10-09 | 1969-05-07 | Motohiko Kanai | Improvements in and relating to the Electroplating of Tin-Lead Alloy |
US3661730A (en) * | 1969-09-22 | 1972-05-09 | Kazuo Nishihara | Process for the formation of a super-bright solder coating |
-
1970
- 1970-10-22 US US00083229A patent/US3785939A/en not_active Expired - Lifetime
-
1971
- 1971-07-06 US US00160109A patent/US3769182A/en not_active Expired - Lifetime
- 1971-10-20 SE SE7113286A patent/SE392132B/sv unknown
- 1971-10-21 CA CA125,761A patent/CA972704A/en not_active Expired
- 1971-10-21 AU AU34842/71A patent/AU458608B2/en not_active Expired
- 1971-10-22 DE DE2152785A patent/DE2152785C2/de not_active Expired
- 1971-10-22 FR FR7138136A patent/FR2111779B1/fr not_active Expired
- 1971-11-22 GB GB4925671A patent/GB1368318A/en not_active Expired
-
1975
- 1975-12-30 MY MY186/75A patent/MY7500186A/xx unknown
Also Published As
Publication number | Publication date |
---|---|
MY7500186A (en) | 1975-12-31 |
US3769182A (en) | 1973-10-30 |
AU3484271A (en) | 1973-05-03 |
US3785939A (en) | 1974-01-15 |
DE2152785A1 (de) | 1972-05-04 |
FR2111779B1 (sv) | 1975-02-07 |
CA972704A (en) | 1975-08-12 |
FR2111779A1 (sv) | 1972-06-09 |
GB1368318A (en) | 1974-09-25 |
AU458608B2 (en) | 1975-03-06 |
DE2152785C2 (de) | 1982-07-01 |
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