MY7500186A - Tin/lead electroplating baths - Google Patents

Tin/lead electroplating baths

Info

Publication number
MY7500186A
MY7500186A MY186/75A MY7500186A MY7500186A MY 7500186 A MY7500186 A MY 7500186A MY 186/75 A MY186/75 A MY 186/75A MY 7500186 A MY7500186 A MY 7500186A MY 7500186 A MY7500186 A MY 7500186A
Authority
MY
Malaysia
Prior art keywords
tin
electroplating baths
lead electroplating
lead
baths
Prior art date
Application number
MY186/75A
Other languages
English (en)
Original Assignee
Kenvert Int Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26769076&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=MY7500186(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Kenvert Int Corp filed Critical Kenvert Int Corp
Publication of MY7500186A publication Critical patent/MY7500186A/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/34—Electroplating: Baths therefor from solutions of lead
    • C25D3/36—Electroplating: Baths therefor from solutions of lead characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
MY186/75A 1970-10-22 1975-12-30 Tin/lead electroplating baths MY7500186A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US8322970A 1970-10-22 1970-10-22
US16010971A 1971-07-06 1971-07-06

Publications (1)

Publication Number Publication Date
MY7500186A true MY7500186A (en) 1975-12-31

Family

ID=26769076

Family Applications (1)

Application Number Title Priority Date Filing Date
MY186/75A MY7500186A (en) 1970-10-22 1975-12-30 Tin/lead electroplating baths

Country Status (8)

Country Link
US (2) US3785939A (enrdf_load_stackoverflow)
AU (1) AU458608B2 (enrdf_load_stackoverflow)
CA (1) CA972704A (enrdf_load_stackoverflow)
DE (1) DE2152785C2 (enrdf_load_stackoverflow)
FR (1) FR2111779B1 (enrdf_load_stackoverflow)
GB (1) GB1368318A (enrdf_load_stackoverflow)
MY (1) MY7500186A (enrdf_load_stackoverflow)
SE (1) SE392132B (enrdf_load_stackoverflow)

Families Citing this family (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3749649A (en) * 1971-12-16 1973-07-31 M & T Chemicals Inc Bright tin-lead alloy plating
US3926749A (en) * 1971-12-20 1975-12-16 M & T Chemicals Inc Tin-lead alloy plating
GB1469547A (en) * 1973-06-28 1977-04-06 Minnesota Mining & Mfg Tin/lead electr-plating baths
US3875029A (en) * 1974-02-19 1975-04-01 R O Hull & Company Inc Plating bath for electrodeposition of bright tin and tin-lead alloy
US4053372A (en) * 1975-10-09 1977-10-11 Amp Incorporated Tin-lead acidic plating bath
CA1077430A (en) * 1975-11-28 1980-05-13 Minnesota Mining And Manufacturing Company Electroplating bath for the electrodeposition of tin and tin/cadmium deposits
US4207148A (en) * 1975-11-28 1980-06-10 Minnesota Mining And Manufacturing Company Electroplating bath for the electrodeposition of tin and tin/cadmium deposits
US4067781A (en) * 1977-01-10 1978-01-10 Rapids Felix R Method for electroplating
US4135991A (en) * 1977-08-12 1979-01-23 R. O. Hull & Company, Inc. Bath and method for electroplating tin and/or lead
GB2013241B (en) * 1977-11-16 1982-03-24 Dipsol Chem Electroplating bath for depositing tin or tin alloy with brightness
US4347107A (en) * 1981-04-02 1982-08-31 Hooker Chemicals & Plastics Corp. Electroplating tin and tin alloys and baths therefor
SE8204505L (sv) * 1981-09-08 1983-03-09 Occidental Chem Co Elektropletering for avsettning av tenn-blylegeringar pa olika underlag
US4871429A (en) * 1981-09-11 1989-10-03 Learonal, Inc Limiting tin sludge formation in tin or tin/lead electroplating solutions
US5066367B1 (en) * 1981-09-11 1993-12-21 I. Nobel Fred Limiting tin sludge formation in tin or tin/lead electroplating solutions
US5094726B1 (en) * 1981-09-11 1993-12-21 I. Nobel Fred Limiting tin sludge formation in tin or tin/lead electroplating solutions
US4765871A (en) * 1981-12-28 1988-08-23 The Boeing Company Zinc-nickel electroplated article and method for producing the same
US4701244A (en) * 1983-12-22 1987-10-20 Learonal, Inc. Bath and process for electroplating tin, lead and tin/alloys
US4717460A (en) * 1983-12-22 1988-01-05 Learonal, Inc. Tin lead electroplating solutions
US4640746A (en) * 1984-10-11 1987-02-03 Learonal, Inc. Bath and process for plating tin/lead alloys on composite substrates
DE3440668A1 (de) * 1984-11-07 1986-05-07 Dr.-Ing. Max Schlötter GmbH & Co KG, 7340 Geislingen Verfahren zur erhaltung der loetbarkeit von bleizinn-ueberzuegen
US4582576A (en) * 1985-03-26 1986-04-15 Mcgean-Rohco, Inc. Plating bath and method for electroplating tin and/or lead
US4681670A (en) * 1985-09-11 1987-07-21 Learonal, Inc. Bath and process for plating tin-lead alloys
DE3856429T2 (de) * 1987-12-10 2001-03-08 Learonal, Inc. Zinn, Blei- oder Zinn-Blei-Legierungselektrolyten für Elektroplattieren bei hoher Geschwindigkeit
US5174887A (en) * 1987-12-10 1992-12-29 Learonal, Inc. High speed electroplating of tinplate
US4844780A (en) * 1988-02-17 1989-07-04 Maclee Chemical Company, Inc. Brightener and aqueous plating bath for tin and/or lead
US4849059A (en) * 1988-09-13 1989-07-18 Macdermid, Incorporated Aqueous electroplating bath and method for electroplating tin and/or lead and a defoaming agent therefor
US4885064A (en) * 1989-05-22 1989-12-05 Mcgean-Rohco, Inc. Additive composition, plating bath and method for electroplating tin and/or lead
WO1993009276A1 (en) * 1991-11-01 1993-05-13 National-Standard Company Age resistant solder coatings
US5698087A (en) * 1992-03-11 1997-12-16 Mcgean-Rohco, Inc. Plating bath and method for electroplating tin and/or lead
US5346607A (en) * 1992-09-30 1994-09-13 Weirton Steel Corporation Electrolytic tinplating and product
DE4422756C1 (de) * 1994-06-29 1995-04-20 Goldschmidt Ag Th Selbstregulierende, saure Elektrolyte zur Tauchverzinnung von Aluminiumlegierungen
US5560813A (en) * 1994-09-09 1996-10-01 National Science Council Solder electroplating solution containing gelatin
US8465425B2 (en) 1998-04-30 2013-06-18 Abbott Diabetes Care Inc. Analyte monitoring device and methods of use
US6175752B1 (en) * 1998-04-30 2001-01-16 Therasense, Inc. Analyte monitoring device and methods of use
US9066695B2 (en) * 1998-04-30 2015-06-30 Abbott Diabetes Care Inc. Analyte monitoring device and methods of use
US20080076997A1 (en) * 1998-04-30 2008-03-27 Abbott Diabetes Care, Inc. Analyte monitoring device and methods of use
US6949816B2 (en) 2003-04-21 2005-09-27 Motorola, Inc. Semiconductor component having first surface area for electrically coupling to a semiconductor chip and second surface area for electrically coupling to a substrate, and method of manufacturing same
US8688188B2 (en) 1998-04-30 2014-04-01 Abbott Diabetes Care Inc. Analyte monitoring device and methods of use
US8346337B2 (en) * 1998-04-30 2013-01-01 Abbott Diabetes Care Inc. Analyte monitoring device and methods of use
US8974386B2 (en) 1998-04-30 2015-03-10 Abbott Diabetes Care Inc. Analyte monitoring device and methods of use
US8480580B2 (en) * 1998-04-30 2013-07-09 Abbott Diabetes Care Inc. Analyte monitoring device and methods of use
US6560471B1 (en) * 2001-01-02 2003-05-06 Therasense, Inc. Analyte monitoring device and methods of use
US6582582B2 (en) 2001-03-09 2003-06-24 Donald Becking Electroplating composition and process
AU2002309528A1 (en) * 2001-04-02 2002-10-15 Therasense, Inc. Blood glucose tracking apparatus and methods
US6562221B2 (en) 2001-09-28 2003-05-13 David Crotty Process and composition for high speed plating of tin and tin alloys
EP1342817A3 (en) * 2002-03-05 2006-05-24 Shipley Co. L.L.C. Limiting the loss of tin through oxidation in tin or tin alloy electroplating bath solutions
US7273540B2 (en) * 2002-07-25 2007-09-25 Shinryo Electronics Co., Ltd. Tin-silver-copper plating solution, plating film containing the same, and method for forming the plating film
EP1578262A4 (en) 2002-12-31 2007-12-05 Therasense Inc CONTINUOUS BLOOD SUGAR MONITORING SYSTEM AND USE METHOD
US7920907B2 (en) * 2006-06-07 2011-04-05 Abbott Diabetes Care Inc. Analyte monitoring system and method
JP5622360B2 (ja) * 2009-01-16 2014-11-12 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 電気錫めっき液および電気錫めっき方法
US8834958B2 (en) 2011-07-08 2014-09-16 The United States Of America As Represented By The Secretary Of The Army Process of making negative electrode
GB201815262D0 (en) * 2018-09-19 2018-10-31 Lankem Ltd Composition and method

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2460252A (en) * 1946-02-09 1949-01-25 Harshaw Chem Corp Lead-tin alloy plating
BE508197A (enrdf_load_stackoverflow) * 1951-01-12
US2773819A (en) * 1954-01-13 1956-12-11 Harshaw Chem Corp Electrodeposition of lead
AT252681B (de) * 1963-08-28 1967-03-10 Max Schloetter Fa Dr Ing Galvanische Bäder zur elektrolytischen Abscheidung blanker bis glänzender Zinnschichten
NL134963C (enrdf_load_stackoverflow) * 1963-08-28
NL128321C (enrdf_load_stackoverflow) * 1965-02-13
GB1151460A (en) * 1967-10-09 1969-05-07 Motohiko Kanai Improvements in and relating to the Electroplating of Tin-Lead Alloy
US3661730A (en) * 1969-09-22 1972-05-09 Kazuo Nishihara Process for the formation of a super-bright solder coating

Also Published As

Publication number Publication date
AU3484271A (en) 1973-05-03
FR2111779A1 (enrdf_load_stackoverflow) 1972-06-09
CA972704A (en) 1975-08-12
US3769182A (en) 1973-10-30
DE2152785C2 (de) 1982-07-01
US3785939A (en) 1974-01-15
AU458608B2 (en) 1975-03-06
SE392132B (sv) 1977-03-14
FR2111779B1 (enrdf_load_stackoverflow) 1975-02-07
GB1368318A (en) 1974-09-25
DE2152785A1 (de) 1972-05-04

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