US20240200222A1 - Plating electrode and plating method that uses the plating electrode - Google Patents

Plating electrode and plating method that uses the plating electrode Download PDF

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Publication number
US20240200222A1
US20240200222A1 US18/554,085 US202218554085A US2024200222A1 US 20240200222 A1 US20240200222 A1 US 20240200222A1 US 202218554085 A US202218554085 A US 202218554085A US 2024200222 A1 US2024200222 A1 US 2024200222A1
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United States
Prior art keywords
plating
solution
impregnated fabric
plated
contact
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US18/554,085
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English (en)
Inventor
Issei OTANI
Yohei Takemoto
Keisuke Miyoshi
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Assigned to MITSUBISHI ELECTRIC CORPORATION reassignment MITSUBISHI ELECTRIC CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MIYOSHI, KEISUKE, OTANI, Issei, TAKEMOTO, Yohei
Publication of US20240200222A1 publication Critical patent/US20240200222A1/en
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/04—Electroplating with moving electrodes
    • C25D5/06—Brush or pad plating

Definitions

  • the present disclosure relates to a plating electrode used for forming a plating film on an object to be plated, and relates to a plating method that uses the plating electrode.
  • Patent Literature 1 discloses a partial plating method that can omit masking work.
  • This partial plating method is structured in which a plating target portion of an object to be plated is immersed in a plating solution in a plating tank and a plating non-target portion is exposed from the surface of the plating solution so that a plating film is formed by electroplating only on the surface of the portion to be plated.
  • Patent Literature 1 Japanese Patent No. 6510993
  • the partial plating method disclosed in Patent Literature 1 is structured in which the entire plating target portion is immersed in the plating solution in the plating tank and hence, a plating film is formed on the entire periphery of the immersed portion. Therefore, it is impossible to selectively form a plating film only on the surface of the portion of the object to be plated. That is, in the partial plating method disclosed in Patent Literature 1, there is a limitation on a target portion on which partial plating is performed and hence, partial plating treatment with various patterns cannot be performed.
  • the present disclosure has been made to solve the above-mentioned problem, and it is an object of the present disclosure to provide a plating electrode that does not require masking work, in which portions other than a portion to be plated are protected by a masking material, and that can selectively apply partial plating only to the surface of a portion of an object to be plated, and it is another object of the present disclosure to provide a plating method that uses the plating electrode.
  • a plating electrode is a plating electrode used for forming a plating film on an object to be plated, the plating electrode including a plating-solution-impregnated fabric formed into an annular shape; an annular part disposed inside the annular shape of the plating-solution-impregnated fabric, and provided in a state in which an outer surface of the annular part is kept in close contact with an inner surface of the plating-solution-impregnated fabric, the annular part having conductivity; a first rotary part provided inside the annular part, electrically connected to the annular part, and configured to be rotatable while ensuring conductivity; and a second rotary part provided inside the annular part, and configured to rotate in synchronization with driving of a motor.
  • An anode of a DC conversion power supply is electrically connected to the first rotary part, and a cathode of the DC conversion power supply is electrically connected to the object to be plated, and the annular part is caused to turn in synchronization with rotation of the first rotary part and the second rotary part to cause the plating-solution-impregnated fabric to turn in an annular direction, thereby causing the plating-solution-impregnated fabric to come into contact with and to slide against a portion to be plated of the object to be plated.
  • a plating method is a plating method that uses the plating electrode, including performing plating treatment, the performing plating treatment including turning the plating-solution-impregnated fabric with the plating-solution-impregnated fabric impregnated the plating solution; transmitting an electric current through the plating-solution-impregnated fabric by use of the DC conversion power supply; and causing the plating-solution-impregnated fabric to come into contact with and to slide against the portion to be plated of the object to be plated.
  • the plating-solution-impregnated fabric is caused to be in close contact with the annular part, which is electrically connected to the anode of the DC conversion power supply via the first rotary part, and the plating-solution-impregnated fabric slides while keeping in contact with the portion to be plated of the object to be plated, which is electrically connected to the cathode of the DC conversion power supply, and hence, it is possible to form a plating film only at the portion to be plated with which the plating-solution-impregnated fabric comes into contact. Therefore, masking work, in which portions other than the portion to be plated are protected by a masking material, is not required, and it is possible to selectively form a plating film only on the surface of the portion of the object to be plated.
  • FIG. 1 is a perspective view schematically showing a plating electrode according to Embodiment 1.
  • FIG. 2 is a diagram schematically illustrating the mechanism of the plating electrode according to Embodiment 1 that causes an annular part to rotate in an annular direction in which the annular part rotates.
  • FIG. 3 is a cross-sectional view schematically showing the plating electrode according to Embodiment 1 in a state in which a plating-solution-impregnated fabric is fixed to the annular part.
  • FIG. 4 is a perspective view schematically showing the plating electrode according to Embodiment 1 in a state in which a plating film is formed on an object to be plated.
  • FIG. 5 is a diagram illustrating one example of a case in which the plating electrode according to Embodiment 1 forms a plating film on an object to be plated that includes a recessed portion.
  • FIG. 6 is a block diagram of constituent elements used in modification 1 of the plating method according to Embodiment 1.
  • FIG. 7 is a flowchart of modification 1 of the plating method according to Embodiment 1.
  • FIG. 8 is a block diagram of constituent elements used in modification 2 of the plating method according to Embodiment 1.
  • FIG. 9 is a flowchart of modification 2 of the plating method according to Embodiment 1.
  • FIG. 10 is a block diagram of constituent elements used in modification 3 of the plating method according to Embodiment 1.
  • FIG. 11 is a flowchart of modification 3 of the plating method according to Embodiment 1.
  • FIG. 12 is a diagram schematically illustrating a part of a plating electrode according to Embodiment 2.
  • FIG. 13 is a diagram schematically illustrating a state in which a plating-solution-impregnated fabric is caused to come into contact with an object to be plated by moving the plating electrode from the state shown in FIG. 12 .
  • FIG. 14 is a diagram schematically illustrating a state in which the plating-solution-impregnated fabric is caused to come into contact with the object to be plated by moving all of first movable contacts from the state shown in FIG. 12 .
  • FIG. 15 is a diagram schematically illustrating a state in which the plating-solution-impregnated fabric is caused to come into contact with the object to be plated by moving some of the first movable contacts from the state shown in FIG. 12 .
  • FIG. 16 is a diagram schematically illustrating a state in which the plating-solution-impregnated fabric is caused to come into contact with the object to be plated by moving some of the first movable contacts from the state shown in FIG. 12 .
  • FIG. 17 is a diagram schematically illustrating a state in which the plating-solution-impregnated fabric is caused to come into contact with a curved surface of an object to be plated by moving the first movable contacts from the state shown in FIG. 12 .
  • FIG. 18 is a diagram schematically illustrating a state in which the plating-solution-impregnated fabric is caused to come into contact with a convex surface of an object to be plated by moving the first movable contacts from the state shown in FIG. 12 .
  • FIG. 19 is a diagram schematically illustrating a modification of the plating electrode according to Embodiment 2.
  • FIG. 20 is a diagram schematically illustrating a state in which the plating-solution-impregnated fabric is caused to come into contact with an object to be plated by moving some of the first movable contacts from the state shown in FIG. 19 .
  • FIG. 21 is a diagram schematically illustrating a plating electrode according to Embodiment 3.
  • FIG. 22 is a diagram of the plating electrode according to Embodiment 3 as viewed in the direction shown by an arrow A in FIG. 21 .
  • FIG. 23 is a perspective view schematically showing a plating electrode according to Embodiment 4.
  • FIG. 24 is a diagram schematically illustrating a plating electrode according to Embodiment 5.
  • FIG. 25 is a diagram schematically illustrating modification 1 of the plating electrode according to Embodiment 5.
  • FIG. 26 is a diagram schematically illustrating modification 2 of the plating electrode according to Embodiment 5.
  • FIG. 27 is a diagram schematically illustrating modification 3 of the plating electrode according to Embodiment 5.
  • FIG. 1 is a perspective view schematically showing a plating electrode according to Embodiment 1.
  • FIG. 2 is a diagram schematically illustrating the mechanism of the plating electrode according to Embodiment 1 that causes an annular part to rotate in an annular direction in which the annular part annularly rotates.
  • FIG. 3 is a cross-sectional view schematically showing the plating electrode according to Embodiment 1 in a state in which a plating-solution-impregnated fabric is fixed to the annular part.
  • FIG. 4 is a perspective view schematically showing the plating electrode according to Embodiment 1 in a state in which a plating film is formed on an object to be plated.
  • FIG. 1 is a perspective view schematically showing a plating electrode according to Embodiment 1.
  • FIG. 5 is a diagram illustrating one example of a case in which the plating electrode according to Embodiment 1 forms a plating film on an object to be plated that includes a recessed portion.
  • Outline arrows a shown in FIG. 1 , FIG. 2 , and FIG. 4 show a turning direction in which a plating-solution-impregnated fabric 1 and an annular part 2 turn.
  • Outline arrows b shown in FIG. 2 show respective rotational directions in which a first rotary part 3 and a second rotary part 4 rotate.
  • a plating electrode 100 according to Embodiment 1 is used for forming a plating film on a portion to be plated 200 a of an object to be plated 200 .
  • the portion to be plated 200 a is a region of the surface of the object to be plated 200 in which a plating film is formed.
  • the plating electrode 100 includes the plating-solution-impregnated fabric 1 , the annular part 2 , the first rotary part 3 , the second rotary part 4 , a motor 6 , and a plating solution supplier 7 .
  • the plating-solution-impregnated fabric 1 has an annular shape, and the outer surface of the annular shape of the plating-solution-impregnated fabric 1 comes into contact with the portion to be plated 200 a of the object to be plated 200 to form a plating film.
  • the annular part 2 , the first rotary part 3 , and the second rotary part 4 are disposed inside the annular shape of the plating-solution-impregnated fabric 1 .
  • the plating-solution-impregnated fabric 1 is made of a material that can be saturated with a plating solution but that is non-reactive with the plating solution.
  • the plating-solution-impregnated fabric 1 is made of a woven fabric, a non-woven fabric, or a sponge.
  • the annular part 2 is formed from a mesh having conductivity, for example.
  • the annular part 2 is made of a material that does not dissolve in or that does not easily dissolve in the plating solution, which is in use.
  • the annular part 2 is made of platinum (Pt), titanium-platinum (Ti—Pt), titanium-iridium oxide (Ti—IrO2), stainless steel (SUS), or carbon (C).
  • the annular part 2 is disposed inside the annular shape of the plating-solution-impregnated fabric 1 , and is provided in a state in which the outer surface of the annular part 2 is kept in close contact with the inner surface of the plating-solution-impregnated fabric 1 .
  • a method for keeping the outer surface of the annular part 2 in close contact with the inner surface of the plating-solution-impregnated fabric 1 there is a method in which, as shown in FIG.
  • the fixing part 20 is a clip or similar part made of a material that is non-reactive with the plating solution. In this case, by obliquely bending the edges of the annular shape of the annular part 2 toward the inside of the annular shape, it is possible to prevent a situation in which the fixing part 20 comes into contact with the object to be plated 200 .
  • annular part 2 is sewn to the plating-solution-impregnated fabric 1 by use of thread made of a material that is non-reactive with the plating solution so that the outer surface of the annular part 2 can be kept in close contact with the inner surface of the plating-solution-impregnated fabric 1 .
  • the first rotary part 3 and the second rotary part 4 are disposed inside the annular part 2 .
  • the annular part 2 is electrically connected with the first rotary part 3 .
  • the annular part 2 turns in the annular direction in synchronization with rotation of the first rotary part 3 and the second rotary part 4 .
  • the plating-solution-impregnated fabric 1 that is in close contact with the annular part 2 also turns in the annular direction in synchronization with the rotation of the first rotary part 3 and the second rotary part 4 .
  • the annular part 2 it is preferable for the annular part 2 to have notches at edges 2 a of the annular shape. By causing the edges 2 a of the annular shape of the annular part 2 to have the notches, it is possible to prevent generation of an excessive tension in the annular part 2 at the time when the first rotary part 3 and the second rotary part 4 come into contact with the annular part 2 and hence, breakage of the end portion of the annular part 2 can be prevented.
  • the annular part 2 is not limited to the above-mentioned mesh, and may be formed from other parts, such as a thin plate, provided that the annular part 2 can turn in the annular direction in synchronization with the rotation of the first rotary part 3 and the second rotary part 4 while the annular part 2 is electrically connected with the first rotary part 3 .
  • the first rotary part 3 is a rotary connecting connector including a rotary shaft 30 and a rotary body 31 electrically connected to the rotary shaft 30 and having a cylindrical shape.
  • the first rotary part 3 is provided inside the annular part 2 .
  • the first rotary part 3 is electrically connected to the annular part 2 , and is configured to be rotatable while ensuring conductivity of the rotary shaft 30 and the rotary body 31 .
  • the first rotary part 3 is made of a material that does not dissolve in or that does not easily dissolve in the plating solution, which is in use.
  • the first rotary part 3 is made of platinum (Pt), titanium-platinum (Ti—Pt), titanium-iridium oxide (Ti—IrO2), stainless steel (SUS), or carbon (C).
  • a commercially available connector may be used in which conductivity of the rotary shaft 30 and the rotary body 31 is ensured by use of, for example, a carbon brush, a mercury-gallium alloy, or a roller current collector.
  • the anode of a DC conversion power supply 5 is electrically connected to the rotary shaft 30 of the first rotary part 3 via a conductive wire 5 a .
  • the cathode of the DC conversion power supply 5 is electrically connected to the object to be plated 200 via a conductive wire 5 b .
  • the rotary body 31 of the first rotary part 3 can be rotated independently from the rotary shaft 30 .
  • the DC conversion power supply 5 includes a power supply circuit that is controlled such that the DC output voltage always remains at a constant value.
  • the first rotary part 3 includes a plurality of protruding portions 32 having a smaller width than a width of the openings of the annular part 2 .
  • the protruding portions 32 are provided to the outer peripheral surface of the rotary body 31 at intervals along the rotational direction in which the rotary body 31 rotates.
  • the rotary body 31 includes the protruding portions 32 , thus having a gear shape.
  • the protruding portions 32 are fit into the openings of the annular part 2 when the first rotary part 3 rotates.
  • the annular part 2 can be synchronized with rotation of the rotary body 31 , and can be rotated in the annular direction.
  • a means that causes the annular part 2 to synchronize with the rotation of the rotary body 31 is not limited to the configuration in which the protruding portions 32 are provided to the rotary body 31 .
  • a configuration may be adopted in which tension is generated between the rotary body 31 and the annular part 2 and the annular part 2 is synchronized with the rotation of the rotary body 31 by a frictional force, or other configurations may be adopted.
  • the second rotary part 4 includes a rotary shaft 40 and a rotary body 41 rotated by the rotary shaft 40 and having a cylindrical shape.
  • the second rotary part 4 is made of a material that does not dissolve in or that does not easily dissolve in the plating solution, which is in use.
  • the second rotary part 4 is made of platinum (Pt), titanium-platinum (Ti—Pt), titanium-iridium oxide (Ti—IrO2), stainless steel (SUS), or carbon (C).
  • the rotary shaft 40 is provided at the center of the circle of the rotary body 41 .
  • One end of the rotary shaft 40 is connected to the motor 6 connected to a power supply (not shown in the drawing).
  • the second rotary part 4 is configured such that the rotary body 41 rotates about the rotary shaft 40 when the motor 6 is driven.
  • the first rotary part 3 includes a plurality of protruding portions 42 having a smaller width than the width of the openings of the annular part 2 .
  • the protruding portions 42 are provided to the outer peripheral surface of the rotary body 41 at intervals along the rotational direction in which the rotary body 41 rotates.
  • the rotary body 41 includes the protruding portions 42 , thus having a gear shape.
  • the protruding portions 42 fit into the openings of the annular part 2 when the second rotary part 4 rotates.
  • the annular part 2 can be synchronized with rotation of the rotary body 41 , and can be rotated in the annular direction.
  • a means that causes the annular part 2 to synchronize with the rotation of the rotary body 41 is not limited to the configuration in which the protruding portions 42 are provided to the rotary body 41 .
  • a configuration may be adopted in which tension is generated between the rotary body 41 and the annular part 2 and the annular part 2 is synchronized with the rotation of the rotary body 41 by a frictional force, or other configurations may be adopted.
  • each of the rotary bodies 31 and 41 is not limited to a cylindrical shape shown in the drawing.
  • each of the rotary bodies 31 and 41 may have a shape obtained by arranging a plurality of spherical bodies or gears with a shaft in a row, or may have a configuration in which a plurality of polygonal prisms or cylindrical bodies with a shaft are arranged in a row.
  • the rotary parts that cause the annular part 2 to turn in synchronization with the rotary parts are not limited to two rotary parts, that is, the first rotary part 3 and the second rotary part 4 shown in the drawing.
  • the rotary parts may include three or more rotary parts depending on the purpose of use, the shape of the object to be plated 200 , and other features.
  • a uniform plating film can be formed onto the recessed portion by use of three rotary parts obtained by adding a third rotary part 11 .
  • the plating solution supplier 7 is a device that supplies a plating solution 70 to the plating-solution-impregnated fabric 1 .
  • the plating solution supplier 7 shown in FIG. 1 is configured to supply the plating solution 70 by dripping the plating solution 70 onto the plating-solution-impregnated fabric 1 .
  • the plating solution supplier 7 is not limited to the configuration shown in the drawing. Provided that the plating solution supplier 7 can supply the plating solution 70 to the plating-solution-impregnated fabric 1 , other modes may be adopted. It is not always necessary for the plating electrode 100 to be provided with the plating solution supplier 7 .
  • a configuration may be adopted in which a tank filled with the plating solution 70 is separately prepared, and the plating-solution-impregnated fabric 1 is put into the tank to cause the plating-solution-impregnated fabric 1 to be impregnated with the plating solution in advance.
  • the above-mentioned plating-solution-impregnated fabric 1 , annular part 2 , first rotary part 3 , second rotary part 4 , and motor 6 are held by a holder 8 .
  • the rotary shaft 30 of the first rotary part 3 and the rotary shaft 40 of the second rotary part 4 are connected to the holder 8 such that the rotary shaft 30 and the rotary shaft 40 are rotatable so that the plating-solution-impregnated fabric 1 and the annular part 2 are also held by the holder 8 together with the first rotary part 3 and the second rotary part 4 .
  • One end of the rotary shaft 40 of the second rotary part 4 is connected to the holder 8 such that the motor 6 is between the one end of the rotary shaft 40 and the holder 8 .
  • the holder 8 is formed to pass over the outside of the first rotary part 3 , the outside of the second rotary part 4 , and the outside of the annular part 2 , and to hold the plating electrode 100 .
  • the reason for this form is to prevent the holder 8 from preventing the rotation of the first rotary part 3 , the second rotary part 4 , and the motor 6 .
  • Another reason is to prevent the holder 8 from preventing conduction of the plating-solution-impregnated fabric 1 , the annular part 2 , and the first rotary part 3 .
  • Still another reason is to prevent the holder 8 from interfering with a turning path in which the plating-solution-impregnated fabric 1 turns.
  • An operation mechanism not shown in the drawing including the arm of a robot or other mechanism is connected to the holder 8 .
  • the operation mechanism is configured to freely move the plating electrode 100 via the holder 8 , and is also configured to adjust the contact pressure of the plating-solution-impregnated fabric 1 against the portion to be plated 200 a , for example.
  • the operation mechanism may be formed to include a grip portion that can be manually operated by the operator.
  • the grip portion is made of an insulating material, such as a resin.
  • Embodiment 1 a method for applying silver plating to a copper alloy material, which is a highly versatile material as the target for plating treatment, will be described as an example.
  • a copper alloy material processed into a set shape is prepared as the object to be plated 200 .
  • the degreasing treatment is performed on the object to be plated 200 by use of a degreasing agent.
  • a degreasing agent a commercially available sodium-hydroxide-based or sodium-carbonate-based alkaline degreasing agent, for example, may be used.
  • the acid cleaning treatment is performed on the object to be plated 200 by use of an acid cleaning agent.
  • an acid cleaning agent obtained by diluting nitric acid or sulfuric acid, or a commercially available acid cleaning agent, for example, may be used.
  • the neutralization treatment is performed on the object to be plated 200 by use of a neutralizing agent.
  • a neutralizing agent a cyanide-based solution, such as sodium cyanide, a dilute sodium-hydroxide-based cleaning solution, and a commercially available neutralizing agent, for example, may be used.
  • silver plating treatment is performed on the object to be plated 200 by use of a silver plating solution by a silver electroplating method.
  • a silver plating film is formed on the surface of the object to be plated 200 at the portion to be plated 200 a .
  • cathode electrolytic treatment that is generally performed in plating treatment is performed.
  • the plating time period is a time period during which the plating-solution-impregnated fabric 1 impregnated with the silver plating solution is caused to be in contact with the portion to be plated 200 a .
  • the current density is set to 20 A/dm 2
  • the temperature of the silver plating solution is set to 25 degrees C.
  • An appropriate temperature of the silver plating solution is a temperature in the vicinity of 25 degrees C.
  • the known plating solution for silver plating is a plating solution the pH of which is adjusted to 7 by use of, as metal salts, silver ion of 1 wt % to 5 wt %, potassium iodide of 30 wt % to 40 wt %, and methanesulfonic acid of 1 wt % to 5 wt %, for example.
  • the known plating solution for silver plating is a plating solution that is adjusted by use of, as metal salts, silver ion of 3 wt % to 15 wt %, free cyanide of 5 wt % to 15 wt %, and potassium carbonate of 2 wt % to 7 wt %.
  • wt % denotes a value relative to the entire adjusted solution.
  • the object to be plated 200 is fixed, and the plating electrode 100 is held by use of the operation mechanism not shown in the drawing and connected to the holder 8 . At this point of operation, the plating electrode 100 is kept away from the object to be plated 200 .
  • the contact pressure of the plating-solution-impregnated fabric 1 that is caused to come into contact with the portion to be plated 200 a is set.
  • the contact pressure is adjusted such that the film thickness of a plating film to be formed at the portion to be plated 200 a is at the target film thickness. It is preferable that the contact pressure be 0.25 kgf/cm 2 to 2.0 kgf/cm 2 . The reason is that when the contact pressure is less than 0.25 kgf/cm 2 , burning of a silver plating film is likely to occur, which causes the problem of failing in obtaining a good plating film.
  • the motor 6 is driven to rotate the second rotary part 4 .
  • the plating-solution-impregnated fabric 1 it is possible to cause the plating-solution-impregnated fabric 1 to turn in the annular direction via the annular part 2 , which turns in the annular direction in synchronization with the second rotary part 4 .
  • the DC conversion power supply 5 is brought into an on state from an off state while a turning state in which the plating-solution-impregnated fabric 1 turns is maintained.
  • the operation mechanism not shown in the drawing is operated to move the holder 8 , thereby causing the plating-solution-impregnated fabric 1 to come into contact with the portion to be plated 200 a at a set contact pressure.
  • An electric current starts to be transmitted through the plating-solution-impregnated fabric 1 at the moment when the plating-solution-impregnated fabric 1 comes into contact with the portion to be plated 200 a .
  • the plating time period may be 30 seconds, for example.
  • the plating time period is suitably determined depending on the target plating film thickness. It is preferable that the sliding speed at which the plating-solution-impregnated fabric 1 is slid against the object to be plated 200 fall within a range from 12.5 m/min to 17.5 m/min. The reason is that, in the silver plating, when the sliding speed is less than 12.5 m/min, burning of a plating film occurs, which causes the problem of failing in obtaining a good plating film.
  • the sliding speed is more than 17.5 m/min, a large amount of wear occurs between a precipitated plating film and the plating-solution-impregnated fabric 1 , preventing growth of the plating film, which causes the problem of failing in obtaining the target plating thickness.
  • the above-mentioned procedure may be changed.
  • a configuration may be adopted in which, after the plating-solution-impregnated fabric 1 is caused to come into contact with the portion to be plated 200 a , the plating-solution-impregnated fabric 1 is turned and, thereafter, the DC conversion power supply 5 is brought into an on state to transmit an electric current.
  • the operation mechanism not shown in the drawing is operated to move the plating electrode 100 by making use of the holder 8 , thereby separating the plating-solution-impregnated fabric 1 from the object to be plated 200 as shown in FIG. 4 .
  • a silver plating film 200 b can be obtained.
  • the post treatment include chemical treatment, such as chromate treatment, and discoloration prevention treatment.
  • plating solutions that produce unwanted reaction products on the surface when the plating solution comes into direct contact with water.
  • post treatment of removing a plating solution with a special solution is performed.
  • any of various treatments is performed according to the kind of the plating solution.
  • a water-washing step may be added in which the plating-solution-impregnated fabric 1 is immersed in pure water and, thereafter, is dried. By performing the water-washing step, it is possible to remove deteriorated treatment solution that is impregnated in the plating-solution-impregnated fabric 1 .
  • the target for the plating treatment is not limited to a copper alloy material. Further, the kind of plating is not limited to silver plating.
  • the above-mentioned plating method is also applicable to formation of a plurality of plating layers, such as a case in which nickel plating is formed on an aluminum alloy material, which is the target for the plating treatment, and tin plating is further formed on the upper surface of the nickel plating.
  • electrolytic treatment is also applicable to the post treatment and the water-washing step performed after the degreasing step, the acid cleaning step, the neutralizing step, and the plating step are performed.
  • electrolytic treatment applied in the degreasing step is electrolytic degreasing.
  • a degreasing solution is impregnated into the plating-solution-impregnated fabric 1 as a degreasing agent, and the plating-solution-impregnated fabric 1 is caused to come into contact with the portion to be plated 200 a .
  • cathode electrolytic treatment can be applied as the degreasing treatment.
  • anode electrolytic treatment can be applied as the degreasing treatment.
  • electrolytic treatment is applied to a step other than the plating step, it is not always necessary to cause the plating-solution-impregnated fabric 1 to slide against the portion to be plated 200 a.
  • the plating film 200 b without using the annular part 2 by turning the plating-solution-impregnated fabric 1 by causing the plating-solution-impregnated fabric 1 to come into direct contact with the first rotary part 3 and the second rotary part 4 .
  • a portion in the vicinity of the first rotary part 3 that plays the role of an anode has a significantly higher current density than other portions and hence, there is a possibility that a normal plating film cannot be obtained and uniformity of a film thickness deteriorates. That is, interposing the annular part 2 can make current density distribution uniform, thereby improving uniformity of a film thickness.
  • the plating electrode 100 according to Embodiment 1 includes the plating-solution-impregnated fabric 1 formed into an annular shape, and the annular part 2 disposed inside the annular shape of the plating-solution-impregnated fabric 1 and provided in a state in which the outer surface of the annular part 2 is kept in close contact with the inner surface of the plating-solution-impregnated fabric 1 , and the annular part 2 has conductivity.
  • the plating electrode 100 according to Embodiment 1 also includes the first rotary part 3 provided inside the annular part 2 , electrically connected to the annular part 2 , and configured to be rotatable while ensuring conductivity, and the second rotary part 4 provided inside the annular part 2 and configured to rotate in synchronization with the driving of the motor 6 .
  • the anode of the DC conversion power supply 5 is electrically connected to the first rotary part 3
  • the cathode of the DC conversion power supply 5 is electrically connected to the object to be plated 200 .
  • the annular part 2 is caused to turn in synchronization with the rotation of the first rotary part 3 and the second rotary part 4 to cause the plating-solution-impregnated fabric 1 to turn in the annular direction, thereby causing the plating-solution-impregnated fabric 1 to come into contact with and to slide against the portion to be plated 200 a of the object to be plated 200 .
  • the plating-solution-impregnated fabric 1 is caused to be in close contact with the annular part 2 , which is electrically connected to the anode of the DC conversion power supply 5 via the first rotary part 3 , and the plating-solution-impregnated fabric 1 slides while keeping in contact with the portion to be plated 200 a of the object to be plated 200 , which is electrically connected to the cathode of the DC conversion power supply 5 , and hence, it is possible to form a plating film only at the portion to be plated 200 a with which the plating-solution-impregnated fabric 1 comes into contact. Therefore, masking work, in which portions other than the portion to be plated are protected by a masking material, is not required, and it is possible to selectively form a plating film only on the surface of the portion of the object to be plated 200 .
  • the annular part 2 has a mesh shape.
  • the first rotary part 3 includes the protruding portions 32
  • the second rotary part 4 includes the protruding portions 42
  • the protruding portions 32 and 42 each have a smaller width than the width of the openings of the annular part 2 .
  • the protruding portions 32 and 42 fit into the openings of the annular part 2 when the first rotary part 3 and the second rotary part 4 rotate. Therefore, it is possible to generate a frictional force between the annular part 2 and the first rotary part 3 and between the annular part 2 and the second rotary part 4 and hence, the annular part 2 can be turned in the annular direction in synchronization with the rotation of the first rotary part 3 and the second rotary part 4 .
  • the plating-solution-impregnated fabric 1 includes the folded-back portions 1 a obtained by folding back the edges of the annular shape of the plating-solution-impregnated fabric 1 .
  • the folded-back portions 1 a are hooked on the edges of the annular shape of the annular part 2 , and are fixed by the fixing parts 20 . Therefore, the plating-solution-impregnated fabric 1 can be surely caused to be in close contact with the annular part 2 .
  • the plating electrode 100 according to Embodiment 1 further includes the plating solution supplier 7 disposed on a turning path along which the plating-solution-impregnated fabric 1 turns, and the plating solution supplier 7 is configured to supply the plating solution 70 to the plating-solution-impregnated fabric 1 . Therefore, in the plating electrode 100 and the plating method according to Embodiment 1, the plating solution 70 can be supplied to the plating-solution-impregnated fabric 1 while plating treatment is performed. Accordingly, a shortage of the plating solution 70 in the plating-solution-impregnated fabric 1 can be averted so that a loss of quality of a plating film is averted.
  • FIG. 6 is a block diagram of constituent elements used in modification 1 of the plating method according to Embodiment 1.
  • movement of the holder 8 which holds the plating electrode 100 , is operated by use of an operation mechanism 80 and, on the basis of the measured value from a load measurer configured to measure a load of the plating electrode 100 , the operation mechanism 80 is controlled such that the contact pressure of the plating-solution-impregnated fabric 1 that is caused to come into contact with the portion to be plated 200 a is at the target contact pressure set in advance.
  • the operation mechanism 80 is formed to include the arm of a robot or other mechanism, and is connected to the holder 8 .
  • the operation mechanism 80 is controlled by a controller 81 .
  • the controller 81 include an arithmetic unit, such as a microcomputer and a CPU, and software executed on the arithmetic unit, for example.
  • the controller 81 may be hardware, such as a circuit device, that can achieve the functions of the controller 81 .
  • a force sensor is preferably used as a load measurer 82 .
  • another configuration may be adopted.
  • the load measurer 82 formed by a force sensor is incorporated in the operation mechanism 80 .
  • FIG. 7 is a flowchart of modification 1 of the plating method according to Embodiment 1.
  • the controller 81 drives the motor 6 to rotate the second rotary part 4 , thereby turning the plating-solution-impregnated fabric 1 in the annular direction.
  • the controller 81 controls the operation mechanism 80 to cause the plating-solution-impregnated fabric 1 to come into contact with the portion to be plated 200 a of the object to be plated 200 .
  • step S 101 and step S 102 may be performed in the opposite order.
  • the motor 6 may be driven to turn the plating-solution-impregnated fabric 1 in the annular direction.
  • step S 103 the controller 81 determines whether the measured value measured by the load measurer 82 is less than or equal to the lower limit value set in advance.
  • the controller 81 advances to step S 104 where the plating electrode 100 is moved toward the object to be plated 200 by controlling the operation mechanism 80 to adjust the contact pressure.
  • the controller 81 returns again to step S 103 where the controller 81 determines whether the measured value measured by the load measurer 82 is less than or equal to the lower limit value set in advance.
  • step S 105 the controller 81 determines whether the measured value measured by the load measurer 82 is more than or equal to the upper limit value set in advance.
  • the controller 81 advances to step S 106 where the plating electrode 100 is moved away from the object to be plated 200 by controlling the operation mechanism 80 to adjust the contact pressure. Then, the controller 81 returns again to step S 105 where the controller 81 determines whether the measured value measured by the load measurer 82 is more than or equal to the upper limit value set in advance.
  • step S 105 When the controller 81 determines in step S 105 that the measured value measured by the load measurer 82 is more than or equal to the upper limit value set in advance, the controller 81 advances to step S 107 .
  • step S 107 the controller 81 determines whether the plating time period has elapsed for the target time period set in advance.
  • the controller 81 returns again to step S 103 where the controller 81 determines whether the measured value measured by the load measurer 82 is less than or equal to the lower limit value set in advance.
  • step S 107 when the controller 81 determines in step S 107 that the plating time period has elapsed for the target time period set in advance, the controller 81 advances to step S 108 where the controller 81 causes driving of the motor 6 to stop to end the turning of the plating-solution-impregnated fabric 1 .
  • FIG. 8 is a block diagram of constituent elements used in modification 2 of the plating method according to Embodiment 1. In the plating method of modification 2 shown in FIG.
  • a notifier 83 is caused to issue a notification for whether the contact pressure of the plating-solution-impregnated fabric 1 that is caused to come into contact with the portion to be plated 200 a is at the target contact pressure set in advance.
  • the operation mechanism 80 of modification 2 is formed to include a grip portion that can be manually operated by the operator, and the holder 8 is gripped at the grip portion.
  • a load cell for example, is preferably used as the load measurer 82 , other configurations may be adopted.
  • the notifier 83 is controlled by the controller 81 on the basis of the measured value measured by the load measurer 82 .
  • the notifier 83 may be a lamp, a buzzer, or a vibration, for example. In the case in which the notifier 83 is a lamp, a notification is issued by turning on or blinking the lamp. In the case in which the notifier 83 is a buzzer, a notification is issued by buzzer sound. In the case in which the notifier 83 is a vibration, a notification is issued by vibrations.
  • the notifier 83 may be configured to display the contact pressure as a numerical value.
  • FIG. 9 is a flowchart of modification 2 of the plating method according to Embodiment 1.
  • the motor 6 is driven to rotate the second rotary part 4 , thereby turning the plating-solution-impregnated fabric 1 in the annular direction.
  • the controller 81 controls the operation mechanism 80 such that the plating-solution-impregnated fabric 1 is caused to come into contact with the portion to be plated 200 a of the object to be plated 200 .
  • step S 201 and step S 202 may be performed in the opposite order. That is, after the plating-solution-impregnated fabric 1 is caused to come into contact with the portion to be plated 200 a of the object to be plated 200 by controlling the operation mechanism 80 , the motor 6 may be driven to turn the plating-solution-impregnated fabric 1 in the annular direction.
  • step S 203 the controller 81 determines whether the measured value measured by the load measurer 82 is less than or equal to the lower limit value set in advance.
  • the controller 81 advances to step S 204 where the controller 81 causes the lamp, which is the notifier 83 , to blink to notify that the contact pressure is not at the target contact pressure.
  • the controller 81 returns again to step S 203 where the controller 81 determines whether the measured value measured by the load measurer 82 is less than or equal to the lower limit value set in advance.
  • step S 205 the controller 81 determines whether the measured value measured by the load measurer 82 is more than or equal to the upper limit value set in advance.
  • the controller 81 advances to step S 206 where the controller 81 causes the lamp, which is the notifier 83 , to blink to notify that the contact pressure is not at the target contact pressure. Then, the controller 81 returns again to step S 205 where the controller 81 determines whether the measured value measured by the load measurer 82 is more than or equal to the upper limit value set in advance.
  • step S 205 When the controller 81 determines in step S 205 that the measured value measured by the load measurer 82 is more than or equal to the upper limit value set in advance, the controller 81 advances to step S 207 .
  • step S 205 to notify that the contact pressure of the plating electrode 100 that is caused to come into contact with the portion to be plated 200 a is at the target contact pressure, the controller 81 causes the lamp, which is the notifier 83 , to be turned on. With such a configuration, the operator can be notified that the contact pressure of the plating-solution-impregnated fabric 1 that is caused to come into contact with the portion to be plated 200 a is at the target contact pressure.
  • step S 208 the controller 81 determines whether the plating time period has elapsed for the target time period set in advance.
  • the controller 81 determines whether the plating time period has elapsed for the target time period set in advance.
  • the controller 81 returns again to step S 203 where the controller 81 determines whether the measured value measured by the load measurer 82 is less than or equal to the lower limit value set in advance.
  • the controller 81 advances to step S 209 where the controller 81 causes driving of the motor 6 to stop to end the turning of the plating-solution-impregnated fabric 1 .
  • the plating electrode 100 is caused to come into contact with the portion to be plated 200 a by the operator as follows.
  • the operator operates the operation mechanism 80 while observing the measured value from the load measurer 82 to achieve a proper contact pressure.
  • FIG. 10 is a block diagram of constituent elements used in modification 3 of the plating method according to Embodiment 1.
  • the rotation frequency of the motor 6 is measured by use of a rotation frequency measurer 84 and, on the basis of the measured value from the rotation frequency measurer 84 , the motor 6 is controlled such that the rotation frequency of the motor 6 is at the target rotation frequency set in advance.
  • the turning speed at which the plating-solution-impregnated fabric 1 turns is adjusted by controlling the rotation frequency of the second rotary part 4 such that the sliding speed at which the plating-solution-impregnated fabric 1 is slid against the object to be plated 200 is maintained at a constant value.
  • an encoder for example, is preferably used as the rotation frequency measurer 84 , other configurations may be adopted.
  • FIG. 11 is a flowchart of modification 3 of the plating method according to Embodiment 1.
  • the controller 81 drives the motor 6 to rotate the second rotary part 4 , thereby turning the plating-solution-impregnated fabric 1 in the annular direction.
  • step S 302 the plating-solution-impregnated fabric 1 is caused to come into contact with the portion to be plated 200 a of the object to be plated 200 by controlling the operation mechanism 80 .
  • the operation mechanism 80 may be formed to include the arm of a robot or other mechanism, or may be formed to include a grip portion that can be manually operated by the operator.
  • step S 301 and step S 302 may be performed in the opposite order.
  • the motor 6 may be driven to turn the plating-solution-impregnated fabric 1 in the annular direction.
  • step S 303 the controller 81 determines whether the measured value measured by the rotation frequency measurer 84 is less than or equal to the lower limit value set in advance.
  • the controller 81 advances to step S 304 where the controller 81 increases the rotation frequency of the motor 6 to increase the sliding speed at which the plating-solution-impregnated fabric 1 is slid against the object to be plated 200 .
  • the controller 81 returns again to step S 303 where the controller 81 determines whether the measured value measured by the rotation frequency measurer 84 is less than or equal to the lower limit value set in advance.
  • step S 303 When the controller 81 determines in step S 303 that the measured value measured by the rotation frequency measurer 84 is less than or equal to the lower limit value set in advance, the controller 81 advances to step S 305 .
  • step S 305 the controller 81 determines whether the measured value measured by the rotation frequency measurer 84 is more than or equal to the upper limit value set in advance.
  • the controller 81 advances to step S 306 where the controller 81 reduces the rotation frequency of the motor 6 to reduce the sliding speed at which the plating-solution-impregnated fabric 1 is slid against the object to be plated 200 .
  • step S 305 the controller 81 determines whether the measured value measured by the rotation frequency measurer 84 is more than or equal to the upper limit value set in advance.
  • step S 305 When the controller 81 determines in step S 305 that the measured value measured by the rotation frequency measurer 84 is more than or equal to the upper limit value set in advance, the controller 81 advances to step S 307 .
  • step S 307 the controller 81 determines whether the plating time period has elapsed for the target time period set in advance.
  • the controller 81 returns again to step S 303 where the controller 81 determines whether the measured value measured by the rotation frequency measurer 84 is less than or equal to the lower limit value set in advance.
  • step S 307 when the controller 81 determines in step S 307 that the plating time period has elapsed for the target time period set in advance, the controller 81 advances to step S 308 where the controller 81 causes driving of the motor 6 to stop to end the turning of the plating-solution-impregnated fabric 1 .
  • FIG. 12 is a diagram schematically illustrating a part of the plating electrode according to Embodiment 2.
  • FIG. 13 is a diagram schematically illustrating a state in which a plating-solution-impregnated fabric is caused to come into contact with an object to be plated by moving the plating electrode from the state shown in FIG. 12 .
  • FIG. 12 is a diagram schematically illustrating a part of the plating electrode according to Embodiment 2.
  • FIG. 13 is a diagram schematically illustrating a state in which a plating-solution-impregnated fabric is caused to come into contact with an object to be plated by moving the plating electrode from the state shown in FIG. 12 .
  • FIG. 14 is a diagram schematically illustrating a state in which the plating-solution-impregnated fabric is caused to come into contact with the object to be plated by moving all of first movable contacts from the state shown in FIG. 12 .
  • Constituent elements identical to the corresponding constituent elements in Embodiment 1 are given the same reference signs, and the description of such constituent elements will be omitted when appropriate.
  • the plating electrode 101 according to Embodiment 2 shown in FIG. 12 is characterized in that one plating electrode 101 can form partial plating with a plurality of patterns.
  • the plating electrode 101 according to Embodiment 2 includes a movable contact group 9 and a tension adjuster 10 in addition to the components in the above-mentioned Embodiment 1.
  • a plating-solution-impregnated fabric 1 , an annular part 2 , a first rotary part 3 , a second rotary part 4 , a DC conversion power supply 5 , a motor 6 , a plating solution supplier 7 , and a holder 8 have configurations identical to the configurations of the corresponding components in Embodiment 1.
  • the movable contact group 9 and the tension adjuster 10 are disposed inside the annular part 2 together with the first rotary part 3 and the second rotary part 4 .
  • the movable contact group 9 are structured in which a plurality of first movable contacts 9 a , each of which is formed by a cylindrical body, are arranged in parallel along the annular direction of the annular part 2 in which the annular part 2 rotates.
  • the movable contact group 9 is formed by an aggregate of five first movable contacts 9 a .
  • the first movable contacts 9 a are made of a material that does not dissolve in or that does not easily dissolve in the plating solution, which is in use.
  • the first movable contacts 9 a are made of platinum (Pt), titanium-platinum (Ti—Pt), titanium-iridium oxide (Ti—IrO2), stainless steel (SUS), or carbon (C).
  • the first movable contacts 9 a are held by the holder 8 , for example, such that the first movable contacts 9 a are movable.
  • the first movable contacts 9 a can be moved toward an object to be plated 200 in the annular part 2 .
  • the movement of the first movable contacts 9 a is controlled by a control unit not shown in the drawing.
  • By moving the first movable contacts 9 a it is possible to push the plating-solution-impregnated fabric 1 against a portion to be plated 200 a such that the annular part 2 is located between the first movable contacts 9 a and the plating-solution-impregnated fabric 1 . It is possible to either move all of the first movable contacts 9 a of the movable contact group 9 , or to move only some of the first movable contacts 9 a of the movable contact group 9 .
  • the movable contact group 9 is not limited to the aggregate of the five first movable contacts 9 a . It is sufficient for the movable contact group 9 to include one or more first movable contacts 9 a .
  • the number of first movable contacts 9 a may be suitably changed depending on the purpose of use and the shape of the object to be plated 200 .
  • the shape of the first movable contacts 9 a is not limited to a cylindrical shape shown in the drawing.
  • the first movable contacts 9 a may have any shape provided that the first movable contacts 9 a do not inhibit the turning of the annular part 2 and the plating-solution-impregnated fabric 1 .
  • each first movable contact 9 a may be formed by a cylindrical body having a smooth surface, a semi-cylindrical body, a prism, or a thin plate, or may be formed by a cylindrical body or a spherical body having a mechanism that rotates about a shaft.
  • the first movable contact 9 a may have a shape that conforms to the shape of the portion to be plated 200 a . By adopting such a shape, it is possible to improve close contact between the plating-solution-impregnated fabric 1 and the portion to be plated 200 a during plating treatment.
  • the tension adjuster 10 is provided to maintain the tension of the plating-solution-impregnated fabric 1 and the tension of the annular part 2 at constant values.
  • the tension adjuster 10 is made of a material that does not dissolve in or that does not easily dissolve in the plating solution, which is in use.
  • the tension adjuster 10 is made of platinum (Pt), titanium-platinum (Ti—Pt), titanium-iridium oxide (Ti—IrO2), stainless steel (SUS), or carbon (C).
  • the tension adjuster 10 has a cylindrical shape having a mechanism that rotates about a shaft portion.
  • the tension adjuster 10 is disposed inside the annular part 2 in a state in which the outer surface of the cylindrical body is kept in contact with the inner surface of the annular part 2 .
  • the tension adjuster 10 may be formed by a cylindrical body having a smooth surface, a semi-cylindrical body, a prism, or a thin plate provided that the tension adjuster 10 does not inhibit the turning of the annular part 2 and the plating-solution-impregnated fabric 1 .
  • the number of tension adjusters 10 is not limited to one shown in the drawing, and may be suitably changed depending on the purpose of use and the shape of the object to be plated 200 .
  • the tension adjuster 10 is held by the holder 8 , for example, such that the tension adjuster 10 is movable.
  • the movement of the tension adjuster 10 is controlled by a control unit not shown in the drawing.
  • a configuration may be adopted in which the tension of the plating-solution-impregnated fabric 1 and the tension of the annular part 2 are maintained at constant values by moving either one of the first rotary part 3 or the second rotary part 4 or by moving both the first rotary part 3 and the second rotary part 4 .
  • a configuration may be adopted in which the first movable contacts 9 a are moved to the outside from the inside of the annular part 2 through the annular opening of the annular part 2 .
  • the tension adjuster 10 is caused to come into direct contact with the plating-solution-impregnated fabric 1 .
  • Embodiment 2 the plating method that uses the plating electrode 101 according to Embodiment 2 will be described. Also in the plating method of Embodiment 2, in the same manner as Embodiment 1, a degreasing step, an acid cleaning step, a neutralizing step, and a plating step are performed in this order.
  • a method for applying silver plating to a copper alloy material having high versatility as the target for plating treatment will be described as an example.
  • Post treatment and a water-washing step performed after the degreasing step, the acid cleaning step, the neutralizing step, and the plating step are substantially equal to corresponding steps in Embodiment 1. Further, conditions for plating treatment, such as a silver plating solution, current density, a plating time period, and the turning of the plating-solution-impregnated fabric 1 , are also substantially equal to corresponding conditions in Embodiment 1.
  • the plating electrode 101 of Embodiment 2 by moving the movable contact group 9 as shown in FIG. 14 when the plating-solution-impregnated fabric 1 is caused to come into contact with the portion to be plated 200 a , it is possible to change a contact region and a contact position. Specifically, in the plating electrode 101 , the first movable contacts 9 a are moved and caused to come into contact with the inner surface of the annular part 2 to cause a portion of the plating-solution-impregnated fabric 1 to protrude toward the portion to be plated 200 a together with the annular part 2 .
  • FIG. 14 shows a case in which all of the five first movable contacts 9 a are moved. By causing only the protruding portion of the plating-solution-impregnated fabric 1 to come into contact with the portion to be plated 200 a , it is possible to reduce a region where the plating film is formed.
  • FIG. 15 is a diagram schematically illustrating a state in which the plating-solution-impregnated fabric is caused to come into contact with the object to be plated by moving some of the first movable contacts from the state shown in FIG. 12 .
  • the area of a protruding portion of the plating-solution-impregnated fabric 1 can be reduced and hence, it is possible to reduce a contact area in which the plating-solution-impregnated fabric 1 comes into contact with the portion to be plated 200 a .
  • FIG. 15 shows a case in which, of the five first movable contacts 9 a arranged in parallel to each other, three first movable contacts 9 a that are disposed in the middle are moved.
  • FIG. 16 is a diagram schematically illustrating a state in which the plating-solution-impregnated fabric is caused to come into contact with the object to be plated by moving some of the first movable contacts from the state shown in FIG. 12 .
  • the plating electrode 101 by changing the first movable contacts 9 a to be moved as shown in FIG. 16 , a position of a protruding portion of the plating-solution-impregnated fabric 1 is changed and hence, it is possible to change a contact position at which the plating-solution-impregnated fabric 1 comes into contact with the portion to be plated 200 a .
  • first movable contacts 9 a shows a case in which, of the five first movable contacts 9 a arranged in parallel to each other, two first movable contacts 9 a disposed at the left end are moved.
  • the positions and the number of first movable contacts 9 a to be moved are not limited to the configurations shown in FIG. 15 and FIG. 16 , and may be suitably changed depending on the purpose of use, the shape of the object to be plated 200 and other features.
  • FIG. 17 is a diagram schematically illustrating a state in which the plating-solution-impregnated fabric is caused to come into contact with a curved surface of an object to be plated by moving the first movable contacts from the state shown in FIG. 12 .
  • FIG. 18 is a diagram schematically illustrating a state in which the plating-solution-impregnated fabric is caused to come into contact with a convex surface of an object to be plated by moving the first movable contacts from the state shown in FIG. 12 .
  • the portion to be plated 200 a has a curved surface as shown in FIG.
  • Each first movable contact 9 a is configured to adjust the contact pressure of the plating-solution-impregnated fabric 1 against the portion to be plated 200 a .
  • the contact pressure is adjusted by a control unit, for example. With such a configuration, it is possible to allow a plating film formed at the portion to be plated 200 a to have the target film thickness. It is preferable that the contact pressure be set to 0.25 kgf/cm 2 to 2.0 kgf/cm 2 .
  • the plating electrode 101 by turning the plating-solution-impregnated fabric 1 and by transmitting an electric current through the plating-solution-impregnated fabric 1 in a state in which the plating-solution-impregnated fabric 1 is caused to be in contact with the portion to be plated 200 a , it is possible to form a silver plating film at the portion to be plated 200 a .
  • the sliding speed at which the plating-solution-impregnated fabric 1 is slid against the object to be plated 200 fall within a range from 12.5 m/min to 17.5 m/min.
  • the movable contact group 9 is moved to separate the plating-solution-impregnated fabric 1 from the object to be plated 200 . Then, after post treatment is performed on the object to be plated 200 when necessary and a water-washing step is performed on the object to be plated 200 , the silver plating film can be formed.
  • the movable contact group 9 may be electrically connected to the anode of the DC conversion power supply 5 by use of, for example, a rotary connecting connector in which a rotary shaft and a rotary portion disposed on the periphery of the rotary shaft are electrically connected to each other.
  • a commercially available connector may be used in which conductivity of a rotary shaft and a rotary portion disposed on the periphery of the rotary shaft is ensured by use of, for example, a carbon brush, a mercury or gallium alloy, or a roller current collector.
  • the target for the plating treatment is not limited to a copper alloy material. Further, the kind of plating is not limited to silver plating.
  • the above-mentioned plating method is also applicable to formation of a plurality of plating layers, such as a case in which nickel plating is formed on an aluminum alloy material, which is the target for the plating treatment, and tin plating is further formed on the upper surface of the nickel plating.
  • the plating electrode 101 is mainly used in the plating step, the plating electrode 101 may also be used in the degreasing step, the acid cleaning step, and the neutralizing step.
  • the above-mentioned plating electrode 101 may also be used in the water-washing step performed between respective steps of the plating method.
  • the plating electrode 101 according to Embodiment 2 includes one or more first movable contacts 9 a and one or more tension adjusters 10 .
  • the one or more first movable contacts 9 a are disposed inside the annular part 2 and are configured to push the plating-solution-impregnated fabric 1 against the object to be plated 200 such that the annular part 2 is located between the one or more first movable contacts 9 a and the plating-solution-impregnated fabric 1 .
  • the one or more tension adjusters 10 are disposed inside the annular part 2 such that the one or more tension adjusters 10 are movable and are configured to maintain the tension of the plating-solution-impregnated fabric 1 and the tension of the annular part 2 at constant values.
  • the plating electrode 101 according to Embodiment 2 and the plating method that uses the plating electrode 101 can freely change the region in and the position at which the plating-solution-impregnated fabric 1 comes into contact with the portion to be plated 200 a and hence, the plating electrode 101 according to Embodiment 2 and the plating method that uses the plating electrode 101 can accommodate a plurality of partial plating patterns.
  • FIG. 19 is a diagram schematically illustrating a modification of the plating electrode according to Embodiment 2.
  • FIG. 20 is a diagram schematically illustrating a state in which the plating-solution-impregnated fabric is caused to come into contact with an object to be plated by moving some of the first movable contacts from the state shown in FIG. 19 .
  • the plating electrode 101 of Embodiment 2 shown in FIG. 19 is characterized by a configuration in which a second movable contact 9 b is provided outside the annular shape of the plating-solution-impregnated fabric 1 , and pushes the plating-solution-impregnated fabric 1 toward the inside of the annular shape.
  • the second movable contact 9 b has a configuration same as the configuration of the first movable contact 9 a disposed inside the annular part 2 .
  • the second movable contact 9 b is disposed between the movable contact group 9 and the portion to be plated 200 a .
  • FIG. 19 shows a case in which the second movable contact 9 b is disposed at a position facing the first movable contact 9 a that is disposed at the center of the five first movable contacts 9 a arranged in parallel to each other.
  • One second movable contact 9 b may be provided as shown in FIG. 19 , or two or more second movable contacts 9 b may be provided.
  • the first movable contacts 9 a disposed at both ends are moved and caused to come into contact with the inner side of the annular part 2 to cause a portion of the plating-solution-impregnated fabric 1 to protrude as shown in FIG. 20 .
  • a portion of the plating-solution-impregnated fabric 1 located between the first movable contacts 9 a which is moved, is pushed toward the inside of the annular part 2 by the second movable contact 9 b , thereby being prevented from coming into contact with the object to be plated 200 . That is, in the plating electrode 101 shown in FIG.
  • FIG. 21 is a diagram schematically illustrating the plating electrode according to Embodiment 3.
  • FIG. 22 is a diagram of the plating electrode according to Embodiment 3 as viewed in the direction shown by an arrow A in FIG. 21 .
  • Constituent elements identical to the corresponding constituent elements in Embodiment 1 are given the same reference signs, and the description of such constituent elements will be omitted when appropriate.
  • the plating electrode 102 according to Embodiment 3 is formed to include, as a plating solution supplier 7 , a plating tank 71 filled with a plating solution 70 .
  • a plating-solution-impregnated fabric 1 , an annular part 2 , a first rotary part 3 , a second rotary part 4 , a DC conversion power supply 5 , a motor 6 , and a holder 8 have configurations identical to the configurations of the corresponding components in Embodiment 1.
  • the plating tank 71 is disposed in a turning path in which the plating-solution-impregnated fabric 1 turns.
  • the plating-solution-impregnated fabric 1 which is turning, passes through the plating tank 71 so that the plating solution 70 is supplied to the plating-solution-impregnated fabric 1 .
  • the third rotary part 11 is disposed in the plating tank 71 .
  • the third rotary part 11 has a configuration identical to the configuration of the second rotary part 4 .
  • the third rotary part 11 is held by the holder 8 , for example.
  • the third rotary part 11 is provided inside the annular part 2 , and the outer surface of a rotary body of the third rotary part 11 is in contact with the inner surface of the annular part 2 .
  • a pressure adjuster 12 is provided between the first rotary part 3 and the third rotary part 11
  • a pressure adjuster 13 is provided between the second rotary part 4 and the third rotary part 11 .
  • the pressure adjusters 12 and 13 are held by the holder 8 , for example.
  • the pressure adjusters 12 and 13 are configured to apply adjusted pressure to the plating-solution-impregnated fabric 1 and the annular part 2 , which are turning.
  • the pressure adjuster 12 which is provided between the first rotary part 3 and the third rotary part 11 , is disposed in the annular part 2 , and is configured to apply a pressure toward the outside of the annular shape.
  • the pressure adjuster 13 which is provided between the second rotary part 4 and the third rotary part 11 , is disposed outside the annular shape of the plating-solution-impregnated fabric 1 , and is configured to apply a pressure toward the inside of the annular shape.
  • the operation mechanism is configured to adjust the contact pressure of the plating-solution-impregnated fabric 1 against the portion to be plated 200 a .
  • the contact pressure be set to 0.25 kgf/cm 2 to 2.0 kgf/cm 2 , for example.
  • the plating-solution-impregnated fabric 1 is turned and the DC conversion power supply 5 is brought into an on state to transmit an electric current and, thereafter, the plating-solution-impregnated fabric 1 is caused to come into contact with the portion to be plated 200 a .
  • the sliding speed at which the plating-solution-impregnated fabric 1 is slid against the object to be plated 200 fall within a range from 12.5 m/min to 17.5 m/min.
  • plating treatment can be performed while the plating solution 70 is supplied to the plating-solution-impregnated fabric 1 . Accordingly, it is unnecessary to additionally provide a step of immersing the plating-solution-impregnated fabric 1 in the plating solution 70 and hence, productivity can be improved. Further, a large amount of the plating solution 70 can be supplied to the plating-solution-impregnated fabric 1 and hence, it is possible to prevent plating defects, such as seizure, caused by a shortage of a plating solution.
  • the configuration of the above-mentioned Embodiment 2 may be applied to the plating electrode 102 according to Embodiment 3 and the plating method that uses the plating electrode 102 .
  • FIG. 23 is a perspective view schematically showing the plating electrode according to Embodiment 4.
  • the DC conversion power supply 5 and the plating solution supplier 7 shown in FIG. 1 are omitted.
  • Outline arrows c shown in FIG. 23 show rotation of the plating electrode 100 .
  • Outline arrows d shown in FIG. 23 show the moving direction in which the plating electrode 100 moves.
  • the plating electrode 100 used in the plating method according to Embodiment 4 has a configuration identical to the configuration of the plating electrode 100 described in Embodiment 1.
  • the plating method according to Embodiment 4 is performed in the case of forming a plating film 200 b in a region A that is larger than the area of a portion to be plated 200 a with which the plating-solution-impregnated fabric 1 comes into contact as shown in FIG. 23 .
  • a post treatment and a water-washing step are performed after a degreasing step, an acid cleaning step, a neutralizing step, and a plating step are performed in the same manner as Embodiment 1.
  • a plating solution used in plating treatment is the same as the plating solution used in Embodiment 1.
  • an operation mechanism not shown in the drawing is operated to move the holder 8 , thereby causing the plating-solution-impregnated fabric 1 brought into a turning state to come into contact with the portion to be plated 200 a .
  • An electric current starts to be transmitted through the plating-solution-impregnated fabric 1 at the moment when the plating-solution-impregnated fabric 1 comes into contact with the portion to be plated 200 a .
  • the sliding speed at which the plating-solution-impregnated fabric 1 is slid against the object to be plated 200 fall within a range from 12.5 m/min to 17.5 m/min.
  • the plating time period is calculated from current density, the target film thickness, the area in which the plating-solution-impregnated fabric 1 comes into contact with the object to be plated 200 , and the area of the region A in which the plating film 200 b is desired to be formed, for example, and the plating time period thus calculated is set. Specifically, the plating time period is set by use of the following relational expression (1).
  • t denotes the plating time period
  • T denotes the target film thickness
  • v denotes the valence of the plating metal ion
  • C denotes the Faraday constant
  • d denotes the density of plating metal
  • S denotes the area of the region A in which the plating film 200 b is desired to be formed
  • I denotes current density
  • s denotes the area in which the plating-solution-impregnated fabric 1 comes into contact with the object to be plated 200
  • A denotes the atomic weight of plating metal. Current density is obtained by dividing the electric current that flows at the time when a voltage is applied by the area in which the plating-solution-impregnated fabric 1 comes into contact with the object to be plated 200 .
  • the sliding speed at which the plating-solution-impregnated fabric 1 is slid against the object to be plated 200 changes at the time when the turning of the plating-solution-impregnated fabric 1 is started and at the time when the direction of the plating-solution-impregnated fabric 1 is changed.
  • the sliding speed at which the plating-solution-impregnated fabric 1 is slid significantly affects plating quality. A change in sliding speed may lead to a loss of plating quality.
  • the turning speed at which the plating-solution-impregnated fabric 1 turns is changed by changing the rotation frequency of the motor 6 according to a change in the moving speed at which the plating electrode 100 is moved caused by the operation of the operation mechanism.
  • the moving speed at which the plating electrode is moved reduces by 1 m/min, for example, by exercising control such that the turning speed at which the plating-solution-impregnated fabric 1 turns is increased by 1 m/min, it is possible to prevent a reduction in sliding speed.
  • the plating electrode 100 by rotating the plating electrode 100 with the operation mechanism by use of, as the axis, the vertical direction to the region A in which the plating film 200 b is desired to be formed, it is possible to change the sliding direction in which the plating-solution-impregnated fabric 1 is slid.
  • the sliding direction in which the plating electrode 100 is slid at fixed time intervals as described above anisotropy of the plating film resulting from the sliding direction can be reduced, thereby preventing variation in quality of plating films.
  • the operation mechanism is operated to move the holder 8 , thereby separating the plating-solution-impregnated fabric 1 from the object to be plated 200 . Then, after post treatment is performed on the object to be plated 200 when necessary and water-washing step is performed on the object to be plated 200 , the plating film 200 b can be obtained.
  • the region A in which the plating film 200 b is desired to be formed is not limited to a rectangular shape shown in FIG. 23 , and may have any of other shapes, such as a circular shape. Further, by operating the operation mechanism to change the moving direction in which the plating electrode 100 moves, the plating electrode 100 can be used to plate not only one flat surface, but also a region spanning a plurality of flat surfaces, and can also be applied to a curved surface.
  • Embodiment 3 may be applied to Embodiment 4.
  • the plating tank 71 provided in the path in which the plating-solution-impregnated fabric 1 turns in conjunction with the plating electrode 100 , it is possible to prevent a change in tension of and damage to the plating-solution-impregnated fabric 1 .
  • one plating electrode 100 can accommodate a case in which the plating film 200 b is formed in the region A larger than the area of the portion to be plated 200 a with which the plating-solution-impregnated fabric 1 comes into contact. Accordingly, it is unnecessary to prepare a plurality of plating electrodes and hence, a reduction in space and the omission of the step of exchanging the plating electrode 100 can be achieved, thereby improving productivity.
  • the turning speed at which the plating-solution-impregnated fabric 1 turns is adjusted by controlling the rotation frequency of the second rotary part 4 such that the sliding speed at which the plating-solution-impregnated fabric 1 is slid against the object to be plated 200 is maintained at a constant value and hence, it is possible to prevent a loss of plating quality caused by a change in sliding speed.
  • FIG. 24 is a diagram schematically illustrating the plating electrode according to Embodiment 5.
  • FIG. 25 is a diagram schematically illustrating modification 1 of the plating electrode according to Embodiment 5.
  • FIG. 26 is a diagram schematically illustrating modification 2 of the plating electrode according to Embodiment 5.
  • FIG. 27 is a diagram schematically illustrating modification 3 of the plating electrode according to Embodiment 5.
  • a plating-solution-impregnated fabric 1 of the plating electrode 103 according to Embodiment 5 is disposed such that the surface of the plating-solution-impregnated fabric 1 faces upward, and the surface of the plating-solution-impregnated fabric 1 facing upward is caused to come into contact with a portion to be plated 200 a of an object to be plated 200 .
  • the object to be plated 200 is disposed directly above the plating-solution-impregnated fabric 1 .
  • the portion to be plated 200 a of the object to be plated 200 is disposed in a state in which the portion to be plated 200 a faces downward to face the plating-solution-impregnated fabric 1 .
  • the plating-solution-impregnated fabric 1 , an annular part 2 , a first rotary part 3 , a second rotary part 4 , a DC conversion power supply 5 , a motor 6 , and a third rotary part 11 have configurations identical to the configurations of the corresponding components in Embodiments 1 to 4.
  • a plating solution supplier 7 is formed to include a plating tank 71 filled with a plating solution 70 .
  • the plating tank 71 is disposed in a turning path in which the plating-solution-impregnated fabric 1 turns and at a position below the object to be plated 200 .
  • the plating-solution-impregnated fabric 1 which is turning, passes through the plating tank 71 so that the plating solution 70 is supplied to the plating-solution-impregnated fabric 1 .
  • the third rotary part 11 is disposed in the plating tank 71 .
  • the third rotary part 11 has a configuration identical to the configuration of the second rotary part 4 .
  • the third rotary part 11 is provided inside the annular part 2 , and the outer surface of a rotary body of the third rotary part 11 is in contact with the inner surface of the annular part 2 .
  • the plating-solution-impregnated fabric 1 of the plating electrode 103 shown in FIG. 25 is disposed such that the surface of the plating-solution-impregnated fabric 1 faces in the horizontal direction, and the surface of the plating-solution-impregnated fabric 1 facing in the horizontal direction is caused to come into contact with the portion to be plated 200 a of the object to be plated 200 .
  • the portion to be plated 200 a of the object to be plated 200 is disposed in a state in which the portion to be plated 200 a faces in the horizontal direction to face the plating-solution-impregnated fabric 1 .
  • the configuration of the plating electrode 103 according to Embodiment 5 is not limited to the configuration shown in FIG. 24 and FIG. 25 .
  • the plating-solution-impregnated fabric 1 may be disposed such that the surface of the plating-solution-impregnated fabric 1 is inclined from the horizontal direction, and the surface of the plating-solution-impregnated fabric 1 inclined from the horizontal direction is caused to come into contact with the portion to be plated 200 a of the object to be plated 200 .
  • An inclination angle is 45 degrees from the horizontal direction, for example.
  • the plating electrode 103 allows the plating-solution-impregnated fabric 1 to be disposed in a state in which the plating-solution-impregnated fabric 1 faces in any of various directions according to the shape of the object to be plated 200 or components of the facility in which the plating electrode 103 is used.
  • the plating tank 71 is provided with solution scattering prevention walls 72 that cover the periphery of the plating-solution-impregnated fabric 1 .
  • the solution scattering prevention walls 72 are disposed along the surface of the plating-solution-impregnated fabric 1 from the wall portions of the plating tank 71 .
  • the solution scattering prevention walls 72 are provided to receive a plating solution that scatters during plating treatment and to return the received plating solution 70 to the plating tank 71 .
  • Any material, such as a resin material and stainless steel, may be used as the material of the solution scattering prevention wall 72 provided that the material is excellent in chemical resistance, has heat resistance against a plating treatment temperature, and does not produce a plating precipitation.
  • the plating electrode 103 described with reference to FIG. 24 is fixed at a predetermined position, and the object to be plated 200 is moved by use of the operation mechanism to cause the portion to be plated 200 a to come into contact with the plating-solution-impregnated fabric 1 .
  • the operation mechanism may be formed to include the arm of a robot or other mechanism, or may be formed to include a grip portion that can be manually operated by the operator. In the plating method shown in FIG.
  • the object to be plated 200 to which treatment is not yet performed is conveyed to the plating-solution-impregnated fabric 1 , the object to be plated 200 is caused to come into contact with the plating-solution-impregnated fabric 1 to perform plating treatment and, after the plating treatment is performed, the object to be plated 200 is conveyed to the next step.
  • This series of plating steps is performed only by the facility that conveys the object to be plated 200 .
  • the operation mechanism for the plating electrode 103 according to Embodiment 5 shown in FIG. 24 to FIG. 27 is configured to adjust the contact pressure of the plating-solution-impregnated fabric 1 against the portion to be plated 200 a .
  • the contact pressure be set to 0.25 kgf/cm 2 to 2.0 kgf/cm 2 , for example.
  • the plating-solution-impregnated fabric 1 is turned and the DC conversion power supply 5 is brought into an on state to transmit an electric current and, thereafter, the plating-solution-impregnated fabric 1 is caused to come into contact with the portion to be plated 200 a .
  • the sliding speed at which the plating-solution-impregnated fabric 1 is slid against the object to be plated 200 fall within a range from 12.5 m/min to 17.5 m/min.
  • plating treatment can be performed while the plating solution 70 is supplied to the plating-solution-impregnated fabric 1 . Accordingly, it is unnecessary to additionally provide a complicated step of supplying the plating solution 70 to the plating-solution-impregnated fabric 1 and a large amount of the plating solution 70 can be supplied to the plating-solution-impregnated fabric 1 and hence, it is possible to prevent plating defects, such as seizure, caused by a shortage of the plating solution 70 .
  • the plating tank 71 is located below the plating electrode 103 and hence, it is possible to easily collect the separated plating solution 70 and hence, a loss of the plating solution 70 can be kept to a minimum possible.
  • the object to be plated 200 is moved by use of the operation mechanism and hence, it is unnecessary to install an operation mechanism that matches the configuration of the plating electrode 103 so that the entire facility can be simplified.
  • Embodiments 1 to 4 may be applied to the plating electrode 103 according to Embodiment 5 and the plating method that uses the plating electrode 103 .
  • the operation mechanism is operated to move the object to be plated 200 , thereby causing the plating-solution-impregnated fabric 1 brought into a turning state to come into contact with the portion to be plated 200 a .
  • An electric current starts to be transmitted through the plating-solution-impregnated fabric 1 at the moment when the plating-solution-impregnated fabric 1 comes into contact with the portion to be plated 200 a .
  • the plating electrodes ( 100 , 101 , 102 , 103 ) and the plating methods that use the plating electrodes ( 100 , 101 , 102 , 103 ) have been described above with reference to Embodiments.
  • the plating electrodes ( 100 , 101 , 102 , 103 ) are not limited to the configurations of the above-described Embodiments.
  • the plating electrodes ( 100 , 101 , 102 , 103 ) shown in the drawing are merely examples, and may include other constituent elements.
  • the plating electrodes ( 100 , 101 , 102 , 103 ) include variations to which design changes or applications are normally added by those who are skilled in the art without departing from the technical concept.

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  • Chemical Kinetics & Catalysis (AREA)
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  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)
US18/554,085 2021-04-21 2022-04-05 Plating electrode and plating method that uses the plating electrode Pending US20240200222A1 (en)

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US3966581A (en) * 1974-10-16 1976-06-29 Auric Corporation Selective plating apparatus
JPS5157647A (ja) * 1974-11-18 1976-05-20 Nippon Steel Corp Peesutojohifukuzaino denkishintohifukuho
US4193847A (en) * 1978-09-05 1980-03-18 Polaroid Corporation Method of electrodeposition
JPS57200593A (en) * 1981-06-05 1982-12-08 Nippon Steel Corp Method of electrolysis treatment of steel band
JPS5887293A (ja) * 1981-11-19 1983-05-25 Yaskawa Electric Mfg Co Ltd メツキ装置
JPS58136795A (ja) * 1982-02-05 1983-08-13 Hitachi Ltd 部分電気めつき装置
JPS6112894A (ja) * 1984-06-28 1986-01-21 Nippon Steel Corp 電気めつき用電解槽
JPS63125691A (ja) * 1986-11-14 1988-05-28 Nippon Steel Corp 電気メツキ装置
JPH03226600A (ja) * 1990-01-31 1991-10-07 Kawasaki Steel Corp 金属材表面の電解処理方法及び装置
JP2000232078A (ja) * 1999-02-10 2000-08-22 Toshiba Corp メッキ方法及びメッキ装置
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