CN117136257A - 电镀电极和使用该电镀电极的电镀方法 - Google Patents

电镀电极和使用该电镀电极的电镀方法 Download PDF

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Publication number
CN117136257A
CN117136257A CN202280028475.4A CN202280028475A CN117136257A CN 117136257 A CN117136257 A CN 117136257A CN 202280028475 A CN202280028475 A CN 202280028475A CN 117136257 A CN117136257 A CN 117136257A
Authority
CN
China
Prior art keywords
plating
impregnated cloth
plated
contact
plating solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280028475.4A
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English (en)
Chinese (zh)
Inventor
大谷一誓
竹本洋平
三好启友
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of CN117136257A publication Critical patent/CN117136257A/zh
Pending legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10Electrodes, e.g. composition, counter electrode
    • C25D17/12Shape or form
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005Contacting devices
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06Suspending or supporting devices for articles to be coated
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • C25D21/12Process control or regulation
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02Electroplating of selected surface areas
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/04Electroplating with moving electrodes
    • C25D5/06Brush or pad plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)
CN202280028475.4A 2021-04-21 2022-04-05 电镀电极和使用该电镀电极的电镀方法 Pending CN117136257A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021-071550 2021-04-21
JP2021071550 2021-04-21
PCT/JP2022/017104 WO2022224817A1 (ja) 2021-04-21 2022-04-05 めっき電極及び該めっき電極を用いためっき方法

Publications (1)

Publication Number Publication Date
CN117136257A true CN117136257A (zh) 2023-11-28

Family

ID=83722265

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280028475.4A Pending CN117136257A (zh) 2021-04-21 2022-04-05 电镀电极和使用该电镀电极的电镀方法

Country Status (4)

Country Link
US (1) US20240200222A1 (https=)
JP (1) JP7561975B2 (https=)
CN (1) CN117136257A (https=)
WO (1) WO2022224817A1 (https=)

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3966581A (en) * 1974-10-16 1976-06-29 Auric Corporation Selective plating apparatus
JPS5157647A (ja) * 1974-11-18 1976-05-20 Nippon Steel Corp Peesutojohifukuzaino denkishintohifukuho
US4193847A (en) * 1978-09-05 1980-03-18 Polaroid Corporation Method of electrodeposition
JPS57200593A (en) * 1981-06-05 1982-12-08 Nippon Steel Corp Method of electrolysis treatment of steel band
JPS5887293A (ja) * 1981-11-19 1983-05-25 Yaskawa Electric Mfg Co Ltd メツキ装置
JPS58136795A (ja) * 1982-02-05 1983-08-13 Hitachi Ltd 部分電気めつき装置
JPS6112894A (ja) * 1984-06-28 1986-01-21 Nippon Steel Corp 電気めつき用電解槽
JPS63125691A (ja) * 1986-11-14 1988-05-28 Nippon Steel Corp 電気メツキ装置
JPH03226600A (ja) * 1990-01-31 1991-10-07 Kawasaki Steel Corp 金属材表面の電解処理方法及び装置
JP2000232078A (ja) * 1999-02-10 2000-08-22 Toshiba Corp メッキ方法及びメッキ装置
CA2649786A1 (en) * 2006-04-18 2007-10-25 Basf Se Electroplating device and method

Also Published As

Publication number Publication date
JPWO2022224817A1 (https=) 2022-10-27
US20240200222A1 (en) 2024-06-20
JP7561975B2 (ja) 2024-10-04
WO2022224817A1 (ja) 2022-10-27

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