JP7561975B2 - めっき電極及び該めっき電極を用いためっき方法 - Google Patents

めっき電極及び該めっき電極を用いためっき方法 Download PDF

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Publication number
JP7561975B2
JP7561975B2 JP2023516427A JP2023516427A JP7561975B2 JP 7561975 B2 JP7561975 B2 JP 7561975B2 JP 2023516427 A JP2023516427 A JP 2023516427A JP 2023516427 A JP2023516427 A JP 2023516427A JP 7561975 B2 JP7561975 B2 JP 7561975B2
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Japan
Prior art keywords
plating
plating solution
plated
impregnated cloth
contact
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JP2023516427A
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English (en)
Japanese (ja)
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JPWO2022224817A1 (https=
JPWO2022224817A5 (https=
Inventor
一誓 大谷
洋平 竹本
啓友 三好
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/04—Electroplating with moving electrodes
    • C25D5/06—Brush or pad plating

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)
JP2023516427A 2021-04-21 2022-04-05 めっき電極及び該めっき電極を用いためっき方法 Active JP7561975B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021071550 2021-04-21
JP2021071550 2021-04-21
PCT/JP2022/017104 WO2022224817A1 (ja) 2021-04-21 2022-04-05 めっき電極及び該めっき電極を用いためっき方法

Publications (3)

Publication Number Publication Date
JPWO2022224817A1 JPWO2022224817A1 (https=) 2022-10-27
JPWO2022224817A5 JPWO2022224817A5 (https=) 2023-09-25
JP7561975B2 true JP7561975B2 (ja) 2024-10-04

Family

ID=83722265

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023516427A Active JP7561975B2 (ja) 2021-04-21 2022-04-05 めっき電極及び該めっき電極を用いためっき方法

Country Status (4)

Country Link
US (1) US20240200222A1 (https=)
JP (1) JP7561975B2 (https=)
CN (1) CN117136257A (https=)
WO (1) WO2022224817A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4193847A (en) 1978-09-05 1980-03-18 Polaroid Corporation Method of electrodeposition
JP2000232078A (ja) 1999-02-10 2000-08-22 Toshiba Corp メッキ方法及びメッキ装置
JP2009534527A (ja) 2006-04-18 2009-09-24 ビーエーエスエフ ソシエタス・ヨーロピア 電解コーティング装置及び電解コーティング方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3966581A (en) * 1974-10-16 1976-06-29 Auric Corporation Selective plating apparatus
JPS5157647A (ja) * 1974-11-18 1976-05-20 Nippon Steel Corp Peesutojohifukuzaino denkishintohifukuho
JPS57200593A (en) * 1981-06-05 1982-12-08 Nippon Steel Corp Method of electrolysis treatment of steel band
JPS5887293A (ja) * 1981-11-19 1983-05-25 Yaskawa Electric Mfg Co Ltd メツキ装置
JPS58136795A (ja) * 1982-02-05 1983-08-13 Hitachi Ltd 部分電気めつき装置
JPS6112894A (ja) * 1984-06-28 1986-01-21 Nippon Steel Corp 電気めつき用電解槽
JPS63125691A (ja) * 1986-11-14 1988-05-28 Nippon Steel Corp 電気メツキ装置
JPH03226600A (ja) * 1990-01-31 1991-10-07 Kawasaki Steel Corp 金属材表面の電解処理方法及び装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4193847A (en) 1978-09-05 1980-03-18 Polaroid Corporation Method of electrodeposition
JP2000232078A (ja) 1999-02-10 2000-08-22 Toshiba Corp メッキ方法及びメッキ装置
JP2009534527A (ja) 2006-04-18 2009-09-24 ビーエーエスエフ ソシエタス・ヨーロピア 電解コーティング装置及び電解コーティング方法

Also Published As

Publication number Publication date
JPWO2022224817A1 (https=) 2022-10-27
US20240200222A1 (en) 2024-06-20
CN117136257A (zh) 2023-11-28
WO2022224817A1 (ja) 2022-10-27

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