US20220406571A1 - Substrate treating apparatus and substrate treating method - Google Patents

Substrate treating apparatus and substrate treating method Download PDF

Info

Publication number
US20220406571A1
US20220406571A1 US17/842,222 US202217842222A US2022406571A1 US 20220406571 A1 US20220406571 A1 US 20220406571A1 US 202217842222 A US202217842222 A US 202217842222A US 2022406571 A1 US2022406571 A1 US 2022406571A1
Authority
US
United States
Prior art keywords
substrate
space
treating apparatus
antenna
plasma
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
US17/842,222
Other languages
English (en)
Inventor
Yoon Seok Choi
Soon-Cheon Cho
Yun Sang Kim
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semes Co Ltd
Original Assignee
Semes Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semes Co Ltd filed Critical Semes Co Ltd
Assigned to SEMES CO., LTD. reassignment SEMES CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHO, SOON-CHEON, CHOI, YOON SEOK, KIM, YUN SANG
Publication of US20220406571A1 publication Critical patent/US20220406571A1/en
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H01J37/32449—Gas control, e.g. control of the gas flow
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32192—Microwave generated discharge
    • H01J37/32211—Means for coupling power to the plasma
    • H01J37/3222—Antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32192—Microwave generated discharge
    • H01J37/32311—Circuits specially adapted for controlling the microwave discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32422—Arrangement for selecting ions or species in the plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/64—Heating using microwaves
    • H05B6/72—Radiators or antennas
    • H05B6/725—Rotatable antennas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/64—Heating using microwaves
    • H05B6/80—Apparatus for specific applications
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/334—Etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/335—Cleaning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/64—Heating using microwaves
    • H05B6/72—Radiators or antennas

Definitions

  • the present invention relates to a substrate treating apparatus and a substrate treating method.
  • Plasma may be used in a treatment process of the substrate.
  • plasma may be used for etching, deposition, or dry cleaning processes.
  • Plasma is generated by a very high temperature, a strong electric field, or a high-frequency electromagnetic field (RF electromagnetic field), and the plasma refers to an ionized gas state composed of ions, electrons, radicals, etc.
  • Dry cleaning, ashing, or etching processes using plasma are performed when ions or radical particles included in plasma collide with a substrate.
  • the dry cleaning process is a process for removing a natural oxide film formed on the substrate, and a thin film to be removed is very thin compared to the etching process.
  • Korean Patent Application Laid-Open No. 10-2011-0057510 discloses an apparatus for treating a substrate by using plasma mainly containing only radicals excluding electrons and ions by using a grounded ion blocker.
  • the present invention has been made in an effort to provide a substrate treating apparatus capable of efficiently treating a substrate.
  • the present invention has also been made in an effort to provide a substrate treating apparatus capable of improving an UPH per unit time.
  • the present invention has also been made in an effort to provide a substrate treating apparatus capable of reducing a footprint of equipment.
  • An exemplary embodiment of the present invention provides a substrate treating apparatus, including: a process chamber in which an inner space for treating a substrate is formed; an ion blocker for dividing the inner space into a plasma generating space and a treatment space; a substrate support unit for supporting a substrate in the treatment space; an exhaust unit for exhausting the treatment space; an anneal source positioned above the ion blocker and transmitting energy for annealing to the substrate through the ion blocker; and a gas supply unit for supplying process gas to the plasma generating space, in which the ion blocker includes: a body which is shaped like a disk, is made of a material through which microwaves are transmittable, and is formed with a plurality of through-holes; and a transparent conductive oxide film provided on at least one of an upper surface and a lower surface of the body in a first thickness or less.
  • the transparent conductive oxide film may be formed of any one or a mixture of one or more of AZO, FTO, ATO, SnO 2 , ZnO, IrO 2 , RuO 2 , graphene, metal nanowire, and CNT, or by multiple overlapping thereof.
  • the ion blocker may be grounded.
  • the body may be made of a quartz material.
  • the anneal source may include: an antenna unit including an antenna disposed on one side of the plasma generating space, and a transmission plate positioned between the antenna and the plasma generating space; and a microwave application unit for applying set microwaves to the antenna unit.
  • the anneal source may be a lamp or an optical system for delivering a laser.
  • the substrate treating apparatus may further include: a plasma source for applying energy for exciting the process gas that has been applied to the plasma generating space into plasma to the plasma generating space; and a controller, in which when the substrate is loaded into the treatment space and an atmosphere of the treatment space is changed to a first atmosphere, the controller may perform a first process by exciting the process gas into plasma in the plasma generating space by controlling controls the gas supply unit and the plasma source.
  • the substrate treating apparatus may further include a controller, in which the controller may block supply of the process gas by the gas supply unit in the state where the substrate is continuously supported in the substrate support unit, and apply energy for the annealing to the substrate by controlling the anneal source.
  • the energy for the annealing may be a first microwave.
  • the first thickness may be 1 ⁇ m.
  • Another exemplary embodiment of the present invention provides a substrate treating method, including: a first process of exciting process gas into plasma and treating a substrate with radicals that have passed through an ion blocker that blocks ions in the plasma; and a second process of applying first energy that has transmitted through the ion blocker to the substrate, in which the ion blocker is made of a material through which light, heat, and microwaves are transmittable.
  • the first process and the second process may be performed in one chamber.
  • the ion blocker may be grounded.
  • the ion blocker may include: a body which is shaped like a disk and is made of a material through which light, heat, and microwaves are transmittable; and a transparent conductive oxide film coated on at least one of an upper surface and a lower surface of the body in a first thickness or less.
  • the transparent conductive oxide film may be formed of any one or a mixture of one or more of AZO, FTO, ATO, SnO 2 , ZnO, IrO 2 , RuO 2 , graphene, metal nanowire, and CNT, or by multiple overlapping thereof.
  • the first thickness may be 1 ⁇ m.
  • the application of the first energy may be performed in a state where the supply of the process gas is blocked.
  • the first energy may anneal the substrate.
  • the body may be made of a quartz material.
  • Still another exemplary embodiment of the present invention provides a substrate treating apparatus, including: a process chamber in which an inner space for treating a substrate is formed; an ion blocker which is shaped like a disk, is formed with a plurality of through-holes, is grounded, and divides the inner space into a plasma generating space and a treatment space; a substrate support unit for supporting a substrate in the treatment space; an exhaust unit for exhausting the treatment space; an antenna unit including an antenna plate disposed above the ion blocker and a transmission plate positioned under the antenna plate; an microwave application unit for applying set microwaves to the antenna unit; and a gas supply unit for supplying process gas to the plasma generating space, in which the ion blocker includes: a body made of a quartz material; and the transparent conductive oxide film is formed of any one or a mixture of one or more of AZO, FTO, ATO, SnO 2 , ZnO, IrO 2 , RuO 2 , graphene, metal nanowire, and CNT,
  • FIG. 1 is a cross-sectional view illustrating a substrate treating apparatus according to an exemplary embodiment (a first exemplary embodiment) of the present invention.
  • FIG. 2 is a cross-sectional view illustrating an operation when the substrate treating apparatus according to the exemplary embodiment (the first exemplary embodiment) of the present invention performs a plasma treatment.
  • FIG. 3 is a cross-sectional view illustrating an operation when the substrate treating apparatus according to the exemplary embodiment (the first exemplary embodiment) of the present invention performs an annealing treatment.
  • FIG. 4 is an enlarged view of a portion of the ion blocker 530 according to the exemplary embodiment of the present invention.
  • FIG. 5 is a cross-sectional view illustrating a substrate treating apparatus according to an exemplary embodiment (a second exemplary embodiment) of the present invention.
  • FIG. 6 is a cross-sectional view illustrating an operation when the substrate treating apparatus according to the exemplary embodiment (the second exemplary embodiment) of the present invention performs a plasma treatment.
  • FIG. 7 is a cross-sectional view illustrating an operation when the substrate treating apparatus according to the exemplary embodiment (the second exemplary embodiment) of the present invention performs an annealing treatment.
  • FIG. 8 is a cross-sectional view illustrating a substrate treating apparatus according to an exemplary embodiment (a third exemplary embodiment) of the present invention.
  • FIG. 9 is a cross-sectional view illustrating a substrate treating apparatus according to an exemplary embodiment (a fourth exemplary embodiment) of the present invention.
  • FIG. 10 is a cross-sectional view illustrating a substrate treating apparatus according to an exemplary embodiment (a fifth exemplary embodiment) of the present invention.
  • the exemplary embodiment of the present invention may be modified in various forms, and the scope of the present invention should not be construed as being limited to the following exemplary embodiments.
  • the present exemplary embodiment is provided to more completely explain the present invention to those skilled in the art. Therefore, the shapes of elements in the drawings are exaggerated to emphasize clearer descriptions.
  • FIG. 1 is a cross-sectional view illustrating a substrate treating apparatus according to an exemplary embodiment of the present invention. This will be described with reference to FIG. 1 .
  • a substrate treating apparatus 10 includes a process chamber 100 , a substrate support unit 200 , a microwave application unit 400 , a controller 600 , and an exhaust baffle 700 .
  • the process chamber 100 provides a treatment space 102 in which the substrate W is treated.
  • the process chamber 100 is provided in a circular cylindrical shape.
  • the process chamber 100 is provided with a metal material.
  • the process chamber 100 may be made of an aluminum material.
  • An opening 130 is formed in one sidewall of the process chamber 100 .
  • the opening 130 is provided as an entrance 130 through which a substrate W can be carried in and out.
  • the entrance 130 may be opened and closed by a door 140 .
  • An exhaust port 150 is installed on a bottom surface of the process chamber 100 .
  • the exhaust port 150 is positioned to coincide with the central axis of the process chamber 100 .
  • the exhaust port 150 serves as a discharge port 150 through which byproducts generated in the treatment space 102 are discharged to the outside of the process chamber 100 .
  • the substrate support unit 200 supports the substrate W in the treatment space.
  • the substrate support unit 200 may be provided as an electrostatic chuck (ESC) for supporting the substrate W by using electrostatic force.
  • ESC electrostatic chuck
  • the substrate support unit 200 may support the substrate W in various ways, such as mechanical clamping.
  • the support unit 200 includes a dielectric plate 210 , a focus ring 252 , an edge ring 254 , and a lower electrode 230 .
  • the substrate W is directly placed on the upper surface of the dielectric plate 210 .
  • the dielectric plate 210 is provided in a disk shape.
  • the dielectric plate 210 may have a smaller radius than that of the substrate W.
  • a chucking electrode 212 is installed inside the dielectric plate 210 .
  • a power supply (not illustrated) is connected to the chucking electrode 212 , and receives a voltage from a power supply (not illustrated).
  • the chucking electrode 212 provides electrostatic force so that the substrate W is adsorbed to the dielectric plate 210 from the applied voltage.
  • a heater 214 for heating the substrate W is installed inside the dielectric plate 210 .
  • the heater 214 may be positioned below the chucking electrode 212 .
  • the heater 214 may be provided as a spiral-shaped coil.
  • the dielectric plate 210 may be made of a ceramic material.
  • the lower electrode 230 supports the dielectric plate 210 .
  • the lower electrode 230 is positioned under the dielectric plate 210 and is fixedly coupled to the dielectric plate 210 .
  • the upper surface of the lower electrode 230 has a stepped shape such that the central region thereof is higher than the edge region.
  • the lower electrode 230 has an area in which the central region of the upper surface corresponds to the lower surface of the dielectric plate 210 .
  • a cooling passage 232 is formed in the lower electrode 230 .
  • the cooling passage 232 is provided as a passage through which a cooling fluid circulates.
  • the cooling passage 232 may be provided in a spiral shape inside the lower electrode 230 .
  • the lower electrode 230 may be connected to an external high-frequency power supply or may be grounded. The high-frequency power supply may apply power to the lower electrode 230 and control ion energy incident on the substrate.
  • the lower electrode 230 may be made of a metal material.
  • a focus ring 252 concentrates the plasma to the substrate W.
  • the focus ring 252 is provided in an annular ring shape surrounding the dielectric plate 210 .
  • the focus ring 252 is positioned at an edge region of the dielectric plate 210 .
  • the focus ring 250 may be made of a conductive material.
  • the upper surface of the focus ring 252 may be provided to be stepped.
  • the inner portion of the upper surface of the focus ring 252 is provided to have the same height as the upper surface of the dielectric plate 210 to support the edge region of the bottom surface of the substrate W.
  • the edge ring 254 is provided in an annular ring shape surrounding the focus ring 252 .
  • the edge ring 254 is positioned adjacent to the focus ring 252 in the edge region of the lower electrode 230 .
  • the upper surface of the edge ring 254 is provided with a higher height than the upper surface of the focus ring 252 .
  • the edge ring 254 may be provided with an insulating material.
  • the microwave application unit 400 is provided as an example of a plasma source that applies microwaves to a reaction space 101 of the process chamber 100 to excite gas in the reaction space 101 into plasma.
  • the microwave application unit 400 may generate plasma by exciting the process gas.
  • the microwave application unit 400 includes a microwave power supply 410 , a waveguide 420 , a microwave antenna 430 , a dielectric plate 470 , a cooling plate 480 , and a transmission plate 490 .
  • the microwave power supply 410 generates microwaves.
  • the waveguide 420 is connected to the microwave power supply 410 , and provides a path through which the microwave generated in the microwave power supply 410 is transferred.
  • the microwave antenna 430 is positioned inside the front end of the waveguide 420 .
  • the microwave antenna 430 applies the microwave transferred through the waveguide 420 into the process chamber 100 .
  • the microwave antenna 430 may receive power applied by the microwave power supply 410 and apply the power to the reaction space 101 .
  • the microwave may be a microwave of predetermined power with a frequency of 2.45 GHz.
  • the power applied to the microwave power source 410 may be several to several tens of kW.
  • the microwave antenna 430 includes an antenna plate 431 , an antenna rod 433 , an external conductor 434 , a microwave adapter 436 , a connector 441 , a cooling plate 443 , and an antenna height adjusting unit 445 .
  • the antenna plate 431 is provided as a thin disk, and a plurality of slot holes 432 are formed.
  • the slot holes 432 provide passages through which the microwaves pass.
  • the slot holes 432 may be provided in various shapes.
  • the slot holes 432 may be provided in the shape of ‘X’, ‘+’, ‘ ⁇ ’, or the like.
  • the slot holes 432 may be combined with each other and arranged in a plurality of ring shapes.
  • the rings have the same center, and different radii.
  • the antenna rod 433 is provided as a cylindrical rod.
  • the antenna rod 433 is disposed so that the longitudinal direction is the vertical direction.
  • the antenna rod 433 is positioned above the antenna plate 431 , and a lower end thereof is inserted and fixed to the center of the antenna plate 431 .
  • the antenna rod 433 propagates the microwaves to the antenna plate 431 .
  • the external conductor 434 is located below the front end of the waveguide 420 .
  • a space connected with the inner space of the waveguide 420 is formed in the vertical direction inside the external conductor 434 .
  • a partial region of the antenna rod 433 is positioned inside the external conductor 434 .
  • a microwave adaptor 436 is located inside the front end of the wave guide 420 .
  • the microwave adaptor 436 has a cone shape in which an upper end has a larger radius than that of the lower end.
  • An accommodating space with an open bottom surface is formed at the lower end of the microwave adapter 436 .
  • the connector 441 is positioned in the accommodating space.
  • the connector 441 is provided in a ring shape.
  • the outer surface of the connector 441 has a radius corresponding to the inner surface of the accommodating space.
  • the outer surface of the connector 441 is in contact with the inner surface of the accommodating space and is fixedly positioned.
  • the connector 441 may be made of a conductive material.
  • the upper end of the antenna rod 433 is located in the receiving space and is fitted into the inner region of the connector 441 .
  • the upper end of the antenna rod 433 is forcibly inserted into the connector 441 , and is electrically connected to the microwave adapter 436 through the connector 441 .
  • the cooling plate 443 is coupled to the upper end of the microwave adapter 436 .
  • the cooling plate 443 may be provided as a plate having a larger radius than that of the upper end of the microwave adapter 436 .
  • the cooling plate 443 may be made of a material having superior thermal conductivity than that of the microwave adapter 436 .
  • the cooling plate 443 may be formed of a copper (Cu) or aluminum (Al) material. The cooling plate 443 promotes cooling of the microwave adapter 436 to prevent thermal deformation of the microwave adapter 436 .
  • the antenna height adjusting unit 445 connects the microwave adaptor 436 and the antenna rod 433 . Then, the antenna height adjusting unit 445 moves the antenna rod 433 so that the relative height of the antenna plate 431 with respect to the microwave adapter 436 is changed.
  • the antenna height adjusting unit 445 includes a bolt. The bolt 445 is inserted into the microwave adapter 436 in the vertical direction from the top to the bottom of the microwave adapter 436 , and the lower end is located in the accommodating space. The bolt 445 is inserted into the center region of the microwave adaptor 436 . The lower end of the bolt 445 is inserted into the upper end of the antenna rod 433 .
  • a screw groove into which the lower end of the bolt 445 is inserted and fastened is formed in a predetermined length.
  • the antenna rod 433 moves in the vertical direction according to the rotation of the bolt 445 . For example, when the bolt 445 rotates in a clockwise direction, the antenna rod 433 may move up, and when the bolt 445 rotates in a counterclockwise direction, the antenna rod 433 may move down. With the movement of the antenna rod 433 , the antenna plate 431 may be moved in the vertical direction.
  • the dielectric plate 470 is positioned on the antenna plate 431 .
  • the dielectric plate 470 is provided with a dielectric material, such as alumina or quartz.
  • the microwaves propagated in the vertical direction from the microwave antenna 430 are propagated in the radial direction of the dielectric plate 470 .
  • the microwave propagated to the dielectric plate 470 has a compressed wavelength and is resonant.
  • the resonant microwave is transmitted through the slot holes 432 of the antenna plate 431 .
  • the cooling plate 480 is provided on the dielectric plate 470 .
  • the cooling plate 480 cools the dielectric plate 470 .
  • the cooling plate 480 may be made of an aluminum material.
  • the cooling plate 480 may cool the dielectric plate 470 by making the cooling fluid flow through a cooling passage (not illustrated) formed therein.
  • the cooling method includes a water cooling type and an air cooling type.
  • the transmission plate 490 is provided under the antenna plate 431 .
  • the transmission plate 490 is provided with a dielectric material, such as alumina or quartz. Microwaves passing through the slot holes 432 of the antenna plate 431 are radiated into the process chamber 100 through the transmission plate 490 . By the electric field of the radiated microwaves, the process gas supplied into the process chamber 100 is excited into a plasma state.
  • the upper surface of the transmission plate 490 may be spaced apart from the bottom surface of the antenna plate 431 by a predetermined interval.
  • the antenna height adjusting unit 445 may vertically move the antenna rod 433 so that the relative height of the antenna plate 431 with respect to the microwave adapter 436 is changed.
  • the antenna height adjusting unit 445 may move the antenna rod 433 in the vertical direction to maintain an appropriate interval between the antenna plate 431 and the transmission plate 490 .
  • a plasma generating space 520 is formed between the transmission plate 490 and the ion blocker 530 .
  • the plasma generating space 520 is connected to the gas supply unit 300 that supplies the process gas.
  • the gas supply unit 300 includes a gas supply pipe 310 and a valve member 311 .
  • the process gas supplied by the gas supply unit may be provided as single component gas or mixed gas of two or more components.
  • the process gas introduced into the plasma generating space 520 is converted to a plasma state by the microwaves.
  • the process gas is decomposed into ions, electrons, and radicals in the plasma state.
  • the plasma passes through the ion blocker 530 and moves into the treatment space 102 .
  • the ion blocker 530 is provided by coating a Transparent Conductive Oxide (TCO) film on a body 531 .
  • TCO Transparent Conductive Oxide
  • the TCO film 532 is provided with a first thickness or less.
  • the first thickness is a thickness through which microwaves can transmit through the determined material.
  • the first thickness is different depending on the material determined as the TCO film 532 .
  • “can transmit” in the present description means that the transmission is not significantly affected.
  • the first thickness may be 1 ⁇ m.
  • the ion blocker 530 is provided in a plate shape.
  • the ion blocker 530 may have a flat plate shape. FIG.
  • the body 531 of the ion blocker 530 is provided with a microwave-transmittable material. Quartz may be provided as an example of the body 531 .
  • the TCO film 532 may be provided by being coated on the upper surface of the body 531 .
  • the TCO film 532 may be provided by being coated on the lower surface of the body 531 .
  • the TCO film 532 may be provided by being coated on the upper and lower surfaces of the body 531 .
  • the TCO film 532 is provided with a thickness through which microwaves for heating the substrate W are transmittable.
  • the TCO film 532 may be Indium Tin Oxide (ITO).
  • TCO may be formed of any one or more mixtures of AZO, FTO, ATO, SnO 2 , ZnO, IrO 2 , RuO 2 , graphene, metal nanowire, and CNT, or by multiple overlapping.
  • the ion blocker 530 is provided to be grounded. The ion blocker 530 blocks ions from passing through the ion blocker 530 and allows radicals to pass therethrough.
  • the TCO of the ion blocker 530 is provided with a thickness through which the microwaves are transmitted. The microwave applied by the microwave application unit 400 may pass through the ion blocker 530 .
  • a plurality of through-holes is formed in the ion blocker 530 .
  • the through-holes are formed in the vertical direction of the ion blocker 530 .
  • the bottom surface of the ion blocker 530 is exposed to the treatment space.
  • the ion blocker 530 is provided between the plasma generating space 520 and the treatment space 102 , and forms a boundary between the plasma generating space 520 and the treatment space 102 . Radicals of plasma generated in the plasma generating space 520 pass through the through-hole of the ion blocker 530 , and ions and electrons are blocked without moving to the treatment space 102 by the ion blocker 530 .
  • the ion blocker 530 is positioned above the substrate support unit 200 .
  • the ion blocker 530 is positioned to face the dielectric plate 210 .
  • the plasma passing through the ion blocker 530 is uniformly supplied to the treatment space 102 in the process chamber 100 .
  • the exhaust baffle 700 uniformly exhausts plasma for each region in the treatment space.
  • the exhaust baffle 700 is positioned between the inner wall of the process chamber 100 and the substrate support unit 200 in the treatment space 102 .
  • the exhaust baffle 700 is provided in an annular ring shape.
  • a plurality of through-holes 702 is formed in the exhaust baffle 700 .
  • the through-holes 702 are provided to face up and down.
  • the through-holes 702 are arranged along the circumferential direction of the exhaust baffle 700 .
  • the through-holes 702 have a slit shape, and have a longitudinal direction toward the radial direction of the exhaust baffle 700 .
  • the controller 600 may control the substrate treating apparatus.
  • the controller 600 may control at least one of the pressure reducing member 123 , the substrate support unit 200 , the gas supply unit 300 , and the microwave application unit 400 of the substrate treating apparatus so that the substrate treating apparatus is capable of performing a substrate treating method which is to be described below.
  • the controller 600 may include a process controller formed of a microprocessor (computer) executing the control of the substrate treating apparatus, a user interface formed of a keyboard through which an operator performs a command input manipulation and the like for managing the substrate treating apparatus, a display for visualizing and displaying an operation situation of the substrate treating apparatus, or the like, and a storage unit in which a control program for executing the processing executed in the substrate treating apparatus under the control of the process controller or various data and a program, that is, a processing recipe, for executing processing on each configuration according to processing conditions are stored.
  • the user interface and the storage unit may be connected to the process controller.
  • the treatment recipe may be stored in a storage medium in the storage unit, and the storage medium may be a hard disk, and may also be a portable disk, such as a CD-ROM or a DVD, or a semiconductor memory, such as a flash memory.
  • FIG. 2 is a cross-sectional view illustrating an operation when the substrate treating apparatus according to the exemplary embodiment of the present invention performs a plasma treatment that is a first process. This will be described with reference to FIG. 2 .
  • the door 140 is closed.
  • the process gas is supplied to the plasma generating space 520 by controlling the valve member 311 of the gas supply unit 300 to an open state.
  • microwaves are applied to the process gas by controlling the microwave power supply 410 to be turned on, and the process gas is excited into plasma.
  • Radicals R of the plasma are introduced into the treatment space 102 through the through-hole of the ion blocker 530 . Ions are blocked by the ion blocker 530 and do not pass through the through-hole.
  • the radical R introduced into the treatment space 102 treats the substrate W.
  • FIG. 3 is a cross-sectional view illustrating an operation when the substrate treating apparatus according to the exemplary embodiment of the present invention performs an annealing treatment that is a second process. This will be described with reference to FIG. 3 .
  • the microwave power supply 410 is controlled to be turned on to transmit microwaves for annealing to the substrate W.
  • the microwave is transmitted to the substrate W through the ion blocker 530 .
  • the microwaves transmitted to the substrate are microwaves capable of annealing the substrate W.
  • the valve member 311 of the gas supply unit 300 is controlled to a closed state.
  • FIG. 5 is a cross-sectional view illustrating a substrate treating apparatus according to an exemplary embodiment (a second exemplary embodiment) of the present invention. This will be described with reference to FIG. 5 .
  • the same configuration as that of the first exemplary embodiment is replaced with the description with reference to FIGS. 1 to 3 describing the first exemplary embodiment.
  • the plasma generating space 520 is defined by a cylindrical quartz chamber 630 .
  • An antenna 610 for generating a magnetic field in the plasma generating space 520 is wound around the outside of the plasma generating space 520 .
  • a cylindrical antenna is provided.
  • the antenna 610 is electrically connected to a power supply 640 .
  • a current from the power supply 640 flows through the antenna 610 , an electric field is formed in the plasma generating space 520 .
  • the electric field applied from the antenna 610 excites the process gas applied to the plasma generating space 620 into plasma.
  • the antenna 610 and the power supply 640 function as a plasma source.
  • FIG. 6 is a cross-sectional view illustrating an operation when the substrate treating apparatus according to the exemplary embodiment (the second exemplary embodiment) of the present invention performs a plasma treatment. This will be described with reference to FIG. 6 .
  • the door 140 is closed.
  • the process gas is supplied to the plasma generating space 520 by controlling the valve member 311 of the gas supply unit 300 to an open state.
  • a magnetic field is applied to the process gas by controlling the power supply 640 applied to the antenna 610 to be turned on, and the process gas is excited into plasma.
  • Radicals R of the plasma are introduced into the treatment space 102 through the through-hole of the ion blocker 530 . Ions are blocked by the ion blocker 530 and do not pass through the through-hole.
  • the radical R introduced into the treatment space 102 treats the substrate W.
  • FIG. 7 is a cross-sectional view illustrating an operation when the substrate treating apparatus according to the exemplary embodiment (the second exemplary embodiment) of the present invention performs an annealing treatment. This will be described with reference to FIG. 7 .
  • the microwave power supply 410 is controlled to be turned on to transmit microwaves for annealing to the substrate W.
  • the microwave is transmitted to the substrate W through the ion blocker 530 .
  • the microwaves transmitted to the substrate are microwaves capable of annealing the substrate W.
  • the power supply 640 is turned off, and the valve member 311 of the gas supply unit 300 is controlled to a closed state.
  • FIG. 8 is a cross-sectional view illustrating a substrate treating apparatus according to an exemplary embodiment (a third exemplary embodiment) of the present invention. This will be described with reference to FIG. 8 .
  • a lamp 1410 is provided as a heat source for annealing the substrate W.
  • the lamp 1410 may be a flash lamp.
  • a reflecting plate 1415 for reflecting the light emitted from the lamp 1410 toward the substrate W may be further included.
  • the valve member 311 of the gas supply unit 300 is controlled to an open state to supply process gas to the plasma generating space 520 .
  • a magnetic field is applied to the process gas by controlling the power supply 640 applied to the antenna 610 to be turned on, and the process gas is excited into plasma.
  • Radicals R of the plasma are introduced into the treatment space 102 through the through-hole of the ion blocker 530 . Ions are blocked by the ion blocker 530 and do not pass through the through-hole.
  • the radical R introduced into the treatment space 102 treats the substrate W.
  • the power supply 640 is turned off, and the valve member 311 of the gas supply unit 300 is controlled to a closed state.
  • the lamp 1410 is controlled to be in an on state to transmit optical energy for annealing to the substrate W.
  • the optical energy passes through the ion blocker 530 and is transferred to the substrate W.
  • FIG. 9 is a cross-sectional view illustrating a substrate treating apparatus according to an exemplary embodiment (a fourth exemplary embodiment) of the present invention. This will be described with reference to FIG. 9 .
  • a laser optical system 2400 is provided as a heat source for annealing the substrate W.
  • the laser optical system 2400 includes a laser generating device and an optical module for transferring the laser emitted from the laser generating device to the substrate W.
  • the optical module may be formed of a combination of a plurality of lenses.
  • the valve member 311 of the gas supply unit 300 is controlled to an open state to supply process gas to the plasma generating space 520 .
  • a magnetic field is applied to the process gas by controlling the power supply 640 applied to the antenna 610 to be turned on, and the process gas is excited into plasma.
  • Radicals R of the plasma are introduced into the treatment space 102 through the through-hole of the ion blocker 530 . Ions are blocked by the ion blocker 530 and do not pass through the through-hole.
  • the radical R introduced into the treatment space 102 treats the substrate W.
  • the power supply 640 is turned off, and the valve member 311 of the gas supply unit 300 is controlled to a closed state.
  • the laser optical system 2400 is controlled to be turned on to transmit optical energy for annealing to the substrate W.
  • the optical energy passes through the ion blocker 530 and is transferred to the substrate W.
  • FIG. 10 is a cross-sectional view illustrating a substrate treating apparatus according to an exemplary embodiment (a fifth exemplary embodiment) of the present invention. This will be described with reference to FIG. 10 .
  • a CCP type is provided as a plasma source for exciting the process gas into plasma.
  • the upper electrode 2610 includes a transparent electrode, and is provided to allow light transmission, heat transmission, and electromagnetic wave transmission.
  • the transparent electrode constituting the upper electrode 2610 is provided under conditions similar to those of the above-described ion blocker.
  • the high-frequency power by the high-frequency power supply 640 is applied to the transparent electrode.
  • the valve member 311 of the gas supply unit 300 is controlled to an open state to supply process gas to the plasma generating space 520 .
  • an electric field is applied to the process gas by controlling the power supply 640 applied to the upper electrode 2610 to be turned on, and the process gas is excited into plasma.
  • Radicals R of the plasma are introduced into the treatment space 102 through the through-hole of the ion blocker 530 . Ions are blocked by the ion blocker 530 and do not pass through the through-hole.
  • the radical R introduced into the treatment space 102 treats the substrate W.
  • the power supply 640 is turned off, and the valve member 311 of the gas supply unit 300 is controlled to a closed state.
  • the lamp 1410 is controlled to be in an on state to transmit light energy for annealing to the substrate W.
  • the optical energy passes through the ion blocker 530 and is transferred to the substrate W.
  • radical dry cleaning and annealing may be performed in one process chamber 100 .
  • the substrate treating apparatus according to the exemplary embodiment of the present invention may be applied to isotropic ALE (t-ALE). According to the substrate treating apparatus according to the exemplary embodiment of the present invention, since it is sufficient if a separate annealing chamber is provided, it is possible to reduce the footprint of the equipment. Further, since the operation of moving between the apparatus using plasma and the annealing apparatus is unnecessary, the movement time between the apparatuses is eliminated, thereby increasing the UPH.

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Plasma Technology (AREA)
  • Drying Of Semiconductors (AREA)
US17/842,222 2021-06-17 2022-06-16 Substrate treating apparatus and substrate treating method Pending US20220406571A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2021-0078399 2021-06-17
KR1020210078399A KR20220169010A (ko) 2021-06-17 2021-06-17 기판 처리 장치 및 기판 처리 방법

Publications (1)

Publication Number Publication Date
US20220406571A1 true US20220406571A1 (en) 2022-12-22

Family

ID=84464103

Family Applications (1)

Application Number Title Priority Date Filing Date
US17/842,222 Pending US20220406571A1 (en) 2021-06-17 2022-06-16 Substrate treating apparatus and substrate treating method

Country Status (4)

Country Link
US (1) US20220406571A1 (ko)
JP (1) JP7390434B2 (ko)
KR (1) KR20220169010A (ko)
CN (1) CN115497801A (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7389845B2 (ja) 2022-04-18 2023-11-30 セメス カンパニー，リミテッド 基板処理装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63161622A (ja) * 1986-12-25 1988-07-05 Fujitsu Ltd 光異方性エツチング装置
JP2010177065A (ja) * 2009-01-30 2010-08-12 Tokyo Electron Ltd マイクロ波プラズマ処理装置、マイクロ波プラズマ処理装置用のスロット板付き誘電体板及びその製造方法
JP2015128108A (ja) * 2013-12-27 2015-07-09 東京エレクトロン株式会社 ドーピング方法、ドーピング装置及び半導体素子の製造方法
JP2015185594A (ja) * 2014-03-20 2015-10-22 株式会社日立ハイテクノロジーズ エッチング装置
JP6721695B2 (ja) * 2016-09-23 2020-07-15 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理装置、半導体装置の製造方法およびプログラム
JP6778624B2 (ja) * 2017-01-31 2020-11-04 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、基板処理システムおよび基板処理方法

Also Published As

Publication number Publication date
KR20220169010A (ko) 2022-12-27
CN115497801A (zh) 2022-12-20
JP7390434B2 (ja) 2023-12-01
JP2023001073A (ja) 2023-01-04

Similar Documents

Publication Publication Date Title
US8419859B2 (en) Method of cleaning plasma-treating apparatus, plasma-treating apparatus where the cleaning method is practiced, and memory medium memorizing program executing the cleaning method
JP4677918B2 (ja) プラズマ処理装置及びプラズマ処理方法
KR100960424B1 (ko) 마이크로파 플라즈마 처리 장치
KR102523730B1 (ko) 이중 주파수 표면파 플라즈마 소스
JP5723397B2 (ja) プラズマ処理装置
JP5438260B2 (ja) プラズマ処理装置
TWI585813B (zh) Plasma processing device and plasma processing method
US20220406571A1 (en) Substrate treating apparatus and substrate treating method
JP5522887B2 (ja) プラズマ処理装置
KR102491984B1 (ko) 안테나, 플라즈마 처리 장치 및 플라즈마 처리 방법
KR20210126092A (ko) 기판 처리 장치, 처리 용기, 반사체 및 반도체 장치의 제조 방법
JP2019009305A (ja) プラズマ処理装置
JP5559505B2 (ja) プラズマ処理装置
JPWO2006118215A1 (ja) 基板処理装置および半導体デバイスの製造方法
US20220384153A1 (en) Apparatus for treating substrate and method for treating substrate
KR102668439B1 (ko) 플라즈마 처리 장치 및 플라즈마 처리 방법
US20230207290A1 (en) Method of treating substrate
KR102674205B1 (ko) 기판 처리 장치 및 기판 처리 방법
US20230298860A1 (en) Apparatus And Method Of Treating Substrate
KR20230015625A (ko) 기판 처리 장치
TW202338900A (zh) 處理基板之設備及方法
KR20230097959A (ko) 기판 처리 방법
JP2022027040A (ja) プラズマ処理装置及びプラズマ処理方法
KR20220060408A (ko) 기판 처리 장치
CN116364512A (zh) 用于处理基板的装置

Legal Events

Date Code Title Description
AS Assignment

Owner name: SEMES CO., LTD., KOREA, REPUBLIC OF

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHOI, YOON SEOK;CHO, SOON-CHEON;KIM, YUN SANG;REEL/FRAME:060475/0801

Effective date: 20220614

STPP Information on status: patent application and granting procedure in general

Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION