US20190283206A1 - Polishing pad, semiconductor fabricating device and fabricating method of semiconductor device - Google Patents

Polishing pad, semiconductor fabricating device and fabricating method of semiconductor device Download PDF

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Publication number
US20190283206A1
US20190283206A1 US16/109,665 US201816109665A US2019283206A1 US 20190283206 A1 US20190283206 A1 US 20190283206A1 US 201816109665 A US201816109665 A US 201816109665A US 2019283206 A1 US2019283206 A1 US 2019283206A1
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Prior art keywords
polishing pad
polishing
temperature
recess portions
substrate
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Abandoned
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US16/109,665
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English (en)
Inventor
Takahiko Kawasaki
Yukiteru Matsui
Akifumi Gawase
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Kioxia Corp
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Toshiba Memory Corp
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Assigned to TOSHIBA MEMORY CORPORATION reassignment TOSHIBA MEMORY CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MATSUI, YUKITERU, GAWASE, AKIFUMI, KAWASAKI, TAKAHIKO
Publication of US20190283206A1 publication Critical patent/US20190283206A1/en
Priority to US17/319,637 priority Critical patent/US11883926B2/en
Abandoned legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/31051—Planarisation of the insulating layers
    • H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/31051—Planarisation of the insulating layers
    • H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step
    • H01L21/31055—Planarisation of the insulating layers involving a dielectric removal step the removal being a chemical etching step, e.g. dry etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/32115—Planarisation
    • H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
    • H01L21/76802—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics
    • H01L21/76805—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics the opening being a via or contact hole penetrating the underlying conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
    • H01L21/76819—Smoothing of the dielectric
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/7684—Smoothing; Planarisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76895—Local interconnects; Local pads, as exemplified by patent document EP0896365
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H01L23/53204—Conductive materials
    • H01L23/53209—Conductive materials based on metals, e.g. alloys, metal silicides
    • H01L23/53257—Conductive materials based on metals, e.g. alloys, metal silicides the principal metal being a refractory metal

Definitions

  • Embodiments described herein relate generally to a polishing pad, a semiconductor fabricating device, and a fabricating method of a semiconductor device.
  • FIG. 1 is a perspective view illustrating a structure of a semiconductor fabricating device of a first embodiment
  • FIGS. 2A and 2B are a sectional view and a top view illustrating a structure of a polishing pad of the first embodiment
  • FIG. 3 is a graph ( 1 / 3 ) for explaining a performance of the polishing pad of the first embodiment
  • FIG. 4 is a graph ( 2 / 3 ) for explaining a performance of the polishing pad of the first embodiment
  • FIG. 5 is a graph ( 3 / 3 ) for explaining a performance of the polishing pad of the first embodiment
  • FIG. 6 is a graph in which the performance of the polishing pad is compared between the first embodiment and a comparative example thereof;
  • FIG. 8 is a graph ( 1 / 2 ) in which the performance of the polishing pad is compared between the first and second embodiments;
  • FIGS. 9A and 9B are graphs ( 2 / 2 ) in which the performance of the polishing pad is compared between the first and second embodiments;
  • FIGS. 10A and 10B are sectional views illustrating a fabricating method of a semiconductor device of a third embodiment.
  • FIGS. 11A to 11C are sectional views illustrating a fabricating method of a semiconductor device of a fourth embodiment.
  • At least some embodiments provide a polishing pad, a semiconductor fabricating device, and a fabricating method of a semiconductor device in which a substrate can be polished efficiently.
  • a polishing pad includes a surface having plural recess portions, and a substrate is polished by the surface.
  • an average width of the recess portions at one area of the surface in a direction parallel to the surface is 20 ⁇ m or less, and an average density of the recess portions at one area of the surface is 1,300/mm 2 or more.
  • FIGS. 1 to 11C the same or similar components are denoted by the same reference numerals, and the redundant explanation is not repeated.
  • FIG. 1 is a perspective view illustrating a structure of a semiconductor fabricating device of a first embodiment.
  • the semiconductor fabricating device of FIG. 1 includes a polishing table 1 holding a polishing pad 2 , a polishing head 3 holding a wafer 4 , a slurry supplying unit 5 supplying a slurry, a dresser 6 , and a control unit 7 .
  • the wafer 4 is one example of the substrate, and the slurry is one example of a polishing liquid.
  • the semiconductor fabricating device of FIG. 1 is a CMP device in which the wafer 4 is polished by the polishing pad 2 to which the slurry is suppled.
  • FIG. 1 illustrates an X-direction and a Y-direction which are parallel to the upper surface of the polishing pad 2 and perpendicular to each other, and a Z-direction which is perpendicular to the upper surface of the polishing pad 2 .
  • a ‘+Z’-direction is set as an upper direction
  • a ‘ ⁇ Z’-direction is set as a lower direction.
  • a ‘ ⁇ Z’-direction may match with a gravity direction or may not match with the gravity direction.
  • the polishing table 1 rotates the polishing pad 2
  • the polishing head 3 rotates the wafer 4
  • the slurry supplying unit 5 supplies the slurry to the upper surface of the polishing pad 2 .
  • the semiconductor fabricating device makes the lower surface of the wafer 4 contact with the upper surface of the polishing pad 2 , and pushes the wafer 4 to the polishing pad 2 .
  • the lower surface of the wafer 4 is polished by the upper surface of the polishing pad 2 .
  • the lower surface of the wafer 4 is a device forming surface.
  • the dresser 6 is used to perform a dressing the upper surface of the polishing pad 2 before and after polishing of the wafer 4 . Accordingly, the performance of the polishing pad 2 can be improved and recovered.
  • the control unit 7 controls various operations of the semiconductor fabricating device. For example, the control unit 7 controls the operations of the polishing table 1 , the polishing head 3 , the slurry supplying unit 5 , and the dresser 6 . Examples of the control unit 7 include a processor, an electric circuit, a computer, and so on.
  • FIGS. 2A and 2B are a sectional view and a top view illustrating a structure of the polishing pad 2 of the first embodiment.
  • FIG. 2A is a sectional view illustrating the cross section near the upper surface of the polishing pad 2 .
  • FIG. 2B is a top view illustrating the upper surface of the polishing pad 2 when viewed from above.
  • a number of pores 2 a are formed inside the polishing pad 2 or in the surface thereof.
  • the pores 2 a inside the polishing pad 2 are formed in spherical shape, for example.
  • the pore 2 a of the surface of the polishing pad 2 are formed in the shape (for example, a hemispherical shape) in which a sphere is cut.
  • FIGS. 2A and 2B illustrate plural pores 2 a formed in the upper surface of the polishing pad 2 . These pores 2 a are an example of recess portions.
  • the wafer 4 is polished by the upper surface of the polishing pad 2 .
  • the shape of the pores 2 a in the upper surface of the polishing pad 2 is a circular shape.
  • a reference numeral W means a width of the pore 2 a in the direction parallel to the upper surface of the polishing pad 2 .
  • the flat surface shape of the pores 2 a of this embodiment is a circular shape, and thus the width W of the pores 2 a becomes a diameter of a circle which is the flat surface shape of the pores 2 a.
  • the polishing pad 2 of this embodiment is formed of a polyurethane foam, and the pore 2 a is formed by using a balloon or a foaming agent, for example.
  • the polishing pad 2 may be formed of another material, and plural recess portions other than the pores 2 a may be formed in the upper surface thereof.
  • Such recess portions may be formed by using dry etching, wet etching, cutting, a wire discharge, a laser, and a die, for example. In this case, the recess portions may not be formed inside the polishing pad 2 , and may be formed only in the upper surface of the polishing pad 2 .
  • the flat surface shape of the recess portions may be a shape other than the circular shape, or may be an elliptic shape or a polygonal shape, for example.
  • the flat surface shape of the pores 2 a inside the polishing pad 2 is a distorted spherical shape
  • the flat surface shape of the pores 2 a of the surface of the polishing pad 2 is an elliptic shape.
  • an example of a polygonal shape includes a triangle or a quadrangle which is a cross-section shape or a surface shape of a trigonal pyramid, a quadrangular pyramid, a hexahedron, an octahedron, a polyhedron, and the like.
  • the width W of the pores 2 a indicates a maximum dimension of the pores 2 a in a direction parallel to the upper surface of the polishing pad 2 .
  • the width W of the pore 2 a corresponds to a length of a long diameter of the elliptic shape.
  • the width W of the pore 2 a corresponds to a length of a long side of the rectangular shape.
  • the density of the pores 2 A means the average density of the pores 2 A at one area of the upper surface of the polishing pad 2 .
  • the width W of the pores 2 a in the upper surface of the polishing pad 2 is 20 ⁇ m or less, and the polishing pad 2 is formed or processed such that the density of the pores 2 a in the upper surface of the polishing pad 2 is 1,300/mm 2 or more.
  • the width W of the pores 2 a is set to be 1 to 20 ⁇ m, and the density of the pores 2 a is set to be 1,300 to 400,000/mm 2 .
  • the density of the pores 2 a in the upper surface of the polishing pad 2 indicates the number of the pores 2 a per unit area of the upper surface of the polishing pad 2 .
  • the description that the width W of the pores 2 a in the upper surface of the polishing pad 2 is 20 ⁇ m or less means that the peak of the distribution showing a relation between the width W and the number of the pores 2 a of the upper surface of the polishing pad 2 is within a range of 20 ⁇ m or less. That means that an average value of the width W of the pores 2 a at one area of the upper surface of the polishing pad 2 is 20 ⁇ m or less in many cases.
  • the description that the width W of the pores 2 a of the upper surface of the polishing pad 2 is 1 to 20 ⁇ m means that the peak of the distribution showing the relation between the width W and the number of the pores 2 a of the upper surface of the polishing pad 2 is within a range of 1 to 20 ⁇ m. The same is applied to the recess portions other than the pores 2 a.
  • FIGS. 3 to 5 are graphs for explaining the performance of the polishing pad 2 of the first embodiment.
  • FIG. 3 illustrates an experimental result of a case where the wafer 4 is polished by the polishing pad 2 by using a polishing slurry of a silicon oxide film.
  • a polishing target in this case is the silicon oxide film provided in the wafer 4 .
  • the vertical axis of FIG. 3 indicates a removal rate (polishing rate) of the silicon oxide film.
  • FIGS. 4 and 5 illustrate experimental results of a case where the wafer 4 is polished by the polishing pad 2 by using a polishing slurry of a tungsten layer.
  • a polishing target in this case is the tungsten layer provided in the wafer 4 .
  • the vertical axis of FIGS. 4 and 5 indicates a removal rate of the tungsten layer.
  • the slurries having different average particle diameters are used in the experiments of FIGS. 4 and 5 .
  • the first to third experiments are performed.
  • the polishing pad 2 is used in which the width W of the pores 2 a in the upper surface of the polishing pad 2 is 20 to 40 ⁇ m, and the density of the pores 2 a in the upper surface of the polishing pad 2 is 400 to 600/mm 2 .
  • the polishing pad 2 is used in which the width W of the pores 2 a in the upper surface of the polishing pad 2 is 5 to 20 ⁇ m, and the density of the pores 2 a in the upper surface of the polishing pad 2 is 1,100 to 1,300/mm 2 .
  • the polishing pad 2 is used in which the width W of the pores 2 a in the upper surface of the polishing pad 2 is 5 to 10 ⁇ m, and the density of the pores 2 a in the upper surface of the polishing pad 2 is 1,300/mm 2 or more (more specifically, 1,500/mm 2 or more). The same is applied to FIG. 4 or FIG. 5 .
  • the polishing pad 2 desirably has small pores 2 a with a high density.
  • wettability (contact angle) of the slurry in the polishing pad 2 is measured.
  • the measurement results are 67 degrees in the first experiment, 70 degrees in the second experiment, and 40 degrees in the third experiment. From results, it is found that compared to the other two polishing pads 2 of the first and second experiments, the polishing pad 2 of the third experiment in which the width W of the pores 2 a is 5 to 10 ⁇ m, and the density of the pores 2 a is 1,300/mm 2 or more has excellent wettability and is suitable for the polishing.
  • the wettability is excellent (the contact angle is small), the retention of the slurry is improved, and the polishing rate is increased.
  • FIG. 6 is a graph in which the performance of the polishing pad 2 is compared between the first embodiment and a comparative example thereof.
  • the horizontal axis of FIG. 6 indicates a temperature of the upper surface of the polishing pad 2 .
  • the vertical axis of FIG. 6 indicates the elastic modulus of the polishing pad 2 .
  • the width W of the pores 2 a is 5 to 10 ⁇ m, and the density of the pores 2 a is 1,300/mm 2 or more.
  • the width W of the pores 2 a is 20 ⁇ m or more, and the density of the pores 2 a is 1,300/mm 2 or less.
  • the elastic modulus of the polishing pad 2 of this embodiment is higher than the elastic modulus of the polishing pad 2 of the comparative example under the same temperature.
  • the elastic modulus of the polishing pad 2 of this embodiment is desirably 4.0 ⁇ 10 8 Pa or more at 30° C. and 2.0 ⁇ 10 8 Pa or more at 60° C.
  • the elastic modulus of the polishing pad 2 of this embodiment is about 5.0 ⁇ 10 8 Pa at 30° C. and about 2.5 ⁇ 10 8 Pa at 60° C.
  • the polishing pad 2 of this embodiment desirably has Shore hardness of 50 to 65.
  • the hardness of the polishing pad 2 is reduced as the width W of the pores 2 a becomes larger, and is increased as the width W of the pores 2 a becomes smaller.
  • the elastic modulus of the polishing pad 2 is increased, and the hardness of the polishing pad 2 is increased. Therefore, desirably, the elastic modulus of the polishing pad 2 of this embodiment is 4.0 ⁇ 10 8 Pa or more at 30° C., and is 2.0 ⁇ 10 8 Pa or more at 60° C.
  • the hardness of the polishing pad 2 has an upper limitation.
  • the polishing pad 2 of this embodiment has Shore hardness of 50 to 65.
  • the width W of the pores 2 a is 5 to 10 ⁇ m, and the density of the pores 2 a is 1,300/mm 2 or more. Therefore, according to this embodiment, it is possible to improve the polishing rate of the wafer 4 , and it is possible to polish the wafer 4 efficiently.
  • the width W of the pores 2 a is desirably set to be 1 to 20 ⁇ m, and the density of the pores 2 a is desirably set to be 1,300 to 400,000/mm 2 .
  • the particle diameter of the slurry is less than 10 nm in some cases. In these cases, when the width W of the pores 2 a is set to be less than 1 ⁇ m, the slurry particles may be aggregated in the pore 2 a .
  • the width W of the pores 2 a is 1 ⁇ m
  • the ratio of the volume of the pores 2 a to the volume of the polishing pad 2 is 30% or more, and thus the hardness of the polishing pad 2 (for example, polyurethane) may become insufficient. Therefore, the width W or the density of the pores 2 a is desirably set as above.
  • FIG. 7 is a perspective view illustrating a structure of a semiconductor fabricating device of a second embodiment.
  • the semiconductor fabricating device of FIG. 7 includes a heat exchanger 8 in addition to the components illustrated in FIG. 1 .
  • the heat exchanger 8 can adjust the temperature of the upper surface of the polishing pad 2 by heat exchanging.
  • the control unit 7 monitors the temperature of the upper surface of the polishing pad 2 by a signal sent from a radiation thermometer (not illustrated) and adjusts the temperature of the upper surface of the polishing pad 2 by controlling the operation of the heat exchanger 8 based on the temperature measured by the radiation thermometer.
  • the control unit 7 and the heat exchanger 8 are examples of a temperature adjusting unit.
  • the heat exchanger 8 can perform both heating and cooling for example.
  • the elastic modulus of the polishing pad 2 is changed by the temperature ( FIG. 6 ), and thus the polishing rate is changed by the temperature.
  • a desirable polishing rate can be achieved by adjusting the temperature of the polishing pad 2 by using the control unit 7 and the heat exchanger 8 .
  • FIG. 8 is a graph in which the performance of the polishing pad 2 is compared between the first and second embodiments.
  • FIG. 8 illustrates changeover time of the temperature of the polishing pad 2 of the first and second embodiments during the polishing of the wafer 4 .
  • the polishing pad 2 of the second embodiment is formed of the same material as that of the first embodiment, and has the pores 2 a which has the same width W and density as those of the polishing pad 2 of the first embodiment.
  • the temperature of the polishing pad 2 of the second embodiment is adjusted by the heat exchanger 8 during the polishing while the temperature of the polishing pad 2 of the first embodiment is not adjusted by the heat exchanger 8 during the polishing.
  • the temperature change of the polishing pad 2 of the first embodiment in FIG. 8 results from Joule heat generated in accordance with the polishing.
  • FIG. 8 illustrates a process that oxidizes a portion of the tungsten layer provided in the wafer 4 by the hydrogen peroxide to forma tungsten oxide film and polishes the tungsten oxide film in both the first and second embodiments.
  • a chemical reaction that oxidizes the tungsten layer by the hydrogen peroxide is promoted as the temperature is higher.
  • the tungsten oxide film has a property that is vulnerable compared to the tungsten layer so as to be easily polished. Therefore, when the polishing pad 2 is heated, the chemical reaction is promoted to increase the polishing rate.
  • the polishing pad 2 of the first embodiment is heated by the heat exchanger 8 .
  • the temperature of the polishing pad 2 during the first step is an example of the first temperature.
  • the polishing pad 2 is formed of polyurethane
  • the elastic modulus of the polishing pad 2 is reduced (see FIG. 6 ). Therefore, in a case where the temperature of the polishing pad 2 is high, there is a concern that the flatness of the surface of the wafer 4 after ending the polishing is deteriorated.
  • the polishing pad 2 of the first embodiment is cooled by the heat exchanger 8 . As a result, the temperature of the polishing pad 2 is decreased, and the flatness of the surface of the wafer 4 is improved.
  • the temperature of the polishing pad 2 during the second step is an example of the second temperature.
  • the temperature of the polishing pad 2 is increased by supplying the hot water to the heat exchanger 8 .
  • the temperature of the polishing pad 2 is decreased by supply a cold water or a normal temperature water to the heat exchanger 8 .
  • the polishing rate of the wafer 4 can be improved caused by a high temperature
  • the flatness of the wafer 4 can be improved caused by a low temperature. That is, according to this embodiment, it is possible to improve the polishing rate and improve the flatness.
  • the polishing ending time of the second embodiment is earlier than the polishing ending time of the first embodiment.
  • the temperature of the polishing pad 2 is increased gradually to be saturated near the time indicated by a dotted line in FIG. 8 .
  • the temperature of the polishing pad 2 can be adjusted to the high temperature immediately after starting the polishing. Additionally, in the second embodiment, the temperature of the polishing pad 2 can be decreased from the time indicated by the dotted line in FIG. 8 , that is, the starting time of the second step.
  • FIGS. 9A and 9B are other graphs in which the performance of the polishing pad 2 is compared between the first and second embodiments.
  • FIG. 9A shows a relation between a line width of the wiring pattern and a step remaining in the wafer 4 after ending the polishing in a case where the wiring pattern provided in the wafer 4 is polished by the method of FIG. 8 .
  • the same is applied to FIG. 9B .
  • the tungsten (W) making up the wiring pattern occupies 50% of the entire wafer
  • the tungsten (W) configuring the wiring pattern occupies 65% of the entire wafer. From those experimental results, it is found that according to the second embodiment, the step can be reduced, and the flatness of the wafer 4 can be improved compared to the first embodiment.
  • the semiconductor fabricating device of this embodiment adjusts the temperature of the upper surface of the polishing pad 2 by the heat exchanger 8 . Therefore, according to this embodiment, it is possible to improve the polishing rate of the wafer 4 and improve the flatness of the wafer 4 .
  • FIGS. 10A and 10B are sectional views illustrating a fabricating method of a semiconductor device of a third embodiment.
  • a semiconductor device such as a three-dimensional memory is manufactured from the above-described wafer 4 .
  • a first insulation film 12 , a second insulation film 13 , and a third insulation film 14 are formed in order on a semiconductor substrate 11 .
  • the example of the semiconductor substrate 11 is a silicon substrate (silicon wafer).
  • the example of the first insulation film 12 is a silicon oxide film.
  • the example of the second insulation film 13 is a silicon nitride film.
  • the example of the third insulation film 14 is a silicon oxide film.
  • the surface of the third insulation film 14 is polished by the semiconductor fabricating device of the first embodiment ( FIG. 10B ).
  • the third insulation film 14 such as a silicon insulation film can be polished efficiently by the above-described polishing pad 2 .
  • this embodiment maybe applied to another layer in addition to the silicon oxide film.
  • FIG. 11A to 11C are sectional views illustrating a fabricating method of a semiconductor device of a fourth embodiment.
  • a plug member 15 is formed in the entire surface of the semiconductor substrate 11 ( FIG. 11A ).
  • the example of the plug member 15 is a tungsten layer.
  • the surface of the plug member 15 is polished in the first step of the second embodiment ( FIG. 10B ). Accordingly, the plug member 15 is polished during a short time, and plugs 15 a to 15 c are formed from the plug member 15 in the holes Ha to Hc. However, dishings Da to Dc are formed in the upper surface of the plugs 15 a to 15 c , so as to deteriorate the flatness of the upper surface of the plugs 15 a to 15 c.
  • the upper surface of the plugs 15 a to 15 c and the upper surface of the third insulation film 14 are polished in the second step of the second embodiment ( FIG. 11C ). Accordingly, it is possible to improve the flatness of the upper surface of the plugs 15 a to 15 c . In addition, according to the second step of this process, it is possible to improve erosion occurring in the first step.
  • the plug member 15 such as the tungsten layer can be efficiently polished by the polishing pad 2 and the heat exchanger 8 described above.
  • this embodiment maybe applied to another layer in addition to the tungsten layer.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
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