US20190212197A1 - Inspection method, inspection apparatus, production method, and production system for heatsink - Google Patents
Inspection method, inspection apparatus, production method, and production system for heatsink Download PDFInfo
- Publication number
- US20190212197A1 US20190212197A1 US16/211,285 US201816211285A US2019212197A1 US 20190212197 A1 US20190212197 A1 US 20190212197A1 US 201816211285 A US201816211285 A US 201816211285A US 2019212197 A1 US2019212197 A1 US 2019212197A1
- Authority
- US
- United States
- Prior art keywords
- heat dissipation
- dissipation layer
- substrate
- image data
- heatsink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000000034 method Methods 0.000 title claims abstract description 53
- 238000004519 manufacturing process Methods 0.000 title claims description 63
- 238000007689 inspection Methods 0.000 title claims description 50
- 230000017525 heat dissipation Effects 0.000 claims abstract description 162
- 239000000758 substrate Substances 0.000 claims abstract description 135
- 238000009826 distribution Methods 0.000 claims abstract description 35
- 238000005266 casting Methods 0.000 claims abstract description 16
- 230000002950 deficient Effects 0.000 claims description 44
- 238000005070 sampling Methods 0.000 claims description 29
- 229920005989 resin Polymers 0.000 claims description 22
- 239000011347 resin Substances 0.000 claims description 22
- 238000010438 heat treatment Methods 0.000 description 19
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 229910052724 xenon Inorganic materials 0.000 description 9
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 9
- 238000010586 diagram Methods 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000003745 diagnosis Methods 0.000 description 2
- 239000002657 fibrous material Substances 0.000 description 2
- 230000015654 memory Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000001931 thermography Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004590 computer program Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000000295 emission spectrum Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/0003—Radiation pyrometry, e.g. infrared or optical thermometry for sensing the radiant heat transfer of samples, e.g. emittance meter
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/06—Constructions of heat-exchange apparatus characterised by the selection of particular materials of plastics material
- F28F21/067—Details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/72—Investigating presence of flaws
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J2005/0077—Imaging
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K3/00—Thermometers giving results other than momentary value of temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
Definitions
- the present disclosure relates to an inspection method, an inspection apparatus, a production method, and a production system for a heatsink.
- the present disclosure relates to an inspection method, an inspection apparatus, a production method, and a production system for a heatsink in which a heat dissipation layer is formed on a surface of a substrate which is formed by casting.
- a substrate that constitutes such a heatsink is usually formed of a metal having a high thermal conductivity such as aluminum.
- the thermal conductivity of the metal such as aluminum in itself is high, conductivity of heat from the metal to the air tends to be low.
- a layer of carbon, a nitride, a resin, or the like that has a higher thermal conductivity to the air than the thermal conductivity from the metal to the air is formed as a heat dissipation layer on a surface of the substrate.
- Japanese Unexamined Patent Application Publication No. S57-202683 discloses a method for manufacturing a heat dissipation base for an electro-thermal apparatus, in which a resin layer is formed on a surface of a substrate in a state where residual heat that is generated when the substrate is formed by casting remains.
- Japanese Unexamined Patent Application Publication No. 2003-139731 discloses a structure inspection/diagnosis system in which after a surface of a concrete structure is heated by heating means, the surface of the concrete structure is shot (i.e., photographed) by a thermography apparatus and the concrete structure is inspected for presence of cracking and the like based on acquired image data.
- the applicant of the present application has found the following problem.
- the heat dissipation layer could be peeled off from the surface of the substrate due to a release agent adhering to the surface of the substrate and/or a temperature of the substrate at the time when the heat dissipation layer is formed. Therefore, for example, although it is possible to inspect the degree of peeling of the heat dissipation layer from the surface of the substrate by using the structure inspection/diagnosis system disclosed in Japanese Unexamined Patent Application Publication No.
- the present disclosure has been made in view of the above-described problem and an object thereof is to provide an inspection method, an inspection apparatus, a production method, and a production system for a heatsink, capable of improving efficiency of a process for inspecting whether a heatsink is defective or not based on a degree of peeling of a heat dissipation layer from a surface of a substrate.
- a first exemplary aspect is a method for inspecting a heatsink in which a heat dissipation layer is formed on a surface of a substrate formed by casting, including
- the heat dissipation layer shooting the heat dissipation layer by image pickup means in a state where residual heat transferred from the substrate to the heat dissipation layer remains and thereby acquiring image data representing a temperature distribution on a surface of the heat dissipation layer, the heat dissipation layer being formed by performing a film-forming process on the surface of the substrate where residual heat that is generated when the substrate is cast remains, the image pickup means being configured to receive an emission of light (an emission spectrum) from molecules of the heat dissipation layer.
- an emission of light an emission spectrum
- the above-described method for inspecting a heatsink preferably further includes:
- the sampling image data being acquired in advance and representing a temperature distribution on the surface of the heat dissipation layer in a state where the heat dissipation layer is not peeled off from the surface of the substrate;
- the above-described method for inspecting a heatsink preferably further includes determining whether or not a total size of areas having a predetermined temperature or lower in the section having the predetermined size in the image data is equal to or larger than a predetermined ratio with respect to the size of the section, and determining that the heatsink is a defective product in which the heat dissipation layer is peeled off from the surface of the substrate when the total size of the areas having the predetermined temperature or lower is equal to or higher than the predetermined ratio with respect to the size of the section.
- the above-described method for inspecting a heatsink preferably further includes displaying the image data and the sampling image data, which is acquired in advance and representing the temperature distribution on the surface of the heat dissipation layer in the state where the heat dissipation layer is not peeled off from the surface of the substrate.
- Another exemplary aspect is a method for producing a heatsink in which a heat dissipation layer is formed on a surface of a substrate formed by casting by performing a film-forming process, the method including:
- the image pickup means being configured to receive an emission of light from molecules of the heat dissipation layer.
- Another exemplary aspect is an inspection apparatus for a heatsink in which a heat dissipation layer is formed on a surface of a substrate formed by casting, the inspection apparatus including:
- image pickup means for shooting the heat dissipation layer in a state where residual heat transferred from the substrate to the heat dissipation layer remains and thereby acquiring image data representing a temperature distribution on a surface of the heat dissipation layer, the heat dissipation layer being formed by performing a film-forming process on the surface of the substrate where residual heat that is generated when the substrate is cast remains, the image pickup means being configured to receive an emission of light from molecules of the heat dissipation layer;
- processing means for determining whether or not the heatsink is a defective product in which the heat dissipation layer is peeled off from the surface of the substrate based on the image data.
- the processing means is preferably further configured to: compare the image data with sampling image data and calculate a difference between temperatures of a plurality of areas within a section having a predetermined size in the image data and temperatures of areas in the sampling image data corresponding to respective areas in the image data, the sampling image data being acquired in advance and representing a temperature distribution on the surface of the heat dissipation layer in a state where the heat dissipation layer is not peeled off from the surface of the substrate; and determine whether or not a size of areas having a predetermined temperature difference or larger in the section is equal to or larger than a predetermined ratio with respect to the size of the section based on the calculated difference, and determine that the heatsink is a defective product in which the heat dissipation layer is peeled off from the surface of the substrate when the size of the areas having the predetermined temperature difference or larger is equal to or higher than the predetermined ratio with respect to the size of the section.
- the heatsink Since it is determined whether the heatsink is defective or not by the processing means as described above, the heatsink can be easily inspected.
- the processing means preferably further configured to determine whether or not a size of areas having a predetermined temperature or lower in the section having the predetermined size in the image data is equal to or larger than a predetermined ratio with respect to the size of the section, and determine that the heatsink is a defective product in which the heat dissipation layer is peeled off from the surface of the substrate when the size of the areas having the predetermined temperature or lower is equal to or higher than the predetermined ratio with respect to the size of the section.
- the heatsink Since it is determined whether the heatsink is defective or not by the processing means as described above, the heatsink can be easily inspected.
- Another exemplary aspect is a production system for a heatsink in which a heat dissipation layer is formed on a surface of a substrate formed by casting by performing a film-forming process, the production system for a heatsink including:
- temperature detecting means for detecting a temperature of the substrate where residual heat that is generated when the substrate is cast remains
- forming means for forming the heat dissipation layer by applying a film-forming resin to the surface of the substrate when the detected temperature of the residual heat of the substrate is equal to or higher than a film-forming temperature of the film-forming resin;
- image pickup means for shooting the heat dissipation layer in a state where residual heat transferred from the substrate to the heat dissipation layer remains and thereby acquiring image data representing a temperature distribution on a surface of the heat dissipation layer, the image pickup means being configured to receive an emission of light from molecules of the heat dissipation layer;
- processing means for determining whether or not the heatsink is a defective product in which the heat dissipation layer is peeled off from the surface of the substrate based on the image data.
- FIG. 1 is a block diagram showing a control system of a heatsink production system according to a first embodiment
- FIG. 2 shows a state in which a substrate is molded by using a mold in a heatsink manufacturing apparatus according to the first embodiment
- FIG. 3 shows a state in which a heat dissipation layer is formed on a surface of the substrate by using forming means in the heatsink manufacturing apparatus according to the first embodiment
- FIG. 4 shows a state in which image data is acquired by using image pickup means in a heatsink inspection apparatus according to the first embodiment
- FIG. 5 is a flowchart showing a flow of a heatsink manufacturing method according to the first embodiment
- FIG. 6 is sampling image data representing a part of a temperature distribution on the surface of the heat dissipation layer in a state where the heat dissipation layer is not peeled off from the surface of the substrate in the heatsink;
- FIG. 7 is image data representing a part of a temperature distribution on the surface of the heat dissipation layer in a state where a part of the heat dissipation layer is peeled off from the surface of the substrate in the heatsink;
- FIG. 8 is a block diagram showing a control system of a heatsink production system according to a second embodiment
- FIG. 9 is a flowchart showing a flow of a heatsink manufacturing method according to the second embodiment.
- FIG. 10 is a block diagram showing a control system of a heatsink production system according to a third embodiment.
- FIG. 1 is a block diagram showing a control system of the heatsink production system according to this embodiment.
- FIG. 2 shows a state in which a substrate is molded by using a mold in a heatsink manufacturing apparatus according to this embodiment.
- FIG. 3 shows a state in which a heat dissipation layer is formed on a surface of the substrate by using forming means in the heatsink manufacturing apparatus according to this embodiment.
- the heatsink production system according to this embodiment 1 (hereinafter, also simply referred to as the production system 1 ) includes a heatsink manufacturing apparatus 2 and a heatsink inspection apparatus 3 .
- the heatsink manufacturing apparatus 2 (hereinafter, also simply referred to as the manufacturing apparatus 2 ) includes a mold 4 , temperature detecting means 5 , forming means 6 , and processing means 7 . Further, the manufacturing apparatus 2 is used to manufacture a heatsink 10 in which a heat dissipation layer 9 is formed on a surface of a substrate 8 which is formed by casting. Note that the heatsink 10 is not limited to heatsinks provided in electric circuits, and may instead be any type of heatsink that is provided in a place where heat needs to be dissipated.
- the mold 4 is used to mold the substrate 8 by casting molten metal such as aluminum. As shown in FIG. 2 , for example, the mold 4 includes a fixed die 4 a and a movable die 4 b . Further, the movable die 4 b can be moved toward and away from the fixed die 4 a . Alternatively, both dies of the mold 4 may be movable.
- the mold 4 is closed by moving the movable die 4 b toward the fixed die 4 a , so that a cavity 4 c is formed inside the fixed die 4 a and the movable die 4 b .
- the cavity 4 c has a shape corresponding to the shape of the substrate 8 to be molded. Further, molten metal is poured into the cavity 4 c from a molten-metal inlet (not shown). Further, the mold 4 is opened by moving the movable die 4 b away from the fixed die 4 a , so that the substrate 8 molded in the cavity 4 c is removed from the mold 4 .
- the temperature detecting means 5 detects a temperature of the cast substrate 8 (i.e., the molded substrate 8 ).
- the temperature detecting means 5 is, for example, a probe-type thermometer, and detects the temperature of the surface of the substrate 8 by bringing its probe into contact with the substrate 8 .
- the temperature detection means 5 outputs the detected temperature data to the processing means 7 .
- the temperature detecting means 5 is not limited to the probe-type thermometer, and may instead be any type of thermometer capable of detecting the temperature of the surface of the substrate 8 .
- the forming means 6 forms a heat dissipation layer 9 by applying a film-forming resin to the surface of the substrate 8 .
- the forming means 6 is, for example, a spray nozzle that sprays a film-forming resin that can form a film (can be sintered) by residual heat that is generated when the substrate 8 is cast.
- a thermoplastic resin such as polyamide imide (PAI) or a thermosetting resin such as epoxy-based paint or phenol-based paint can be used.
- the heat dissipation layer 9 is formed by spraying the film-forming resin on the substrate 8 .
- the heat dissipation layer 9 may instead be formed by spraying fibrous material, such as carbon, mixed with a film-forming resin, on the substrate 8 , or may be formed by spraying fibrous material, separately from the film-forming resin, on the substrate 8 .
- the processing means 7 controls the forming means 6 based on temperature data of the substrate 8 received from the temperature detecting means 5 , details of which will be described later.
- the inspection apparatus 3 for the heatsink 10 determines whether the heatsink 10 is a conforming product (e.g., a satisfactory product) or a defective product based on the degree of peeling of the heat dissipation layer 9 from the surface of the substrate 8 .
- the inspection apparatus 3 includes image pickup means 11 and processing means 12 .
- FIG. 4 shows a state in which image data is acquired by using the image pickup means in the heatsink inspection apparatus according to this embodiment.
- the image pickup means 11 shoots (i.e., photographs) the heat dissipation layer 9 formed on the substrate 8 and thereby acquires image data representing a temperature distribution on the surface of the heat dissipation layer 9 .
- the image pickup means 11 includes a light-receiving element that receives an emission of light from molecules of the heat dissipation layer 9 .
- the image pickup means 11 is an infrared thermo-camera.
- the image pickup means 11 outputs the acquired image data to the processing means 12 .
- the infrared thermo-camera is used as an example of the image pickup means 11
- any type of image pickup means capable of receiving an emission of light from molecules of the heat dissipation layer 9 and thereby acquiring image data may be used.
- the processing means 12 determines whether the heatsink 10 is a conforming product or a defective product based on the image data received from the image pickup means 11 , details of which will be described later.
- FIG. 5 is a flowchart showing a flow of a method for producing a heatsink according to this embodiment.
- the method for producing a heatsink 10 according to this embodiment includes a process for manufacturing the heatsink 10 and a process for inspection thereof.
- a substrate 8 is formed by casting (S 1 ). Specifically, the mold 4 is closed by moving the movable die 4 b toward the fixed die 4 a and molten metal is poured into the cavity 4 c through a molten-metal inlet. Then, after solidifying the molten metal, the mold 4 is opened by moving the movable die 4 b away from the fixed die 4 a and the substrate 8 is removed from the mold 4 as shown in FIG. 2 . After that, in a state where residual heat generated in the casting remains, the substrate 8 is placed on a placement table 13 by using, for example, conveying means (not shown).
- the processing unit 7 of the production apparatus 2 determines whether or not a temperature of a surface of the substrate 8 is equal to or higher than a temperature at which a film-forming resin applied to the substrate 8 can form a film (can be sintered) (i.e., a predetermined film-forming temperature) (S 2 ).
- the temperature detecting means 5 detects the temperature of the surface of the substrate 8 placed on the placement table 13 , which is in a state where residual heat generated in the casting still remains, and outputs the detected temperature data to the processing means 7 .
- the temperature detecting means 5 is preferably disposed on the placement table 13 so that when the substrate 8 is placed on the placement table 13 , the probe of the temperature detecting means 5 comes into contact with the substrate 8 and thereby detects its surface temperature. In this way, when the substrate 8 is placed on the placement table 13 , the temperature of the surface of the substrate 8 can be automatically detected. Then, the processing means 7 determines whether or not the temperature of the surface of the substrate 8 in the state where the residual heat remains is equal to or higher than the film-forming temperature based on the temperature data received from the temperature detection means 5 .
- the processing means 7 of the manufacturing apparatus 2 forms a heat dissipation layer 9 by controlling the forming means 6 and thereby applying a film-forming resin to the surface of the substrate 8 (S 3 ).
- the film-forming resin forms a film on the surface of the substrate 8 and thereby becomes the heat dissipation layer 9 .
- the heatsink 10 having the heat dissipation layer 9 formed on the surface of the substrate 8 is manufactured.
- the manufactured heatsink 10 is placed on a placement table 14 by using, for example, conveying means (not shown) in a state where residual heat from the substrate 8 remains in the heat dissipation layer 9 .
- the film-forming resin is preferably applied in a period during which the temperature of the surface of the substrate 8 is equal to or higher than the film-forming temperature and is lower than a set temperature that is higher than the film-forming temperature by a predetermined temperature (e.g., a temperature that is 100° C. higher than the film-forming temperature).
- the processing means 7 of the manufacturing apparatus 2 determines that the heat dissipation layer 9 cannot be formed (No at S 2 ).
- the processing unit 12 of the inspection apparatus 3 acquires image data, which is obtained by shooting the heat dissipation layer 9 in the image pickup means 11 and represents a temperature distribution on the surface of the heat dissipation layer 9 (S 4 ). Specifically, when the heatsink 10 is placed on the placement table 14 , the processing means 12 controls the image pickup means 11 so that the image pickup means 11 shoots (i.e., photographs) the heatsink 10 placed on the placement table 14 in the state where the residual heat of the substrate 8 still remains in the heat dissipation layer 9 .
- the image pickup means 11 outputs the acquired image data representing the temperature distribution on the surface of the heat dissipation layer 9 to the processing unit 12 .
- the temperature of the surface of the heat dissipation layer 9 at the time when the heat dissipation layer 9 is shot (i.e., photographed) by the image pickup means 11 is preferably about 150° C. or higher.
- the temperature of the heat dissipation layer 9 at the time when the image data is acquired by the image pickup means 11 may be any temperature as long as satisfactory image data representing the temperature distribution on the surface of the heat dissipation layer 9 can be acquired.
- the processing unit 12 of the inspection apparatus 3 compares the acquired image data with sampling image data, which is acquired in advance and represents a temperature distribution on the surface of the heat dissipation layer 9 in a state where the heat dissipation layer 9 is not peeled off from the surface of the substrate 8 , and calculates a difference (a temperature difference) between temperatures of a plurality of areas within a section having a predetermined size in the image data and temperatures of areas in the sampling image data corresponding to respective areas in the image data (S 5 ).
- sampling image data image data representing a temperature distribution on the surface of the heat dissipation layer 9 in a state where the heat dissipation layer 9 is not peeled off from the surface of the substrate 8 is acquired in advance by performing the above-described processes in the steps S 1 to S 4 . That is, the sampling image data is image data that is acquired by shooting a heatsink 10 that is manufactured in the same manner as the heatsink 10 to be inspected under the same condition as that for the heatsink 10 to be inspected (for example, the same elapsed time after the formation of the heat dissipation layer 9 , etc.) by using the image pickup means 11 .
- FIG. 6 shows a sampling image data representing a part of a temperature distribution on a surface of a heat dissipating layer in a state where the heat dissipation layer is not peeled off from a surface of a substrate in a heatsink.
- FIG. 7 shows an image data representing a part of a temperature distribution on a surface of a heat dissipating layer in a state where a part of the heat dissipation layer is peeled off from a surface of a substrate in a heatsink. Note that in FIGS. 6 and 7 , the lighter the color of an area is, the higher the temperature of the area is.
- FIGS. 6 and 7 it is possible to estimate a temperature distribution on the surface of the heat dissipation layer 9 by using color-coding. Then, as shown in FIG. 6 , when the heat dissipation layer 9 is not peeled off from the surface of the substrate 8 , the temperature distribution on the surface of the heat dissipation layer 9 is roughly uniform. On the other hand, as shown in FIG. 7 , when a part of the heat dissipation layer 9 is peeled off from the surface of the substrate 8 , the temperature of the area where the heat dissipation layer 9 is peeled off is lower than the temperature of the area where the heat dissipation layer 9 is not peeled off.
- the processing means 12 of the inspection apparatus 3 calculates a difference between temperatures of a plurality of areas within a section having a predetermined size in the image data and temperatures of areas in the sampling image data corresponding to respective areas in the image data. That is, the processing means 12 calculates a temperature difference between each of the plurality of areas within the section in the image data and a respective one of the areas in the sampling image data.
- the section is defined by dividing a part where the heat dissipation layer 9 is shown in the image data into sections having a predetermined size. Further, one or a plurality of sections are present in the image data. Further, the area is defined by dividing the section and a plurality of areas are present within the section. Note that in FIG. 7 , one example section C is indicated by alternate long and short dash lines and one example area A is indicated by broken lines. Note that the section and the area may be defined on a pixel basis.
- the processing unit 12 of the inspection apparatus 3 repeats the above-described process in the step S 5 and thereby calculates a temperature difference for each area A in each section C in the entire area of the image data.
- the processing unit 12 of the inspection apparatus 3 determines, based on the temperature difference in each area A calculated for each section C, whether or not a total size of areas A having the predetermined temperature difference or larger in the section C is equal to or higher than a predetermined ratio with respect to the size of the section C (S 6 ).
- the processing means 12 of the inspection apparatus 3 determines that the heatsink is a defective product in which the heat dissipation layer 9 is peeled off from the surface of the substrate 8 (Yes at S 6 ).
- the processing means 12 determines that the heatsink 10 is defective.
- the processing means 12 of the inspection apparatus 3 determines that the heatsink is a conforming product (e.g., a satisfactory product) in which the heat dissipation layer 9 is not peeled off from the surface of the substrate 8 (No at S 6 ). That is, when there is no section C in which the total size of areas A having the predetermined temperature difference or larger is equal to or higher than the predetermined ratio with respect to the size of the section C in the image data, the processing means 12 determines that the heatsink 10 is satisfactory (i.e., is a conforming product).
- a conforming product e.g., a satisfactory product
- the heatsink 10 is shot (i.e., photographed) by the image pickup means 11 in the state where the residual heat of the substrate 8 still remains in the heat dissipation layer 9 in order to acquire image data representing a temperature distribution on the surface of the heat dissipation layer 9 . Therefore, satisfactory image data can be acquired.
- the heat dissipation layer 9 it is possible, when image data representing a temperature distribution on the surface of the heat dissipation layer 9 is acquired, to eliminate the need for heating process for heating the heat dissipation layer 9 by using heating means such as a xenon lamp. As a result, it is possible to improve efficiency of a process for inspecting whether the heatsink 10 is defective or not based on the degree of peeling of the heat dissipation layer 9 from the surface of the substrate 8 . In addition, it is possible to eliminate the need for the heating means such as a xenon lamp and thereby to contribute to a reduction in the production cost.
- heating means such as a xenon lamp
- the heatsink 10 is a conforming product or a defective product by using sampling image data. However, it may be determined whether the heatsink 10 is a conforming product or a defective product without using the sampling image data.
- FIG. 8 is a block diagram showing a control system of a heatsink production system according to this embodiment.
- descriptions of the same components and structures as those of the first embodiment are omitted. Further, the same components as those of the first embodiment are indicated by the same symbols as those of the first embodiment.
- a configuration of the manufacturing apparatus 2 of a production system 21 according to this embodiment is identical to that in the production system 1 according to the first embodiment. However, processes performed by the processing means 23 of the inspection apparatus 22 differ from those performed by the processing means 12 of the production system 1 .
- FIG. 9 is a flowchart showing a flow of a method for producing a heatsink according to this embodiment.
- steps S 21 to S 24 i.e., steps up to the acquisition of image data in the heatsink production method according to this embodiment are the same as the steps S 1 to S 4 , i.e., the steps up to the acquisition of image data in the heatsink production method according to the first embodiment.
- the processing means 23 of the inspection apparatus 22 determines whether or not the total size of areas A having a predetermined temperature or lower in a section C having a predetermined size in the acquired image data is equal to or larger than a predetermined ratio with respect to the size of that section C (S 25 ).
- the predetermined temperature may be set to, for example, 130° C. However, the predetermined temperature can be changed as desired according to the material of the film-forming resin or the like.
- the processing means 23 of the inspection apparatus 22 determines that the heatsink 10 is defective (Yes at S 25 ). That is, when there is a section C in which the total size of areas A, which have been determined to have the predetermined temperature or lower in the section C, is equal to or higher than the predetermined ratio with respect to the size of the section C in the image data, the processing means 23 determines that the heatsink 10 is defective.
- the processing means 23 of the inspection apparatus 22 determines that the heatsink 10 is satisfactory (No at S 25 ). That is, when there is no section C in which the total size of areas A, which have been determined to have the predetermined temperature or lower in the section C, is equal to or higher than the predetermined ratio with respect to the size of the section C in the image data, the processing means 23 determines that the heatsink 10 is satisfactory.
- the heatsink 10 is also shot by the image pickup means 11 in the state where the residual heat of the substrate 8 still remains in the heat dissipation layer 9 in order to acquire image data representing a temperature distribution on the surface of the heat dissipation layer 9 . Therefore, satisfactory image data can be acquired.
- the heat dissipation layer 9 it is possible, when image data representing a temperature distribution on the surface of the heat dissipation layer 9 is acquired, to eliminate the need for heating process for heating the heat dissipation layer 9 by using heating means such as a xenon lamp. As a result, it is possible to improve efficiency of a process for inspecting whether the heatsink 10 is defective or not based on the degree of peeling of the heat dissipation layer 9 from the surface of the substrate 8 . In addition, it is possible to eliminate the need for the heating means such as a xenon lamp and thereby to contribute to a reduction in the production cost.
- heating means such as a xenon lamp
- step S 25 after determining the temperature in each area A in the section C in the entire area of the image data, it may be determined whether or not the total size of areas A having the predetermined temperature or lower in the section C is equal to or higher than the predetermined ratio with respect to the size of the section C.
- the processing means 12 of the inspection apparatus 3 determines whether the heatsink 10 is a conforming product or a defective product.
- an operator e.g., a worker
- FIG. 10 is a block diagram showing a control system of a heatsink production system according to this embodiment.
- descriptions of the same components and structures as those of the first embodiment are omitted. Further, the same components as those of the first embodiment are indicated by the same symbols as those of the first embodiment.
- a configuration of the manufacturing apparatus 2 of a production system 31 according to this embodiment is identical to that in the production system 1 according to the first embodiment.
- processes performed by the processing means 33 of the inspection device 32 differ from those performed by the processing means 12 of the production system 1 .
- the production system 31 also differs from the production system 1 because the inspection device 32 includes display means 34 .
- the processing unit 33 of the inspection apparatus 32 receives image data from the image pickup means 11 , the processing unit 33 displays the image data and sampling image data in the display means 34 . In this way, an operator compares the image data displayed in the display means 34 with the sampling image data also displayed in the display means 34 . Then, for example, when an area where the temperature of the surface of the heat dissipation layer 9 is lower than a predetermined threshold temperature is larger than an area where the temperature of the surface of the heat dissipation layer 9 is determined to be lower than the predetermined threshold temperature due to an error in the image pickup means 11 , the operator can determine that the heatsink 10 is defective.
- the image data and the sampling image data are not displayed in display means, they may be displayed in display means.
- the heatsink in the above-described embodiment may have a configuration in which, for example, a heat dissipation layer is formed in a cast article such as a cylinder head of an engine.
- the present disclosure is described as a hardware configuration in the above-described embodiments, the present disclosure is not limited to the hardware configurations.
- an arbitrary process can also be implemented by causing a CPU (Central Processing Unit) to execute a computer program.
- a CPU Central Processing Unit
- Non-transitory computer readable media include any type of tangible storage media.
- Examples of non-transitory computer readable media include magnetic storage media (such as floppy disks, magnetic tapes, hard disk drives, etc.), optical magnetic storage media (e.g. magneto-optical disks), CD-ROM (compact disc read only memory), CD-R (compact disc recordable), CD-R/W (compact disc rewritable), and semiconductor memories (such as mask ROM, PROM (programmable ROM), EPROM (erasable PROM), flash ROM, RAM (random access memory), etc.).
- magnetic storage media such as floppy disks, magnetic tapes, hard disk drives, etc.
- optical magnetic storage media e.g. magneto-optical disks
- CD-ROM compact disc read only memory
- CD-R compact disc recordable
- CD-R/W compact disc rewritable
- semiconductor memories such as mask ROM, PROM (programmable ROM), EPROM (erasable PROM), flash ROM
- the program may be provided to a computer using any type of transitory computer readable media.
- Examples of transitory computer readable media include electric signals, optical signals, and electromagnetic waves.
- Transitory computer readable media can provide the program to a computer via a wired communication line (e.g. electric wires, and optical fibers) or a wireless communication line.
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Health & Medical Sciences (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Pathology (AREA)
- Analytical Chemistry (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US17/023,238 US11802797B2 (en) | 2018-01-11 | 2020-09-16 | Inspection method, inspection apparatus, production method, and production system for heatsink |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018-002907 | 2018-01-11 | ||
JP2018002907A JP6907951B2 (ja) | 2018-01-11 | 2018-01-11 | ヒートシンクの検査方法、検査装置及び生産方法、生産システム |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US17/023,238 Division US11802797B2 (en) | 2018-01-11 | 2020-09-16 | Inspection method, inspection apparatus, production method, and production system for heatsink |
Publications (1)
Publication Number | Publication Date |
---|---|
US20190212197A1 true US20190212197A1 (en) | 2019-07-11 |
Family
ID=64900736
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US16/211,285 Abandoned US20190212197A1 (en) | 2018-01-11 | 2018-12-06 | Inspection method, inspection apparatus, production method, and production system for heatsink |
US17/023,238 Active 2040-07-13 US11802797B2 (en) | 2018-01-11 | 2020-09-16 | Inspection method, inspection apparatus, production method, and production system for heatsink |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US17/023,238 Active 2040-07-13 US11802797B2 (en) | 2018-01-11 | 2020-09-16 | Inspection method, inspection apparatus, production method, and production system for heatsink |
Country Status (4)
Country | Link |
---|---|
US (2) | US20190212197A1 (ja) |
EP (1) | EP3514527B1 (ja) |
JP (1) | JP6907951B2 (ja) |
CN (1) | CN110026350A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115460895A (zh) * | 2022-11-10 | 2022-12-09 | 武汉至驱动力科技有限责任公司 | 基于温度场图像信息的电子水泵控制器散热方法 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113808127A (zh) * | 2021-09-27 | 2021-12-17 | 苏州中诚地利科技有限公司 | 散热器检测方法及装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0154242B2 (ja) * | 1983-04-15 | 1989-11-17 | Matsushita Electric Ind Co Ltd | |
US20030128737A1 (en) * | 2001-09-07 | 2003-07-10 | Board Of Trustees Operating Michigan State University | Fluorescence emission ratio imaging thermography for use in heat transfer analysis |
JP2007292605A (ja) * | 2006-04-25 | 2007-11-08 | Kubota Matsushitadenko Exterior Works Ltd | 塗装板の塗装検査方法 |
Family Cites Families (48)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57202683A (en) | 1981-06-08 | 1982-12-11 | Toshiba Denki Kigu Kk | Method of producing heat radiating base for electric heater |
JPS60186743A (ja) | 1984-03-06 | 1985-09-24 | Mitsubishi Heavy Ind Ltd | 構造物内部欠陥検査方法及び装置 |
JPS63271127A (ja) * | 1987-04-28 | 1988-11-09 | Nikon Corp | 半導体基板の温度測定装置 |
JPS6454242U (ja) | 1987-09-26 | 1989-04-04 | ||
JP2715485B2 (ja) * | 1988-11-15 | 1998-02-18 | 日本電気株式会社 | ポリイミドベーク装置 |
JPH04248451A (ja) * | 1991-02-04 | 1992-09-03 | Dainippon Printing Co Ltd | 欠陥検出方法 |
JP2856267B2 (ja) * | 1991-05-07 | 1999-02-10 | トヨタ自動車株式会社 | 塗型膜厚の測定方法 |
US5344236A (en) * | 1992-01-23 | 1994-09-06 | Fishman Iiya M | Method for evaluation of quality of the interface between layer and substrate |
JPH08304036A (ja) * | 1995-05-10 | 1996-11-22 | Toppan Printing Co Ltd | 塗膜の塗布ムラ検査方法及びその装置 |
JP4121152B2 (ja) * | 1996-04-29 | 2008-07-23 | パーカー−ハニフイン・コーポレーシヨン | 電子部品用の適合性熱境界面材料 |
US7690840B2 (en) * | 1999-12-22 | 2010-04-06 | Siemens Energy, Inc. | Method and apparatus for measuring on-line failure of turbine thermal barrier coatings |
US6488405B1 (en) * | 2000-03-08 | 2002-12-03 | Advanced Micro Devices, Inc. | Flip chip defect analysis using liquid crystal |
JP3834749B2 (ja) | 2001-10-31 | 2006-10-18 | Nec三栄株式会社 | サーモグラフィを用いた構造物調査・診断装置及びサーモグラフィ装置による鉄筋・鉄骨コンクリート構造物の測定方法並びに構造物調査・診断システム |
JP4033809B2 (ja) * | 2003-06-16 | 2008-01-16 | 東京エレクトロン株式会社 | 熱処理装置及び熱処理方法 |
US20060114965A1 (en) * | 2003-10-10 | 2006-06-01 | Murphy John C | Thermal-based methods for nondestructive evaluation |
JP4091568B2 (ja) | 2004-05-31 | 2008-05-28 | 株式会社デンソー | エンジン制御用電子制御機器 |
KR20060019104A (ko) * | 2004-08-26 | 2006-03-03 | 삼성전자주식회사 | 웨이퍼 냉각 시스템 |
EP1828754B1 (en) * | 2004-11-12 | 2013-07-17 | Toyota Motor Engineering & Manufacturing North America, Inc. | Systems and methods for inspecting coatings, surfaces and interfaces |
US20060124853A1 (en) * | 2004-12-10 | 2006-06-15 | Andrew Corporation | Non-contact surface coating monitor and method of use |
US7409313B2 (en) * | 2005-12-16 | 2008-08-05 | General Electric Company | Method and apparatus for nondestructive evaluation of insulative coating |
WO2007147158A2 (en) * | 2006-06-16 | 2007-12-21 | Worcester Polytechnic Institute | Infrared defect detection system and method for the evaluation of powdermetallic compacts |
JP2008060288A (ja) * | 2006-08-31 | 2008-03-13 | Dainippon Screen Mfg Co Ltd | 基板処理システム |
JP2009027100A (ja) * | 2007-07-23 | 2009-02-05 | Rohm Co Ltd | 基板温度計測装置及び基板温度計測方法 |
JP5368351B2 (ja) | 2010-03-23 | 2013-12-18 | 日立オートモティブシステムズ株式会社 | 自動車用電子制御装置 |
DE102011012673A1 (de) | 2010-03-17 | 2011-09-22 | Hitachi Automotive Systems, Ltd. | Elektronische Steuereinrichtung für Fahrzeuge |
US8692887B2 (en) * | 2010-08-27 | 2014-04-08 | General Electric Company | Thermal imaging method and apparatus for evaluating coatings |
JP5724272B2 (ja) | 2010-09-28 | 2015-05-27 | Jfeスチール株式会社 | 鋼板表面検査方法および装置 |
KR101204943B1 (ko) * | 2011-04-28 | 2012-11-26 | 현대제철 주식회사 | 몰드 코팅층의 결함 진단장치 및 그 방법 |
WO2013081151A1 (ja) * | 2011-11-30 | 2013-06-06 | ダイハツ工業株式会社 | ワックスの塗布膜厚並びに塗布範囲評価方法、及び塗布検査システム |
JP5831940B2 (ja) | 2012-05-28 | 2015-12-09 | 一般財団法人電力中央研究所 | コーティング層における剥離の非破壊検査方法および非破壊検査装置 |
TWI491346B (zh) * | 2012-09-03 | 2015-07-01 | 鴻準精密工業股份有限公司 | 散熱器及其製造方法 |
KR101961097B1 (ko) * | 2012-09-06 | 2019-03-25 | 삼성전자 주식회사 | 반도체 패키지 검사 장치 |
CN103091189B (zh) * | 2013-01-10 | 2014-09-24 | 湘潭大学 | 一种模拟热障涂层服役环境并实时检测其失效的试验装置 |
JP2014219222A (ja) | 2013-05-01 | 2014-11-20 | 住友電気工業株式会社 | 鋳造材の欠陥検査方法 |
JP5752299B2 (ja) * | 2013-07-01 | 2015-07-22 | デクセリアルズ株式会社 | 熱伝導シートの製造方法、熱伝導シート、及び放熱部材 |
JP2015086090A (ja) * | 2013-10-29 | 2015-05-07 | 株式会社ノリタケカンパニーリミテド | 導体ペーストとこれを用いた放熱性基板 |
WO2016035796A1 (ja) * | 2014-09-02 | 2016-03-10 | 株式会社アライドマテリアル | 放熱部材、及び放熱部材の製造方法 |
WO2016103007A1 (fr) * | 2014-12-24 | 2016-06-30 | Arcelormittal | Procédé de contrôle d'un support comprenant un substrat métallique, un revêtement diélectrique, et une couche conductrice |
JP6678404B2 (ja) * | 2015-07-08 | 2020-04-08 | Koa株式会社 | 赤外線サーモグラフの性能評価方法 |
JP6454242B2 (ja) | 2015-08-27 | 2019-01-16 | 日本電信電話株式会社 | 負荷電流計測方法およびその装置 |
US10168217B2 (en) * | 2016-09-28 | 2019-01-01 | Amazon Technologies, Inc. | Automated thermographic inspection for composite structures |
US10175186B2 (en) * | 2016-09-28 | 2019-01-08 | Amazon Technologies, Inc. | Thermographic inspection process for composite vehicle and components |
JP2018057998A (ja) * | 2016-10-03 | 2018-04-12 | トヨタ自動車株式会社 | ヒートシンクの製造方法 |
CN106501305B (zh) * | 2016-10-18 | 2019-05-28 | 上海大学 | 基于红外热像仪的红外辐射薄膜透过率的测量方法 |
CN107153079B (zh) * | 2017-05-18 | 2024-03-29 | 金华职业技术学院 | 一种测量薄膜导热系数的方法 |
CN107286837B (zh) * | 2017-07-19 | 2019-08-06 | 深圳市新纶科技股份有限公司 | 一种导热涂料、导热涂层以及复合散热膜 |
CN110379781B (zh) * | 2019-06-05 | 2021-05-11 | 苏州通富超威半导体有限公司 | Bga产品的使用方法 |
CN209785918U (zh) * | 2019-06-12 | 2019-12-13 | 东莞市通科电子有限公司 | 一种贴片式三极管 |
-
2018
- 2018-01-11 JP JP2018002907A patent/JP6907951B2/ja active Active
- 2018-12-06 US US16/211,285 patent/US20190212197A1/en not_active Abandoned
- 2018-12-11 EP EP18211561.8A patent/EP3514527B1/en active Active
-
2019
- 2019-01-08 CN CN201910016310.5A patent/CN110026350A/zh active Pending
-
2020
- 2020-09-16 US US17/023,238 patent/US11802797B2/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0154242B2 (ja) * | 1983-04-15 | 1989-11-17 | Matsushita Electric Ind Co Ltd | |
US20030128737A1 (en) * | 2001-09-07 | 2003-07-10 | Board Of Trustees Operating Michigan State University | Fluorescence emission ratio imaging thermography for use in heat transfer analysis |
JP2007292605A (ja) * | 2006-04-25 | 2007-11-08 | Kubota Matsushitadenko Exterior Works Ltd | 塗装板の塗装検査方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115460895A (zh) * | 2022-11-10 | 2022-12-09 | 武汉至驱动力科技有限责任公司 | 基于温度场图像信息的电子水泵控制器散热方法 |
Also Published As
Publication number | Publication date |
---|---|
EP3514527A1 (en) | 2019-07-24 |
JP2019125602A (ja) | 2019-07-25 |
US20200408600A1 (en) | 2020-12-31 |
US11802797B2 (en) | 2023-10-31 |
JP6907951B2 (ja) | 2021-07-21 |
CN110026350A (zh) | 2019-07-19 |
EP3514527B1 (en) | 2021-09-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US11802797B2 (en) | Inspection method, inspection apparatus, production method, and production system for heatsink | |
JP6533789B2 (ja) | 画像解析によってレーザービームのエネルギー密度を監視する方法、および対応する装置 | |
US20060073227A1 (en) | Molding system for molding micro pattern structure having micro heating heating element and method for fabricating mold insert for molding micro pattern structure used therein | |
KR101663084B1 (ko) | 정밀 주조를 통해 거푸집을 용이하게 제거할 수 있는 수도꼭지 제조 방법 | |
JP2011516837A (ja) | サーモグラフィーで同定された複合材料の欠陥の特性評価 | |
US20180169942A1 (en) | Apparatus and method for release of additively manufactured products and build platform | |
US20180326486A1 (en) | Method for additive production, component, and apparatus for additive production | |
JP6931548B2 (ja) | 情報処理装置、温度測定システム、情報処理装置の制御方法、および制御プログラム | |
JP2016197099A (ja) | 熱変色性観察アセンブリを使用して複合材構造体の熱環境をモニターするシステム及び方法 | |
EP3287211B1 (en) | Method for producing heat sink | |
JP6010593B2 (ja) | 金型加熱装置 | |
JP2017087722A (ja) | マイクロ波エネルギを使用して3次元印刷物体から支持構造を除去するシステム及び方法 | |
JP2005138366A (ja) | 精密成形金型 | |
CA2893751C (en) | Method of measuring temperature of a heated part | |
JP2022514584A (ja) | 検査方法および検査システム | |
JP5732826B2 (ja) | 鋳造品の検査方法 | |
US20160288423A1 (en) | Three-dimensional printed part removal using a bimetallic platen | |
JP2017032530A (ja) | 粗材の変位量計測方法 | |
JP2006250714A (ja) | プレス成形後の成形体のネッキング検出方法及び装置 | |
JP2018057998A (ja) | ヒートシンクの製造方法 | |
CN104347438A (zh) | 玻璃基板与金属基板的结合方法 | |
EP3340287B1 (en) | Pattern-based temperature measurement for a bonding device and a bonding system | |
WO2017114409A1 (zh) | 散热片表面溢料处理方法 | |
JP2005188994A (ja) | 金型上の塗布剤の膜厚測定方法及び金型上の塗布剤の塗布量制御方法 | |
JP2006346939A (ja) | 複合型光学素子の成型装置およびその成型方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: TOYOTA JIDOSHA KABUSHIKI KAISHA, JAPAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:EGAWA, YUTA;TAKAMI, KATSUHIRO;SIGNING DATES FROM 20181106 TO 20181115;REEL/FRAME:047686/0841 |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: NON FINAL ACTION MAILED |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: NON FINAL ACTION MAILED |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: FINAL REJECTION MAILED |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |