US20140097002A1 - Electrical components and methods and systems of manufacturing electrical components - Google Patents

Electrical components and methods and systems of manufacturing electrical components Download PDF

Info

Publication number
US20140097002A1
US20140097002A1 US13/836,861 US201313836861A US2014097002A1 US 20140097002 A1 US20140097002 A1 US 20140097002A1 US 201313836861 A US201313836861 A US 201313836861A US 2014097002 A1 US2014097002 A1 US 2014097002A1
Authority
US
United States
Prior art keywords
coating layer
irradiating
electron beam
substrate
processing state
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/836,861
Other languages
English (en)
Inventor
Soenke Sachs
Helge Schmidt
Michael Leidner
Eva Henschel
Dominique Freckmann
Marjorie Myers
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TE Connectivity Germany GmbH
TE Connectivity Corp
Original Assignee
Tyco Electronics AMP GmbH
Tyco Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US13/836,861 priority Critical patent/US20140097002A1/en
Assigned to TYCO ELECTRONICS CORPORATION reassignment TYCO ELECTRONICS CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: FRECKMANN, DOMINIQUE, MYERS, MARJORIE
Assigned to TYCO ELECTRONICS SERVICES GMBG reassignment TYCO ELECTRONICS SERVICES GMBG ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SACHS, Soenke, SCHMIDT, HELGE, HENSCHEL, Eva, LEIDNER, MICHAEL
Application filed by Tyco Electronics AMP GmbH, Tyco Electronics Corp filed Critical Tyco Electronics AMP GmbH
Assigned to TYCO ELECTRONICS AMP GMBH reassignment TYCO ELECTRONICS AMP GMBH ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: TYCO ELECTRONICS SERVICES GMBH
Priority to JP2015535691A priority patent/JP2015530760A/ja
Priority to KR1020157008710A priority patent/KR101728619B1/ko
Priority to PCT/US2013/061107 priority patent/WO2014055271A1/en
Priority to EP13771341.8A priority patent/EP2904883A1/en
Priority to MX2015004055A priority patent/MX350165B/es
Priority to BR112015007557A priority patent/BR112015007557A2/pt
Priority to CN201380051737.XA priority patent/CN104704930B/zh
Publication of US20140097002A1 publication Critical patent/US20140097002A1/en
Priority to US14/711,453 priority patent/US10154595B2/en
Assigned to TE CONNECTIVITY GERMANY GMBH reassignment TE CONNECTIVITY GERMANY GMBH CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: TYCO ELECTRONICS AMP GMBH
Abandoned legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/092—Particle beam, e.g. using an electron beam or an ion beam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/111—Preheating, e.g. before soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1157—Using means for chemical reduction

Definitions

  • the subject matter herein relates generally to electrical components and methods and systems of manufacturing electrical components.
  • Electrical components such as circuit boards, typically have coating layers applied to substrates.
  • the coating layer may define a conductive trace or circuit on the circuit board and/or may be used to enhance electrical properties of the electrical components.
  • the coating layers may enhance electrical properties such as by enhancing the conductivity of the electrical component and providing electrical connections between components which are assembled on the circuit board.
  • the coating layers are conductive metallic structures applied to the substrate.
  • Application of such layers are typically accomplished either by deposition of the conductive metallic structures by using masks (e.g. vacuum evaporation, sputtering, chemical vapor deposition, plating) or by printing metallic pastes or inks on the substrate and then a subsequent thermal post-treatment.
  • masks e.g. vacuum evaporation, sputtering, chemical vapor deposition, plating
  • metallic pastes or inks on the substrate and then a subsequent thermal post-treatment.
  • a method of manufacturing an electrical component is providing an electrically insulating substrate having an outer surface, applying a coated structure on the outer surface and irradiating the coated structure with an electron beam to form an electrical conductor on the substrate.
  • the irradiating may include heating the coating layer to melt the coating layer to form the electrical conductor.
  • the coating layer may have a low binder concentration and a high metal concentration.
  • the irradiating may include vaporizing substantially all the binder leaving a substantially pure metallic layer to form the electrical conductor.
  • the coating layer may be irradiated until non-metallic material of the coating layer is completely removed.
  • the coating layer may be printed directly on the outer surface of the substrate and the coating layer may include metal precursors.
  • the irradiating may chemically reduce the metal precursors to metals to form the electrical conductor.
  • the irradiating may include reacting the metal precursors with the electrons of the electron beam to transform the coating layer.
  • the method may include preheating the coating layer to a temperature below a melting point of the coating layer prior to irradiating the coating layer.
  • the irradiating may heat the coating layer to a temperature above the melting point of the coating layer.
  • the method may include irradiating different portions of the coating layer differently to form a resistor in the electrical conductor.
  • the irradiating may include controlling operating parameters of the electron beam based on the properties of the coating layer.
  • the coating layer may be electrically grounded during the irradiating process.
  • an electrical component including a substrate having an outer surface and a coating layer selectively applied to the outer surface.
  • the coating layer is configured in a pre-processing state and in a post-processing state after irradiating with an electron beam.
  • the coating layer is transformed from the pre-processing state to the post-processing state.
  • An electron beam at least partially penetrates the coating layer during the irradiating process to transform the coating layer.
  • a non-metallic material content of the coating layer may be higher at the pre-processing state than the post-processing state.
  • the non-metallic material may be removed during the irradiating process by the electron beam.
  • the coating layer may have a low binder concentration when applied to the substrate, and substantially all of the binder may be removed during the irradiating process by the electron beam.
  • an electrical component forming system including a chamber, an irradiation source generating electron beams and a substrate positioned in the chamber.
  • the substrate has a coating layer selectively applied to the substrate.
  • the electron beams at least partially penetrate the coating layer to form an electrical conductor on the substrate.
  • FIG. 1 illustrates an electrical component being processed to form an electrical conductor on a substrate.
  • FIG. 2 illustrates a circuit board manufactured using an electron beam to irradiate selectively deposited coating layers to form electrical conductors in the form of conductive traces defining circuits.
  • FIG. 3 illustrates an electrical component forming system in accordance with an exemplary embodiment.
  • FIG. 4 illustrates the interaction of the electron beam with the coating layer.
  • FIG. 5 illustrates a method of manufacturing an electrical component.
  • Embodiments described herein include a method of manufacturing an electrical component that includes irradiating a coating layer with an electron beam to form an electrical conductor on a substrate.
  • Embodiments described herein include a system that uses an electron beam to irradiate a coating layer on a substrate to transform the coating layer to enhance one or more electrical properties of the coating layer.
  • Embodiments described herein include an electrical component having a coating layer that is transformed by energy from an electron beam to enhance electrical properties of the coating layer to form an electrical conductor.
  • Embodiments described herein may include an electrical component having the form of a circuit board with electrical conductors forming circuits thereon, the electrical conductors being processed by an electron beam.
  • Other types of electrical components may be manufactured using the systems and methods described herein.
  • Embodiments described herein may achieve a high quality electrical conductor by using a non-adiabatic electron beam processing technique.
  • heat may be generated inside the coating layer quickly (e.g. within microseconds), which may transform the coating layer to enhance properties of the coating layer.
  • the heat may be used to melt or remelt some or all of the compounds or materials of the coating layer.
  • the electrons of the electron beam may react with materials of the coating layer to transform the coating layer into a conductive structure.
  • Some of the material of the coating layer may be segregated and/or evaporated by the electron beam during processing to transform the composition of the coating layer.
  • the material used for the coating layer may be selected to function well with the electron beam processing.
  • Embodiments described herein may provide a coating layer and electrical conductor with substantially all residual non-metallic (e.g. organic) material from the paste or ink (used to apply the coating layer to the substrate) removed during electron beam processing of the coating layer.
  • the post-processed electrical conductor may be a dense, pore-free metallic coating.
  • the coating layer may have an initial concentration of non-metallic material (e.g. binder) that is lower, even much lower, than conventional paste (e.g. paste that is processed in a thermal oven).
  • the coating layer may have a final concentration of non-metallic material (e.g. binder) that is lower, even much lower, than components made with conventional paste (e.g. processing in a thermal oven).
  • Embodiments described herein may enhance or select control parameters to achieve a high quality electrical conductor.
  • the interaction of the electron beam with the applied coating layer and substrate may be considered.
  • the interaction of parameters including the metal ink composition, the printing technique (e.g. micro dispensing, screen printing, pad printing, ink jet printing, aerosol jet printing, and the like), and/or the electron beam levels may be considered and balanced.
  • Embodiments described herein produce an electrical conductor that may have properties necessary to provide stable electro-mechanical performance throughout the lifetime of the electrical component.
  • the electrical conductor may have a low and stable electrical contact resistance and good resistance to environmental degradation factors such as corrosive gas or high temperature exposures.
  • the electron beam may be precisely controlled allowing for high spatial resolution of the electrical conductor.
  • the finish of the electrical conductor may be controlled by the electron beam process and the materials of the coating layer to achieve the desired properties.
  • the electrical conductor may have appropriate coating qualities such as layer composition, film thicknesses, roughness, topography, structure, and the like.
  • FIG. 1 illustrates an electrical component 100 being processed to form an electrical conductor 102 on a substrate 104 .
  • a coating layer 106 is applied on an outer surface 108 of the substrate 104 .
  • the coating layer 106 is processed by an electron beam 110 generated from an irradiation source 112 .
  • FIG. 1 illustrates the electrical component 100 at different stages or states of the processing. For example, at 120 , the coating layer 106 of the electrical component 100 is shown at a pre-processing state. At 122 , the coating layer 106 of the electrical component 100 is shown at a processing state, at which the electron beams 110 at least partially penetrate the coating layer 106 .
  • the coating layer 106 is irradiated to transform one or more properties of the material of the coating layer 106 .
  • the coating layer 106 may be transformed into a conductive structure, such as a circuit of the electrical component 100 .
  • the coating layer 106 of the electrical component 100 is shown at a post-processing state, after irradiation from the electron beam 110 .
  • the substrate 104 may be a non-metallic substrate.
  • the substrate 104 may be a plastic material, an FR-4 material, a ceramic material, a glass epoxy material, a foil, a semi-conductor or another type of dielectric material as the base material.
  • the substrate 104 may be used to form a circuit board or an antenna structure.
  • FIG. 2 illustrates a circuit board 130 , in accordance with an exemplary embodiment, defining an electrical component 100 manufactured using the electron beam 110 to irradiate selectively deposited coating layers 106 to form electrical conductors 102 in the form of conductive traces defining circuits.
  • different portions of the coating layer 106 may be irradiated differently, such as to form a resistor 131 or a resistor network in one or more of the electrical conductors 102 .
  • the resistors 131 may be formed by processing the electrical conductors 102 and/or depositing a coating layer 106 having a high resistance.
  • the resistors 131 may be incorporated into the electrical conductor 102 paths or circuits by variation of the parameters of the electron beam 110 during irradiation. No assembly or mounting of resistors to the circuit board 130 is then necessary.
  • the coating layer 106 may be applied by printing a conductive or metallic ink or paste on the outer surface 108 .
  • the coating layer 106 may be applied directly to the outer surface 108 .
  • one or more layers may be provided between the substrate 104 and the coating layer 106 .
  • the substrate 104 may be cleaned, de-oxidized, and/or chemically activated prior to printing the coating layer 106 on the outer surface 108 , in order to enhance the adhesion of the coating layer 106 to the outer surface 108 .
  • the coating layer 106 includes metal particles of various shapes and sizes.
  • the coating layer 106 may include a binder to promote as-printed adhesion and/or a surfactant to prevent metal particle agglomeration (e.g. 1-2 wt %).
  • the coating layer 106 may include a solvent and/or process aids needed for the printing process(es).
  • the coating layer 106 may contain additional flux additives (e.g. commercial brazing flux, borax, and potassium-tetraborate), such as at levels between 1 and 10 wt %. The flux may be added to adjust a wetting behavior of the coating layer 106 during post processing with the electron beam 110 .
  • the coating layer 106 may have a high metal concentration (e.g. greater than 50 wt %).
  • the metal particles may be 100% silver particles.
  • Other types of metals may be used in alternative embodiments, such as gold, copper, nickel, tin, zinc, titanium, palladium, platinum, and the like and/or alloys thereof
  • the coating layer 106 material may include metal precursors which can be chemically reduced to metals.
  • metal salts, metal oxides, and other metal compounds may be used, such as silver chloride, tin chloride, and silver nitrate.
  • the precursors may include metals having low melting points, such as tin, zinc, copper, silver, and the like.
  • intermetallic structures may be created during the electron beam processing to achieve desired characteristics or properties for the coating layer 106 .
  • the coating layer 106 may be a microstructure structure of micro particles and/or nano-particles.
  • the coating layer 106 may include a mixed powder of solid metal particles, such as Sn and Ag particles, with a binder, solvent and/or flux mixture. The metal particles are melted with the electron beam 110 to generate a solution where the materials are mixed on the atomic scale.
  • the coating layer 106 may be rapidly cooled to quickly solidify the solution to inhibit phase separations and grain growth. Having good mixture of the materials and having quick solidification, leads to a fine material microstructure.
  • differently sized and shaped metal particle may be used. Precursors, which are reduced to metallic particles during the irradiation and melting process (e.g. metal salts, metal oxides) may be used.
  • a diffusion barrier layer may be provided between the substrate 104 and the coating layer 106 , such as to reduce interdiffusion between the material of the substrate 104 and the material of the coating layer 106 .
  • the binder concentration may be relatively low (e.g. less than 5 wt %), such as compared to the metal particle concentration.
  • the binder concentration may be relatively low compared to conventional pastes that are used in conventional thermal oven post-treatment applications.
  • the binder concentration may be between approximately 25 wt % and 5 wt %. Alternatively, the binder concentration may be very low (e.g. less than 1 wt %).
  • Examples of binders include dextrins, polyvinyl butyral resins (e.g. Butvar), hydroxypropylcellulose (e.g. Klucel®), but other types of binders may be used in alternative embodiments.
  • the binder may include glue or other additives to change a viscosity of the coating material for ease of application to the substrate 104 .
  • the coating layer 106 may be applied by one of various different printing techniques, such as screen printing, pad printing, ink jet printing, aerosol jet printing, micro dispensing, spin coating, a wiping application and the like. Other application techniques other than printing may be used in alternative embodiments to apply the coating layer 106 to the substrate 104 .
  • the coating layer 106 may be applied by powder coating, spraying, dip immersion or other processes.
  • the application technique may selectively apply the coating layer 106 to the substrate 104 , such as along a predetermined circuit trace path.
  • the printing technique may allow for a standardized pattern to be printed on the substrate 104 , and the printing may be done in a batch printing application or a continuous reel printing application.
  • the printing technique may be chosen according to the smallest structure sizes of the paste or ink, the layer thicknesses being applied, the composition of the coating layer material, and the like.
  • FIG. 3 illustrates a electrical component forming system 140 used to irradiate the electron beam 110 at the electrical component 100 in accordance with an exemplary embodiment.
  • the system 140 may be an electron beam micro welder capable of producing the electron beam 110 .
  • the processing may be performed in a vacuum chamber 142 .
  • the power of the irradiation source 112 may be controlled during processing.
  • the energy density of the electron beam 110 may be controlled during processing.
  • the deflection speed of the electrons may be controlled during processing.
  • the maximum acceleration voltage may be controlled during processing.
  • the maximum electron beam current may be controlled during processing.
  • the beam focus spot size and depth on the target may be controlled during processing.
  • the electron beam 110 may be controlled based on properties of the deposited layer (e.g.
  • the coating layer 106 and/or the substrate 104 may be heated to a temperature below the melting point to change characteristics of the layer(s) by reacting materials and/or sintering the layer(s).
  • the system 140 may be equipped with both a backscatter electron and a secondary electron detector which can be used to produce electron beam images of the work piece, similar to a Scanning Electron Microscope (SEM). The images can be viewed live on a screen or saved using a computer.
  • the system 140 may include software to control the functions of the irradiation source 112 , such as to program the electron beam 110 to scan defined paths over the sample or to irradiate defined patterns.
  • the electron beam paths may be sweeping paths, scanning paths, spiral paths or other irregular paths.
  • the software may allow synchronous movement of the electron beam 110 with the irradiated sample, such as a continuously moved reel. In such a way, a continuous remelting process is possible.
  • the system 140 may include a heat sink, such as a thick aluminum plate heat sink having a high thermal mass and positioned in good thermal contact with the target.
  • FIG. 4 illustrates the interaction of the electron beam 110 with the coating layer 106 .
  • the electron beam 110 is focused internal of the coating layer 106 .
  • the electron beam 110 at least partially penetrates the coating layer 106 .
  • a beam focus spot 150 is in the coating layer 106 rather than in the substrate 104 . Irradiation or heating of the substrate 104 is limited by having the electron beam 110 focused on the coating layer 106 .
  • the electron beam 110 is used to irradiate the material of the coating layer 106 to achieve electrical conductivity within the coating layer. As the impinging electrons of the electron beam 110 are scattered by the material of the coating layer 106 , kinetic energy of the electrons is converted into heat energy.
  • the scattering probability may be dependent on the energy of the electrons, on the density of the irradiated material of the coating layer 106 , on the beam focus depth, and the like.
  • the penetration depth of the electron beam may be between 0.5 ⁇ m and 20 ⁇ m.
  • a characteristic of the energy dependence of the scattering probability is that the maximum of the generated heat density does not lie at the surface of the material but at about 1 ⁇ 3 of the penetration depth. Heat is generated not only at the surface but inside the material of the coating layer 106 . A part of the electrons are reflected or re-emitted from the coating layer 106 .
  • Such electrons can be utilized to generate in-situ SEM pictures during irradiation, such as to control the irradiation process via a feedback control system.
  • the power of the heat which is generated is dependent on the electron current for a fixed acceleration voltage.
  • the product of the acceleration voltage and the beam current gives the power of the beam.
  • the power can be adjusted by controlling the electron current and/or the acceleration voltage.
  • Another parameter that may be adjusted to control the irradiation process is the duration of irradiation at or near a spot of the coating layer 106 .
  • the printed material of the coating layer 106 melts if the generated heat exceeds the thermal energy needed to heat the material to its melting point and the latent heat of fusion of the material. Having the heat energy focused in the coating layer 106 , as opposed to the substrate 104 , generates heat and melting of the coating layer 106 very quickly.
  • the substrate 104 may act as a heat sink to quickly dissipate heat from the coating layer 106 after irradiation enabling high cooling rates of the molten film.
  • Quick heating and cooling rates may affect the properties of the electrical conductor formed by the coating layer 106 .
  • the hardness of the electrical conductor may be higher with quick heating and cooling as opposed to slow heating and cooling of the coating layer 106 , as is typical of thermal curing in a thermal oven where the substrate 104 is heated in addition to the paste.
  • more heat energy is needed to heat the paste in a thermal oven because the substrate is heated in addition to the paste.
  • the use of thermally sensitive substrates 104 may be possible.
  • the quick heating and cooling of the coating layer 106 may avoid heating of the substrate 104 by heat conduction.
  • binders typically have a mass density an order of magnitude lower than the metal particles in the coating layer 106 , the volume percentage of the binders in the coating layer 106 are even higher.
  • a conventional paste typical for use in an application cured in a thermal oven is a 90Ag/10Mo material with 23 wt % Butvar binder, which is a high binder concentration and is borderline very high binder concentration.
  • Such conventional paste has a binder volume fraction of approximately 75%.
  • the high or very high binder concentrations of conventional pastes is needed to securely fix the printed structures onto the substrate and the binder remains post thermal treatment using conventional thermal ovens.
  • the coating layer 106 does not require such a high binder content as the binder is only needed to keep the printed coating layer 106 adhered to the substrate 104 long enough to transfer the substrate 104 to the electron beam 110 for irradiation.
  • a binder content may be approximately 1 wt %, greatly reducing the volume percentage as well.
  • the coating layer 106 is dense and has good adhesion to the substrate.
  • the binder is intended to be substantially entirely removed from the coating layer 106 during the irradiation process, such as by evaporation or by decomposition.
  • a low concentration of binder in the coating layer 106 allows quicker and more thorough evaporation or removal of the binder during irradiation.
  • a binder having properties such as high paste quality, high printed film adhesion, film quality of the coating layer 106 after irradiation (e.g. low concentration of carbon residue (char) after irradiation), and the like are considered when selecting the binder material.
  • binders include dextrins, polyvinyl butyral resins (e.g. Butvar), hydroxypropylcellulose (e.g. Klucel®), but other types of binders may be used in alternative embodiments.
  • all or substantially all of the binder is irradiated by the electron beam 110 and a low amount of carbon residue remains, which may be removed by scraping or another processing technique.
  • the operation of the electron beam 110 may vary based on the type of material of the coating layer 106 .
  • the operation may be different when using pure metallic material versus using metal precursors.
  • the post-processing and irradiation of the coating layer 106 may be controlled by adjusting the energy density and exposure time in such a way that the metal particles sinter or at least one of the metallic components goes into the melt phase and the coating layer 106 fuses into a homogeneous metallic layer.
  • a two-step process with sintering and subsequent melting is possible in some embodiments.
  • the non-metallic components e.g. the binder
  • the post-processing and irradiation of the coating layer 106 is controlled by the energy density and exposure time in such a way that the metal precursors are chemically reduced to metals, either indirectly by the heat input into the coating layer 106 or directly by interaction of the metal precursors with the electrons of the electron beam 110 .
  • the non-metallic components e.g. the binder
  • the coating layer 106 may transform into a homogeneous metallic layer when the precursors are chemically altered by the electron beam 110 .
  • the thermal energy generated by the electron beam 110 inside the coating layer 106 can be controlled by adjusting parameters of the electron beam 110 .
  • the coating layer 106 may be only partially melted and may not bond to the substrate 104 .
  • the particles of the coating layer 106 may be only sintered and not completely melted. In such situations, the coating layer 106 may not adhere well to the substrate 104 and may be easily displaced mechanically over time.
  • portions of the coating layer 106 may be removed by the electron beam, such as by splattering away the material upon irradiation.
  • the substrate 104 may melt in addition to the coating layer 106 , which provides a poorer electrical interface.
  • the energy level of the electron beam 110 should be controlled to achieve melting of the coating layer 106 while having good covering of the substrate 104 and without excessive damage to the substrate 104 .
  • particle blowing or spattering of the coating layer 106 may occur at any energy level.
  • the amount of non-metallic components may be reduced or minimized, since the less filler there is between the particles, the higher the number of conductive paths between the particles there are to ‘bleed off’ excessive charge to ground.
  • the coating layer 106 may be preheated such that lower beam power is required before the actual melting.
  • the coating layer 106 may be preheated to a temperature below the melting point of the coating layer 106 , such as in a thermal oven, using the electron beam, or otherwise. During the irradiation process, the coating layer 106 is then further heated to a temperature above the melting point of the coating layer 106 .
  • larger particle sizes of the material of the coating layer 106 may be used or particles of irregular (non-spherical) shapes may be used to reduce effects of particle blowing, since more mechanical contacts between the particles could increase the forces to move particles relative to each other, as well as possibly creating more conductive paths.
  • the scanning or irradiation pattern may be selected to heat the material of the coating layer 106 indirectly via heat conduction, such as through the substrate 104 .
  • the material composition of the coating layer may have a high metal particle density and/or low porosity to increase the electrical and heat conductivity.
  • the coating layer 106 may be grounded.
  • the electron beam 110 may be operated at low accelerating voltages to increase electron emission.
  • a light e.g. UV or laser
  • the coating layer 106 may be processed at an increased pressure (e.g. with argon partial pressure).
  • the control of the electron beam 110 may be varied along the coating layer 106 .
  • the characteristics of the coating layer 106 may be varied.
  • resistors may be incorporated into the electrical conductor paths or circuits by variation of the parameters of the electron beam 110 . No assembly or mounting of resistors is then necessary.
  • the irradiation source 112 may producing the electron beam 110 at a power of approximately 2 kW; however it may be more or less in other embodiments.
  • the electron beam 110 may have an acceleration voltage of approximately 60 kV; however it may be more or less in other embodiments.
  • the electron beam 110 may have an electron beam current of between approximately 0.15 mA and 15 mA; however it may be more or less in other embodiments, such as approximately 40 mA.
  • the beam focus spot size on the coating layer 106 may be approximately 100 ⁇ m; however it may be more or less in other embodiments, such as between approximately 30-50 ⁇ m.
  • the electron beam 110 may have an irradiation time durations of between approximately 12 ⁇ s/spot and 1000 ⁇ s/spot; however it may be more or less in other embodiments.
  • FIG. 5 illustrates a method 200 of manufacturing an electrical component, such as a circuit board, an antenna, and the like.
  • the method 200 includes providing 202 an electrically insulating substrate having an outer surface.
  • the substrate may include an insulative base, such as plastic, glass, ceramic and the like, such as for use in making a circuit board.
  • the method 200 includes applying 204 a coating layer on the outer surface of the substrate.
  • the coating layer may be a paste or ink.
  • the coating layer may be a powder or may have other forms.
  • the coating layer includes a high concentration of metallic particles to form a high quality electrical conductor, such as a circuit trace or a coating on the substrate.
  • the coating layer may include binder to secure the coating layer to the substrate. The binder concentration may be low, with the intention of removing substantially all of the binder during processing.
  • the coating layer may include precursors, such as metal oxides or metal salts that are processed at a later step.
  • the coating layer may be applied 204 by printing the coating layer on the substrate.
  • the coating layer may be screen printed, pad printed, ink jet printed, aerosol jet printed.
  • the coating layer may be applied by micro dispensing, spin coating, a wiping application, powder coating, spraying, dip immersion or other processes.
  • the coating layer may be applied directly to the outer surface of the substrate. Alternatively, other layers may be provided therebetween.
  • the method 200 includes preheating 206 the coating layer prior to other processing steps, such as processing the coating layer with an electron beam.
  • the coating layer may be preheated to a temperature below a melting point of the coating layer prior to other processing steps, where the temperature may be increased to a temperature above the melting point of the coating layer.
  • the method 200 includes electrically grounding 208 the coating layer prior to other processing steps, such as processing the coating layer with an electron beam.
  • the grounding 208 may reduce sputtering of the coating layer during processing with the electron beam.
  • the method 200 includes irradiating 210 the coating layer with an electron beam to form an electrical conductor on the substrate.
  • the electron beam may be spot focused within the coating layer, such as at about 1 ⁇ 3 to 2 ⁇ 3 of the depth of the coating layer, making it possible to generate heat not only at the surface of the material but inside the material.
  • the irradiation with the electron beam may heat the coating layer to melt the coating layer to form the electrical conductor.
  • the metal precursors may interact with the electrons of the electron beam during irradiation to transform the coating layer into a conductive structure.
  • the electron beam may chemically reduce the metal precursors to metals to form the electrical conductor.
  • the irradiating 210 may vaporize substantially all the binder or non-metallic material of the coating layer leaving a substantially pure metallic layer to form the electrical conductor.
  • the coating layer may be irradiated until the non-metallic material of the coating layer is completely removed.
  • the irradiation process may be controlled, such as by controlling operating parameters of the electron beam, based on the properties of the coating layer, such as the thickness, composition, concentration of binder, and the like.
  • different portions of the coating layer may be irradiated differently, such as to form a resistor in the electrical conductor.
  • the electrical component may be a structured electrical component.
  • layers of the electrical component may be printed in a structured way and irradiated via an electron beam to get predefined properties in one or more of the layers.
  • the electrical component may be laminated or printed on or in a way to define a plane structure. Electron beams may irradiate all or selected portions of the layered structure, and then excess laminated/printed material may be removed.
  • the methods and systems described herein of processing a coating layer 106 with an electron beam 110 achieve a high quality electrical conductor for an electronic component.
  • the process may be performed without wet chemistry and at reduced environmental impact.
  • the metal consumption for manufacturing the electrical component may be reduced as compared to other manufacturing techniques.
  • the process achieves high selectivity and precise placement of the coating layer 106 .
  • the coating layer 106 and electronic component may be processed quickly, and may be processed as part of a continuous reel-to-reel system or a batch system.
  • the electrical conductors defined by the processed coating layer 106 provide improved properties compared to standard procedures. For example, the conductors may have increased electrical conductivity, increased thermal conductivity, better corrosion resistance, increased hardness, and the like.
US13/836,861 2012-10-05 2013-03-15 Electrical components and methods and systems of manufacturing electrical components Abandoned US20140097002A1 (en)

Priority Applications (9)

Application Number Priority Date Filing Date Title
US13/836,861 US20140097002A1 (en) 2012-10-05 2013-03-15 Electrical components and methods and systems of manufacturing electrical components
CN201380051737.XA CN104704930B (zh) 2012-10-05 2013-09-23 电气部件和制造电气部件的方法和系统
BR112015007557A BR112015007557A2 (pt) 2012-10-05 2013-09-23 componentes elétricos e métodos e sistemas de fabricação de componentes elétricos
JP2015535691A JP2015530760A (ja) 2012-10-05 2013-09-23 電気部品並びに電気部品を製造する方法及びシステム
MX2015004055A MX350165B (es) 2012-10-05 2013-09-23 Componentes eléctricos y métodos y sistemas de fabricación de componentes eléctricos.
KR1020157008710A KR101728619B1 (ko) 2012-10-05 2013-09-23 전기 컴포넌트, 전기 컴포넌트의 제조 방법 및 시스템
PCT/US2013/061107 WO2014055271A1 (en) 2012-10-05 2013-09-23 Electrical components and methods and systems of manufacturing electrical components
EP13771341.8A EP2904883A1 (en) 2012-10-05 2013-09-23 Electrical components and methods and systems of manufacturing electrical components
US14/711,453 US10154595B2 (en) 2012-10-05 2015-05-13 Electrical components and methods and systems of manufacturing electrical components

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261710365P 2012-10-05 2012-10-05
US13/836,861 US20140097002A1 (en) 2012-10-05 2013-03-15 Electrical components and methods and systems of manufacturing electrical components

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US14/711,453 Division US10154595B2 (en) 2012-10-05 2015-05-13 Electrical components and methods and systems of manufacturing electrical components

Publications (1)

Publication Number Publication Date
US20140097002A1 true US20140097002A1 (en) 2014-04-10

Family

ID=50431849

Family Applications (2)

Application Number Title Priority Date Filing Date
US13/836,861 Abandoned US20140097002A1 (en) 2012-10-05 2013-03-15 Electrical components and methods and systems of manufacturing electrical components
US14/711,453 Active US10154595B2 (en) 2012-10-05 2015-05-13 Electrical components and methods and systems of manufacturing electrical components

Family Applications After (1)

Application Number Title Priority Date Filing Date
US14/711,453 Active US10154595B2 (en) 2012-10-05 2015-05-13 Electrical components and methods and systems of manufacturing electrical components

Country Status (8)

Country Link
US (2) US20140097002A1 (zh)
EP (1) EP2904883A1 (zh)
JP (1) JP2015530760A (zh)
KR (1) KR101728619B1 (zh)
CN (1) CN104704930B (zh)
BR (1) BR112015007557A2 (zh)
MX (1) MX350165B (zh)
WO (1) WO2014055271A1 (zh)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017066342A1 (en) 2015-10-12 2017-04-20 Te Connectivity Corporation Electronic component and process of producing eletronic component
WO2017066338A1 (en) 2015-10-12 2017-04-20 Te Connectivity Corporation Process of producting electronic component and an electronic component
US20180097295A1 (en) * 2015-06-08 2018-04-05 Te Connectivity Germany Gmbh Electrical Contact Element And Method For Altering Mechanical And/Or Electrical Properties Of At Least One Area Of Such
CN108156678A (zh) * 2016-12-06 2018-06-12 财团法人工业技术研究院 可挠热电结构与其形成方法
US20190059158A1 (en) * 2017-08-17 2019-02-21 Avery Dennison Retail Information Services, Llc Use of rf driven coherence between conductive particles for rfid antennas
EP3518279A1 (en) * 2018-01-26 2019-07-31 Meng-Hsiu Hsieh Ceramic circuit plate and method of making same
US11856834B2 (en) 2019-06-21 2023-12-26 Boe Technology Group Co., Ltd. Display substrate and method for preparing the same, and display device

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013113485A1 (de) * 2013-12-04 2015-06-11 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Ausbilden einer elektrisch leitfähigen Struktur auf einem Kunststoffsubstrat
JP6699827B2 (ja) * 2016-12-27 2020-05-27 Ｎｅｘｔ Ｉｎｎｏｖａｔｉｏｎ合同会社 ダイヤモンド系通電構造の製造方法
EP3761452A1 (de) * 2019-07-03 2021-01-06 Gebauer & Griller Kabelwerke Gesellschaft m.b.H. Elektrische verbindung zwischen einem elektrischen leiter und einem kontaktelement
US11554537B2 (en) * 2021-02-09 2023-01-17 Xerox Corporation Polymer filaments comprising a metal precursor for additive manufacturing and methods associated therewith
US20230268682A1 (en) * 2022-02-23 2023-08-24 TE Connectivity Services Gmbh Metal polymer composite films as contact finish for low normal load sockets

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3968056A (en) * 1974-09-27 1976-07-06 General Electric Company Radiation curable inks
US4694138A (en) * 1984-02-10 1987-09-15 Kabushiki Kaisha Toshiba Method of forming conductor path
US4942110A (en) * 1988-08-29 1990-07-17 Xerox Corporation High resolution conductor patterning
US5141602A (en) * 1991-06-18 1992-08-25 International Business Machines Corporation High-productivity method and apparatus for making customized interconnections
US20050276912A1 (en) * 2004-06-14 2005-12-15 Hiroko Yamamoto Wiring substrate, semiconductor device and manufacturing method thereof
US20060275705A1 (en) * 2005-06-01 2006-12-07 Hewlett-Packard Development Company Lp Conductive patterning
US20080038928A1 (en) * 2006-08-14 2008-02-14 Micron Technology, Inc. Electron beam etching device and method

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3081485A (en) * 1958-11-20 1963-03-19 Steigerwald Karl Heinz Process and apparatus for treating synthetic plastic materials
US3294951A (en) * 1963-04-30 1966-12-27 United Aircraft Corp Micro-soldering
JPS59204036A (ja) * 1983-05-06 1984-11-19 Dainippon Ink & Chem Inc レジストパタ−ンの形成法
JPH04247681A (ja) * 1991-02-04 1992-09-03 Fujitsu Ltd 導体パターンの形成方法
US5599468A (en) 1994-10-03 1997-02-04 Frederick M. Mako Pulsed electron beam joining of materials
US5855755A (en) * 1995-06-19 1999-01-05 Lynntech, Inc. Method of manufacturing passive elements using conductive polypyrrole formulations
JPH09110534A (ja) * 1995-10-13 1997-04-28 Dainippon Printing Co Ltd 焼結体膜の形成方法
US5825123A (en) * 1996-03-28 1998-10-20 Retsky; Michael W. Method and apparatus for deflecting a charged particle stream
US5780970A (en) * 1996-10-28 1998-07-14 University Of Maryland Multi-stage depressed collector for small orbit gyrotrons
US5897794A (en) 1997-01-30 1999-04-27 The United States Of America As Represented By The Secretary Of The Navy Method and apparatus for ablative bonding using a pulsed electron
JP3422233B2 (ja) 1997-09-26 2003-06-30 株式会社村田製作所 バイアホール用導電性ペースト、およびそれを用いた積層セラミック基板の製造方法
US6235353B1 (en) 1998-02-24 2001-05-22 Alliedsignal Inc. Low dielectric constant films with high glass transition temperatures made by electron beam curing
JP3232051B2 (ja) * 1998-09-28 2001-11-26 京セラ株式会社 電子装置の製造方法
US6187418B1 (en) 1999-07-19 2001-02-13 International Business Machines Corporation Multilayer ceramic substrate with anchored pad
EP1267360A4 (en) * 2000-02-21 2003-04-02 Toyo Ink Mfg Co CONDUCTIVE PASTE OF THE ACTIVE ENERGY RAY CURING TYPE, MANUFACTURING METHOD AND MODULE FOR A SEMICONDUCTOR CIRCUIT SUBSTRATE AND NON-CONTACT ID AND MANUFACTURING METHOD THEREFOR
US20040209190A1 (en) * 2000-12-22 2004-10-21 Yoshiaki Mori Pattern forming method and apparatus used for semiconductor device, electric circuit, display module, and light emitting device
EP1223615A1 (en) * 2001-01-10 2002-07-17 Eidgenössische Technische Hochschule Zürich A method for producing a structure using nanoparticles
US7069645B2 (en) 2001-03-29 2006-07-04 Ngk Insulators, Ltd. Method for producing a circuit board
US20050191439A1 (en) * 2002-06-05 2005-09-01 Toyo Ink Mfg. Co., Ltd. Shrink film, process for producing the same, printing ink, print produced therewith and process for producing print
JP4378476B2 (ja) * 2004-03-10 2009-12-09 独立行政法人産業技術総合研究所 新規な金属クラスター集合体、ポリメチルメタクリレート−金属クラスター複合体及びその新規な製造方法
US7321098B2 (en) 2004-04-21 2008-01-22 Delphi Technologies, Inc. Laminate ceramic circuit board and process therefor
JP4536601B2 (ja) 2004-06-14 2010-09-01 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP4535797B2 (ja) * 2004-07-21 2010-09-01 ハリマ化成株式会社 金属微粒子焼結体型の薄膜導電体層の形成方法、該方法を応用した金属配線ならびに金属薄膜の形成方法
TW200643124A (en) * 2005-06-08 2006-12-16 Yung-Shu Yang The radiation hardening conductive ink and the manufacturing method of conductive substrate by using radiation hardening conductive ink
JP4378334B2 (ja) 2005-09-09 2009-12-02 日本碍子株式会社 ヒートスプレッダモジュール及びその製造方法
US7427765B2 (en) * 2005-10-03 2008-09-23 Jeol, Ltd. Electron beam column for writing shaped electron beams
US20090011143A1 (en) * 2007-06-22 2009-01-08 Matsushita Electric Industrial Co., Ltd. Pattern forming apparatus and pattern forming method
JP2009283547A (ja) * 2008-05-20 2009-12-03 Dainippon Printing Co Ltd 導電性パターンの形成方法とその形成装置並びに導電性基板
JP2009290112A (ja) * 2008-05-30 2009-12-10 Fujifilm Corp 導電性無機膜とその製造方法、配線基板、半導体装置
JP5387034B2 (ja) * 2009-02-20 2014-01-15 大日本印刷株式会社 導電性基板
KR20100137216A (ko) 2009-06-22 2010-12-30 주식회사 이그잭스 엘이디 어레이 기판 및 이의 제조방법
JP5616070B2 (ja) 2010-01-21 2014-10-29 株式会社フジクラ 電子線硬化用導電性ペースト及びこれを用いた回路基板の製造方法
JP2012178486A (ja) * 2011-02-28 2012-09-13 Hitachi Computer Peripherals Co Ltd 抵抗器化回路付きプリント配線板、該配線板の作製装置及び該配線板の作製方法
KR101310479B1 (ko) 2011-02-28 2013-09-24 삼성전기주식회사 도전성 금속 페이스트 조성물 및 이의 제조방법

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3968056A (en) * 1974-09-27 1976-07-06 General Electric Company Radiation curable inks
US4694138A (en) * 1984-02-10 1987-09-15 Kabushiki Kaisha Toshiba Method of forming conductor path
US4942110A (en) * 1988-08-29 1990-07-17 Xerox Corporation High resolution conductor patterning
US5141602A (en) * 1991-06-18 1992-08-25 International Business Machines Corporation High-productivity method and apparatus for making customized interconnections
US20050276912A1 (en) * 2004-06-14 2005-12-15 Hiroko Yamamoto Wiring substrate, semiconductor device and manufacturing method thereof
US20060275705A1 (en) * 2005-06-01 2006-12-07 Hewlett-Packard Development Company Lp Conductive patterning
US20080038928A1 (en) * 2006-08-14 2008-02-14 Micron Technology, Inc. Electron beam etching device and method

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180097295A1 (en) * 2015-06-08 2018-04-05 Te Connectivity Germany Gmbh Electrical Contact Element And Method For Altering Mechanical And/Or Electrical Properties Of At Least One Area Of Such
US10777912B2 (en) * 2015-06-08 2020-09-15 Te Connectivity Germany Gmbh Electrical contact element and method for altering mechanical and/or electrical properties of at least one area of such
WO2017066342A1 (en) 2015-10-12 2017-04-20 Te Connectivity Corporation Electronic component and process of producing eletronic component
WO2017066338A1 (en) 2015-10-12 2017-04-20 Te Connectivity Corporation Process of producting electronic component and an electronic component
CN108156678A (zh) * 2016-12-06 2018-06-12 财团法人工业技术研究院 可挠热电结构与其形成方法
US11812663B2 (en) 2016-12-06 2023-11-07 Industrial Technology Research Institute Method for manufacturing flexible thermoelectric structure
US20190059158A1 (en) * 2017-08-17 2019-02-21 Avery Dennison Retail Information Services, Llc Use of rf driven coherence between conductive particles for rfid antennas
EP3518279A1 (en) * 2018-01-26 2019-07-31 Meng-Hsiu Hsieh Ceramic circuit plate and method of making same
US11856834B2 (en) 2019-06-21 2023-12-26 Boe Technology Group Co., Ltd. Display substrate and method for preparing the same, and display device

Also Published As

Publication number Publication date
US10154595B2 (en) 2018-12-11
CN104704930B (zh) 2019-01-15
WO2014055271A1 (en) 2014-04-10
BR112015007557A2 (pt) 2017-07-04
JP2015530760A (ja) 2015-10-15
EP2904883A1 (en) 2015-08-12
KR20150052279A (ko) 2015-05-13
US20150319865A1 (en) 2015-11-05
CN104704930A (zh) 2015-06-10
MX350165B (es) 2017-08-29
KR101728619B1 (ko) 2017-04-19
MX2015004055A (es) 2016-02-22

Similar Documents

Publication Publication Date Title
US10154595B2 (en) Electrical components and methods and systems of manufacturing electrical components
US20150126026A1 (en) Electrical components and methods and systems of manufacturing electrical components
JP6061308B2 (ja) スイッチコンタクトやプラグコンタクトなどの電気コンタクト部材上に少なくとも１つの機能的領域を製造するための方法
US20170189995A1 (en) Printing of 3d structures by laser-induced forward transfer
EP2150417B1 (en) Metallic ink
EP2414109B1 (en) Metallic ink
US9190322B2 (en) Method for producing a copper layer on a semiconductor body using a printing process
JP6158230B2 (ja) 表面上に導電性パターンを生成する方法及び装置
KR102345450B1 (ko) 펄스-모드 직접-기록 레이저 금속화
US9758858B2 (en) Methods of manufacturing a coated structure on a substrate
WO2016194972A1 (ja) プリント配線板用原板及びプリント配線板、並びにプリント配線板用原板の製造方法
JP3354377B2 (ja) レーザ溶射法による高耐食性改質層の作製方法
JP2024002952A (ja) 導電性基材に表面仕上げを形成するための方法、および表面仕上げを有する電気導体
Alemohammad et al. Characterization of Laser Assisted Maskless Micro-Deposition Technology for Fabrication of Conductive Micro Systems
KR20090022605A (ko) 인쇄회로기판의 제조방법

Legal Events

Date Code Title Description
AS Assignment

Owner name: TYCO ELECTRONICS CORPORATION, PENNSYLVANIA

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:FRECKMANN, DOMINIQUE;MYERS, MARJORIE;SIGNING DATES FROM 20130314 TO 20130315;REEL/FRAME:030016/0756

Owner name: TYCO ELECTRONICS SERVICES GMBG, SWITZERLAND

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:SACHS, SOENKE;SCHMIDT, HELGE;LEIDNER, MICHAEL;AND OTHERS;SIGNING DATES FROM 20130313 TO 20130315;REEL/FRAME:030016/0572

AS Assignment

Owner name: TYCO ELECTRONICS AMP GMBH, GERMANY

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:TYCO ELECTRONICS SERVICES GMBH;REEL/FRAME:030129/0223

Effective date: 20130401

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION

AS Assignment

Owner name: TE CONNECTIVITY GERMANY GMBH, GERMANY

Free format text: CHANGE OF NAME;ASSIGNOR:TYCO ELECTRONICS AMP GMBH;REEL/FRAME:036617/0856

Effective date: 20150630