US20140027100A1 - Piping structure of cooling device, method for making the same, and method for connecting pipes - Google Patents

Piping structure of cooling device, method for making the same, and method for connecting pipes Download PDF

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Publication number
US20140027100A1
US20140027100A1 US14/110,671 US201214110671A US2014027100A1 US 20140027100 A1 US20140027100 A1 US 20140027100A1 US 201214110671 A US201214110671 A US 201214110671A US 2014027100 A1 US2014027100 A1 US 2014027100A1
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United States
Prior art keywords
tubular part
cooling device
piping structure
refrigerant
pipe
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Abandoned
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US14/110,671
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English (en)
Inventor
Minoru Yoshikawa
Hitoshi Sakamoto
Masaki Chiba
Kenichi Inaba
Arihiro Matsunaga
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NEC Corp
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NEC Corp
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Publication date
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Publication of US20140027100A1 publication Critical patent/US20140027100A1/en
Assigned to NEC CORPORATION reassignment NEC CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHIBA, MASAKI, INABA, KENICHI, MATSUNAGA, ARIHIRO, SAKAMOTO, HITOSHI, YOSHIKAWA, MINORU
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
    • F28F13/185—Heat-exchange surfaces provided with microstructures or with porous coatings
    • F28F13/187—Heat-exchange surfaces provided with microstructures or with porous coatings especially adapted for evaporator surfaces or condenser surfaces, e.g. with nucleation sites
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F19/00—Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers
    • F28F19/02—Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers by using coatings, e.g. vitreous or enamel coatings
    • F28F19/04—Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers by using coatings, e.g. vitreous or enamel coatings of rubber; of plastics material; of varnish
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
    • F28F21/081—Heat exchange elements made from metals or metal alloys
    • F28F21/084—Heat exchange elements made from metals or metal alloys from aluminium or aluminium alloys
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/003—Multiple wall conduits, e.g. for leak detection
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
    • F28F2255/02—Flexible elements

Definitions

  • the present invention relates to piping structures of cooling devices for semiconductor devices and electronic devices and the like, in particular, to a piping structure of a cooling device using an ebullient cooling system in which the heat transportation and heat radiation are performed by a cycle of vaporization and condensation of a refrigerant, a method for making the same, and a method for connecting pipes.
  • the cooling device using an ebullient cooling system in which the heat transportation and heat radiation are performed by a cycle of vaporization and condensation of a refrigerant, is expected as a cooling device for the semiconductor devices and the electronic devices because it does not require any driving unit such as a pump.
  • the ebullient cooling device described in patent literature 1 includes an evaporator absorbing the heat from a heating element by the evaporation action of working fluids such as pure water and ethanol, and a condenser releasing heat by the condensation action of working fluids.
  • the ebullient cooling device includes flow conduits circulating the working fluids between the evaporator and the condenser, and is configured so that the flow conduits can be bent at a number of points. It is said that the configuration enables the flow conduits to act as a spring and to absorb the force applied to the evaporator and the condenser.
  • a low-boiling organic refrigerant is often used as the refrigerant in the ebullient cooling device in order to improve the cooling performance within a range of the operation temperature for a semiconductor device and an electronic device. It is possible to obtain a flexible pipe by using an organic material such as resin and rubber. If a pipe made of an organic material is used, however, there has been a problem that the internal pressure increases due to a chemical reaction with the organic refrigerant, and consequently, the cooling performance is degraded owing to the boiling point elevation of the refrigerant.
  • Patent literature 2 describes a technology to solve such problems.
  • An ebullient cooling device described in patent literature 2 includes an evaporator container accommodating a refrigerant liquid, a condenser condensing the vaporized refrigerant, and a single pipe connecting the evaporator container to the condenser, through which a gas-liquid flows in a mixed phase.
  • the pipe has a structure in which a thin film of a corrosion-resistant and permeation-resistant material such as aluminum and stainless steel is evaporated onto the inner wall of the pipe made of a resin. It is said that the structure enables the pipe to have enough rigidity to maintain its shape against the atmospheric pressure and thus the installation location of the evaporator container and the condenser can be freely decided.
  • Patent literature 1 Japanese Patent Application Laid-Open Publication No. 2006-125718 (paragraphs [0025] to [0044])
  • Patent literature 2 Japanese Patent Application Laid-Open Publication No. 1994-224337 (paragraphs [004] to [009])
  • the pipe in the related ebullient cooling device has a structure in which a metal film is evaporated onto the inner surface of the pipe.
  • the vapor of the refrigerant however, is condensed again and liquefies in the middle of the pipe due to the surface roughness of the metal film evaporated on the resin.
  • the related ebullient cooling device using such pipes therefore, has a problem that the amount of heat transports by the refrigerant decreases.
  • the objective of the present invention is to provide a piping structure of a cooling device, a method for making the same, and a method for connecting pipes which solve the problem mentioned above that in a piping structure of a cooling device using an ebullient cooling system, the cooling performance of the cooling device is degraded if the pipe is provided with flexibility.
  • a piping structure of a cooling device includes a first tubular part with a hollow portion through which a refrigerant used in the cooling device flows; wherein the first tubular part is made of metal materials; and the surface roughness of the inner surface of the first tubular part is less than or equal to the size of a condensation nucleus for the refrigerant.
  • a method for making a piping structure of cooling device includes the steps of: applying a rolling process to a metal material composing a hollow portion through which a refrigerant used in a cooling device flows; forming a plate-like metal plate material with a surface roughness less than or equal to the size of a condensation nucleus for the refrigerant by the rolling process; and bending the metal plate material into a tube and joining both ends.
  • a method for connecting pipes includes the steps of: fitting, in a connective projection, a pipe including a first tubular part, the first tubular part having a hollow portion through which a refrigerant used in a cooling device flowing, made of a metal material, and a surface roughness of its inner surface being less than or equal to the size of a condensation nucleus for the refrigerant; applying a pressure from the outer periphery of the pipe toward the center; and deforming the metal material composing the first tubular part by the pressure and attaching firmly the metal material to the connective projection.
  • the piping structure of the cooling device of the present invention it is possible to obtain a piping structure of a cooling device which does not cause deterioration in the cooling performance of the cooling device even if the pipe is provided with flexibility.
  • FIG. 1A is a plan view showing a configuration of a piping structure of a cooling device in accordance with the first exemplary embodiment of the present invention
  • FIG. 1B is a cross-sectional view showing a configuration of a piping structure of a cooling device in accordance with the first exemplary embodiment of the present invention.
  • FIG. 2A is a plan view showing a configuration of a piping structure of a cooling device in accordance with the second exemplary embodiment of the present invention.
  • FIG. 2B is a cross-sectional view showing a configuration of a piping structure of a cooling device in accordance with the second exemplary embodiment of the present invention.
  • FIG. 3A is a cross-sectional view to illustrate a method for making the piping structure of cooling device in accordance with the second exemplary embodiment of the present invention.
  • FIG. 3B is a cross-sectional view to illustrate a method for making the piping structure of cooling device in accordance with the second exemplary embodiment of the present invention.
  • FIG. 4 is a cross-sectional view showing a configuration of an ebullient cooling device in accordance with the third exemplary embodiment of the present invention.
  • FIG. 5A is a cross-sectional view to illustrate a method for connecting pipes in the cooling device in accordance with the third exemplary embodiment of the present invention.
  • FIG. 5B is a cross-sectional view to illustrate a method for connecting pipes in the cooling device in accordance with the third exemplary embodiment of the present invention.
  • FIGS. 1A and 1B show configurations of a piping structure of cooling device 10 in accordance with the first exemplary embodiment of the present invention.
  • FIG. 1A is a plan view and FIG. 1B is a cross-sectional view in a plane perpendicular to the axial direction of the piping structure (a cross-sectional view taken along the line A-A of FIG. 1A ).
  • the piping structure of cooling device 10 in accordance with the present exemplary embodiment includes a first tubular part 11 with a hollow portion through which a refrigerant used in the cooling device flows.
  • the first tubular part 11 is made of metal materials, and the surface roughness of the inner surface of the first tubular part 11 is less than or equal to the size of a condensation nucleus for the refrigerant.
  • the condensation nucleus means a spot which acts as a base point when a vapor liquefies. If the vapor touches the base points, the liquefaction is accelerated there. It is possible to use aluminum materials and the like as the first tubular part 11 , for example.
  • center line average roughness of a surface equal to or more than 0.1 micrometers and less than or equal to 10 micrometers, preferably less than or equal to 1 micrometer, it is possible to prevent the inner surface of the first tubular part 11 from acting as a condensation nucleus of the refrigerant.
  • a plate-like metal plate material made of a metal material such as aluminum is prepared.
  • the metal plate material can be produced by a conventional rolling process.
  • the metal plate material is bent into a tube by using a cylindrical jig such as a roll, for example, and both ends are joined by means of a weld process and the like.
  • a cylindrical jig such as a roll
  • both ends are joined by means of a weld process and the like.
  • the first tubular part 11 made of a metal material is completed. It is also acceptable to perform the annealing process subsequently.
  • the annealing process can be performed under conditions normally used for the metal material to be used.
  • the thickness of the first tubular part which is determined by the plate thickness of the metal plate material, equal to or more than 0.4 mm and less than or equal to 1 mm. This is because it becomes difficult to weld the ends and to maintain the bending strength and the internal pressure capacity of the first tubular part if the plate thickness of the metal plate material becomes thinner than 0.4 mm. On the other hand, it is also because the flexibility of the piping structure of cooling device 10 decreases if the thickness of the first tubular part is more than 1 mm.
  • FIGS. 2A and 2B show configurations of a piping structure of cooling device 100 according to the second exemplary embodiment of the present invention.
  • FIG. 2A is a plan view and FIG. 2B is a cross-sectional view in a plane perpendicular to the axial direction of the piping structure (a cross-sectional view taken along the line A-A of FIG. 2A ).
  • the piping structure of cooling device 100 in accordance with the present exemplary embodiment includes a first tubular part 110 with a hollow portion through which a refrigerant used in the cooling device flows, and a second tubular part 120 with which the first tubular part 110 is covered.
  • the first tubular part 110 is made of metal materials, and the surface roughness of the inner surface of the first tubular part 110 is less than or equal to the size of a condensation nucleus for the refrigerant.
  • the condensation nucleus means a spot which acts as a base point when a vapor liquefies. If the vapor touches the base points, the liquefaction is accelerated there. It is possible to use aluminum materials and the like as the first tubular part 110 , for example.
  • center line average roughness of a surface equal to or more than 0.1 micrometers and less than or equal to 10 micrometers, preferably less than or equal to 1 micrometer, it is possible to prevent the inner surface of the first tubular part 110 from acting as a condensation nucleus of the refrigerant.
  • the second tubular part is made of organic materials such as resin and rubber, and it is possible to use polyethylene materials and butyl rubber materials, for example.
  • the piping structure of cooling device 100 is configured in which the first tubular part 110 touching the refrigerant is made of metal materials and the surface roughness of the inner surface is less than or equal to the size of a condensation nucleus for the refrigerant. Accordingly, it is possible to prevent the piping structure of cooling device 100 from reacting chemically with the refrigerant, and prevent the vapor of the refrigerant from condensing again. Additionally, since the piping structure of cooling device 100 includes a multi-layered structure in which the first tubular part 110 is covered with the second tubular part 120 made of organic materials, it is possible to maintain the mechanical strength of the piping structure of cooling device 100 with maintenance of its flexibility. As a result, according to the present exemplary embodiment, it is possible to obtain a piping structure of a cooling device which does not cause deterioration in the cooling performance of the cooling device even if the pipe is provided with flexibility.
  • FIGS. 3A and 3B are cross-sectional views to illustrate a method for making the piping structure of cooling device 100 according to the present exemplary embodiment.
  • a plate-like metal plate material 140 made of a metal material such as aluminum is prepared.
  • the metal plate material 140 is bent into a tube by using a cylindrical jig 150 such as a roll, for example, and both ends 160 are joined by means of a weld process and the like.
  • the first tubular part 110 made of a metal material is formed.
  • the outer periphery of the first tubular part 110 is covered by ejecting a resin material such as polyethylene from a nozzle 170 and the like, for example.
  • a resin material such as polyethylene from a nozzle 170 and the like, for example.
  • the second tubular part made of the organic material is formed with which the first tubular part 110 is covered, and the piping structure of cooling device 100 is completed. Since the method for making the piping structure of cooling device 100 according to the present exemplary embodiment is composed of the simple processes, it is possible to manufacture the piping structure of cooling device 100 massively and cheaply according to the present method for making.
  • the surface roughness of the inner surface of the first tubular part 110 made of the metal plate material 140 is desirable to set the surface roughness of the inner surface of the first tubular part 110 made of the metal plate material 140 equal to or more than 0.1 micrometers and less than or equal to 10 micrometers, preferably less than or equal to 1 micrometer. This can be achieved by producing the metal plate material 140 by means of a conventional rolling process. By setting the surface roughness within the range, it is possible to prevent the inner surface of the first tubular part 110 from acting as a condensation nucleus of the refrigerant. It is desirable to set the thickness of the first tubular part, which is determined by the plate thickness of the metal plate material 140 , equal to or more than 0.4 mm and less than or equal to 1 mm.
  • FIG. 4 is a cross-sectional view showing a configuration of an ebullient cooling device 200 in accordance with the present exemplary embodiment.
  • the ebullient cooling device 200 includes an evaporator 220 storing a refrigerant 210 , and a condenser 230 condensing and liquefying a vapor-state refrigerant vaporized in the evaporator 220 and radiating heat.
  • a heat-generating part 240 of an object to be cooled such as a semiconductor device is disposed so as to thermally contact with one surface of the evaporator 220 .
  • the evaporator 220 is connected to the condenser 230 by using the piping structure of cooling device 100 according to the second exemplary embodiment.
  • the piping structure of cooling device 100 includes a first connection 131 connected to the evaporator 210 and a second connection 132 connected to the condenser 230 .
  • FIG. 4 shows a case where the piping structure of cooling device 100 is used for a vapor-phase pipe 251 through which a vapor-phase refrigerant flows from the evaporator 220 toward the condenser 230 and for a liquid-phase pipe 252 through which a liquid-phase refrigerant flows from the condenser 230 toward the evaporator 220 .
  • the bending strength of the vapor-phase pipe 251 and the liquid-phase pipe 252 (hereafter, referred to as “a pipe 250 ” simply) is maintained by means of the second tubular part 120 made of organic materials having the flexibility.
  • a pipe 250 The bending strength of the vapor-phase pipe 251 and the liquid-phase pipe 252 (hereafter, referred to as “a pipe 250 ” simply) is maintained by means of the second tubular part 120 made of organic materials having the flexibility.
  • the ebullient cooling device 200 therefore, it is possible to decide freely the disposition of the evaporator 220 and the condenser 230 with maintenance of the mechanical strength of the pipe connecting the evaporator 220 to the condenser 230 .
  • the ebullient cooling device 200 of the present exemplary embodiment is configured in which the evaporator 220 is connected to the condenser 230 by using the pipe 250 including the first tubular part 110 made of metal materials as the inner layer and the second tubular part 120 made of organic materials having the flexibility as the outer layer.
  • the pipe 250 including the first tubular part 110 made of metal materials as the inner layer and the second tubular part 120 made of organic materials having the flexibility as the outer layer.
  • the evaporator 220 is configured to include a first connective projection 221 connected to the first connection 131 of the piping structure of cooling device 100 and the condenser 230 is configured to include a second connective projection 231 connected to the second connection 132 .
  • at least one of the first connective projection 221 and the second connective projection 231 is made of the same material as the metal material of which the first tubular part 131 is made. In this case, since the electrical potential difference does not arise between the same type of metals, it is possible to prevent the corrosion based on the electrochemical action (electrical corrosion) even though a conductive refrigerant such as water is used.
  • a semiconductor device, an electronic device and the like are designed so as to operate at temperature in the range from several tens of degrees Celsius to about 100 degrees Celsius.
  • a material with small surface tension and a low boiling point as the refrigerant used in the ebullient cooling device, therefore, it is possible to activate the generation of bubbles in the evaporator and improve the cooling performance.
  • organic refrigerants such as hydrofluorocarbon and hydrofluoroether are used as the refrigerant.
  • These organic refrigerants react chemically with organic materials such as resin and rubber. Since the chemical reaction generates a reaction gas and the internal pressure in the related ebullient cooling device increases, the boiling point of the refrigerant rises. As a result, the cooling performance in the related ebullient cooling device is degraded by the prolonged use.
  • the ebullient cooling device 200 of the present exemplary embodiment uses the piping structure of cooling device 100 including the first tubular part 110 made of metal materials as the vapor-phase pipe 251 and the liquid-phase pipe 252 .
  • the reaction between the refrigerant and the pipe is suppressed, and accordingly, it is possible to prevent the cooling performance from degrading and ensure long-term reliability of the ebullient cooling device.
  • FIGS. 5A and 5B are cross-sectional views to illustrate a method for connecting pipes in the cooling device according to the present exemplary embodiment.
  • the pipe 250 is fitted in the first connective projection 221 or the second connective projection 231 (hereafter, referred to as “a connective projection 260 ” simply).
  • the pipe 250 includes the piping structure of cooling device 100 according to the second exemplary embodiment, as mentioned above. That is to say, the pipe 250 includes the first tubular part 110 made of metal materials with a hollow portion through which the refrigerant used in the cooling device flows, and the second tubular part 120 made of organic materials with which the first tubular part 110 is covered.
  • a pressure is applied from the outer periphery of the second tubular part 120 toward the center.
  • a clamping tool such as a clamp 270 in order to apply the pressure.
  • the pressure enables the metal material composing the first tubular part 110 to deform and the metal material to be attached firmly to the connective projection 260 by a simple process.
  • the connective projection 260 can be configured to be a nipple shape, as shown in FIGS. 5A and 5B .
  • the first tubular part 110 made of metal materials, which composes the inner layer of the pipe 250 has a small wall thickness, it undergoes plastic deformation due to the stress concentration at the convex portions of the nipple shape, and is attached firmly to the connective projection 260 .
  • the pipe 250 according to the present exemplary embodiment includes, as the outer layer, the second tubular part 120 made of organic materials such as resin and rubber, it is possible to maintain the mechanical strength as a pipe even if the metal material of the inner layer is deformed.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
US14/110,671 2011-04-03 2012-04-10 Piping structure of cooling device, method for making the same, and method for connecting pipes Abandoned US20140027100A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011-089347 2011-04-13
JP2011089347 2011-04-13
PCT/JP2012/060197 WO2012141320A1 (ja) 2011-04-13 2012-04-10 冷却装置の配管構造、その製造方法、及び配管接続方法

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US (1) US20140027100A1 (ja)
EP (1) EP2698590B1 (ja)
JP (1) JP6156142B2 (ja)
CN (1) CN103459969A (ja)
WO (1) WO2012141320A1 (ja)

Cited By (2)

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US20150062821A1 (en) * 2012-03-22 2015-03-05 Nec Corporation Cooling Structure for Electronic Circuit Board, and Electronic Device Using the Same
US20160377356A1 (en) * 2015-06-25 2016-12-29 Asia Vital Components Co., Ltd. Flexible and transformable water-cooling device

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Publication number Priority date Publication date Assignee Title
JP2012242009A (ja) * 2011-05-20 2012-12-10 Nec Corp 接続管、その製造方法、及びそれを用いた冷却装置
RU2508516C1 (ru) * 2012-12-06 2014-02-27 Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Казанский государственный энергетический университет" (ФГБОУ ВПО "КГЭУ") Теплообменная труба
JP7467028B2 (ja) * 2018-10-29 2024-04-15 株式会社神戸製鋼所 低温液化ガス気化器、冷却システム及び気化器における着氷抑制方法

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