EP2698590B1 - Piping structure of cooling device, manufacturing method thereof, and pipe coupling method. - Google Patents

Piping structure of cooling device, manufacturing method thereof, and pipe coupling method. Download PDF

Info

Publication number
EP2698590B1
EP2698590B1 EP12770839.4A EP12770839A EP2698590B1 EP 2698590 B1 EP2698590 B1 EP 2698590B1 EP 12770839 A EP12770839 A EP 12770839A EP 2698590 B1 EP2698590 B1 EP 2698590B1
Authority
EP
European Patent Office
Prior art keywords
tubular part
cooling device
piping structure
refrigerant
pipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP12770839.4A
Other languages
German (de)
French (fr)
Other versions
EP2698590A4 (en
EP2698590A1 (en
Inventor
Minoru Yoshikawa
Hitoshi Sakamoto
Masaki Chiba
Kenichi Inaba
Arihiro Matsunaga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Publication of EP2698590A1 publication Critical patent/EP2698590A1/en
Publication of EP2698590A4 publication Critical patent/EP2698590A4/en
Application granted granted Critical
Publication of EP2698590B1 publication Critical patent/EP2698590B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
    • F28F13/185—Heat-exchange surfaces provided with microstructures or with porous coatings
    • F28F13/187—Heat-exchange surfaces provided with microstructures or with porous coatings especially adapted for evaporator surfaces or condenser surfaces, e.g. with nucleation sites
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F19/00—Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers
    • F28F19/02—Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers by using coatings, e.g. vitreous or enamel coatings
    • F28F19/04—Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers by using coatings, e.g. vitreous or enamel coatings of rubber; of plastics material; of varnish
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
    • F28F21/081—Heat exchange elements made from metals or metal alloys
    • F28F21/084—Heat exchange elements made from metals or metal alloys from aluminium or aluminium alloys
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/003—Multiple wall conduits, e.g. for leak detection
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
    • F28F2255/02—Flexible elements

Definitions

  • the present invention relates to piping structures of cooling devices for semiconductor devices and electronic devices and the like, in particular, to a piping structure of a cooling device using an ebullient cooling system in which the heat transportation and heat radiation are performed by a cycle of vaporization and condensation of a refrigerant, a method for making the same, and a method for connecting pipes.
  • the cooling device using an ebullient cooling system in which the heat transportation and heat radiation are performed by a cycle of vaporization and condensation of a refrigerant, is expected as a cooling device for the semiconductor devices and the electronic devices because it does not require any driving unit such as a pump.
  • the ebullient cooling device described in patent literature 1 includes an evaporator absorbing the heat from a heating element by the evaporation action of working fluids such as pure water and ethanol, and a condenser releasing heat by the condensation action of working fluids.
  • the ebullient cooling device includes flow conduits circulating the working fluids between the evaporator and the condenser, and is configured so that the flow conduits can be bent at a number of points. It is said that the configuration enables the flow conduits to act as a spring and to absorb the force applied to the evaporator and the condenser.
  • a low-boiling organic refrigerant is often used as the refrigerant in the ebullient cooling device in order to improve the cooling performance within a range of the operation temperature for a semiconductor device and an electronic device. It is possible to obtain a flexible pipe by using an organic material such as resin and rubber. If a pipe made of an organic material is used, however, there has been a problem that the internal pressure increases due to a chemical reaction with the organic refrigerant, and consequently, the cooling performance is degraded owing to the boiling point elevation of the refrigerant.
  • Patent literature 2 describes a technology to solve such problems.
  • An ebullient cooling device described in patent literature 2 includes an evaporator container accommodating a refrigerant liquid, a condenser condensing the vaporized refrigerant, and a single pipe connecting the evaporator container to the condenser, through which a gas-liquid flows in a mixed phase.
  • the pipe has a structure in accordance with the preamble of claim 1 and in which a thin film of a corrosion-resistant and permeation-resistant material such as aluminum and stainless steel is evaporated onto the inner wall of the pipe made of a resin. It is said that the structure enables the pipe to have enough rigidity to maintain its shape against the atmospheric pressure and thus the installation location of the evaporator container and the condenser can be freely decided.
  • Document EP 1 857 722 A1 describes a metal pipe which has a plurality of ridges that have different heights, extend in the axial direction, and are arranged in the circumferential direction at its inner circumferential surface. If the Reynolds number changes and the streak structure and the scale of a hairpin vortex change, the streak and the hairpin vortex each match any one of the ridges. Therefore, the fluid friction can be reduced in a wide Reynolds number range.
  • the pipe in the related ebullient cooling device has a structure in which a metal film is evaporated onto the inner surface of the pipe.
  • the vapor of the refrigerant however, is condensed again and liquefied in the middle of the pipe due to the surface roughness of the metal film evaporated on the resin.
  • the related ebullient cooling device using such pipes therefore, has a problem that the amount of heat transports by the refrigerant decreases.
  • the objective of the present invention is to provide a piping structure of a cooling device, a method for making the same, and a method for connecting pipes which solve the problem mentioned above that in a piping structure of a cooling device using an ebullient cooling system, the cooling performance of the cooling device is degraded if the pipe is provided with flexibility.
  • the piping structure of the cooling device of the present invention it is possible to obtain a piping structure of a cooling device which does not cause deterioration in the cooling performance of the cooling device even if the pipe is provided with flexibility.
  • FIGS. 1A and 1B show configurations of a piping structure of cooling device 10 in accordance with the first exemplary embodiment of the present invention.
  • FIG. 1A is a plan view and FIG. 1B is a cross-sectional view in a plane perpendicular to the axial direction of the piping structure (a cross-sectional view taken along the line A-A of FIG. 1A ).
  • the piping structure of cooling device 10 in accordance with the present exemplary embodiment includes a first tubular part 11 with a hollow portion through which a refrigerant used in the cooling device flows.
  • the first tubular part 11 is made of metal materials, and the surface roughness of the inner surface of the first tubular part 11 is less than or equal to the size of a condensation nucleus for the refrigerant.
  • the condensation nucleus means a spot which acts as a base point when a vapor liquefies. If the vapor touches the base points, the liquefaction is accelerated there. It is possible to use aluminum materials and the like as the first tubular part 11, for example.
  • By setting the center line average roughness of a surface equal to or more than 0.1 micrometers and less than or equal to 10 micrometers, preferably less than or equal to 1 micrometer, it is possible to prevent the inner surface of the first tubular part 11 from acting as a condensation nucleus of the refrigerant.
  • a plate-like metal plate material made of a metal material such as aluminum is prepared.
  • the metal plate material can be produced by a conventional rolling process.
  • the metal plate material is bent into a tube by using a cylindrical jig such as a roll, for example, and both ends are joined by means of a weld process and the like.
  • a cylindrical jig such as a roll
  • both ends are joined by means of a weld process and the like.
  • the first tubular part 11 made of a metal material is completed. It is also acceptable to perform the annealing process subsequently.
  • the annealing process can be performed under conditions normally used for the metal material to be used.
  • the thickness of the first tubular part which is determined by the plate thickness of the metal plate material, equal to or more than 0.4 mm and less than or equal to 1 mm. This is because it becomes difficult to weld the ends and to maintain the bending strength and the internal pressure capacity of the first tubular part if the plate thickness of the metal plate material becomes thinner than 0.4 mm. On the other hand, it is also because the flexibility of the piping structure of cooling device 10 decreases if the thickness of the first tubular part is more than 1 mm.
  • FIGS. 2A and 2B show configurations of a piping structure of cooling device 100 according to the second exemplary embodiment of the present invention.
  • FIG. 2A is a plan view and FIG. 2B is a cross-sectional view in a plane perpendicular to the axial direction of the piping structure (a cross-sectional view taken along the line A-A of FIG. 2A ).
  • the piping structure of cooling device 100 in accordance with the present exemplary embodiment includes a first tubular part 110 with a hollow portion through which a refrigerant used in the cooling device flows, and a second tubular part 120 with which the first tubular part 110 is covered.
  • the first tubular part 110 is made of metal materials, and the surface roughness of the inner surface of the first tubular part 110 is less than or equal to the size of a condensation nucleus for the refrigerant.
  • the condensation nucleus means a spot which acts as a base point when a vapor liquefies. If the vapor touches the base points, the liquefaction is accelerated there. It is possible to use aluminum materials and the like as the first tubular part 110, for example.
  • center line average roughness of a surface equal to or more than 0.1 micrometers and less than or equal to 10 micrometers, preferably less than or equal to 1 micrometer, it is possible to prevent the inner surface of the first tubular part 110 from acting as a condensation nucleus of the refrigerant.
  • the second tubular part is made of organic materials such as resin and rubber, and it is possible to use polyethylene materials and butyl rubber materials, for example.
  • the piping structure of cooling device 100 is configured in which the first tubular part 110 touching the refrigerant is made of metal materials and the surface roughness of the inner surface is less than or equal to the size of a condensation nucleus for the refrigerant. Accordingly, it is possible to prevent the piping structure of cooling device 100 from reacting chemically with the refrigerant, and prevent the vapor of the refrigerant from condensing again. Additionally, since the piping structure of cooling device 100 includes a multi-layered structure in which the first tubular part 110 is covered with the second tubular part 120 made of organic materials, it is possible to maintain the mechanical strength of the piping structure of cooling device 100 with maintenance of its flexibility. As a result, according to the present exemplary embodiment, it is possible to obtain a piping structure of a cooling device which does not cause deterioration in the cooling performance of the cooling device even if the pipe is provided with flexibility.
  • FIGS. 3A and 3B are cross-sectional views to illustrate a method for making the piping structure of cooling device 100 according to the present exemplary embodiment.
  • a plate-like metal plate material 140 made of a metal material such as aluminum is prepared.
  • the metal plate material 140 is bent into a tube by using a cylindrical jig 150 such as a roll, for example, and both ends 160 are joined by means of a weld process and the like.
  • the first tubular part 110 made of a metal material is formed.
  • the outer periphery of the first tubular part 110 is covered by ejecting a resin material such as polyethylene from a nozzle 170 and the like, for example.
  • a resin material such as polyethylene from a nozzle 170 and the like, for example.
  • the second tubular part made of the organic material is formed with which the first tubular part 110 is covered, and the piping structure of cooling device 100 is completed. Since the method for making the piping structure of cooling device 100 according to the present exemplary embodiment is composed of the simple processes, it is possible to manufacture the piping structure of cooling device 100 massively and cheaply according to the present method for making.
  • the surface roughness of the inner surface of the first tubular part 110 made of the metal plate material 140 is desirable to set the surface roughness of the inner surface of the first tubular part 110 made of the metal plate material 140 equal to or more than 0.1 micrometers and less than or equal to 10 micrometers, preferably less than or equal to 1 micrometer. This can be achieved by producing the metal plate material 140 by means of a conventional rolling process. By setting the surface roughness within the range, it is possible to prevent the inner surface of the first tubular part 110 from acting as a condensation nucleus of the refrigerant. It is desirable to set the thickness of the first tubular part, which is determined by the plate thickness of the metal plate material 140, equal to or more than 0.4 mm and less than or equal to 1 mm.
  • FIG. 4 is a cross-sectional view showing a configuration of an ebullient cooling device 200 in accordance with the present exemplary embodiment.
  • the ebullient cooling device 200 includes an evaporator 220 storing a refrigerant 210, and a condenser 230 condensing and liquefying a vapor-state refrigerant vaporized in the evaporator 220 and radiating heat.
  • a heat-generating part 240 of an object to be cooled such as a semiconductor device is disposed so as to thermally contact with one surface of the evaporator 220.
  • the evaporator 220 is connected to the condenser 230 by using the piping structure of cooling device 100 according to the second exemplary embodiment.
  • the piping structure of cooling device 100 includes a first connection 131 connected to the evaporator 210 and a second connection 132 connected to the condenser 230.
  • FIG. 4 shows a case where the piping structure of cooling device 100 is used for a vapor-phase pipe 251 through which a vapor-phase refrigerant flows from the evaporator 220 toward the condenser 230 and for a liquid-phase pipe 252 through which a liquid-phase refrigerant flows from the condenser 230 toward the evaporator 220.
  • a pipe 250 The bending strength of the vapor-phase pipe 251 and the liquid-phase pipe 252 (hereafter, referred to as "a pipe 250" simply) is maintained by means of the second tubular part 120 made of organic materials having the flexibility. In the ebullient cooling device 200, therefore, it is possible to decide freely the disposition of the evaporator 220 and the condenser 230 with maintenance of the mechanical strength of the pipe connecting the evaporator 220 to the condenser 230.
  • the ebullient cooling device 200 of the present exemplary embodiment is configured in which the evaporator 220 is connected to the condenser 230 by using the pipe 250 including the first tubular part 110 made of metal materials as the inner layer and the second tubular part 120 made of organic materials having the flexibility as the outer layer.
  • the pipe 250 including the first tubular part 110 made of metal materials as the inner layer and the second tubular part 120 made of organic materials having the flexibility as the outer layer.
  • the evaporator 220 is configured to include a first connective projection 221 connected to the first connection 131 of the piping structure of cooling device 100 and the condenser 230 is configured to include a second connective projection 231 connected to the second connection 132. It is also acceptable that at least one of the first connective projection 221 and the second connective projection 231 is made of the same material as the metal material of which the first tubular part 131 is made. In this case, since the electrical potential difference does not arise between the same type of metals, it is possible to prevent the corrosion based on the electrochemical action (electrical corrosion) even though a conductive refrigerant such as water is used.
  • a semiconductor device, an electronic device and the like are designed so as to operate at temperature in the range from several tens of degrees Celsius to about 100 degrees Celsius.
  • a material with small surface tension and a low boiling point as the refrigerant used in the ebullient cooling device, therefore, it is possible to activate the generation of bubbles in the evaporator and improve the cooling performance.
  • organic refrigerants such as hydrofluorocarbon and hydrofluoroether are used as the refrigerant.
  • These organic refrigerants react chemically with organic materials such as resin and rubber. Since the chemical reaction generates a reaction gas and the internal pressure in the related ebullient cooling device increases, the boiling point of the refrigerant rises. As a result, the cooling performance in the related ebullient cooling device is degraded by the prolonged use.
  • the ebullient cooling device 200 of the present exemplary embodiment uses the piping structure of cooling device 100 including the first tubular part 110 made of metal materials as the vapor-phase pipe 251 and the liquid-phase pipe 252. As a result, the reaction between the refrigerant and the pipe is suppressed, and accordingly, it is possible to prevent the cooling performance from degrading and ensure long-term reliability of the ebullient cooling device.
  • FIGS. 5A and 5B are cross-sectional views to illustrate a method for connecting pipes in the cooling device according to the present exemplary embodiment.
  • the pipe 250 is fitted in the first connective projection 221 or the second connective projection 231 (hereafter, referred to as "a connective projection 260" simply).
  • the pipe 250 includes the piping structure of cooling device 100 according to the second exemplary embodiment, as mentioned above. That is to say, the pipe 250 includes the first tubular part 110 made of metal materials with a hollow portion through which the refrigerant used in the cooling device flows, and the second tubular part 120 made of organic materials with which the first tubular part 110 is covered.
  • a pressure is applied from the outer periphery of the second tubular part 120 toward the center.
  • a clamping tool such as a clamp 270 in order to apply the pressure.
  • the pressure enables the metal material composing the first tubular part 110 to deform and the metal material to be attached firmly to the connective projection 260 by a simple process.
  • the connective projection 260 can be configured to be a nipple shape, as shown in FIGS. 5A and 5B .
  • the first tubular part 110 made of metal materials, which composes the inner layer of the pipe 250 has a small wall thickness, it undergoes plastic deformation due to the stress concentration at the convex portions of the nipple shape, and is attached firmly to the connective projection 260.
  • the pipe 250 according to the present exemplary embodiment includes, as the outer layer, the second tubular part 120 made of organic materials such as resin and rubber, it is possible to maintain the mechanical strength as a pipe even if the metal material of the inner layer is deformed.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

    TECHNICAL FIELD
  • The present invention relates to piping structures of cooling devices for semiconductor devices and electronic devices and the like, in particular, to a piping structure of a cooling device using an ebullient cooling system in which the heat transportation and heat radiation are performed by a cycle of vaporization and condensation of a refrigerant, a method for making the same, and a method for connecting pipes.
    • BACKGROUND ART
  • In recent years, with the progress of high performance and high functionality in semiconductor devices and electronic devices, the amount of heat generation from them has been increasing. On the other hand, the miniaturization of semiconductor devices and electronic devices has been advancing due to the popularization of portable devices. Because of such background, a cooling device with high efficiency and a small size is highly required. The cooling device using an ebullient cooling system in which the heat transportation and heat radiation are performed by a cycle of vaporization and condensation of a refrigerant, is expected as a cooling device for the semiconductor devices and the electronic devices because it does not require any driving unit such as a pump.
  • An example of the cooling device using an ebullient cooling system (hereinafter, also referred to as an ebullient cooling device) is described in patent literature 1. The ebullient cooling device described in patent literature 1 includes an evaporator absorbing the heat from a heating element by the evaporation action of working fluids such as pure water and ethanol, and a condenser releasing heat by the condensation action of working fluids. The ebullient cooling device includes flow conduits circulating the working fluids between the evaporator and the condenser, and is configured so that the flow conduits can be bent at a number of points. It is said that the configuration enables the flow conduits to act as a spring and to absorb the force applied to the evaporator and the condenser.
  • In the ebullient cooling device described in patent literature 1, however, a metal pipe made of rigid metal with a spring function is used as the flow conduit, and consequently, there has been a problem that the degree of freedom to dispose the flow conduits with a bent form is limited. There has also been a problem that the mechanical strength cannot be maintained, for example, a buckling occurs in the process of bending, if the thickness of the metal pipe is reduced to a thickness in which it can be bent freely. Furthermore, there has been a problem that the corrosion (electrical corrosion) based on an electrochemical action occurs due to the electrical potential difference between the metal composing the flow conduit and the metal composing a connection of the evaporator or the condenser if an electrically-conductive refrigerant is used.
  • On the other hand, a low-boiling organic refrigerant is often used as the refrigerant in the ebullient cooling device in order to improve the cooling performance within a range of the operation temperature for a semiconductor device and an electronic device. It is possible to obtain a flexible pipe by using an organic material such as resin and rubber. If a pipe made of an organic material is used, however, there has been a problem that the internal pressure increases due to a chemical reaction with the organic refrigerant, and consequently, the cooling performance is degraded owing to the boiling point elevation of the refrigerant.
  • Patent literature 2 describes a technology to solve such problems. An ebullient cooling device described in patent literature 2 includes an evaporator container accommodating a refrigerant liquid, a condenser condensing the vaporized refrigerant, and a single pipe connecting the evaporator container to the condenser, through which a gas-liquid flows in a mixed phase. The pipe has a structure in accordance with the preamble of claim 1 and in which a thin film of a corrosion-resistant and permeation-resistant material such as aluminum and stainless steel is evaporated onto the inner wall of the pipe made of a resin. It is said that the structure enables the pipe to have enough rigidity to maintain its shape against the atmospheric pressure and thus the installation location of the evaporator container and the condenser can be freely decided.
    • Patent literature 1: Japanese Patent Application Laid-Open Publication Neo. 2006-125718 (paragraphs [0025] to [0044])
    • Patent literature 2: Japanese Patent Application Laid-Open Publication No. 1994-224337 (paragraphs [004] to [009])
  • Document EP 1 857 722 A1 describes a metal pipe which has a plurality of ridges that have different heights, extend in the axial direction, and are arranged in the circumferential direction at its inner circumferential surface. If the Reynolds number changes and the streak structure and the scale of a hairpin vortex change, the streak and the hairpin vortex each match any one of the ridges. Therefore, the fluid friction can be reduced in a wide Reynolds number range.
    • DISCLOSURE OF INVENTION
  • The invention is defined in independent claims 1, 8, and 11.
    • PROBLEM TO BE SOLVED BY THE INVENTION
  • As mentioned above, the pipe in the related ebullient cooling device has a structure in which a metal film is evaporated onto the inner surface of the pipe. The vapor of the refrigerant, however, is condensed again and liquefied in the middle of the pipe due to the surface roughness of the metal film evaporated on the resin. The related ebullient cooling device using such pipes, therefore, has a problem that the amount of heat transports by the refrigerant decreases.
  • Thus, in the piping structure of the related ebullient cooling device, there is a problem that the cooling performance of the cooling device is
  • degraded if the pipe is provided with flexibility.
  • The objective of the present invention is to provide a piping structure of a cooling device, a method for making the same, and a method for connecting pipes which solve the problem mentioned above that in a piping structure of a cooling device using an ebullient cooling system, the cooling performance of the cooling device is degraded if the pipe is provided with flexibility.
    • MEANS FOR SOLVING A PROBLEM
  • A piping structure for a cooling device as defined in claim 1.
  • A method for making a piping structure for a cooling device as defined in claim 8.
  • A method for connecting pipes as defined in claim 11.
    • EFFECT OF THE INVENTION
  • According to the piping structure of the cooling device of the present invention, it is possible to obtain a piping structure of a cooling device which does not cause deterioration in the cooling performance of the cooling device even if the pipe is provided with flexibility.
    • BRIEF DESCRIPTION OF THE DRAWINGS
    • FIG. 1A is a plan view showing a configuration of a piping structure of a cooling device in accordance with the first exemplary embodiment of the present invention.
    • FIG. 1B is a cross-sectional view showing a configuration of a piping structure of a cooling device in accordance with the first exemplary embodiment of the present invention.
    • FIG. 2A is a plan view showing a configuration of a piping structure of a cooling device in accordance with the second exemplary embodiment of the present invention.
    • FIG. 2B is a cross-sectional view showing a configuration of a piping structure of a cooling device in accordance with the second exemplary embodiment of the present invention.
    • FIGS. 3A is a cross-sectional view to illustrate a method for making the piping structure of cooling device in accordance with the second exemplary embodiment of the present invention.
    • FIGS. 3B is a cross-sectional view to illustrate a method for making the piping structure of cooling device in accordance with the second exemplary embodiment of the present invention.
    • FIG. 4 is a cross-sectional view showing a configuration of an ebullient cooling device in accordance with the third exemplary embodiment of the present invention.
    • FIG. 5A is a cross-sectional view to illustrate a method for connecting pipes in the cooling device in accordance with the third exemplary embodiment of the present invention.
    • FIG. 5B is a cross-sectional view to illustrate a method for connecting pipes in the cooling device in accordance with the third exemplary embodiment of the present invention.
    DESCRIPTION OF EMBODIMENTS
  • The exemplary embodiments of the present invention will be described with reference to drawings below.
    • [The first exemplary embodiment]
  • FIGS. 1A and 1B show configurations of a piping structure of cooling device 10 in accordance with the first exemplary embodiment of the present invention. FIG. 1A is a plan view and FIG. 1B is a cross-sectional view in a plane perpendicular to the axial direction of the piping structure (a cross-sectional view taken along the line A-A of FIG. 1A). The piping structure of cooling device 10 in accordance with the present exemplary embodiment includes a first tubular part 11 with a hollow portion through which a refrigerant used in the cooling device flows.
  • The first tubular part 11 is made of metal materials, and the surface roughness of the inner surface of the first tubular part 11 is less than or equal to the size of a condensation nucleus for the refrigerant. Here, the condensation nucleus means a spot which acts as a base point when a vapor liquefies. If the vapor touches the base points, the liquefaction is accelerated there. It is possible to use aluminum materials and the like as the first tubular part 11, for example. By setting the center line average roughness of a surface equal to or more than 0.1 micrometers and less than or equal to 10 micrometers, preferably less than or equal to 1 micrometer, it is possible to prevent the inner surface of the first tubular part 11 from acting as a condensation nucleus of the refrigerant.
  • It is possible to use a material formed through an annealing process for the first tubular part. By means of the annealing process, it is possible to adjust a strain arising at a processing treatment, and it becomes possible to maintain the strength of the first tubular part with maintenance of its flexibility.
  • Next, the method for making the piping structure of cooling device 10 according to the present exemplary embodiment will be described. In the method for making according to the present exemplary embodiment, first, a plate-like metal plate material made of a metal material such as aluminum is prepared. The metal plate material can be produced by a conventional rolling process. The metal plate material is bent into a tube by using a cylindrical jig such as a roll, for example, and both ends are joined by means of a weld process and the like. By this process, the first tubular part 11 made of a metal material is completed. It is also acceptable to perform the annealing process subsequently. The annealing process can be performed under conditions normally used for the metal material to be used. It is desirable to set the thickness of the first tubular part, which is determined by the plate thickness of the metal plate material, equal to or more than 0.4 mm and less than or equal to 1 mm. This is because it becomes difficult to weld the ends and to maintain the bending strength and the internal pressure capacity of the first tubular part if the plate thickness of the metal plate material becomes thinner than 0.4 mm. On the other hand, it is also because the flexibility of the piping structure of cooling device 10 decreases if the thickness of the first tubular part is more than 1 mm.
  • As mentioned above, according to the present exemplary embodiment, it is possible to obtain a piping structure of a cooling device which does not cause deterioration in the cooling performance of the cooling device even if the pipe is provided with flexibility.
    • [The second exemplary embodiment]
  • Next, the second exemplary embodiment of the present invention will be described. FIGS. 2A and 2B show configurations of a piping structure of cooling device 100 according to the second exemplary embodiment of the present invention. FIG. 2A is a plan view and FIG. 2B is a cross-sectional view in a plane perpendicular to the axial direction of the piping structure (a cross-sectional view taken along the line A-A of FIG. 2A). The piping structure of cooling device 100 in accordance with the present exemplary embodiment includes a first tubular part 110 with a hollow portion through which a refrigerant used in the cooling device flows, and a second tubular part 120 with which the first tubular part 110 is covered.
  • The first tubular part 110 is made of metal materials, and the surface roughness of the inner surface of the first tubular part 110 is less than or equal to the size of a condensation nucleus for the refrigerant. Here, the condensation nucleus means a spot which acts as a base point when a vapor liquefies. If the vapor touches the base points, the liquefaction is accelerated there. It is possible to use aluminum materials and the like as the first tubular part 110, for example. By setting the center line average roughness of a surface equal to or more than 0.1 micrometers and less than or equal to 10 micrometers, preferably less than or equal to 1 micrometer, it is possible to prevent the inner surface of the first tubular part 110 from acting as a condensation nucleus of the refrigerant.
  • The second tubular part is made of organic materials such as resin and rubber, and it is possible to use polyethylene materials and butyl rubber materials, for example.
  • As mentioned above, the piping structure of cooling device 100 according to the present exemplary embodiment is configured in which the first tubular part 110 touching the refrigerant is made of metal materials and the surface roughness of the inner surface is less than or equal to the size of a condensation nucleus for the refrigerant. Accordingly, it is possible to prevent the piping structure of cooling device 100 from reacting chemically with the refrigerant, and prevent the vapor of the refrigerant from condensing again. Additionally, since the piping structure of cooling device 100 includes a multi-layered structure in which the first tubular part 110 is covered with the second tubular part 120 made of organic materials, it is possible to maintain the mechanical strength of the piping structure of cooling device 100 with maintenance of its flexibility. As a result, according to the present exemplary embodiment, it is possible to obtain a piping structure of a cooling device which does not cause deterioration in the cooling performance of the cooling device even if the pipe is provided with flexibility.
  • Next, the method for making the piping structure of cooling device 100 according to the present exemplary embodiment will be described. FIGS. 3A and 3B are cross-sectional views to illustrate a method for making the piping structure of cooling device 100 according to the present exemplary embodiment. In the method for making according to the present exemplary embodiment, first, a plate-like metal plate material 140 made of a metal material such as aluminum is prepared. As shown in FIG. 3A, the metal plate material 140 is bent into a tube by using a cylindrical jig 150 such as a roll, for example, and both ends 160 are joined by means of a weld process and the like. By this process, the first tubular part 110 made of a metal material is formed.
  • Subsequently, as shown in FIG. 3B, the outer periphery of the first tubular part 110 is covered by ejecting a resin material such as polyethylene from a nozzle 170 and the like, for example. By this process, the second tubular part made of the organic material is formed with which the first tubular part 110 is covered, and the piping structure of cooling device 100 is completed. Since the method for making the piping structure of cooling device 100 according to the present exemplary embodiment is composed of the simple processes, it is possible to manufacture the piping structure of cooling device 100 massively and cheaply according to the present method for making.
  • Here, it is desirable to set the surface roughness of the inner surface of the first tubular part 110 made of the metal plate material 140 equal to or more than 0.1 micrometers and less than or equal to 10 micrometers, preferably less than or equal to 1 micrometer. This can be achieved by producing the metal plate material 140 by means of a conventional rolling process. By setting the surface roughness within the range, it is possible to prevent the inner surface of the first tubular part 110 from acting as a condensation nucleus of the refrigerant. It is desirable to set the thickness of the first tubular part, which is determined by the plate thickness of the metal plate material 140, equal to or more than 0.4 mm and less than or equal to 1 mm. This is because it becomes difficult to weld the ends 160 and to maintain the bending strength and the internal pressure capacity of the first tubular part if the plate thickness of the metal plate material 140 becomes thinner than 0.4 mm. On the other hand, it is also because the flexibility of the piping structure of cooling device 100 decreases if the thickness of the first tubular part is more than 1 mm.
    • [The third exemplary embodiment]
  • Next, the third exemplary embodiment of the present invention will be described. In the present exemplary embodiment, a cooling device will be described which uses the piping structure of cooling device 100 according to the second exemplary embodiment, but it is also acceptable to use the piping structure of cooling device 10 according to the first exemplary embodiment. A case will be described below in which the piping structure is applied to a cooling device using an ebullient cooling system (hereinafter, referred to as an ebullient cooling device). FIG. 4 is a cross-sectional view showing a configuration of an ebullient cooling device 200 in accordance with the present exemplary embodiment. The ebullient cooling device 200 includes an evaporator 220 storing a refrigerant 210, and a condenser 230 condensing and liquefying a vapor-state refrigerant vaporized in the evaporator 220 and radiating heat. A heat-generating part 240 of an object to be cooled such as a semiconductor device is disposed so as to thermally contact with one surface of the evaporator 220.
  • The evaporator 220 is connected to the condenser 230 by using the piping structure of cooling device 100 according to the second exemplary embodiment. As shown in FIG. 2A, the piping structure of cooling device 100 includes a first connection 131 connected to the evaporator 210 and a second connection 132 connected to the condenser 230. FIG. 4 shows a case where the piping structure of cooling device 100 is used for a vapor-phase pipe 251 through which a vapor-phase refrigerant flows from the evaporator 220 toward the condenser 230 and for a liquid-phase pipe 252 through which a liquid-phase refrigerant flows from the condenser 230 toward the evaporator 220. The bending strength of the vapor-phase pipe 251 and the liquid-phase pipe 252 (hereafter, referred to as "a pipe 250" simply) is maintained by means of the second tubular part 120 made of organic materials having the flexibility. In the ebullient cooling device 200, therefore, it is possible to decide freely the disposition of the evaporator 220 and the condenser 230 with maintenance of the mechanical strength of the pipe connecting the evaporator 220 to the condenser 230.
  • As mentioned above, the ebullient cooling device 200 of the present exemplary embodiment is configured in which the evaporator 220 is connected to the condenser 230 by using the pipe 250 including the first tubular part 110 made of metal materials as the inner layer and the second tubular part 120 made of organic materials having the flexibility as the outer layer. By adopting this configuration, it is possible to change the layout of the ebullient cooling device 200 easily even if the layout or the specifications of a device to be cooled are changed. Accordingly, it becomes unnecessary to design and produce the evaporator 220 and the condenser 230 with respect to each device to be cooled, and it becomes possible to standardize them. As a result, it is possible to reduce the costs of the evaporator 220 and the condenser 230.
  • It is also possible that the evaporator 220 is configured to include a first connective projection 221 connected to the first connection 131 of the piping structure of cooling device 100 and the condenser 230 is configured to include a second connective projection 231 connected to the second connection 132. It is also acceptable that at least one of the first connective projection 221 and the second connective projection 231 is made of the same material as the metal material of which the first tubular part 131 is made. In this case, since the electrical potential difference does not arise between the same type of metals, it is possible to prevent the corrosion based on the electrochemical action (electrical corrosion) even though a conductive refrigerant such as water is used.
  • In general, a semiconductor device, an electronic device and the like are designed so as to operate at temperature in the range from several tens of degrees Celsius to about 100 degrees Celsius. By using a material with small surface tension and a low boiling point as the refrigerant used in the ebullient cooling device, therefore, it is possible to activate the generation of bubbles in the evaporator and improve the cooling performance. For this reason, organic refrigerants such as hydrofluorocarbon and hydrofluoroether are used as the refrigerant. These organic refrigerants, however, react chemically with organic materials such as resin and rubber. Since the chemical reaction generates a reaction gas and the internal pressure in the related ebullient cooling device increases, the boiling point of the refrigerant rises. As a result, the cooling performance in the related ebullient cooling device is degraded by the prolonged use.
  • In contrast, the ebullient cooling device 200 of the present exemplary embodiment uses the piping structure of cooling device 100 including the first tubular part 110 made of metal materials as the vapor-phase pipe 251 and the liquid-phase pipe 252. As a result, the reaction between the refrigerant and the pipe is suppressed, and accordingly, it is possible to prevent the cooling performance from degrading and ensure long-term reliability of the ebullient cooling device.
  • Next, the method for connecting pipes will be described in more detail using FIGS. 5A and 5B. FIGS. 5A and 5B are cross-sectional views to illustrate a method for connecting pipes in the cooling device according to the present exemplary embodiment.
  • In the method for connecting pipes according to the present exemplary embodiment, first, as shown in FIG. 5A, the pipe 250 is fitted in the first connective projection 221 or the second connective projection 231 (hereafter, referred to as "a connective projection 260" simply). Here, the pipe 250 includes the piping structure of cooling device 100 according to the second exemplary embodiment, as mentioned above. That is to say, the pipe 250 includes the first tubular part 110 made of metal materials with a hollow portion through which the refrigerant used in the cooling device flows, and the second tubular part 120 made of organic materials with which the first tubular part 110 is covered.
  • Next, a pressure is applied from the outer periphery of the second tubular part 120 toward the center. As shown in FIG. 5B, it is possible to use a clamping tool such as a clamp 270 in order to apply the pressure. The pressure enables the metal material composing the first tubular part 110 to deform and the metal material to be attached firmly to the connective projection 260 by a simple process.
  • Here, the connective projection 260 can be configured to be a nipple shape, as shown in FIGS. 5A and 5B. In this case, since the first tubular part 110 made of metal materials, which composes the inner layer of the pipe 250, has a small wall thickness, it undergoes plastic deformation due to the stress concentration at the convex portions of the nipple shape, and is attached firmly to the connective projection 260. As a result, it is possible to suppress the leakage of the refrigerant from the connective projection 260. Since the pipe 250 according to the present exemplary embodiment includes, as the outer layer, the second tubular part 120 made of organic materials such as resin and rubber, it is possible to maintain the mechanical strength as a pipe even if the metal material of the inner layer is deformed.
  • The present invention is not limited to the above-mentioned exemplary embodiments and can be variously modified within the scope of the invention described in the claims. It goes without saying that these modifications are also included in the scope of the present invention.
    • DESCRIPTION OF THE CODES
    • 10, 100
    piping structure of cooling device
    11, 110
    first tubular part
    120
    second tubular part
    140
    metal plate material
    150
    cylindrical jig
    160
    end section
    170
    nozzle
    200
    ebullient cooling device
    210
    refrigerant
    220
    evaporator
    221
    first connective projection
    230
    condenser
    231
    second connective projection
    240
    heat generating unit
    250
    piping
    251
    vapor-phase pipe
    252
    liquid-phase pipe
    260
    connective projection
    270
    clamp

Claims (13)

  1. A piping structure (10, 100) for a cooling device, comprising:
    a first tubular part (11, 110) with a hollow portion through which a refrigerant used in the cooling device is able to flow;
    wherein the first tubular part (11, 110) is made of metal materials characterised in that the surface roughness of the inner surface of the first tubular part (11, 110) is equal to or more than 0.1 micrometers and less than 1 micrometer so that the surface roughness of the inner surface of the first tubular part (11, 110) is less than or equal to the size of a condensation nucleus for the refrigerant.
  2. The piping structure (10, 100) for a cooling device according to claim 1,
    wherein the first tubular part (11, 110) is formed through an annealing process.
  3. The piping structure (10, 100) for a cooling device according to any one of claims 1 and 2,
    wherein the thickness of the first tubular part (11, 110) is equal to or more than 0.4 mm and less than or equal to 1 mm.
  4. The piping structure (10, 100) for a cooling device according to any one of claims 1, 2, and 3, comprising:
    the first tubular part (11, 110); and
    a second tubular part (120) with which the first tubular part (11,110) is covered,
    wherein the second tubular part (120) is made of organic materials.
  5. The piping structure (10, 100) for a cooling device according to any one of claims 1, 2, 3, and 4, further comprising:
    a first connection connected to an evaporator storing a refrigerant; and
    a second connection connected to a condenser condensing and liquefying a vapor-state refrigerant vaporized in the evaporator and radiating heat.
  6. A cooling device, comprising:
    an evaporator storing a refrigerant;
    a condenser condensing and liquefying a vapor-state refrigerant vaporized in the evaporator and radiating heat; and
    a pipe connecting the evaporator to the condenser,
    wherein the pipe comprises the piping structure for a cooling device (10, 100) according to any one of claims 1, 2, 3, 4, and 5.
  7. The cooling device according to claim 6,
    wherein the evaporator comprises a first connective projection connected to the pipe; the condenser comprises a second connective projection connected to the pipe; and at least one of the first connective projection and the second connective projection is made of the same material as a metal material of which the first tubular part is made.
  8. A method for making a piping structure for a cooling device, comprising the steps of:
    applying a rolling process to a metal material composing a hollow portion through which a refrigerant used in a cooling device flows;
    forming a plate-like metal plate material with a surface roughness equal to or more than 0.1 micrometers and less than 1 micrometer so that the surface roughness is less than or equal to the size of a condensation nucleus for the refrigerant by the rolling process; and
    bending the metal plate material into a tube and joining both ends.
  9. The method for making a piping structure for a cooling device according to claim 8, further comprising:
    performing an annealing process subsequently to the joining process.
  10. The method for making a piping structure for a cooling device according to claim 8, further comprising:
    forming a first tubular part made of metal materials by the joining process; and
    covering the outer periphery of the first tubular part by ejecting an organic material and forming a second tubular part made of the organic material.
  11. A method for connecting pipes, comprising the steps of:
    fitting, in a connective projection, a pipe comprising a first tubular part, the first tubular part having a hollow portion through which a refrigerant used in a cooling device is able to flow, made of a metal material, and a surface roughness of its inner surface being equal to or more than 0.1 micrometers and less than 1 micrometer so that the surface roughness of said inner surface is less than or equal to the size of a condensation nucleus for the refrigerant,
    applying a pressure from the outer periphery of the pipe toward the center; and
    deforming the metal material composing the first tubular part by the pressure and attaching firmly the metal material to the connective projection.
  12. The method for connecting pipes according to claim 11,
    wherein the first tubular part is formed through an annealing process.
  13. The method for connecting pipes according to claim 11,
    wherein the pipe comprises a second tubular part, which is made of organic materials, with which the first tubular part is covered; and
    the pressure is applied from the outer periphery of the second tubular part toward the center.
EP12770839.4A 2011-04-13 2012-04-10 Piping structure of cooling device, manufacturing method thereof, and pipe coupling method. Active EP2698590B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011089347 2011-04-13
PCT/JP2012/060197 WO2012141320A1 (en) 2011-04-13 2012-04-10 Piping structure of cooling device, manufacturing method thereof, and pipe coupling method.

Publications (3)

Publication Number Publication Date
EP2698590A1 EP2698590A1 (en) 2014-02-19
EP2698590A4 EP2698590A4 (en) 2014-11-19
EP2698590B1 true EP2698590B1 (en) 2016-11-30

Family

ID=47009478

Family Applications (1)

Application Number Title Priority Date Filing Date
EP12770839.4A Active EP2698590B1 (en) 2011-04-13 2012-04-10 Piping structure of cooling device, manufacturing method thereof, and pipe coupling method.

Country Status (5)

Country Link
US (1) US20140027100A1 (en)
EP (1) EP2698590B1 (en)
JP (1) JP6156142B2 (en)
CN (1) CN103459969A (en)
WO (1) WO2012141320A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200049580A (en) * 2018-10-29 2020-05-08 가부시키가이샤 고베 세이코쇼 Low temperature liquefied gas vaporizer, cooling system, and ice accretion suppressing method in vaporizer

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012242009A (en) * 2011-05-20 2012-12-10 Nec Corp Connection pipe, method of manufacturing the same, and cooling device using the same
US20150062821A1 (en) * 2012-03-22 2015-03-05 Nec Corporation Cooling Structure for Electronic Circuit Board, and Electronic Device Using the Same
RU2508516C1 (en) * 2012-12-06 2014-02-27 Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Казанский государственный энергетический университет" (ФГБОУ ВПО "КГЭУ") Heat exchange tube
US20160377356A1 (en) * 2015-06-25 2016-12-29 Asia Vital Components Co., Ltd. Flexible and transformable water-cooling device

Family Cites Families (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1944094A (en) * 1927-06-01 1934-01-16 Laura S Stevenson Method of making tubes and pipes
US2508465A (en) * 1944-03-18 1950-05-23 Westinghouse Electric Corp Lined metal tube and method of manufacture
US3847353A (en) * 1973-11-14 1974-11-12 J Wynne Spray device for coating the outside of pipe
US3988427A (en) * 1974-05-22 1976-10-26 Ethyl Corporation Flame reaction process for producing hydrogen bromide
DE2919188C2 (en) * 1979-05-12 1986-10-30 Süddeutsche Kühlerfabrik Julius Fr. Behr GmbH & Co KG, 7000 Stuttgart Method for treating a surface of a metallic wall for the transfer of heat and its application
US4589275A (en) * 1982-04-16 1986-05-20 The Kendall Company Pipe coating
JPS6076793U (en) * 1983-10-31 1985-05-29 昭和アルミニウム株式会社 Metal tube for heat pipes with acid-resistant coating layer
JP3071441B2 (en) * 1990-02-03 2000-07-31 臼井国際産業株式会社 Multiple wound steel pipe, method for producing the same, and strip used for the same
US5070937A (en) * 1991-02-21 1991-12-10 American Standard Inc. Internally enhanced heat transfer tube
KR100267605B1 (en) * 1992-09-24 2000-10-16 안자이 이치로 Pipe joint
JPH06224337A (en) 1993-01-22 1994-08-12 Yaskawa Electric Corp Vaporization cooling apparatus
US5388329A (en) * 1993-07-16 1995-02-14 Olin Corporation Method of manufacturing a heating exchange tube
JPH11300411A (en) * 1994-04-14 1999-11-02 Sumitomo Metal Ind Ltd Bright annealing type clean pipe and its manufacture
JPH08261671A (en) * 1995-03-23 1996-10-11 Mitsubishi Shindoh Co Ltd Heat sink and electronic apparatus with the sink
DE19516830A1 (en) * 1995-05-08 1996-11-14 Veritas Gummiwerke Ag Pressing tools and methods for connecting tubular elements
JPH0949693A (en) * 1995-08-04 1997-02-18 Fujikura Ltd Manufacture of heat pipe container
JP2000258080A (en) * 1999-03-05 2000-09-22 Maruyasu Industries Co Ltd Heat pipe and manufacture thereof
US6393226B1 (en) * 2000-10-04 2002-05-21 Nexpress Solutions Llc Intermediate transfer member having a stiffening layer and method of using
US6971442B2 (en) * 2001-06-29 2005-12-06 Intel Corporation Method and apparatus for dissipating heat from an electronic device
JP2003214750A (en) * 2002-01-23 2003-07-30 Twinbird Corp Thermosiphon
DE10221515C1 (en) * 2002-05-14 2003-11-13 Hydro Aluminium Deutschland Aluminium tube manufacturing method using dressing rollers for texturing outer surface of aluminium tube
JP4032954B2 (en) * 2002-07-05 2008-01-16 ソニー株式会社 COOLING DEVICE, ELECTRONIC DEVICE DEVICE, SOUND DEVICE, AND COOLING DEVICE MANUFACTURING METHOD
US6910620B2 (en) * 2002-10-15 2005-06-28 General Electric Company Method for providing turbulation on the inner surface of holes in an article, and related articles
US20050121177A1 (en) * 2003-12-03 2005-06-09 Chiung-Chuan Wang Radiation tube structure
JP2005257989A (en) * 2004-03-11 2005-09-22 Nitto Kogyo Co Ltd Rotating body for fixing
JP4234635B2 (en) * 2004-04-28 2009-03-04 株式会社東芝 Electronics
CN1707785A (en) * 2004-06-11 2005-12-14 鸿富锦精密工业（深圳）有限公司 Liquid-cooled radiator
US7922065B2 (en) * 2004-08-02 2011-04-12 Ati Properties, Inc. Corrosion resistant fluid conducting parts, methods of making corrosion resistant fluid conducting parts and equipment and parts replacement methods utilizing corrosion resistant fluid conducting parts
US20060042274A1 (en) * 2004-08-27 2006-03-02 Manole Dan M Refrigeration system and a method for reducing the charge of refrigerant there in
JP2006125718A (en) * 2004-10-28 2006-05-18 Sony Corp Heat transport device, and electronic device
US7204298B2 (en) * 2004-11-24 2007-04-17 Lucent Technologies Inc. Techniques for microchannel cooling
US20090158799A1 (en) * 2005-02-17 2009-06-25 Yoshiaki Takeishi Metal Pipe and Manufacturing Method Thereof
EP1889936B1 (en) * 2005-06-09 2019-03-13 JFE Steel Corporation Ferrite stainless steel sheet for bellows stock pipe
TWI285081B (en) * 2005-08-10 2007-08-01 Cooler Master Co Ltd Heat-dissipation structure and method thereof
US7562444B2 (en) * 2005-09-08 2009-07-21 Delphi Technologies, Inc. Method for manufacturing a CPU cooling assembly
US20080101023A1 (en) * 2006-11-01 2008-05-01 Hsia-Yuan Hsu Negative pressure pump device
US20080104840A1 (en) * 2006-11-03 2008-05-08 Qnx Cooling Systems Inc. Heat transfer unit extrusion process
JP2008202880A (en) * 2007-02-21 2008-09-04 Nomura Unison Co Ltd Cooling system
JP4878317B2 (en) * 2007-03-22 2012-02-15 株式会社コベルコ マテリアル銅管 Copper tube made of copper or copper alloy
US20080229580A1 (en) * 2007-03-23 2008-09-25 Russell Charles Anderson Method of manufacturing a brazed micro-channel cold plate heat exchanger assembly
US20100259888A1 (en) * 2007-09-17 2010-10-14 Vadim Anatolievich Pomytkin Thermal spreader for heat pipe coolers and water coolers
US20090090489A1 (en) * 2007-10-05 2009-04-09 Asia Vital Components Co., Ltd. Water-cooling heat-dissipating module of electronic apparatus
EP2209051A4 (en) * 2007-11-05 2013-12-04 Endo Seisakusho Kk Tube and its manufacturing method
JP4819071B2 (en) * 2008-02-06 2011-11-16 本田技研工業株式会社 Electric vehicle and cooling method for DC / DC converter for vehicle
WO2009104575A1 (en) * 2008-02-19 2009-08-27 昭和電工株式会社 Method of manufacturing a pipe coupling component, method of manufacturing a casing structural member, and pipe coupling structure for a hollow part
US8748008B2 (en) * 2008-06-12 2014-06-10 Exxonmobil Research And Engineering Company High performance coatings and surfaces to mitigate corrosion and fouling in fired heater tubes
JP2010181057A (en) * 2009-02-04 2010-08-19 Mitsubishi Electric Corp Sealed pipe and method of sealing thin pipe
US20100296249A1 (en) * 2009-05-19 2010-11-25 Beijing AVC Technology Research Center Co., Ltd. Micro passage cold plate device for a liquid cooling radiator
JP5210997B2 (en) * 2009-08-28 2013-06-12 株式会社日立製作所 COOLING SYSTEM AND ELECTRONIC DEVICE USING THE SAME
DE102009045882A1 (en) * 2009-10-21 2011-04-28 Evonik Degussa Gmbh Geothermal probe for a geothermal heat pump
TWI506238B (en) * 2009-12-29 2015-11-01 Foxconn Tech Co Ltd Micro liquid cooling device
DE102010004960A1 (en) * 2010-01-20 2011-07-21 J. Eberspächer GmbH & Co. KG, 73730 Pipe body and exhaust system
WO2012053624A1 (en) * 2010-10-19 2012-04-26 日本電気株式会社 Cooling device and method for producing same
JPWO2012060461A1 (en) * 2010-11-02 2014-05-12 日本電気株式会社 Cooling device and manufacturing method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200049580A (en) * 2018-10-29 2020-05-08 가부시키가이샤 고베 세이코쇼 Low temperature liquefied gas vaporizer, cooling system, and ice accretion suppressing method in vaporizer

Also Published As

Publication number Publication date
EP2698590A4 (en) 2014-11-19
WO2012141320A1 (en) 2012-10-18
US20140027100A1 (en) 2014-01-30
JP6156142B2 (en) 2017-07-05
EP2698590A1 (en) 2014-02-19
CN103459969A (en) 2013-12-18
JPWO2012141320A1 (en) 2014-07-28

Similar Documents

Publication Publication Date Title
EP2698590B1 (en) Piping structure of cooling device, manufacturing method thereof, and pipe coupling method.
US11789505B2 (en) Loop heat pipe
US7891413B2 (en) Heat pipe
US8400770B2 (en) Heat spreader, electronic apparatus, and heat spreader manufacturing method
US8391007B2 (en) Heat spreader, electronic apparatus, and heat spreader manufacturing method
US9074825B2 (en) Heatsink apparatus and electronic device having the same
US7520315B2 (en) Heat pipe with capillary wick
US20110174464A1 (en) Flat heat pipe and method for manufacturing the same
US20070107878A1 (en) Heat pipe with a tube therein
CN109724438B (en) Loop type heat pipe
JP2010121867A (en) Heat transport device, electronic equipment and method of manufacturing the heat transport device
US10712098B2 (en) Loop heat pipe and method of manufacturing loop heat pipe
JP2018194197A (en) Heat pipe and electronic equipment
JP5183744B2 (en) Piping device and fluid transfer device
JP2020516845A (en) Evaporator with optimized vaporization interface
US20060201655A1 (en) Heat pipe suitable for application in electronic device with limited mounting space
US9062920B2 (en) Heat pipe with sealed vesicle
US20130219954A1 (en) Cooling device and method for producing the same
EP2851948B1 (en) Connecting structure of cooling device, cooling device, and method for connecting cooling device
WO2008100007A1 (en) Flat plate heat pipe and method for manufacturing the same
US9689622B2 (en) Heat transfer device
JP2012242009A (en) Connection pipe, method of manufacturing the same, and cooling device using the same
EP2801781B1 (en) Cooling device
KR101927751B1 (en) Heat pipe and method of manufacturing the same
EP3910275B1 (en) Loop-type heat pipe

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20131113

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DAX Request for extension of the european patent (deleted)
A4 Supplementary search report drawn up and despatched

Effective date: 20141020

RIC1 Information provided on ipc code assigned before grant

Ipc: F28F 21/08 20060101ALI20150831BHEP

Ipc: F28F 13/02 20060101AFI20150831BHEP

Ipc: F28D 15/02 20060101ALI20150831BHEP

Ipc: F28F 13/18 20060101ALI20150831BHEP

Ipc: F28F 19/04 20060101ALI20150831BHEP

Ipc: F28F 1/00 20060101ALI20150831BHEP

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

INTG Intention to grant announced

Effective date: 20160613

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

Ref country code: GB

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: AT

Ref legal event code: REF

Ref document number: 850199

Country of ref document: AT

Kind code of ref document: T

Effective date: 20161215

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 602012026073

Country of ref document: DE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LV

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20161130

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 6

REG Reference to a national code

Ref country code: LT

Ref legal event code: MG4D

REG Reference to a national code

Ref country code: NL

Ref legal event code: MP

Effective date: 20161130

REG Reference to a national code

Ref country code: AT

Ref legal event code: MK05

Ref document number: 850199

Country of ref document: AT

Kind code of ref document: T

Effective date: 20161130

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20161130

Ref country code: LT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20161130

Ref country code: NO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170228

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170301

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170330

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20161130

Ref country code: AT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20161130

Ref country code: HR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20161130

Ref country code: RS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20161130

Ref country code: ES

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20161130

Ref country code: PL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20161130

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: NL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20161130

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20161130

Ref country code: RO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20161130

Ref country code: CZ

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20161130

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20161130

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20161130

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SM

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20161130

Ref country code: BG

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170228

Ref country code: IT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20161130

Ref country code: BE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20161130

REG Reference to a national code

Ref country code: DE

Ref legal event code: R097

Ref document number: 602012026073

Country of ref document: DE

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed

Effective date: 20170831

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20161130

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

REG Reference to a national code

Ref country code: IE

Ref legal event code: MM4A

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MC

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20161130

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20170410

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20170430

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20170430

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 7

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20170410

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20170410

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: HU

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT; INVALID AB INITIO

Effective date: 20120410

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CY

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20161130

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20161130

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: TR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20161130

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: AL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20161130

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170330

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 20240419

Year of fee payment: 13

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20240418

Year of fee payment: 13

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20240425

Year of fee payment: 13