CN103459969A - Piping structure of cooling device, manufacturing method thereof, and pipe coupling method - Google Patents
Piping structure of cooling device, manufacturing method thereof, and pipe coupling method Download PDFInfo
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- CN103459969A CN103459969A CN2012800177405A CN201280017740A CN103459969A CN 103459969 A CN103459969 A CN 103459969A CN 2012800177405 A CN2012800177405 A CN 2012800177405A CN 201280017740 A CN201280017740 A CN 201280017740A CN 103459969 A CN103459969 A CN 103459969A
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- tubular portion
- cooling device
- pipeline structure
- cold
- producing medium
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
- F28F13/185—Heat-exchange surfaces provided with microstructures or with porous coatings
- F28F13/187—Heat-exchange surfaces provided with microstructures or with porous coatings especially adapted for evaporator surfaces or condenser surfaces, e.g. with nucleation sites
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F19/00—Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers
- F28F19/02—Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers by using coatings, e.g. vitreous or enamel coatings
- F28F19/04—Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers by using coatings, e.g. vitreous or enamel coatings of rubber; of plastics material; of varnish
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
- F28F21/081—Heat exchange elements made from metals or metal alloys
- F28F21/084—Heat exchange elements made from metals or metal alloys from aluminium or aluminium alloys
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/003—Multiple wall conduits, e.g. for leak detection
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
- F28F2255/02—Flexible elements
Abstract
In a piping structure of a cooling device in a boiling cooling system, when a pipe has flexibility, cooling performance of the cooling device is lowered. Therefore, this piping structure of a cooling device has a first tubular part provided with a hollow part, through which a refrigerant used in the cooling device flows, the first tubular part is made of a metal material, and the surface roughness of an inner surface of the first tubular part is not more than the size of a condensation nucleus of the refrigerant.
Description
Technical field
The present invention relates to a kind of pipeline structure of the cooling device for semiconductor device and electronic installation etc., the invention particularly relates to a kind of pipeline structure that uses the cooling device of boiling cooling system, in described boiling cooling system, heat transmission and heat radiation are carried out by evaporation and the condensation cycle of cold-producing medium, and relate to a kind of a kind of method and method for tube connector of manufacturing this pipeline structure.
Background technology
In recent years, along with the high-performance of semiconductor device and electronic installation and the progress of high functionality, from the caloric value increase of these devices.On the other hand, the microminiaturization of semiconductor device and electronic installation is because the universal of mancarried device promoted.Because this background, require to have high efficiency and undersized cooling device to heavens.The cooling device of the boiling cooling system of carrying out by evaporation and the condensation cycle of cold-producing medium with heat transfer and heat radiation is expected to as the cooling device for semiconductor device and electronic installation, because it does not require any driver element, such as pump.
Use the example of the cooling device (hereinafter also referred to as boiling cooling device) of boiling cooling system to describe in patent documentation 1.The boiling cooling device of describing in patent documentation 1 comprises evaporimeter, and this evaporimeter absorbs the heat from heater element by the evaporation of working fluid (such as pure water and ethanol).Boiling cooling device comprises flow duct, and this flow duct circulates working fluid between evaporimeter and condenser, and boiling cooling device is constructed so that flow duct can be in a plurality of some place's bendings.It is said that this structure makes flow duct can be used as spring and works and absorb the power that is applied to evaporimeter and condenser.
Yet, in the boiling cooling device of describing in patent documentation 1, the metal tube with spring function of being made by rigid metal is as flow duct, and the problem therefore existed is to arrange that the free degree with the flow duct of curved shape is limited.The problem also existed is, if but the thickness reduction of metal tube to the thickness that makes its free bend, mechanical strength can not maintain, and flexing for example occurs in BENDING PROCESS.In addition, the problem of existence is if use the cold-producing medium of conduction, due to the metal that forms flow duct and the electrical potential difference that forms between the metal of connection of evaporimeter or condenser, the corrosion (galvano-cautery) based on electrochemical action occurs.
On the other hand, low boiling has machine refrigerant often as the cold-producing medium in boiling cooling device, with the cooling performance in the operating temperature range that improves semiconductor device and electronic installation.Can obtain flexible pipe by using organic material (such as resin and rubber).Yet, if use the pipe made by organic material, the problem existed is because use has the chemical reaction of machine refrigerant, internal pressure to be raise, and therefore cooling performance reduces due to the elevation of boiling point of cold-producing medium.
Patent documentation 2 has been described a kind of technology of head it off.The boiling cooling device of describing in patent documentation 2 comprises the evaporator vessel that holds refrigerant fluid, by the condenser of the condensation of refrigerant of evaporation with evaporator vessel is connected to the single tube of condenser, by this single tube, gas-liquid is moving with mixed phase flow.Pipe has corrosion-resistant and film impermeabilisation material (such as aluminium and stainless steel) and is evaporated to the structure on the inwall of the pipe that resin makes.It is said that this structure makes pipe have enough rigidity and resists atmospheric pressure with the shape that maintains pipe, and therefore the installation site of evaporator vessel and condenser can freely determine.
Patent documentation 1: Japanese Patent Application Laid-Open 2006-125718([0025] to [0044] section).
Patent documentation 2: Japanese Patent Application Laid-Open 1994-224337([004] to [009] section).
Summary of the invention
The problem that the present invention is to be solved
As mentioned above, the pipe in related boiling cooling device has metallic film and is evaporated to the structure on the inner surface of pipe.Yet the steam of cold-producing medium again is condensed and is liquefied at the middle part of pipe due to the surface roughness of the metallic film evaporated on resin.Therefore, using the problem that the relevant boiling cooling device of such pipe has is that the heat of carrying by cold-producing medium reduces.
Therefore, in the pipeline structure of related boiling cooling device, the problem of existence is if pipe has flexible the cooling performance of cooling device is reduced.
The purpose of this invention is to provide a kind of pipeline structure of cooling device, a kind of method for the manufacture of this pipeline structure and a kind of method for tube connector, this has solved above-described problem: in the pipeline structure of the cooling device that uses the boiling cooling system, if pipe has cooling performance flexible cooling device, reduce.
The method of dealing with problems
Comprise the first tubular portion according to the pipeline structure of the cooling device of illustrative aspects of the present invention, this first tubular portion is with hollow space, and the cold-producing medium used in cooling device flows through this hollow space; Wherein, the first tubular portion is made by metal material; And the surface roughness of the inner surface of the first tubular portion is less than or equal to the size of the nucleus of condensation of cold-producing medium.
Comprise the steps: rolling process is applied to form the metal material of the hollow space flow through for the cold-producing medium in cooling device for the manufacture of the method for the pipeline structure of the cooling device according to illustrative aspects of the present invention; Form the plate-shape metal plate material by rolling process, the surface roughness of this metallic sheet material is less than or equal to the size of the nucleus of condensation of cold-producing medium; Manage and two ends are engaged with metallic sheet material is bent into.
Comprise the steps: to assemble according to the method for the pipe of illustrative aspects of the present invention the pipe that comprises the first tubular portion for connection within connecting protuberance, this first tubular portion has, hollow space that by metal material made that flow through for the cold-producing medium in cooling device, and the surface roughness of its inner surface is less than or equal to the size of the nucleus of condensation of cold-producing medium; From pipe, circumferential central authorities exert pressure; With the metal material distortion that makes to form the first tubular portion by pressure, and metal material is attached to the connection protuberance securely.
Effect of the present invention
According to the pipeline structure of cooling device of the present invention, even can obtain the pipeline structure that pipe has the deteriorated cooling device of the flexible cooling performance that does not also cause cooling device.
The accompanying drawing explanation
Figure 1A shows the plane according to the structure of the pipeline structure of the cooling device of the first exemplary embodiment of the present invention.
Figure 1B shows the cross-sectional view according to the structure of the pipeline structure of the cooling device of the first exemplary embodiment of the present invention.
Fig. 2 A shows the plane according to the structure of the pipeline structure of the cooling device of the second exemplary embodiment of the present invention.
Fig. 2 B shows the cross-sectional view according to the structure of the pipeline structure of the cooling device of the second exemplary embodiment of the present invention.
Fig. 3 A illustrates the cross-sectional view be used to form according to the method for the pipeline structure of the cooling device of the second exemplary embodiment of the present invention.
Fig. 3 B illustrates the cross-sectional view be used to form according to the method for the pipeline structure of the cooling device of the second exemplary embodiment of the present invention.
Fig. 4 shows the cross-sectional view according to the structure of the boiling cooling device of the 3rd exemplary embodiment of the present invention.
Fig. 5 A illustrates for connecting the cross-sectional view according to the method for the pipe in the cooling device of the 3rd exemplary embodiment of the present invention.
Fig. 5 B illustrates for connecting the cross-sectional view according to the method for the pipe in the cooling device of the 3rd exemplary embodiment of the present invention.
The specific embodiment
Referring now to accompanying drawing, exemplary embodiment of the present invention is described.
[the first exemplary embodiment]
Figure 1A and Figure 1B show the pipeline structure according to the cooling device 10 of the first exemplary embodiment of the present invention.Figure 1A is plane, and Figure 1B is the cross-sectional view in the plane vertical at the axial direction with pipeline structure (along the cross section of the line A-A intercepting of Figure 1A).The first tubular portion 11 that comprises the hollow space flow through with the cold-producing medium in cooling device according to the pipeline structure of the cooling device 10 of this exemplary embodiment.
The first tubular portion 11 is made by metal material, and the surface roughness of the inner surface of the first tubular portion 11 is less than or equal to the size of the nucleus of condensation of cold-producing medium.At this, nucleus of condensation means the point worked as basic point when steam liquefied.If steam contact basic point, the liquefaction at its place is accelerated.For example, can use aluminum etc. as the first tubular portion 11.Be set as being equal to or greater than 0.1 micron and be less than or equal to 10 microns by the center line average roughness by surperficial, preferably be less than or equal to 1 micron, the inner surface that can prevent the first tubular portion 11 works as the nucleus of condensation of cold-producing medium.
Can use the material formed by annealing process for the first tubular portion.By annealing process, the strain that capable of regulating processing produces while processing, and can be in the situation that maintain the intensity that the flexibility of the first tubular portion maintains the first tubular portion.
Next, the manufacture method according to the pipeline structure of the cooling device 10 of this exemplary embodiment by description.In the manufacture method for according to this exemplary embodiment, at first prepare the plate-shape metal plate material of for example, being made by metal material (aluminium).Metallic sheet material can produce by conventional rolling process.For example, by using cylindrical fixture (such as roller), metallic sheet material is bent into to pipe, and by welding process etc., two ends is engaged.By this process, completed the first tubular portion 11 of being made by metal material.Also acceptable is to carry out subsequently annealing process.Annealing process can be carried out under the condition that is generally used for metal material to be used.What wish is that the thickness of the first tubular portion (its plate thickness by metallic sheet material is determined) is set as being equal to or greater than 0.4mm and is less than or equal to 1mm.This is to be less than 0.4mm because if the plate thickness of metallic sheet material becomes, the bending strength and the internal pressure capacity that become and be difficult to weld end and be difficult to maintain the first tubular portion.On the other hand, if also because the thickness of the first tubular portion surpasses 1mm, the flexibility of the pipeline structure of cooling device 10 reduces.
As mentioned above, according to this exemplary embodiment, can obtain the pipeline structure of cooling device, even pipe has flexibility, this pipeline structure does not cause cooling performance deteriorated of cooling device yet.
[the second exemplary embodiment]
Next, the second exemplary embodiment of the present invention will be described.Fig. 2 A and Fig. 2 B show the structure according to the pipeline structure of the cooling device 100 of the second exemplary embodiment of the present invention.Fig. 2 A is plane, and Fig. 2 B is the cross-sectional view in the plane vertical at the axial direction with pipeline structure (along the cross section of the intercepting of the line A-A in Fig. 2 A).Comprise the first tubular portion 110 of the hollow space flow through with the cold-producing medium in cooling device according to the pipeline structure of the cooling device 100 of this exemplary embodiment, and cover the second tubular portion 120 of the first tubular portion 110.
The first tubular portion 110 is made by metal material, and the surface roughness of the inner surface of the first tubular portion 110 is less than or equal to the size of the nucleus of condensation of cold-producing medium.At this, nucleus of condensation means the point worked as basic point when steam liquefied.If steam contact basic point, the liquefaction at its place is accelerated.For example, can use aluminum etc. as the first tubular portion 110.Be set as being equal to or greater than 0.1 micron and be less than or equal to 10 microns by the center line average roughness by surperficial, preferably be less than or equal to 1 micron, the inner surface that can prevent the first tubular portion 110 works as the nucleus of condensation of cold-producing medium.
The second tubular portion is made by organic material (such as resin and rubber), and for example, can use polythene material and butyl rubber material.
As mentioned above, the first tubular portion 110 that is constructed to contact cold-producing medium according to the pipeline structure of the cooling device 100 of this exemplary embodiment is made by metal material, and makes the surface roughness of inner surface be less than or equal to the size of the nucleus of condensation of cold-producing medium.Therefore, can prevent pipeline structure and the cold-producing medium generation chemical reaction of cooling device 100, and prevent the steam condensation again of cold-producing medium.In addition, because the pipeline structure of cooling device 100 comprises the sandwich construction of the second tubular portion 120 coverings that the first tubular portion 110 is made by organic material, so can be in the situation that maintain the mechanical strength that the flexibility of the pipeline structure of cooling device 100 maintains the pipeline structure of cooling device 100.As a result, according to this exemplary embodiment, can obtain the pipeline structure of following cooling device, even this pipeline structure pipe has the deteriorated of the flexible cooling performance that does not also cause cooling device.
Next, the formation method according to the pipeline structure of the cooling device 100 of this exemplary embodiment by description.Fig. 3 A and Fig. 3 B illustrate the cross-sectional view of formation according to the method for the pipeline structure of the cooling device 100 of this exemplary embodiment.In the method be used to form according to this exemplary embodiment, at first prepare the plate-shape metal plate material 140 of being made by metal material (such as aluminium).As shown in Fig. 3 A, metallic sheet material 140 is by being used cylindrical fixture 150(such as roller) be bent into pipe, and by welding process etc., two ends 160 are engaged.By this process, completed the first tubular portion 110 of being made by metal material.
Next, as shown in FIG 3 B, the periphery of the first tubular portion 110 is capped by from nozzle 170 grades, spraying for example poly resin material.By this process, formed the second tubular portion of being made by organic material, cover the first tubular portion 110 with described the second tubular portion, and completed the pipeline structure of cooling device 100.Because comprise simple process according to the method for the pipeline structure that is used to form cooling device 100 of of the present invention exemplary embodiment, so formation method according to the present invention can be in enormous quantities and manufactured at an easy rate the pipeline structure of cooling device 100.
At this, the surface roughness of the inner surface of the first tubular portion 110 that hope will be made by metallic sheet material 140 is set as being equal to or greater than 0.1 micron and be less than or equal to 10 microns, preferably is less than or equal to 1 micron.This can produce metallic sheet material 140 by conventional rolling process and realize.By surface roughness is set within this range, the inner surface that can prevent the first tubular portion 110 works as the nucleus of condensation of cold-producing medium.What wish is that the thickness of the first tubular portion (its plate thickness by metallic sheet material 140 is determined) is set as being equal to or greater than 0.4mm and is less than or equal to 1mm.This is to be less than 0.4mm because if the plate thickness of metallic sheet material 140 becomes, the bending strength and the internal pressure capacity that become and be difficult to weld end 160 and be difficult to maintain the first tubular portion.On the other hand, if the thickness of the first tubular portion surpasses 1mm, the flexibility of the pipeline structure of cooling device 100 also reduces.
[the 3rd exemplary embodiment]
Next, the 3rd exemplary embodiment of the present invention will be described.In this exemplary embodiment, will describe use the cooling device according to the pipeline structure of the cooling device 100 of the second exemplary embodiment, but also acceptable be the pipeline structure used according to the cooling device 10 of the first exemplary embodiment.The situation that pipeline structure is applied to the cooling device (hereinafter referred to as boiling cooling device) of use boiling cooling system will be described as follows.Fig. 4 shows the cross-sectional view according to the structure of the boiling cooling device 200 of this exemplary embodiment.Boiling cooling device 200 comprises the evaporimeter 220 of storing cold-producing medium 210, and the cold-producing medium of the steam-like that will evaporate in evaporimeter 220 condenser 230 that carries out condensation and liquefaction and heat radiation.The heating part 240(to be cooled of object is such as semiconductor device) be arranged to a surface heat of evaporimeter 220 and contact.
As mentioned above, the boiling cooling device 200 of this exemplary embodiment is constructed to wherein evaporimeter 220 and manages 250 by use and be connected to condenser 230, and this pipe 250 comprises by metal material and is made for the first tubular portion 110 of internal layer and is made for outer field the second tubular portion 120 by having flexible organic material.By taking this structure, even the layout of device to be cooled or specifications vary also can easily change the layout of boiling cooling device 200.Therefore, become need to be not to be cooled for each device design and produce evaporimeter 220 and condenser 230, and become can be by evaporimeter 220 and condenser 230 standardization.As a result of, can reduce the cost of evaporimeter 220 and condenser 230.
Also evaporimeter 220 can be configured to comprise the first connection protuberance 221 of the first connecting portion 131 of the pipeline structure that is connected to cooling device 100, and condenser 230 is configured to comprise that being connected to second of the second connecting portion 132 connects protuberance 231.Also acceptable is to make the first connection protuberance 221 be connected at least one the material manufacture identical by the metal material with manufacturing the first tubular portion 131 in protuberance 231 with second.In this case, because do not produce electrical potential difference between the material of same type, so, even use conduction cold-producing medium (such as water), can prevent the corrosion (galvano-cautery) based on electrochemical action yet.
Usually, semiconductor device, electronic installation etc. are designed to operate under the temperature range from tens of degrees centigrade to about 100 degrees centigrade.Therefore, by being used as the cold-producing medium in boiling cooling device with little surface tension and lower boiling material, can excite the generation of the bubble in evaporimeter and improve cooling performance.Reason, have machine refrigerant (such as hydrogen fluorohydrocarbon and hydrogen fluorine ether) as cold-producing medium for this reason.Yet these have machine refrigerant and organic material (such as resin and rubber) that chemical reaction occurs.Because chemical reaction has generated reacting gas and the internal pressure in relevant boiling cooling device raises, so the elevation of boiling point of cold-producing medium.As a result, the cooling performance in relevant boiling cooling device is because long-term the use descends.
By contrast, the boiling cooling device 200 of this exemplary embodiment is used the pipeline structure of the cooling device 100 that comprises the first tubular portion 110 of being made by metal material as vapor phase pipe 251 and liquid phase tube 252.As a result of, suppressed the reaction between cold-producing medium and pipe, and therefore can prevent that cooling performance from reducing and having guaranteed the long-term reliability of boiling cooling device.
Next, will use Fig. 5 A and Fig. 5 B to describe in more detail the method for tube connector.Fig. 5 A and Fig. 5 B are the cross-sectional views for the method at the cooling device tube connector illustrated according to this exemplary embodiment.
In the method for the tube connector according to this exemplary embodiment, at first, as shown in Fig. 5 A, will manage 250 and be assemblied in the first connection protuberance 221 or (hereinafter referred to as " connecting protuberance 260 ") in the second connection protuberance 231.At this, manage 250 pipeline structures that comprise according to the cooling device 100 of the second exemplary embodiment, as mentioned above.That is, manage 250 and comprise the first tubular portion 110 of the hollow space of being made by metal material, flow through with the cold-producing medium in cooling device, and the second tubular portion 120 of covering the first tubular portion 110 of being made by organic material.
Then, from the second tubular portion 120, circumferential central authorities exert pressure.As shown in Fig. 5 B, can use clamping tool (such as folder) 270 to exert pressure.Pressure makes the metal material that forms the first tubular portion 110 to be out of shape, and metal material is attached to securely and connects protuberance 260 by simple process.
At this, connect protuberance 260 and can be configured to have nipple (nipple) shape, as shown in Fig. 5 A and Fig. 5 B.In this case, because the first tubular portion 110 of being made by the metal material that has formed the internal layer of managing 250 has little wall thickness, so the first tubular portion 110 experiences plastic deformation because the stress of the lug boss office in the nipple shape is concentrated, and be attached to securely connection protuberance 260.As a result of, can suppress cold-producing medium from connecting the leakage of protuberance 260.Because comprise that according to the pipe 250 of this exemplary embodiment the second tubular portion 120 of being made by organic material (such as resin and rubber) is as outer, so even the distortion of the metal material of internal layer also can maintain the mechanical strength of pipe.
The invention is not restricted to above-described exemplary embodiment, and can in the scope described in claim of the present invention, carry out various improvement.Self-evident, these modification are also included within scope of the present invention.
The application based on and require the rights and interests of the Japanese patent application 2011-089347 that submits on April 13rd, 2011, its full content is incorporated to this paper by reference.
Reference numerals list:
10, the pipeline structure of 100 cooling devices
11,110 first tubular portions
120 second tubular portions
140 metallic sheet materials
150 cylindrical fixtures
160 ends
170 nozzles
200 boiling cooling devices
210 cold-producing mediums
220 evaporimeters
221 first connect protuberance
230 condensers
231 second connect protuberance
240 heat-generating units
250 pipelines
251 vapor phase pipes
252 liquid phase tubes
260 connect protuberance
270 folders
Claims (14)
1. the pipeline structure of a cooling device, described pipeline structure comprises:
The first tubular portion, the hollow space that described the first tubular portion flows through with the cold-producing medium in cooling device;
Wherein, described the first tubular portion is made by metal material; And the surface roughness of the inner surface of described the first tubular portion is less than or equal to the size of the nucleus of condensation of described cold-producing medium.
2. the pipeline structure of cooling device according to claim 1, wherein, described the first tubular portion forms by annealing process.
3. the pipeline structure of cooling device according to claim 1 and 2, wherein, the surface roughness of the inner surface of described the first tubular portion is equal to or greater than 0.1 micron and be less than or equal to 10 microns.
4. according to the pipeline structure of the described cooling device of any one in claim 1,2 and 3, wherein, the thickness of described the first tubular portion is equal to or greater than 0.4mm and is less than or equal to 1mm.
5. according to the pipeline structure of the described cooling device of any one in claim 1,2,3 and 4, described pipeline structure comprises:
Described the first tubular portion; And
The second tubular portion, described the second tubular portion covers described the first tubular portion,
Wherein, described the second tubular portion is made by organic material.
6. according to the pipeline structure of the described cooling device of any one in claim 1,2,3,4 and 5, described pipeline structure further comprises:
The first connecting portion, described the first connecting portion is connected to the evaporimeter of storage cold-producing medium; And
The second connecting portion, described the second connecting portion is connected to condenser, and the cold-producing medium of the steam-like that described condenser will evaporate in described evaporimeter carries out condensation and liquefaction radiant heat.
7. a cooling device, described cooling device comprises:
Evaporimeter, described evaporimeter storage cold-producing medium;
Condenser, the condensation of refrigerant of the steam-like that described condenser will evaporate in described evaporimeter and liquefaction radiant heat; And
Pipe, described pipe is connected to described condenser by described evaporimeter,
Wherein, described pipe comprises the pipeline structure according to the described cooling device of any one in claim 1,2,3,4,5 and 6.
8. cooling device according to claim 7, wherein,
Described evaporimeter comprises that being connected to first of described pipe connects protuberance;
Described condenser comprises that being connected to second of described pipe connects protuberance; And
At least one material identical by the metal material with making described the first tubular portion that described the first connection protuberance is connected in protuberance with described second is made.
9. the method for the manufacture of the pipeline structure of cooling device, described method comprises the steps:
Rolling process is applied to form to the metal material of hollow space, the cold-producing medium used in cooling device flows through described hollow space;
Form the plate-shape metal plate material by described rolling process, the surface roughness of described plate-shape metal plate material is less than or equal to the size of the nucleus of condensation of described cold-producing medium; And
By described metallic sheet material be bent into the pipe and by two engaged at end.
10. the method for the pipeline structure for the manufacture of cooling device according to claim 9, described method further comprises: after described engaging process, carry out annealing process.
11. the method for the pipeline structure for the manufacture of cooling device according to claim 9, described method further comprises:
Form the first tubular portion of being made by metal material by described engaging process; And
Cover the periphery of described the first tubular portion by spraying organic material, and form the second tubular portion of being made by described organic material.
12. the method for tube connector, described method comprises the steps:
In connecting protuberance, assembling comprises the pipe of the first tubular portion, described the first tubular portion has, hollow space that by metal material made that flow through for the cold-producing medium in cooling device, and the surface roughness of the inner surface of described the first tubular portion is less than or equal to the size of the nucleus of condensation of cold-producing medium;
From described pipe, circumferential central authorities exert pressure; And
Make to form the metal material distortion of described the first tubular portion by described pressure, and described metal material is attached to described connection protuberance securely.
13. the method for tube connector according to claim 12, wherein, described the first tubular portion forms by annealing process.
14. the method for tube connector according to claim 12, wherein, described pipe comprises the second tubular portion, and described the second tubular portion is made by organic material, and covers described the first tubular portion; And
Described pressure circumferential central authorities from described the second tubular portion apply.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011089347 | 2011-04-13 | ||
| JP2011-089347 | 2011-04-13 | ||
| PCT/JP2012/060197 WO2012141320A1 (en) | 2011-04-13 | 2012-04-10 | Piping structure of cooling device, manufacturing method thereof, and pipe coupling method. |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103459969A true CN103459969A (en) | 2013-12-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012800177405A Pending CN103459969A (en) | 2011-04-13 | 2012-04-10 | Piping structure of cooling device, manufacturing method thereof, and pipe coupling method |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20140027100A1 (en) |
| EP (1) | EP2698590B1 (en) |
| JP (1) | JP6156142B2 (en) |
| CN (1) | CN103459969A (en) |
| WO (1) | WO2012141320A1 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012242009A (en) * | 2011-05-20 | 2012-12-10 | Nec Corp | Connection pipe, method of manufacturing the same, and cooling device using the same |
| JP6269478B2 (en) * | 2012-03-22 | 2018-01-31 | 日本電気株式会社 | Electronic substrate cooling structure and electronic device using the same |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP6156142B2 (en) | 2017-07-05 |
| EP2698590B1 (en) | 2016-11-30 |
| EP2698590A4 (en) | 2014-11-19 |
| US20140027100A1 (en) | 2014-01-30 |
| WO2012141320A1 (en) | 2012-10-18 |
| JPWO2012141320A1 (en) | 2014-07-28 |
| EP2698590A1 (en) | 2014-02-19 |
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