US20130335898A1 - Systems and methods for applying protective coatings to internal surfaces of fully assembled electronic devices - Google Patents

Systems and methods for applying protective coatings to internal surfaces of fully assembled electronic devices Download PDF

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Publication number
US20130335898A1
US20130335898A1 US13/920,836 US201313920836A US2013335898A1 US 20130335898 A1 US20130335898 A1 US 20130335898A1 US 201313920836 A US201313920836 A US 201313920836A US 2013335898 A1 US2013335898 A1 US 2013335898A1
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United States
Prior art keywords
electronic device
protective coating
coating
components
housing
Prior art date
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Abandoned
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US13/920,836
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English (en)
Inventor
Blake Stevens
Max Sorenson
Paul S. Clayson
Scott B. Gordon
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HZO Inc
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HZO Inc
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Priority to US13/920,836 priority Critical patent/US20130335898A1/en
Assigned to HZO, INC. reassignment HZO, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SORENSON, MAX, STEVENS, BLAKE, CLAYSON, PAUL S., GORDON, SCOTT B.
Publication of US20130335898A1 publication Critical patent/US20130335898A1/en
Priority to US14/178,112 priority patent/US9596794B2/en
Assigned to PACIFIC WESTERN BANK (AS SUCCESSOR IN INTEREST BY MERGER TO SQUARE 1 BANK) reassignment PACIFIC WESTERN BANK (AS SUCCESSOR IN INTEREST BY MERGER TO SQUARE 1 BANK) SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HZO, INC.
Assigned to CATHAY BANK reassignment CATHAY BANK SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HZO, INC.
Assigned to HZO, INC. reassignment HZO, INC. RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS). Assignors: PACIFIC WESTERN BANK
Assigned to CATHAY BANK reassignment CATHAY BANK SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HZO, INC.
Assigned to CATHAY BANK reassignment CATHAY BANK SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HZO HONG KONG LIMITED, HZO, INC.
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • H05K13/0046—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1322—Encapsulation comprising more than one layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333—Deposition techniques, e.g. coating
    • H05K2203/1338—Chemical vapour deposition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333—Deposition techniques, e.g. coating
    • H05K2203/1344—Spraying small metal particles or droplets of molten metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333—Deposition techniques, e.g. coating
    • H05K2203/1366—Spraying coating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49716—Converting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device

Definitions

  • This disclosure relates generally to systems and methods in which protective coatings are applied to surfaces of the interior components of electronic devices, including portable consumer electronic devices that have been fully assembled, or are in a consumer-ready, or “aftermarket,” form. More particularly, aspects of this disclosure relate to systems and methods for forming protective coatings, such as moisture resistant coatings, on interior surfaces and components of electronic devices that have been fully assembled by introducing a protective coating material into the interiors of the electronic devices or accessing the interiors of the electronic devices (e.g., by disassembly the electronic devices, etc.), introducing material of the protective coating onto surfaces that are or will be located within interiors of the electronic devices and, optionally, reassembling the electronic devices.
  • protective coatings such as moisture resistant coatings
  • mobile phones have become important equipment in the lives of an office worker, particularly with the advent of so-called smart phones which allow a person to not only make and receive phone calls, but also to view and create calendar events, receive emails, view and edit documents, and the like.
  • smart phones which allow a person to not only make and receive phone calls, but also to view and create calendar events, receive emails, view and edit documents, and the like.
  • Mobile phones and other portable devices are also used outside of an office setting and it is estimated that nearly 475 million smart phones were produced in 2011, and by the end of 2015 that number is expected to double and approach one billion per year.
  • the electronic device may be exposed to water from rain or other environmental conditions, or the device may accidentally be dropped into a puddle, sink, toilet, or other location where water is present.
  • the removable covers often do not offer full protection against water. As a result, when the electronic device is exposed to water, the water can leak into the device and damage electronic components within the electronic device.
  • Exposure of interior electronic components of an electronic device to water or other moisture can also void the warranty of an electronic device. If the warranty is voided and the moisture causes the electronic device to malfunction, the user may have little choice but to expend significant sums to repair or replace the electronic device. As moisture exposure can void the warranty, manufacturers of such devices may have little incentive to provide significant protection against moisture to interior components.
  • a protective material may be applied only to interior surfaces of the electronic device to apply, or form, the protective coating.
  • the protective material may be applied to both interior and externally exposed surfaces of the electronic device.
  • the protective material may be applied to a previously fully assembled electronic device as part of a so-called “aftermarket” process.
  • protective material may simply be introduced into the interior of an electronic device (e.g., through a port, through another opening, etc.).
  • At least a portion of a body, housing, covering or shroud that defines an exterior of the electronic device and, optionally, encapsulates, contains or otherwise carries one or more components within an interior of the electronic device may be at least partially removed to expose the components, or at least portions thereof, and protective material may be applied to at least some of the newly (and temporarily) exposed interior surfaces of the electronic device.
  • the interior may be closed (e.g., by reassembly of the body, housing, covering or shroud; by covering or plugging any openings that have been formed; etc.).
  • the term “housing” and its variants, as used herein, refer to any of the features that form part or all of the exterior of an electronic device.
  • the application of protective material to an electronic device may comprise part of a method for refurbishing and/or remanufacturing electronic devices, including portable consumer electronic devices and, thus, may be performed by a system for refurbishing and remanufacturing electronic devices.
  • the protective materials applied to surfaces of an electronic device may impart at least a portion of the electronic device with moisture resistance.
  • the term “protective coating” includes moisture resistant coatings or films, as well as other coatings or films that protect various parts of an electronic assembly from moisture and/or other external influences. While the term “moisture resistant coating” is used throughout this disclosure, in many, if not all, circumstances, a moisture resistant coating may comprise or be substituted with a protective coating that protects coated components and/or features from other external influences. The term “moisture resistant” refers to the ability of a coating to prevent exposure of a coated element or feature to moisture.
  • a moisture resistant coating may resist wetting or penetration by one or more types of moisture, or it may be impermeable or substantially impermeable to one or more types of moisture.
  • a moisture resistant coating may repel one or more types of moisture.
  • a moisture resistant coating may be impermeable to, substantially impermeable to or repel water, an aqueous solution (e.g., salt solutions, acidic solutions, basic solutions, drinks, etc.) or vapors of water or other aqueous materials (e.g., humidity, fogs, mists, etc.), wetness, etc.).
  • an aqueous solution e.g., salt solutions, acidic solutions, basic solutions, drinks, etc.
  • vapors of water or other aqueous materials e.g., humidity, fogs, mists, etc.
  • moisture resistant may also refer to the ability of a coating to restrict permeation of or repel organic liquids or vapors (e.g., organic solvents, other organic materials in liquid or vapor form, etc.), as well as a variety of other substances or conditions that might pose a threat to an electronic device or its components.
  • organic liquids or vapors e.g., organic solvents, other organic materials in liquid or vapor form, etc.
  • Protective coatings may be non-selectively applied to, or formed on, surfaces of an electronic device (e.g., “blanket coated” onto all surfaces that are exposed to a protective material), or the protective coating may be applied to, or formed on, selected portions of one or more surfaces of the electronic device that are exposed to the protective material.
  • Protective material may be applied to, and protective coatings may be applied to, or formed on, one or more surfaces of an electronic device using any of a variety of different types of equipment.
  • a protective material may be applied to one or more surfaces of an electronic device using chemical vapor deposition (CVD), plasma-based deposition processes (including, but not limited to, plasma enhanced CVD (PECVD) processes), physical vapor deposition (PVD) or physical application (e.g., by spraying, rolling, printing, etc.) of the protective material.
  • CVD chemical vapor deposition
  • PECVD plasma enhanced CVD
  • PVD physical vapor deposition
  • physical application e.g., by spraying, rolling, printing, etc.
  • Selective application of protective material to an electronic device may include placing a mask or coating release element on one or more portions of the exposed surfaces of the electronic device.
  • a coating release element e.g., a material that prevents adhesion of a mask material or protective coating to a surface that has been coated with the material, or coating release element; etc.
  • a mask may be placed on one or more surfaces (e.g., a port, an electrical contact, a lens, a speaker, a microphone, a peripheral surface, etc.).
  • the coating may be applied to the mask rather than to the surface beneath the mask.
  • the mask and any portion of the protective coating thereon may then be removed to expose the underlying surface of the electronic device.
  • the underlying surface may be exposed to enable electrical contact or communication during reassembly and/or use of the electronic device.
  • one or more portions of a protective coating may be selectively removed from one or more features of the electronic device by suitable means. Such means for removing a portion of the protective coating may ablate, dissolve, vaporize, mechanically remove or otherwise take protective material away from each selected region of the protective coating.
  • the act of removal may comprise at least partial disassembly of the electronic device.
  • Disassembly of an electronic device may occur in a variety of different ways, and may vary from one type of electronic device to the next.
  • one or more portions of a housing may be disassembled or separated from one or more other portions of the housing to expose at least a portion of an interior of the electronic device.
  • a protective coating may be applied to interior surfaces of one or more portions of the housing and/or to features or surfaces within the interior of the electronic device.
  • disassembly of an electronic device may include removal or separation of components other than or in addition to the housing, including separation of a power supply (e.g., a battery, etc.), a circuit board, a semiconductor device (e.g., a processor, a memory device, etc.), or another component from a remainder of the electronic device.
  • a protective coating may be applied to the remainder of the electronic device assembly, to one or more of the components that have been removed from the electronic device (e.g., collectively, or to any or all components in isolation, etc.) or to any suitable combination of components.
  • the housing of an electronic device may be configured for selective separation from one or more other portions of the housing or from a remainder of the electronic device, or the housing may not include any feature that provides ready access to an interior of the electronic device (e.g., the entire housing may permanently house other components of the electronic device, etc.).
  • the housing of an electronic device is not configured for ready removal and does not include any features that provide ready access to the interior of an electronic device, it may be difficult to access the interior of the electronic device or to separate the electronic device into multiple components.
  • Access locations in the housing may provide access to desired locations (e.g., features, components, surfaces, etc.) within the interior of an electronic device and, in some embodiments, access locations may correspond to locations within the electronic device through which various features or components can be removed, masked, or treated (e.g., to prevent adhesion of a protective coating, to enable removal of a mask material and/or protective material, etc.). In some embodiments, access locations may correspond to locations where a protective material will be or has been introduced into the electronic device, and from which the protective material may access and, thus, be applied to one or more surfaces, features or components inside of the electronic device. After use of an access location is complete, a plug, cap or cover may be formed or assembled with the electronic device to close each access location and, thus, to limit the exposure of surfaces, features or components within the electronic device to an environment outside of the electronic device.
  • desired locations e.g., features, components, surfaces, etc.
  • access locations may correspond to locations within the electronic device through which various features or components can be removed,
  • components of a disassembled electronic device may, prior to application of a protective coating, lack water-resistant or other protective features.
  • a disassembled electronic device may include one or more mechanical seals (e.g., O-rings, gaskets, etc.) that are configured to prevent moisture from entering into the housing of the electronic device.
  • the disassembled components may include a protective material which is the same as or different from (e.g., in material, texture, purpose, or other characteristics) the protective coating applied using the methods and systems of this disclosure.
  • a protective coating of some sort is in place upon at least some surfaces of an electronic device prior to application of a protective coating in accordance with teachings of this disclosure (e.g., prior to accessing at least a portion of the electronic device, etc.)
  • subsequent application of a protective coating in accordance with teachings of this disclosure may produce a discernible boundary or seam between adjacent protective coatings, with the subsequently applied, aftermarket protective coating be located at the same elevation as the original protective coating, at a more outward elevation than the original protective coating or, in some embodiments, at least partially superimposed over the original protective coating.
  • Such a system may include components of a production line (e.g., a manufacturing line, an assembly line, etc.) in which processes or elements thereof are performed manually or are automated, or a system may be configured to perform a combination of manual and automated actions.
  • a production line e.g., a manufacturing line, an assembly line, etc.
  • An example of such a system may include an access element for providing access to at least a portion of an interior of an electronic device (e.g., dissembling the electronic device, opening the electronic device, etc.).
  • the disassembly element may be configured to separate one or more portions of a housing from one or more other portions of a housing, or from other components of the electronic device (e.g., a remainder of the electronic device, etc.), to cut into the housing, to remove or provide access to one or more features or components within an interior of the electronic device, or to perform any combination of these actions.
  • a coating element of the system may apply a protective coating.
  • a sealing element may limit access to the interior of the electronic device (e.g., by reassembling the electronic device or otherwise closing it, etc.) to enable resumed operation and use of the electronic device.
  • Embodiments of a coating application system may also include a selectivity element.
  • the selectivity element may apply a coating release element and/or a mask to selected portions (e.g., features, components, etc.) of an electronic device or an electronic device assembly, etc.) to prevent or inhibit a protective coating from being applied to, or to enable the ready removal of a protective coating from, one or more surfaces of the electronic device.
  • the selectivity element may be located upstream from the coating element. Additionally, an optional material removal element may be located downstream from the coating element to optionally remove a mask and/or one or more portions of a protective coating.
  • FIG. 1 illustrates an embodiment of an electronic device
  • FIG. 2 illustrates the electronic device of FIG. 1 following its disassembly into front and rear portions
  • FIG. 3A is a schematic representation of a front portion of the disassembled electronic device of FIG. 2 ;
  • FIG. 3B is a schematic representation of the front portion of the disassembled electronic device of FIGS. 2 and 3A , with a protective coating applied to the front portion;
  • FIG. 4 illustrates the front portion of the disassembled portable electronic device of FIG. 2 , with elements of a mask applied thereto;
  • FIG. 5A is a schematic cross-sectional representation of the front portion of the disassembled portable electronic device of FIG. 4 , with a mask and a protective coating applied thereto;
  • FIG. 5B is a schematic cross-sectional representation of the front portion of the disassembled portable electronic device of FIG. 5A , with masking elements removed therefrom;
  • FIG. 6 is a rear view of the electronic device of FIG. 1 ;
  • FIG. 7 illustrates the electronic device of FIG. 6 with holes formed through a housing of the electronic device to expose interior features or components of the electronic device;
  • FIG. 8 illustrates the electronic device of FIGS. 6 and 7 , with masking elements applied to interior features or components
  • FIG. 9 illustrates the electronic device of FIGS. 6-8 and includes covers for the openings through the housing of the electronic device.
  • FIG. 10 is a schematic representation of an embodiment of a system for applying protective coatings to electronic devices.
  • a system for applying protective coatings to electronic devices may include one or more coating elements. Each coating element of such a system is configured to apply a protective coating to surfaces of one or more internal features or components of an electronic device.
  • the protective coating may be configured to prevent electrical shorting and/or corrosion of one or more features or components of the electronic device.
  • protective coatings may be referred to herein as being “water-resistant” or providing “water resistance,” the protective coatings disclosed hereby are not limited to coatings that provide protection against moisture and/or its effects (e.g., electrical shorting, corrosion, etc.).
  • the electronic device When an electronic device is fully assembled, the electronic device may be susceptible to penetration by moisture.
  • the material from which a housing of the electronic device is made may be porous or otherwise allow moisture to penetrate it if it is exposed to moisture for a sufficient period of time.
  • different segments of a housing or shell may mate or connect together.
  • a seam may exist at the junction between different components, and the seam may be susceptible to penetration by water or another fluid.
  • a covering or coating material may be applied to the exterior of the electronic device to resist or prevent penetration of water through the housing material or seams therein.
  • the protective coating can be applied to individual features, components or subassemblies prior to their assembly or reassembly with other parts of the electronic device. In other embodiments, however, the coating may be applied collectively or individually to multiple elements or components of a previously assembled electronic device.
  • FIG. 1 depicts an embodiment of an electronic device 100 that may have a protective covering applied thereto.
  • the illustrated electronic device may include a housing 102 .
  • the housing 102 can be configured to secure (e.g., encase, enclose, carry, etc.) and/or protect one or more interior components (not shown).
  • interior components may include processors, storage media, transceivers, power supplies, circuitry, antennas, audio transducers (e.g., speakers, microphones, etc.), and other components that generally enable the electronic device 100 to operate in a desired manner.
  • the electronic device 100 may display text or visual (e.g., pictorial or video) information to a user. The information may be presented on a display 104 .
  • a user interface 106 is included to allow a user to interact with the electronic device 100 .
  • the user interface 106 may be accessible through the housing 102 (e.g., formed in the housing 102 , embedded in the housing 102 , otherwise be secured to the housing 102 , etc.).
  • the display 104 may also include user interface features.
  • the display 104 may comprise a touch screen using pressure, capacitive, or other input features to enable a user to select one or more options or otherwise provide an input.
  • the depicted electronic device 100 is generally illustrative of a number of different types of electronic devices that may have protective materials and coatings applied thereto.
  • the electronic device 100 may represent any electronic device that may be intentionally or accidentally placed in an environment where it may be exposed to moisture.
  • the electronic device 100 may be portable or relatively non-portable. Examples of portable electronic devices include, but are not limited to, smart phones, hand-held multimedia devices (or “digital media players”), so-called “slate” or “tablet” computers, e-readers, inventory scanners or the like. Examples of smart phones may include, but are certainly not limited to, the IPHONE® devices available from Apple, Inc. and the GALAXYTM devices available from Samsung Electronics Co., Ltd.
  • multimedia devices include the IPOD® and IPOD TOUCH® devices available from Apple, Inc. and any number of additional devices from various manufacturers and having different capabilities.
  • IPAD® products available from Apple, Inc.
  • XOOMTM tablet computer available from Motorola Mobility, Inc.
  • the BLACKBERRY PLAYBOOKTM available from Research in Motion Limited
  • STREAKTM available from Dell Inc.
  • HP TOUCHPADTM available from Hewlett-Packard Co.
  • GALAXY TABTM available from Samsung Electronics Co., Ltd.
  • the KINDLE® devices available from Amazon Technologies, Inc. and the NOOKTM devices available from Barnes & Noble, Inc. are examples of e-readers.
  • a protective coating may also be applied to any of a wide variety of other types of electronic devices, such as laptop computers, desktop computers, monitors, televisions, optical disk players, storage devices, garage door openers, remote keyless entry systems (e.g., automotive keys, etc.) or any other electronic devices intended for general or specific uses.
  • electronic devices such as laptop computers, desktop computers, monitors, televisions, optical disk players, storage devices, garage door openers, remote keyless entry systems (e.g., automotive keys, etc.) or any other electronic devices intended for general or specific uses.
  • the electronic device 100 may be protected by one or more protective coatings. Example methods for protecting the electronic device 100 are described in additional detail with respect to the figures following FIG. 1 .
  • the housing 102 of the electronic device 100 may generally carry and/or protect one or more components or features of the electronic device 100 , including, without limitation, one or more components or features that are inside the electronic device 100 .
  • the coated components or features may generally enable operation of the electronic device 100 .
  • the housing 102 may generally be constructed to protect the sensitive internal features or components of the electronic device 100 from damage by physical impact or exposure to water, dust or other elements or contaminants.
  • the housing 102 may provide some level of protection against the elements and contaminants by preventing exposure of the internal features or components to the elements or contaminants that might otherwise damage, disable or interfere with the operation of the internal features or components. While the housing 102 may provide some protection, it may not be configured to entirely prevent the elements or contaminants from contacting the internal features or components of the electronic device 100 .
  • the housing 102 may include one or more ports (e.g., ports to connect audio devices, power supplies, communication elements, etc.) that provide passageways from the exterior of the electronic device 100 to its interior.
  • Boundaries or interfaces between two or more assembled parts may also provide potential paths through which the elements or contaminants from outside of the electronic device 100 may reach its interior. Regardless of the potential paths by which the elements or contaminants can enter the housing 102 and, thus, reach features or components within the electronic device 100 , some of the internal features or components could potentially be damaged, disabled or have their operation interfered with if the exposure is significant enough.
  • FIG. 2 illustrates an embodiment in which parts or pieces of the housing 102 , including a front portion 102 a and a rear portion 102 b , have been separated from one another. Disassembly of the housing 102 may be performed in any suitable manner.
  • the electronic device 100 may be designed to allow a user to easily separate the front and rear portions 102 a , 102 b of the housing 102 .
  • the rear portion 102 b may be removable and selectively and removably secured to the front portion 102 a using snap fit or frictional fit components, latches, screws, or other suitable means for securing.
  • the rear portion 102 b of the housing 102 may not be configured for removal from another assembled part or piece of the housing 102 a .
  • one or more means for securing e.g., rivets, welds, etc.
  • the means for securing may be overcome by cutting, drilling, or the like, enabling adjacent parts or pieces of the housing 102 (e.g., the front and rear portions 102 a and 102 b , etc.) to be separated from one another.
  • a power supply 108 such as a battery, may be seen.
  • the power supply 108 may include contacts that touch one or more corresponding contacts 110 of the electronic device 100 , which are generally located within the housing 102 .
  • the power supply 108 and contacts 110 are merely illustrative of different internal features and components within the housing 102 of an electronic device 100 .
  • Additional components may include circuits and circuit boards, wiring, processors, storage media and devices, communication busses, speakers, microphones, and any number of additional devices or components. Some or all of such components may be susceptible to damage or malfunction if exposed to certain conditions, such as the elements, moisture or contaminants.
  • FIG. 3A is a schematic, cross-sectional representation of the front portion 102 a of the electronic device 100 shown in FIG. 2 .
  • an internal component 116 is illustrated as being located within an outer periphery 114 defined by the front portion 102 a , and may be fully encased when the rear portion 102 b (see FIG. 2 ) of the housing 102 of the electronic device 100 is attached to the front portion 102 a .
  • the internal component 116 may correspond generally to any individual internal components of the electronic device 100 , including internal components that are at least partially carried by the front portion 102 a of the housing 102 , and may also represent all internal components collectively within the front portion 102 a of the housing 102 or even all internal components of the electronic device 100 .
  • the internal component(s) 116 and, optionally, all or any portion (e.g., the internal surface(s), etc.) of the front portion 102 a of the housing 102 of the electronic device 100 may be coated with a protective material.
  • the protective material may take any number of different forms; in one embodiment it comprises a protective coating to protect the internal component 116 from exposure to moisture.
  • FIG. 3B illustrates an embodiment in which a protective coating 118 is applied to (e.g., deposited or otherwise placed on) the internal component 116 .
  • the protective coating 118 may also be applied to portions of the housing 102 , including up to, and potentially extending beyond, the outer periphery 114 of the front portion 102 a of the housing 102 , or a boundary between an outer surface and an inner surface of the front portion 102 a.
  • the protective coating 118 may comprise any of, or any combination of, a variety of embodiments of coatings.
  • the protective coating 118 may comprise a water-resistant material.
  • the protective coating 118 may be formed with a reactive monomer that reacts with other monomers or reactive groups at an end of a polymer chain to form polymers.
  • the protective coating 118 may include poly(p-xylylene) (i.e., Parylene), including unsubstituted and/or substituted units (or -mers).
  • the protective coating 118 may comprise a film having a sufficient thickness to provide a desired level of moisture resistance.
  • the protective coating 118 may have a minimum thickness or an average thickness of at least one micrometer, or micron ( ⁇ m) (e.g., about 4 ⁇ m, about 5 ⁇ m, about 7 ⁇ m, about 8 ⁇ m, etc.).
  • a protective coating limits exposure of a coated feature or component to moisture may be quantified in any number of different manners, and using a variety of different metrics. For example, the ability of a protective coating to physically inhibit water from contacting a coated feature or component may be considered to impart the coating with water resistance. In other embodiments, the water resistance of a protective coating may be based on more quantifiable data. As an illustration, water resistance may be measured as the rate at which water permeates through the material of the protective coating, or using a water vapor transfer rate (WVTR). In the case of a water vapor transfer rate, the rate may be measured using any suitable technique.
  • WVTR water vapor transfer rate
  • Such a measurement may measure water in units of g/m 2 /day or in units of g/100 in 2 /day (e.g., less than 2 g/100 in 2 /day, about 1.5 g/100 in 2 /day or less, about 1 g/100 in 2 /day or less, about 0.5 g/100 in 2 /day or less, about 0.25 g/100 in 2 /day or less, about 0.15 g/100 in 2 /day or less, etc., through a film at a temperature of 37° and at a relative humidity of 90%).
  • the protective coating 118 may comprise a hydrophobic, or water repellant, material.
  • a material may comprise a fluorinated organic polymer.
  • a specific but nonlimiting embodiment of such a material is 1H,1H,2H,2H-Heptadecafluorodecyl acrylate.
  • the hydrophobicity, or water repellence, of a protective coating 118 may be determined through use of a water contact angle when water is applied to a surface of the coating by an acceptable technique (e.g., the static sessile drop method, the dynamic sessile drop method, the dynamic Wilhelmy method, the single-fiber Wilhelmy method, the powder contact angle method, etc.).
  • the hydrophobicity of the surface may be measured by determining the angle the base of a water droplet makes with the surface, from beneath a base of the water droplet.
  • the Young equation may be used. The Young equation may be stated as:
  • ⁇ c arccos ⁇ ⁇ r A ⁇ cos ⁇ ⁇ ⁇ A + r R ⁇ cos ⁇ ⁇ ⁇ R r A + r R ,
  • ⁇ A is the highest, or advancing, contact angle and ⁇ R is the lowest, or receding, contact angle.
  • ⁇ R is the lowest, or receding, contact angle.
  • a surface that has an affinity for water, or which absorbs water is generally known as a “hydrophilic” surface. If the surface is hydrophilic, the water will spread somewhat, forming a water contact angle of less than 90° with the surface. In contrast, a hydrophobic surface, which, for purposes of this disclosure, may be considered to be moisture-resistant, will prevent or restrict the water or other liquid from spreading, resulting in a water contact angle of 90° or greater. In general, the more the water beads on a surface, the greater the water contact angle and the greater the hydrophobicity. When water droplets bead on a surface such that the water contact angle with the surface is about 120° or more, the surface may be considered to be highly hydrophobic.
  • a protective coating e.g., a protective coating formed in accordance with teachings of this disclosure, etc.
  • a protective coating 118 may be formed include, but are not limited to, thermoplastic materials, curable materials (e.g., radiation-curable materials, two-part materials, thermoset materials, room temperature curable materials, etc.).
  • curable materials e.g., radiation-curable materials, two-part materials, thermoset materials, room temperature curable materials, etc.
  • the material used for a protective coating 118 may be applied in numerous manners, examples of which are described by U.S. Patent Application Publication Nos. 2009/0263581, 2009/0263641 and 2011/0262740, the entire disclosures of each of which are, by this reference, incorporated herein.
  • Some non-limiting examples of equipment that may be used to apply a protective coating 118 include molecular diffusion equipment, chemical vapor deposition (CVD) equipment, physical vapor deposition (PVD) equipment (e.g., devices that employ evaporation deposition processes (including, but not limited to e-beam evaporation), sputtering, laser ablation, pulsed laser deposition, etc.) and physical application apparatuses (e.g., printing equipment, spray-on equipment, roll-on equipment, brush-on apparatuses, etc.).
  • CVD chemical vapor deposition
  • PVD physical vapor deposition
  • equipment e.g., devices that employ evaporation deposition processes (including, but not limited to e-beam evaporation), sputtering, laser ablation, pulsed laser deposition, etc.
  • physical application apparatuses e.g., printing equipment, spray-on equipment, roll-on equipment, brush-on apparatuses, etc.
  • other types of equipment may be used to apply
  • a single material or multiple materials may be used to form the protective coating 118 .
  • different types of protective coatings 118 may be used together to provide desired types of protection to a coated feature or component.
  • a protective coating 118 may be configured to provide a moisture impermeable coating, while another protective coating 118 material may be moisture-repellant, and yet another protective coating 118 comprises an anti-static coating and another protective coating 118 may provide an adhesive function.
  • Other types of protective coatings 118 may also be used.
  • a protective coating 118 may include two or more sublayers that provide different types of protection.
  • protective coatings 118 may be applied to different features or components (e.g., moisture repellant protective coatings 118 may cover features that might not function as intended if coated with a moisture impermeable protective coating 118 , while less sensitive features may carry relatively robust moisture impermeable protective coatings 118 , etc.).
  • moisture repellant protective coatings 118 may cover features that might not function as intended if coated with a moisture impermeable protective coating 118 , while less sensitive features may carry relatively robust moisture impermeable protective coatings 118 , etc.
  • a protective coating 118 may cover all or substantially all the interior surfaces of an electronic device 100 ( FIGS. 1 and 2 ) (e.g., a portion enclosed in a front portion 102 a of the housing 102 (FIG. 1 )), without covering exterior surfaces of the electronic device 100 or its housing 102 . It should be appreciated that the embodiment illustrated by FIG. 3B is not limiting. In some embodiments, the protective coating 118 may be applied to at least some surfaces, features or components that are exposed to an exterior of the electronic device.
  • a protective coating 118 may be applied to, or may reside on, fewer than all of the interior surfaces of an electronic device 100 ; i.e., some surfaces within the interior of the electronic device 100 may be exposed through apertures in the protective coating 118 and/or laterally beyond an outer periphery of the protective coating.
  • FIG. 4 illustrates an embodiment of a technique for restricting the application of a protective coating 118 ( FIG. 3B ) to one or more selected areas, features or components of an electronic device 100 ( FIGS. 1 and 2 ).
  • Such selectivity may be achieved by way of one or more masks 120 - 124 or coating release elements, which may be applied to areas, features and/or components that are not to be covered by a protective film 118 .
  • mask 120 - 124 or coating release element may be used (e.g., a preformed mask configured for assembly with a substrate; a mask formed on a substrate; a coating release material, such as a non-stick material, an oil, a grease or the like; etc.).
  • the masks 120 - 124 or other coating release element may comprise (a) material(s) that can be secured (e.g., adhered, etc.) to a surface that is to remain exposed through or laterally beyond a protective coating 118 ( FIG. 3B ), while withstanding the processes by which the materials from which such a protective coating 118 is formed.
  • the masks 120 - 124 may be configured to prevent the application of a protective coating 118 to locations covered by the masks 120 - 124 or coating release agents (e.g., they may be formed from a material that prevents application of a protective coating 118 to the masks 120 - 124 , they may have a surface configured to prevent application of a protective coating thereto, etc.).
  • coating release agents e.g., they may be formed from a material that prevents application of a protective coating 118 to the masks 120 - 124 , they may have a surface configured to prevent application of a protective coating thereto, etc.
  • portions of a protective coating 118 may be applied to the masks 120 - 124 or coating release agents, but the masks 120 - 124 or coating release agents may be configured to facilitate or enable the removal of any portions of the protective coating 118 thereover (e.g., by so-called “lift-off” techniques; by defining areas where adhesion of the protective coating 118 to a portion of the electronic device 100 is reduced, and delineating one or more boundaries at which the protective coating 118 may be cut or otherwise disrupted to enable removal of one or more portions that overlie a mask 120 - 124 or coating release element; etc.).
  • lift-off by so-called “lift-off” techniques; by defining areas where adhesion of the protective coating 118 to a portion of the electronic device 100 is reduced, and delineating one or more boundaries at which the protective coating 118 may be cut or otherwise disrupted to enable removal of one or more portions that overlie a mask 120 - 124 or coating release element; etc.
  • a mask 120 - 124 may be formed from a material that may be removed (e.g., chemically, thermally, etc.) with selectivity over a material of the protective coating 118 .
  • the mask 120 - 124 may be configured to remain in place after a protective coating 118 is applied to an electronic device 100 (e.g., it may comprise a conductive material, solder flux, a material than facilitates electrical coupling to the masked feature, etc.).
  • a first mask element 120 is positioned around the perimeter or outer periphery 114 ( FIGS. 2-3B ) of the front portion 102 a of a housing 102 ( FIG. 1 ), and extends outward to cover the exterior of the front portion 102 a .
  • the mask 120 or coating release agent may be configured to prevent application of a protective coating 118 ( FIG. 3B ) to the exterior surface of the front portion 102 a , and to prevent the material(s) from which the protective coating 118 is formed from blocking ports or other access features of the electronic device 100 ( FIGS. 1 and 2 ).
  • a second mask 122 is shown at a location adjacent to an end of a power supply 108 , such as a removable, rechargeable battery, where the masking element 122 may shield one or more contacts 110 ( FIG. 2 ) through which the power supply 108 electrically couples to the electronic device 100 ( FIGS. 1 and 2 ).
  • a power supply 108 such as a removable, rechargeable battery
  • the subassembly illustrated by FIG. 4 includes a third mask 124 that resides over a camera lens and/or flash element (i.e., a source of bright light), 112 FIG. 2 .
  • a camera lens and/or flash element i.e., a source of bright light
  • the masks 120 - 124 are merely illustrative; masks or coating release elements may be applied to any number of different locations or to different types of features or components of a substrate, such as an electronic device 100 ( FIGS. 1 and 2 ).
  • a few examples of locations where masks or coating release agents may be applied include audio transducers, or input/output devices, electrical contacts, moving parts (or at least portions thereof), optical components, and the like.
  • FIG. 5A illustrates an embodiment of a masking process in additional detail.
  • FIG. 5A is a schematic representation of the front portion 102 a ( FIG. 4 ) of the housing 102 ( FIG. 1 ), and includes an internal component 116 at least partially enclosed within the housing 102 or secured to the housing 102 .
  • the internal component 116 may comprise a single feature or component that is substantially confined within the housing 102 when the electronic device 100 is in an assembled state, or the internal component 116 may collectively represent multiple internal components of the electronic device 100 .
  • two masks 126 , 128 may be applied to portions of the internal component 116 and/or the front portion 102 a of the housing 102 ( FIG. 1 ).
  • a first mask 126 is applied to a surface (or to multiple surfaces) of the internal component 116 while a second mask 128 is applied to a portion of the outer periphery 114 of the front portion 102 a .
  • the protective coating 118 is applied to the illustrated portion of the electronic device 100 ( FIGS.
  • the protective coating 118 resides on (e.g., adheres to, etc.) the outer surfaces of the masks 126 and 128 or coating release elements rather than to surfaces that are covered by the interior surfaces of the masks 126 and 128 or coating release elements. Thereafter, the masks 126 and 128 or coating release elements may optionally be removed. As shown in FIG. 5B , the removed masks or coating release elements may enable a surface 130 of the internal component 116 , as well as one or more surfaces 132 of the outer periphery 114 of the front portion 102 a of the housing 102 ( FIG. 1 ) to lack a protective coating; i.e., to be exposed through an aperture of a protective coating 118 or laterally beyond a protective coating 118 .
  • a protective coating 118 may provide protection to features and/or components of an electronic device 100 ( FIGS. 1 and 2 ).
  • the electronic device 100 may be reassembled or otherwise be substantially returned to the state in which it was originally provided to a consumer (e.g., by plugging holes, re-engaging coupling features, etc.).
  • Reassembly of an electronic device 100 may include, for instance, reassembling front and rear portions 102 a and 102 b (see FIG. 2 ), respectively, of a housing 102 ( FIG. 1 ).
  • the electronic device 100 shown in FIGS. 2-5B includes a housing 102 that may be readily disassembled into component sections, such as front and rear portions 102 a and 102 b . It should be appreciated, however, that not all electronic devices are configured for ready disassembly. For instance, specialized equipment or tooling may be required to disassemble an electronic device. In other embodiments, a housing may not be configured for disassembly (e.g., single-use devices, electronic devices provided under exclusive or restrictive service contracts, etc.)
  • FIGS. 6-9 illustrate an embodiment of a method for accessing the interior of an electronic device 100 and applying one or more protective coatings to internal components of the electronic device 100 .
  • the method represented by FIGS. 6-9 may be useful with electronic devices 100 that have housings 102 that are difficult to disassemble or that are not configured for disassembly.
  • FIG. 6 provides a rear view of an electronic device 100 .
  • the electronic device 100 may have ports, user interfaces, seams and/or other features through which moisture, dust, other contaminants or other potentially damaging elements may enter into the interior components of the electronic device 100 and, thus, make the electronic device 100 susceptible to damage.
  • the electronic device may include a camera lens 112
  • the housing 102 of the electronic device may include an aperture that accommodates the camera lens and a seam may exist at the interface between the camera lens 112 and the electronic device 100 . If the electronic device 100 is exposed to moisture, dust, other contaminants or other potentially damaging elements, the seam between the camera lens 112 and the housing 102 may allow water to enter into the interior of the housing 102 and, thus, into the interior of the electronic device 100 .
  • access to the interior of the electronic device 100 may be provided by removing a portion of the housing 102 .
  • the configuration of the electronic device e.g., the locations of features or components within its interior, etc.
  • a protective material may be introduced into the interior of the electronic device.
  • FIG. 6 for instance, an electronic device 100 with two access locations 134 and 136 is illustrated. Using a cutting, drilling, milling, or other suitable material removal operation, portions of the housing 102 at one or more access locations 134 , 136 may be removed to expose an interior of the electronic device 100 .
  • FIG. 7 illustrates the electronic device 100 once portions of the housing 102 at one or more access locations 134 , 136 have been removed.
  • access location 134 may expose or otherwise provide access to one or more components, such as electrical contacts 110 .
  • Another access location 136 may expose or otherwise provide access to a different component, such as a camera 112 .
  • the number of access locations 134 , 136 may correspond, of course, to the different components that may be accessed.
  • pre-application processing may include the removal of contaminants from the electronic device 100 or, as depicted by FIG. 8 , processes that enable a protective coating to be selectively applied to features or components of the electronic device 100 (e.g., masking processes, in which masks 138 , 140 are placed or formed on features or components that are to ultimately remain uncoated; application of coating release elements to features or components that are not to be covered with a protective coating; etc.).
  • masking processes in which masks 138 , 140 are placed or formed on features or components that are to ultimately remain uncoated; application of coating release elements to features or components that are not to be covered with a protective coating; etc.
  • all or part of an exterior of the housing 102 of an electronic device 100 may be masked or otherwise treated to prevent a protective coating from being formed or remaining thereon.
  • a protective material may be introduced into the housing 102 or a protective coating may otherwise be applied to one or more features or components within the housing 102 .
  • post-application processing of the electronic device 100 may include removal of each mask 138 , 140 and any protective coating thereon.
  • removal of an area of protective coating that resides over a mask may comprise cutting (e.g., at or around the periphery of the mask 138 , 140 , etc.) or a similar process (e.g., scoring, perforating, focused material removal, etc.), along with lifting the protective coating and, if a mask 138 , 140 was used, lifting the mask 138 , 140 from the feature or component that it covered.
  • a portion of a protective coating and, in some embodiments, a mask 138 , 140 beneath that portion of the protective coating may be removed by directed mechanical material removal processes (e.g., use of abrasives, polishing, etc.), directed chemical material removal processes (e.g., etching, dissolution, etc.), directed radiation material removal processes (e.g., lasers, etc.) or the like.
  • directed mechanical material removal processes e.g., use of abrasives, polishing, etc.
  • directed chemical material removal processes e.g., etching, dissolution, etc.
  • directed radiation material removal processes e.g., lasers, etc.
  • a plug 142 , 144 which may be formed to fit within an access location 134 , 136 , may be assembled with the housing at its corresponding access location 134 , 136 .
  • the plug 142 , 144 may be secured in place using any suitable mechanism, including, without limitation, a frictional or interference fit, an adhesive, a bonding process (e.g., chemical bonding, thermal bonding, laser welding, use of a cement, etc.), and the like.
  • a moisture-tight seal may be formed between each plug 142 , 144 and the housing 102 .
  • a plug 142 , 144 may be configured to maintain or substantially maintain an original appearance of the electronic device 100 .
  • a plug 142 , 144 may comprise a transparent element (e.g., a window, an optical element (e.g., a lens, etc.), or the like).
  • one or more access locations 134 , 136 may be used to apply a mask or coating release element to one or more features or components within the electronic device 100 and, thus, prevent a protective material that enters the interior of the electronic device 100 from coating the masked features or components.
  • one or more access locations 134 , 136 may be used to prevent the application of a protective film to features or components within the interior of the electronic device 100
  • one or more other access locations 134 , 136 may be used to introduce a protective material or a protective coating into the interior of the electronic device 100 .
  • Embodiments of the present disclosure may thus relate to methods in which a previously fully assembled electronic device, including an electronic device that has been purchased by a consumer, or an aftermarket electronic device, is at least partially disassembled to enable a protective coating to be applied to one or more features or components within an interior of the electronic device 100 .
  • FIG. 10 depicts an embodiment of a coating application system 200 that may be configured to apply protective coatings to features or components within the interiors of aftermarket electronic devices.
  • the coating application system 200 may include a conveyor 202 that transports an electronic device 100 to be protected.
  • a conveyor is an optional part of the coating application system 200 , and need not be included.
  • the conveyor 202 may transport the electronic device through any or all of a set of elements 204 - 218 of the coating application system 200 .
  • the conveyor 202 may comprise part of a production line, or it may include elements that enable it to carry one or more electronic devices 100 away from a production line to off-line elements.
  • elements of the coating application system 200 may be online, while other elements (e.g., a coating element, etc.) may be off-line.
  • the conveyor 202 may transport electronic devices 100 between on-line components, or even from an online component to an offline component and/or from an offline component to an online component.
  • the conveyor 202 may include a number of components for transporting individual electronic devices 100 or groups of electronic devices 100 to and from various components of the coating application system 200 .
  • the illustrated embodiment of conveyor 202 is configured to sequentially pass one or more electronic devices 100 through multiple elements 204 - 218 of the coating application system 200
  • the conveyor 202 may provide multiple routing options, including, without limitation, the ability to cause one or more electronic devices 100 to bypass an element 204 - 218 of the coating application system 200 , the ability to return one or more electronic devices 100 to an element 204 - 218 , or any of a variety of other functions that relate to the routing of electronic devices 100 into, through or out of the coating application system 200 .
  • the conveyor 202 may be configured to transport one or more electronic devices 100 that are to be protected to or through an inspection or identification element 204 and/or to a disassembly element 206 .
  • the inspection or identification element 204 may be used to evaluate an electronic device 100 , and to determine whether or not the electronic device 100 is in working condition or is otherwise suited for processing by the coating application system 200 .
  • the inspection or identification element 204 may detect which electronic device(s) 100 is (are) to be protected, ensure that each electronic device 100 is properly oriented and/or perform any of a variety of other functions.
  • Identification of the electronic device 100 e.g., an electronic device 100 of a particular type, an indicator, or indicia, (e.g., text, a bar code, a quick response (QR code, a radio-frequency identification (RFID) tag, etc.) that has been associated with the electronic device 100 to dictate the type of processing to which the electronic device 100 is to be subjected, etc.) may be used to determine how the coating application system 200 will operate.
  • QR code quick response
  • RFID radio-frequency identification
  • a processing element may be programmed to correlate information about the identity of a particular electronic device 100 to a specific process protocol, or program, which may control or otherwise cause various elements of the coating application system 200 to operate in a manner that will route, process and apply one or more protective coatings to the electronic device 100 in a predetermined, or programmed, manner.
  • the inspection and identification element 204 may provide identifying information that corresponds to a particular electronic device 100 or group of electronic devices 100 to processing equipment located downstream from the coating application system 200 , or even to processing equipment upstream of the coating application system (e.g., for feedback control of electronic devices 100 that are to be subsequently processed in the same manner; to provide the processing equipment with additional data on which feedback controls may be based, or “teach” the processing equipment; etc.). If an electronic device 100 fails inspection or cannot be identified by the inspection and identification element 204 , the electronic device 100 may optionally be removed from the coating application system 200 .
  • the conveyor 202 may transport an electronic device 100 from the inspection and identification element 204 , if any, to the disassembly element 206 .
  • each electronic device 100 handled by the coating application system 200 is at least partially disassembled; i.e., at least a portion of an interior of each electronic device 100 is exposed. Disassembly may occur as disclosed herein. In some embodiments, disassembly may include removing some or all of the electrical components from a remainder of the electronic device 100 or a subassembly of the electronic device 100 .
  • a power supply e.g., a battery etc.
  • a circuit board e.g., a circuit board, a memory or storage device, an audio component (e.g., a speaker, a microphone, etc.), an optical component, or the like may be wholly or partially removed from the electronic device 100 during disassembly.
  • disassembly may occur with detachable and selectively removable components. In other embodiments, disassembly may occur using components intended to remain semi-permanently or permanently connected (e.g., when restricted from disassembly using conventional mechanisms, etc.).
  • Information from the inspection and identification element 204 may be used to determine the manner in which an electronic device 100 is disassembled, as well as the extent of disassembly, by the disassembly element 206 (e.g., by providing an individual with disassembly instructions, by identifying a program for automated disassembly of the electronic device 100 , etc.).
  • a disassembled electronic device 100 may be transported (e.g., using the conveyor 202 , etc.) to a masking element 208 of the coating application system 200 .
  • Use of the masking element 208 may be optional and, in some embodiments, whether or not it is used and the manner in which it is used may be based on the identity or other information associated with the disassembled electronic device 100 , which may, in some embodiments, be obtained with an inspection and identification element 204 .
  • the masking element 208 may be used to apply masks or coating release elements to one or more features or components of the disassembled electronic device 100 (e.g., contact pads, terminals, audio interfaces (e.g., speakers, microphones, etc.), etc.).
  • Masks or coating release elements applied by the masking element 208 may be configured to prevent or inhibit adherence of a protective coating to surfaces, features or components on which the masks or coating release elements reside.
  • a coating application system 200 may include one or more surface treatment elements 210 .
  • a surface treatment element 210 may be configured to prepare a surface of an electronic device 100 for application of a protective coating.
  • a surface treatment element 210 may be configured to enhance adhesion of a protective coating to at least a portion of the electronic device 100 .
  • a surface treatment element 210 may be configured to modify a surface (e.g., by defining a texture, by defining one or more surface features, etc.) of the electronic device 100 , at least a portion of the surface, or some or all of a surface of a protective coating on one or more features or components of the electronic device 100 .
  • Modification of a surface may impart the surface with at least one desired characteristic (e.g., a texture that will enhance adhesion of a protective coating to the modified surface; smoothness that will minimize adhesion of a mask or protective coating to the modified surface; moisture repellency, as provided by so-called “lotus leaf” structures; etc.).
  • a surface treatment element 210 may clean one or more surfaces of an electronic device 100 before or after a protective coating has been applied to at least portions of the electronic device 100 .
  • the coating application system 200 includes one or more coating elements 212 .
  • Each coating element 212 may be configured to receive and apply protective coatings to a plurality of substrates (e.g., electronic devices, etc.) (e.g., tens of units, hundreds of units, etc.) at a time.
  • all of the coating elements 212 may be configured to apply the same type of protective coatings in the same manner as one another, or different coating elements 212 may be configured to apply different types of protective coatings and/or to apply protective coatings in a different manner from one another.
  • the coating element 212 is configured to apply a protective coating to one or more exposed surfaces of an electronic device 100 , or to disassembled components that are to be reassembled with the electronic device 100 , and that will ultimately be located at least partially within an interior of, or even internally confined within, the housing of the electronic device 100 once it is reassembled.
  • the coating element 212 may be configured to form reactive species (e.g., monomers, etc.) and to initiate polymerization and deposition of a protective coating onto exposed portions of the electronic device 100 .
  • the coating element 212 may deposit or otherwise apply a protective coating in the form of a film within a relatively short period of time, but having a sufficient density and/or thickness to provide a desired level of moisture resistance (e.g., impermeability, repellency, etc.).
  • the coating element 212 may deposit or otherwise form a film (e.g., a Parylene film, etc.) at a rate (minimum, average, etc.) of at least one micron per hour, per half hour, per quarter hour, per ten minutes, per five minutes, per two minutes, or even less.
  • a film e.g., a Parylene film, etc.
  • a rate minimum, average, etc.
  • coating elements 212 are described in U.S. patent application Ser. Nos. 12/104,080, 12/104,152, 12/988,103, 12/446,999, 12/669,074 and 12/740,119. More particular examples of coating elements 212 may include, without limitation, molecular diffusion equipment, CVD equipment, PVD equipment, physical application apparatuses, or other apparatus or combinations of any of the foregoing.
  • a coating application system 200 may include at least one coating inspection element 214 located downstream from the coating element 212 .
  • Each coating inspection element 214 may enable an analysis of the presence of a protective coating, the thickness of the protective coating, the surfaces on which the protective coating resides, the quality of the protective coating, or any other useful information about a protective coating that has been applied by a coating element 212 to an electronic device 100 .
  • Information from a coating inspection element 214 may be used to provide feedback control over a coating element 212 of the coating application system 200 .
  • a coating application system 200 may include a material removal element 216 .
  • the material removal element 216 may be configured to selectively remove material from one or more regions of a protective coating. Such material removal may be effected by any suitable means, without detrimentally affecting underlying or adjacent portions of the electronic device 100 under from which the material is removed.
  • the material removal element 216 may be configured to ablate, vaporize or sublimate the material of a water-resistant coating (e.g., with a properly placed, pulsed or continuous laser beam, etc.).
  • the material removal element 216 may selectively apply a solvent (e.g., by inkjet processes, screen printing, etc.) that will selectively remove a material of a protective coating on an electronic device 100 .
  • the material removal element 216 may be configured to mechanically remove material from one or more selected regions of a protective coating (e.g., by cutting, ablation, abrading, etc.).
  • the material removal element 216 may operate as a de-masking element to remove all or some masking components applied by the masking element 208 .
  • the coating application system 200 may also include a reassembly element 218 , which may be configured to reassemble an electronic device 100 ; i.e., to reduce or eliminate exposure of features or components within an interior of the electronic device 100 .
  • the operation of the reassembly element 218 may substantially reverse the processes or actions performed by the disassembly element 206 .
  • the reassembly element 218 may be configured to reassemble two or more components, including portions of a housing, internal components (e.g., in a manner known in the art, etc.), and the like, and secure the reassembled components to one another.
  • the reassembly element 218 may be configured to plug or cap one or more openings formed in a housing or body of the electronic device 100 .
  • the coating application system 200 may be fully or partially automated.
  • the coating application system 200 may include a controller 220 that may control operation of the conveyor 202 , any of the elements 204 - 218 or any combination of the conveyer 202 and elements 204 - 218 .
  • the controller 220 may be configured to manage throughput, route electronic devices 100 to suitable elements (or to components within elements 204 - 218 ), and the like.
  • the controller 220 may also be used to communicate information between elements 204 - 218 , such as information regarding the type of electronic device 100 being processed for suitable disassembly, inspection, cleaning, masking, coating, reassembly, and the like.
  • each substrate may be tested to confirm that it functions as intended.
  • the protected electronic device 100 may be tested in any suitable manner to confirm that the electronic device 100 was not damaged by any of the processes performed by the coating application system 200 .
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Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8773271B1 (en) 2013-01-08 2014-07-08 Hzo, Inc. Apparatuses, systems, and methods for detecting and reacting to exposure of an electronic device to moisture
US20150050961A1 (en) * 2013-08-19 2015-02-19 Mbit Wireless, Inc. Method and apparatus for an add-on communication device
WO2015192146A1 (en) * 2014-06-13 2015-12-17 Hzo, Inc. Impermeable protective coatings through which electrical connections may be established and electronic devices including the impermeable protective coatings
US20160113136A1 (en) * 2014-10-21 2016-04-21 Samsung Electronics Co., Ltd. Case in which electrical parts are accommodated and electronic device having the same
USD754625S1 (en) * 2014-06-06 2016-04-26 Hzo, Inc. Mobile telephone
USD756324S1 (en) * 2014-06-06 2016-05-17 Hzo, Inc. Mobile telephone
US9403236B2 (en) 2013-01-08 2016-08-02 Hzo, Inc. Removal of selected portions of protective coatings from substrates
US9559514B2 (en) 2012-01-10 2017-01-31 Hzo, Inc. Methods, apparatuses and systems for monitoring for exposure of electronic devices to moisture and reacting to exposure of electronic devices to moisture
US9563244B2 (en) 2013-01-08 2017-02-07 Hzo, Inc. Apparatuses, systems, and methods for reducing power to ports of electronic devices
US9590433B2 (en) * 2013-10-09 2017-03-07 Zte Corporation Terminal and electronic water-resistance method
US9596794B2 (en) 2012-06-18 2017-03-14 Hzo, Inc. Methods for applying protective coatings to internal surfaces of fully assembled electronic devices
US9627194B2 (en) 2012-01-10 2017-04-18 Hzo, Inc. Methods for masking and applying protective coatings to electronic assemblies
US20170171445A1 (en) * 2015-12-10 2017-06-15 Le Holdings (Beijing) Co., Ltd. Brightness compensation method and electronic device for front-facing camera, and mobile terminal
US9894776B2 (en) 2013-01-08 2018-02-13 Hzo, Inc. System for refurbishing or remanufacturing an electronic device
US20180062310A1 (en) * 2016-08-25 2018-03-01 Japan Aviation Electronics Industry, Limited Connector assembly
DE102017217244A1 (de) * 2017-09-27 2019-03-28 Robert Bosch Gmbh Elektronikanordnung
US10359812B2 (en) * 2017-12-12 2019-07-23 Motorola Mobility Llc Device component exposure protection
US10449568B2 (en) 2013-01-08 2019-10-22 Hzo, Inc. Masking substrates for application of protective coatings
US10541529B2 (en) 2012-01-10 2020-01-21 Hzo, Inc. Methods, apparatuses and systems for sensing exposure of electronic devices to moisture
EP3706521A1 (en) * 2019-03-08 2020-09-09 Picosun Oy Solder mask
US20200310001A1 (en) * 2019-03-25 2020-10-01 Applied Materials, Inc. Non-line-of-sight deposition of coating on internal components of assembled device

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8687351B2 (en) 2011-03-31 2014-04-01 Patientsafe Solutions, Inc. Scanning jacket for a handheld device
USD717304S1 (en) * 2012-03-26 2014-11-11 Patientsafe Solutions, Inc. Scanning jacket for a handheld device
USD719166S1 (en) * 2014-08-22 2014-12-09 Patientsafe Solutions, Inc. Scanning jacket for a handheld phone device
USD719167S1 (en) * 2014-08-22 2014-12-09 Patientsafe Solutions, Inc. Scanning jacket for a handheld personal digital assistant (PDA) device
USD761261S1 (en) * 2015-06-09 2016-07-12 Teco Image Systems Co., Ltd Handheld scanner
US10887371B2 (en) 2015-09-14 2021-01-05 Google Llc Systems and methods for content storage and retrieval
US10893604B1 (en) 2020-03-03 2021-01-12 Goodrich Corporation Potted printed circuit board module and methods thereof
CN113645747A (zh) * 2020-04-27 2021-11-12 北京小米移动软件有限公司 线路板导通部防护方法、点胶设备及线路板

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5176312A (en) * 1991-08-12 1993-01-05 Brian Lowenthal Selective flow soldering apparatus
US5240746A (en) * 1991-02-25 1993-08-31 Delco Electronics Corporation System for performing related operations on workpieces
US6447847B1 (en) * 1997-01-16 2002-09-10 Precision Valve & Automation, Inc. Conformal coating using multiple applicators
US7681778B2 (en) * 2007-11-20 2010-03-23 Caterpillar Inc. Electronic assembly remanufacturing system and method

Family Cites Families (76)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3661641A (en) 1969-08-29 1972-05-09 Michael Walter Vigh Method of removing polyurethane resin protective coating
US4059708A (en) 1976-07-30 1977-11-22 Bell Telephone Laboratories, Incorporated Method for selective encapsulation
US4254174A (en) 1979-03-29 1981-03-03 Massachusetts Institute Of Technology Supported membrane composite structure and its method of manufacture
US4255469A (en) * 1979-07-02 1981-03-10 Hughes Aircraft Company Process for selectively applying a conformal coating with a masking tape having an imbedded wire cutting edge
US4300184A (en) * 1979-07-11 1981-11-10 Johnson Controls, Inc. Conformal coating for electrical circuit assemblies
US4234357A (en) 1979-07-16 1980-11-18 Trw Inc. Process for manufacturing emitters by diffusion from polysilicon
JPS60144993A (ja) * 1984-01-09 1985-07-31 沖電気工業株式会社 樹脂コ−テイングにおけるマスキング方法
US4784310A (en) 1986-03-24 1988-11-15 General Motors Corporation Method for screen printing solder paste onto a substrate with device premounted thereon
JPS62248228A (ja) * 1986-04-21 1987-10-29 Nec Corp 混成集積回路の製造方法
US4814943A (en) 1986-06-04 1989-03-21 Oki Electric Industry Co., Ltd. Printed circuit devices using thermoplastic resin cover plate
IT1199795B (it) 1986-12-17 1988-12-30 Ausimont Spa Processo per il consolidamento di materiali a struttura discontinua
JP2863171B2 (ja) 1988-07-08 1999-03-03 名古屋油化株式会社 マスキング材
US5102712A (en) 1990-02-13 1992-04-07 Conductive Containers, Inc. Process for conformal coating of printed circuit boards
US5246730A (en) 1990-02-13 1993-09-21 Conductive Containers, Inc. Process for conformal coating of printed circuit boards
US5009311A (en) * 1990-06-11 1991-04-23 Schenk Robert J Removable rigid support structure for circuit cards
JPH04279089A (ja) 1990-09-04 1992-10-05 Dow Corning Corp 加工中の電子デバイスのマスキング方法及び該方法用の紫外線硬化性マスカント
US5188669A (en) 1991-02-22 1993-02-23 Nordson Corporation Circuit board coating apparatus with inverting pallet shuttle
US5271953A (en) * 1991-02-25 1993-12-21 Delco Electronics Corporation System for performing work on workpieces
US5166864A (en) * 1991-05-17 1992-11-24 Hughes Aircraft Company Protected circuit card assembly and process
CH684479A5 (de) 1992-06-30 1994-09-30 Cerberus Ag Schutzüberzug für elektronische Baugruppen auf einer Leiterplatte, sowie Verfahren zu dessen Herstellung.
US5518964A (en) 1994-07-07 1996-05-21 Tessera, Inc. Microelectronic mounting with multiple lead deformation and bonding
US5587207A (en) * 1994-11-14 1996-12-24 Gorokhovsky; Vladimir I. Arc assisted CVD coating and sintering method
US5888308A (en) 1997-02-28 1999-03-30 International Business Machines Corporation Process for removing residue from screening masks with alkaline solution
US6138349A (en) 1997-12-18 2000-10-31 Vlt Corporation Protective coating for an electronic device
US6956963B2 (en) 1998-07-08 2005-10-18 Ismeca Europe Semiconductor Sa Imaging for a machine-vision system
US7353954B1 (en) 1998-07-08 2008-04-08 Charles A. Lemaire Tray flipper and method for parts inspection
US6280821B1 (en) 1998-09-10 2001-08-28 Ppg Industries Ohio, Inc. Reusable mask and method for coating substrate
US6980647B1 (en) 1999-01-12 2005-12-27 Teccor Electronics, Lp Primary telephone line protector with failsafe
ATE348498T1 (de) 2000-10-02 2007-01-15 Siemens Ag Dichtungsmittel gegen eine vergussmasse
JP2002204081A (ja) * 2000-12-27 2002-07-19 Seiko Instruments Inc 携帯電子機器
US20020187350A1 (en) 2001-01-29 2002-12-12 Honeywell International Inc. Robust highly reflective optical construction
US6697217B1 (en) 2001-11-30 2004-02-24 Western Digital Technologies, Inc. Disk drive comprising a coating bonded to a printed circuit board assembly
US7148148B2 (en) 2001-12-06 2006-12-12 Seiko Epson Corporation Mask forming and removing method, and semiconductor device, an electric circuit, a display module, a color filter and an emissive device manufactured by the same method
US8002948B2 (en) 2002-04-24 2011-08-23 Sipix Imaging, Inc. Process for forming a patterned thin film structure on a substrate
AU2003228977A1 (en) 2002-05-07 2003-11-11 University Of Southern California Method of and apparatus for forming three-dimensional structures integral with semiconductor based circuitry
JP4260450B2 (ja) 2002-09-20 2009-04-30 東京エレクトロン株式会社 真空処理装置における静電チャックの製造方法
US20040056039A1 (en) 2002-09-23 2004-03-25 Sarajian Tigran K. Deformable pull plug
JP4766831B2 (ja) * 2002-11-26 2011-09-07 株式会社村田製作所 電子部品の製造方法
US20050081354A1 (en) 2003-10-16 2005-04-21 Hydrill, Inc. Method and apparatus for rivet removal and in-situ rehabilitation of large metal structures
JP2005260106A (ja) * 2004-03-15 2005-09-22 Jfe Steel Kk プリント基板のコーティング方法
US7160427B2 (en) 2004-07-19 2007-01-09 Pratt & Whitney Canada Corp. In situ plating of electrical connector contacts
US20070157457A1 (en) 2004-09-10 2007-07-12 Lance Fried Assembly Method and Machinery for Waterproof Testing of Electronic Devices
JP2006107088A (ja) * 2004-10-05 2006-04-20 Takeshi Yamate ノート型パーソナル・コンピュータおよびノート型パーソナル・コンピュータの再生方法
US7273767B2 (en) 2004-12-31 2007-09-25 Carsem (M) Sdn. Bhd. Method of manufacturing a cavity package
US7109055B2 (en) 2005-01-20 2006-09-19 Freescale Semiconductor, Inc. Methods and apparatus having wafer level chip scale package for sensing elements
US20060199408A1 (en) 2005-03-04 2006-09-07 Hoisington Mark A Modular electrical connection unit and method of forming an electrical connector
CA2622023A1 (en) 2005-10-14 2007-04-26 Advanced Plastics Technologies Luxembourg S.A. Methods of forming multilayer articles by surface treatment applications
US20070095368A1 (en) * 2005-10-27 2007-05-03 Honeywell International Inc. Methods of removing a conformal coating, related processes, and articles
US7652892B2 (en) * 2006-03-03 2010-01-26 Kingston Technology Corporation Waterproof USB drives and method of making
US20070246820A1 (en) 2006-04-19 2007-10-25 Tessera, Inc. Die protection process
US7632698B2 (en) 2006-05-16 2009-12-15 Freescale Semiconductor, Inc. Integrated circuit encapsulation and method therefor
GB0621520D0 (en) 2006-10-28 2006-12-06 P2I Ltd Novel products
US20080147158A1 (en) 2006-12-18 2008-06-19 Quan Emerteq Corp. Implantable Medical Lead Having Coil Electrode
WO2009010741A1 (en) 2007-07-17 2009-01-22 P2I Ltd. Method for liquid proofing an item by plasma graft polymerisation
US20090263641A1 (en) 2008-04-16 2009-10-22 Northeast Maritime Institute, Inc. Method and apparatus to coat objects with parylene
US20090263581A1 (en) * 2008-04-16 2009-10-22 Northeast Maritime Institute, Inc. Method and apparatus to coat objects with parylene and boron nitride
GB0721202D0 (en) 2007-10-30 2007-12-05 P2I Ltd Novel method
JP2009272529A (ja) 2008-05-09 2009-11-19 Ngk Spark Plug Co Ltd 半田ボール搭載装置及び配線基板の製造方法
US8882983B2 (en) 2008-06-10 2014-11-11 The Research Foundation For The State University Of New York Embedded thin films
ATE540568T1 (de) * 2009-02-03 2012-01-15 Ismeca Semiconductor Holding Verfahren und vorrichtung zum füllen von trägerbändern mit elektronischen bauteilen
US8184440B2 (en) 2009-05-01 2012-05-22 Abl Ip Holding Llc Electronic apparatus having an encapsulating layer within and outside of a molded frame overlying a connection arrangement on a circuit board
WO2011046770A1 (en) 2009-10-14 2011-04-21 Lockheed Martin Corporation Serviceable conformal em shield
US8955515B2 (en) 2009-10-23 2015-02-17 3M Innovative Properties Company Patterned chemical sensor having inert occluding layer
BE1019159A5 (nl) 2010-01-22 2012-04-03 Europlasma Nv Werkwijze voor de afzetting van een gelijkmatige nanocoating door middel van een lage druk plasma proces.
US8642119B2 (en) 2010-09-22 2014-02-04 Stmicroelectronics Pte Ltd. Method and system for shielding semiconductor devices from light
US8492892B2 (en) 2010-12-08 2013-07-23 International Business Machines Corporation Solder bump connections
US9166126B2 (en) 2011-01-31 2015-10-20 Cree, Inc. Conformally coated light emitting devices and methods for providing the same
US8544781B2 (en) 2011-03-03 2013-10-01 Dongguan Futai Electronic Co., Ltd. Power shredder with individually removable components structure
US8852693B2 (en) * 2011-05-19 2014-10-07 Liquipel Ip Llc Coated electronic devices and associated methods
WO2013106442A1 (en) 2012-01-10 2013-07-18 Hzo, Inc. Masks for use in applying protective coatings to electronic assemblies, masked electronic assemblies and associated methods
JP2013143563A (ja) 2012-01-10 2013-07-22 Hzo Inc 内部耐水性被覆を備える電子デバイスを組み立てるためのシステム
US20130286567A1 (en) 2012-01-10 2013-10-31 Hzo, Inc. Apparatuses, systems and methods for protecting electronic device assemblies
JP5693515B2 (ja) 2012-01-10 2015-04-01 エイチズィーオー・インコーポレーテッド 内部耐水性被覆を備える電子デバイス
WO2013142858A1 (en) 2012-03-23 2013-09-26 Hzo, Inc. Apparatuses, systems and methods for applying protective coatings to electronic device assemblies
WO2013192222A2 (en) 2012-06-18 2013-12-27 Hzo, Inc. Systems and methods for applying protective coatings to internal surfaces of fully assembled electronic devices
CN104245157B (zh) 2013-01-08 2018-09-18 Hzo股份有限公司 从基底上除去保护性涂层的选定部分

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5240746A (en) * 1991-02-25 1993-08-31 Delco Electronics Corporation System for performing related operations on workpieces
US5176312A (en) * 1991-08-12 1993-01-05 Brian Lowenthal Selective flow soldering apparatus
US6447847B1 (en) * 1997-01-16 2002-09-10 Precision Valve & Automation, Inc. Conformal coating using multiple applicators
US7681778B2 (en) * 2007-11-20 2010-03-23 Caterpillar Inc. Electronic assembly remanufacturing system and method

Cited By (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10541529B2 (en) 2012-01-10 2020-01-21 Hzo, Inc. Methods, apparatuses and systems for sensing exposure of electronic devices to moisture
US9627194B2 (en) 2012-01-10 2017-04-18 Hzo, Inc. Methods for masking and applying protective coatings to electronic assemblies
US9559514B2 (en) 2012-01-10 2017-01-31 Hzo, Inc. Methods, apparatuses and systems for monitoring for exposure of electronic devices to moisture and reacting to exposure of electronic devices to moisture
US9596794B2 (en) 2012-06-18 2017-03-14 Hzo, Inc. Methods for applying protective coatings to internal surfaces of fully assembled electronic devices
US10744529B2 (en) 2013-01-08 2020-08-18 Hzo, Inc. Materials for masking substrates and associated methods
US9157880B2 (en) 2013-01-08 2015-10-13 Hzo, Inc. Apparatuses, systems, and methods for detecting and reacting to exposure of an electronic device to moisture
US10449568B2 (en) 2013-01-08 2019-10-22 Hzo, Inc. Masking substrates for application of protective coatings
US9894776B2 (en) 2013-01-08 2018-02-13 Hzo, Inc. System for refurbishing or remanufacturing an electronic device
US9656350B2 (en) 2013-01-08 2017-05-23 Hzo, Inc. Removal of selected portions of protective coatings from substrates
US8773271B1 (en) 2013-01-08 2014-07-08 Hzo, Inc. Apparatuses, systems, and methods for detecting and reacting to exposure of an electronic device to moisture
US9403236B2 (en) 2013-01-08 2016-08-02 Hzo, Inc. Removal of selected portions of protective coatings from substrates
US9563244B2 (en) 2013-01-08 2017-02-07 Hzo, Inc. Apparatuses, systems, and methods for reducing power to ports of electronic devices
US9369169B2 (en) * 2013-08-19 2016-06-14 Mbit Wireless, Inc. Method and apparatus for an add-on communication device
US20150050961A1 (en) * 2013-08-19 2015-02-19 Mbit Wireless, Inc. Method and apparatus for an add-on communication device
US9590433B2 (en) * 2013-10-09 2017-03-07 Zte Corporation Terminal and electronic water-resistance method
USD756324S1 (en) * 2014-06-06 2016-05-17 Hzo, Inc. Mobile telephone
USD754625S1 (en) * 2014-06-06 2016-04-26 Hzo, Inc. Mobile telephone
US20150366097A1 (en) * 2014-06-13 2015-12-17 Hzo, Inc. Impermeable protective coatings through which electrical connections may be established and electronic devices including the impermeable protective coatings
CN106664803A (zh) * 2014-06-13 2017-05-10 Hzo股份有限公司 可以穿过其建立电连接的不渗透保护涂层以及包括不渗透保护涂层的电子设备
US9848495B2 (en) * 2014-06-13 2017-12-19 Hzo, Inc. Impermeable protective coatings through which electrical connections may be established and electronic devices including the impermeable protective coatings
WO2015192146A1 (en) * 2014-06-13 2015-12-17 Hzo, Inc. Impermeable protective coatings through which electrical connections may be established and electronic devices including the impermeable protective coatings
US20160113136A1 (en) * 2014-10-21 2016-04-21 Samsung Electronics Co., Ltd. Case in which electrical parts are accommodated and electronic device having the same
US20170171445A1 (en) * 2015-12-10 2017-06-15 Le Holdings (Beijing) Co., Ltd. Brightness compensation method and electronic device for front-facing camera, and mobile terminal
US10461466B2 (en) * 2016-08-25 2019-10-29 Japan Aviation Electronics Industry, Limited Connector assembly
US20180062310A1 (en) * 2016-08-25 2018-03-01 Japan Aviation Electronics Industry, Limited Connector assembly
DE102017217244A1 (de) * 2017-09-27 2019-03-28 Robert Bosch Gmbh Elektronikanordnung
US10359812B2 (en) * 2017-12-12 2019-07-23 Motorola Mobility Llc Device component exposure protection
US10802546B2 (en) 2017-12-12 2020-10-13 Motorola Mobility Llc Device component exposure protection
EP3706521A1 (en) * 2019-03-08 2020-09-09 Picosun Oy Solder mask
US11477894B2 (en) * 2019-03-08 2022-10-18 Picosun Oy Method for formation of patterned solder mask
US20200310001A1 (en) * 2019-03-25 2020-10-01 Applied Materials, Inc. Non-line-of-sight deposition of coating on internal components of assembled device
US11933942B2 (en) * 2019-03-25 2024-03-19 Applied Materials, Inc. Non-line-of-sight deposition of coating on internal components of assembled device

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US9596794B2 (en) 2017-03-14
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WO2013192222A3 (en) 2014-02-13
JP2016076254A (ja) 2016-05-12
KR20150020574A (ko) 2015-02-26
CN104364020A (zh) 2015-02-18
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