US20130273292A1 - Transfer film for attaching protection film to flat panel display and method for manufacturing the flat panel display using the same - Google Patents

Transfer film for attaching protection film to flat panel display and method for manufacturing the flat panel display using the same Download PDF

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Publication number
US20130273292A1
US20130273292A1 US13/718,857 US201213718857A US2013273292A1 US 20130273292 A1 US20130273292 A1 US 20130273292A1 US 201213718857 A US201213718857 A US 201213718857A US 2013273292 A1 US2013273292 A1 US 2013273292A1
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United States
Prior art keywords
film
base
transfer
protection
flexible
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
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US13/718,857
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English (en)
Inventor
Jongmoo Kim
Chanwoo LEE
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Display Co Ltd
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LG Display Co Ltd
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Application filed by LG Display Co Ltd filed Critical LG Display Co Ltd
Assigned to LG DISPLAY CO., LTD. reassignment LG DISPLAY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KIM, JONGMOO, LEE, CHANWOO
Publication of US20130273292A1 publication Critical patent/US20130273292A1/en
Priority to US14/609,150 priority Critical patent/US10022946B2/en
Abandoned legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
    • B32B37/025—Transfer laminating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/30—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/18—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1306—Details
    • G02F1/1309—Repairing; Testing
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1313—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells specially adapted for a particular application
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/14—Layer or component removable to expose adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2848—Three or more layers

Definitions

  • the present disclosure relates to a transfer film for attaching protection film to flat panel display and method for manufacturing the flat panel display using the same. Especially, the present disclosure relates to a transfer film having protection films temporarily to prevent an organic light emitting diode display device (OLED) from moisture and a method for manufacturing the OLED using the same.
  • OLED organic light emitting diode display device
  • the flat panel display devices include the liquid crystal display device (or LCD), the field emission display (or FED), the plasma display panel (or PDP) and the electroluminescence display device (or ED).
  • the electroluminescence display device is categorized in the inorganic light emitting diode display device and the organic light emitting diode display device according to the luminescence material.
  • the electroluminescence display device has the merits those the response speed is very fast, the brightness is very high and the view angle is large.
  • FIG. 1 illustrates the structure of the organic light emitting diode according to the related art.
  • the organic light emitting diode comprises the organic light emitting material layer, and the cathode and the anode which are facing each other with the organic light emitting material layer therebetween.
  • the organic light emitting material layer comprises the hole injection layer HIL, the hole transport layer HTL, the emission layer EML, the electron transport layer ETL and the electron injection layer EIL.
  • the organic light emitting diode radiates the lights due to the energy from the excition formed at the excitation state in which the hole and the electron are recombined at the emission layer EML.
  • the organic light emitting display device represents the video data by controlling the light brightness from the emission layer EML of the organic light emitting diode.
  • the organic light emitting diode display (or OLED) using the organic light emitting diode can be categorized in the passive matrix type organic light emitting diode display (or PMOLED) and the active matrix type organic light emitting diode display (or AMOLED). Furthermore, according to the direction of the emitted light, it can be categorized in the top emission type and the bottom emission type.
  • the organic light emitting diode display By representing any video/image in the natural color, the organic light emitting diode display is currently coming into the lime light, and widely applied in various field including the portable personal information devices such as cellular phone, smart phone or PDAs.
  • the OLED is the self luminescence display having the high responding speed less than lms and the low power consumption, for representing natural full color images/videos. Furthermore, it has wide view angle covering near 180 degree, and it is best device for display regardless of diagonal size. Its manufacturing method is very simple, based on the low temperature process and the conventional semiconductor processing technologies.
  • the OLED is very weak from oxygen and moisture.
  • the glass substrate having a getter is used for encapsulation of the organic light emitting material.
  • the glass substrate may be exchanged by film type encapsulation as the protecting film for the OLED panel.
  • FIGS. 2A and 2B are perspective views illustrating the processes for attaching the protection film to the organic light emitting diode display panel.
  • the protection film FF is transferred to the organic light emitting diode display panel.
  • the metal jig MM is made of rigid metal material.
  • the metal jig MM has a plurality of pattern hole HO at which each protection film FF is located.
  • a plurality of the OLED panels are arrayed in a matrix pattern, on one large mother substrate MG, each protection film FF is attached on each organic light emitting diode display panel, and then a plurality of the unit OLED displays are completed by cutting the mother substrate MG.
  • the metal jig MM is combined with the transferring substrate PT.
  • Each protection film FF is located at each pattern hole HO formed at the metal jig MM. At this time, the protection film FF is located as the adhesive surface is facing upward.
  • the adhesive may be the thermal hardening epoxy resin.
  • a mother substrate MG having a plurality of organic light emitting diode display panels OLED is located on the metal jig MM.
  • the mother substrate MG is placed on the metal jig MM.
  • the protection films FF are attached on the organic light emitting diode display panels OLED.
  • the protection films FF and the organic light emitting diode display panels OLED should be firmly closed to each other.
  • the protection films FF are permanently attached on the organic light emitting diode display panels OLED.
  • the vacuum facility is required.
  • the oven system is also required.
  • aligning the substrate with the metal jig and conducting processes in oven and vacuum chamber through a manual processes the method according to the related art is not proper to apply In-line type facility for mass production. That is, the related art cannot ensure enough yields for establishing the mass production system.
  • the protection film is attached to the organic light emitting diode display panel under vacuum condition, when the air is not perfectly out, air bubble may be formed so that the protection film may not be attached correctly.
  • the rigid large substrate should be attached to the transferring substrate having rigid structure, it is hard to completely eliminate the air bubble between them so that the final product may have defects on representing images/videos.
  • the purpose of the present disclosure is to suggest a transfer film for attaching a protection film to a flat panel display and a method for manufacturing a flat panel display using the same transfer film.
  • Another purpose of the present disclosure is to a transfer film applied to a In-Line type facility for attaching the transfer film to a flat panel display without air bubble there-between and a method for manufacturing a flat panel display using the same transfer film.
  • a transfer film comprising: a lower film; and a protection film temporarily attached on the lower film and including a base film and an adhesion layer disposed on an upper surface of the base film.
  • the protection film further includes a relief film attached on an upper surface of the adhesion layer, and further comprising an upper film including a flexible relief base facing the relief film of the protection film and a strong adhesion layer disposed on a surface of the flexible relief base configured to attach with the relief film.
  • the lower film includes: a flexible transfer base; and a weak adhesion layer disposed on a surface of the flexible transfer base configured to attach with the base film of the lower film.
  • the protection film is temporarily attached on the lower film in a manner that a plurality of unit protection films is disposed in a matrix array.
  • the each unit protection film comprises a unit upper film including: a unit flexible relief base facing the relief film of the each unit protection film; and a unit strong adhesion layer disposed on a surface of the unit flexible relief base configured to attach with the relief film.
  • the present disclosure suggests a method for manufacturing a flat panel comprising: forming a display panel; forming a transfer film including a protection film having a lower film, a base film temporarily attached on the lower film, and an adhesion layer disposed on an upper surface of the base film; attaching the transfer film on an upper surface of the display panel by adhering the protection film on the display panel; and removing the lower film of the transfer film to encapsulate the display panel by the protection film.
  • the forming the transfer film includes: preparing the lower film having a flexible transfer base and a weak adhesion layer disposed on one side of the flexible transfer base; preparing the protection film having the base film, the adhesion layer disposed on the upper surface of the base film, and a relief film disposed on the adhesion layer; preparing an upper film having a flexible relief base and a strong adhesion layer disposed on one surface of the flexible relief base; temporarily attaching the base film of the protection film on the weak adhesion layer of the lower film; adhering the strong adhesion layer of the upper film on the relief film of the protection film; selectively patterning the upper film and the protection film to have same size corresponding to the display panel; and removing the upper film to peel off the relief film of the protection film.
  • the attaching the transfer film on the upper surface of the display panel is conducted from one end side to the other end side by a roller.
  • the method further comprising: attaching a circular polarization film on the protection film; and attaching a cover film on the display panel having the circular polarization film with an optical adhesive.
  • the forming the display panel includes: depositing a sacrifice layer on a rigid substrate; depositing a flexible layer on the rigid substrate; and forming display elements on the flexible layer, and wherein the method, after attaching the cover film, further comprises: separating the flexible layer from the rigid substrate by removing the sacrifice layer; and attaching a back panel at a rear surface of the flexible layer.
  • the flat panel display can be encapsulated using a transfer film having a protection film temporarily attached on a flexible lower film.
  • a transfer film having a protection film temporarily attached on a flexible lower film.
  • the present disclosure can suggest a method for manufacturing a flat panel display in which the encapsulating property is enhanced and the display property is progressed. Further, by preparing the transfer film with low price materials, the price for manufacturing the flat panel display can be reduced and the processes can be simplified.
  • FIG. 1 illustrates the structure of the organic light emitting diode according to the related art.
  • FIGS. 2A and 2B are perspective views illustrating the processes for attaching the protection film to the organic light emitting diode display panel.
  • FIGS. 3A to 3D are cross-sectional views illustrating a method for manufacturing a transfer film configured to attach a protection film to an organic light emitting diode display panel, according to the present disclosure.
  • FIGS. 4A to 4E are cross-sectional views illustrating the method for attaching the protection film and method for manufacturing a flat panel display using the transfer film for attaching the protection film of the flat panel display according to the present disclosure.
  • FIG. 5 is a perspective view illustrating that four protection films (#1 to #4) are disposed in a matrix pattern on one large lower film.
  • FIG. 6 is a perspective view illustrating that four organic light emitting diode display panels (#1 to #4) are disposed on one large rigid mother substrate.
  • FIGS. 3A to 3D are cross-sectional views illustrating a method for manufacturing a transfer film configured to attach a protection film to an organic light emitting diode display panel, according to the present disclosure.
  • a transfer film for attaching a protection film of a flat display panel comprises a protection film FF, a lower film LF, and an upper film UF.
  • the protection film FF includes a base film BF, an adhesion layer ADH deposited on the whole surface of one side of the base film BF, and a relief film RF temporarily stick onto the adhesion layer ADH.
  • the lower film LF includes a transfer base PE 1 , and a weak adhesion layer LAH deposited on the whole surface of one side of the transfer base PE 1 .
  • the upper film UF includes, a relief base PE 2 , and a strong adhesion layer HAH deposited on the whole surface of one side of the relief base PE 2 .
  • the rear side of the base film BF of the protection film FF which does not have the adhesion layer ADH is attached with the weak adhesion layer LAH of the lower film LF.
  • the relief film RF of the protection film FF is attached to the strong adhesion layer HAH of the upper film UF.
  • the upper film UF and the protection film FF are selectively cut off.
  • the remained part of the upper film UF and the protection film FF after cutting off may be same size with the attaching area on the organic light emitting diode display panel OLED.
  • the transfer film is formed as shown in FIG. 3C .
  • the upper film UF is not yet removed from the transfer film, so that the relief film RF is still attached on the protection film FF.
  • the transfer film and the organic light emitting diode display panel are prepared respectively, until the protection film FF is attached on the display panel, the upper film UF should be attached on the transfer film to protect the adhesion layer ADH from being contaminating by ambient materials.
  • the size of each protection film FF should be same with the size of each organic light emitting diode display panel.
  • the upper film UF should be removed.
  • the relief film RF is also removed (peeled off) because it is firmly adhered to the upper film UF by the strong adhesion layer HAH. That is, the adhesive strength of the strong adhesion layer HAH should be stronger than the adhesive strength of the relief film RF on the adhesion layer ADH of the protection film FF to remove the relief film RF simultaneously when removing the upper film UF.
  • the adhesive strength of the weak adhesion layer LAH temporarily attaching the base film BF of the protection film FF to the lower film PE 1 should be stronger than the adhesive strength of the relief film RF temporarily attached to the adhesion layer ADH of the protection film FF, so that the protection film FF cannot be detached from the lower film LF by the force of removing the relief film RF.
  • the strong adhesion layer HAH should be removed with the relief film RF when the upper film PE 1 is removed, so it should have strong adhesive strength.
  • the weak adhesion layer LAH should have strong adhesive strength enough not to detach the base film BF of the protection film FF from the lower film LF when the relief film RF is removed.
  • the lower film LF should be removed after transferring the protection film FF to the organic light emitting diode display panel, so that the weak adhesion layer LAH should have weaker adhesive strength than the adhesive strength of the adhesion layer ADH after the thermal hardening process.
  • FIGS. 4A to 4E are cross-sectional views illustrating the method for attaching the protection film and method for manufacturing a flat panel display using the transfer film for attaching the protection film of the flat panel display according to the present disclosure.
  • the organic light emitting diode display panel comprises a plurality of pixel electrode arrayed in a matrix pattern on a substrate, a thin film transistor disposed at one corner of each pixel electrode for driving the pixel electrode, and an organic light emitting diode stacked on the pixel electrode.
  • a base substrate GS having enough strength is prepared.
  • the enough strength means that the base substrate GS is not bent, distorted or/and deformed to maintain the flatness so that the elements formed on the base substrate GS are not affected during the manufacturing processes including loading and unloading processes between the various facilities and the depositing process.
  • a sacrifice layer SL is deposited on the whole surface of the base substrate GS.
  • the sacrifice layer SL is a temporarily layer for dividing the element layer from the base substrate GS for completing a flexible display.
  • the sacrifice layer SL may include amorphous silicon. Radiating the laser beam to crystallizing the amorphous silicon, the base substrate GS can be removed from the element layers formed thereon.
  • a flexible layer FL used for a flexible substrate of the flexible display is deposited.
  • the flexible layer FL may include organic materials such as the polyimide.
  • a display element layer TL is formed on the flexible layer FL.
  • the display element layer TL includes a display area for representing the images/videos and a pad area extending from the display area.
  • the display element layer TL may be include a plurality of thin film transistors and pixel areas disposed in a matrix manner, and an organic light emitting diode driven by the thin film transistor at each pixel area.
  • a passivation layer PAS is deposited to protect the display element from the out-gas and moisture.
  • the display element layer TL is formed within some area of the flexible layer FL.
  • the display element layer TL is expanded to the right end side. This end portions (pad area) may include the pads and link lines extended from the display elements. Therefore, the display elements of the display element layer TL are covered by the passivation layer PAS, but the pad area is exposed.
  • a film type printed circuit board (COF) having driver ICs for driving the display elements is disposed, as shown in FIG. 4A .
  • the organic light emitting diode display panel is prepared. After further comprising a protection element and an optical element on the organic light emitting diode display panel, the final organic light emitting diode display can be completed.
  • a barrier film BF may cover the display element layer TL over the passivation layer PAS to encapsulate the display elements.
  • FIG. 4B turning over the transfer film in which the protection film FF is attached on the lower film LF as shown in FIG. 3D , the adhesion layer ADH of the protection film FF is attached on the passivation layer PAS of the organic light emitting diode display panel.
  • one end side of the protection film FF is firstly contacted one end side of the passivation layer PAS, after that using a roller ROL, the other parts of the protection film FF is completely attached by rolling and pressing to the other end side of the roller ROL.
  • the transfer film according to the present disclosure has the protection film FF temporarily attached on the flexible lower film LF, so that it is possible to attach to the organic light emitting diode display panel using the roller ROL.
  • the adhesion layer ADH permanently combines the protection film FF with the passivation layer PAS.
  • the adhesion layer ADH includes a thermal hardening adhesive material
  • the protection film FF can be firmly and permanently adhered to the passivation layer PAS.
  • the lower film LF and the weak adhesion layer LAH is removed from the base film BF of the protection film FF.
  • the protection film FF can encapsulate the passivation layer PAS over the organic light emitting diode display panel.
  • a circular polarization film CP is attached on the protection film FF.
  • the circular polarization film CP should be disposed as covering the display element area radiating the light for representing image/video.
  • a cover film CF is attached on the circular polarization film CP.
  • the flatness should be maintained. Therefore, it is preferable to use an organic optical adhesion layer AH having excellent flatness and optical properties for attaching the cover film CF covering the whole surface of the base substrate GS. More detail, in the present disclosure, the light emitting direction is the upper side where the circular polarization film CF is attached.
  • the organic optical adhesion layer AH should be optically transparent material and an organic material for keeping the flatness of the surface of the display panel.
  • the organic optical adhesion layer AH preferably includes a optical bond material for hardening by the ultraviolet light.
  • the organic optical adhesion layer AH may include acrylate esters, acrylate urethanes, mercaptons, and photoinitiator materials.
  • this display panel still has the base substrate GS, the rigid substrate, so it is a non-flexible display.
  • a laser having 532 nm wavelength is radiated into the sacrifice layer SL from the outside of the base substrate GS.
  • the laser beam should be uniformly radiated and scanned over the whole surface of the sacrifice layer SL.
  • the amorphous silicon of the sacrifice layer SL is changed (i.e. crystallized) so that the base substrate GS can be departed or separated from the flexible film FL.
  • a back panel BP having sufficient flexibility is attached on the flexible layer FL to complete the flexible organic light emitting diode display.
  • the back panel BP may have much thicker thickness than that of the flexible layer FL to protect the flexible layer FL and other elements formed on the flexible layer FL, but it has enough thin thickness to maintain the flexibility of the display.
  • non-flexible organic light emitting diode display can be manufactured. Furthermore, when the back panel BP has much thinner thickness than the base substrate GS, non-flexible but ultra thin organic light emitting diode display can be manufactured.
  • the above mentioned preferred embodiment of the present disclosure is the explanation for the manufacturing process of single organic light emitting diode display by attaching a protection film to single organic light emitting diode display panel.
  • each protection film can be attached on each organic light emitting diode display panel, respectively.
  • removing the large lower film conducting additional processes on the organic light emitting diode display panels, and then dividing each organic light emitting diode display panels, a plurality of organic light emitting diode displays can be completed.
  • FIG. 5 is a perspective view illustrating that four protection films (#1 to #4) are disposed in a matrix pattern on one large lower film.
  • FIG. 3B after stacking the protection film FF and an upper film UF on the large area lower film LLF, and cutting the upper film UF and the protection film FF, the four protection films (#1 to #4) are disposed as shown in FIG. 5 .
  • FIG. 6 is a perspective view illustrating that four organic light emitting diode display panels (#1 to #4) are disposed on one large rigid mother substrate LGS.
  • the single organic light emitting diode display panel OLED comprises a display element layer TL and a film type printed circuit board COF disposed at one side of the display element layer TL.
  • each protection film FF can be attached on each organic light emitting diode display panel disposed on one large mother substrate LGS, and other post processes, if required, are conducted, then flexible or non-flexible organic light emitting diode display can be completed.

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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140134913A1 (en) * 2012-11-14 2014-05-15 Lg Display Co., Ltd. Method of fabricating flexible display device
US20150380675A1 (en) * 2010-12-03 2015-12-31 Lg Display Co., Ltd. Organic light emitting display device and method for manufacturing the same
US9246134B2 (en) 2014-01-20 2016-01-26 3M Innovative Properties Company Lamination transfer films for forming articles with engineered voids
US9437820B2 (en) * 2013-06-03 2016-09-06 Samsung Display Co., Ltd. Substrate laminating lower film and substrate laminated structure and method of manufacturing organic light emitting display apparatus using the same
US20180040858A1 (en) * 2016-08-07 2018-02-08 Hon Hai Precision Industry Co., Ltd. Flexible display device and method for making same
US10340454B2 (en) * 2016-10-07 2019-07-02 Samsung Display Co., Ltd. Display device and method of manufacturing the same
US10770426B2 (en) * 2016-08-24 2020-09-08 Center For Advanced Meta-Materials Micro device transferring method, and micro device substrate manufactured by micro device transferring method
US20200404788A1 (en) * 2018-12-14 2020-12-24 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Flexible printed circuit (fpc) board and method for manufacturing the same and oled display device
CN113263822A (zh) * 2021-05-27 2021-08-17 云谷（固安）科技有限公司 显示模组的复合胶膜贴合方法及显示装置

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103956363B (zh) * 2014-03-03 2016-09-21 上海天马有机发光显示技术有限公司 复合基板及其制造方法、柔性显示装置及其制造方法
KR102250710B1 (ko) * 2014-10-31 2021-05-10 엘지디스플레이 주식회사 유기 발광 표시 장치 및 유기 발광 표시 장치 제조 방법
KR102366313B1 (ko) 2017-09-08 2022-02-23 삼성디스플레이 주식회사 보호 필름, 표시 모듈, 표시 장치, 표시 모듈 제조 방법 및 표시 장치 제조 방법
CN107739582A (zh) * 2017-11-08 2018-02-27 上海三恩化工有限公司 基于介质转移的泡棉胶带的制造方法
CN110164855B (zh) * 2019-06-11 2024-04-26 郑州胜龙信息技术股份有限公司 发出偏振光的贴片led灯珠及其批量制作方法
KR102282067B1 (ko) * 2019-08-16 2021-07-29 주식회사 에스에프에이 점착 시트 및 그 제조방법
CN110473965A (zh) * 2019-08-27 2019-11-19 深圳市华星光电半导体显示技术有限公司 柔性oled显示面板的制备方法及柔性oled显示面板
KR20220058686A (ko) 2020-10-29 2022-05-10 삼성디스플레이 주식회사 표시 장치 및 그의 구동 방법
KR200496049Y1 (ko) * 2021-01-11 2022-10-21 주식회사 기산하이텍 유기발광표시장치 제작용 봉지필름용 지그
KR102632827B1 (ko) * 2022-04-29 2024-02-06 유진디스컴 주식회사 점착필름을 이용하여 패널에 가요성 필름을 라미네이팅하는 방법 및 그 장치

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6777055B2 (en) * 2000-06-27 2004-08-17 3M Innovative Properties Company Protective article having removable sheets and vertically staggered side edge, substrates protected therewith, and a method of use

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5156941A (en) * 1986-06-17 1992-10-20 Kyodo Printing Co., Ltd. Method of producing an optical or magneto-optical recording card and transfer type optical or magneto-optical recording medium
US20010036645A1 (en) 1998-09-29 2001-11-01 Mcneirney John C. Analyte detector and analyte detection method
US6455119B2 (en) 1998-11-12 2002-09-24 Dittler Brothers Incorporated Label structure
CN1235069C (zh) * 1999-04-21 2006-01-04 日石三菱株式会社 光学叠层板,偏振衍射元件,补偿元件,装饰元件和防伪元件
JP4336427B2 (ja) * 1999-10-01 2009-09-30 帝人株式会社 表面保護フィルムおよびそれからなる積層体
EP1480762A1 (en) 2002-03-02 2004-12-01 Polymeric Converting LLC Removable labels, coupons and the like
JP4063082B2 (ja) * 2003-01-10 2008-03-19 日本電気株式会社 フレキシブル電子デバイスとその製造方法
KR100563057B1 (ko) * 2003-11-14 2006-03-24 삼성에스디아이 주식회사 초박형 유기 전계 발광 표시장치 및 그 제조방법
DE102004014784B3 (de) 2004-03-24 2005-09-15 nivtec flexibel Bühnensysteme GmbH Podest
US7323235B2 (en) 2004-07-20 2008-01-29 Graham Group, Inc. Multi-strip promotional piece
JP5177608B2 (ja) * 2004-11-19 2013-04-03 任天堂株式会社 保護シートの装着構造体
JP2006244729A (ja) * 2005-02-28 2006-09-14 Idemitsu Kosan Co Ltd 着色層形成用転写シートを用いた有機エレクトロルミネッセンス表示装置の製造方法
US7501069B2 (en) * 2005-06-01 2009-03-10 The Board Of Trustees Of The University Of Illinois Flexible structures for sensors and electronics
US20070046560A1 (en) * 2005-08-30 2007-03-01 W5 Networks, Inc. Interleaved text display
US7655289B2 (en) * 2005-12-12 2010-02-02 Eastman Kodak Company Optical film composite having spatially controlled adhesive strength
KR101230310B1 (ko) * 2006-02-02 2013-02-06 삼성디스플레이 주식회사 접착 부재 및 이를 사용하는 표시 장치의 제조 방법
JP5136745B2 (ja) 2006-12-13 2013-02-06 大日本印刷株式会社 多重露光技術におけるマスク製造誤差検証方法
KR20080073224A (ko) 2007-02-05 2008-08-08 (주)유비카드 플라스틱 액정 패널 제조방법
JP4096023B1 (ja) * 2007-05-31 2008-06-04 日本写真印刷株式会社 電波透過性転写材の製造方法
US8101256B1 (en) 2008-02-21 2012-01-24 Cowan Randy G Label structure including a two ply reclosable flap
WO2009128115A1 (ja) * 2008-04-15 2009-10-22 日東電工株式会社 光学フィルム積層体ロールならびにその製造方法および装置
JP5587312B2 (ja) * 2009-07-02 2014-09-10 ニッタ株式会社 機能膜付粘着テープおよび機能膜の転写方法
JP5580155B2 (ja) * 2010-09-27 2014-08-27 スタンレー電気株式会社 タッチパネル入力装置の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6777055B2 (en) * 2000-06-27 2004-08-17 3M Innovative Properties Company Protective article having removable sheets and vertically staggered side edge, substrates protected therewith, and a method of use

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150380675A1 (en) * 2010-12-03 2015-12-31 Lg Display Co., Ltd. Organic light emitting display device and method for manufacturing the same
US9741961B2 (en) * 2010-12-03 2017-08-22 Lg Display Co., Ltd. Organic light emitting display device and method for manufacturing the same
US20140134913A1 (en) * 2012-11-14 2014-05-15 Lg Display Co., Ltd. Method of fabricating flexible display device
US8951085B2 (en) * 2012-11-14 2015-02-10 Lg Display Co., Ltd. Method of fabricating flexible display device
US9437820B2 (en) * 2013-06-03 2016-09-06 Samsung Display Co., Ltd. Substrate laminating lower film and substrate laminated structure and method of manufacturing organic light emitting display apparatus using the same
US9246134B2 (en) 2014-01-20 2016-01-26 3M Innovative Properties Company Lamination transfer films for forming articles with engineered voids
US9419250B2 (en) 2014-01-20 2016-08-16 3M Innovative Properties Company Methods of forming transfer films
US9731473B2 (en) 2014-01-20 2017-08-15 3M Innovative Properties Company Articles with lamination transfer films having engineered voids
US20180040858A1 (en) * 2016-08-07 2018-02-08 Hon Hai Precision Industry Co., Ltd. Flexible display device and method for making same
CN107706305A (zh) * 2016-08-07 2018-02-16 鸿富锦精密工业（深圳）有限公司 柔性显示装置及其制备方法
US10777775B2 (en) * 2016-08-07 2020-09-15 Hon Hai Precision Industry Co., Ltd. Flexible display device and method for making same
US10770426B2 (en) * 2016-08-24 2020-09-08 Center For Advanced Meta-Materials Micro device transferring method, and micro device substrate manufactured by micro device transferring method
US10340454B2 (en) * 2016-10-07 2019-07-02 Samsung Display Co., Ltd. Display device and method of manufacturing the same
US10665784B2 (en) 2016-10-07 2020-05-26 Samsung Display Co., Ltd. Display device and method of manufacturing the same
US20200404788A1 (en) * 2018-12-14 2020-12-24 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Flexible printed circuit (fpc) board and method for manufacturing the same and oled display device
US11432404B2 (en) * 2018-12-14 2022-08-30 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Flexible printed circuit (FPC) board and method for manufacturing the same and OLED display device
CN113263822A (zh) * 2021-05-27 2021-08-17 云谷（固安）科技有限公司 显示模组的复合胶膜贴合方法及显示装置

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US10022946B2 (en) 2018-07-17
CN103378314A (zh) 2013-10-30

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