JP5580155B2 - タッチパネル入力装置の製造方法 - Google Patents
タッチパネル入力装置の製造方法 Download PDFInfo
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- JP5580155B2 JP5580155B2 JP2010214944A JP2010214944A JP5580155B2 JP 5580155 B2 JP5580155 B2 JP 5580155B2 JP 2010214944 A JP2010214944 A JP 2010214944A JP 2010214944 A JP2010214944 A JP 2010214944A JP 5580155 B2 JP5580155 B2 JP 5580155B2
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- thin film
- touch panel
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- piezoelectric
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N39/00—Integrated devices, or assemblies of multiple devices, comprising at least one piezoelectric, electrostrictive or magnetostrictive element covered by groups H10N30/00 – H10N35/00
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/016—Input arrangements with force or tactile feedback as computer generated output to the user
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0414—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using force sensing means to determine a position
- G06F3/04146—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using force sensing means to determine a position using pressure sensitive conductive elements delivering a boolean signal and located between crossing sensing lines, e.g. located between X and Y sensing line layers
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/045—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
- H10N30/081—Shaping or machining of piezoelectric or electrostrictive bodies by coating or depositing using masks, e.g. lift-off
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/30—Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
- H10N30/302—Sensors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/08—Dimensions, e.g. volume
- B32B2309/10—Dimensions, e.g. volume linear, e.g. length, distance, width
- B32B2309/105—Thickness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2310/00—Treatment by energy or chemical effects
- B32B2310/08—Treatment by energy or chemical effects by wave energy or particle radiation
- B32B2310/0806—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation
- B32B2310/0843—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation using laser
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2367/00—Polyesters, e.g. PET, i.e. polyethylene terephthalate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
- B32B2457/208—Touch screens
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/0008—Electrical discharge treatment, e.g. corona, plasma treatment; wave energy or particle radiation
Description
2 x方向透明電極
3 PZT薄膜パターン
4 y方向透明電極
5 タッチパネルガラス
6 表示エリア
7 制御回路
10 タッチパネル入力部
11 ダンパー
12 機器筐体
13 表示部
14 空間
21 成長基板
22 熱酸化膜
23 TiO2薄膜
24 Ti薄膜
25 Pt薄膜
100 タッチパネル
Claims (3)
- (a)成長基板を準備する工程と、
(b)前記成長基板上に第1密着層を形成する工程と、
(c)前記第1密着層上に第2密着層を形成する工程と、
(d)前記第2密着層表面の選択された領域に、レーザを照射することにより、前記第2密着層のみを前記選択された領域から除去する工程と、
(e)前記第2密着層が除去された領域及び前記第2密着層上に、成長下地層を形成する工程と、
(f)前記成長下地層上に圧電性を有する酸化物薄膜を形成する工程と、
(g)前記酸化物薄膜層を成長させた前記成長基板と、第1の透明電極が形成された第2の基板とを接着する工程と、
(h)前記酸化物薄膜層を前記第2密着層が除去された領域のみにおいて、前記第1密着層と前記成長下地層との界面から剥離させ、前記第2の基板へ転写する工程と、
(i)前記転写された酸化物薄膜層を挟みこむ形で、前記第2の基板を第2の透明電極が形成された第3の基板へ接着する工程と
を有するタッチパネル入力装置の製造方法。 - 前記圧電性酸化物薄膜は、ペロブスカイト結晶構造を持つ圧電体酸化物、層状ペロブスカイト結晶構造を持つ圧電体酸化物、非鉛系ペロブスカイト型圧電体酸化物、酸化亜鉛および水晶などの単結晶圧電体薄膜のうち選択された一つの圧電体組成から成ることを特徴とする請求項1記載のタッチパネル入力装置の製造方法。
- 前記第1密着層はTiO2、ZrO2、RuO2、IrO2のいずれか少なくとも一つから成り、
前記第2密着層はTi、Zr、Ru、Ir、Au、Cu、Niのいずれか少なくとも一つから成り、
前記成長下地層はPt、Ir、SrRuO3、LaNiO3のいずれか少なくとも一つまたはそれらの積層体から成ることを特徴とする請求項1又は2記載のタッチパネル入力装置の製造方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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JP2010214944A JP5580155B2 (ja) | 2010-09-27 | 2010-09-27 | タッチパネル入力装置の製造方法 |
US13/242,260 US20120075221A1 (en) | 2010-09-27 | 2011-09-23 | Touchscreen panel input device manufacturing method, piezoelectric element and touchscreen panel input device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2010214944A JP5580155B2 (ja) | 2010-09-27 | 2010-09-27 | タッチパネル入力装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
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JP2012069042A JP2012069042A (ja) | 2012-04-05 |
JP5580155B2 true JP5580155B2 (ja) | 2014-08-27 |
Family
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JP2010214944A Active JP5580155B2 (ja) | 2010-09-27 | 2010-09-27 | タッチパネル入力装置の製造方法 |
Country Status (2)
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US (1) | US20120075221A1 (ja) |
JP (1) | JP5580155B2 (ja) |
Families Citing this family (39)
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JP5597583B2 (ja) * | 2011-03-28 | 2014-10-01 | 太陽誘電株式会社 | タッチパネル装置及び電子機器 |
EP2743804B1 (en) * | 2011-08-11 | 2018-11-14 | Murata Manufacturing Co., Ltd. | Touch panel |
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US9195350B2 (en) | 2011-10-26 | 2015-11-24 | Nokia Technologies Oy | Apparatus and associated methods |
US9495010B2 (en) | 2011-10-26 | 2016-11-15 | Nokia Technologies Oy | Apparatus and associated methods |
KR101823691B1 (ko) * | 2011-11-30 | 2018-01-30 | 엘지이노텍 주식회사 | 터치 패널 |
KR101931336B1 (ko) * | 2012-04-16 | 2018-12-20 | 엘지디스플레이 주식회사 | 평판 표시장치의 보호필름 부착용 전사필름 및 전사필름을 이용한 평판 표시장치의 제조 방법 |
JP5720851B2 (ja) * | 2012-04-27 | 2015-05-20 | 株式会社村田製作所 | 操作入力装置および情報表示装置 |
CN102819351A (zh) * | 2012-08-09 | 2012-12-12 | 昆山攀特电陶科技有限公司 | 夹心型压电触摸屏 |
CN103677256B (zh) * | 2012-09-12 | 2018-05-01 | 三星显示有限公司 | 呈现触觉图像的方法和用于执行该方法的触摸屏设备 |
US9223403B2 (en) * | 2012-12-19 | 2015-12-29 | Panasonic Intellectual Property Management Co., Ltd. | Tactile input and output device |
JP5781495B2 (ja) * | 2012-12-28 | 2015-09-24 | 京セラドキュメントソリューションズ株式会社 | タッチパネル装置 |
JP5860980B2 (ja) * | 2013-02-01 | 2016-02-16 | 株式会社村田製作所 | 押圧センサ付き表示パネル、および押圧入力機能付き電子機器 |
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KR102214929B1 (ko) | 2013-04-15 | 2021-02-10 | 삼성전자주식회사 | 촉각 제공 장치 및 방법 |
JP5904174B2 (ja) * | 2013-08-22 | 2016-04-13 | Smk株式会社 | タッチパネルの支持構造 |
WO2015050097A1 (ja) * | 2013-10-04 | 2015-04-09 | 株式会社村田製作所 | タッチセンサ |
JP6485618B2 (ja) * | 2013-11-11 | 2019-03-20 | Tianma Japan株式会社 | 圧電シートならびにそれを用いたタッチパネルならびにそれらを用いた入出力装置 |
US9448631B2 (en) * | 2013-12-31 | 2016-09-20 | Microsoft Technology Licensing, Llc | Input device haptics and pressure sensing |
US20170115765A1 (en) * | 2014-03-31 | 2017-04-27 | Hewlett-Packard Development Company, L.P. | Interaction with surface acoustic wave touchscreens |
KR102384103B1 (ko) * | 2014-08-26 | 2022-04-07 | 엘지디스플레이 주식회사 | 터치 패널의 구동 장치 |
DE112014006935T5 (de) * | 2014-09-09 | 2017-06-22 | Mitsubishi Electric Corporation | Tastempfindung-Steuersystem und Tastempfindung-Steuerverfahren |
US9501167B2 (en) * | 2014-10-22 | 2016-11-22 | Synaptics Incorporated | Scanned piezoelectric touch sensor device |
KR102425824B1 (ko) * | 2015-04-24 | 2022-07-29 | 삼성디스플레이 주식회사 | 가요성 디스플레이의 햅틱 구동 방법 및 장치 |
US10222889B2 (en) | 2015-06-03 | 2019-03-05 | Microsoft Technology Licensing, Llc | Force inputs and cursor control |
US10416799B2 (en) | 2015-06-03 | 2019-09-17 | Microsoft Technology Licensing, Llc | Force sensing and inadvertent input control of an input device |
US10061385B2 (en) | 2016-01-22 | 2018-08-28 | Microsoft Technology Licensing, Llc | Haptic feedback for a touch input device |
WO2018005890A1 (en) * | 2016-07-01 | 2018-01-04 | Flextronics Ap, Llc | Localized haptic feedback on flexible displays |
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CN106384782A (zh) * | 2016-11-02 | 2017-02-08 | 清华大学 | 一种多层金属电极材料及其制备方法 |
EP3358447B1 (en) * | 2017-02-06 | 2021-07-21 | Aito BV | Haptic signalizing device |
TWI622911B (zh) * | 2017-02-14 | 2018-05-01 | 宏碁股份有限公司 | 觸控裝置 |
CN107272953B (zh) * | 2017-06-16 | 2019-12-10 | 京东方科技集团股份有限公司 | 一种压力触控显示装置及其控制方法 |
JP2019169009A (ja) * | 2018-03-24 | 2019-10-03 | Smk株式会社 | 触覚提示装置および操作入力装置 |
CN108563368A (zh) * | 2018-06-28 | 2018-09-21 | 信利光电股份有限公司 | 一种压电触摸屏及电子产品 |
DE102018215083A1 (de) * | 2018-09-05 | 2020-03-05 | Bayerische Motoren Werke Aktiengesellschaft | Modul für eine Anzeige- und/oder Bedienvorrichtung, Anzeige- und/oder Bedienvorrichtung, Verfahren zur Herstellung eines Moduls und Fortbewegungsmittel |
KR102271268B1 (ko) * | 2019-09-20 | 2021-06-30 | 재단법인대구경북과학기술원 | 전자장치 제조방법 |
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KR101482702B1 (ko) * | 2008-07-16 | 2015-01-15 | 삼성전자주식회사 | 나노와이어를 이용한 비접촉식 터치패널 |
US20100207895A1 (en) * | 2009-02-16 | 2010-08-19 | Samsung Electro-Mechanics Co., Ltd. | Tactile interface device and method for controlling the same |
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-
2010
- 2010-09-27 JP JP2010214944A patent/JP5580155B2/ja active Active
-
2011
- 2011-09-23 US US13/242,260 patent/US20120075221A1/en not_active Abandoned
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JP2012069042A (ja) | 2012-04-05 |
US20120075221A1 (en) | 2012-03-29 |
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