CN110473965A - 柔性oled显示面板的制备方法及柔性oled显示面板 - Google Patents

柔性oled显示面板的制备方法及柔性oled显示面板 Download PDF

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CN110473965A
CN110473965A CN201910796489.0A CN201910796489A CN110473965A CN 110473965 A CN110473965 A CN 110473965A CN 201910796489 A CN201910796489 A CN 201910796489A CN 110473965 A CN110473965 A CN 110473965A
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oled display
preparation
display panel
layer
protective layer
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钱佳佳
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Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Priority to US16/612,846 priority patent/US11476420B2/en
Priority to PCT/CN2019/106374 priority patent/WO2021035835A1/zh
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Abstract

本发明提供一种柔性OLED显示面板的制备方法，包括：步骤S1:提供一刚性基板，在所述刚性基板上制备形成柔性衬底；步骤S2:在所述柔性衬底上制备形成薄膜晶体管阵列层；步骤S3:在所述薄膜晶体管阵列层上制备形成OLED显示单元；步骤S4:在所述OLED显示单元上制备形成封装层；步骤S5:在所述封装层上制备形成一保护层，所述保护层通过热敏型粘合剂粘结于所述封装层背离所述OLED显示单元的表面；步骤S6:剥离所述刚性基板,并完成一支撑膜贴付至所述柔性衬底下方；步骤S7:移除所述保护层；及步骤S8:在所述封装层上制备形成保护盖板。

Description

柔性OLED显示面板的制备方法及柔性OLED显示面板
技术领域
本发明涉及OLED显示技术领域，尤其涉及一种柔性OLED显示面板的制备方法及柔性OLED显示面板。
背景技术
有机发光二极管(organic light-emitting diode，简称OLED)是自发光器件，具有诸多优点：主动发光、发光效率高、对比度高、低功耗、宽视角、响应速度快、工作温度范围宽、轻薄等，成为近年来应用较广的显示器件之一，也因此，采用此发光器件的柔性OLED显示面板成为目前显示领域的主流产品。
常规柔性OLED(Flexible OLED)器件制程通常包含以下几个主要制造流程:在玻璃基板上形成柔性基板，接着在柔性基板上依次制作薄膜晶体管背板、阳极、像素界定层以及发光层，待薄膜封装(Thin Film Encapsulation，TFE)完成，剥离载板玻璃，即完成了柔性OLED器件的制作。请参照图1，其中，现有技术在完成薄膜封装后，会进行压合保护层160用以防止后续制程对薄膜封装层150造成损伤，然而在完成相关制程，要剥离保护层160时，因为薄膜封装层150附着力不好，而保护层160中的光学透明粘合剂(optical clearadhesive,OCA)的粘附力相对较大，容易导致薄膜封装膜层150与其下方的OLED显示单元140分离，严重影响产品良率。
发明内容
为解决上述现有技术的问题，本发明提供了一种柔性OLED显示面板的制备方法，用于降低剥离保护层时，薄膜封装膜层脱落的风险，提高生产良率。
具体地，本发明提供了一种柔性OLED显示面板的制备方法，所述制备方法包括：步骤S1:提供一刚性基板，在所述刚性基板上制备形成柔性衬底；步骤S2:在所述柔性衬底上制备形成薄膜晶体管阵列层；步骤S3:在所述薄膜晶体管阵列层上制备形成OLED显示单元；步骤S4:在所述OLED显示单元上制备形成封装层；步骤S5:在所述封装层上制备形成一保护层，所述保护层通过热敏型粘合剂粘结于所述封装层背离所述OLED显示单元的表面；步骤S6:剥离所述刚性基板,并完成一支撑膜贴付至所述柔性衬底下方；步骤S7:移除所述保护层；及步骤S8:在所述封装层上制备形成保护盖板。
本揭示之一实施例中，所述步骤S5中的保护层包括所述热敏型粘合剂。
本揭示之一实施例中，所述步骤S5还包括：在所述所述封装层背离所述OLED显示单元的表面涂覆所述热敏型粘合剂，及，在所述热敏性粘合剂上形成所述保护层。
本揭示之一实施例中，移除所述保护层的步骤采用加热或冷却所述保护层。
本揭示之一实施例中，所述移除所述保护层的步骤包括提供一加热器对所述保护层进行加热。
本揭示之一实施例中，所述加热器温度范围介于摄氏30至85度。
本揭示之一实施例中，所述移除所述保护层的步骤包括提供一制冷器对所述保护层进行降温。
本揭示之一实施例中，所述制冷器温度范围介于摄氏零下40至零下20度。
本揭示之一实施例中，所述柔性衬底的材料为聚酰亚胺、聚碳酸酯、聚醚砜、聚对苯二甲酸乙二醇酯、聚萘二甲酸乙二醇酯、多芳基化合物或玻璃纤维增强塑料。
为达成上述目的，本揭示更提供一种柔性OLED显示面板，所述柔性OLED显示面板由上述的柔性OLED显示面板的制备方法制成。
附图说明
为了更清楚地说明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单介绍，显而易见地，下面描述中的附图仅仅是发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是现有柔性OLED显示面板的制备方法中移除保护层之前的结构示意图；
图2是本发明实施例提供的柔性OLED显示面板的制备方法中移除保护层之前的结构示意图；
图3是本发明实施例提供的柔性OLED显示面板的制备方法的结构示意图；
图4是本发明实施例提供的柔性OLED显示面板的制备方法流程图；以及
图5是本发明实施例提供的一种柔性OLED显示面板的示意图。
具体实施方式
以下各实施例的说明是参考附加的图示，用以例示本申请可用以实施的特定实施例。本申请所提到的方向用语，例如[上]、[下]、[前]、[后]、[左]、[右]、[内]、[外]、[侧面]等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本申请，而非用以限制本申请。在图中，结构相似的单元是用以相同标号表示。
在此，还需要说明的是，为了避免因不必要的细节而模糊了本发明，在附图中仅仅示出了与根据本发明的方案密切相关的结构和/或处理步骤。
请参照图2，图2是本发明实施例提供的柔性OLED显示面板的制备方法中移除保护层之前的结构示意图。在实际制造过程中，可以多个柔性OLED显示面板在一个母板中同时进行制备，图2仅示例性地示出其中一个柔性OLED显示面板200进行说明制备方法中移除保护层之前的结构示意，其中，柔性OLED显示面板200包括支撑膜210、柔性衬底220、薄膜晶体管阵列层230、OLED显示单元240、封装层250、以及保护层260。
进一步说明请参考图图3与图4，图3是本发明柔性OLED显示面板300的结构示意，图4是本发明柔性OLED显示面板的制备方法流程图。本发明实施例提供的制备方法包括以下各别描述的步骤。
步骤S1提供一刚性基板(图未示)，刚性基板可以为玻璃基板、石英基板等，在所述刚性基板上应用涂布工艺制备形成柔性衬底320，所述涂布工艺可以选择为狭缝涂布工艺或旋涂工艺或喷涂工艺。柔性衬底320的材料为聚酰亚胺、聚碳酸酯、聚醚砜、聚对苯二甲酸乙二醇酯、聚萘二甲酸乙二醇酯、多芳基化合物或玻璃纤维增强塑料。
然后进行步骤S2，在所述柔性衬底320上制备形成薄膜晶体管阵列层330，薄膜晶体管阵列层330包括栅电极、栅极绝缘层、源电极和漏电极、所述源电极和所述漏电极之间的有源层，所述有源层的两端分别连接所述源电极和所述漏电极，以及平坦层覆盖所述源电极和漏电极以及所述有源层。薄膜晶体管阵列层330的形成方法可以是采用沉积薄膜结合光刻工艺，或是电子印刷工艺例如喷墨印刷工艺或丝网印刷工艺。
步骤S3在所述薄膜晶体管阵列层330上制备形成OLED显示单元340，OLED显示单元340包括阳极、有机发光层、阴极，也可以是依次层叠设置的空穴注入层、空穴传输层、有机发光层、电子传输层及电子注入层等，但不限于此。OLED显示单元340的制作例如采用蒸镀法，或是电子印刷工艺例如喷墨印刷工艺或丝网印刷工艺。
步骤S4在所述OLED显示单元340上制备形成封装层350，封装层350的材料可以是有氧化硅(SixOy)和/或氮化硅(SiN)，其中，x≥1，y≥1。SixOy例如可以是SiO、Si2O3、Si3O4。SixOy或者SiN膜均具有一定的水气阻隔能力。在其它实施例中，封装层350也可以包括有树脂薄膜，或是封装层350的结构采用有机物膜与无机物膜交替而成。
步骤S5在所述封装层350上制备形成保护层(即图2的保护层260)，所述保护层260通过热敏型粘合剂(Thermal sensitive Adhesive，TSA)粘结于所述封装层背离所述OLED显示单元的表面。
在一实施例中，所述步骤S5中的保护层包括所述热敏型粘合剂。
在另一实施例中，所述步骤S5还包括：在所述所述封装层背离所述OLED显示单元的表面涂覆所述热敏型粘合剂，及，在所述热敏性粘合剂上形成所述保护层。其中，涂覆方式不限于旋涂、喷涂等制备方式。
热敏型粘合剂依其组成成份特性可以分为高温敏感型热敏型粘合剂和低温敏感型热敏型粘合剂，高温敏感型热敏型粘合剂即是受热在一定温度以上时，其粘性会有效降低，相对地，低温敏感型热敏型粘合剂则是通过制冷而使得胶材的粘性有效降低。
步骤S6剥离所述刚性基板,并完成一支撑膜310贴付至所述柔性衬底320下方；剥离方法例如采用激光剥离工艺将所述刚性基板与所述柔性衬底320分离，接着再透过设备直接贴付支撑膜310至所述柔性衬底320下方。
步骤S7移除所述保护层(即图2的保护层260)，采用加热或冷却方式使所述保护层温度进行改变并达到降低粘附剂的粘附力，使保护层中的胶材粘性有效降低，因此移除保护层时，所述封装层350不会被剥离。其中加热方式包括提供一加热器对所述保护层进行加热，所述加热器温度范围介于摄氏30至85度；冷却方式包括提供一制冷器对所述保护层进行降温，所述制冷器温度范围介于摄氏零下40至零下20度。
最后，步骤S8在所述封装层350上制备形成保护盖板380。
在其它实施例中，所述柔性OLED显示面板的制备方法更包括在所述封装层350和所述保护盖板380之间还设置有触控结构层360。
在其它实施例中，所述柔性OLED显示面板的制备方法更包括在所述触控结构层360和所述保护盖板380之间还设置有偏光片370。
在其它实施例中，所述封装层350是薄膜封装层。
图5是本发明实施例提供的一种柔性OLED显示面板的示意图，所述柔性OLED显示面板300由上述的柔性OLED显示面板的制备方法制成，以及驱动模块500电性连接柔性OLED显示面板300，控制柔性OLED显示面板300的影像画面。
本发明针对对常规柔性OLED器件制程过程中遇到的问题：保护层剥离过程中会因薄膜封装膜层和OLED显示单元间粘附作用力较弱，而保护层自身的光学透明粘合剂粘附力相对较大，所以薄膜封装膜层容易被保护层粘附剥离掉；提出了解决方案，对保护层的胶材粘附力进行更改，在不影响其主要功能的前提下降低了剥离保护层时该胶材的粘附力，降低了封装层脱落的风险，并在其剥离过程中加入对应的条件变更，从而改善柔性OLED器件封装层脱落的问题。本发明制程简单易行，在更改保护层中的粘附剂类型情况下，仅需在常规保护层剥离制程添加加热或制冷功能即可，如此即可降低剥离保护层时薄膜封装膜层脱落的风险，提高生产良率。
综上所述，虽然本申请已以优选实施例揭露如上，但上述优选实施例并非用以限制本申请，本领域的普通技术人员，在不脱离本申请的精神和范围内，均可作各种更动与润饰，因此本申请的保护范围以权利要求界定的范围为准。

Claims (10)

1.一种OLED显示面板的制备方法，其特征在于，所述制备方法包括：
步骤S1:提供一刚性基板，在所述刚性基板上制备形成柔性衬底；
步骤S2:在所述柔性衬底上制备形成薄膜晶体管阵列层；
步骤S3:在所述薄膜晶体管阵列层上制备形成OLED显示单元；
步骤S4:在所述OLED显示单元上制备形成封装层；
步骤S5:在所述封装层上制备形成一保护层，所述保护层通过热敏型粘合剂粘结于所述封装层背离所述OLED显示单元的表面；
步骤S6:剥离所述刚性基板,并完成一支撑膜贴付至所述柔性衬底下方；
步骤S7:移除所述保护层；及
步骤S8:在所述封装层上制备形成保护盖板。
2.根据权利要求1所述的柔性OLED显示面板的制备方法，其特征在于，所述步骤S5中的保护层包括所述热敏型粘合剂。
3.根据权利要求1所述的柔性OLED显示面板的制备方法，其特征在于，所述步骤S5还包括：在所述所述封装层背离所述OLED显示单元的表面涂覆所述热敏型粘合剂，及，在所述热敏性粘合剂上形成所述保护层。
4.根据权利要求1所述的柔性OLED显示面板的制备方法，其特征在于，移除所述保护层的步骤采用加热或冷却所述保护层。
5.根据权利要求4所述的柔性OLED显示面板的制备方法，其特征在于，所述移除所述保护层的步骤包括提供一加热器对所述保护层进行加热。
6.根据权利要求5所述的柔性OLED显示面板的制备方法，其特征在于，所述加热器温度范围介于摄氏30至85度。
7.根据权利要求4所述的柔性OLED显示面板的制备方法，其特征在于，所述移除所述保护层的步骤包括提供一制冷器对所述保护层进行降温。
8.根据权利要求7所述的柔性OLED显示面板的制备方法，其特征在于，所述制冷器温度范围介于摄氏零下40至零下20度。
9.根据权利要求1所述的柔性OLED显示面板的制备方法，其特征在于，所述柔性衬底的材料为聚酰亚胺、聚碳酸酯、聚醚砜、聚对苯二甲酸乙二醇酯、聚萘二甲酸乙二醇酯、多芳基化合物或玻璃纤维增强塑料。
10.一种柔性OLED显示面板，其特征在于，所述柔性OLED显示面板由权利要求1-9任一项柔性OLED显示面板的制备方法制成。
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