US20130186592A1 - Device for detecting temperature of cooling liquid - Google Patents

Device for detecting temperature of cooling liquid Download PDF

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Publication number
US20130186592A1
US20130186592A1 US13/824,571 US201013824571A US2013186592A1 US 20130186592 A1 US20130186592 A1 US 20130186592A1 US 201013824571 A US201013824571 A US 201013824571A US 2013186592 A1 US2013186592 A1 US 2013186592A1
Authority
US
United States
Prior art keywords
cooling liquid
bracket
temperature
cooling
temperature sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/824,571
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English (en)
Inventor
Yoshiki Tomita
Kenji Ohtsuka
Shuichi Hirata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyota Motor Corp
Original Assignee
Toyota Motor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyota Motor Corp filed Critical Toyota Motor Corp
Assigned to TOYOTA JIDOSHA KABUSHIKI KAISHA reassignment TOYOTA JIDOSHA KABUSHIKI KAISHA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HIRATA, SHUICHI, OHTSUKA, KENJI, TOMITA, YOSHIKI
Publication of US20130186592A1 publication Critical patent/US20130186592A1/en
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F27/00—Control arrangements or safety devices specially adapted for heat-exchange or heat-transfer apparatus
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/16—Special arrangements for conducting heat from the object to the sensitive element
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K2205/00—Application of thermometers in motors, e.g. of a vehicle

Definitions

  • the present invention relates to an improved structure of a temperature detecting device for cooling liquid that detects the temperature of a cooling liquid.
  • Patent Literature 1 describes a water cooling heat sink for cooling electrical equipment.
  • the heat sink and an entrance/exit pipe through which cooling water flows into and from the heat sink are bonded together by brazing.
  • Heat conductivity is required for the bracket for transferring the heat of the cooling water to the temperature sensor with high efficiency.
  • it can be considered to enlarge a bonding surface of the bracket that is bonded to the heat sink or the entrance/exit pipe.
  • simple-enlargement of the bonding surface would result in formation of voids during brazing, leading to a problem that heat conduction is inhibited.
  • a device for detecting a temperature of a cooling liquid including a cooling section in which a cooling liquid flows, a temperature sensor that detects a temperature of the cooling liquid, and a bracket that supports the temperature sensor and is braze-bonded to the cooling section, the bracket transferring heat of the cooling liquid to the temperature sensor, wherein a communication portion that communicates between a bonding surface that is bonded to the cooling section and the outside is formed in the bracket.
  • the bracket includes one end portion which is a region that is bonded to the cooling section, and the other end portion which is a region where the temperature sensor is provided, with a thickness of the one end portion being smaller than a thickness of the other end portion.
  • the communication portion is slits that are formed on the bonding surface of the bracket.
  • the slits are formed at intervals of 3 mm or less.
  • the communication portion is a through hole that is formed to pass through the bonding surface of the bracket and a surface that is opposite to the bonding surface.
  • the cooling section is mounted on electrical equipment for cooling a heating element of the electrical equipment.
  • the temperature detecting device for cooling liquid of the present invention it is possible to suppress a reduction in the heat conductivity caused by braze-bonding of elements, with a simple structure. Further, according to this device, it is possible to enhance responsiveness of the temperature sensor with a simple structure.
  • FIG. 1 View illustrating a structure of a temperature detecting device for cooling liquid according to the present embodiment.
  • FIG. 2 Cross sectional view taken along line A-A in FIG. 1 .
  • FIG. 3 View illustrating a structure of a bracket.
  • a preferred embodiment of a temperature detecting device for cooling liquid according to the present invention will be described with reference to the drawings.
  • a temperature detecting device for cooling liquid that detects the temperature of a cooling liquid that cools a semiconductor module provided in a power module that supplies electric power to a motor for driving a motor vehicle will be described, for example.
  • the present invention is also applicable to a temperature detecting device for cooling liquid that detects the temperature of a cooling liquid that cools a heating element of electrical equipment, not limited to the power module of a motor vehicle.
  • FIG. 1 is a view illustrating a structure of a temperature detecting device for cooling liquid according to the present embodiment and FIG. 2 is a cross sectional view taken along line A-A in FIG. 1 .
  • a temperature detecting device for cooling liquid (which will hereinafter be simply referred to as a “temperature detecting device”) 10 is attached to a power module 12 .
  • the power module 12 includes a housing 14 for storing a semiconductor module (not shown) that is a heating element and a control section (not shown) that controls this module.
  • the housing 14 is formed of a material having a high insulating property, such as a resin (including a bicomponent fiber material).
  • the semiconductor module includes a semiconductor element and a substrate on which this element is disposed, although not shown.
  • the semiconductor element is a switching element that is used for an inverter and a booster converter, and is composed of IGBT, a power transistor, a thyristor, and so on. The switching element generates heat when it is driven.
  • the substrate includes an electric circuit, on which the semiconductor element is electrically connected.
  • an operating temperature range (particularly the upper limit temperature) is preset.
  • the control section of the power module 12 controls to restrict the performance of the semiconductor module, before the operating temperature range is exceeded.
  • the temperature detecting device 10 includes a cooling section 16 in which a cooling liquid flows, and a temperature sensor 18 that detects the temperature of the cooling liquid.
  • the temperature detecting device 10 also includes a bracket 20 that supports the temperature sensor 18 and that is braze-bonded to the cooling section 16 .
  • the cooling liquid according to the present embodiment is a cooling medium that is used for a motor vehicle, such as ATF (Automatic Transmission Fluid) or LLC (Long Life Coolant), for example.
  • the cooling section 16 includes a cooling unit 22 connected to the power module 12 and a flow passage 24 connected to each of an entrance port and an exit port of the cooling unit 22 .
  • the cooling unit 22 and the flow passage 24 are both formed of a material having excellent heat conductivity such as aluminum, and are braze-bonded to each other.
  • the cooling unit 22 of the present embodiment is connected to the lower portion of the housing 14 of the power module 12 , as illustrated in FIG. 1 .
  • the cooling unit 22 dissipates the heat of the semiconductor module within the housing 14 to the cooling liquid.
  • the cooling unit 22 is formed of aluminum, as described above, it is possible to dissipate the heat of the semiconductor module to the cooling liquid with high efficiency.
  • the flow passage 24 of the present embodiment is connected to a pump and a heat dissipation member (both of which are not shown) for dissipating the heat of the semiconductor module to the outside.
  • FIG. 3 is a view illustrating the structure of the bracket 20 and is a plan view seen from the B direction in FIG. 2 .
  • the bracket 20 is formed of a material having excellent heat conductivity, such as aluminum. As the bracket 20 is thus formed of aluminum, it is possible to transfer the heat of the cooling liquid flowing in the cooling section 16 to the temperature sensor 18 with high efficiency.
  • the bracket 20 includes one end portion 20 a which is a region to be bonded to the cooling section 16 and the other end portion 20 b which is a region on which the temperature sensor 18 is provided. While the bracket 20 of the present embodiment is bonded to the entrance port i.e. the upstream side, of the cooling section 16 , the present invention is not limited to this structure and the bracket 20 may be bonded to the exit port i.e. the downstream side, of the cooling section 16 .
  • the other end portion 20 b includes a threaded hole 28 formed therein, into which a bolt 26 is to be screw fitted.
  • the temperature sensor 18 includes a terminal 18 a through which the bolt 26 passes. By screwing the bolt 26 passing through this terminal 18 a into the threaded hole 28 , the temperature sensor 18 is fixed to the other end portion 20 b .
  • the temperature sensor 18 of the present embodiment is a thermistor, and a detection value of the temperature sensor 18 is output to the control section of the power module 12 .
  • This method of fixing the temperature sensor 18 to the bracket 20 is only one example, and the present invention is not limited to this structure and other fixing methods, including welding, for example, may be adopted.
  • the one end portion 20 a includes a bonding surface 30 that is bonded to the cooling section 16 . While the bonding surface 30 of the present embodiment is bonded to the cooling unit 22 , this structure is only one example and the bonding surface 30 can be bonded to the flow passage 24 . On the bonding surface 30 , five slits 32 are formed at predetermined intervals. Here, the number of slits 32 indicated above is only one example and is not limited to five.
  • the slits 32 on the bonding surface 30 as described above, it is possible to transfer the air generated on the bonding surface 30 during brazing to the outside through these slits. As formation of voids can be prevented by the transfer of the air, it is possible to prevent a reduction in the thermal conductivity from the cooling section 16 to the bracket 20 caused by such voids.
  • the slits 32 are formed at intervals of 3 mm or less, for example. With this structure, it is possible to transfer the air generated on the bonding surface 30 through the slits 32 with high efficiency. Here, this interval can also be applied to both ends on the bonding surface 30 . More specifically, this interval of 3 mm or less can be applied to the interval between the right end slit 32 and the right end of the one end portion 20 a and to the interval between the left end slit 32 and the left end (indicated by a broken line) of the one end portion 20 a illustrated in FIG. 3 .
  • the bracket 20 of the present embodiment is characterized in that the thickness t 1 of the one end portion 20 a is smaller than the thickness t 2 of the other end portion 20 b .
  • the thicknesses t 1 and t 2 refer to the length of the bracket 20 in the direction which is orthogonal to the bonding surface 30 .
  • the temperature detecting device 10 of the present embodiment due to the characteristics structure of the bracket 20 as described above, it is possible to detect the temperature of the cooling liquid with high accuracy. Consequently, as the accuracy of detection of the temperature of the semiconductor module via the cooling liquid is increased, it is possible to set the preset upper limit temperature of the semiconductor module, which is set in consideration of an error or a margin, to a higher temperature. As, with the increase in the upper limit temperature, it becomes less necessary to restrict the performance of the semiconductor module, an increase in the driving performance of the motor vehicle can be achieved. Further, as the upper limit value for surge voltage protection can also be set higher with the increase in the upper limit temperature, the operation of the semiconductor element can be enhanced due to the surplus voltage obtained accordingly, which would result in an increase in the fuel efficiency performance.
  • cooling section 16 and the bracket 20 are formed of aluminum
  • the present invention is not limited to this structure, and they may be formed of any material with excellent heat conductivity, such as copper.
  • the present invention is not limited to this structure. Any other structures may be adopted as long as they are configured to communicate between the bonding surface 30 and the outside and to allow the air generated on the bonding surface 30 to transfer to the outside to thereby avoid formation of voids during brazing.
  • a through hole formed through the bonding surface 30 and the surface of the one end portion 20 a opposite to the bonding surface 30 may be provided, in place of the slits 32 .
  • temperature detecting device for cooling liquid 10 temperature detecting device for cooling liquid, 12 power module, 14 housing, 16 cooling section, 18 temperature sensor, 20 bracket, 22 cooling unit, 24 flow passage, 26 bolt, 28 threaded hole, 30 bonding surface, 32 slit.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
US13/824,571 2010-10-15 2010-10-15 Device for detecting temperature of cooling liquid Abandoned US20130186592A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2010/068131 WO2012049765A1 (ja) 2010-10-15 2010-10-15 冷却液用温度検出装置

Publications (1)

Publication Number Publication Date
US20130186592A1 true US20130186592A1 (en) 2013-07-25

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
US13/824,571 Abandoned US20130186592A1 (en) 2010-10-15 2010-10-15 Device for detecting temperature of cooling liquid

Country Status (5)

Country Link
US (1) US20130186592A1 (de)
EP (1) EP2629073A1 (de)
JP (1) JPWO2012049765A1 (de)
CN (1) CN103154685A (de)
WO (1) WO2012049765A1 (de)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2542844A (en) * 2015-10-01 2017-04-05 Iceotope Ltd An immersion cooling system
US20170211844A1 (en) * 2016-01-27 2017-07-27 Noritz Corporation Hot water supply device
DE102021102178A1 (de) 2021-02-01 2022-08-04 Webasto SE Temperaturerfassungsvorrichtung und System zur Erfassung der Temperatur einer kühlmediumführenden Komponente einer Heiz- oder Kühlvorrichtung für ein Automobil

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110207853A (zh) * 2019-07-05 2019-09-06 北京比特大陆科技有限公司 温度检测装置、电路板及计算设备

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3779079A (en) * 1972-06-28 1973-12-18 Diginetics Inc Temperature measuring systems for automotive vehicles and the like
US5222811A (en) * 1991-04-19 1993-06-29 Mitsubishi Denki Kabushiki Kaisha Lead wire connection for a temperature sensor
US5383518A (en) * 1991-02-27 1995-01-24 Rolls-Royce Plc Heat exchanger
US20090052210A1 (en) * 2007-08-22 2009-02-26 Ward Terence G Temperature sensing arrangements for power electronic devices
US20090178792A1 (en) * 2008-01-15 2009-07-16 Kabushiki Kaisha Toyota Jidoshokki Liquid-cooled-type cooling device
US20090230176A1 (en) * 2008-03-13 2009-09-17 Ngk Insulators, Ltd. Joining jig and method for manufacturing a bonded body of different members by using the jig
US20120033712A1 (en) * 2010-08-05 2012-02-09 Astrium Sas Device for Measuring the Temperature of a Substrate

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02148432U (de) * 1989-05-19 1990-12-17
JPH09275170A (ja) * 1996-04-03 1997-10-21 Fuji Electric Co Ltd 半導体装置
JP2000117426A (ja) * 1998-10-14 2000-04-25 Nippon Light Metal Co Ltd サンドイッチパネル
JP3476142B2 (ja) * 2001-05-24 2003-12-10 日本電気株式会社 結露防止構造を備えた電子デバイス
JP2002353385A (ja) * 2001-05-29 2002-12-06 Yaskawa Electric Corp サーボドライブ装置
DE102005013762C5 (de) * 2005-03-22 2012-12-20 Sew-Eurodrive Gmbh & Co. Kg Elektronisches Gerät und Verfahren zur Bestimmung der Temperatur eines Leistungshalbleiters
JP4996284B2 (ja) 2007-02-28 2012-08-08 株式会社ティラド 熱交換器のパイプ取付け構造
JP4725536B2 (ja) * 2007-03-05 2011-07-13 株式会社デンソー 電力変換装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3779079A (en) * 1972-06-28 1973-12-18 Diginetics Inc Temperature measuring systems for automotive vehicles and the like
US5383518A (en) * 1991-02-27 1995-01-24 Rolls-Royce Plc Heat exchanger
US5222811A (en) * 1991-04-19 1993-06-29 Mitsubishi Denki Kabushiki Kaisha Lead wire connection for a temperature sensor
US20090052210A1 (en) * 2007-08-22 2009-02-26 Ward Terence G Temperature sensing arrangements for power electronic devices
US20090178792A1 (en) * 2008-01-15 2009-07-16 Kabushiki Kaisha Toyota Jidoshokki Liquid-cooled-type cooling device
US20090230176A1 (en) * 2008-03-13 2009-09-17 Ngk Insulators, Ltd. Joining jig and method for manufacturing a bonded body of different members by using the jig
US20120033712A1 (en) * 2010-08-05 2012-02-09 Astrium Sas Device for Measuring the Temperature of a Substrate

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2542844A (en) * 2015-10-01 2017-04-05 Iceotope Ltd An immersion cooling system
GB2542844B (en) * 2015-10-01 2021-06-16 Iceotope Group Ltd An immersion cooling system
US20170211844A1 (en) * 2016-01-27 2017-07-27 Noritz Corporation Hot water supply device
DE102021102178A1 (de) 2021-02-01 2022-08-04 Webasto SE Temperaturerfassungsvorrichtung und System zur Erfassung der Temperatur einer kühlmediumführenden Komponente einer Heiz- oder Kühlvorrichtung für ein Automobil

Also Published As

Publication number Publication date
EP2629073A1 (de) 2013-08-21
JPWO2012049765A1 (ja) 2014-02-24
CN103154685A (zh) 2013-06-12
WO2012049765A1 (ja) 2012-04-19

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AS Assignment

Owner name: TOYOTA JIDOSHA KABUSHIKI KAISHA, JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:TOMITA, YOSHIKI;OHTSUKA, KENJI;HIRATA, SHUICHI;REEL/FRAME:030031/0437

Effective date: 20120829

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION