US20130006564A1 - Discrete component backward traceability and semiconductor device forward traceability - Google Patents

Discrete component backward traceability and semiconductor device forward traceability Download PDF

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Publication number
US20130006564A1
US20130006564A1 US13/634,068 US201013634068A US2013006564A1 US 20130006564 A1 US20130006564 A1 US 20130006564A1 US 201013634068 A US201013634068 A US 201013634068A US 2013006564 A1 US2013006564 A1 US 2013006564A1
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Prior art keywords
semiconductor device
semiconductor
die
substrate
identifier
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Inventor
Didier Chavet
Cheeman Yu
Hem Takiar
Frank Lu
Chih-Chiang Tung
Jiaming Shi
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SanDisk SemiConductor Shanghai Co Ltd
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SanDisk SemiConductor Shanghai Co Ltd
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Assigned to SANDISK SEMICONDUCTOR (SHANGHAI) CO., LTD. reassignment SANDISK SEMICONDUCTOR (SHANGHAI) CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SHI, JIAMING, TUNG, CHIH-CHIANG, CHAVET, DIDIER, LU, FRANK, TAKIAR, HEM, YU, CHEEMAN
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54406—Marks applied to semiconductor devices or parts comprising alphanumeric information
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54413—Marks applied to semiconductor devices or parts comprising digital information, e.g. bar codes, data matrix
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54433—Marks applied to semiconductor devices or parts containing identification or tracking information
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present technology relates to fabrication of semiconductor devices.
  • Non-volatile semiconductor memory devices such as flash memory storage cards
  • flash memory storage cards are becoming widely used to meet the ever-growing demands on digital information storage and exchange.
  • Their portability, versatility and rugged design, along with their high reliability and large capacity, have made such memory devices ideal for use in a wide variety of electronic devices, including for example digital cameras, digital music players, video game consoles, PDAs and cellular telephones.
  • FIGS. 1 and 2 respectively show a flowchart and schematic representation of steps in the production of semiconductor device memory cards.
  • Manufacturing execution systems are known which receive information in real time from process tools and fab personnel to manage and, to an extent, track the production of memory cards.
  • An MES maintains a database of the fabrication process which allows fab personnel to track semiconductor devices during the production process and also may be used to trace the source of problems should a defect be found in one or more assembled semiconductor devices.
  • MES platform One example of a known MES platform is that from Camstar Inc., Charlotte, N.C., USA. Camstar Inc. provides an MES platform under the name Camstar Manufacturing, and a quality management system under the name Camstar Quality.
  • Other known platforms for managing the flow in a semiconductor memory card plant include Tango production monitoring suite by CyberDaemons Inc. of Hsinchu, Taiwan and an assembly line production (ALPS) manager by Kinesys Software Inc., Forest Grove, Pa., USA.
  • memory die wafer lots 70 and controller die lot 72 are received in a memory card fabrication plant from wafer piece manufacturers.
  • the wafers arrive with the integrated circuits defined thereon by the wafer piece manufacturers so that each memory die wafer piece includes a plurality of memory die, and each controller die wafer piece includes a plurality of controller die.
  • a semiconductor device is being fabricated including a pair of memory die.
  • two memory die wafer lots 70 a and 70 b are shown. It is also known to form semiconductor devices with one or more than two memory die.
  • the wafer lot 70 a used for the bottom memory die may be referred to as the wafer mother lot, while wafer lot(s) used for memory die above the bottom die may be referred to as the wafer sublots.
  • Substrate lots 74 are also received in the memory card fabrication plant from a substrate manufacturer.
  • the substrates in a substrate lot 74 may for example be a printed circuit board (PCB), leadframe or tape automated bonding (TAB) tape.
  • PCB printed circuit board
  • TAB tape automated bonding
  • each wafer piece may have a protective tape applied to its active surface (the surface including the integrated circuits) and is then mounted to a chuck (not shown), active side down in step 20 . Thereafter, a backgrind step 22 may be performed on the each wafer piece to thin the wafer down to a desired thickness. After backgrind step 22 , the wafer pieces may be transferred to another tool where they are diced, for example by saw or laser, in step 24 so that they may be picked and placed onto the substrate.
  • passive components may be mounted on the substrate in a surface mounting process.
  • the solder paste may be applied in step 30 .
  • the passive components also referred to herein as passives, may be mounted in step 32 , and the solder may reflowed/cleaned in a step 34 .
  • the passives may include for example resistors and capacitors.
  • the memory die and a controller die may be mounted on a substrate at a die attach tool 76 .
  • the tool 76 makes use of a known good die (KGD) map 78 which defines good and bad die for each wafer piece used.
  • KGD known good die
  • each die on each wafer piece in wafer lots 70 , 72 may be operationally tested and given a rating such as 0,0 (flawless), A,A (good) or 1,1 (bad).
  • the KGD map 78 is used by the die attach tool so that bad die on a wafer piece are ignored.
  • memory die and typically a controller die are mounted on a substrate to form a semiconductor device.
  • the term “device” refers to an assembly of a substrate, one or more semiconductor die on the substrate and, possibly, passive components on the substrate.
  • the respective die, substrate and/or passives within a device may be referred to herein as “discrete components” of the semiconductor device.
  • the resulting device may then be wire bonded in step 48 .
  • the wire bonding step 48 is a time consuming process. As such, the device assembly lots may be split into a plurality of device assembly sublots so that wire bonding may be performed by a plurality of wire bonding tools 80 simultaneously (the number of wire bonding tools in FIG. 2 is by way of example only).
  • die bond pads on each of the die mounted to a substrate may be electrically coupled to contact pads on the substrate.
  • the devices in the respective device assembly sublots may be encapsulated in a molding compound (step 50 ) in one or more tools 82 , laser marked with an identifier (step 54 ) in one or more tools 84 , and then singulated (step 56 ) in one or more tools 86 .
  • FIG. 2 shows the device assembly sublots remaining separated through each of these steps. However, one or more of the device assembly sublots may be reassembled into the device assembly lot following any of the steps 48 through 56 .
  • the laser marking step 54 may be significant in that it allows information regarding a device assembly lot or sublot to be uploaded and tracked by the MES platform managing flow within the card fabrication plant.
  • FIG. 3 shows an example of a conventional laser mark placed on the devices in a device assembly lot or sublot.
  • the laser mark may include for example a logo and alphanumeric characters.
  • the alphanumeric characters may include a plant code identifying the plant where the semiconductor device was made, a date code indicating when the semiconductor device was made, an MES lot or sublot number assigned to each device assembly lot or sublot, and a device ID code identifying the type of semiconductor package the device is.
  • the information from the laser mark for a device assembly lot or sublot is assigned and stored by the MES, and used for device tracking and traceability.
  • the MES platform does not uniquely identify specific devices. At most, the MES assembly sublot number is unique to an entire device assembly sublot that went through a particular set of tools. Each particular device in such an MES assembly sublot will have the same identification code on its surface and be identified by the same identification code stored in the MES platform. Second, in part because of the generic marking of entire assembly sublots, there is no specific discrete component information directly associated with a specific device. That is, there is no direct link between a device's identification code and the semiconductor die, substrate and/or passive components used in that device.
  • semiconductor devices 90 may be inspected (step 60 ) and then put through one or more tests in step 62 . These tests may include for example burn-in and memory read-write testing at high and low temperatures. Typically, semiconductor devices 90 from a number of device assembly lots are combined in the testing step. It is known to perform tests on 30,000 to 50,000 devices 90 from a plurality of device assembly lots. There is an N:1 consolidation of device assembly lots into a single device test lot, where N may for example be 25 device assembly lots.
  • the devices from respective assembly lots are reshuffled into different bins, depending on how the devices performed in the testing operations.
  • Devices classified in bins 5 - 7 failed the testing operation for one reason or another, and are subjected to a reclaim step 64 where they are retested.
  • the reclaim operations will vary depending on whether a device was classified in bin 5 , bin 6 or bin 7 .
  • a device may go through multiple reclaim processes. If, after one or more of these reclaim processes, a device is found to operate satisfactorily, it may be reclassified into one of bins 1 - 4 and passed on to the card test.
  • the card test in step 66 may be similar to the memory test in step 62 , however content may be written to each device and its capabilities tested. Although not shown in FIG. 2 , the card test may have a similar binning operation, where devices classified in certain bins are submitted for retest in a reclaim operation in step 68 . Devices 90 which pass the card test may undergo some final inspection and processing steps (not shown) and then shipped.
  • the assembly steps of attaching die to a substrate through to singulating the devices are referred to as a 54 - 81 process.
  • the memory test is referred to as a 54 - 62 process.
  • the card test is referred to as a 54 - 99 process.
  • FIG. 1 is a prior art flowchart showing an assembly process of a semiconductor device memory card.
  • FIG. 2 is a prior art schematic representation of an assembly process of a semiconductor device memory card.
  • FIG. 3 is a prior art illustration of a semiconductor device including an MES marking.
  • FIG. 4 is a flowchart of an embodiment of the present technology for processing a substrate strip.
  • FIG. 5 is a flowchart of an embodiment of the present technology for processing a semiconductor wafer piece.
  • FIG. 6 is a flowchart of an embodiment of the present technology for forming a semiconductor device.
  • FIG. 7 is an illustration of a substrate including a marking according to an embodiment of the present technology.
  • FIG. 8 is an illustration of a KGD map used in embodiments of the present technology.
  • FIG. 9 is an illustration of a semiconductor device including a unique identifier.
  • FIG. 10 is a table including information on a semiconductor device and its discrete components according to an embodiment of the present technology.
  • FIG. 11 is a flowchart of an embodiment of the present technology for testing a semiconductor device.
  • FIG. 12 is a table including information on a semiconductor device and its processes according to an embodiment of the present technology.
  • FIG. 13 is a block diagram of a sample server for implementing aspects of the present technology.
  • FIGS. 4 through 13 relate to a system enabling backward traceability of a semiconductor device fabrication process to a single semiconductor die or other discrete component, and forward traceability of individual devices and components through memory and card tests.
  • FIGS. 4 through 13 relate to a system enabling backward traceability of a semiconductor device fabrication process to a single semiconductor die or other discrete component, and forward traceability of individual devices and components through memory and card tests.
  • the present technology may be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey the invention to those skilled in the art. Indeed, the present system is intended to cover alternatives, modifications and equivalents of these embodiments, which are included within the scope and spirit of the present system as defined by the appended claims.
  • the present technology provides backward and forward traceability by a methodology which uniquely identifies each semiconductor device, and which provides an association between the uniquely identified semiconductor device and the discrete components (die, substrate and/or passives) that are used in that device.
  • the unique identification and marking of a semiconductor device enables the semiconductor device, and the discrete components within that device, to be tracked and traced through each process and test in the production of a memory card from that device.
  • the information relating to a semiconductor device are stored in a database, referred to herein as an MES database.
  • the MES database stores backward and forward traceability data in addition to other MES data.
  • storage of data relating to card fabrication may be distributed across more than one database in a variety of ways.
  • a traceability database 306 a for storing all backward and forward traceability data, generated as explained below
  • a separate MES database 306 b for storing other MES-related data.
  • the description that follows generally refers to a single MES database which stores backward and forward traceability data as well as other MES data.
  • information regarding discrete components may be stored in the MES database prior to their assembly into a semiconductor device.
  • this information for the discrete components may be associated in the MES database with the device.
  • information regarding the discrete components may be identified and stored.
  • the fabrication process may begin by defining a work order for production of a given number and type of memory card. This may occur for example days or weeks before the actual fabrication begins. Each memory card is made from a particular type of substrate, memory die, controller die and other discrete components.
  • the discrete components that will be used for the work order are also specified and stored in the MES database.
  • the component manufacturer, date and place of manufacture and a lot number assigned to that component lot are scanned upon receipt (or at some point prior to use in a work order) and uploaded to the MES database.
  • the specific lot numbers of the discrete components that will be used for that work order are also specified.
  • FIG. 7 shows a strip 200 of leadframe substrates 204 (one of which is marked in FIG. 7 ).
  • the strip 200 shown in FIG. 7 may for example be for MicroSD memory cards having eighty substrates 204 in a 4 ⁇ 20 array.
  • the strip 200 shown is by way of example only and strip 200 may come in other shapes, sizes and configurations. While a strip of substrates is described hereinafter, it is understood that the individual substrates may be other substrates and may alternatively be formed of a panel, roll or other grouping of substrates.
  • each strip 200 (or other grouping of substrates 204 ) may be laser marked with its substrate lot number and a specific ID unique to that strip 200 .
  • the MES system includes a control program which receives data and feedback from various tools and components within the card fabrication plant and stores the information in the MES database. Two components providing data and feedback to the MES control program are laser mark stations 318 ( FIG. 13 ) and scanners 320 .
  • the laser mark station 318 associated with substrate processing may generate and assign each substrate strip 200 a unique ID.
  • the laser mark station may assign successive strip identifiers as successive substrate strips 200 are processed.
  • the laser mark station 318 then laser marks each substrate with the known substrate lot number and the substrate strip ID that it generated. It is understood that the unique strip identifier for each substrate strip 200 may be generated by another component within the MES system.
  • the component may then communicate the unique substrate strip ID to the laser mark station, which marks each substrate strip 200 with the substrate lot and substrate strip identifier.
  • Each instance of a substrate strip 200 may include a laser marking 202 including a substrate lot number (generic to all strips in that substrate lot) and a substrate strip identifier that is unique to that specific strip.
  • the substrate lot number and unique strip identifier are shown in FIG. 7 as a pair of two digit alphanumeric characters. It is understood that the substrate lot number and/or the unique strip identifier may be represented with more digits, or in different ways, than is shown in FIG. 7 in further embodiments.
  • each digit of a two digit alphanumeric identifier may have 33 possible values.
  • the 33 possible values come from 10 numeric values (0-9) and 23 letters of the alphabet (A-Z, minus the letters B, O and I, as these may be confused with 8, 0 and 1, respectively).
  • a digit may be any of 33 possible characters for each digit.
  • the laser marking 202 may further include a machine-readable code having the substrate lot number and unique strip identifier information in a form that is readable by a computer scanner.
  • the machine-readable code shown in FIG. 7 is a two-dimensional matrix code, but it is understood that the computer readable code may be a one-dimensional bar code or any other marking in which the substrate lot number and unique strip identifier may be encoded in such a way so as to be understood by a computing device.
  • a computer can read alphanumeric text.
  • the separate matrix or other code in addition to the text may be omitted.
  • the markings of step 102 may be made by laser or other known printing operation. Instead of marking, adhesive labels including the above-described information may be affixed to each substrate strip 200 .
  • FIG. 7 shows the laser marking 202 in the upper left hand corner of substrate strip 200 . It is understood that the laser marking 202 may be provided at other locations on substrate strip 200 in further embodiments.
  • the laser mark station 318 which generated the unique strip ID may upload the unique ID assigned to each substrate strip to the MES database.
  • a separate record may be created in the MES database for each substrate strip 200 .
  • Each record may include the substrate lot, substrate lot history, unique strip ID and a unique substrate ID of each substrate on a strip 200 .
  • Substrate lot history may include information such as who made the substrate lot, and when and where it was made. Historical information may include other information in further embodiments.
  • the substrate lot ID and history may be uploaded to the MES database at a time other than when received within the card fabrication plant, such as for example when a substrate lot is selected for use.
  • the step 104 further includes storing a unique ID for each instance of a substrate 204 on the strip 200 .
  • the control program or other aspect of the MES system may generate unique IDs for each substrate 204 on a strip 200 using some pre-defined convention of identifying individual substrates based on their position on a substrate strip 200 .
  • the MES control program may adopt a convention where the rows are assigned a letter A-D starting from the bottom and the columns are assigned a number 1-20 starting from the left.
  • the substrate in row 2, column 4 may be identified as B-4.
  • a convention may be defined which numbers each position consecutively, for example the first row from the bottom are number 1 through 20, the second row from the bottom are numbered 21-40, etc. It is understood that each substrate may be assigned a unique identifier by other conventions in further embodiments.
  • different substrate strips may have different shapes and numbers of substrates in further examples.
  • the substrate strip 200 may be processed prior to connection of the passive components, including for example solder application, cleaning and inspection.
  • any such process steps may be stored by the MES control program in the MES database in association with the substrate strip 200 and/or specific substrates 204 . Additional information relating to the processes may also be stored in association with the strip 200 and/or specific substrate 204 , including for example when and where the processes were performed, the specific tool that was used, a maintenance record for that tool and/or fab personnel associated with the process.
  • a separate wafer lot may be used for each die in the die stack to be affixed to the semiconductor device.
  • each wafer piece in each wafer lot may be identified.
  • a unique ID may be marked on each wafer piece, either by the wafer manufacturer or within the card fabrication plant, for example using a marking process as described above with respect to the substrate strips.
  • a wafer piece may be uniquely identified by its vertical position relative to other wafer pieces within a wafer sublot (e.g., the ninth wafer piece from the top of the sublot).
  • a record may be created in the MES database for each die on a wafer, including the wafer sublot, wafer lot history, wafer piece ID for each wafer piece in the sublot and a die ID for each die on a wafer piece. This occurs for each wafer sublot used in a device fabrication process, including the one or more memory die wafer sublots/mother lot and the controller die wafer lot.
  • an MES wafer lot ID for that lot, as well as a history for that lot may be scanned and uploaded to the MES database.
  • Wafer lot history may include information such as who made the wafer lot, and when and where it was made. Historical information may include other information in further embodiments.
  • the MES wafer lot ID and history may be uploaded to the MES database at a time other than when received within the card fabrication plant, such as for example when a wafer sublot is selected for use.
  • the step 112 further includes storing a wafer piece ID and die ID.
  • the MES control program identifies each wafer piece, either with a unique ID or by its position within an identified wafer sublot.
  • the MES control program may also store the wafer piece identifier at the time it is generated.
  • the MES control program may store these using a pre-defined convention of describing the positions of all die on a wafer piece in terms of (x, y) coordinates. Spherical coordinates (r, ⁇ ) may alternatively be used to define the positions of die on a wafer piece.
  • Other methods of identifying specific die on a wafer piece are contemplated, including by position on the wafer piece or a unique ID assigned to each die on a wafer piece.
  • a wafer piece may be processed, including for example backgrind, dicing, inspection and cleaning.
  • any such process steps may be stored by the MES control program in the MES database in association with the wafer piece and/or die on the wafer piece. Additional information relating to the processes may also be stored in association with the wafer piece and/or die on the wafer piece, including for example when and where the processes were performed, the specific tool or tools that were used, a maintenance record for the tool(s) and/or fab personnel associated with the processes.
  • FIGS. 4 and 5 enable maximum resolution as to backward traceability of the discrete components used within a semiconductor device, as explained below.
  • one or more of the discrete component identification and storage steps described above may be omitted.
  • at least some of the steps described above with respect to FIGS. 4 and 5 may be performed later in the fabrication process, such as for example when the discrete components are assembled together into a semiconductor device, as will now be described with respect to the flowchart of FIG. 6 .
  • step 120 the next substrate 204 to receive passives and die on a strip 200 is selected. If not already done, the substrate lot number, strip ID and position of this substrate 204 are stored in the MES database by the MES control program.
  • step 122 a unique identifier for each passive component to be mounted on the selected substrate 204 may be stored in the MES database in association with the selected substrate 204 .
  • the passives including for example resistors and/or capacitors, may have their own unique identifier, which gets scanned or otherwise entered by fab personnel into the MES database in association with the substrate 204 on which they are to be mounted.
  • the passive components may then be surface mounted on the selected substrate 204 and reflowed in step 124 .
  • step 126 die are selected for mounting on the substrate 204 based on a KGD map.
  • a representation of a KGD map is shown in FIG. 8 for a single wafer piece from an MES wafer sublot.
  • semiconductor devices may include different numbers of semiconductor die, and there may be a separate wafer sublot used for each die to be mounted in a die stack on the substrate 204 .
  • KGD map of each wafer piece in each MES wafer sublot which KGD maps are provided by the wafer piece manufacturer based on testing done at the manufacturer.
  • FIG. 8 shows an example of a wafer piece 206 having a plurality of semiconductor die 208 (one of which is numbered in FIG. 8 ).
  • the goodness of a die may be represented in the KGD map by alphanumeric codes associated with each die 208 on wafer piece 206 .
  • 0,0 may represent a die with no detected flaws
  • A,A may be a good die with minimal flaws
  • 1,1 may represent a bad die which should not be selected for mounting on any of the substrates 204 .
  • any of a variety of other schemes may be used by a KGD map to represent the goodness of a die on a particular wafer piece 204 .
  • the die selected in step 126 from wafer pieces in different MES wafer lots may be selected based on a number of different criteria.
  • flawless die (0,0) from wafer pieces in the respective MES wafer sublots may be first selected and attached together on substrates 204 .
  • Substrates having only flawless die are likely to result in the highest quality semiconductor devices.
  • one aspect of the present technology allows identification and segregation of semiconductor devices having the highest quality semiconductor die. These devices may then be shipped to OEM manufacturers or others for a premium. Selection of only flawless die for mounting in a single semiconductor device may optimize the chance of that device being of the highest quality. If the flawless die from one or more wafer pieces in respective sublots have been exhausted, then the next best die (A,A) may be used. It is understood that the die selected for attachment within a given semiconductor device may be selected based on a variety of other criteria in further embodiments.
  • the MES wafer sublot, wafer piece ID and selected die position on the wafer piece may be stored in association with the substrate 204 on which the selected die are to be mounted. This may be done for each die from the different sublots to be mounted on the substrate. After all die to be mounted on a given substrate have been identified and stored in association with that substrate in step 128 , the die may be mounted on the substrate in step 130 . The order of steps 128 and 130 may be reversed in alternative embodiments. The die may be mounted to the substrate for example via a die attach adhesive in a known adhesive or eutectic die bond process.
  • each semiconductor device may be considered a semiconductor device (although further processing steps are performed before it is a finished package as explained below).
  • assign each semiconductor device a unique device ID.
  • assignment of a unique device ID may alternatively be performed later in the process, for example in relation to the laser mark step 142 .
  • step 136 semiconductor devices formed on substrates may go through a wire bond process for wire bonding die bond pads on each device semiconductor die 208 to contact pads formed on the substrate 204 .
  • this process is relatively time consuming.
  • an MES assembly lot may be subdivided into MES assembly sublots.
  • the information for each device may be updated in the MES database to reflect the particular assembly sublot and process tool to which each device is transferred.
  • the devices in the respective assembly sublots may be encapsulated in a molding compound in step 138 , assigned a unique device ID in step 140 , laser marked with an identifier in step 142 (steps 140 and 142 are explained in greater detail below), singulated into separate semiconductor devices in step 144 and inspected in step 148 .
  • the respective sublots may stay separated for steps 138 , 140 , 142 , 144 and/or 148 .
  • one or some of the assembly sublots may recombine, or all assembly sublots may recombine into the original assembly lot.
  • the step 140 of assigning a unique device ID to each device, and the step 142 of laser marking that unique device ID on a device may both be performed by a laser marking station 318 associated with device marking.
  • FIG. 9 shows a top view semiconductor device 210 after encapsulation, singulation and laser mark.
  • the laser mark may include a logo 212 and an alphanumeric representation 214 of the unique ID associated with the device.
  • the logo 212 may be omitted in embodiments.
  • the device unique ID representation 214 may have the format of:
  • the first seven digits in the unique ID representation 214 are known by the MES system for each device.
  • the last three digits may be generated and assigned for example by the laser marking station as it marks each device.
  • the laser mark station may assign successive device identifiers as successive devices 210 are processed.
  • the unique ten digit ID may then be stored by the MES control program in the MES database as a means of uniquely identifying the specific device 210 in the database.
  • the unique device identifier for each device 210 may be generated by another component within the MES system. The component may then communicate the unique device ID to the laser mark station, which marks each device 210 with the ten digit device identifier.
  • any of the digits such as for example the sublot number LL and the assigned digits XXX, may have 33 possible values as described above (10 numeric values and 23 letters of the alphabet (A-Z, minus the letters B, O and I)).
  • the sublot number LL may uniquely identify any of 1089 sublots
  • the assigned three digit code may uniquely identify any of almost 36,000 devices within a given sublot. It is understood that a given digit may represent more or less values in further embodiments.
  • the unique ID representation 214 may be included within the unique ID representation 214 in further embodiments, with the provision that the representation uniquely identify the semiconductor device 210 bearing the representation.
  • the representation uniquely identify the semiconductor device 210 bearing the representation.
  • the date information may be represented in different ways in the representation 214 .
  • the marking further includes a code 218 having the same information as the alphanumeric representation 214 , but in machine-readable form.
  • the machine-readable code 218 may be a two-dimensional matrix code, but it is understood that the computer readable code may be a one-dimensional bar code or any other marking in which the unique device ID may be encoded in such a way so as to be understood by a computing device.
  • the separate matrix or other code in addition to the text may be omitted.
  • the logo 212 , representation 214 and/or code 218 may be made by laser or other known printing operation. Instead of marking, adhesive labels including the above-described information may be affixed to each semiconductor device 210 .
  • the locations of the logo 212 , representation 214 and code 218 shown in FIG. 10 are by way of example only, and the location of each may be moved to different locations.
  • One or more of the logo 212 , representation 214 and code 218 may be placed on a back surface of the semiconductor device 210 in further embodiments.
  • the code 218 may be omitted where a computing device is able to read and comprehend the alphanumeric representation. Alternatively, though more time consuming, the code 218 may be omitted and fab personnel can input the alphanumeric representation via a keyboard or other input device associated with the MES control program. Similarly, while it is useful to allow people to read the alphanumeric representation 214 , it may be omitted, in which event, people may identify the unique ID once the code 218 is scanned.
  • the laser mark station may then upload the three digit code so that the MES system then has a unique ten digit identifier for each device.
  • the unique ten digit identifier may then be stored in the MES database to allow unique identification of each specific device in the process.
  • the MES database may have a table 220 with all of the data it needs for backward traceability of all relevant information relating to all processed devices. This information may include for example the specific discrete components (as opposed to a wafer lot, substrate lot or passive component lot) that are included in each device. As shown in FIG. 10 , the MES database may store the unique ID for a device, together with the following information associated with that unique device ID:
  • the above information regarding the discrete components may be stored along with the information shown in FIG. 10 , or it may be cross-referenced in the MES database with the information shown in FIG. 10 .
  • the MES database can provide complete backward traceability with respect to all of the discrete components within a given semiconductor device. This information may be accessed by knowing a device's unique ID, which is printed right on the device as explained above (both in human-readable and machine-readable formats).
  • the information shown in FIG. 10 and described above is not intended as an exhaustive listing of the information which may be stored in the MES database regarding a semiconductor device and its discrete components. Additional and/or alternative information may also be stored in further embodiments in association with a unique device ID.
  • Each process tool (or personnel associated with each such process tool) may have a scanner 320 in communication with the MES control program.
  • the scanner at a given tool scans the matrix code 218 of a device 210 , and the MES control program updates the MES database to indicate that the device 210 is undergoing the process or test at that tool.
  • the scanner may scan one device 210 at a time, or the scanner could potentially scan the code 218 of a number of devices 210 at one time.
  • the MES control program may record the process step, as well as information about the process step, in association with the device's unique ID number.
  • This recorded information may include for example a date and time the device underwent a process, personnel associated with the tool performing the process, a maintenance record of the process tool, and a wide variety of other information.
  • the unique device ID together with the scanning of that ID for all processes the device undergoes, provides complete forward traceability of the device 210 as it moves through the fabrication and testing processes.
  • the devices 210 may undergo memory testing and card testing.
  • memory testing For memory testing, several assembly sublots can be combined to a larger test lot in an N to 1 consolidation for efficient testing and equipment utilization. As one example, 25 assembly sublots may be combined into a single test lot, though it can be more or less assembly sublots in further examples.
  • a consolidated test lot may undergo a memory test.
  • the memory test may include multiple read/write operations to each device 210 in the test lot, possibly at hot and cold temperatures.
  • the memory test in step 150 may include other or alternative tests, such as for example burn-in.
  • the memory test 150 results in a binning of the semiconductor devices in the test lot, where the devices are physically separated into different bins.
  • there may be 7 bins where devices in bins 1 - 4 are deemed to have satisfactorily passed the test operation(s), and devices in bins 5 - 7 have not.
  • a variety of other binning and classifications may be used where devices which satisfactorily perform the memory test are distinguished from those that do not.
  • step 156 if any device winds up in bins 5 - 7 , the device ID is scanned in step 158 , and the record for that device in the MES database is moved to a different logical partition (still within the MES database, but within a different set of stored records).
  • the steps 156 , 158 and 160 of identifying bad devices and moving the records for the bad devices to a new location results in two different overall classifications of devices.
  • Database records for devices which pass the memory test remain unchanged in the database. These devices, referred to herein as a prime test sublot, are transported to the card test as described below.
  • records for devices which wind up in bins 5 , 6 and 7 are scanned to record their bin, and records for those devices moved to a new database locations.
  • Other information may also be stored with the records in the new locations, including for example date and time, test personnel, etc. Records for individual devices may be identified by their unique ID number as explained above. With the separation into different database locations, it may be readily apparent which devices performed well in the memory testing steps and which devices did not.
  • those devices ending up in bins 5 - 7 may go through reclaim, where they are retested in step 150 .
  • the type of retest may depend on which bin a device was classified into. After retest, the devices are again binned, and bad devices scanned. Database records for these devices that fail binning a second time may again be moved to a new database location.
  • the MES database will have an express record of how a given device performed in testing step 150 . Where a device fails multiple times, each instance and resulting binning will be stored in association with that device.
  • the present system allows the MES control program to provide a variety of real-time data. In one aspect, the MES control program may indicate when a device has failed the testing step 150 a predetermined number of times, in which event that device may be removed from further testing.
  • steps 150 through 162 only those devices that failed testing are scanned. This provides advantages in that the devices which pass, which would typically be a very large number of devices, do not need to be scanned. However, in further embodiments, all devices may be scanned after test, and the information regarding their binning may also be added to the database. In embodiments, instead of removing bad device records, all records may be left within their original location in the database, but their record is updated to reflect the test result. Here again, only bad devices may be scanned and their record updated, or all devices may be scanned and their record updated.
  • the devices may be combined into a card test lot for a card test in step 166 .
  • the card testing steps may be similar to the memory testing steps, but additional or different tests are run, such as for example seeing how the devices 210 handle downloaded content.
  • the devices 210 are subjected to a card test in step 166 and the devices are binned depending on how they perform in step 168 .
  • This binning may be by the same or different procedure than in the memory test step.
  • Bad devices may be scanned in step 170 , and their records moved to a new database location together with the binning information in step 174 . These devices may be reclaimed in step 178 , and the process repeated. Each time a device 210 goes through reclaim, its record, together with the reclaim information, may be moved to a new location upon failure.
  • Those devices 210 which pass the card test may go through final labeling or handling in step 176 at which point the devices 210 are finished semiconductor packages ready for shipment.
  • One aspect of the present technology allows identification of the best devices. That is, given the tracking of each device and storage of information about the device, the MES control program can identify devices which for example have only flawless semiconductor die (0,0 on the KGD map) and/or those which passed the memory test and card test without any reclaim. These devices may be segregated in step 180 for sale to customers requiring higher performance. The remaining good quality devices may be sold elsewhere. Similarly, devices which passed the memory and/or card tests after several reclaims may be segregated, for example to be sold at a lower price. Segregation step 180 may be omitted in further embodiments.
  • FIG. 12 shows the table 220 further including records for all process tools a semiconductor device went through, and all testing procedures the semiconductor device went through.
  • the table 220 may also include all of the discrete component information shown in the table 220 of FIG. 9 , which is omitted from FIG. 12 for clarity).
  • the table 220 may further have records for each reclaim process a semiconductor device went through during a test operation.
  • the table 220 of FIG. 12 is shown by way of example only, and may include additional or different information in further embodiments.
  • the present system provides complete backward and forward traceability of a semiconductor device and its discrete components as the semiconductor device travels through the fabrication process, and the present system provides this traceability in real-time. Such a system provides better resolution than was possible with conventional tracking and traceability systems.
  • conventional traceability systems did not have a unique ID associated with each device, and did not have the ability to trace back and track the specific discrete components (die, substrate and/or passives) used in a device.
  • Prior art systems allowed identification of MES assembly lots, from which it could be determined what processes a given device went through. From this, further research could reveal a wafer lot, and possibly reveal where a problem occurred. However, such research was time consuming and did not provide any specific identification or information on the discrete components from which the semiconductor device was formed.
  • a query to the MES database can instantly reveal all processes the device went through, as well as an identification, process steps and information relating to the specific die, substrate and/or passives used. Not only does this enable identification of the source of a problem more easily, but it can quickly reveal problem trends. Analysis of a small number of problem devices may quickly and easily identify a common factor between them, whether at the device level or the discrete component level. For example, it may happen that a sampling of problem devices reveals that each problem device was made using semiconductor die from a particular wafer sublot or lots coming from a particular wafer manufacturer. The ability to pinpoint the source of a problem, even when occurring at the discrete component level, provides a marked advance over conventional MES platforms.
  • the source of a problem may be identified and remedied as soon as the problem is found, without wasting additional resources. For example, if a problem in a sampling of semiconductor devices during memory or card testing identifies a particular wafer lot or lots as the problem, the fabrication run may be stopped, and the problematic lot or lots removed from the process before further die from these wafers are incorporated into devices.
  • the MES control program and MES database may be part of an MES server 300 , one example of which is now described with reference to FIG. 13 .
  • Components of MES server 300 may include, but are not limited to, a processor 302 , a system memory 304 , traceability database 306 a , MES database 306 b , various system interfaces and a system bus 308 that couples various system components.
  • the traceability database 306 a and MES database 306 b may be combined into a single database or distributed across multiple databases.
  • the system bus 308 may be any of several types of bus structures including a memory bus or memory controller, a peripheral bus, and a local bus using any of a variety of bus architectures.
  • the system memory 304 includes computer storage media in the form of volatile and/or nonvolatile memory such as ROM 310 and RAM 312 .
  • RAM 312 may contain an operating system 313 for MES server 300 , and the program modules of the MES software platform 314 .
  • One of these program modules may be the MES control program mentioned above.
  • the MES control program may be that portion of the MES platform which directs various components of MES server 300 to retrieve data relating to the semiconductor devices 210 and the discrete components of the semiconductor devices 210 .
  • the MES control program may further be responsible for generating identifiers as described above.
  • the MES control program may have further responsibilities.
  • the traceability database 306 a and the MES database 306 b may each for example be a relational database including computer-readable media which together store all MES data including data relating to the semiconductor devices 210 and the discrete components of the semiconductor devices 210 discussed above.
  • the databases 306 a and/or 306 b may store other types of data and information as well.
  • the traceability database 306 a and/or the MES database 306 b may be remote from server 300 , and may even be remote from the card fabrication plant in which the MES server may be located. There may be redundant and backup versions of one or both of the traceability database 306 a and the MES database 306 b in embodiments.
  • the MES server 300 may also include a variety of other computer-readable media, including removable/non-removable, volatile/nonvolatile computer storage media.
  • the MES server 300 may include a variety of interfaces for the input and output of data and information.
  • Input interface 316 receives data from a plurality of scanners 320 and input devices such as a keyboard 322 and mouse 324 .
  • the scanners 320 may be provided at process and test tools for reading the machine readable codes discussed above, such as the matrix code 218 on the semiconductor device 210 .
  • the scanners 320 may also read the machine readable codes on the discrete components.
  • the number of scanners shown in FIG. 13 is by way of example only.
  • a video interface 330 may be provided for interfacing with a monitor 332 .
  • Monitor 332 may for example be used to provide a graphical user interface for fab personnel, and to display data from the various process and testing tools, as well as other plant operations.
  • a peripheral interface 336 may be provided for supporting peripheral devices, including for example a printer 338 .
  • the MES server 300 may operate in a networked environment via a network interface 340 using logical connections to one or more remote computers 344 , 346 .
  • the logical connection to computer 344 may be a local area connection (LAN) 348
  • the logical connection to computer 346 may be via the Internet 350 .
  • Other types of networked connections are possible.
  • the present system allows connection to the MES server 300 to obtain this information from any remote location having a network connection to the MES server.
  • MES server 300 is by way of example only, and may include a wide variety of other components in addition to or instead of those described above.
  • one embodiment of the present technology relates to a system for tracking semiconductor packages.
  • the system includes a semiconductor device having a substrate and one or more semiconductor die mounted on the substrate.
  • the system further includes an identifier associated with the semiconductor device, the identifier uniquely distinguishing the semiconductor device from all other semiconductor devices.
  • the present technology relates to a system for tracking semiconductor packages.
  • the system includes a semiconductor device having a substrate and one or more semiconductor die mounted on the substrate.
  • the system further includes an identifier associated with the semiconductor device, the identifier associating the specific semiconductor die used in the semiconductor device with the semiconductor device.
  • the present technology relates to a system for tracking semiconductor packages.
  • the system includes a semiconductor device having a substrate and one or more semiconductor die mounted on the substrate.
  • the system further includes an identifier associated with the semiconductor device, the identifier also associating with the semiconductor device: i) fabrication processes performed on the semiconductor device, ii) testing operations performed on the semiconductor device, and iii) how the semiconductor device performed in the testing operations.
  • the present technology relates to a system for tracking semiconductor packages.
  • the system includes a semiconductor device having a substrate, one or more semiconductor die mounted on the substrate, and passive components.
  • the system further includes a computer-readable medium including stored information identifying at least one of: i) the substrate used in the semiconductor device, ii) the one or more semiconductor die used in the semiconductor device, iii) the passive components used in the semiconductor device, iv) tools at which the semiconductor was processed, v) tools at which the semiconductor device was tested, vi) binning of the semiconductor device after testing of the semiconductor device, and vii) whether and how many times the semiconductor device underwent a reclaim operation after a testing operation.

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JP2013545266A (ja) 2013-12-19
US20160181205A1 (en) 2016-06-23
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KR101700904B1 (ko) 2017-01-31
TW201234559A (en) 2012-08-16
US10229886B2 (en) 2019-03-12
CN102640253B (zh) 2014-06-18
TWI459533B (zh) 2014-11-01
EP2625708A4 (fr) 2014-10-08
KR20160034423A (ko) 2016-03-29
WO2012045202A1 (fr) 2012-04-12
EP2625708A1 (fr) 2013-08-14
KR20140116560A (ko) 2014-10-02
KR101575831B1 (ko) 2015-12-08
TWI570874B (zh) 2017-02-11
BR112012004524A2 (pt) 2016-03-22
TW201503310A (zh) 2015-01-16

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