US20120291465A1 - Cooling system for electronic equipment - Google Patents

Cooling system for electronic equipment Download PDF

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Publication number
US20120291465A1
US20120291465A1 US13/473,685 US201213473685A US2012291465A1 US 20120291465 A1 US20120291465 A1 US 20120291465A1 US 201213473685 A US201213473685 A US 201213473685A US 2012291465 A1 US2012291465 A1 US 2012291465A1
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United States
Prior art keywords
refrigerant
evaporator
electronic equipment
flow rate
control valve
Prior art date
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Abandoned
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US13/473,685
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English (en)
Inventor
Yasuhiro Kashirajima
Junichi Ito
Yasuhiko Inadomi
Tomohiro Yoshida
Teruo Mikami
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Hitachi Ltd
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Hitachi Plant Technologies Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Plant Technologies Ltd filed Critical Hitachi Plant Technologies Ltd
Assigned to HITACHI PLANT TECHNOLOGIES, LTD. reassignment HITACHI PLANT TECHNOLOGIES, LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: Inadomi, Yasuhiko, KASHIRAJIMA, YASUHIRO, MIKAMI, TERUO, YOSHIDA, TOMOHIRO, ITO, JUNICHI
Publication of US20120291465A1 publication Critical patent/US20120291465A1/en
Assigned to HITACHI, LTD. reassignment HITACHI, LTD. MERGER (SEE DOCUMENT FOR DETAILS). Assignors: HITACHI PLANT TECHNOLOGIES, LTD.
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20818—Liquid cooling with phase change within cabinets for removing heat from server blades
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20836—Thermal management, e.g. server temperature control

Definitions

  • the present invention relates to a cooling system for electronic equipment which is favorably used, in particular, for cooling electronic equipment which is to be operated with precision and is large in quantity of heat generated therefrom such as a computer, a server and the like.
  • Japanese Patent Application Laid-Open No. 2009-217500 discloses a cooling system for electronic equipment in which an evaporator for cooling a hot blast (air) which has been discharged from electronic equipment such as a server or the like is disposed and a temperature sensor which detects a temperature of air obtained after the air has been cooled is disposed downstream of the evaporator such that the opening of a valve for controlling a flow rate of a refrigerant which flows within the evaporator is adjusted on the basis of a detection value or the like of the temperature sensor to control an outlet temperature of the evaporator so as to approximate to a set value.
  • a temperature sensor is disposed on the middle of the downstream side of the evaporator so as to adjust the flow rate of the refrigerant which flows within the evaporator on the basis a result of detection by the temperature sensor.
  • a cooling system of the type using a refrigerant natural circulation system although the refrigerant is in a liquefied state on the side of an inlet (a lower part) into the evaporator, since the quantity of heat generated from the electronic equipment is increased when the electronic equipment is fully operated, most of the refrigerant evaporates to a gaseous refrigerant on the side of an outlet (an upper part) of the evaporator.
  • an object of the present invention is to provide a cooling system for electronic equipment which is configured to appropriately adjust a flow rate of a refrigerant which flows within an evaporator, coping with the operating status of the electronic equipment, thereby attaining stable control of the electronic equipment.
  • a cooling system for electronic equipment of the type including an evaporator which evaporates a refrigerant with heat generated from electronic equipment, a blower which makes air which is heated with the heat generated from the electronic equipment flow into the evaporator, and a condenser which is disposed higher than the evaporator and cools and condenses the refrigerant to be supplied to the evaporator to a liquefied refrigerant, and including a refrigerant liquid pipe which guides the liquefied refrigerant from the condenser to a lower part of the evaporator, a refrigerant gas pipe which guides the refrigerant from an upper part of the evaporator to the condenser, a refrigerant flow rate control unit which controls a flow rate of the refrigerant in accordance with a temperature of air obtained after the air has passed through the evaporator and a temperature sensor which detects the temperature of
  • the evaporator includes a coiled vertical pipe through which the refrigerant flows upward from below and the temperature sensor is disposed higher than a half of the height of the coiled vertical pipe.
  • the temperature sensor is disposed lower than an upper end of the evaporator. More desirably, the temperature sensor is disposed lower than an upper end of the coiled vertical pipe.
  • a cooling system for electronic equipment of the type including an evaporator which evaporates a refrigerant with heat generated from electronic equipment, a blower which makes air which is heated with the heat generated from the electronic equipment flow into the evaporator, and a condenser which is disposed higher than the evaporator and cools and condenses the refrigerant to be supplied to the evaporator to a liquefied refrigerant, and including a refrigerant liquid pipe which guides the liquefied refrigerant from the condenser to a lower part of the evaporator, a refrigerant gas pipe which guides the refrigerant from an upper part of the evaporator to the condenser, a refrigerant flow rate control valve which is disposed in at least one of the refrigerant liquid pine and the refrigerant gas pipe and controls a flow rate of the refrigerant which flows within the evaporator, a temperature sensor which detects
  • the controller for control valve increases the opening of the refrigerant flow rate control valve to increase the flow rate of the liquefied refrigerant to be supplied to the evaporator, and when a temperature value which is detected by the temperature sensor is lower than a predetermined value, the controller for control valve decreases the opening of the refrigerant flow rate control valve to decrease the flow rate of the liquid refrigerant to be supplied to the evaporator.
  • the present invention is favorably applicable to the system in which the refrigerant is conveyed between the evaporator and the condenser by a refrigerant natural circulation system.
  • the blower is disposed downstream of the evaporator and the temperature sensor is disposed between the evaporator and the blower.
  • a plurality of the blowers is vertically disposed on the evaporator and the temperature sensor is disposed in the vicinity of a blower which is disposed at an upper stage in the plurality of blowers.
  • the electronic apparatus may be cooled even when an outdoor temperature is high by configuring such that the condenser condenses a gaseous refrigerant which flows into it through the refrigerant gas pipe by being cooled by a refrigerating machine.
  • the condenser may condense a gaseous refrigerant which flows into it through the refrigerant gas pipe by being cooled with outside air or external cooling water.
  • the condenser is a condenser which is included in a refrigerating machine
  • the evaporator is an evaporator which is included in the refrigerating machine
  • a gaseous refrigerant which is sent through the refrigerant gas pipe is compressed by a compressor included in the refrigerating machine, is sent to the condenser and is condensed to a liquefied refrigerant through heat exchange with outside air or external cooling water
  • the liquefied refrigerant so condensed by the condenser is sent to the refrigerant liquid pipe and a refrigerant flow rate control valve which is configured using an electronic expansion valve is disposed in the refrigerant liquid pipe as the refrigerant flow rate control unit so as to expand the refrigerant while controlling the flow rate of the refrigerant by the refrigerant flow rate control valve, thereby making the refrigerant flow into the evaporator.
  • a plurality of the evaporator are disposed, the refrigerant flow rate control valve is disposed in the refrigerant liquid pipe, the refrigerant liquid pipe is branched into respective pipes on the downstream side of the refrigerant flow rate control valve and the branched pipes are connected to lower parts of the plurality of evaporators, a plurality of refrigerant gas pipes are respectively connected to upper parts of the plurality of evaporators, the plurality of refrigerant gas pipes are configured to be united together so as to guide a gaseous refrigerant to the condenser, a plurality of the temperature sensors are respectively disposed on upper parts of the respective evaporators, and the refrigerant flow rate control valve is configured to be controlled by the controller for control valve on the basis of detection values of the respective temperature sensors.
  • the refrigerant flow rate control valve is controlled by the controller for control valve such that a mean value of the detection values detected by the temperature sensors disposed on the respective evaporators is within a predetermined temperature range. Also desirably, the refrigerant flow rate control valve is controlled by the controller for control valve such that a maximum detection value of the detection values detected by the temperature sensors disposed on the respective evaporators is within a predetermined temperature range.
  • FIG. 1 is a schematic diagram of a general configuration, illustrating an embodiment 1 of a cooling system for electronic equipment according to the present invention
  • FIG. 2 is a schematic side view of the cooling system illustrated in FIG. 1 , viewed from the side of a blower;
  • FIG. 3 is a diagram illustrating a manner that a liquefied refrigerant evaporates to a gaseous refrigerant in an evaporator illustrated in FIG. 1 ;
  • FIG. 4 is a flowchart illustrating a flow of control by a controller in the embodiment 1 of the present invention
  • FIG. 5 is a schematic diagram of a configuration of essential parts, illustrating an embodiment 2 of the cooling system for electronic equipment according to the present invention.
  • FIG. 6 is a flowchart illustrating a flow of control by a controller in the embodiment 2 of the present invention.
  • FIG. 1 is a schematic diagram of a general configuration, illustrating an embodiment 1 of a cooling system for electronic equipment according to the present invention.
  • FIG. 2 is a schematic side view of the cooling system illustrated in FIG. 1 , viewed from the side of a blower.
  • FIG. 3 is a diagram illustrating a manner that a liquefied refrigerant evaporates to a gaseous refrigerant in an evaporator illustrated in FIG. 1 .
  • FIG. 4 is a flowchart illustrating a flow of control by a controller in the embodiment 1 of the present invention.
  • FIG. 1 illustrates a cooling system for electronic equipment 2 which cools a server as electronic equipment.
  • 1 is a server room which is installed within a building.
  • a plurality of server racks 100 (only one server rack is illustrated in FIG. 1 ), each housing the servers (electronic equipment) 10 , are installed in the server room 1 .
  • a blade type server is given as an example of the server 10 to be cooled.
  • the blade type server 10 is a thin-type server. Although, in general, a plurality of the thin-type servers is loaded on the server rack 100 , the server 10 may be one large-sized server.
  • Air is taken into the server 10 from a front surface (on the right side in FIG. 1 ) of the server rack 100 and turns to a hot blast by cooling the hot server 10 .
  • the air which has flown out from the server rack 100 is sent toward an evaporator 21 in the cooling system 2 .
  • the cooling system 2 includes the evaporator 21 and a condenser 22 which are used to cool the hot blast from the server 10 , a refrigerant liquid pipe 23 which guides a liquefied refrigerant which has been condensed by the condenser 22 to a lower part of the evaporator 21 , a refrigerant gas pipe 24 which returns a gaseous refrigerant which has evaporated through heat exchange with the hot blast from the server 10 in the evaporator 21 from an upper part of the evaporator 21 to the condenser 22 , a refrigerant flow rate control valve (a refrigerant flow rate control unit) 25 which is disposed in the refrigerant liquid pipe 23 to control a flow rate of the liquefied refrigerant flowing into the evaporator 21 , a blower 26 , that is, a plurality of blowers which are installed downstream of the evaporator 21 so as to introduce air in the server room 1 into the server rack 100 , to cool the air which
  • the blower 26 includes an upper blower 26 u disposed on a downstream-side upper part of the evaporator, a middle blower 26 m disposed on a downstream-side middle part thereof, and a lower blower 26 d disposed on a downstream-side lower part thereof.
  • two blowers are installed as the upper blower 26 u
  • one blower is installed as the middle blower 26 m
  • two blowers are installed as the lower blower 26 d .
  • Each blower includes a propeller and a motor (not illustrated in FIG. 2 ) for driving the propeller. Air in the server room 1 is introduced into the server rack 100 by rotating the propeller, passes through the server 10 , passes through the evaporator 21 and is again blown off into the server room 1 .
  • the condenser 22 is configured to condense a gaseous refrigerant which flows into the condenser through the refrigerant gas pipe 24 by cooling it by a refrigerating machine 30 .
  • the refrigerating machine 30 configures a refrigeration cycle by compressing a refrigerant by a compressor.
  • the condenser 22 may be configured to condense a gaseous refrigerant which flows into the condenser through the refrigerant gas pipe 24 by cooling it with outside air or external cooling water, instead of installation of the refrigerating machine 30 .
  • the temperature sensor 27 is disposed between the evaporator 21 and the blower 26 and in the vicinity of the upper blower 26 u which is disposed on an upper part of the evaporator 21 as illustrated in FIG. 1 and FIG. 2 , and, more specifically, is disposed between the two upper blowers 26 u (on an axial central part of the evaporator) in the example illustrated in FIG. 2 .
  • the temperature of air which flows out from an upper part of the evaporator 21 may be more accurately and stably detected by positioning the temperature sensor 27 as mentioned above.
  • a detection value of the temperature sensor 27 is sent to the controller 28 .
  • the controller 28 controls the opening of the refrigerant flow rate control valve 25 on the basis of the detection value so as to set the temperature of air on the outlet side of the evaporator 21 to a predetermined value (or within a predetermined temperature range). That is, when the detection value of the temperature sensor 27 is higher than a predetermined value, the controller 28 controls to increase the opening of the refrigerant flow rate control valve 25 to increase the flow rate of the liquefied refrigerant which flows through the refrigerant liquid pipe, thereby increasing the cooling capacity of the evaporator 21 .
  • the controller 28 controls to decrease the opening of the refrigerant flow rate control valve 25 to decrease the flow rate of the liquefied refrigerant which flows through the refrigerant liquid pipe, thereby decreasing the cooling capacity of the evaporator 21 .
  • the temperature sensor 27 is disposed on the air outlet side of the evaporator 21 and higher than a half of the height of the evaporator 21 .
  • the evaporator 21 includes a coiled vertical pipe through which the refrigerant flows upward from below and the temperature sensor 27 is disposed at a position which is higher than that of a half of the height of the coiled vertical pipe.
  • the temperature sensor 27 is disposed lower than an upper end part of the evaporator 21 and it is preferable that the temperature sensor 27 be disposed lower than an upper end part of the coiled vertical pipe.
  • the temperature sensor 27 is configured to be disposed at a height-wise position which is within 10% when measured downward from the upper end part of the evaporator 21 .
  • Control to almost complete evaporation of a liquefied refrigerant on an upper part of the evaporator may be facilitated, efficiency of heat exchange of the entire evaporator may be increased, and stable refrigerant natural circulation may be attained by configuring the temperature sensor 27 as mentioned above. That is, since the temperature sensor 27 is disposed on an upper part of the evaporator 21 and a part of the evaporator corresponding to the sensor disposed position is a place where the liquefied refrigerant is liable to evaporate to a gas, the detected temperature of air faithfully conforms to the status of the evaporator 21 and hence a change in temperature may be grasped sensitively.
  • the evaporator 21 includes a lower horizontal pipe 21 a , an upper horizontal pipe 21 b and a plurality of vertical pipes 21 c which connect together the lower horizontal pipe 21 a and the upper horizontal pipe 21 b and each vertical pipe 21 c is configured using a coiled heat-transfer pipe.
  • the refrigerant liquid pipe 23 is connected to the lower horizontal pipe 21 a and the refrigerant gas pipe 24 is connected to the upper horizontal pipe 21 b.
  • Air heated by the server 10 is cooled through heat exchange with the refrigerant which goes upward through the vertical pipe 21 c when passing through the evaporator 21 and the liquefied refrigerant which passes through the vertical pipe 21 c evaporates to a gaseous refrigerant.
  • the gaseous refrigerant flows into the refrigerant gas pipe 24 through the upper horizontal pipe 21 b , goes upward and is returned to the condenser 22 .
  • the server (electronic equipment) 10 is cooled by a refrigerant natural circulation system.
  • R-134a HFC-134a
  • HFC-134a may be used as the refrigerant to be naturally circulated.
  • the state of the refrigerant in the vertical pipe 21 c depends on the operating status on the side of electronic equipment used, for example, 80% of the refrigerant is in a liquefied state and 20% of the refrigerant is in a gaseous state on a lower part of the vertical pipe 21 c , and 5% of the refrigerant is in a liquefied state and 95% of the refrigerant is in a gaseous state on an upper part of the vertical pipe 21 c .
  • the gaseous refrigerant which has been returned to the condenser 22 is cooled by the refrigerating machine 30 and is again condensed.
  • the gaseous refrigerant which has been returned to the condenser may be cooled with outside air or external cooling water as described above.
  • the refrigerant which has been condensed to a liquefied refrigerant in the condenser 22 again flows out toward the refrigerant liquid pipe 23 .
  • Step S 01 When operation is started, first, a detection temperature T is acquired by the temperature sensor 27 (Step S 01 ). Next, the process proceeds to Step S 02 .
  • Step S 05 When a controlling operation of the refrigerant flow rate control valve 25 is started (operation is started), the opening of the control valve 25 is set to its initial state (Step S 05 ) and the process returns to Step S 01 .
  • Step S 03 When the controlling operation is not started in Step S 02 , the process proceeds to Step S 03 .
  • the process proceeds to Step S 06 and a manipulated variable (the opening or the like) of the control valve 25 is calculated on the basis of the detection value T of the blown-off air temperature which has been acquired in Step S 01 .
  • Step S 08 whether manipulation of the control valve 25 is desirable is determined in Step S 08 .
  • the process returns Step S 01 . While, when manipulation is desirable, desirable manipulation such as change of the opening of the control valve or the like is performed and then the process returns to Step S 01 .
  • the above mentioned PID control is a kind of feedback control, that is, a controlling method by which an input value is controlled on the basis of three elements of proportional (or deviation) between an output value and a target value, integral thereof and differential thereof.
  • Step S 04 When PID control is not being performed or is not performed in Step S 03 , the process proceeds to Step S 04 .
  • the process returns to Step S 01 .
  • the control valve 25 is shut down (Step S 07 ) and the operation of the cooling system is stopped.
  • FIG. 5 is a schematic diagram of a configuration of essential parts, illustrating the embodiment 2 of the cooling system for electronic equipment of the present invention.
  • FIG. 6 is a flowchart illustrating a flow of control which is performed by a controller in the embodiment 2 of the present invention.
  • the embodiment 1 a case in which only one evaporator is connected to one cooling system for electronic component (a server) to be cooled has been described by way of example, in the embodiment 2, an example in which a plurality (two in this embodiment) of evaporators are connected to one cooling system will be described. That is, the embodiment 2 involves an example in which two evaporators are connected to one refrigerant circulation cycle.
  • the same numerals as those in FIG. 1 to FIG. 4 designate the same or corresponding parts.
  • two evaporators 21 A and 21 B are vertically disposed and temperature sensors (for example, blown-off air temperature sensors) 27 A and 27 B are disposed on air-outlet-side upper parts of the respective evaporators 21 A and 21 B.
  • Three blowers 26 A 26 Au, 26 Am and 26 Ad
  • three blowers 26 B 26 Bu, 26 Bm and 26 Bd
  • the temperature sensors 27 A and 27 B are connected to the controller 28 for control valve and the controller 28 is configured to control the opening or the like of the refrigerant flow rate control valve 25 on the basis of detection values obtained by the temperature sensors 27 A and 27 B.
  • control of the control valve 25 which is performed by the controller 28 for control valve on the basis of the detection values of the temperature sensors 27 A and 27 B will be described.
  • a mean value is obtained by the arithmetical mean of values detected by the both temperature sensors 27 A and 27 B and the control valve 25 is controlled on the basis of the mean value. That is, when the mean value of temperatures detected by the temperature sensors 27 A and 27 B is higher than a predetermined value, the opening of the refrigerant flow rate control valve 25 is increased to increase the flow rate of a refrigerant which flows into the respective evaporators 21 A and 21 B through the refrigerant liquid pipe 23 , thereby increasing the cooling capacities of the evaporators 21 A and 21 B.
  • the opening of the refrigerant flow rate control valve 25 is decreased to decrease the flow rate of the refrigerant which flows into the respective evaporators 21 A and 21 B through the refrigerant liquid pipe 23 , thereby decreasing the cooling capacities of the evaporators 21 A and 21 B.
  • the control valve 25 is controlled on the basis of a maximum detection value of values detected by the plurality of temperature sensors 27 A and 27 B. That is, when the maximum detection value of detection values detected by the temperature sensors 27 A and 27 B is higher than a predetermined value, the opening of the refrigerant flow rate control valve 25 is increased, thereby increasing the cooling capacities of the evaporators 21 A and 21 B. While, when the maximum detection value of the detection values detected by the temperature sensors 27 A and 27 B is lower than the predetermined value, the opening of the refrigerant flow rate control valve 25 is decreased, thereby decreasing the cooling capacities of the evaporators 21 A and 21 B.
  • each of the temperature sensors 27 A and 27 B be disposed at a height-wise position which is within 20% when measured downward from an upper end part of each of the evaporators 21 A and 21 B.
  • control may be readily performed such that these two evaporations 21 A and 21 B are operated within a capacity (that is a 90% capacity of a maximum cooling capacity) which is lower by 10% than the maximum cooling capacity obtained by combining together the capacities of the two evaporators 21 A and 21 B.
  • control since control may be readily performed so as to almost complete evaporation of the liquefied refrigerant on an upper part of each evaporator, the heat exchange efficiency of the entire evaporator may be increased.
  • Step S 10 in which control mode the controller 28 controls the flow rate control valve 25 , that is, whether the controller 28 controls the control valve 25 on the basis of a mean value of detection values of the plurality of temperature sensors or a maximum value of the detection values is determined.
  • controller 28 controls the control valve 25 on the basis of a mean value of detection values of the temperature sensors 27 A and 27 B,
  • T ( T out 0+ T out 1)/2
  • Step S 12 is set (Step S 12 ).
  • controller 28 controls the control valve 25 on the basis of a maximum value of the detection values of the temperature sensors 27 A and 27 B, whether
  • Step S 11 is determined (Step S 11 ).
  • the condenser 22 may be configured as a condenser included in a refrigerating machine and the evaporator 21 may be configured as an evaporator included in the refrigerating machine such that a gaseous refrigerant which is sent through the refrigerant gas pipe 24 is compressed by a compressor included in the refrigerating machine and is sent to the condenser 22 to condense the refrigerant so compressed through heat exchange with outside air or external cooling water.
  • such a configuration is also allowable that a liquefied refrigerant obtained by being condensed by the condenser 22 is sent to the refrigerant liquid pipe 23 and the refrigerant flow rate control valve 25 which is configured using an electronic control valve or the like is installed in the refrigerant liquid pipe so as to expand the refrigerant while controlling the flow rate thereof by the refrigerant flow rate control valve 25 to make the refrigerant flow into the evaporator 21 .
  • a refrigerant liquid pipe for guiding a liquefied refrigerant from a condenser to a lower part of an evaporator since a refrigerant liquid pipe for guiding a liquefied refrigerant from a condenser to a lower part of an evaporator, a refrigerant gas pipe for guiding the refrigerant which has evaporated by cooling electronic equipment from an upper part of the evaporator to the condenser, a refrigerant flow rate control valve (a refrigerant flow rate control unit) which is disposed in the refrigerant liquid pipe to control a flow rate of the refrigerant flowing into the evaporator, a temperature sensor for detecting a temperature of air obtained after passing through the evaporator, and a controller for control valve for controlling the refrigerant flow rate control valve on the basis of a detection value of the temperature sensor are included, and since the temperature sensor is disposed on the side of an air outlet of the evaporator and on an upper
  • the cooling system is configured as a cooling system for cooling electronic equipment by a refrigerant natural circulation system, stability of control may be improved.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
US13/473,685 2011-05-18 2012-05-17 Cooling system for electronic equipment Abandoned US20120291465A1 (en)

Applications Claiming Priority (2)

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JP2011111693A JP5750304B2 (ja) 2011-05-18 2011-05-18 電子機器の冷却システム
JP2011-111693 2011-05-18

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EP (1) EP2525639A3 (zh)
JP (1) JP5750304B2 (zh)
CN (1) CN102791110B (zh)
SG (1) SG185896A1 (zh)

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US20140268547A1 (en) * 2011-12-01 2014-09-18 Fujitsu Limited Electronic device rack and information processing apparatus
US20160330873A1 (en) * 2015-05-04 2016-11-10 Google Inc. Cooling electronic devices in a data center
US20180059746A1 (en) * 2015-03-23 2018-03-01 Nec Corporation Phase change cooling device and phase change cooling method
US10203163B2 (en) 2014-10-17 2019-02-12 Nec Platforms, Ltd Cooling system and electronic device
US10375901B2 (en) 2014-12-09 2019-08-13 Mtd Products Inc Blower/vacuum
WO2019070498A3 (en) * 2017-10-05 2020-03-26 Ice Qube, Inc. Miniaturized closed-loop cooling system
CN111288726A (zh) * 2020-02-28 2020-06-16 佛山格尼斯磁悬浮技术有限公司 磁悬浮内螺纹铜管加工设备的温度监控系统及方法、装置
CN112954955A (zh) * 2021-01-25 2021-06-11 华为技术有限公司 一种冷却系统和数据中心
US20230137596A1 (en) * 2021-11-02 2023-05-04 Oracle International Corporation Unified control of cooling in computers
US11711908B1 (en) * 2022-03-18 2023-07-25 Baidu Usa Llc System and method for servicing and controlling a leak segregation and detection system of an electronics rack

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CN103327799B (zh) * 2013-07-17 2016-06-29 曙光信息产业股份有限公司 用于机架式服务器的冷却组件、及机架式服务器机组
KR101917484B1 (ko) * 2013-11-14 2018-11-09 닛본 덴끼 가부시끼가이샤 배관 구조, 그 배관 구조를 사용한 냉각 장치, 및 냉매 증기 수송 방법
CN106604616A (zh) * 2017-01-04 2017-04-26 北京百度网讯科技有限公司 整机柜服务器系统的散热系统及方法
WO2018131555A1 (ja) * 2017-01-16 2018-07-19 日本電気株式会社 バルブ制御装置、冷却装置、バルブ制御方法およびプログラム記憶媒体
CN107289681B (zh) * 2017-06-23 2019-11-08 麦克维尔空调制冷(武汉)有限公司 一种冷水机组冷媒流量控制方法
CN107728746B (zh) * 2017-09-22 2019-10-29 郑州云海信息技术有限公司 一种服务器冷却系统
JP7403984B2 (ja) * 2019-07-26 2023-12-25 株式会社鷺宮製作所 冷却装置
CN112212552B (zh) * 2020-09-04 2021-10-15 珠海格力电器股份有限公司 一种冷却方法、设备、计算机可读介质和电子设备
CN114110920A (zh) * 2021-11-08 2022-03-01 珠海格力电器股份有限公司 一种空调器的控制方法及空调器
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