US20120125520A1 - Ultrasonic bonding tool, method for manufacturing ultrasonic bonding tool, ultrasonic bonding method, and ultrasonic bonding apparatus - Google Patents

Ultrasonic bonding tool, method for manufacturing ultrasonic bonding tool, ultrasonic bonding method, and ultrasonic bonding apparatus Download PDF

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Publication number
US20120125520A1
US20120125520A1 US13/379,669 US200913379669A US2012125520A1 US 20120125520 A1 US20120125520 A1 US 20120125520A1 US 200913379669 A US200913379669 A US 200913379669A US 2012125520 A1 US2012125520 A1 US 2012125520A1
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Prior art keywords
tool
ultrasonic bonding
lead wire
planar portions
layer
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Abandoned
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US13/379,669
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English (en)
Inventor
Akio Yoshida
Masahisa Kogura
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Toshiba Mitsubishi Electric Industrial Systems Corp
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Toshiba Mitsubishi Electric Industrial Systems Corp
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Assigned to TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION reassignment TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KOGURA, MASAHISA, YOSHIDA, AKIO
Publication of US20120125520A1 publication Critical patent/US20120125520A1/en
Abandoned legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B23K20/106—Features related to sonotrodes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/22—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
    • B24B19/02—Single-purpose machines or devices for particular grinding operations not covered by any other main group for grinding grooves, e.g. on shafts, in casings, in tubes, homokinetic joint elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
    • B24B19/16—Single-purpose machines or devices for particular grinding operations not covered by any other main group for grinding sharp-pointed workpieces, e.g. needles, pens, fish hooks, tweezers or record player styli
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0633—Grinders for cutting-off using a cutting wire
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices
    • B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54—Glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48455—Details of wedge bonds
    • H01L2224/48456—Shape

Definitions

  • the present invention relates to an ultrasonic bonding tool used in an ultrasonic bonding apparatus, and particularly to a structure of a chip portion that is a distal end portion of the ultrasonic bonding tool.
  • An ultrasonic bonding apparatus can be mentioned as an apparatus for bonding an aluminum-based material to a steel material that is a dissimilar metal with a high bonding strength or as an apparatus for bonding a to-be-bonded member such as a lead wire for external connection onto a bonding object portion of an electronic device or the like.
  • a stress caused by vertical pressure application to a bonding interface and a repetitive stress caused by a high vibration acceleration in a parallel direction are given so that frictional heat is generated in the bonding interface. Thereby, atoms of the to-be-bonded member are diffused and thus bonding can be made.
  • Such an ultrasonic bonding apparatus includes an ultrasonic bonding tool having a chip portion that is brought into contact with the to-be-bonded member. This ultrasonic bonding tool is disclosed in , for example, Patent Document 1.
  • Patent Document 1 Japanese Patent Application Laid-Open No. 2005-254323
  • the ultrasonic bonding apparatus performs an ultrasonic bonding operation in which both the application of pressure from the upper side and the application of ultrasonic vibration are made.
  • the bonding object portion needs to be resistant to the ultrasonic bonding operation. Therefore, in apparatuses including the ultrasonic bonding apparatus disclosed in the Patent Document 1, it is not assumed that a thin-film base, such as a glass substrate, having a relatively small plate thickness and thus having a small resistance is used as the bonding object portion mentioned above, and means for bonding a lead wire onto a surface of the thin-film base has not been considered.
  • an object of the present invention is to provide an ultrasonic bonding tool capable of bonding a to-be-bonded member even to a surface of a thin-film base having a plate thickness of 2 mm or less such as a glass substrate or the like.
  • An ultrasonic bonding tool is an ultrasonic bonding tool used in an ultrasonic bonding apparatus that applies pressure from an upper side to a to-be-bonded member placed on a surface of a thin-film base and applies ultrasonic vibration thereto to thereby bond the to-be-bonded member onto the surface of the thin-film base, wherein the ultrasonic bonding tool has, at a distal end portion thereof, a chip portion that is brought into contact with the to-be-bonded member at a time of ultrasonic bonding, a surface portion of the chip portion which is brought into contact with the to-be-bonded member has a plurality of planar portions formed so as to be separated from one another and a plurality of concavities formed between the plurality of planar portions, the plurality of planar portions having a flatness of 2 ⁇ m or less.
  • the surface portion of the chip portion which is brought into contact with the to-be-bonded member has the plurality of planar portions formed so as to be separated from one another and the plurality of concavities formed between the plurality of planar portions, and the plurality of planar portions 10 have a flatness of 2 ⁇ m or less.
  • the ultrasonic bonding method using the ultrasonic bonding apparatus having the ultrasonic bonding tool according to the present invention provides an effect that the to-be-bonded member can be bonded, without any trouble, even onto the surface of the thin-film base having a plate thickness of 2 mm or less such as a glass substrate.
  • FIG. 1 A cross-sectional view schematically showing a status of ultrasonic bonding performed by an ultrasonic bonding tool according to an embodiment 1 of the present invention.
  • FIG. 2 A cross-sectional view showing a cross-sectional structure of a surface portion of a chip portion according to the embodiment 1.
  • FIG. 3 A perspective view schematically showing a planar structure of the surface portion of the chip portion according to the embodiment 1.
  • FIG. 4 A cross-sectional view showing a cross-sectional structure of a surface portion of an ordinary chip portion of an ultrasonic bonding tool.
  • FIG. 5 An explanatory diagram showing an exemplary pattern of forming a plurality of planar portions of the chip portion according to the embodiment 1.
  • FIG. 6 A cross-sectional view showing another cross-sectional structure of the chip portion according to the embodiment 1.
  • FIG. 7 An explanatory diagram showing a shape of a chip portion according to an embodiment 2 of the present invention.
  • FIG. 8 A cross-sectional view showing a cross-sectional structure of a chip portion according to an embodiment 3 of the present invention.
  • FIG. 9 A cross-sectional view showing a method for manufacturing an ultrasonic bonding tool according to an embodiment 4.
  • FIG. 10 An explanatory diagram schematically showing a planar structure with respect to an ultrasonic bonding tool and a lead wire in an ultrasonic bonding method according to an embodiment 5.
  • FIG. 11 An explanatory diagram schematically showing a function for adjusting a position of the lead wire, of a lead wire guide mechanism according to an embodiment 6.
  • FIG. 12 A cross-sectional view showing a cross-sectional structure of a chip portion according to an embodiment 7 of the present invention.
  • FIG. 13 A cross-sectional view showing a cross-sectional structure of a chip portion according to an embodiment 8 of the present invention.
  • FIG. 1 is a cross-sectional view schematically showing a status of ultrasonic bonding performed by an ultrasonic bonding tool 1 according to an embodiment 1 of the present invention.
  • a glass substrate 3 that is a thin-film base having a plate thickness of about 0.7 to 2.0 mm is fixed to a table (anvil) 5 , and an aluminum-made lead wire 2 (to-be-bonded member) for external connection having a plate thickness of about 0.1 to 0.2 mm is arranged at a predetermined position on a surface of the glass substrate 3 .
  • an ultrasonic bonding operation is performed in which vertical pressure is applied to a bonding surface to be bonded to the lead wire 2 via a chip portion 1 c of the ultrasonic bonding tool 1 while the ultrasonic bonding tool 1 is ultrasonically vibrated in a horizontal direction to largely deform the bonding surface.
  • the lead wire 2 and the glass substrate 3 are solid-state bonded to each other at a bonding interface between the lead wire 2 and the glass substrate 3 .
  • FIG. 2 is a cross-sectional view showing a cross-sectional structure of a surface portion of the chip portion 1 c .
  • FIG. 3 is a perspective view schematically showing a planar structure of the surface portion of the chip portion 1 c .
  • FIG. 2 corresponds to an inverted version of a cross-section taken along the line A-A of FIG. 3 .
  • a plurality of planar portions 10 are formed so as to be separated from one another by a plurality of concavities 11 (in FIG. 3 , first grooves 11 a and second grooves 11 b ).
  • FIG. 4 is a cross-sectional view showing a cross-sectional structure of a surface portion of an ordinary chip portion 51 c of an ultrasonic bonding tool.
  • the chip portion 51 c has a plurality of planar portions 60 formed so as to be separated from one another by a plurality of concavities 61 through a wire-cutting process.
  • each of the plurality of planar portions 60 is substantially in the shape of a protrusion, and does not maintain a high degree of flatness. Therefore, as a surface structure of the chip portion 51 c , unevenness of a few tens of pm order is formed by the planar portions 60 and the concavities 61 . This is not a problem in the conventional method, because a large amount of deformation in a direction of the plate thickness caused by the ultrasonic bonding is acceptable.
  • a horizontal line LH defined by a plane where surfaces of the planar portions 10 are formed is accurately set to be 90 degrees with respect to the vertical line LV, and the planar portions 10 are accurately formed so as to have a flatness of 2 ⁇ m or less.
  • An interval P 1 between the concavities 11 and 11 is set to be approximately 1.0 mm or less, and a depth D 1 to the innermost of the concavity 11 is set to be approximately 0.15 mm or less.
  • the chip portion 1 c of the ultrasonic bonding tool 1 according to the embodiment 1 is structured with an accuracy completely different from the ordinary ultrasonic bonding tool 51 c, and enables the lead wire 2 to be bonded without damaging the glass substrate 3 which is susceptible to fracture.
  • FIG. 3 shows an example in which the plurality of concavities 11 of FIG. 2 are formed by a plurality of first grooves 11 a and a plurality of second grooves 11 b that cross each other in the vertical direction. That is, the concavities 11 are formed in a matrix by being separated from each other by the plurality of first grooves 11 a provided substantially in a longitudinal direction in FIG. 3 and the second grooves 11 b provided in a lateral direction in FIG. 3 , so that the plurality of planar portions 10 each having a rectangular shape in a plan view are formed.
  • the plurality of planar portions 10 define a single surface having a flatness of 2 ⁇ m or less.
  • FIG. 5 is an explanatory diagram showing an exemplary pattern of forming the plurality of planar portions 10 .
  • the region other than the planar portions 10 is the concavities 11 , but the concavities 11 are not shown.
  • a plurality of planar portions 10 each having a rectangular shape in a plan view may be arranged in a matrix (corresponding to FIG. 3) , and as shown in FIG. 5( b ), a plurality of planar portions 10 each having an elongated rectangular shape in a plan view may be arranged in parallel.
  • a plurality of planar portions 10 each having a circular shape in a plan view may be arranged in a matrix, and as shown in FIG. 5( d ), a plurality of planar portions 10 each having a rhombic shape in a plan view may be arranged in a matrix.
  • FIG. 6 is a cross-sectional view showing another cross-sectional structure of the chip portion 1 c .
  • the concavity 11 may be formed such that its cross-section has an inverted trapezoidal shape.
  • the plurality of planar portions 10 have a highly accurate flatness of 2 ⁇ m or less, which can reduce the above-mentioned concentrated load in each of the plurality of planar portions 10 .
  • the plurality of planar portions 60 are formed so as to be separated from one another, a stress is distributed among the plurality of planar portions to thereby reduce a stress acting on one planar portion.
  • the planar portion 60 has a circular shape in a plan view as shown in FIG. 5( c ).
  • the plurality of concavities 11 make it easy to hold the lead wire 2 so as not to fall off during the ultrasonic bonding operation performed by the ultrasonic bonding tool 1 (holding function) and to separate the ultrasonic bonding tool 1 from the lead wire 2 after completion of the ultrasonic bonding operation by the ultrasonic bonding tool 1 (separating function).
  • the surface portion of the chip portion 1 c which is brought into contact with the lead wire 2 has the plurality of planar portions 10 separated from one another and the plurality of concavities 11 each formed between the plurality of planar portions.
  • the plurality of planar portions 10 define one plane having a flatness of 2 ⁇ m or less.
  • an ultrasonic bonding method using an ultrasonic bonding apparatus having the ultrasonic bonding tool 1 according to the embodiment 1 provides an effect that the lead wire 2 can be bonded without any trouble on the surface of the glass substrate 3 that is a thin-film base having a plate thickness of 2 mm or less.
  • FIG. 7 is an explanatory diagram showing the shape of the chip portion 1 c according to an embodiment 2 of the present invention.
  • FIG. 7( a ) shows a planar structure of the chip portion 1 c
  • FIG. 7( b ) shows a cross-sectional structure of the chip portion 1 c .
  • FIG. 7( b ) corresponds to a cross-section taken along the line B-B of FIG. 7( a ).
  • the chip portion 1 c has a rectangular shape in a plan view, and an acute angled end portion (edge) of an outer peripheral portion 1 ce of each of the plurality of planar portions 10 is chamfered in both of a horizontal plane (plane parallel to the horizontal line LH (see FIG. 2) ) and a vertical plane (plane parallel to the vertical line LV (see FIG. 2 )) and rounded at a predetermined curvature radius r.
  • the chip portion 1 c of the ultrasonic bonding tool 1 according to the embodiment 2 is characterized in that the acute angled end portion (edge) of the outer peripheral portion 1 ce of each of the plurality of planar portions 10 is chamfered and rounded.
  • the plurality of planar portions 10 of the chip portion 1 c are vibrated in a direction parallel to the surface of the glass substrate 3 due to the ultrasonic vibration. Accordingly, in each of the plurality of planar portions 10 , a vertical vibration of micron order occurs back and forth, right and left, which tends to damage the lead wire 2 and the glass substrate 3 because of a concentrated load acting thereon.
  • the edge of the outer peripheral portion 1 ce is chamfered and rounded. Therefore, the concentrated load on the outer peripheral portion 1 ce is reduced, and thus the effect that the lead wire 2 can be bonded without any trouble on the surface of the glass substrate 3 is obtained more successfully than in the embodiment 1.
  • FIG. 8 is a cross-sectional view showing a cross-sectional structure of the chip portion 1 c according to the embodiment 3 of the present invention. As shown in FIG. 8 , in addition to the feature of the embodiment 2, fine unevenness in a range that satisfies a flatness of 2 ⁇ m or less is provided in a planar portion 10 a of the chip portion 1 c.
  • the chip portion 1 c of the ultrasonic bonding tool 1 according to the embodiment 3 is characterized in that the plurality of planar portions 10 a have fine unevenness in a range that satisfies a flatness of 2 ⁇ m or less. Additionally, it is also characterized in that each of the plurality of concavities 11 has fine unevenness.
  • the fine unevenness of the planar portions 10 a allows making inroads into an aluminum material of the lead wire 2 , and thus the holding function of the chip portion 1 c for holding the lead wire 2 increases as compared with the embodiment 1 and the embodiment 2. Therefore, the ultrasonic bonding operation can be performed in a state where the chip portion 1 c and the lead wire 2 are more firmly integrated with each other. Moreover, fine unevenness formed in the plurality of concavities 11 also contributes to enhancement of the effect that the holding function of the chip portion 1 c for holding the lead wire 2 during the ultrasonic bonding operation increases.
  • an ultrasonic bonding apparatus having the ultrasonic bonding tool 1 according to the embodiment 3 provides an energy saving effect that the lead wire 2 can be bonded without any trouble on the surface of the glass substrate 3 by performing an ultrasonic bonding operation with less energy.
  • FIG. 9 is a cross-sectional view showing a method for manufacturing the ultrasonic bonding tool 1 according to an embodiment 4. In the following, details of a process for manufacturing the ultrasonic bonding tool 1 will be described with reference to FIG. 9 .
  • a grinding process and a polishing process are performed on the distal planar portion, to increase the flatness of a planar area 8 of the tool original material 7 up to 2 ⁇ m.
  • the planar area 8 has a rectangular shape in a plan view, though not shown.
  • the plurality of concavities 11 are selectively formed in the planar area 8 through a grooving process using wire cutting or a cutting wheel.
  • the plurality of concavities 11 separate the planar area 8 into the plurality of planar portions 10 each still having a flatness of 2 ⁇ m.
  • the chip portion 1 c corresponding to the embodiment 1 which includes the plurality of planar portions 10 and the plurality of concavities 11 is completed.
  • the edge of the outer peripheral portion of the planar area 8 (the plurality of planar portions 10 ) having a rectangular shape is rounded, and the plurality of planar portions 10 a each having fine unevenness in a range that satisfies a flatness of 2 ⁇ m or less are obtained. Consequently, the chip portion 1 c according to the embodiment 3 is obtained.
  • fine unevenness is also formed in each of the plurality of concavities 11 . Accordingly, the fine unevenness formed in the plurality of concavities 11 also provides the effect that the holding function of the chip portion 1 c for holding the lead wire 2 during the ultrasonic bonding operation increases.
  • the ultrasonic bonding tool 1 having the chip portion 1 c according to the embodiment 3 can be obtained.
  • FIG. 10 is an explanatory diagram schematically showing a planar structure with respect to the ultrasonic bonding tool 1 and the lead wire 2 in an ultrasonic bonding method according to an embodiment 5.
  • a width Wc of formation of the planar area of the chip portion 1 c is smaller than a width WL of formation of the lead wire 2 .
  • FIG. 10 schematically shows the chip portion 1 c in which the broken lines indicate the concavities and the rest are the planar portions.
  • a ultrasonic bonding method including the following steps (a) and (b) can be performed by using the ultrasonic bonding tool 1 provided with the chip portion 1 c having the width Wc of formation shown in FIG. 10 .
  • step (a) the lead wire 2 is placed on the surface of the glass substrate 3 .
  • step (b) pressure is applied to the lead wire 2 from the upper side by using the chip portion 1 c of the ultrasonic bonding tool 1 , and additionally ultrasonic vibration is applied thereto so that the lead wire 2 is bonded to the surface of the glass substrate 3 .
  • the width Wc of formation of the chip portion 1 c is set smaller than the width WL of formation of the lead wire 2 .
  • the ultrasonic bonding method according to the embodiment 5 is characterized by allowing the ultrasonic bonding tool 1 to perform the ultrasonic bonding operation while the entire planar area of the chip portion 1 c is within a range of the width WL of formation of the lead wire 2 .
  • the lead wire 2 Since an ultrasonic bonding surface (the planar area of the chip portion 1 c ) is within a range of the width WL of formation of the lead wire 2 , the lead wire 2 inevitably has a blank space 2 e where the plate thickness is not reduced after the ultrasonic bonding operation. This can provide an effect of the strength of the lead wire 2 can be improved.
  • FIG. 11 is an explanatory diagram schematically showing a function for adjusting the position of the lead wire 2 , of a lead wire guide mechanism 21 used in an ultrasonic bonding method according to an embodiment 6 .
  • FIG. 11( a ) is a plan view
  • FIG. 11( b ) is a perspective view.
  • the lead wire guide mechanism 21 is arranged on a transport path of a transport mechanism that places the lead wire 2 at a predetermined position on the surface of the glass substrate 3 .
  • the lead wire guide mechanism 21 can move the lead wire 2 in a widthwise direction D 21 , to thereby control a position where the lead wire 2 is to be arranged relative to the planar area of the chip portion 1 c .
  • FIG. 11 two chip-marked portions 2 c marked by the chip portion 1 c after the ultrasonic bonding operation are shown.
  • Monitor means such as a CCD camera for monitoring a planar positional relationship between the chip portion 1 c and the lead wire 2 is arranged at a portion where the chip portion 1 c and the lead wire 2 are bonded to each other.
  • a monitoring result indicating the planar positional relationship between the chip portion 1 c and the lead wire 2 can be obtained by image processing performed by the monitor means.
  • the lead wire guide mechanism 21 can control the planar position of the lead wire 2 such that the center of the planar area of the chip portion 1 c can be always located in a central portion of the lead wire 2 in a widthwise direction thereof, in other words, such that the entire planar area can fall within the width WL of formation of the lead wire 2 without fail.
  • step (c) the monitor means detects a position of the chip portion 1 c with respect to the widthwise direction of the lead wire 2 .
  • step (d) based on the monitoring result of the step (c), a relative positional relationship between the lead wire 2 and the chip portion 1 c is adjusted by the lead wire guide mechanism 21 , in such a manner that pressure can be applied to the lead wire 2 within the width WL of formation of the lead wire 2 during execution of the step (b) of the embodiment 5 described above.
  • the ultrasonic bonding method according to the embodiment 6 provides an effect that the relative positional relationship between the lead wire 2 and the chip portion 1 c is always adjusted by using the lead wire guide mechanism 21 shown in FIG. 11 , to thereby ensure that the ultrasonic bonding surface can fall within the width WL of formation of the lead wire 2 without fail.
  • FIG. 12 is a cross-sectional view showing a cross-sectional structure of the chip portion 1 c according to an embodiment 7 of the present invention.
  • the chip portion 1 c is formed as a layered structure of a base layer 12 made of a steel material and a front layer 13 made of a super-steel material (such as tungsten carbide).
  • the front layer 13 is formed by brazing the base layer 12 .
  • the super-steel material used for the front layer 13 has a higher hardness and more excellent wearing resistance than those of the steel material used for the base layer 12 .
  • the features of the embodiment 1 shown in FIGS. 1 to 6 are provided.
  • the chip portion 1 c according to the embodiment 7 includes the base layer 12 (first layer) made of a steel material, and the front layer 13 (second layer) made of a super-steel material that has a higher hardness (smaller degree of wear) than that of the steel material, and the front layer 13 serves as a most distal end portion of the chip portion 1 c . This provides an effect that the life of the chip portion 1 c can be extended.
  • FIG. 13 is a cross-sectional view showing a cross-sectional structure of the chip portion 1 c according to an embodiment 8 of the present invention.
  • the chip portion 1 c includes a main part 1 m (first layer) made of a steel material and having the plurality of planar portions 10 and the plurality of concavities 11 , and a DLC (Diamond Like Carbon) film 4 (second layer) formed on the entire surface and a part of a side surface of the main part 1 m .
  • the DLC of the DLC film 4 has a lower affinity for aluminum that is a material of the lead wire 2 .
  • the features of the embodiment 1 shown in FIGS. 1 to 6 are provided.
  • the DLC film 4 having a lower affinity for aluminum that is a material of the lead wire 2 is formed on the surface, and therefore an adhesion of the lead wire 2 to the chip portion 1 c can be suppressed so that the life of the chip portion 1 c can be extended.
  • a single-body structure of the glass substrate 3 is shown as the thin-film base.
  • the present invention is also applicable to a composite structure in which a conductive metal film layer such as a Cr (chromium) or Mo (molybdenum) film layer, a conductive oxide layer such as a ITO, ZnO, or SnO layer, or the like, is laminated on the surface of the glass substrate 3 .
  • the present invention is also applicable to the substrate serving as a thin-film base having the above-described single-body structure or composite structure, as long as the substrate is a thin film having a plate thickness of 2 mm or less.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Wire Bonding (AREA)
  • Apparatuses For Generation Of Mechanical Vibrations (AREA)
US13/379,669 2009-06-23 2009-06-23 Ultrasonic bonding tool, method for manufacturing ultrasonic bonding tool, ultrasonic bonding method, and ultrasonic bonding apparatus Abandoned US20120125520A1 (en)

Applications Claiming Priority (1)

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PCT/JP2009/061384 WO2010150350A1 (ja) 2009-06-23 2009-06-23 超音波接合用ツール、超音波接合用ツールの製造方法、超音波接合方法及び超音波接合装置

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US20140014709A1 (en) * 2011-03-15 2014-01-16 Yazaki Corporation Ultrasonic Jointing Method
US9550252B2 (en) * 2011-03-15 2017-01-24 Yazaki Corporation Ultrasonic jointing method
US11117212B2 (en) 2015-08-26 2021-09-14 Arizona Board Of Regents On Behalf Of Arizona State University Systems and methods for additive manufacturing utilizing localized ultrasound-enhanced material flow and fusioning
EP3341148A4 (en) * 2015-08-26 2019-05-01 Arizona Board of Regents on behalf of Arizona State University SYSTEMS AND METHOD FOR GENERATIVE MANUFACTURE WITH LOCALIZED ULTRASONICALLY IMPROVED MATERIAL CURRENT AND FUSIONING
US10946475B2 (en) 2016-08-04 2021-03-16 Toshiba Mitsubishi-Electric Industrial Systems Corporation Tool for ultrasonic bonding and apparatus for ultrasonic bonding
US20180369953A1 (en) * 2017-06-22 2018-12-27 Nippon Mektron, Ltd. Ultrasonic bonding method, ultrasonic bonding jig, and bonding structure
US10391584B2 (en) * 2017-08-08 2019-08-27 Nippon Mektron, Ltd. Ultrasonic bonding jig, ultrasonic bonding method, and bonding structure
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US20190151983A1 (en) * 2017-11-20 2019-05-23 GM Global Technology Operations LLC Ultrasonic welding/brazing a steel workpiece over aluminum alloys
EP4082709A1 (en) * 2021-04-30 2022-11-02 Infineon Technologies AG Ultrasonic welding device
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EP2446974A4 (en) 2017-07-12
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US10864597B2 (en) 2020-12-15
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