US20100190418A1 - Lapping plate-conditioning grindstone segment, lapping plate-conditioning lapping machine, and method for conditioning lapping plate - Google Patents

Lapping plate-conditioning grindstone segment, lapping plate-conditioning lapping machine, and method for conditioning lapping plate Download PDF

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Publication number
US20100190418A1
US20100190418A1 US12/693,756 US69375610A US2010190418A1 US 20100190418 A1 US20100190418 A1 US 20100190418A1 US 69375610 A US69375610 A US 69375610A US 2010190418 A1 US2010190418 A1 US 2010190418A1
Authority
US
United States
Prior art keywords
conditioning
lapping plate
lapping
grindstone
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/693,756
Other languages
English (en)
Inventor
Kai Yasuoka
Tsuyoshi Shimizu
Kenichi Kazama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinano Electric Refining Co Ltd
Original Assignee
Shinano Electric Refining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinano Electric Refining Co Ltd filed Critical Shinano Electric Refining Co Ltd
Assigned to SHINANO ELECTRIC REFINING CO., LTD. reassignment SHINANO ELECTRIC REFINING CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KAZAMA, KENICHI, SHIMIZU, TSUYOSHI, YASUOKA, KAI
Publication of US20100190418A1 publication Critical patent/US20100190418A1/en
Abandoned legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/013—Application of loose grinding agent as auxiliary tool during truing operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/02—Devices or means for dressing or conditioning abrasive surfaces of plane surfaces on abrasive tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
US12/693,756 2009-01-27 2010-01-26 Lapping plate-conditioning grindstone segment, lapping plate-conditioning lapping machine, and method for conditioning lapping plate Abandoned US20100190418A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2009015517 2009-01-27
JP2009-015517 2009-01-27
JP2009170336A JP2010194704A (ja) 2009-01-27 2009-07-21 定盤修正用砥石、定盤修正用研磨装置及び研磨定盤の修正方法
JP2009-170336 2009-07-21

Publications (1)

Publication Number Publication Date
US20100190418A1 true US20100190418A1 (en) 2010-07-29

Family

ID=42154521

Family Applications (1)

Application Number Title Priority Date Filing Date
US12/693,756 Abandoned US20100190418A1 (en) 2009-01-27 2010-01-26 Lapping plate-conditioning grindstone segment, lapping plate-conditioning lapping machine, and method for conditioning lapping plate

Country Status (6)

Country Link
US (1) US20100190418A1 (ja)
EP (1) EP2210707A3 (ja)
JP (1) JP2010194704A (ja)
KR (1) KR20100087621A (ja)
CN (1) CN101817170A (ja)
TW (1) TW201028246A (ja)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110097979A1 (en) * 2009-10-26 2011-04-28 Illinois Tool Works Inc. Fusion Bonded Epoxy Removal Tool
US20120028546A1 (en) * 2010-07-28 2012-02-02 Siltronic Ag Method and apparatus for trimming the working layers of a double-side grinding apparatus
US20120071064A1 (en) * 2009-06-04 2012-03-22 Sumco Corporation Fixed abrasive-grain processing device, method of fixed abrasive-grain processing, and method for producing semiconductor wafer
USD778247S1 (en) * 2015-04-16 2017-02-07 Veeco Instruments Inc. Wafer carrier with a multi-pocket configuration
USD793972S1 (en) 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 31-pocket configuration
USD793971S1 (en) 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 14-pocket configuration
USD854506S1 (en) 2018-03-26 2019-07-23 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD858469S1 (en) 2018-03-26 2019-09-03 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD860146S1 (en) * 2017-11-30 2019-09-17 Veeco Instruments Inc. Wafer carrier with a 33-pocket configuration
USD860147S1 (en) 2018-03-26 2019-09-17 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD863239S1 (en) 2018-03-26 2019-10-15 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD866491S1 (en) 2018-03-26 2019-11-12 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD893438S1 (en) * 2017-08-21 2020-08-18 Tokyo Electron Limited Wafer boat

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102837077A (zh) * 2012-07-18 2012-12-26 中国人民解放军军事交通学院 齿条滚抛精整加工方法及加工设备
DE102012214998B4 (de) * 2012-08-23 2014-07-24 Siltronic Ag Verfahren zum beidseitigen Bearbeiten einer Halbleiterscheibe
US10518387B2 (en) * 2017-07-18 2019-12-31 Taiwan Semiconductor Manufacturing Co., Ltd. Grinding element, grinding wheel and manufacturing method of semiconductor package using the same
CN113496870B (zh) * 2020-04-03 2022-07-26 重庆超硅半导体有限公司 一种集成电路用硅片边缘形貌控制方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6004196A (en) * 1998-02-27 1999-12-21 Micron Technology, Inc. Polishing pad refurbisher for in situ, real-time conditioning and cleaning of a polishing pad used in chemical-mechanical polishing of microelectronic substrates
US6019670A (en) * 1997-03-10 2000-02-01 Applied Materials, Inc. Method and apparatus for conditioning a polishing pad in a chemical mechanical polishing system
US6254461B1 (en) * 2000-03-15 2001-07-03 International Business Machines Corporation Process of dressing glass disk polishing pads using diamond-coated dressing disks
US6338672B1 (en) * 1998-12-21 2002-01-15 White Hydraulics, Inc. Dressing wheel system
US20070026770A1 (en) * 2005-07-28 2007-02-01 3M Innovative Properties Company Abrasive agglomerate polishing method
US7637802B2 (en) * 2005-09-08 2009-12-29 Shinano Electric Refining Co., Ltd. Lapping plate resurfacing abrasive member and method

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1110522A (ja) 1997-06-20 1999-01-19 Asahi Glass Co Ltd 研磨機用修正キャリヤー
JP2000135666A (ja) 1998-10-29 2000-05-16 Kyocera Corp 定盤修正用治具
JP2000218521A (ja) 1999-01-28 2000-08-08 Toshiba Ceramics Co Ltd 両面研磨用定盤修正キャリア
JP2006297488A (ja) 2005-04-15 2006-11-02 Tsc:Kk 修正キャリア構造

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6019670A (en) * 1997-03-10 2000-02-01 Applied Materials, Inc. Method and apparatus for conditioning a polishing pad in a chemical mechanical polishing system
US6004196A (en) * 1998-02-27 1999-12-21 Micron Technology, Inc. Polishing pad refurbisher for in situ, real-time conditioning and cleaning of a polishing pad used in chemical-mechanical polishing of microelectronic substrates
US6338672B1 (en) * 1998-12-21 2002-01-15 White Hydraulics, Inc. Dressing wheel system
US7101264B2 (en) * 1998-12-21 2006-09-05 White Drive Products, Inc. Dressing wheel system
US6254461B1 (en) * 2000-03-15 2001-07-03 International Business Machines Corporation Process of dressing glass disk polishing pads using diamond-coated dressing disks
US20070026770A1 (en) * 2005-07-28 2007-02-01 3M Innovative Properties Company Abrasive agglomerate polishing method
US7637802B2 (en) * 2005-09-08 2009-12-29 Shinano Electric Refining Co., Ltd. Lapping plate resurfacing abrasive member and method

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120071064A1 (en) * 2009-06-04 2012-03-22 Sumco Corporation Fixed abrasive-grain processing device, method of fixed abrasive-grain processing, and method for producing semiconductor wafer
US9550264B2 (en) * 2009-06-04 2017-01-24 Sumco Corporation Fixed abrasive-grain processing device, method of fixed abrasive-grain processing, and method for producing semiconductor wafer
US20110097979A1 (en) * 2009-10-26 2011-04-28 Illinois Tool Works Inc. Fusion Bonded Epoxy Removal Tool
US20120028546A1 (en) * 2010-07-28 2012-02-02 Siltronic Ag Method and apparatus for trimming the working layers of a double-side grinding apparatus
US8911281B2 (en) * 2010-07-28 2014-12-16 Siltronic Ag Method for trimming the working layers of a double-side grinding apparatus
US8986070B2 (en) 2010-07-28 2015-03-24 Siltronic Ag Method for trimming the working layers of a double-side grinding apparatus
US9011209B2 (en) 2010-07-28 2015-04-21 Siltronic Ag Method and apparatus for trimming the working layers of a double-side grinding apparatus
USD793972S1 (en) 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 31-pocket configuration
USD793971S1 (en) 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 14-pocket configuration
USD852762S1 (en) 2015-03-27 2019-07-02 Veeco Instruments Inc. Wafer carrier with a 14-pocket configuration
USD778247S1 (en) * 2015-04-16 2017-02-07 Veeco Instruments Inc. Wafer carrier with a multi-pocket configuration
USD806046S1 (en) 2015-04-16 2017-12-26 Veeco Instruments Inc. Wafer carrier with a multi-pocket configuration
USD893438S1 (en) * 2017-08-21 2020-08-18 Tokyo Electron Limited Wafer boat
USD860146S1 (en) * 2017-11-30 2019-09-17 Veeco Instruments Inc. Wafer carrier with a 33-pocket configuration
USD854506S1 (en) 2018-03-26 2019-07-23 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD858469S1 (en) 2018-03-26 2019-09-03 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD860147S1 (en) 2018-03-26 2019-09-17 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD863239S1 (en) 2018-03-26 2019-10-15 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD866491S1 (en) 2018-03-26 2019-11-12 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover

Also Published As

Publication number Publication date
CN101817170A (zh) 2010-09-01
JP2010194704A (ja) 2010-09-09
KR20100087621A (ko) 2010-08-05
TW201028246A (en) 2010-08-01
EP2210707A3 (en) 2010-12-29
EP2210707A2 (en) 2010-07-28

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Legal Events

Date Code Title Description
AS Assignment

Owner name: SHINANO ELECTRIC REFINING CO., LTD., JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:YASUOKA, KAI;SHIMIZU, TSUYOSHI;KAZAMA, KENICHI;REEL/FRAME:023867/0294

Effective date: 20091209

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION