US20100050365A1 - Substrate fixture pallet and substrate processor - Google Patents

Substrate fixture pallet and substrate processor Download PDF

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Publication number
US20100050365A1
US20100050365A1 US12/483,641 US48364109A US2010050365A1 US 20100050365 A1 US20100050365 A1 US 20100050365A1 US 48364109 A US48364109 A US 48364109A US 2010050365 A1 US2010050365 A1 US 2010050365A1
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US
United States
Prior art keywords
substrate
fixture pallet
pallet
body part
substrate fixture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/483,641
Other languages
English (en)
Inventor
Tadashi Inoue
Gen MINEMURA
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Assigned to FUJITSU LIMITED reassignment FUJITSU LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MINEMURA, GEN, INOUE, TADASHI
Publication of US20100050365A1 publication Critical patent/US20100050365A1/en
Abandoned legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
    • B23Q11/0042—Devices for removing chips
    • B23Q11/0046—Devices for removing chips by sucking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/01—Means for holding or positioning work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/18—Means for removing cut-out material or waste
    • B26D7/1845—Means for removing cut-out material or waste by non mechanical means
    • B26D7/1863—Means for removing cut-out material or waste by non mechanical means by suction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/0909—Preformed cutting or breaking line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0228—Cutting, sawing, milling or shearing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/082—Suction, e.g. for holding solder balls or components

Definitions

  • a certain aspect of the embodiment discussed herein is related to a substrate fixture pallet and a substrate processor.
  • the multi-board substrate since the multi-board substrate has a rectangular shape and the printed boards have a shape corresponding to the electronic apparatus, the multi-board substrate inevitably includes a frame-shaped unnecessary part (hereinafter referred to as “frame-shaped unnecessary part”) around the printed boards. Therefore, the frame-shaped unnecessary part and the printed boards are separated in mounting the printed boards on electronic apparatuses.
  • frame-shaped unnecessary part a frame-shaped unnecessary part around the printed boards. Therefore, the frame-shaped unnecessary part and the printed boards are separated in mounting the printed boards on electronic apparatuses.
  • the printed boards are separated from the multi-board substrate by forming grooves at peripheral parts to be cut of the printed boards and forming connection parts connecting the printed boards and the frame-shaped unnecessary part at some points in the peripheral parts. Then, after automatically mounting electronic components on each of the printed boards formed in the rectangularly-shaped multi-board substrate, the connection parts are removed at the time of mounting the printed boards on electronic apparatuses such as cellular phones. As a result, the printed boards are separated from the frame-shaped unnecessary part into pieces to be mounted on electronic apparatuses.
  • connection parts include: (a) breaking connection parts by manual operations; (b) removing connection parts with a press using a mold and a jig for cutting; and (c) cutting connection parts with a router bit.
  • connection parts are cut with a router bit, so that cutting powder that becomes dust is generated.
  • this cutting powder is suctioned through a dust collecting duct so as to prevent the cutting powder from adhering to printed boards or the substrate fixture pallet.
  • a substrate fixture pallet includes a body part configured to receive a substrate to be processed and a lid part attached movably to the body part so as to fix the substrate when closed relative to the body part, the lid part being configured to form a gap between the body part and the lid part when closed relative to the body part so as to allow a suction air of a dust collector for suctioning a cutting powder to be generated at a time of processing the substrate to flow through the gap when the substrate fixture pallet is attached to the dust collector.
  • FIG. 1 is a diagram illustrating a substrate processor according to an embodiment
  • FIGS. 2A , 2 B, and 2 C are a plan view, a front view, and a right side view, respectively, of a substrate fixture pallet according to the embodiment;
  • FIG. 3 is a bottom view of the substrate fixture pallet according to the embodiment.
  • FIG. 4 is an enlarged view of a dust collector and its neighborhood in the substrate processor according to the embodiment.
  • FIG. 5 is a plan view of an object to be processed by the substrate processor according to the embodiment.
  • FIG. 6 is a diagram illustrating the cutting of a connection part with a router bit according to the embodiment
  • FIG. 8 is an enlarged view of a dust collector and its neighborhood in a substrate processor according to a variation of the embodiment.
  • the cutting powder generated by cutting connection parts with a router bit at the time of separating printed boards and the frame-shaped unnecessary part using the router bit method may be suctioned through a dust collecting duct so as to prevent the cutting powder from adhering to printed boards or the substrate fixture pallet.
  • the substrate fixture pallet has a single flat bottom surface and is provided on the placement table of the substrate processor (over the dust collecting duct), so that there is a problem in that the cutting power enters the space between the bottom surface of the substrate fixture pallet and the placement table of the substrate processor so as to adhere to the bottom surface of the substrate fixture pallet when the cutting power is suctioned through the dust collecting duct.
  • FIG. 1 is a diagram illustrating a substrate fixture pallet 20 A and a substrate processor 1 to which the substrate fixture pallet 20 A is attached according to the embodiment.
  • FIGS. 2A , 2 B, and 2 C and FIG. 3 are enlarged views of the substrate fixture pallet 20 A.
  • FIG. 5 is a diagram illustrating a configuration of the multi-board substrate 40 .
  • the multi-board substrate 40 has multiple (three in this embodiment) printed (circuit) boards 41 formed therein. Electronic devices and the like are pre-mounted on each printed board 41 in a separate process.
  • the multi-board substrate 40 has a predetermined rectangular shape in order to enable automated mounting of these electronic devices. While the multi-board substrate 40 thus has a rectangular shape, the printed boards 41 have a shape corresponding to an electronic apparatus. Therefore, the multi-board substrate 40 inevitably includes a frame-shaped unnecessary part 44 around the printed boards 41 .
  • Separation grooves 43 are formed around the printed boards 41 at the boundary between the printed boards 41 and the frame-shaped unnecessary part 44 . These separation grooves 43 are not formed entirely around the periphery of the printed boards 41 , and are discontinued or separated by connection parts 42 . That is, the printed boards 41 are connected to the frame-shaped unnecessary part 44 through the connection parts 42 . These connection parts 42 have enough strength to prevent the printed boards 41 from being detached from the frame-shaped unnecessary part 44 at the time of mounting electronic devices on the printed boards 41 .
  • the substrate processor 1 includes a base 2 , a processor body 3 , a dust collector 4 A, a suction unit 10 , and a controller 12 .
  • the processor body 3 includes a router head 5 , the router bit 6 , and a router mover 7 .
  • the router head 5 has a motor (not graphically illustrated) provided inside, and the router bit 6 is provided at the lower end of the rotational shaft of the motor. Therefore, the router bit 6 is rotated by the router head 5 .
  • This motor is connected to a router controller 13 , which is connected to the controller 12 .
  • the router mover 7 supports the router head 5 and moves the router head 5 three-dimensionally.
  • a drive part for moving the router head 5 is provided inside the router mover 7 .
  • Examples of the drive part include a motor, an air cylinder, and an oil-hydraulic cylinder. According to this embodiment, the router head 5 is moved using a motor.
  • the motor provided in the router head 5 is connected to the controller 12 through the router controller 13 . Further, the motor provided in the router mover 7 is connected to the controller 12 through a mover controller 14 .
  • the controller 12 performs general control of the overall operation of the substrate processor 1 . Data on the shape of the multi-board substrate 40 (including data on the positions of the connection parts 42 and data on the positions of the separation grooves 43 ) are prestored in the controller 12 .
  • the controller 12 drives and controls the router controller 13 and the mover controller 14 based on these shape data.
  • the dust collector 4 A includes an attachment table 8 , a dust collecting nozzle 9 , and the suction unit 10 .
  • the substrate fixture pallet 20 A described below is attached to the upper side of the attachment table 8 .
  • This attachment table 8 is provided at the upper end of the dust collecting nozzle 9 .
  • This dust collecting nozzle 9 has a substantially quadrangular pyramid shape and is open at its upper end in FIG. 1 . Further, the lower end of the dust collecting nozzle 9 is connected to a duct 11 . Referring to FIG. 4 , an opening 8 a is formed in the attachment table 8 .
  • the opening 8 a and the upper end of the dust collecting nozzle 9 communicate with each other.
  • the duct 11 extends rightward along the base 2 to be connected to the suction unit 10 . Therefore, by driving the suction unit 10 , the cutting powder generated at the time of cutting the connection parts 42 with the router bit 6 is suctioned and removed through the dust collecting nozzle 9 . Further, the suction unit 10 is connected to the controller 12 to be driven and controlled by the controller 12 . A description is given below of a specific route through which the cutting powder is removed inside the substrate fixture pallet 20 A.
  • FIGS. 2A through 2C , FIG. 3 , and FIG. 7 are a plan view, a front view, and a right side view, respectively, of the substrate fixture pallet 20 A.
  • FIG. 3 is a bottom view of the substrate fixture pallet 20 A.
  • FIG. 7 is a schematic perspective view of the substrate fixture pallet 20 A in an open state.
  • the substrate fixture pallet 20 A includes a pallet body 21 and a lid body 22 .
  • the pallet body 21 and the lid body 22 are connected with hinges 23 so that the lid body 22 is openable and closable relative to the pallet body 21 .
  • the lid body 22 has magnets 27 provided on a side opposite to the side on which the hinges 23 are provided.
  • This lid body 22 is configured to cover the entire upper surface of the multi-board substrate 40 so as to not only fix the multi-board substrate 40 but also serve as a protective cover for the multi-board substrate 40 .
  • magnets 27 are attachable through magnetic attraction to corresponding fixation parts (not graphically illustrated) formed of a magnetic material and provided on the pallet body 21 . This causes the lid body 22 to be fixed to the pallet body 21 through the magnetic attraction (force) of the magnets 27 . Further, the lid body 22 may be made open relative to the pallet body 21 by urging the lid body 22 in a direction to open the lid body 22 with a force greater than the magnetic force of the magnets 27 .
  • FIG. 2A illustrates the substrate fixture pallet 20 A in a closed state, where the multi-board substrate 40 (indicated by a one-dot chain line in FIG. 2A ) is attached onto the pallet body 21 with the lid body 22 closed.
  • Multiple recesses 24 and 25 are formed in the pallet body 21 so as to correspond to the printed boards 41 formed in the multi-board substrate 40 .
  • the electronic devices mounted on the printed boards 41 project from their surfaces, but are accommodated in the recesses 24 and 25 . This ensures the containing of the multi-board substrate 40 inside the substrate fixture pallet 20 A.
  • the gap 29 forms a passage or channel for the suctioned air.
  • the size (vertical dimension) of the gap 29 is determined so as to be larger in size than the cutting powder (particles) generated at the time of cutting the connection parts 42 with the router bit 6 . This allows the cutting powder generated on the upper side of the substrate fixture pallet 20 A to be suctioned.
  • the multi-board substrate 40 is omitted in FIG. 4 .
  • communication holes 26 are formed through the pallet body 21 at predetermined positions (positions inside the recesses 25 in this embodiment) in the pallet body 21 . Therefore, the communication holes 26 are open on a bottom surface 37 of the pallet body 21 as illustrated in FIG. 3 .
  • the communication holes 26 are provided so that the dust collection nozzle 9 communicates with the inside of the substrate fixture pallet 20 A through the communication holes 26 when the substrate fixture pallet 20 A is attached to the attachment table 8 .
  • body grip parts 31 are provided on both sides (right and left sides in FIG. 2A ) of the pallet body 21 . These body grip parts 31 are used when the substrate fixture pallet 20 A is attached to or detached from the attachment table 8 .
  • lid body grip parts 32 are provided on both sides (right and left sides in FIG. 2A ) of the lid body 22 . These lid body grip parts 32 are used when the lid body 22 is being opened or closed.
  • the air passages 38 are configured to form gaps of 0.2 mm to 1.0 mm in height (vertical dimension) relative to the surface of the attachment table 8 when the substrate fixture pallet 20 A is attached to the attachment table 8 . These gaps (intervals) are larger than the size of the cutting powder (particles) generated at the time of cutting the connection parts 42 with the router bit 6 . Further, the lengths or longitudinal dimensions of the air passages 38 may be set to any values as long as the leg parts 36 maintain enough strength.
  • each side of the substrate fixture pallet 20 A is provided with one air passage 38 .
  • the air passage 38 of each side may be divided so as to have multiple air passages 38 on each side.
  • the air passages 38 have a cross-sectional shape that is uniform in height relative to the upper surface of the attachment table 8 as illustrated in FIG. 4 .
  • any of the air passages 38 may have an inclined upper surface so as to increase or decrease its passage area toward inside from outside.
  • the substrate fixture pallet 20 A having the multi-board substrate 40 attached thereto is attached to the substrate processor 1 .
  • the controller 12 activates the router head 5 through the router controller 13 to cause the router bit 6 to rotate, while driving the router mover 7 through the mover controller 14 to start cutting the connection parts 42 of the multi-board substrate 40 with the router bit 6 .
  • the controller 12 also activates the suction unit 10 to start suctioning cutting powder from the dust collecting nozzle 9 through the duct 11 .
  • FIG. 6 is an enlarged view illustrating the router bit 6 thus inserted into the adjacent (corresponding) separation groove 43 .
  • the controller 12 controls the router mover 7 so as to move the router bit 6 in the direction indicated by arrow in FIG. 6 .
  • the connection part 42 (to be removed) formed in the multi-board substrate 40 is cut by the router bit 6 .
  • the controller 12 controls the driving of the router mover 7 so as to perform this cutting operation on each connection part 42 .
  • the multiple (three in this embodiment) printed boards 41 are separated from the frame-shaped unnecessary part 44 .
  • the printed boards 41 and the frame-shaped unnecessary part 44 remain fixed and are prevented from moving inside the substrate fixture pallet 20 A.
  • cutting powder that becomes dust is generated.
  • This cutting powder is carried by the suction air generated by the driving of the suction unit 10 so as to be suctioned from the dust collecting nozzle 9 to the suction unit 10 through the duct 11 to be discharged from a discharge unit (not graphically illustrated).
  • the spacer projections 28 are provided so that the gap 29 is formed between the pallet body 21 and the lid body 22 when the substrate fixture pallet 20 A is in a closed state as described above.
  • the height (vertical dimension) of this gap 29 is determined to be larger than the shape (size) of the cutting powder (particles) generated at the time of cutting the connection parts 42 .
  • the gap 29 is connected to the outside air on its outer side and is connected to the dust collecting nozzle 9 through the communication holes 26 formed in the pallet body 21 and the opening 8 a formed in the attachment table 8 on its inner side. Therefore, the suction air generated by the driving of the suction unit 10 serves as an influx route into the dust collecting nozzle 9 through the gap 29 , the communication holes 26 , and the opening 8 a. (This flow of suction air is indicated by broken arrows in FIG. 4 .)
  • the communication holes 26 may also serve as a communication path connecting the gap 29 and the air passages 38 .
  • the air passages 38 are connected to the outside air on their outer sides and are connected to the dust collecting nozzle 9 through the opening 8 a formed in the attachment table 8 on their inner sides. Accordingly, the suction air generated by the driving of the suction unit 10 serves as an influx route into the dust collecting nozzle 9 through the air passages 38 and the opening 8 a. (This flow of suction air is indicated by solid arrows in FIG. 4 .)
  • the cutting powder generated during the cutting of the connection parts 42 with the router bit 6 is prevented from remaining in or on the substrate fixture pallet 20 A.
  • FIG. 8 illustrates a variation according to this embodiment.
  • FIG. 8 is an enlarged view of part of a dust collector 4 B and its neighborhood in a substrate processor.
  • the same elements as those illustrated in FIG. 1 through FIG. 7 are referred to by the same reference numerals, and a description thereof is omitted where appropriate.
  • the air passages 38 are provided by forming grooves in the pallet body 21 of the substrate fixture pallet 20 A, thereby causing suction air to flow on the bottom surface 37 side of the pallet body 21 as well so as to prevent cutting powder from adhering to the bottom surface 37 of the pallet body 21 .
  • passage spacers 45 are provided on the upper surface of the attachment table 8 . Further, unlike in the substrate fixture pallet 20 A illustrated in FIGS. 2A through 4 , no grooves forming the air passages 38 are formed in a substrate fixture pallet 20 B employed in this variation.
  • the substrate fixture pallet 20 B is attached on top of the passage spacers 45 provided on the attachment table 8 . That is, when the substrate fixture pallet 20 B is attached to the attachment table 8 , the substrate fixture pallet 20 B is placed on the passage spacers 45 .
  • the (upper) surface of the attachment table 8 and the bottom surface of the substrate fixture pallet 20 B are spaced apart from each other, so that the space between the surface of the attachment table 8 and the bottom surface of the substrate fixture pallet 20 B serves as an air passage 48 where suction air flows.
  • the height (vertical dimension) of this air passage 48 or the distance or interval between the surface of the attachment table 8 and the bottom surface of the substrate fixture pallet 20 B, is determined to be larger than the shape (size) of the cutting powder (particles) generated at the time of cutting the connection parts 42 as in the case of the above-described air passages 38 .
  • the air passage 48 is connected to the outside air on its outer side and is connected to the dust collecting nozzle 9 through the opening 8 a formed in the attachment table 8 on its inner side. Therefore, the suction air generated by the driving of the suction unit 10 serves as an influx route into the dust collecting nozzle 9 through the air passage 48 and the opening 8 a. (This flow of suction air is indicated by solid arrows in FIG. 8 .)

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Auxiliary Devices For Machine Tools (AREA)
US12/483,641 2008-08-28 2009-06-12 Substrate fixture pallet and substrate processor Abandoned US20100050365A1 (en)

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Application Number Priority Date Filing Date Title
JP2008220172A JP5380956B2 (ja) 2008-08-28 2008-08-28 基板固定パレット及び基板加工装置
JP2008-220172 2008-08-28

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2482625A3 (de) * 2011-01-26 2012-08-29 GAS - Automation GmbH Leiterplattentrenneinrichtung
US20140271004A1 (en) * 2013-03-12 2014-09-18 Christopher R. Bialy Drilling safety system
CN104168713A (zh) * 2013-05-20 2014-11-26 北大方正集团有限公司 印制线路板的锣板方法
JP2016111278A (ja) * 2014-12-10 2016-06-20 日立オートモティブシステムズ株式会社 配線基板の製造方法および配線基板の製造装置
DE102021119691A1 (de) 2021-07-29 2023-02-02 Voith Patent Gmbh Staubabsaugung am Rollenschneider
WO2023107993A1 (en) * 2021-12-07 2023-06-15 Jabil Inc. Pcba router test vehicle

Families Citing this family (2)

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Publication number Priority date Publication date Assignee Title
JP6342777B2 (ja) * 2014-10-09 2018-06-13 株式会社ケーヒン 基板切断装置の運転方法及び基板切断装置
JP6884425B2 (ja) * 2019-08-01 2021-06-09 株式会社竹原理研 基板分割装置

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JPH079397A (ja) * 1993-06-29 1995-01-13 Sayaka:Kk プリント基板の切断方法及びその装置
JPH09309098A (ja) * 1996-05-24 1997-12-02 Fujitsu Ten Ltd プリント基板分割装置
JP2002036182A (ja) * 2000-07-18 2002-02-05 Denso Corp プリント基板分割装置
JP2003300196A (ja) * 2002-04-03 2003-10-21 Roland Dg Corp プリント基板の分割装置における集塵機構

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JPH11197928A (ja) * 1998-01-05 1999-07-27 Sony Corp 切削方法及び装置
JP2001156423A (ja) * 1999-11-30 2001-06-08 Icom Inc プリント基板分割装置
JP2007044830A (ja) * 2005-08-11 2007-02-22 Seiko Epson Corp シート基板保持治具

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH079397A (ja) * 1993-06-29 1995-01-13 Sayaka:Kk プリント基板の切断方法及びその装置
JPH09309098A (ja) * 1996-05-24 1997-12-02 Fujitsu Ten Ltd プリント基板分割装置
JP2002036182A (ja) * 2000-07-18 2002-02-05 Denso Corp プリント基板分割装置
JP2003300196A (ja) * 2002-04-03 2003-10-21 Roland Dg Corp プリント基板の分割装置における集塵機構

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2482625A3 (de) * 2011-01-26 2012-08-29 GAS - Automation GmbH Leiterplattentrenneinrichtung
US20140271004A1 (en) * 2013-03-12 2014-09-18 Christopher R. Bialy Drilling safety system
US9849553B2 (en) * 2013-03-12 2017-12-26 Christopher R. Bialy Drilling safety system
CN104168713A (zh) * 2013-05-20 2014-11-26 北大方正集团有限公司 印制线路板的锣板方法
JP2016111278A (ja) * 2014-12-10 2016-06-20 日立オートモティブシステムズ株式会社 配線基板の製造方法および配線基板の製造装置
DE102021119691A1 (de) 2021-07-29 2023-02-02 Voith Patent Gmbh Staubabsaugung am Rollenschneider
WO2023107993A1 (en) * 2021-12-07 2023-06-15 Jabil Inc. Pcba router test vehicle

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JP2010052097A (ja) 2010-03-11

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