US20070222384A1 - Organic light-emitting device, and method for manufacturing organic light-emitting device - Google Patents

Organic light-emitting device, and method for manufacturing organic light-emitting device Download PDF

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Publication number
US20070222384A1
US20070222384A1 US11/686,824 US68682407A US2007222384A1 US 20070222384 A1 US20070222384 A1 US 20070222384A1 US 68682407 A US68682407 A US 68682407A US 2007222384 A1 US2007222384 A1 US 2007222384A1
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United States
Prior art keywords
organic light
covering member
emitting element
emitting device
covering
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
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US11/686,824
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English (en)
Inventor
Issei Yonemoto
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Canon Inc
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Canon Inc
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Application filed by Canon Inc filed Critical Canon Inc
Assigned to CANON KABUSHIKI KAISHA reassignment CANON KABUSHIKI KAISHA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: YONEMOTO, ISSEI
Publication of US20070222384A1 publication Critical patent/US20070222384A1/en
Priority to US12/782,257 priority Critical patent/US8272913B2/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/841—Self-supporting sealing arrangements

Definitions

  • the present invention relates to an organic light-emitting device having an organic light-emitting element covered with a covering member, and a method for manufacturing the organic light-emitting device.
  • an organic light-emitting element (organic electroluminescence element) is covered with a covering member such as glass, a metal, a resin and a polarizing plate, in order to prevent the organic light-emitting element from deteriorating affected by water or oxygen.
  • Another technology which double-dampproofs an organic electroluminescence element with the use of a hollow structure obtained by etching a glass sealing plate, applying an adhesive onto the back face, bonding the above described glass sealing plate as a covering member to a substrate to seal the inner part, and then placing an adhesive again at the joined perimeter of the glass sealing plate (Japanese Patent Application Laid-Open No. 2000-208251). Further, an organic electroluminescence panel is known in which a notch with a chamfered corner is formed on a sealing glass plate for sealing the organic electroluminescence element so as not to damage a flexible wiring board to be placed thereon (Japanese Patent Application Laid-Open No. 2004-234938).
  • Organic electroluminescence display devices according to U.S. Pat. No. 5,194,027 and Japanese Patent Application Laid-Open No. 2000-208251 have a problem that a perimeter of the covering member is damaged or partially peeled off from a periphery thereof by a large external peeling force acted on a corner of the covering member, which is caused by a water pressure in a cleaning step or a physical impact force after an organic electroluminescence element is covered with the covering member.
  • the organic electroluminescence display devices also have a problem that the step of applying a large amount of the adhesive to the perimeter of the covering member and then removing an excessive adhesive with a squeegee leads to a high material cost and a high apparatus cost.
  • the organic electroluminescence display devices When applying an adhesive to a perimeter of a covering member with a high accuracy by using a dispenser, it is necessary, for instance, to set a dispenser needle diagonally to the perimeter so that the dispenser needle may not contact with the covering member. Consequently the organic electroluminescence display devices further have a problem that a robot-moving mechanism becomes complicated in order to adjust an angle of the dispenser needle and rotate the dispenser needle, whereby an apparatus cost increases.
  • the present invention provides an organic light-emitting device which can prevent damage, peeling-off, and the like of a covering member, and which can be manufactured with excellent productivity and cost performance; and a method of manufacturing the organic light-emitting device.
  • the present invention provides a method of manufacturing an organic light-emitting device which includes a substrate; an organic light-emitting element arranged on the substrate and including a pair of electrodes and an organic compound layer formed between the pair of the electrodes; a covering member arranged on the organic light-emitting element, for covering the organic light-emitting element; and an adhesive member for adhering an end of the covering member and an end of the substrate, the method including: a step of arranging, on the organic light-emitting element, the covering member having a chamfer formed on a side of one face thereof so that a face of the covering member on a reverse side to the one face faces to a side of the organic light-emitting element; and a step of adhering a side part of the covering member and a face of the substrate on a side of the covering member by dripping the adhesive member to the chamfer from above of the one face.
  • An organic light-emitting device includes: a substrate; an organic light-emitting element formed on the substrate, and including a pair of electrodes and an organic compound layer formed between the pair of the electrodes; a covering member arranged on the organic light-emitting element, for covering the organic light-emitting element, the covering member having a chamfer formed on a side of a face thereof on a reverse side to the organic light-emitting element; and an adhesive member for adhering the substrate and the covering member by adhering a side part of the covering member and a face of the substrate on a side of the covering member.
  • the chamfer is formed on the end of the top face of a covering member. Therefore, the manufactured organic light-emitting device can prevent damage, peeling-off, and the like of the covering member because even when the covering member receives a water pressure in a cleaning step and a physical impact force after an organic light-emitting element has been covered with the covering member, the water pressure and the physical impact force do not act on the covering member as an external peeling force.
  • the covering member can be placed on an intended position because the adhesive member attached to the chamfer naturally flows down toward the substrate only by covering the organic light-emitting element with the covering member and dripping the adhesive member on the chamfer formed on the side of a face of the covering member on a reverse side to the organic light-emitting element. Accordingly, the manufacturing method shows excellent productivity and cost performance because the method enables the organic light-emitting element to be easily and reliably covered with the covering member without using a high-precision dispenser device for an operation of covering the organic light-emitting element and without removing an excessive adhesive member by a squeegee.
  • FIG. 1A is a schematic cross-sectional view illustrating an organic light-emitting device and a method of manufacturing the organic light-emitting device, in Embodiment 1 (Example 1) according to the present invention.
  • FIG. 1B is an enlarged view of a chamfer.
  • FIG. 1C is a plan view of FIG. 1A .
  • FIG. 2 is a schematic cross-sectional view illustrating an organic light-emitting device and a method for manufacturing the organic light-emitting device, in Embodiment 2 (Example 2) according to the present invention.
  • FIG. 3 is a schematic cross-sectional view illustrating an organic light-emitting device and a method for manufacturing the organic light-emitting device, in Embodiment 3 (Example 3) according to the present invention.
  • FIG. 4 is a schematic cross-sectional view illustrating an organic light-emitting device and a method for manufacturing the organic light-emitting device, in Embodiment 4 (Example 4) according to the present invention.
  • FIG. 5 is a schematic cross-sectional view illustrating a conventional organic light-emitting device and a conventional method for manufacturing the organic light-emitting device.
  • FIG. 6 is a schematic cross-sectional view illustrating a conventional organic light-emitting device and a conventional method for manufacturing the organic light-emitting device.
  • FIG. 7 is a schematic cross-sectional view illustrating a conventional organic light-emitting device and a conventional method for manufacturing the organic light-emitting device.
  • FIG. 1A is a schematic cross-sectional view illustrating an organic light-emitting device and a method of manufacturing the organic light-emitting device, in Embodiment 1 according to the present invention.
  • FIG. 1B is an enlarged view of a chamfer.
  • FIG. 1C is a plan view of FIG. 1A .
  • An organic light-emitting device shown in FIGS. 1A to 1 C has an organic light-emitting element (organic electroluminescence element) 2 , an intermediate layer 3 which is formed so as to cover the organic light-emitting element 2 , and a covering member (flat glass plate) 4 which is formed on the upper face of the intermediate layer 3 as a so-called sealing plate, sequentially aligned and fixed on the upper face of a substrate 1 such as a glass plate.
  • the organic light-emitting element 2 has a structure having a first electrode (not shown), an organic compound layer (not shown) and a second electrode (not shown).
  • the organic light-emitting device has an insulation layer 5 and a drawing wiring 6 as shown in FIG. 1C , in other words, has a structure fundamentally similar to a conventional organic light-emitting device.
  • the covering member 4 is made from glass, a resin, a metal or the like, and has a chamfer 7 formed on a side of a face (end of upper face) of the covering member 4 on a reverse side to the organic light-emitting element (cf. FIG. 1B ).
  • the covering member 4 receives a water pressure at the time of shower cleaning or jet cleaning in a cleaning step after covering the organic light-emitting element 2 with the covering member, and normally the water pressure acts on the corner of the covering member as an external peeling force for peeling the covering member 4 .
  • the covering member 4 according to the present invention does not receive the external peeling force because of the shape effect of a chamfer 7 formed on an end of the upper face, and can prevent itself from being damaged and peeled off.
  • a chamfer 7 is formed by using a total mold grind stone in the step of cutting the covering member 4 into a predetermined shape, or by polishing an end thereof after having cut a glass plate (not shown).
  • the covering member 4 is made of a resin, it is easily formed into a mold shape by using a molding technique (not shown).
  • the chamfer 7 can have a chamfered angle ⁇ in a range of 30 to 60 degrees.
  • the chamfer 7 has a round shape, an effect in the present invention can be expected in particular.
  • the chamfer 7 can have the shape with the angle ⁇ of 45 degrees because the shape can be economically formed, and the effect of the present invention is obtained.
  • a normal dispenser device (not shown) has an XYZ shaft robot (not shown) for controlling a position of a dispenser needle 8 , and the position accuracy is about ⁇ 0.2 mm. Accordingly, when a chamfered length (L) of a chamfer 7 on a covering member 4 , which indicates the horizontal length of a chamfered portion of the cover member as shown in FIG. 1B , is set to 0.2 mm or more, an adhesive member 9 as a sealing agent ejected from the vertically downward-directing dispenser needle 8 can be dripped on a chamfer 7 even when the center position of ejection of the dispenser is deviated from the intended position.
  • the dispenser device can reliably drop the adhesive member 9 onto the chamfer 7 of the covering member 4 within an accuracy of the XYZ shaft robot itself.
  • the dispenser device goes around a perimeter of the covering member 4 on a substrate 1 while the position is controlled by the XYZ shaft robot, and the ejecting step of the dispenser needle 8 is completed.
  • an organic light-emitting element 2 is sealed at the perimeters by the covering member 4 and the adhesive member 9 so as not cause leakage (cf. FIG. 1C ).
  • the adhesive member 9 can be such a material as to easily flow down on the chamfer 7 of the covering member 4 and be quickly hardened without giving damage to the organic light-emitting element 2 after having been placed at the intended position.
  • the adhesive member 9 can be an epoxy resin having a viscosity, for instance, of 40,000 ⁇ 10,000 (mPa ⁇ s).
  • an adhesive member 9 can be placed at an intended position merely by covering an organic light-emitting element 2 with a covering member, and applying the adhesive member 9 onto the chamfer 7 which has been formed on a side of a face (end of a upper face) of the covering member 4 on a reverse side to the organic light-emitting element side. Accordingly, the above-described method shows excellent productivity and cost performance, because the method enables the organic light-emitting element 2 to be easily and reliably covered with the covering member, without using a high-precision dispenser device for an operation of covering the organic light-emitting element 2 or without removing an excessive adhesive member by a squeegee.
  • FIG. 2 is a schematic cross-sectional view illustrating an organic light-emitting device and the method of manufacturing the organic light-emitting device, in Embodiment 2 according to the present invention.
  • An organic light-emitting device shown in FIG. 2 has an organic light-emitting element 2 which is covered with a covering member 10 made of an etched covering glass plate.
  • the lower face side of the glass plate is etched except the outer edge.
  • a chamfer 7 is formed on an end of the upper face reverse to the etched face. Accordingly, the covering member 10 does not receive a peeling force by the shape effect, and can prevent itself from being damaged and peeled off.
  • an adhesive member 9 as a sealing agent can be placed at an intended position by dripping on the chamfer 7 the adhesive member ejected from a vertically downward-directing dispenser needle 8 , and allowing the adhesive member 9 dripped on the chamfer 7 to flow down along a slope of the chamfer 7 , even when the center position of ejection of the dispenser is deviated from the intended position. Accordingly, the organic light-emitting device can be manufactured with excellent productivity and cost performance, because the organic light-emitting element 2 can be easily and reliably covered with a covering member, without using a high-precision dispenser device for an operation of covering the organic light-emitting element 2 or without removing an excessive adhesive member by a squeegee.
  • FIG. 3 is a schematic cross-sectional view illustrating an organic light-emitting device and the method of manufacturing the organic light-emitting device, in Embodiment 3 according to the present invention.
  • An organic light-emitting device shown in FIG. 3 has an organic light-emitting element 2 covered with a covering member 11 formed of a polarizing plate made of a PVA resin, and a chamfer 7 is formed on an end of the upper face of the covering member 11 . Therefore, the covering member 11 also does not receive an external peeling force by the shape effect, and can prevent itself from being damaged and peeled off.
  • an adhesive member 9 as a sealing agent can be placed at an intended position by dripping the adhesive member ejected from a vertically downward-directing dispenser needle 8 on the chamfer 7 , and allowing the adhesive member 9 dripped on the chamfer 7 to flow down along a slope of the chamfer 7 even when the center position of ejection of the dispenser is deviated from the intended position. Accordingly, the organic light-emitting device can be manufactured with excellent productivity and cost performance, because the organic light-emitting element 2 can be easily and reliably covered with a covering member, without using a high-precision dispenser device in an operation of covering the organic light-emitting element 2 or without removing an excessive adhesive member by a squeegee.
  • FIG. 4 is a schematic cross-sectional view illustrating an organic light-emitting device and the method of manufacturing the organic light-emitting device, in Embodiment 4 according to the present invention.
  • An organic light-emitting device shown in FIG. 4 has an organic light-emitting element 2 covered with a covering member 12 formed of a flat covering glass plate, and a rounded chamfer 7 is formed on an end of the upper face of the covering member 12 . Therefore, the covering member 12 also does not receive an external peeling force by the shape effect, and can prevent itself from being damaged and peeled off.
  • an adhesive member 9 as a sealing agent can be placed at an intended position by dripping the adhesive member ejected from a vertically downward-directing dispenser needle 8 on the chamfer 7 , and allowing the adhesive member 9 dripped on the chamfer 7 to flow down along a slope of the chamfer 7 even when the center position of ejection of the dispenser is deviated from the intended position. Accordingly, the organic light-emitting device can be manufactured with excellent productivity and cost performance, because the organic light-emitting element 2 can be easily and reliably covered with a covering member, without using a high-precision dispenser device in an operation of covering the organic light-emitting element 2 or without removing an excessive adhesive member by a squeegee.
  • a covering member 4 is expressed as a protective member in other words, and the material also can be widely selected. It is possible to employ a form in which a polarizing plate having a chamfer is further adhered as the covering member onto the upper face of a covering glass plate provided with the chamfer (not shown), and furthermore, an adhesive member may not be applied to the periphery of the polarizing plate having the chamfer (not shown).
  • an adhesive member 9 is continuously placed on all perimeters, namely, on four peripheral sides of the covering member as a so-called sealing agent, but the adhesive member 9 may also be partially placed at the perimeter of the covering member only for the purpose of adhering the covering member to a substrate.
  • a covering member 4 employed in the present example was formed of a flat covering glass plate with a size of 35 mm ⁇ 40 mm and a thickness of 0.6 mm, and had a chamfer 7 with a chamfered length of 0.6 mm and a chamfered angle of 45 degrees formed on an end of the top face of the covering member 4 (cf. FIG. 1 ).
  • a step of covering an organic light-emitting element will be now described below.
  • the organic light-emitting element 2 , an intermediate layer 3 and a covering member 4 were sequentially aligned and fixed on a substrate 1 with a size of 40 mm ⁇ 50 mm and a thickness of 0.6 mm.
  • the adhesive member 9 was ejected to all the perimeters of the above-described covering member 4 by a dispenser needle 8 .
  • the adhesive member 9 which had been dripped on a chamfer 7 of the covering member 4 flowed downward and was placed at the perimeters of the intermediate layer 3 and the covering member 4 with high accuracy.
  • a covering member 10 employed in the present example was formed of an etched covering glass plate with a size of 35 mm ⁇ 40 mm and a thickness of 1.0 mm (cf. FIG. 2 ).
  • a bottom side of the covering member 10 was etched in a depth of 0.4 mm except for a frame (base to be adhered) with the width of 1 mm prepared in the perimeter.
  • a chamfer 7 with a chamfered angle of 45 degrees was formed on an end of the upper face reverse to the etched face.
  • the organic light-emitting element 2 was formed on a substrate 1 with a size of 40 mm ⁇ 50 mm and a thickness of 0.6 mm. Subsequently, a sealing material 13 was ejected to a position on which a base to be adhered of a covering member 10 was placed on the substrate 1 , by a normal dispenser device (not shown) having a position accuracy of ⁇ 0.2 mm. The covering member 10 was then aligned on the above-described substrate 1 , closely contacted with it, and adhered to the substrate 1 by the sandwiched sealing material 13 .
  • an adhesive member 9 was ejected to all the perimeters of the covering member 10 on the substrate 1 by a dispenser needle 8 , similarly to the case of Example 1.
  • the adhesive member 9 which had been dripped on a chamfer 7 of the covering member 10 flowed downward, and was placed at a perimeter of the covering member 10 with high accuracy.
  • a sealed space 14 was formed.
  • a covering member 11 employed in the present example was formed of a polarizing plate made from a PVA resin with a size of 35 mm ⁇ 40 mm and a thickness of 0.3 mm, and had a chamfer 7 with a chamfered angle of 45 degrees formed on an end of the upper face (cf. FIG. 3 ).
  • a step of covering an organic light-emitting element will be now described below.
  • the organic light-emitting element 2 , an intermediate layer 3 and a covering member 11 were sequentially aligned and fixed on a substrate 1 with a size of 40 mm ⁇ 50 mm and a thickness of 0.6 mm.
  • an adhesive member 9 was ejected to all the perimeters of the above-described covering member 11 by a dispenser needle 8 , similarly to the case of Example 1.
  • the adhesive member 9 which had been dripped on a chamfer 7 of the covering member 11 flowed downward and was placed at the perimeters of the intermediate layer 3 and the covering member 11 with high accuracy.
  • a covering member 12 employed in the present example was formed of a flat covering glass plate with a size of 35 mm ⁇ 40 mm and a thickness of 0.6 mm, and had roundness (chamfer) 7 with a curvature of R 1 made by a chamfering operation formed on the upper part (cf. FIG. 4 ).
  • a step of covering an organic light-emitting element will be now described below.
  • the organic light-emitting element 2 , an intermediate layer 3 and a covering member 12 were sequentially aligned and fixed on a substrate 1 with a size of 40 mm ⁇ 50 mm and thickness of 0.6 mm.
  • an adhesive member 9 was ejected to all the perimeters of the above-described covering member 12 by a dispenser needle 8 , similarly to the case of Example 1.
  • the adhesive member 9 which had been dripped on a chamfer 7 of the covering member 12 flowed downward and was placed at the perimeters of the intermediate layer 3 and the covering member 12 with high accuracy.
  • a covering member 15 employed in the present comparative example was formed of a flat covering glass plate having a size of 35 mm ⁇ 40 mm and a thickness of 0.6 mm and having no chamfer thereon (cf. FIG. 5 ).
  • a step of covering an organic light-emitting element will be now described below.
  • the organic light-emitting element 2 , an intermediate layer 3 and a covering member 15 were sequentially aligned and fixed on a substrate 1 with a size of 40 mm ⁇ 50 mm and a thickness of 0.6 mm.
  • an adhesive member 9 was ejected to all perimeters of the covering member 15 by a dispenser needle 8 , similarly to the case of Example 1.
  • the adhesive member 9 was placed at a position outwardly greatly deviated from an intended position because the center position of the adhesive member 9 applied by the dispenser needle 8 was outwardly deviated from the intended position by 0.2 mm. Accordingly, the organic light-emitting element 2 could not be sealed by the adhesive member 9 and the covering member 15 , and besides, the covering member 15 could not be adhered to the substrate 1 .
  • a covering member 16 employed in the present comparative example was also formed of a flat covering glass plate having a size of 35 mm ⁇ 40 mm and a thickness of 0.6 mm thick and having no chamfer thereon (cf. FIG. 6 ).
  • a step of covering an organic light-emitting element will be now described below.
  • the organic light-emitting element 2 , an intermediate layer 3 and a covering member 16 were sequentially aligned and fixed on a substrate 1 with a size of 40 mm ⁇ 50 mm and a thickness of 0.6 mm.
  • an adhesive member 9 was ejected to all the perimeters of the covering member 16 by a dispenser needle 8 , similarly to the case of Example 1.
  • the adhesive member 9 was placed on the upper face of the covering member 16 , which is inwardly greatly deviated from an intended position, and showed an inadequate shape, because the center position of the adhesive member 9 applied by the dispenser needle 8 was inwardly deviated from the intended position by 0.2 mm.
  • a covering member 17 employed in the present comparative example was also formed of a flat covering glass plate having a size of 35 mm ⁇ 40 mm and a thickness of 0.6 mm and having no chamfer thereon (cf. FIG. 7 ).
  • a step of covering an organic light-emitting element will be now described below.
  • the organic light-emitting element 2 , an intermediate layer 3 and a covering member 17 were sequentially aligned and fixed on a substrate 1 with a size of 40 mm ⁇ 50 mm and a thickness of 0.6 mm.
  • a dispenser needle 8 was set so as to form an angle of 45 degrees with respect to the perimeter of the covering member 17 , and an adhesive member 9 was ejected to all the perimeters by the dispenser needle 8 .
  • a position of a dispenser device was controlled by a high-function robot provided with XYZ shafts and even a rotatable shaft (not shown), and the adhesive member 9 was ejected to all the perimeter of the covering member 17 on a substrate 1 by a dispenser needle 8 while the formed angle of the dispenser needle 8 was kept at 45 degrees.
  • the organic light-emitting element 2 could be sealed by the covering member 17 and the adhesive member 9 so as not to cause leakage, and furthermore, the covering member 17 could be adhered to the substrate 1 so that the adhesive member 9 might not mount on the upper face of the covering member 17 .
  • this step needed the expensive high-function robot for controlling such a dispenser device as described above and caused increase in a cost.

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  • Electroluminescent Light Sources (AREA)
US11/686,824 2006-03-23 2007-03-15 Organic light-emitting device, and method for manufacturing organic light-emitting device Abandoned US20070222384A1 (en)

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JP2007056761A JP2007287669A (ja) 2006-03-23 2007-03-07 有機発光装置及び有機発光装置の製造方法

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