WO2018119752A1 - 显示面板的制造方法 - Google Patents

显示面板的制造方法 Download PDF

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Publication number
WO2018119752A1
WO2018119752A1 PCT/CN2016/112664 CN2016112664W WO2018119752A1 WO 2018119752 A1 WO2018119752 A1 WO 2018119752A1 CN 2016112664 W CN2016112664 W CN 2016112664W WO 2018119752 A1 WO2018119752 A1 WO 2018119752A1
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Prior art keywords
substrate
support substrate
glass substrate
glass
manufacturing
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PCT/CN2016/112664
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English (en)
French (fr)
Inventor
唐岳军
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武汉华星光电技术有限公司
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Priority to US15/328,453 priority Critical patent/US10347839B2/en
Publication of WO2018119752A1 publication Critical patent/WO2018119752A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
    • B32B43/006—Delaminating
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1339—Gaskets; Spacers; Sealing of cells
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1341—Filling or closing of cells
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133302—Rigid substrates, e.g. inorganic substrates
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133354—Arrangements for aligning or assembling substrates

Definitions

  • the present invention relates to the field of display panel manufacturing technology, and in particular to a method for manufacturing a display panel, and more particularly to a method for manufacturing a liquid crystal display panel and an organic electroluminescence display panel.
  • a glass substrate In flat panel displays, a glass substrate is generally used as a carrier for carrying other display elements, and in a flat panel display, the glass substrate is the component having the largest weight ratio.
  • the most effective method is to reduce the thickness and weight of the glass substrate. The thinner the glass, the more flexible it is, so the thin glass substrate during production is highly prone to drooping and warping.
  • the method for reducing the thickness and weight of the glass substrate comprises: first, reducing the thickness and weight of the glass substrate by etching the glass substrate; 2. directly using the thin and light glass substrate. In the first method, after the display panel is assembled, an additional glass etching process is performed to reduce the thickness and weight of the glass substrate.
  • the disadvantage of this method is that failure occurs in the glass etching process, and the number is greatly increased. manufacturing cost.
  • even small impacts during loading and unloading can cause a light and thin glass substrate to warp rapidly during transportation of a thin glass substrate, thereby damaging the glass substrate.
  • an object of the present invention is to provide a method of manufacturing a display panel, comprising: acquiring at least two glass substrates having a predetermined display panel size; The glass substrates are disposed on a support substrate at intervals; a pad region is formed on the glass substrate; a card forming process or a packaging process of the display panel is completed; and the support substrate is peeled off.
  • the support substrate is made of glass, the support substrate has a thickness of between 0.5 mm and 1 mm; and the glass substrate has a thickness of between 0.05 mm and 0.2 mm.
  • the method of disposing the glass substrate on the support substrate specifically includes: attaching the support substrate and the glass substrate to each other in a vacuum state, or attaching the support by an adhesive The substrate is adhered to the glass substrate.
  • a support ball is formed on the glass substrate, and the support ball is used to maintain a box pitch when the display panel is formed into a box.
  • a specific method of peeling off the support substrate includes: performing plasma treatment on the support substrate, or by previously forming a protrusion pattern on a surface of the support substrate, and jetting air to the support by a predetermined air ejection device a gap between the substrate and the glass substrate.
  • Another object of the present invention is to provide a method of fabricating a liquid crystal display panel, comprising: acquiring at least two upper glass substrates having a predetermined display panel size and at least two lower glass substrates; spacing the lower glass substrates And disposed on a lower support substrate, and the upper glass substrate is disposed on an upper support substrate at intervals; wherein the lower glass substrate and the upper glass substrate are opposite one another; forming an array on the lower glass substrate a layer, a support ball and a pad region, and a color resist layer is formed on the upper glass substrate; the upper support substrate and the lower support substrate are assembled to the cartridge, and the support ball abuts the upper support substrate, And filling a liquid crystal layer between the color resist layer and the array layer; peeling off the upper support substrate and the lower support substrate, and removing the support ball.
  • Still another object of the present invention is to provide a method of fabricating an organic electroluminescence display panel, comprising: acquiring at least two lower glass substrates having a predetermined display panel size; and spacing the lower glass substrates at a lower support Forming an organic light-emitting layer and a pad region on the lower glass substrate; forming an encapsulation layer on the organic light-emitting layer; and peeling off the lower support substrate.
  • the upper support substrate and/or the lower support substrate are made of glass, and the upper support substrate and/or the lower support substrate have a thickness of between 0.5 mm and 1 mm; the lower glass substrate and / The thickness of the upper glass substrate is between 0.05 mm and 0.2 mm.
  • the method of disposing the lower glass substrate on the lower support substrate specifically includes: attaching the lower support substrate and the lower glass substrate to each other in a vacuum state, or by using an adhesive Attaching the lower support substrate to the lower glass substrate; the method of disposing the upper glass substrate on the upper support substrate specifically includes: by using the upper support substrate and the vacuum in a vacuum state The upper glass substrates are attached to each other for adhesion, or the upper support substrate is adhered to the upper glass substrate by an adhesive.
  • a specific method of peeling off the lower supporting substrate includes: performing plasma treatment on the lower supporting substrate, or forming a protrusion pattern on a surface of the lower supporting substrate in advance, and injecting air into the air by a predetermined air injecting device a gap between the lower support substrate and the lower glass substrate;
  • a specific method of peeling off the upper support substrate includes: performing plasma treatment on the upper support substrate, or forming a surface of the upper support substrate in advance a pattern of protrusions, and air is ejected by a predetermined air ejecting device to a gap between the upper support substrate and the upper glass substrate.
  • the present invention provides a method for manufacturing a display panel by using a thin glass substrate.
  • a thin support substrate is used to support a thin glass substrate, which can avoid serious drooping (Drooping) And warping can avoid sagging and overall warpage at both ends of the thinner glass substrate, thereby improving the convenience and accuracy in the manufacturing process of the display panel.
  • Drooping serious drooping
  • warping can avoid sagging and overall warpage at both ends of the thinner glass substrate, thereby improving the convenience and accuracy in the manufacturing process of the display panel.
  • FIGS. 1A to 1E are process diagrams of a method of manufacturing a liquid crystal display panel according to a first embodiment of the present invention
  • FIGS. 2A to 2E are process diagrams of a method of fabricating an organic electroluminescence display panel according to a second embodiment of the present invention.
  • FIGS. 1A to 1E are process diagrams of a method of fabricating a liquid crystal display panel according to a first embodiment of the present invention.
  • Step 1 Referring to FIG. 1A, a support substrate 11 and an upper support substrate 12 are provided, and two lower glass substrates 13 and two upper glass substrates 14 having a predetermined display panel size are provided. It should be noted that the number of the upper glass substrate 14 and the lower glass substrate 13 can be adjusted according to actual needs, and the present invention is not limited to two.
  • the lower support substrate 11 and the upper support substrate 12 may be made of glass, ceramic or metal.
  • the lower support substrate 11 and the upper support substrate 12 have a thickness of between 0.5 mm and 1 mm.
  • the lower support substrate 11 and the upper support substrate 12 are preferably made of glass, and the thickness of the lower support substrate 11 and the upper support substrate 12 is preferably 0.7 mm.
  • the method of acquiring two lower glass substrates 13 and two upper glass substrates 14 having a predetermined display panel size may be: cutting a large glass plate according to a predetermined display panel size to form two desired lower glasses The substrate 13 and the two upper glass substrates 14.
  • Step 2 Referring to FIG. 1B, lower glass substrates 13 spaced apart from each other are disposed on the lower support substrate 11, and correspondingly, upper glass substrates 14 are spaced apart from each other on the upper support substrate 12.
  • both the lower glass substrate 13 and the upper glass substrate 14 are relatively thin, and their thickness ranges from 0.05 mm to 0.4 mm, preferably between 0.1 mm and 0.15 mm.
  • Thinner glass substrates such as the lower glass substrate 13 and the upper glass substrate 14 are disposed on thicker support substrates such as the lower support substrate 11 and the upper support substrate 12, and a thicker support substrate can be used for thinner.
  • the glass substrate provides support to reduce sagging and overall warpage at both ends of the thinner glass substrate, thereby improving convenience and accuracy in the manufacturing process of the display panel.
  • the method of respectively providing the lower glass substrate 13 and the upper glass substrate 14 on the lower support substrate 11 and the upper support substrate 12 includes two types: one, by contacting the support substrate and the glass substrate with each other in a vacuum state. And attached together, in this case, the adhesion between the support substrate and the glass substrate is electrostatic force, vacuum force, surface tension, etc.; second, the support substrate and the substrate are adhered by an adhesive The glass substrates are adhered together.
  • Step 3 Referring to FIG. 1C, a support ball 15, an array layer 17, and a bonding region 19 are provided on the lower glass substrate 13, and correspondingly, a color resist layer 16 is provided on the upper glass substrate 14. It should be noted that other necessary display elements may also be disposed on the lower glass substrate 13 and the upper glass substrate 14, respectively, and details are not described herein again. In addition, since the pad region 19 and the region where the support ball 15 is located are generally disposed in the non-display area of the liquid crystal display panel, the pad region 19 may be equivalent to the non-display region of the liquid crystal display panel.
  • the support ball 15 may be, for example, a Si ball, but the present invention is not limited thereto.
  • Step 4 Referring to FIG. 1D, the support substrate 12 and the lower support substrate 11 are aligned, the support ball 15 is abutted against the upper support substrate 12, and the liquid crystal layer LC is filled between the color resist layer 16 and the array layer 17 to complete the liquid crystal.
  • the display box's box process (or box process).
  • the upper support substrate 12 and the lower support substrate 11 not only serve to protect the display elements between the upper glass substrate 14, the lower glass substrate 13, and the upper glass substrate 14 and the lower glass substrate 13, but also can be aligned and formed into a box. Improve the convenience and alignment accuracy of the process.
  • the support ball 15 can maintain the spacing between the upper glass substrate 14 and the lower glass substrate 13 and the spacing between the upper support substrate 12 and the lower support substrate 11.
  • the support ball 15 is such that the seal between the upper glass substrate 14 and the lower glass substrate 13 has the same or similar spacing on both sides before curing, so that the thickness of the inner and outer edges is the same or similar after curing, and the occurrence of peripheral chromatic aberration is reduced. . Therefore, the size (especially the height) of the support ball 15 is larger than the size of the support ball in the seal.
  • Step 5 Referring to FIG. 1E, the upper support substrate 12 and the lower support substrate 11 are peeled off, and the support balls 15 are removed.
  • the method of peeling off the support substrate includes two types: one, performing plasma treatment on the support substrate by using fluorine or the like;
  • the surface of the substrate is formed with a protrusion pattern to reduce the adhesion force between the glass substrate and the support substrate, and the support substrate is peeled off by jetting air to a gap between the support substrate and the glass substrate by a predetermined air ejecting device (not shown).
  • the thin upper glass substrate 12 and the lower glass substrate 13 function to maintain a uniform cell thickness of the liquid crystal display panel, and can provide flatness, Smooth surface feel and display plane.
  • FIGS. 2A to 2E are process diagrams of a method of fabricating an organic electroluminescence display panel according to a second embodiment of the present invention.
  • Step 1 Referring to FIG. 2A, a support substrate 21 and two lower glass substrates 23 having a predetermined display panel size are provided. It should be noted that the number of the lower glass substrates 23 can be adjusted according to actual needs, and the present invention is not limited to two.
  • the lower support substrate 21 and the upper support substrate 22 may be made of glass, ceramic or metal.
  • the lower support substrate 21 and the upper support substrate 22 have a thickness of between 0.5 mm and 1 mm.
  • the lower support substrate 21 and the upper support substrate 22 are preferably made of glass, and the thickness of the lower support substrate 21 and the upper support substrate 22 is preferably 0.7 mm.
  • a method of acquiring two lower glass substrates 23 having a predetermined display panel size may be: cutting a large glass plate according to a predetermined display panel size to form two desired lower glass substrates 23.
  • Step 2 Referring to FIG. 2B, lower glass substrates 23 spaced apart from each other are disposed on the lower support substrate 21.
  • the lower glass substrate 23 is relatively thin, and has a thickness ranging from 0.05 mm to 0.4 mm, preferably between 0.1 mm and 0.25 mm.
  • the thinner lower glass substrate 23 is disposed on the lower support substrate 21, and the thicker lower support substrate 21 can be used to support the thinner lower glass substrate 23, thereby reducing the sagging and overallity of the thinner lower glass substrate 23. Warpage, which improves the convenience and accuracy of the display panel manufacturing process.
  • the method for disposing the lower glass substrate 23 on the lower support substrate 21 specifically includes two types: The lower support substrate 21 and the lower glass substrate 23 are attached to each other by contact with each other in a vacuum state.
  • the adhesion force between the lower support substrate 21 and the lower glass substrate 23 is electrostatic force, vacuum force, Surface tension or the like; Second, the lower support substrate 21 and the lower glass substrate 23 are adhered together by an adhesive.
  • Step 3 Referring to FIG. 2C, an organic light-emitting layer 27 and a bonding region 29 are provided on the lower glass substrate 23. It should be noted that other necessary display elements may also be disposed on the lower glass substrate 23, and details are not described herein again. In addition, since the pad region 29 is generally disposed in the non-display area of the organic light emitting display panel, the pad region 29 may be equivalent to the non-display region of the organic light emitting display panel.
  • Step 4 Referring to FIG. 2D, an encapsulation layer 28 is disposed on the organic light-emitting layer 27 to achieve separation of moisture and oxygen.
  • the encapsulation layer 28 may be a glass cover or a thin film encapsulation layer.
  • Step 5 Referring to FIG. 2E, the lower support substrate 21 is peeled off.
  • the method of peeling off the lower support substrate 21 includes two types: one, plasma treatment of the lower support substrate 21 by using fluorine or the like; and second, forming a protrusion pattern on the surface of the lower support substrate 21 in advance to reduce the lower glass substrate 23
  • the adhesion force with the lower support substrate 21 is peeled off by the air jetted to the gap between the lower glass substrate 23 and the lower support substrate 21 by a predetermined air ejecting means (not shown).
  • the thin and light lower glass substrate 23 can provide a flat, smooth surface touch and display plane.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Optics & Photonics (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
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Abstract

一种显示面板的制造方法，包括：获取具有预定显示面板尺寸的至少两个玻璃基板 (13, 14)，将玻璃基板 (13, 14) 间隔地设置在支撑基板上 (11, 12)，在玻璃基板 (13, 14) 上形成焊盘区，完成显示面板的成盒工艺或封装工艺，剥离支撑基板 (11, 12)。

Description

显示面板的制造方法 技术领域
本发明属于显示面板制造技术领域，具体地讲，涉及一种显示面板的制造方法，尤其涉及一种液晶显示面板和有机电致发光显示面板的制造方法。
背景技术
近年来，显示器正朝向轻薄化发展，特别是随着人们对便携式电子产品薄型化要求的不断提高，应用在便携式电子产品中的平板显示器(诸如液晶显示器(LCD)或OLED显示器等)被要求具有越来越薄的厚度以及越来越轻的重量，这样能够改善便携式电子产品的便携性。此外，在电视机等大型电子产品中，轻薄化的显示器可以减小空间占用，并能够给观众更舒适的体验。
在平板显示器中，通常使用玻璃基板作为承载其它显示元件的载体，而在平板显示器中，玻璃基板是占重比最大的元件。为了降低平板显示器的厚度和重量，最有效的方法是降低玻璃基板的厚度和重量。越薄的玻璃越易弯曲，因此生产过程中薄的玻璃基底极易发生下垂(drooping)和翘曲。降低玻璃基板厚度和重量的方法包括：一、通过蚀刻玻璃基板来降低玻璃基板厚度和重量；二、直接使用轻薄的玻璃基板。在第一种方法中，在显示面板被装配好之后，额外执行玻璃蚀刻工艺来降低玻璃基板的厚度和重量，这种方法的不足之处是在玻璃蚀刻工艺中会发生故障，且会大大增加制造成本。在第二种方法中，越轻薄的玻璃基板越容易弯曲，特别是随着玻璃基板的尺寸越来越大，在生产过程中轻薄的玻璃基板极易发生严重的下垂(Drooping)和翘曲，此外在轻薄的玻璃基板的运输过程中，当装载、卸载时即使是小的撞击也会使轻薄的玻璃基板快速翘曲，从而损伤玻璃基板。
发明内容
为了解决上述现有技术存在的问题，本发明的目的在于提供一种显示面板的制造方法，其包括：获取具有预定显示面板尺寸的至少两个玻璃基板；将所 述玻璃基板间隔地设置在一支撑基板上；在所述玻璃基板上形成焊盘区；完成显示面板的成盒工艺或封装工艺；剥离所述支撑基板。
进一步地，所述支撑基板由玻璃制成，所述支撑基板的厚度在0.5mm至1mm之间；所述玻璃基板的厚度在0.05mm至0.2mm之间。
进一步地，将所述玻璃基板设置在所述支撑基板上的方法具体包括：通过在真空状态下使所述支撑基板与所述玻璃基板彼此接触而贴附，或者通过粘附剂将所述支撑基板与所述玻璃基板粘附在一起。
进一步地，当完成显示面板的成盒工艺时，在所述玻璃基板上形成支撑球，所述支撑球用于保持所述显示面板成盒时的盒间距。
进一步地，剥离所述支撑基板的具体方法包括：对所述支撑基板进行等离子体处理，或者通过预先在所述支撑基板的表面形成突起图案，并由预定空气喷射装置将空气喷射到所述支撑基板与所述玻璃基板之间的空隙。
本发明的另一目的还在于提供一种液晶显示面板的制造方法，其包括：获取具有预定显示面板尺寸的至少两个上玻璃基板和至少两个下玻璃基板；将所述下玻璃基板间隔地设置在一下支撑基板上，且将所述上玻璃基板间隔地设置在一上支撑基板上；其中所述下玻璃基板和所述上玻璃基板一一相对对应；在所述下玻璃基板上形成阵列层、支撑球和焊盘区，且在所述上玻璃基板上形成色阻层；对盒组装所述上支撑基板和所述下支撑基板，使所述支撑球抵接所述上支撑基板，并在所述色阻层和所述阵列层之间填充液晶层；剥离所述上支撑基板和所述下支撑基板，并将所述支撑球去除。
本发明的又一目的又在于提供一种有机电致发光显示面板的制造方法，其包括：获取具有预定显示面板尺寸的至少两个下玻璃基板；将所述下玻璃基板间隔地设置在一下支撑基板上；在所述下玻璃基板上形成有机发光层和焊盘区；在所述有机发光层上形成封装层；剥离所述下支撑基板。
进一步地，所述上支撑基板和/或所述下支撑基板由玻璃制成，所述上支撑基板和/或所述下支撑基板的厚度在0.5mm至1mm之间；所述下玻璃基板和/或所述上玻璃基板的厚度在0.05mm至0.2mm之间。
进一步地，将所述下玻璃基板设置在所述下支撑基板上的方法具体包括：通过在真空状态下使所述下支撑基板与所述下玻璃基板彼此接触而贴附，或者通过粘附剂将所述下支撑基板与所述下玻璃基板粘附在一起；将所述上玻璃基板设置在所述上支撑基板上的方法具体包括：通过在真空状态下使所述上支撑基板与所述上玻璃基板彼此接触而贴附，或者通过粘附剂将所述上支撑基板与所述上玻璃基板粘附在一起。
进一步地，剥离所述下支撑基板的具体方法包括：对所述下支撑基板进行等离子体处理，或者通过预先在所述下支撑基板的表面形成突起图案，并由预定空气喷射装置将空气喷射到所述下支撑基板与所述下玻璃基板之间的空隙；剥离所述上支撑基板的具体方法包括：对所述上支撑基板进行等离子体处理，或者通过预先在所述上支撑基板的表面形成突起图案，并由预定空气喷射装置将空气喷射到所述上支撑基板与所述上玻璃基板之间的空隙。
本发明的有益效果：本发明提供了一种利用轻薄的玻璃基板制造显示面板的方法，在制造过程中，利用较厚的支撑基板支撑轻薄的玻璃基板，可以避免极易发生严重的下垂(Drooping)和翘曲可以避免较薄的玻璃基板两端的下垂和整体的翘曲，从而提升显示面板制造过程中的便利性和精确性。
附图说明
通过结合附图进行的以下描述，本发明的实施例的上述和其它方面、特点和优点将变得更加清楚，附图中：
图1A至图1E是根据本发明的第一实施例的液晶显示面板的制造方法的制程图；
图2A至图2E是根据本发明的第二实施例的有机电致发光显示面板的制造方法的制程图。
具体实施方式
以下，将参照附图来详细描述本发明的实施例。然而，可以以许多不同的形式来实施本发明，并且本发明不应该被解释为限制于这里阐述的具体实施例。相反，提供这些实施例是为了解释本发明的原理及其实际应用，从而使本 领域的其他技术人员能够理解本发明的各种实施例和适合于特定预期应用的各种修改。
在附图中，为了清楚器件，夸大了层和区域的厚度。相同的标号在附图中始终表示相同的元件。
图1A至图1E是根据本发明的第一实施例的液晶显示面板的制作方法的制程图。
根据本发明的第一实施例的液晶显示面板的制作方法包括：
步骤一：参照图1A，提供一下支撑基板11和一上支撑基板12，并提供具有预定显示面板尺寸的两个下玻璃基板13和两个上玻璃基板14。需要说明的是，上玻璃基板14和下玻璃基板13的数量可以根据实际需求调整，本发明并不两个为限。
这里，下支撑基板11和上支撑基板12可以采用玻璃、陶瓷或金属制成。下支撑基板11和上支撑基板12厚度介于0.5mm至1mm之间。在本实施例中，下支撑基板11和上支撑基板12优选地采用玻璃制成，并且下支撑基板11和上支撑基板12的厚度优选为0.7mm。
具体地，获取具有预定显示面板尺寸的两个下玻璃基板13和两个上玻璃基板14的方法可以是：按照预定显示面板尺寸对大的玻璃板进行切割，以形成所需的两个下玻璃基板13和两个上玻璃基板14。
步骤二：参照图1B，在下支撑基板11上设置彼此间隔开的下玻璃基板13，对应地，在上支撑基板12上彼此间隔开的上玻璃基板14。
这里，下玻璃基板13和上玻璃基板14都较薄，它们的厚度范围介于0.05mm至0.4mm之间，优选地介于0.1mm至0.15mm之间。将较薄的玻璃基板(诸如下玻璃基板13和上玻璃基板14)设置在较厚的支撑基板(诸如下支撑基板11和上支撑基板12)上，可以利用较厚的支撑基板为较薄的玻璃基板提供支撑，减小较薄的玻璃基板两端的下垂和整体的翘曲，从而提升显示面板制造过程中的便利性和精确性。
具体地，在下支撑基板11和上支撑基板12上分别设置下玻璃基板13和上玻璃基板14的方法具体包括两种：一、通过在真空状态下使所述支撑基板与所述玻璃基板彼此接触而贴附在一起，这种情况下，所述支撑基板与所述玻璃基板之间的贴附力为静电力、真空力、表面张力等；二、通过粘附剂将所述支撑基板与所述玻璃基板粘附在一起。
步骤三：参照图1C，在下玻璃基板13上设置支撑球15、阵列层17和焊盘区(bonding区)19，对应地，在上玻璃基板14上设置色阻层16。需要说明的是，还可以在下玻璃基板13和上玻璃基板14上分别设置其它必需的显示元件，这里不再赘述。另外，由于焊盘区19和支撑球15所在区域通常被设置于液晶显示面板的非显示区，这里也可以将焊盘区19与液晶显示面板的非显示区等同。
在本实施例中，支撑球15可例如是Si球，但本发明并不限制于此。
步骤四：参照图1D，对位上支撑基板12和下支撑基板11，使支撑球15抵接上支撑基板12，并在色阻层16和阵列层17之间填充液晶层LC，以完成液晶显示面板的对盒工艺(或称成盒工艺)。
这里，上支撑基板12和下支撑基板11不仅起到保护上玻璃基板14、下玻璃基板13以及上玻璃基板14和下玻璃基板13之间的显示元件的作用，还能在对位和成盒工艺中提升操作的便利性和对位准确度。
此外，支撑球15可以维持上玻璃基板14和下玻璃基板13之间的间距以及上支撑基板12和下支撑基板11之间的间距。支撑球15使得上玻璃基板14和下玻璃基板13之间的框胶(Seal)在固化前具有两侧相同或相近的间距，使其固化后内外边缘厚度相同或相近，减小周边色差的发生。因此支撑球15的尺寸(尤其是高度)要大于框胶(Seal)内支撑球的尺寸。
步骤五：参照图1E，剥离上支撑基板12和下支撑基板11，并将支撑球15去除。
具体地，剥离支撑基板(即上支撑基板12和下支撑基板11)的方法包括两种：一、通过使用氟等对支撑基板进行等离子体处理；二、通过预先在支撑 基板的表面形成突起图案以减小玻璃基板和支撑基板之间的贴附力，通过由预定空气喷射装置(图未示)将空气喷射到支撑基板与玻璃基板之间的空隙而剥离支撑基板。
在由根据本发明的第一实施例所述的制造方法制造的液晶显示面板中，轻薄的上玻璃基板12和下玻璃基板13起到维持液晶显示面板均匀盒厚的作用，并且能够提供平整、光滑的表面触感和显示平面。
图2A至图2E是根据本发明的第二实施例的有机电致发光显示面板的制作方法的制程图。
根据本发明的第二实施例的有机电致发光显示面板的制作方法包括：
步骤一：参照图2A，提供一下支撑基板21和具有预定显示面板尺寸的两个下玻璃基板23。需要说明的是，下玻璃基板23的数量可以根据实际需求调整，本发明并不两个为限。
这里，下支撑基板21和上支撑基板22可以采用玻璃、陶瓷或金属制成。下支撑基板21和上支撑基板22厚度介于0.5mm至1mm之间。在本实施例中，下支撑基板21和上支撑基板22优选地采用玻璃制成，并且下支撑基板21和上支撑基板22的厚度优选为0.7mm。
具体地，获取具有预定显示面板尺寸的两个下玻璃基板23的方法可以是：按照预定显示面板尺寸对大的玻璃板进行切割，以形成所需的两个下玻璃基板23。
步骤二：参照图2B，在下支撑基板21上设置彼此间隔开的下玻璃基板23。
这里，下玻璃基板23较薄，其厚度范围介于0.05mm至0.4mm之间，优选地介于0.1mm至0.25mm之间。将较薄的下玻璃基板23设置在下支撑基板21上，可以利用较厚的下支撑基板21为较薄的下玻璃基板23提供支撑，减小较薄的下玻璃基板23两端的下垂和整体的翘曲，从而提升显示面板制造过程中的便利性和精确性。
具体地，在下支撑基板21上设置下玻璃基板23的方法具体包括两种：一、 通过在真空状态下使下支撑基板21和下玻璃基板23彼此接触而贴附在一起，这种情况下，下支撑基板21和下玻璃基板23之间的贴附力为静电力、真空力、表面张力等；二、通过粘附剂将下支撑基板21和下玻璃基板23粘附在一起。
步骤三：参照图2C，在下玻璃基板23上设置有机发光层27和焊盘区(bonding区)29。需要说明的是，还可以在下玻璃基板23上设置其它必需的显示元件，这里不再赘述。另外，由于焊盘区29通常被设置于有机发光显示面板的非显示区，这里也可以将焊盘区29与有机发光显示面板的非显示区等同。
步骤四：参照图2D，在有机发光层27上设置封装层28，以实现水汽和氧气的隔离。这里，封装层28可以是玻璃盖板，也可以是薄膜封装层。
步骤五：参照图2E，剥离下支撑基板21。
具体地，剥离下支撑基板21的方法包括两种：一、通过使用氟等对下支撑基板21进行等离子体处理；二、通过预先在下支撑基板21的表面形成突起图案以减小下玻璃基板23和下支撑基板21之间的贴附力，通过由预定空气喷射装置(图未示)将空气喷射到下玻璃基板23和下支撑基板21之间的空隙而剥离下支撑基板21。
在由根据本发明的第二实施例所述的制造方法制造的有机电致发光显示面板中，轻薄的下玻璃基板23能够提供平整、光滑的表面触感和显示平面。
虽然已经参照特定实施例示出并描述了本发明，但是本领域的技术人员将理解：在不脱离由权利要求及其等同物限定的本发明的精神和范围的情况下，可在此进行形式和细节上的各种变化。

Claims (13)

  1. 一种显示面板的制造方法，其中，所述制造方法包括：
    获取具有预定显示面板尺寸的至少两个玻璃基板；
    将所述玻璃基板间隔地设置在一支撑基板上；
    在所述玻璃基板上形成焊盘区；
    完成显示面板的成盒工艺或封装工艺；
    剥离所述支撑基板。
  2. 根据权利要求1所述的制造方法，其中，所述支撑基板由玻璃制成，所述支撑基板的厚度在0.5mm至1mm之间；所述玻璃基板的厚度在0.05mm至0.2mm之间。
  3. 根据权利要求1所述的制造方法，其中，将所述玻璃基板设置在所述支撑基板上的方法具体包括：
    通过在真空状态下使所述支撑基板与所述玻璃基板彼此接触而贴附，或者通过粘附剂将所述支撑基板与所述玻璃基板粘附在一起。
  4. 根据权利要求1所述的制造方法，其中，当完成显示面板的成盒工艺时，在所述玻璃基板上形成支撑球，所述支撑球用于保持所述显示面板成盒时的盒间距。
  5. 根据权利要求1所述的制造方法，其中，剥离所述支撑基板的具体方法包括：
    对所述支撑基板进行等离子体处理，或者通过预先在所述支撑基板的表面形成突起图案，并由预定空气喷射装置将空气喷射到所述支撑基板与所述玻璃基板之间的空隙。
  6. 一种液晶显示面板的制造方法，其中，所述制造方法包括：
    获取具有预定显示面板尺寸的至少两个上玻璃基板和至少两个下玻璃基板；
    将所述下玻璃基板间隔地设置在一下支撑基板上，且将所述上玻璃基板间隔地设置在一上支撑基板上；其中所述下玻璃基板和所述上玻璃基板一一相对对应；
    在所述下玻璃基板上形成阵列层、支撑球和焊盘区，且在所述上玻璃基板上形成色阻层；
    对盒组装所述上支撑基板和所述下支撑基板，使所述支撑球抵接所述上支撑基板，并在所述色阻层和所述阵列层之间填充液晶层；
    剥离所述上支撑基板和所述下支撑基板，并将所述支撑球去除。
  7. 根据权利要求6所述的制造方法，其中，所述上支撑基板和/或所述下支撑基板由玻璃制成，所述上支撑基板和/或所述下支撑基板的厚度在0.5mm至1mm之间；所述下玻璃基板和/或所述上玻璃基板的厚度在0.05mm至0.2mm之间。
  8. 根据权利要求6所述的制造方法，其中，将所述下玻璃基板设置在所述下支撑基板上的方法具体包括：通过在真空状态下使所述下支撑基板与所述下玻璃基板彼此接触而贴附，或者通过粘附剂将所述下支撑基板与所述下玻璃基板粘附在一起；
    将所述上玻璃基板设置在所述上支撑基板上的方法具体包括：通过在真空状态下使所述上支撑基板与所述上玻璃基板彼此接触而贴附，或者通过粘附剂将所述上支撑基板与所述上玻璃基板粘附在一起。
  9. 根据权利要求6所述的制造方法，其中，剥离所述下支撑基板的具体方法包括：对所述下支撑基板进行等离子体处理，或者通过预先在所述下支撑基板的表面形成突起图案，并由预定空气喷射装置将空气喷射到所述下支撑基板与所述下玻璃基板之间的空隙；
    剥离所述上支撑基板的具体方法包括：对所述上支撑基板进行等离子体处 理，或者通过预先在所述上支撑基板的表面形成突起图案，并由预定空气喷射装置将空气喷射到所述上支撑基板与所述上玻璃基板之间的空隙。
  10. 一种有机电致发光显示面板的制造方法，其中，所述制造方法包括：
    获取具有预定显示面板尺寸的至少两个下玻璃基板；
    将所述下玻璃基板间隔地设置在一下支撑基板上；
    在所述下玻璃基板上形成有机发光层和焊盘区；
    在所述有机发光层上形成封装层；
    剥离所述下支撑基板。
  11. 根据权利要求10所述的制造方法，其中，所述下支撑基板由玻璃制成，所述下支撑基板的厚度在0.5mm至1mm之间；所述下玻璃基板的厚度在0.05mm至0.2mm之间。
  12. 根据权利要求10所述的制造方法，其中，将所述下玻璃基板设置在所述下支撑基板上的方法具体包括：通过在真空状态下使所述下支撑基板与所述下玻璃基板彼此接触而贴附，或者通过粘附剂将所述下支撑基板与所述下玻璃基板粘附在一起。
  13. 根据权利要求10所述的制造方法，其中，剥离所述下支撑基板的具体方法包括：对所述下支撑基板进行等离子体处理，或者通过预先在所述下支撑基板的表面形成突起图案，并由预定空气喷射装置将空气喷射到所述下支撑基板与所述下玻璃基板之间的空隙。
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CN112297546A (zh) * 2019-07-24 2021-02-02 东旭光电科技股份有限公司 显示面板的制备方法
CN110571362B (zh) * 2019-09-18 2022-02-22 云谷（固安）科技有限公司 柔性显示面板及其制备方法

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