US20070089858A1 - Waterblock for cooling electrical and electronic circuitry - Google Patents

Waterblock for cooling electrical and electronic circuitry Download PDF

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Publication number
US20070089858A1
US20070089858A1 US11/257,669 US25766905A US2007089858A1 US 20070089858 A1 US20070089858 A1 US 20070089858A1 US 25766905 A US25766905 A US 25766905A US 2007089858 A1 US2007089858 A1 US 2007089858A1
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United States
Prior art keywords
waterblock
cooling tube
cooling
tube
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/257,669
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English (en)
Inventor
John Andberg
Noriyuki Sugihara
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Verigy Singapore Pte Ltd
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Verigy Singapore Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Verigy Singapore Pte Ltd filed Critical Verigy Singapore Pte Ltd
Priority to US11/257,669 priority Critical patent/US20070089858A1/en
Assigned to AGILENT TECHNOLOGIES INC reassignment AGILENT TECHNOLOGIES INC ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ANDBERG, JOHN W, SUGIHARA, NORIYUKI
Priority to TW095118091A priority patent/TW200718343A/zh
Priority to DE102006033226A priority patent/DE102006033226B4/de
Priority to JP2006281384A priority patent/JP2007121286A/ja
Priority to KR1020060103647A priority patent/KR20070044786A/ko
Priority to CNA2006101498359A priority patent/CN1956648A/zh
Assigned to VERIGY (SINGAPORE) PTE. LTD. reassignment VERIGY (SINGAPORE) PTE. LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: AGILENT TECHNOLOGIES, INC.
Publication of US20070089858A1 publication Critical patent/US20070089858A1/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature

Definitions

  • This invention relates to the field of devices for cooling electrical and electronic circuitry, and more particularly to devices, systems and methods for cooling such circuits using waterblocks and associated tubing.
  • one version of the V5400 Apache Tester 100 comprises test head 110 , support rack 120 for supplying test head 110 with electrical power, cooling water and compressed air (not shown in the Figures) and computer workstation 130 , which serves as the user interface to Tester 100 .
  • Manipulator 140 supports and positions test head 110 .
  • Support rack 120 is attached to manipulator 140 and serves as the interface between test head 110 and AC power, cooling water and compressed air.
  • Tester 100 may also comprise additional support racks.
  • Agilent's V5400 tester 100 shown in FIG. 1 has the ability to test Flash, DRAM, SRAM and stacked memory devices.
  • Test head 110 is an important component in the system and comprises tester electronics.
  • tester 100 shown in FIG. 1 offers up to 4,608 channels and 144 independent test sites and is capable of asynchronously testing up to 144 independent devices.
  • Test head electronic components supply power to various devices under test (DUTs) and perform measurements thereon.
  • test electronics are forced to ever-greater speeds and densities, a major problem becomes removal of the internal heat generated by test head 110 and the circuitry being tested thereon.
  • air cooling was sufficient.
  • signal path length has become a critical issue. Minimizing path length has led to miniaturization by a factor of over thousand in the last five years, to such an extent that it is no longer practical to air-cool current-generation automated test equipment. Greater speed compounds the problem, as heat generation increases with clock speed. Higher pin count testers are becoming the norm as well, further increasing the total thermal power dissipation required in a tester.
  • the most reliable methods of liquid cooling seek to isolate the cooling fluid from the electronics of tester 100 and test head 110 , as opposed to immersion cooling. This is accomplished using waterblocks (sometimes referred to as ‘cold plates’).
  • the active circuitry is mounted to a PC board, which in turn is mounted to a waterblock. In some cases certain components may be directly mounted to the waterblock for enhanced cooling. Various methods of mounting may be used, so the top or the bottom of a PC board may be contacting the waterblock.
  • circuits are mounted to both sides of a waterblock, to either minimize space or more fully utilize an expensive component (i.e., a waterblock).
  • the working fluid may be water or some other liquid. Water has the highest cooling performance of the common chosen working fluids, but a variety of considerations may preclude its use in some applications.
  • Waterblocks are generally constructed of an easily machined metal having high thermal conductivity such as aluminum or copper. Water or another fluid is routed through passages formed in the metal, and thereby removes heat. While this may seem to be a relatively straightforward process, many considerations come into play. For instance, some waterblocks have large internal passages, while others have small cross section passages. Heat transfer considerations generally favor small passages with very high liquid velocities to most effectively remove heat. This aids heat removal, at the expense of greater power required to pump the liquid. It should be noted that the ability to tailor the location of the water passage also can be used to aid the cooling of certain regions or devices that may have higher power dissipation requirements or more stringent temperature requirements.
  • waterblocks are of a style where the working fluid contacts the metal block directly.
  • an aluminum plate has long holes drilled through its midplane.
  • Inlet and outlet tubes are glued into two such holes, with the inlet and outlet tubes forming a u-shaped return tube.
  • Other styles of this type of waterblock may also be fabricated by milling corresponding serpentine passages into two plates, gluing the two halves together and adding inlet and outlet tubes in a manner similar to a clamshell.
  • the fluid passage is one continuous piece of tubing.
  • a serpentine passage is routed into the waterblock.
  • a tube is formed to follow the contour routed in the plate.
  • the whole length of tube is then forced into the plate, resulting in a waterblock with no joints in the fluid path.
  • the cross section of the passage and that of the tube is such that a tight fit exists when the tube is forced into the groove.
  • the tube is deformed after insertion to further enhance contact between the tube and block.
  • a material to aid heat transfer is often placed between the tube and the block.
  • Thermal filled epoxy is often employed in such an application, although the tube may also be brazed in place or even surrounded by a thermal grease.
  • the purpose of the epoxy, glue, brazing material or grease is to enhance heat conduction between the block and the outer surface of the tube, since without their presence a microscopic air gap would otherwise exist.
  • tube-in-a-slab design has many advantages, barriers to implementing such a construction exist owing to high manufacturing costs.
  • the blocks must be machined to size and shape and then have a suitable groove routed in them.
  • Tubing must be bent to precisely the same shape as the groove.
  • Filler material must be dispensed into the groove, the tubing laboriously forced in, and finally the surface re-cut to remove the filler material that has been squeezed out.
  • cooling cost on a per unit area basis must decrease considerably.
  • FIG. 2 illustrates a cross section of one type of tube-in-slab waterblock 200 , where cross-sectional groove 300 is routed in the relatively thick plate from which waterblock 200 is formed.
  • Groove 300 is sized to accept cooling tube 230 therewithin easily, cooling tube 230 having inner lumen 240 , inner surface 2650 and outer surface 250 .
  • Thermally conductive epoxy or other suitable material 290 is dispensed in groove 300 , cooling tube 230 is inserted in groove 300 and cooling tube 230 is swaged downwardly (and thus outwardly) into groove 300 , thereby serving to push outer surface 250 of cooling tube 230 tightly against inner surface 310 of groove 300 .
  • Such a tight fit ensures a thin glue line and facilitates heat transfer.
  • Top surface 210 of waterblock 200 is then fly cut for planarity.
  • FIG. 3 shows another style of waterblock 200 having no bonding material 290 for cooling tube 230 , which is swaged into groove 300 (which has a different shape from groove 300 shown in FIG. 2 ).
  • groove 300 which has a different shape from groove 300 shown in FIG. 2 .
  • sharp corners in groove 300 and inner surface 310 thereof firmly engage outer surface 250 of cooling tube 230 .
  • Such a design permits sufficient deformation of cooling tube 230 tube against inner surface 310 to provide excellent heat transfer.
  • the upper portion of outer surface 250 of cooling tube 230 is positioned below substantially planar first surface 210 of waterblock 200 .
  • waterblock 200 shares the disadvantage of being relatively thick, which is necessary to resist the spreading forces applied thereto when cooling tube 230 is placed or forced therein.
  • Waterblock 200 must, of course, be thicker than groove 300 to be milled. Thickness in addition to the groove 310 must therefore be added to waterblock 200 to maintain planarity of waterblock 200 during and after the swaging process.
  • waterblock 200 , groove 300 and cooling tube 230 have rather elaborate and complicated forms and shapes, which those skilled in the art will understand increase considerably the cost of manufacturing and assembling waterblock 200 .
  • the elaborate shapes and forms of such waterblocks, grooves and cooling tubes are necessary owing to the significant thermal and mechanical stresses to which waterblock 200 and cooling tube 230 are subjected during use.
  • most of the cost of a tube-in-slab waterblock may be ascribed to machining operations for placing the cooling tube in the waterblock and to the subsequent cleanup of adhesive.
  • a device for cooling at least one heat-generating electrical or electronic circuit in a circuit board comprises at least a first waterblock comprising a first surface configured for engagement with or positioning adjacent the circuit board, the waterblock comprising at least a second surface, at least a first cooling tube comprising at least a first lumen and an outer surface, the at least first lumen being configured to carry a liquid therethrough such that the liquid does not leak from or through the tube to the outer surface thereof.
  • the at least first cooling tube operably engages and is attached to the second surface of the waterblock, the second surface of the waterblock containing no voids, recesses or grooves for accepting the at least first cooling tube therein, the first cooling tube being configured to carry away at least a portion of the heat generated by the electrical or electronic circuit when the liquid flows therethrough.
  • a method of making a device for cooling at least one heat-generating electrical or electronic circuit in a circuit board comprising at least a first waterblock comprising a first surface configured for engagement with or positioning adjacent the circuit board, the waterblock further comprising at least a second surface, at least a first cooling tube comprising at least a first lumen and an outer surface, the at least first lumen being configured to carry a liquid therethrough such that the liquid does not leak from or through the tube to the outer surface thereof, the at least first cooling tube operably engaging and being attached to the second surface of the waterblock, the second surface of the waterblock containing no voids, recesses or grooves for accepting the at least first cooling tube therein, the first cooling tube being configured to carry away at least a portion of the heat generated by the electrical or electronic circuit when the liquid flows therethrough, the method comprising providing the waterblock; providing the cooling tube; and attaching the cooling tube to the waterblock.
  • the present invention further includes within its scope various methods making and using the foregoing components, devices and systems.
  • the various embodiments of the cooling tube and waterblock of the present invention reduce manufacturing and materials costs, and therefore reduce costs associated with prior art means and methods of cooling electrical or electronic circuitry employing liquid-cooling techniques. For example, many of the various embodiments of the present invention eliminate machining of waterblocks and attendant costs, eliminate time otherwise spent inserting and swaging tubes into grooves, eliminate cleanup after swaging, and use low cost “featureless” cooling tubes attached to one or more sides of one or more waterblocks.
  • FIG. 1 shows a prior art Agilent V5400 Apache memory chip tester
  • FIG. 2 shows a schematic cross-sectional representation of a first embodiment of a prior art waterblock and accompanying groove and cooling tube;
  • FIG. 3 shows a schematic cross-sectional representation of a second embodiment of a prior art waterblock and accompanying groove and cooling tube
  • FIG. 4 shows a first embodiment of a waterblock and accompanying cooling tube of the present invention
  • FIG. 5 shows a second embodiment of a waterblock and accompanying cooling tube of the present invention
  • FIG. 6 shows a third embodiment of a waterblock and accompanying cooling tube of the present invention.
  • FIG. 7 shows a fourth embodiment of a waterblock and accompanying cooling tube of the present invention.
  • the term “waterblock” means a plate-shaped member formed of a material having thermal characteristics which favor the transfer of thermal energy therethrough;
  • the term “cooling tube” means a member capable of carrying a fluid in at least one lumen thereof, the fluid transporting thermal energy away through the tube from an external source of thermal energy;
  • the term “substantially planar first surface” means a surface of a waterblock to which a cooling tube is attached, the first surface forming a substantially flat surface that may be interrupted by ridges or cooling fins disposed thereon or machined or stamped therein.
  • a relatively featureless plate or waterblock 200 formed of sheet metal or another suitable thermally conductive material replaces highly machined prior art plates or tube-in-slab waterblocks described above.
  • many embodiments of waterblock 200 of the present invention have features such as tapped holes or threaded inserts for mounting a PCB to waterblock 200 , such features are very low cost features in comparison to the prior art practice of precision-milling grooves.
  • cooling tube 230 may further reduce machining costs by permitting waterblock 200 to comprise sheet metal that may be sheared to size at relatively low cost.
  • cooling tube 230 instead of placing cooling tube 230 in routed groove 300 , cooling tube 230 one portion of outer surface 250 may be flattened slightly and affixed to sheet metal waterblock 200 .
  • cooling tube 230 is flattened to a D- or O-shaped cross section after serpentine bends are formed in cooling tube 230 , although other cross-sectional shapes are also contemplated such as circular, elliptical, rectangular and square cross-sections.
  • cooling tube 230 flattening at least one side of cooling tube 230 increases the surface area over which outer surface 250 of cooling tube 230 engage substantially planar first surface 210 of waterblock 200 , thereby promoting adhesion and heat transfer. If the bonding material employed to secure cooling tube 230 to first surface 210 has relatively low thermal conductivity (as is the case with some thermally conductive epoxies), the relatively large surface area of outer surface 250 over which a bond may develop between cooling tube 230 and first surface 210 reduces thermal resistance arising from water flowing through lumen 240 of cooling tube 230 . Thermal flux is also promoted by cooling tube 230 having a wide contact area with first surface 210 , which reduces the fin effect (the resistance of heat flowing around the tube periphery).
  • waterblock 200 is formed of sheet metal comprising an aluminum alloy, which has low weight and high thermal conductivity. It is not necessary that cooling tubes 230 be formed of the same alloy or material as waterblock 200 . In most applications where use of the present invention is practical and economic, under typical operating conditions no significant thermally-induced stresses will arise from differential expansion of cooling tube 230 and waterblock 200 . In some cases it is desired that the sheet metal employed to form waterblock 200 be copper owing to its high thermal conductivity.
  • waterblock 200 materials other than aluminum and copper may be used to form waterblock 200 , including, but not limited to a ceramic-containing materials, stainless steel, zinc, nickel, thermally-conductive plastic, aluminum-silicon carbide composites, and alloys, combinations or mixtures of all the foregoing, as well as thermally conductive plastics and composites.
  • thermally conductive epoxy provides the best choice for bonding material 290 , although a wide variety of other materials and methods may be used to attach cooling tube 230 to waterblock 200 .
  • materials and methods are adhesive-containing materials, suitable thermally conductive materials, foam, caulk, tape, glue, epoxy, soldering and brazing.
  • Cooling tube 230 may further be secured to waterblock 200 by means of brackets or clips (not shown in the Figures) for holding cooling tube 230 against upper surface 210 , either as a means of primary attachment or to provide strain relief.
  • the brackets or clips may have legs or portions that are secured to waterblock 200 by means of bolts, screws or adhesive.
  • thermally-filled grease or thermal interface pads may be disposed between outer surface 250 and first surface 210 to facilitate thermal conduction.
  • An electrically nonconductive or electrically insulative, but thermally conductive, material may also be disposed between outer surface 250 and first surface 210 to electrically isolate cooling tube 230 from waterblock 200 .
  • the liquid employed in cooling tube 230 is preferably water, but may also be one or more of COOLANOL (a speciality coiling fluid manufactured by EXXON), polyalpha olefin (PAO) dielectric coolant fluid, synthetic hydrocarbon oil, ethylene glycol, an ethylene glycol/water mixture, or any other suitable cooling fluid.
  • COOLANOL a speciality coiling fluid manufactured by EXXON
  • PAO polyalpha olefin
  • few or no post-attachment steps are required to clean up waterblock 200 after cooling tube 230 has been secured thereto.
  • no material squeeze-out into critical areas results from attachment of cooling tube 230 to waterblock 200 , and thus no cleanup is generally required.
  • relatively featureless and substantially planar first surface 210 of waterblock 200 permits minor imperfections in cooling tube 230 bending or cross section or surface 210 planarity, typically have no impact on proper operation of cooling tube 230 or waterblock 200 .
  • the present invention's tube-on-plate construction may also be employed in applications where a single seamless piece of cooling tube 230 eliminates or reduces the possibility of leaks.
  • a suitable sheet metal plate is sheared from a larger plate to form waterblock 200 .
  • Cooling tube 230 is bent into an appropriate serpentine shape, the shape being configured to meet predetermined heat transfer goals. Accordingly, uniform loops may or may not be formed in cooling tube 230 , depending on anticipated heat flux and temperature conditions. Cooling tube 230 may further be configured to be routed adjacent critical heat-emitting components. In some applications, cooling tube 230 may also be configured such that tube 230 crosses over itself out-of-plane. Such out-of-plane “jumps” are preferably not left dangling but instead are secured to waterblock 200 by some appropriate means such as brackets, clamps or clips.
  • cooling tube 230 is first bent into a preferred serpentine configuration, followed by flattening a portion of outer surface 250 to yield an oval or D-shaped cross-sectional shape by any one of a variety of suitable means. It is preferred that flattening of cooling tube 230 occur after tube 230 has been bent into an appropriate contour so as to minimize the possibility of undesirable out-of-plane flattening of cooling tube 230 . Thermal epoxy is then dispensed along flattened portions of cooling tube 230 , preferably by a dispensing robot that mixes and accurately dispenses epoxy on such flattened portions. Finally, cooling tube 230 is pressed and held against first surface 210 of waterblock 200 with moderate and uniform force until the epoxy has cured and hardened. Waterblock 200 is then inspected and appropriate holes are drilled to mount one or more PCBs thereon. All of the foregoing steps are carried out with little to no machining or hand work, thereby reducing costs.
  • cooling tube 230 is attached to first surface 210 of waterblock 200 by means of brazing, a brazing alloy is applied as a paste or plated on flattened portions of tube 230 . If cooling tube 230 is secured to waterblock 200 by means of clamps, brackets or clips, a dispensing or screening process may be employed to accurately dispense and spread thermal grease onto appropriate portions of tube 230 or first surface 210 . Note that although a sheet metal plate may be employed to form waterblock 200 , thicker plates may be employed to form waterblock 200 and indeed may be preferred in some applications.
  • the present invention possesses mechanical advantages.
  • some distortion of waterblock 200 results which may range between minor and severe and that that varies with the techniques and materials used.
  • Such distortion presents difficulties with flatness and feature placement, since all major machining has been finished before cooling tube 230 is pressed into routed groove 300 .
  • the present invention presents no such difficulties since cooling tube 230 is not pressed or swaged into a groove.
  • waterblock 200 has a relatively small thickness 270 , 270 a or 270 b , which in turn permits the total thickness 280 of waterblock/PCB assembly 295 to be relatively small. See FIGS. 5, 6 and 7 .
  • circuit board 320 may require cooling but does not afford sufficient space and volume to permit the use of a large waterblock. Accordingly, in alternative embodiments of the present invention, typically although not necessarily where circuit board 320 is characterized in having relatively low heat dissipation, cooling tube 230 is routed around the periphery of board 320 . See FIGS. 6 and 7 . In another alternative embodiment of the present invention, a sheet metal plate or other suitable material having a recess disposed in a portion thereof for accepting circuit board 320 therein and forming a periphery thereabout is employed to form waterblock 200 , more about which we say below.
  • Cooling tube 230 is mounted along the periphery of circuit board 320 and preferably on the same side of the PCB as electrical/electronic circuitry mounted thereon to permit double use of space above the plane of the board bottom (see FIG. 6 ). Note that some areas of sheet metal in waterblock 200 of FIG. 6 could be punched out relatively easily to permit back side components to be mounted thereon.
  • FIG. 6 Yet another means of providing a space- and volume-saving construction in the present invention is illustrated in FIG. 6 , where circuit board 320 has electrical/electronic circuitry and components 330 mounted on both sides thereof.
  • surfaces 220 a and 220 b may be configured to engage the surfaces of components 330 mounted on circuit board 320 , such components being optimized for top-side cooling (as is usually the case for components designed for air cooling).
  • Cooling tube 230 is preferably although not necessarily located at the periphery of circuit board 320 and is bonded to waterblocks 200 a and 200 b by means of adhesives 290 a and 290 b . Waterblocks 200 a and 200 b dissipate heat generated by components 330 on both sides of circuit board 320 .
  • Cooling tube 230 may encircle circuit board 320 or be positioned on one, two or three sides thereof, depending on heat flux and size requirements.
  • the present invention includes within its scope various methods of making and using waterblock 200 and cooling tube 230 of the present invention.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
US11/257,669 2005-10-25 2005-10-25 Waterblock for cooling electrical and electronic circuitry Abandoned US20070089858A1 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
US11/257,669 US20070089858A1 (en) 2005-10-25 2005-10-25 Waterblock for cooling electrical and electronic circuitry
TW095118091A TW200718343A (en) 2005-10-25 2006-05-22 Waterblock for cooling electrical and electronic circuitry
DE102006033226A DE102006033226B4 (de) 2005-10-25 2006-07-18 Kühlanordnung zum Kühlen eines elektrischen und elektronischen Schaltungsaufbaus
JP2006281384A JP2007121286A (ja) 2005-10-25 2006-10-16 電気回路又は電子回路を冷却するためのウォータブロック
KR1020060103647A KR20070044786A (ko) 2005-10-25 2006-10-24 열 발생 전기 회로 또는 전자 회로 냉각 장치 및 그 제조방법
CNA2006101498359A CN1956648A (zh) 2005-10-25 2006-10-25 用于冷却电气和电子电路的水冷块

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/257,669 US20070089858A1 (en) 2005-10-25 2005-10-25 Waterblock for cooling electrical and electronic circuitry

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US20070089858A1 true US20070089858A1 (en) 2007-04-26

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US11/257,669 Abandoned US20070089858A1 (en) 2005-10-25 2005-10-25 Waterblock for cooling electrical and electronic circuitry

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US (1) US20070089858A1 (ja)
JP (1) JP2007121286A (ja)
KR (1) KR20070044786A (ja)
CN (1) CN1956648A (ja)
DE (1) DE102006033226B4 (ja)
TW (1) TW200718343A (ja)

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US20090071406A1 (en) * 2007-09-19 2009-03-19 Soo Young Choi Cooled backing plate
US20090101316A1 (en) * 2007-10-18 2009-04-23 Evga Corporation Heat dissipating assembly with reduced thermal gradient
US20090154105A1 (en) * 2007-12-18 2009-06-18 Hon Hai Precision Industry Co., Ltd. Heat dissipation device and a method for manufacturing the same
US20110000645A1 (en) * 2009-07-06 2011-01-06 Ping Chen Heat dissipating board structure and method of manufacturing the same
US20110290450A1 (en) * 2010-05-31 2011-12-01 Asia Vital Components Co., Ltd. Heat Dissipation Module
US20120043057A1 (en) * 2010-08-19 2012-02-23 Chun-Ming Wu Heat-dissipating module
US20220053663A1 (en) * 2020-08-13 2022-02-17 Aptiv Technologies Limited Cooling Device and Method of Manufacturing the Same
US11644254B2 (en) 2018-09-04 2023-05-09 Ovh Thermal transfer device having a fluid conduit

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JP5309901B2 (ja) * 2008-11-04 2013-10-09 ダイキン工業株式会社 取付構造
JP2011009266A (ja) * 2009-06-23 2011-01-13 Sansha Electric Mfg Co Ltd ヒートシンク、及びヒートシンクの製造方法
JP5775388B2 (ja) * 2011-07-16 2015-09-09 エルエスアイクーラー株式会社 液冷ヒートシンク
CN103822511A (zh) * 2014-03-05 2014-05-28 新乡市豫航热交换科技有限公司 一种冷却板
CN104486938B (zh) * 2015-01-04 2017-05-24 东莞市威力固电路板设备有限公司 水冷散热板的制备方法
EP3121548B8 (de) * 2015-07-24 2022-09-14 Kst Ag Wärmeaustauschelement
CN107368666A (zh) * 2017-08-25 2017-11-21 揭阳市美度实业有限公司 冷凝器用钎焊层和d型集流管复合结构的设计与制作方法
DE102017219655A1 (de) * 2017-11-06 2019-05-09 Mahle International Gmbh Gehäuse für ein elektronisches Bauteil
DE102021111711B4 (de) 2021-05-05 2022-12-15 Rolf Prettl Temperiervorrichtung für elektronische Bauelemente

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JP2007121286A (ja) 2007-05-17
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TW200718343A (en) 2007-05-01
DE102006033226A1 (de) 2007-04-26
CN1956648A (zh) 2007-05-02

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