TW200718343A - Waterblock for cooling electrical and electronic circuitry - Google Patents

Waterblock for cooling electrical and electronic circuitry

Info

Publication number
TW200718343A
TW200718343A TW095118091A TW95118091A TW200718343A TW 200718343 A TW200718343 A TW 200718343A TW 095118091 A TW095118091 A TW 095118091A TW 95118091 A TW95118091 A TW 95118091A TW 200718343 A TW200718343 A TW 200718343A
Authority
TW
Taiwan
Prior art keywords
waterblock
cooling tube
electronic circuitry
cooling electrical
electrical
Prior art date
Application number
TW095118091A
Other languages
English (en)
Inventor
John W Andberg
Noriyuki Sugihara
Original Assignee
Agilent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agilent Technologies Inc filed Critical Agilent Technologies Inc
Publication of TW200718343A publication Critical patent/TW200718343A/zh

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2886Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
TW095118091A 2005-10-25 2006-05-22 Waterblock for cooling electrical and electronic circuitry TW200718343A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/257,669 US20070089858A1 (en) 2005-10-25 2005-10-25 Waterblock for cooling electrical and electronic circuitry

Publications (1)

Publication Number Publication Date
TW200718343A true TW200718343A (en) 2007-05-01

Family

ID=37905463

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095118091A TW200718343A (en) 2005-10-25 2006-05-22 Waterblock for cooling electrical and electronic circuitry

Country Status (6)

Country Link
US (1) US20070089858A1 (zh)
JP (1) JP2007121286A (zh)
KR (1) KR20070044786A (zh)
CN (1) CN1956648A (zh)
DE (1) DE102006033226B4 (zh)
TW (1) TW200718343A (zh)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090071406A1 (en) * 2007-09-19 2009-03-19 Soo Young Choi Cooled backing plate
US20090101316A1 (en) * 2007-10-18 2009-04-23 Evga Corporation Heat dissipating assembly with reduced thermal gradient
US7643293B2 (en) * 2007-12-18 2010-01-05 Hon Hai Precision Industry Co., Ltd. Heat dissipation device and a method for manufacturing the same
JP5309901B2 (ja) * 2008-11-04 2013-10-09 ダイキン工業株式会社 取付構造
JP2011009266A (ja) * 2009-06-23 2011-01-13 Sansha Electric Mfg Co Ltd ヒートシンク、及びヒートシンクの製造方法
US20110000645A1 (en) * 2009-07-06 2011-01-06 Ping Chen Heat dissipating board structure and method of manufacturing the same
US20110290450A1 (en) * 2010-05-31 2011-12-01 Asia Vital Components Co., Ltd. Heat Dissipation Module
US20120043057A1 (en) * 2010-08-19 2012-02-23 Chun-Ming Wu Heat-dissipating module
JP5775388B2 (ja) * 2011-07-16 2015-09-09 エルエスアイクーラー株式会社 液冷ヒートシンク
CN103822511A (zh) * 2014-03-05 2014-05-28 新乡市豫航热交换科技有限公司 一种冷却板
CN104486938B (zh) * 2015-01-04 2017-05-24 东莞市威力固电路板设备有限公司 水冷散热板的制备方法
EP3121548B8 (de) * 2015-07-24 2022-09-14 Kst Ag Wärmeaustauschelement
CN107368666A (zh) * 2017-08-25 2017-11-21 揭阳市美度实业有限公司 冷凝器用钎焊层和d型集流管复合结构的设计与制作方法
DE102017219655A1 (de) * 2017-11-06 2019-05-09 Mahle International Gmbh Gehäuse für ein elektronisches Bauteil
PL3620741T3 (pl) 2018-09-04 2021-05-31 Ovh Urządzenie do wymiany ciepła mające przewód płynowy
EP3955716B1 (en) * 2020-08-13 2024-07-31 Aptiv Technologies AG Cooling device and method of manufacturing the same
DE102021111711B4 (de) 2021-05-05 2022-12-15 Rolf Prettl Temperiervorrichtung für elektronische Bauelemente

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1982075A (en) * 1932-03-23 1934-11-27 Fedders Mfg Co Inc Method of making refrigerating apparatus
FR1150673A (fr) * 1955-01-28 1958-01-16 Westinghouse Brake & Signal Redresseur sec avec dispositif de refroidissement
GB826625A (en) * 1956-12-04 1960-01-13 Porter & Co Salford Ltd T Improvements relating to heat exchange apparatus
US4026272A (en) * 1975-06-13 1977-05-31 Bottum Edward W Solar collector
US4023557A (en) * 1975-11-05 1977-05-17 Uop Inc. Solar collector utilizing copper lined aluminum tubing and method of making such tubing
JPS52137505A (en) * 1976-05-13 1977-11-17 Balcke Duerr Ag Tube wall comprising plurality of tubes extending horizontally or slantly in parallel with each other
DE3908996C2 (de) * 1989-03-18 1993-09-30 Abb Patent Gmbh Verfahren zur Herstellung eines Flüssigkeitskühlkörpers
FR2682748A1 (fr) * 1991-10-18 1993-04-23 Aerospatiale Panneau pour le conditionnement thermique, le support et la fixation d'un equipement.
US5829516A (en) * 1993-12-15 1998-11-03 Aavid Thermal Products, Inc. Liquid cooled heat sink for cooling electronic components
DE4437971C2 (de) * 1994-10-24 1997-09-11 Siemens Ag Kühleinrichtung für elektrische Baugruppen
JP3010181B2 (ja) * 1996-09-02 2000-02-14 ダイヤモンド電機株式会社 放熱装置の受熱部構造
DE19842561C2 (de) * 1998-09-17 2003-03-20 Rittal Gmbh & Co Kg Gehäuse zur Aufnahme elektrischer und/oder elektronischer Baueinheiten
GB2352092B (en) * 1999-07-13 2003-10-29 Delphi Tech Inc Motor vehicle control module
JP2001033179A (ja) * 1999-07-22 2001-02-09 Showa Alum Corp チューブ型熱交換器およびその製造方法
DE20200484U1 (de) * 2002-01-14 2002-06-20 Arnold Müller GmbH & Co. KG, 73230 Kirchheim Kühlvorrichtung für Bauteile, insbesondere für elektrische oder elektronische Bauteile, wie Stromrichter o.dgl.
US6536227B1 (en) * 2002-01-29 2003-03-25 Daewoo Electronics Corporation Direct cooling type refrigerator
WO2003091636A1 (de) * 2002-04-26 2003-11-06 BSH Bosch und Siemens Hausgeräte GmbH Wärmetauscher für ein kältegerät und verfahren zur herstellung eines wärmetauschers
JP4243654B2 (ja) * 2003-10-21 2009-03-25 古河スカイ株式会社 電子機器部品の液体冷却板、液体冷却板の製造方法
JP2006132850A (ja) * 2004-11-05 2006-05-25 Usui Kokusai Sangyo Kaisha Ltd 冷却ユニットおよびその製造方法
DE102005036299B4 (de) * 2005-08-02 2008-01-24 Siemens Ag Kühlanordnung

Also Published As

Publication number Publication date
KR20070044786A (ko) 2007-04-30
JP2007121286A (ja) 2007-05-17
US20070089858A1 (en) 2007-04-26
DE102006033226A1 (de) 2007-04-26
CN1956648A (zh) 2007-05-02
DE102006033226B4 (de) 2009-08-13

Similar Documents

Publication Publication Date Title
TW200718343A (en) Waterblock for cooling electrical and electronic circuitry
TW200802744A (en) Electronic component module
TW200709766A (en) Flexible circuit board with heat sink
TW200709475A (en) Light emitting diode package and method for making same
WO2012011978A3 (en) Printed circuit board module enclosure and apparatus using same
TW200642547A (en) A substantially continuous layer of embedded transient protection for printed circuit boards
MX2009011777A (es) Tarjeta de circuito de base de metal.
WO2006089033A3 (en) Led light module assembly
ATE500612T1 (de) Anordnung in druckkontaktierung mit einem leistungshalbleitermodul
DE502004003231D1 (de) Elektrischer Platinenheizbaustein, Elektronikplatine und Verfahren zum Beheizen
WO2007118831A3 (de) Elektronisches bauelementmodul
TW200725870A (en) Semiconductor device
ATE242954T1 (de) Mehrschichtleiterplatte
TW200628878A (en) Display apparatus
EP2040347A4 (en) OMNIBUS BAR DEVICE AND PRINTED CIRCUIT BOARD MOUNTED THEREWITH
TW200501856A (en) Method of mounting an electronic part
TW200618703A (en) Connection method of conductive articles, and electric or electronic component with parts connected by the connection method
DE502008002850D1 (de) Schaltungsvorrichtung mit gebondetem SMD-Bauteil
ATE538345T1 (de) Elektrische schaltungsanordnung
WO2005106954A3 (de) Leistungshalbleiterschaltung und verfahren zum herstellen einer leistungshalbleiterschaltung
WO2007043972A8 (en) Device carrying an integrated circuit/components and method of producing the same
TW200717378A (en) Plasma display device
TW200702172A (en) Heat spreader for printed circuit boards
DE202005001163U1 (de) Leiterplatte oder Platine mit Heizdraht
TW200742665A (en) Substrate of flexible printed circuit board