US20060011292A1 - Apparatus and method for manufacturing liquid crystal display devices, method for using the apparatus, and device produced by the method - Google Patents
Apparatus and method for manufacturing liquid crystal display devices, method for using the apparatus, and device produced by the method Download PDFInfo
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- US20060011292A1 US20060011292A1 US11/228,347 US22834705A US2006011292A1 US 20060011292 A1 US20060011292 A1 US 20060011292A1 US 22834705 A US22834705 A US 22834705A US 2006011292 A1 US2006011292 A1 US 2006011292A1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1341—Filling or closing of cells
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/60—In a particular environment
- B32B2309/68—Vacuum
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2315/00—Other materials containing non-metallic inorganic compounds not provided for in groups B32B2311/00 - B32B2313/04
- B32B2315/08—Glass
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
- B32B2457/202—LCD, i.e. liquid crystal displays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/18—Handling of layers or the laminate
- B32B38/1858—Handling of layers or the laminate using vacuum
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1341—Filling or closing of cells
- G02F1/13415—Drop filling process
Definitions
- LCD liquid crystal display
- PDP plasma display panel
- ELD electro-luminescent display
- VFD vacuum fluorescent display
- LCD devices have been used because of their high resolution, light weight, thin profile, and low power consumption.
- LCD devices have been implemented in mobile devices such as monitors for notebook computers.
- LCD devices have been developed for monitors of computer and television to receive and display broadcasting signals.
- a plurality of gate lines are formed along one direction at fixed intervals on the first glass substrate (TFT array substrate), and a plurality of data lines are formed along a second direction perpendicular to one direction of the plurality of gate lines, thereby defining a plurality of pixel regions.
- a plurality of pixel electrodes are formed in a matrix arrangement at the pixel regions, and a plurality of thin film transistors (TFT) are formed at the pixel regions. Accordingly, the plurality of thin film transistors are switched by signals transmitted along the gate lines and transfer signals transmitted along the data lines to each pixel electrode.
- black matrix films are formed on the second glass substrate (color filter substrate) except at regions of the second glass substrate that correspond to the pixel regions of the first glass substrate.
- a process for manufacturing an LCD device using a TFT substrate and a color filter substrate will be described with reference to a manufacturing apparatus according to the related art.
- the process for manufacturing an LCD device includes steps of forming a sealant pattern on one of a first and second substrate to form an injection inlet, bonding the first and second substrates to each other within a vacuum processing chamber, and injecting liquid crystal material through the injection inlet.
- a liquid crystal dropping method which is disclosed in Japanese Patent Application No. 11-089612 and 11-172903, includes steps of dropping liquid crystal material on a first substrate, arranging a second substrate over the first substrate, and moving the first and second substrates, thereby bonding the first and second substrates to each other.
- the liquid crystal dropping method is advantageous in that various steps such as, formation of a liquid crystal material injection inlet, injection of the liquid crystal material, and sealing of the injection inlet are unnecessary since the liquid crystal material is predisposed on the first substrate.
- FIGS. 1 and 2 show cross sectional views of a substrate bonding device using the liquid crystal dropping method according to the related art.
- the substrate bonding device includes a frame 10 , an upper stage 21 , a lower stage 22 , a sealant dispensor (not shown), a liquid crystal material dispensor 30 , a processing chamber includes an upper chamber unit 31 and a lower chamber unit 32 , a chamber moving system 40 , and a stage moving system 50 .
- the chamber moving system 40 includes a driving motor driven to selectively move the lower chamber unit 32 to a location at which the bonding process is carried out, or to a location at which outflow of the sealant occurs and dropping of the liquid crystal material.
- the stage moving system 50 includes another driving motor driven to selectively move the upper stage 21 along a vertical direction perpendicular to the upper and lower stages 21 and 22 .
- a receiving system temporarily receives a substrate 52 at opposite diagonal portions of the substrate 52 .
- the receiving system is attached to the upper stage 21 , and includes a rotational axis 61 provided to extend from an exterior of the upper chamber unit 31 to an interior of the upper chamber unit 31 , a rotational actuator 63 fixed to the exterior of the upper chamber unit 31 at one end of the rotational axis 61 and driven to selectively rotate the rotational axis 61 , an elevating actuator 64 selectively elevating the rotational actuator 63 , and a receiving plate 62 provided at the other end of the rotational axis 61 to form a single body with the rotational axis 61 , thereby selectively supporting opposite edge portions of the substrate 52 .
- a process of manufacturing a liquid crystal display device using the substrate assembly device follows. First, a second substrate 52 is loaded upon the upper stage 21 , and a first substrate 51 is loaded upon the lower stage 22 . Then, the lower chamber unit 32 having the lower stage 22 is moved to a processing location (S 1 ) by the chamber moving system 40 for sealant dispensing and liquid crystal material dispensing. Subsequently, the lower chamber unit 32 is moved to a processing location (S 2 ) for substrate bonding by the chamber moving system 40 . Thereafter, the upper and lower chamber units 31 and 32 are assembled together by the chamber moving system 40 to form a vacuum tight seal, and a pressure in the chamber is reduced by a vacuum generating system (not shown).
- the elevating actuator 64 is driven to move the rotational axis 61 toward a lower part of the upper stage 21 , and at the same time the rotational actuator 63 is driven to rotate the rotational axis 61 so that the receiving plate 62 is positioned at both edges of the second substrate 52 fixed to the upper stage 21 .
- FIGS. 2 and 3 show a perspective view of an operational state of a receiving system of a substrate assembly device according to a prior art.
- the stage moving system 50 moves the upper stage 21 downward in close corresponding to a height at which the receiving plate 62 is positioned.
- the second substrate 52 When a vacuum state is achieved inside the assembled chamber, the second substrate 52 may fall from the upper stage 21 since the vacuum pressure within the chamber is larger than the vacuum force affixing the second substrate 52 to the upper stages 21 . Accordingly, before the desired vacuum pressure within the chamber is achieved, it is necessary to keep the second substrate 52 temporarily affixed to the upper stage 21 . Once the desired vacuum pressure within the chamber part is attained, the second substrate 52 is affixed to the upper stage 21 by application an electrostatic force to the upper stage 21 . Accordingly, the receiving plates 62 and rotational axis 61 are returned to original standby locations by driving the rotational actuator 63 of the receiving system and the elevating actuator 64 .
- the upper stage 21 is moved downward by the stage moving system 50 to closely fasten the second substrate 52 affixed to the upper stage 21 to the first substrate 51 affixed to the lower stage 22 .
- the process for bonding the first and second substrates 51 and 52 to each other is carried out through a continuous pressurization process, thereby completing the manufacture of LCD device.
- the device of assembling substrates according to the prior art is disadvantages.
- the receiving system is constructed to support only the corner portions of the second substrate 52 .
- a middle portion of the second substrate 52 may become curved downward.
- the deflection of the substrate is attenuated because a thickness of the large-sized LCD devices is relatively thin. Accordingly, the deflection of the relatively thin substrate prevents the application of the receiving system according to the prior art.
- each receiving plate 62 is considerably smaller than an overall size of the second substrate 52 , thereby reducing contact areas between the second substrate 52 and the receiving plates 62 . Furthermore, if the rotational axis 61 does not precisely rotate due to malfunctions of the rotational actuator, the contact areas between the receiving plates 62 and the second substrate 52 become insufficient to support the second substrate, thereby the second substrate 52 may fall from the receiving plates 62 . In addition, if the receiving plates 62 according to the prior art are used to support large-sized LCD devices, the receiving plates 62 will not provide adequate support for the larger substrates. Specifically, the contact areas of the receiving plates 62 are significantly smaller than an entire area of the larger substrate.
- the substrate assembly device according to the prior art has an insufficient number of the receiving plates 62 to effectively manufacture large-sized LCD devices.
- dummy areas at which the respective cell areas fail to be formed and which will be removed by ‘breaking’, are also changed.
- the receiving plates 62 according to the prior art cannot be revised in response to the reconfiguration of the substrate.
- the present invention is directed to an apparatus and method for manufacturing a liquid crystal display device, a method for using the apparatus, and a device produced by the method that substantially obviates one or more problems due to limitations and disadvantages of the related art.
- an apparatus for vacuum bonding a liquid crystal display device includes a unitary vacuum processing chamber, upper and lower stages provided within the vacuum processing chamber for supporting first and second substrates, and at least one first substrate receiving system provided within the vacuum processing chamber to contact dummy areas between cell areas of one of the first and second substrates.
- a method manufacturing a liquid crystal display device includes introducing first and second substrates into a unitary vacuum processing chamber, loading the first and second substrates onto upper and lower stages within the vacuum processing chamber, and contacting dummy areas between cell areas of one of the first and second substrates within the vacuum processing chamber.
- FIG. 1 shows a cross sectional view of a substrate bonding device prior to sealing of upper and lower chamber units according to the prior art
- FIG. 2 shows a cross section view of the substrate bonding device during substrate bonding according to the prior art
- FIG. 3 shows a perspective view of an operational state of a receiving system of a substrate assembly device according to the prior art
- FIG. 10 is a cross sectional view of an exemplary substrate receiving system according to the present invention.
- the vacuum processing chamber 110 may be formed such that bonding between upper and lower substrates is selectively carried out in one of a vacuum pressure state and an atmospheric pressure state within the vacuum processing chamber 110 .
- an air outlet 112 transfers a vacuum force to an inner space of the vacuum processing chamber 110 via an air outlet valve 112 a.
- a subsidiary rotational axis may be incorporated into the upper stage 121 to enable rotation of the upper stages 121
- a subsidiary moving axis may be incorporated into the lower stage 122 to enable the vertical movement.
- the supports 420 may be constructed of individual bodies each having a first end attached at the rotational axis 410 corresponding to a corner region of the lower stage 122 , and a second end having a support protrusion 420 a corresponding to a central region of the lower stage 122 .
- the supports 420 may be formed at a first position along a direction parallel to the long side of the upper and lower stages 121 and 122 .
- each of the rotational axis 410 rotate the supports 420 from the first position to a second position in which each of the support protrusions 420 a are disposed at a region corresponding to one of the dummy areas.
- Each of the driving parts 430 of the substrate receiving system 400 may include a cylinder to provide a vertical movement of the rotational axis 410 and a rotational motor 440 that rotates the rotational axis 410 .
- the cylinder may operate using a one, or both of hydraulic or pneumatic control.
- the driving part 430 may include both the cylinder and the rotational motor 440 , wherein the cylinder moves the rotational axis 410 along a vertical plane and the rotational motor 440 rotates the rotational axis 410 along a horizontal plane.
- the cylinder may rotate the rotational axis 410 along the horizontal plane, and the rotational motor 440 may move the rotational axis 410 along the vertical plane.
- a substrate receiving process is performed wherein the substrate receiving system 400 activates the cylinders and rotational motors 440 to position the supports 420 beneath the lower surface of the second substrate 520 , as shown in FIG. 6A .
- the support protrusions 420 a of each of the supports 420 are positioned adjacent to the dummy areas of the second substrate 520 .
- the vacuum pump 123 is disabled, thereby removing the vacuum force from the upper stage 121 .
- the second substrate 520 falls from the upper stage 121 by release of the vacuum force, as shown in FIG. 6B , and the lower surface of the second substrate 520 contacts each of the support protrusions 420 a of each of the supports 420 .
- the supports 420 may be positioned such that the support protrusions 420 a abut the lower surface of the second substrate 520 . Accordingly, when the vacuum force is removed from the upper stage 121 , the second substrate 520 does not necessary fall from the upper stage 121 , thereby preventing any damage to the second substrate 520 by contact to the support protrusions 420 a.
- the first support 421 of the first substrate receiving system 401 may be provided near a middle portion or corner portion of the lower stage 121 , and may be formed to be shorter than the second support 422 of the second substrate receiving system 402 .
- the first substrate receiving system 401 may be provided closer to the lower stage 122 than the second substrate receiving system 402 . Accordingly, the first supports 421 of adjacent first substrate receiving systems 401 are arranged along a first line, and the second supports 422 of adjacent second substrate receiving systems 402 are arranged along a second line parallel to the first line. Moreover, each of the adjacent first substrate receiving systems 401 and each of the adjacent second substrate systems 402 are symmetrically disposed about the lower stage 121 .
- the second rotational axes 412 at a first end of the lower stage 122 must first be rotated in clockwise and counterclockwise directions, and the second rotational axes at a second end of the lower stage 122 must be rotated next in clockwise and counterclockwise directions.
- the second supports 422 at the first end of the lower stage 122 do not interfere with the second supports 422 at the second end of the lower stage 122 .
- the sequence must be reversed when moving the second substrate receiving system 402 into the home position.
- the first rotational axes 411 of the four first substrate receiving systems 401 move upward, and rotate in a similar direction to the second substrate receiving system 402 to position the second supports 422 to a work position, thereby enabling support of a specific portion of the second substrate 520 .
- the first rotational axes 411 of the four first substrate receiving systems 401 move along an upward direction, and then rotate in clockwise and counterclockwise directions to place each of the first supports 421 beneath the second substrate 520 .
- the first support protrusions 421 a are positioned beneath the second substrate 520 within the dummy areas of the second substrate 520 .
Abstract
Description
- The present invention claims the benefit of Korean Patent Application No. P2002-8899 filed in Korea on Feb. 20, 2002, which is hereby incorporated by reference.
- 1. Field of the Invention
- The present invention relates to a manufacturing apparatus, and more particularly, to an apparatus for manufacturing a liquid crystal display suitable for a large-sized liquid crystal display.
- 2. Discussion of the Related Art
- In general, recent developments in the information communication field have increased demand for various types of displays devices. In response to this demand, various flat panel type displays such as liquid crystal display (LCD), plasma display panel (PDP), electro-luminescent display (ELD), and vacuum fluorescent display (VFD) have been developed to replace conventional cathode ray tube (CRT) devices. In particular, LCD devices have been used because of their high resolution, light weight, thin profile, and low power consumption. In addition, LCD devices have been implemented in mobile devices such as monitors for notebook computers. Furthermore, LCD devices have been developed for monitors of computer and television to receive and display broadcasting signals.
- Accordingly, efforts to improve image quality of LCD devices will contrast with the benefits of high resolution, light weight, thin profile, and low power consumption. In order to incorporate LCD devices as a general image display, image quality such as fineness, brightness, large-sized area, for example, must be realized.
- A plurality of gate lines are formed along one direction at fixed intervals on the first glass substrate (TFT array substrate), and a plurality of data lines are formed along a second direction perpendicular to one direction of the plurality of gate lines, thereby defining a plurality of pixel regions. Then, a plurality of pixel electrodes are formed in a matrix arrangement at the pixel regions, and a plurality of thin film transistors (TFT) are formed at the pixel regions. Accordingly, the plurality of thin film transistors are switched by signals transmitted along the gate lines and transfer signals transmitted along the data lines to each pixel electrode. In order to prevent light leakage, black matrix films are formed on the second glass substrate (color filter substrate) except at regions of the second glass substrate that correspond to the pixel regions of the first glass substrate.
- A process for manufacturing an LCD device using a TFT substrate and a color filter substrate will be described with reference to a manufacturing apparatus according to the related art.
- The process for manufacturing an LCD device according to the related art includes steps of forming a sealant pattern on one of a first and second substrate to form an injection inlet, bonding the first and second substrates to each other within a vacuum processing chamber, and injecting liquid crystal material through the injection inlet. In another process of manufacturing an LCD device according to the related art, a liquid crystal dropping method, which is disclosed in Japanese Patent Application No. 11-089612 and 11-172903, includes steps of dropping liquid crystal material on a first substrate, arranging a second substrate over the first substrate, and moving the first and second substrates, thereby bonding the first and second substrates to each other. Compared to the liquid crystal injection method, the liquid crystal dropping method is advantageous in that various steps such as, formation of a liquid crystal material injection inlet, injection of the liquid crystal material, and sealing of the injection inlet are unnecessary since the liquid crystal material is predisposed on the first substrate.
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FIGS. 1 and 2 show cross sectional views of a substrate bonding device using the liquid crystal dropping method according to the related art. InFIG. 1 , the substrate bonding device includes aframe 10, anupper stage 21, alower stage 22, a sealant dispensor (not shown), a liquidcrystal material dispensor 30, a processing chamber includes anupper chamber unit 31 and alower chamber unit 32, achamber moving system 40, and astage moving system 50. Thechamber moving system 40 includes a driving motor driven to selectively move thelower chamber unit 32 to a location at which the bonding process is carried out, or to a location at which outflow of the sealant occurs and dropping of the liquid crystal material. Thestage moving system 50 includes another driving motor driven to selectively move theupper stage 21 along a vertical direction perpendicular to the upper andlower stages substrate 52 at opposite diagonal portions of thesubstrate 52. The receiving system is attached to theupper stage 21, and includes arotational axis 61 provided to extend from an exterior of theupper chamber unit 31 to an interior of theupper chamber unit 31, arotational actuator 63 fixed to the exterior of theupper chamber unit 31 at one end of therotational axis 61 and driven to selectively rotate therotational axis 61, anelevating actuator 64 selectively elevating therotational actuator 63, and areceiving plate 62 provided at the other end of therotational axis 61 to form a single body with therotational axis 61, thereby selectively supporting opposite edge portions of thesubstrate 52. - A process of manufacturing a liquid crystal display device using the substrate assembly device according to the related art follows. First, a
second substrate 52 is loaded upon theupper stage 21, and afirst substrate 51 is loaded upon thelower stage 22. Then, thelower chamber unit 32 having thelower stage 22 is moved to a processing location (S1) by thechamber moving system 40 for sealant dispensing and liquid crystal material dispensing. Subsequently, thelower chamber unit 32 is moved to a processing location (S2) for substrate bonding by thechamber moving system 40. Thereafter, the upper andlower chamber units chamber moving system 40 to form a vacuum tight seal, and a pressure in the chamber is reduced by a vacuum generating system (not shown). Theelevating actuator 64 is driven to move therotational axis 61 toward a lower part of theupper stage 21, and at the same time therotational actuator 63 is driven to rotate therotational axis 61 so that thereceiving plate 62 is positioned at both edges of thesecond substrate 52 fixed to theupper stage 21. -
FIGS. 2 and 3 show a perspective view of an operational state of a receiving system of a substrate assembly device according to a prior art. InFIGS. 2 and 3 , when thestage moving system 50 moves theupper stage 21 downward in close corresponding to a height at which thereceiving plate 62 is positioned. - When a vacuum state is achieved inside the assembled chamber, the
second substrate 52 may fall from theupper stage 21 since the vacuum pressure within the chamber is larger than the vacuum force affixing thesecond substrate 52 to theupper stages 21. Accordingly, before the desired vacuum pressure within the chamber is achieved, it is necessary to keep thesecond substrate 52 temporarily affixed to theupper stage 21. Once the desired vacuum pressure within the chamber part is attained, thesecond substrate 52 is affixed to theupper stage 21 by application an electrostatic force to theupper stage 21. Accordingly, thereceiving plates 62 androtational axis 61 are returned to original standby locations by driving therotational actuator 63 of the receiving system and theelevating actuator 64. - Then, the
upper stage 21 is moved downward by thestage moving system 50 to closely fasten thesecond substrate 52 affixed to theupper stage 21 to thefirst substrate 51 affixed to thelower stage 22. In addition, the process for bonding the first andsecond substrates - However, the device of assembling substrates according to the prior art is disadvantages. First, the receiving system is constructed to support only the corner portions of the
second substrate 52. Thus, a middle portion of thesecond substrate 52 may become curved downward. Specifically, if the receiving system according to the prior art is applied to a manufacturing device for large-sized LCD device, the deflection of the substrate is attenuated because a thickness of the large-sized LCD devices is relatively thin. Accordingly, the deflection of the relatively thin substrate prevents the application of the receiving system according to the prior art. - Second, an overall size of each receiving
plate 62 is considerably smaller than an overall size of thesecond substrate 52, thereby reducing contact areas between thesecond substrate 52 and thereceiving plates 62. Furthermore, if therotational axis 61 does not precisely rotate due to malfunctions of the rotational actuator, the contact areas between thereceiving plates 62 and thesecond substrate 52 become insufficient to support the second substrate, thereby thesecond substrate 52 may fall from thereceiving plates 62. In addition, if the receivingplates 62 according to the prior art are used to support large-sized LCD devices, thereceiving plates 62 will not provide adequate support for the larger substrates. Specifically, the contact areas of thereceiving plates 62 are significantly smaller than an entire area of the larger substrate. - Third, the substrate assembly device according to the prior art has an insufficient number of the
receiving plates 62 to effectively manufacture large-sized LCD devices. Finally, as substrate models are reconfigured, dummy areas, at which the respective cell areas fail to be formed and which will be removed by ‘breaking’, are also changed. Thus, thereceiving plates 62 according to the prior art cannot be revised in response to the reconfiguration of the substrate. - Accordingly, the present invention is directed to an apparatus and method for manufacturing a liquid crystal display device, a method for using the apparatus, and a device produced by the method that substantially obviates one or more problems due to limitations and disadvantages of the related art.
- An object of the present invention is to provide an apparatus and method for manufacturing a liquid crystal display device having a substrate receiving system that can prevent a specific portion of a target substrate from being distorted, sufficiently support the overall substrate, and eliminate interference on operation of subsidiary devices with a structure supporting the substrate temporarily so as to prevent the substrate fixed to an upper stage during a process for achieving a vacuum state inside a vacuum chamber in the process of a vacuum bonding of a liquid crystal display.
- Additional features and advantages of the invention will be set forth in part in the description which follows, and in part will become apparent from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
- To achieve these objects and other advantages and in accordance with the purpose of the invention, as embodied and broadly described herein, an apparatus for vacuum bonding a liquid crystal display device includes a unitary vacuum processing chamber, upper and lower stages provided within the vacuum processing chamber for supporting first and second substrates, and at least one first substrate receiving system provided within the vacuum processing chamber to contact dummy areas between cell areas of one of the first and second substrates.
- In another aspect, a method manufacturing a liquid crystal display device includes introducing first and second substrates into a unitary vacuum processing chamber, loading the first and second substrates onto upper and lower stages within the vacuum processing chamber, and contacting dummy areas between cell areas of one of the first and second substrates within the vacuum processing chamber.
- In another aspect, a liquid crystal display device is manufactured by a method of introducing first and second substrates into a unitary vacuum processing chamber, loading the first and second substrates onto upper and lower stages within the vacuum processing chamber, contacting dummy areas between cell areas of one of the first and second substrates within the vacuum processing chamber, and bonding the first and second substrates together.
- It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the invention as claimed.
- The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principle of the invention. In the drawings:
-
FIG. 1 shows a cross sectional view of a substrate bonding device prior to sealing of upper and lower chamber units according to the prior art; -
FIG. 2 shows a cross section view of the substrate bonding device during substrate bonding according to the prior art; -
FIG. 3 shows a perspective view of an operational state of a receiving system of a substrate assembly device according to the prior art; -
FIG. 4 is a cross-sectional view of an exemplary apparatus to which an exemplary substrate receiving system is applied according to the present invention; -
FIG. 5A is a plane view of the exemplary substrate receiving system along I-I ofFIG. 4 according to the present invention; -
FIG. 5B is a plane view of another exemplary substrate receiving system along line I-I ofFIG. 4 according to the present invention; -
FIG. 6A is a cross sectional view of an exemplary operational state of a substrate receiving system according to the present invention; -
FIG. 6B is a cross sectional view of another exemplary operational state of the substrate receiving system receiving a substrate inFIG. 4 according to the present invention; -
FIG. 7 is a plane view of an exemplary substrate receiving system according to the present invention; -
FIG. 8 is a plane view of an apparatus having another exemplary substrate receiving system; -
FIG. 9 is a plane view of an apparatus having another exemplary substrate receiving system; -
FIG. 10 is a cross sectional view of an exemplary substrate receiving system according to the present invention; and -
FIG. 11 is a plane view of another exemplary substrate receiving system according to the present invention. - Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings.
-
FIGS. 4, 5A , 5B, 6A, and 6B illustrate an exemplary apparatus for vacuum bonding a liquid crystal display (LCD) device according to a first embodiment of the present invention. InFIG. 4 , the apparatus may include avacuum processing chamber 110, upper andlower stages vacuum device 200, aloader part 300, and asubstrate receiving system 400. - The
vacuum processing chamber 110 may be formed such that bonding between upper and lower substrates is selectively carried out in one of a vacuum pressure state and an atmospheric pressure state within thevacuum processing chamber 110. To switch to the vacuum pressure state from an atmospheric pressure state, anair outlet 112 transfers a vacuum force to an inner space of thevacuum processing chamber 110 via anair outlet valve 112 a. - The upper and
lower stages vacuum processing chamber 110, respectively. The upper andlower stages second substrates vacuum processing chamber 110 via theloading part 300. The upper andlower stages electrostatic chuck first substrates lower stages upper stage 121 may also include a plurality of vacuum holes 121 b formed along at least a circumference of theupper stage 121, and interconnected viapipelines 121 c to transmit a vacuum force generated by avacuum pump 123 to affix thesecond substrate 520 to a lower surface of theupper stage 121. The plurality of vacuum holes 121 b may also be formed at a central portion of the upper substrate. Moreover, thelower stage 122 may also include a plurality of vacuum holes (not shown) formed along at least a circumference of thelower stage 122, and interconnected via pipelines (not shown) to transmit a vacuum force generated by a vacuum pump (not shown) to affix thefirst substrate 520 to an upper surface of thelower stage 122. - The
electrostatic chucks electrostatic chucks electrostatic chuck 122 a may be mounted at a top surface of thelower stage 122, and may include at least one vacuum hole (not shown) provided along a circumference of theelectrostatic chuck 122 a. Moreover, theelectrostatic chuck 122 a and the at least one vacuum hole formed at the top surface of thelower stage 122 is not limited to the same construction of theupper stage 121. Preferably, theelectrostatic chuck 122 a and the at least one vacuum hole at the top surface of thelower stage 122 are arranged so as to consider the overall shape of a target substrate, and the respective liquid crystal dispensing areas. - The stage moving device includes a moving
axis 131 selectively driven to move theupper stage 121, arotational axis 132 selectively driven to rotate thelower stage 122, and drivingmotors lower stages vacuum processing chamber 110 to drive the axes, respectively. Accordingly, the stage moving device is not limited to the device moving theupper stage 121 up and down or thelower stage 122 right and left. Preferably, the stage moving device enables movement of theupper stage 121 along a horizontal direction, and movement of thelower stage 122 along a vertical direction. In addition, a subsidiary rotational axis (not shown) may be incorporated into theupper stage 121 to enable rotation of theupper stages 121, and a subsidiary moving axis (not shown) may be incorporated into thelower stage 122 to enable the vertical movement. - The
loader part 300 may be arranged at the exterior of thevacuum processing chamber 110 separately from various elements provided inside thevacuum processing chamber 110. Theloader part 300 may include afirst arm 310 to carry thefirst substrate 510 upon which at least the liquid crystal material is disposed into thevacuum processing chamber 110, and asecond arm 320 to carry thesecond substrate 520 into thevacuum processing chamber 110. Alternatively, thefirst substrate 510 may have both the liquid crystal material and the sealant disposed on a surface thereof, wherein the first substrate may be one of a TFT array substrate and a color filter (C/F) substrate. Thefirst arm 310 is disposed over thesecond arm 320 so that contaminating particles from thesecond substrate 520 will not fall upon thefirst substrate 510. - The
substrate receiving system 400 may contact a portion of thesecond substrate 520 at dummy areas particularly located between cell areas formed on thesecond substrate 520. Each of thesubstrate receiving system 400 may include arotational axis 410, asupport 420, a support protrusion, and a drivingpart 430. Thesubstrate receiving system 400 may be provided at an interior bottom portion of thevacuum processing chamber 110 adjacent to sides of thelower stage 122. Accordingly, a total number of thesubstrate receiving system 400 may be about 2 to 10. -
FIGS. 5A and 5B are a plane views of the exemplary substrate receiving system along line I-I ofFIG. 4 according to the present invention. InFIG. 5A , one end of thesupport 420 to which therotational axis 410 is coupled may be placed at the interior bottom portion of thevacuum processing chamber 110, which corresponds to a corner portion of one of a long side and a short side of each of the upper andlower stages substrate receiving system 400 may be provided at a vicinity of one corner portion or both corner portions of one side of thelower stage 122 or at a vicinity of one corner portion or both corner portions of the other side of thelower stage 122. In FIG. 5B, one end of thesupport 420 to which therotational axis 410 is coupled may be placed at the interior bottom portion of thevacuum processing chamber 110, which corresponds to a middle portion of one of a long side and a short side of each of the upper andlower stages substrate receiving system 400 may be provided at a vicinity of a central portion of one or the other side of thelower stage 122, or may be provided at each corner and central portions simultaneously. When thesubstrate receiving system 400 is provided at the vicinity of the central portion of one side or the other side of thelower stage 122, it is also possible to provide a plurality ofsubstrate receiving system 400. - In
FIG. 5A , thesupports 420 may be constructed of individual bodies each having a first end attached at therotational axis 410 corresponding to a corner region of thelower stage 122, and a second end having asupport protrusion 420 a corresponding to a central region of thelower stage 122. Thesupports 420 may be formed at a first position along a direction parallel to the long side of the upper andlower stages supports 420, each of therotational axis 410 rotate thesupports 420 from the first position to a second position in which each of thesupport protrusions 420 a are disposed at a region corresponding to one of the dummy areas. Alternatively, thesupports 420 may be formed along a direction parallel to the short side of the upper andlower stages substrate receiving system 400 along the direction parallel to the long side of the upper andlower stages - Each of the
support protrusions 420 a may be formed at top portions of thesupports 420 to reduce a contact area between thesupports 420 and thesecond substrate 520. The support protrusions 420 a are disposed along thesupports 420 such that when thesupport 420 is positioned under theupper stage 121, thesupport protrusions 420 a contact the dummy areas of thesecond substrate 520. Each of thesupport protrusions 420 a may have a same protruding height, or each of thesupport protrusions 420 a may have different relative heights. Moreover, each of thesupport protrusions 420 a may have individually adjustable heights and eachsupport 420 may have a plurality of at least onesupport protrusion 420 a. When at least twosupport protrusions 420 a are formed at a top surface of thesupport 420, an interval between the at least twosupport protrusions 420 a may be selected to prevent a displacement of thesecond substrate 520. In addition, the interval between the at least twosupport protrusions 420 a may be less than a corresponding distance between adjacent cell areas such that the at least twosupport protrusions 420 a contact the second substrate with the dummy area. - Each of the driving
parts 430 of thesubstrate receiving system 400 may include a cylinder to provide a vertical movement of therotational axis 410 and arotational motor 440 that rotates therotational axis 410. The cylinder may operate using a one, or both of hydraulic or pneumatic control. Alternatively, the drivingpart 430 may include both the cylinder and therotational motor 440, wherein the cylinder moves therotational axis 410 along a vertical plane and therotational motor 440 rotates therotational axis 410 along a horizontal plane. Moreover, the cylinder may rotate therotational axis 410 along the horizontal plane, and therotational motor 440 may move therotational axis 410 along the vertical plane. - During deployment of the
substrate receiving system 400, thesupports 420 may be elevated from a home position to a first position along the vertical direction above an upper surface of the lower stage, and thus above an upper surface of thefirst substrate 510, via one of the cylinder androtational motor 440. Once thesupports 420 have been elevated above the upper surface of thefirst substrate 510, therotational motor 440 rotates thesupports 420 about therotational axis 410 to a second position in which thesupport protrusions 420 a are disposed adjacent to the dummy areas of thesecond substrate 520. Consideration must be given regarding the home position of thesupports 420. Specifically, the home position of thesupport 420 should be determined such that an upper surface of each of thesupport protrusions 420 a should be lower than a top surface of thelower stage 122 to prevent any possible interference with a lower surface of thefirst substrate 510. Furthermore, consideration should be given to the first andsecond arms loader part 300 such that thesubstrate receiving system 400 does not interfere with loading and unloading of the first andsecond substrates - Each of the driving
parts 430 may be disposed at the exterior of thevacuum processing chamber 110. Specifically, therotational axis 410 may be provided to penetrate the bottom portion of thevacuum processing chamber 110, and a sealing system (not shown) may be provided to prevent air from entering into thevacuum processing chamber 110 during a vacuum pressure state. - A process for using the apparatus to bond substrates according to the present invention will now be explained with reference to
FIGS. 4, 6A , and 6B. - In
FIG. 4 , a loading process is conducted wherein theloader part 300 controls the first andsecond arms second substrates first substrate 510 includes at least the liquid crystal material disposed on a first surface of thefirst substrate 510. As previously explained, thefirst substrate 510 may include both the liquid crystal material and the sealant, and thefirst substrate 510 may include one of the TFT array substrate and the C/F substrate. Once the first andsecond arms second substrates loader part 300 controls thesecond arm 320 to provide thesecond substrate 520 onto the lower surface of theupper stage 121. Accordingly, thevacuum pump 123 provides the necessary vacuum force to theupper stage 122 to transfer thesecond substrate 520 from thesecond arm 320 to the lower surface of theupper stage 121. Thus, thesecond substrate 520 provided by thesecond arm 320 is affixed to theupper stage 121 by the vacuum force generated by thevacuum pump 123. - During the loading process, if a bonding process of the first and
second substrates second arm 320 may unload the bonded substrates remaining on thelower stage 122 after loading thesecond substrate 520 onto theupper stage 121. Then, the bonded substrates may be removed from thevacuum processing chamber 110, and transferred to another processing step by thesecond arm 320, thereby shorten process time of the bonded substrates. - After the
second arm 320 has transferred the bonded substrates, theloader part 300 controls thefirst arm 310 to provide thefirst substrate 510 upon which at least the liquid crystal material is disposed onto an upper surface of thelower stage 122. Accordingly, the vacuum pump (not shown) associated with thelower stage 122 provides the necessary vacuum force to thelower stage 122 to transfer thefirst substrate 510 from thefirst arm 510 to the upper surface of thelower stage 122. Thus, thefirst substrate 510 provided byfirst arm 310 is affixed to thelower stage 122 by the vacuum force generated by the vacuum pump (not shown) that is associated with thelower stage 122. After loading thefirst substrate 510 onto thelower stage 122, thefirst arm 310 of theloader part 300 exits thevacuum processing chamber 110. Thus, the loading process is finished. - Once both of the first and
second substrates lower stages shield door 114 provided at theentrance 111 of thevacuum processing chamber 110 close theentrance 111. Theshield door 114 provides for a vacuum tight seal with thevacuum processing chamber 110. - Next, a vacuum process is started where the
vacuum device 200 is actuated to generate a vacuum force while theswitch valve 112 a provided at theair outlet 112 of thevacuum processing chamber 110 keeps theair outlet 112 open. The vacuum force generated by thevacuum device 200 is transferred to the interior of thevacuum processing chamber 110, thereby gradually reducing the pressure at the interior of thevacuum processing chamber 110. - During the vacuum process, a substrate receiving process is performed wherein the
substrate receiving system 400 activates the cylinders androtational motors 440 to position thesupports 420 beneath the lower surface of thesecond substrate 520, as shown inFIG. 6A . Specifically, thesupport protrusions 420 a of each of thesupports 420 are positioned adjacent to the dummy areas of thesecond substrate 520. Then, thevacuum pump 123 is disabled, thereby removing the vacuum force from theupper stage 121. Accordingly, thesecond substrate 520 falls from theupper stage 121 by release of the vacuum force, as shown inFIG. 6B , and the lower surface of thesecond substrate 520 contacts each of thesupport protrusions 420 a of each of thesupports 420. Alternatively, thesupports 420 may be positioned such that thesupport protrusions 420 a abut the lower surface of thesecond substrate 520. Accordingly, when the vacuum force is removed from theupper stage 121, thesecond substrate 520 does not necessary fall from theupper stage 121, thereby preventing any damage to thesecond substrate 520 by contact to thesupport protrusions 420 a. - Meanwhile, once the vacuum pressure at the interior of the
vacuum processing chamber 110 has been attained, theair outlet valve 112 a is enabled to close theair outlet 112, and thevacuum device 200 is stopped. However, the substrate receiving process may to be executed after the vacuum process is completed, or prior to a start of the vacuum process. Alternatively, the substrate receiving process may be performed prior to the sealing of thevacuum processing chamber 110 by theshield door 114. Moreover, the substrate receiving process may begin once thesecond substrate 520 has been transferred onto theupper stage 121. - Once the vacuum process has been competed, an electrostatic process may begin wherein the upper and
lower stages electrostatic chucks first substrates lower stages substrate receiving system 400 may be enabled to return thesupports 420 to the home position. - Once the
substrate receiving system 400 have returned to the home position, an alignment process may be performed to align the first andsecond substrates lower stages lower drive motors lower stages second substrates - After completion of the bonding process, the vacuum pressure at the interior of the
vacuum processing chamber 110 may be decreased by a vacuum release valve (not shown) that may be attached to thevacuum processing chamber 110. Then, once the pressure at the interior of thevacuum processing chamber 110 attains ambient atmospheric pressure, theshield door 114 of thevacuum processing chamber 110 may be driven to open theentrance 111. Finally, the bonded substrates may be unloaded by thesecond arm 320 of theloader part 300, and the loading process is started again. -
FIGS. 7 and 8 are plane views of exemplary substrate receiving systems according to the present invention. InFIG. 7 , a firstsubstrate receiving system 401 and a secondsubstrate receiving system 402 may be incorporated into the apparatus according to the present invention. The firstsubstrate receiving system 401 may include a firstrotational axis 411, afirst support 421, and afirst support protrusion 421 a. The secondsubstrate receiving system 402 may include a secondrotational axis 412, asecond support 422, and asecond support protrusion 422 a. Thefirst support 421 of the firstsubstrate receiving system 401 may be provided near a middle portion or corner portion of thelower stage 121, and may be formed to be shorter than thesecond support 422 of the secondsubstrate receiving system 402. The firstsubstrate receiving system 401 may be provided closer to thelower stage 122 than the secondsubstrate receiving system 402. Accordingly, thefirst supports 421 of adjacent firstsubstrate receiving systems 401 are arranged along a first line, and thesecond supports 422 of adjacent secondsubstrate receiving systems 402 are arranged along a second line parallel to the first line. Moreover, each of the adjacent firstsubstrate receiving systems 401 and each of the adjacentsecond substrate systems 402 are symmetrically disposed about thelower stage 121. - In
FIG. 8 , thefirst supports 421 at a first side of thelower stage 122 are arranged along a first line, and thesecond supports 422 at the first side of thelower stage 122 are not arranged along a second line. Specifically, thesecond supports 422 at the first side of thelower stage 122 are offset. - In
FIGS. 7 and 8 , the firstrotational axis 411 of the firstsubstrate receiving system 401 may be formed to be reciprocally offset to the secondrotational axis 412 of the secondsubstrate receiving system 402. In addition, the secondrotational axis 412 may be formed to be closer to a short side of thelower stage 122 than the firstrotational axis 411, whereby the first and secondrotational axes first support 421 of the firstsubstrate receiving system 401 and thesecond support 422 of the secondsubstrate receiving system 402. Moreover, a timing sequence of the first and secondsubstrate receiving systems - The first and second
substrate receiving systems lower stage 122 in a direction of the long side of thelower stage 122 so as to confront each other. Accordingly, the first and secondsubstrate receiving systems substrate receiving systems substrate receiving systems lower stage 122, since the short sides of thelower stage 122 fail to provide sufficient margin space. Thus, the first and secondsubstrate receiving systems lower stage 122. - During the substrate receiving process, four of the second
substrate receiving systems 402 operate to move to a work position, thereby enabling support of a specific portion of thesecond substrate 520. Specifically, the secondrotational axes 412 of the four secondsubstrate receiving systems 402 move along an upward direction, and then rotate in clockwise and counterclockwise directions to place each of thesecond supports 422 beneath thesecond substrate 520. Accordingly, thesecond support protrusions 422 a are positioned beneath thesecond substrate 520 within the dummy areas of thesecond substrate 520. However, the substrate receiving process for the substrate receiving system ofFIG. 8 must be performed in a slightly different sequence. InFIG. 8 , the secondrotational axes 412 at a first end of thelower stage 122 must first be rotated in clockwise and counterclockwise directions, and the second rotational axes at a second end of thelower stage 122 must be rotated next in clockwise and counterclockwise directions. Thus, thesecond supports 422 at the first end of thelower stage 122 do not interfere with thesecond supports 422 at the second end of thelower stage 122. Likewise, the sequence must be reversed when moving the secondsubstrate receiving system 402 into the home position. - Then, the first
rotational axes 411 of the four firstsubstrate receiving systems 401 move upward, and rotate in a similar direction to the secondsubstrate receiving system 402 to position thesecond supports 422 to a work position, thereby enabling support of a specific portion of thesecond substrate 520. Specifically, the firstrotational axes 411 of the four firstsubstrate receiving systems 401 move along an upward direction, and then rotate in clockwise and counterclockwise directions to place each of thefirst supports 421 beneath thesecond substrate 520. Accordingly, thefirst support protrusions 421 a are positioned beneath thesecond substrate 520 within the dummy areas of thesecond substrate 520. - During the previously described substrate receiving process, the vacuum force transferred through the vacuum holes 121 b of the
upper stage 121 is released. Alternatively, the vacuum pressure at the interior of thevacuum processing chamber 110 may become higher than the vacuum force transferred through the vacuum holes 121 b of theupper stage 121. Accordingly, thesecond substrate 520 affixed to theupper stage 121 falls along a gravitational direction to be placed on the first andsecond support protrusions substrate receiving systems second support protrusions second substrate 520 such that thesecond substrate 520 does not fall after the vacuum force applied by theupper stage 121 is released. Accordingly, any damage to thesecond substrate 520 may be prevented. - Once the vacuum process has been competed, an electrostatic process may begin wherein the upper and
lower stages electrostatic chucks first substrates lower stages substrate receiving systems second supports -
FIG. 9 is a plane view of an apparatus having another exemplary substrate receiving system. InFIG. 9 , the secondsubstrate receiving system 402 may be positioned closer to a central portion inside the vacuum processing chamber 110 (i.e., farther from an inner wall of the vacuum processing chamber 110) than the firstsubstrate receiving system 401. - In
FIGS. 7, 8 , and 9, lengths of thesecond supports 422 of the secondsubstrate receiving system 402 may be about 500˜1200 mm, and thefirst supports 421 of the firstsubstrate receiving system 401 may be 100˜500 mm. Preferably, thesecond supports 422 of the secondsubstrate receiving system 402 is about 600 mm, and thefirst supports 421 of the firstsubstrate receiving system 401 is about 400 mm. In general, thesecond supports 422 of the secondsubstrate receiving system 402 may be at least longer than one-third of a long side of thesecond substrate 520, and thefirst supports 421 of the firstsubstrate receiving system 401 may be at least longer than one-fifth of the lone side of thesecond substrate 520. Accordingly, even if reciprocal operation between the first and secondsubstrate receiving systems substrate receiving systems - The present invention is not limited to the first and second
substrate receiving systems vacuum processing chamber 110.FIG. 10 is a cross sectional view of another exemplary substrate receiving system according to the present invention, andFIG. 11 is a plane view of another exemplary substrate receiving system according to the present invention. - In
FIG. 10 , an exemplary respective substrate receiving system may be provided at an interior top portion of thevacuum processing chamber 110 as well as an inner wall of thevacuum processing chamber 110, as shown inFIG. 11 . Accordingly, if thesubstrate receiving system 400 according to the present invention is provided at the interior top portion of thevacuum processing chamber 110, an overall construction (i.e., positions of therotational axes 410 and supports 420 at the interior of the vacuum processing chamber 110) is similar of exemplary substrate receiving systems ofFIGS. 7, 8 , and 9. However, locations of the driving parts of thesubstrate receiving system 400, locations of therotational axes 410 coupled axially with the driving parts, and the downward movements of therotational axes 410 are inverted. Moreover, if thesubstrate receiving system 400 is provided at the inner wall of thevacuum processing chamber 110, recesses 110 a corresponding to the respective supports may be formed at the interior wall of thevacuum processing chamber 110. Therecesses 110 a allow thesupports 420 to be inserted into the interior wall of thevacuum processing chamber 110, and therotational axes 410 penetrate into the interior wall of thevacuum processing chamber 110 so a to be coupled axially with the driving part provided at an exterior of thevacuum processing chamber 110. - It will be apparent to those skilled in the art than various modifications and variations can be made in the apparatus and method for manufacturing liquid crystal display devices, method for using the apparatus, and device produced by the method of the present invention. Thus, it is intended that the present invention covers the modifications and variations of this invention provided they come within the scope of the appended claims and their equivalents.
Claims (6)
Priority Applications (1)
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US11/228,347 US20060011292A1 (en) | 2002-02-20 | 2005-09-19 | Apparatus and method for manufacturing liquid crystal display devices, method for using the apparatus, and device produced by the method |
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KR10-2002-0008899A KR100469359B1 (en) | 2002-02-20 | 2002-02-20 | bonding device for liquid crystal display |
KRP2002-8899 | 2002-02-20 | ||
US10/128,561 US6953073B2 (en) | 2002-02-20 | 2002-04-23 | Apparatus and method for manufacturing liquid crystal display devices, method for using the apparatus, and device produced by the method |
US11/228,347 US20060011292A1 (en) | 2002-02-20 | 2005-09-19 | Apparatus and method for manufacturing liquid crystal display devices, method for using the apparatus, and device produced by the method |
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US10/128,561 Division US6953073B2 (en) | 2002-02-20 | 2002-04-23 | Apparatus and method for manufacturing liquid crystal display devices, method for using the apparatus, and device produced by the method |
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US11/228,347 Abandoned US20060011292A1 (en) | 2002-02-20 | 2005-09-19 | Apparatus and method for manufacturing liquid crystal display devices, method for using the apparatus, and device produced by the method |
US11/228,337 Expired - Lifetime US7883598B2 (en) | 2002-02-20 | 2005-09-19 | Apparatus and method for manufacturing liquid crystal display devices, method for using the apparatus, and device produced by the method |
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JP (1) | JP4084101B2 (en) |
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EP1923736A1 (en) * | 2006-11-20 | 2008-05-21 | Fujitsu Ltd. | Manufacturing method and manufacturing apparatus for a display panel |
US20080115883A1 (en) * | 2006-11-20 | 2008-05-22 | Fujitsu Limited | Manufacturing method and manufacturing apparatus of a panel |
US20090165957A1 (en) * | 2008-01-02 | 2009-07-02 | Yuhwen Lee | Apparatus for laminating substrates |
US9656450B2 (en) * | 2008-01-02 | 2017-05-23 | Tpk Touch Solutions, Inc. | Apparatus for laminating substrates |
Also Published As
Publication number | Publication date |
---|---|
US6953073B2 (en) | 2005-10-11 |
US7883598B2 (en) | 2011-02-08 |
CN1210610C (en) | 2005-07-13 |
US20060005921A1 (en) | 2006-01-12 |
US20030155069A1 (en) | 2003-08-21 |
KR100469359B1 (en) | 2005-02-02 |
CN1439925A (en) | 2003-09-03 |
JP2003241202A (en) | 2003-08-27 |
DE10227824A1 (en) | 2003-08-28 |
JP4084101B2 (en) | 2008-04-30 |
DE10227824B4 (en) | 2009-08-27 |
KR20030069327A (en) | 2003-08-27 |
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