TWM469505U - Vacuum bonding apparatus - Google Patents

Vacuum bonding apparatus Download PDF

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Publication number
TWM469505U
TWM469505U TW102217192U TW102217192U TWM469505U TW M469505 U TWM469505 U TW M469505U TW 102217192 U TW102217192 U TW 102217192U TW 102217192 U TW102217192 U TW 102217192U TW M469505 U TWM469505 U TW M469505U
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TW
Taiwan
Prior art keywords
plate
vacuum bonding
bonding apparatus
module
magnet
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TW102217192U
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Chinese (zh)
Inventor
Po-Hung Chen
Yu-Ting Chen
Hung-I Chen
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Mirle Automation Corp
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Publication of TWM469505U publication Critical patent/TWM469505U/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B32B37/1018Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using only vacuum
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0046Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus

Description

真空貼合設備Vacuum bonding equipment

本創作是關於一種貼合設備,特別是有關於一種真空貼合設備。This creation is about a fitting device, especially a vacuum bonding device.

按,如結合顯示與觸控輸入兩種技術之觸控式顯示面板的製造過程中,常必須將兩板件利用黏膠貼合在一起,然而為了避免貼合膠於貼合製程中產生氣泡,一般是藉由真空貼合設備來完成所述貼合製程。According to the manufacturing process of the touch display panel, such as the combination of the display and the touch input technology, it is often necessary to bond the two boards together with the adhesive, however, in order to prevent the adhesive glue from being generated in the bonding process, bubbles are generated. Generally, the bonding process is completed by a vacuum bonding apparatus.

習知的真空貼合設備之作動方式普遍是以吸盤所產生之吸著力,將欲進行貼合製程之兩板件相對吸持住,於對準相對位置後再進行壓合的程序。The conventional vacuum bonding apparatus generally operates by sucking the two plates of the bonding process by suction force generated by the suction cup, and then performing the pressing process after aligning the relative positions.

然而,對於液晶顯示模組(liquid crystal display module)與觸控面板的真空貼合而言,由於該液晶顯示模組是由液晶面板、背光模組及邊框等所組合而成,故該液晶顯示模組本身是有點翹曲不平的,且該液晶顯示模組的背面多為凹陷不平整,因此當習知的真空貼合設備於吸持該液晶顯示模組時,會容易產生偏移的現象,影響其對位精度,進而造成不佳的貼合品質。However, for the vacuum bonding of the liquid crystal display module and the touch panel, since the liquid crystal display module is composed of a liquid crystal panel, a backlight module, a frame, etc., the liquid crystal display The module itself is a little warped, and the back surface of the liquid crystal display module is mostly uneven. Therefore, when the conventional vacuum bonding device sucks the liquid crystal display module, the offset phenomenon is likely to occur. , affecting its alignment accuracy, resulting in poor fit quality.

因此,有必要提供一種改良的真空貼合設備,以解決上述之問題。Therefore, it is necessary to provide an improved vacuum bonding apparatus to solve the above problems.

有鑑於此,本創作目的在於提供一種真空貼合設備,其係具有改良之承載座,可改善上述的偏移現象,進而增加對位的精度。In view of this, the purpose of the present invention is to provide a vacuum bonding apparatus which has an improved carrier which can improve the above-mentioned offset phenomenon and thereby increase the accuracy of alignment.

為達成上述目的,本創作提供一種真空貼合設備,其用於對一板狀模組及一基板進行貼合,該真空貼合設備包括一對位壓合系統、一殼體及一抽真空裝置,該對位壓合系統包括一下部承載座及一上部承載座。該對位壓合系統用於對準該板狀模組與該基板的相對位置而後進行壓合。該下部承載座用於承載該板狀模組,而該上部承載座則用於承載該基板。該殼體內部具有一腔室,用以容納該下部承載座及該上部承載座。該抽真空裝置是連通於該腔室,該抽真空裝置用以對該腔室抽真空。該下部承載座的至少一區域是由磁鐵構成,用以磁吸該板狀模組。In order to achieve the above object, the present invention provides a vacuum bonding apparatus for bonding a plate-shaped module and a substrate, the vacuum bonding apparatus comprising a pair of position pressing systems, a casing and a vacuum The device, the alignment press system includes a lower carrier and an upper carrier. The alignment pressing system is configured to align the relative positions of the plate module and the substrate and then press-fit. The lower carrier is used to carry the plate module, and the upper carrier is used to carry the substrate. The housing has a chamber inside for receiving the lower carrier and the upper carrier. The vacuuming device is in communication with the chamber for evacuating the chamber. At least one region of the lower carrier is formed of a magnet for magnetically absorbing the plate-shaped module.

在本創作的一實施例中,該板狀模組的其中一元件係由導磁性材料製成,該板狀模組通過該板狀模組中由導磁性材料所製成的該元件吸附固定於該磁鐵上。In an embodiment of the present invention, one of the components of the plate-shaped module is made of a magnetically permeable material, and the plate-shaped module is fixed by the component made of a magnetic conductive material in the plate-shaped module. On the magnet.

在本創作的一實施例中,該板狀模組的邊框上更卡固有至少一治具,該治具係由導磁性材料製成,該板狀模組通過該治具吸附固定於該磁鐵上。In an embodiment of the present invention, the frame of the plate-shaped module is further provided with at least one jig, and the jig is made of a magnetic conductive material, and the plate-shaped module is adsorbed and fixed to the magnet by the jig. on.

在本創作的一實施例中,該板狀模組的邊框上更卡固有至少一治具,該治具上設置有至少一磁吸件,該板狀模組通過該治具上的至少一磁吸件吸附固定於該磁鐵上。In an embodiment of the present invention, at least one jig is further disposed on the frame of the plate module, and the jig is provided with at least one magnetic member, and the plate module passes at least one of the jigs The magnetic member is adsorbed and fixed on the magnet.

在本創作的一實施例中,該磁吸件係永久磁鐵。In an embodiment of the present creation, the magnetic member is a permanent magnet.

在本創作的一實施例中,該磁吸件係由導磁性材料所製成之 薄片。In an embodiment of the present invention, the magnetic member is made of a magnetically permeable material. Sheet.

在本創作的一實施例中,該導磁性材料包含鐵、鈷、鎳或其組合。In an embodiment of the present creation, the magnetically permeable material comprises iron, cobalt, nickel, or a combination thereof.

在本創作的一實施例中,該板狀模組係液晶顯示模組。In an embodiment of the present invention, the panel module is a liquid crystal display module.

在本創作的一實施例中,該基板係觸控面板。In an embodiment of the present invention, the substrate is a touch panel.

在本創作的一實施例中,該磁鐵係永久磁鐵。In an embodiment of the present creation, the magnet is a permanent magnet.

在本創作的一實施例中,該下部承載座更包括至少一頂升裝置,用以藉由該頂升裝置的頂升使該板狀模組上升而脫離該永久磁鐵的吸引。In an embodiment of the present invention, the lower carrier further includes at least one lifting device for lifting the plate-shaped module from the attraction of the permanent magnet by the lifting of the lifting device.

在本創作的一實施例中,該下部承載座更包括至少一下降裝置,該永久磁鐵係設置於該下降裝置上,用以藉由該下降裝置的下降使該永久磁鐵脫離該板狀模組。In an embodiment of the present invention, the lower carrier further includes at least one lowering device, and the permanent magnet is disposed on the lowering device for disengaging the permanent magnet from the plate module by the lowering of the lowering device .

在本創作的一實施例中,該磁鐵係電磁鐵。In an embodiment of the present creation, the magnet is an electromagnet.

相較於先前技術,本創作真空貼合設備中的承載座的至少一區域是由磁鐵構成,而藉由磁吸方式吸附固定一板狀模組,此種改良的承載座除了可以改善習知以吸盤吸持該板狀模組所產生之偏移、增加對位的精度而提供可靠的貼合品質以外,更因為其裝置價格低廉而可以降低生產成本。Compared with the prior art, at least one area of the carrier in the vacuum bonding apparatus of the present invention is composed of a magnet, and a plate-shaped module is adsorbed and fixed by magnetic attraction, and the improved carrier can improve the conventional knowledge. In addition to the offset generated by the suction cup holding the plate module, the accuracy of the alignment is increased, and the reliability of the alignment is provided, and the production cost can be reduced because the device is inexpensive.

1‧‧‧真空貼合設備1‧‧‧Vacuum laminating equipment

2‧‧‧觸控式液晶顯示模組2‧‧‧Touch LCD Module

2a‧‧‧液晶顯示模組2a‧‧‧LCD module

2b‧‧‧觸控面板2b‧‧‧Touch panel

10‧‧‧對位壓合系統10‧‧‧ alignment press system

20‧‧‧殼體20‧‧‧shell

30‧‧‧抽真空裝置30‧‧‧ Vacuuming device

101‧‧‧下部承載座101‧‧‧Lower carrier

102‧‧‧上部承載座102‧‧‧Upper carrier

103‧‧‧對位調整裝置103‧‧‧ alignment adjustment device

104‧‧‧壓合裝置104‧‧‧ Pressing device

201‧‧‧腔室201‧‧‧ chamber

1011‧‧‧電磁鐵1011‧‧‧Electromagnet

1012‧‧‧承載柱1012‧‧‧Loading column

1013‧‧‧永久磁鐵1013‧‧‧ permanent magnet

1014‧‧‧頂升裝置1014‧‧‧Elevation device

1015‧‧‧下降裝置1015‧‧‧Descent device

1016‧‧‧基座1016‧‧‧Base

第1圖係本創作第一實施例中真空貼合設備之示意圖。Fig. 1 is a schematic view showing a vacuum laminating apparatus in the first embodiment of the present invention.

第2圖係本創作第二實施例中真空貼合設備之示意圖。Fig. 2 is a schematic view showing a vacuum bonding apparatus in the second embodiment of the present invention.

第3圖係本創作第三實施例中真空貼合設備之示意圖。Fig. 3 is a schematic view showing a vacuum laminating apparatus in the third embodiment of the present creation.

以下參照附圖詳細說明的實施例將會使得本創作的優點和特徵以及實現這些優點和特徵的方法更加明確。但是,本創作不局限於以下所公開的實施例,本創作能夠以互不相同的各種方式實施,以下所公開的實施例僅用於使本創作的公開內容更加完整,有助於本創作所屬技術領域的普通技術人員能夠完整地理解本創作之範疇,本創作是根據申請專利範圍而定義。在說明書全文中,相同的附圖標記表示相同的結構元件。The embodiments described in detail below with reference to the drawings will make the advantages and features of the present invention and the methods for achieving these advantages and features more apparent. However, the present invention is not limited to the embodiments disclosed below, and the present invention can be implemented in various ways that are different from each other. The embodiments disclosed below are only used to make the disclosure of the present creation more complete and contribute to the creation of the present creation. A person of ordinary skill in the art can fully understand the scope of the present creation, and the creation is defined in accordance with the scope of the patent application. Throughout the specification, the same reference numerals denote the same structural elements.

請先參閱第1圖,其為本創作一種真空貼合設備1的示意圖。該真空貼合設備1主要是包括一對位壓合系統10、一殼體20及一抽真空裝置30,該對位壓合系統10大體上包括一下部承載座101、一上部承載座102、一對位調整裝置103及一壓合裝置104。該真空貼合設備1是用於對一板狀模組及一基板進行貼合,於下述實施例中,該板狀模組為液晶顯示模組2a,而該基板為觸控面板2b。Please refer to FIG. 1 , which is a schematic diagram of a vacuum bonding apparatus 1 . The vacuum bonding apparatus 1 mainly includes a pair of position pressing system 10, a casing 20 and a vacuuming device 30. The alignment pressing system 10 generally includes a lower bearing base 101 and an upper bearing base 102. A pair of position adjusting device 103 and a pressing device 104. The vacuum bonding apparatus 1 is used for bonding a plate-shaped module and a substrate. In the following embodiments, the plate-shaped module is a liquid crystal display module 2a, and the substrate is a touch panel 2b.

該對位壓合系統10的功能是用於對準該液晶顯示模組2a與該觸控面板2b的相對位置而後進行壓合。該下部承載座101是用於承載該液晶顯示模組2a,而該上部承載座102則是用於承載該觸控面板2b。該上部承載座102是連接固定於該對位調整裝置103,並藉由該對位調整裝置103調整該上部承載座102的X、Y、Z三個軸向,而讓欲壓貼加工的該觸控面板2b及該液晶顯示模組2a彼此位置對正,接續再藉由該壓合裝置104施加一向下的力壓合該觸控面板2b及該液晶顯示模組2a兩者。The function of the alignment pressing system 10 is to align the relative positions of the liquid crystal display module 2a and the touch panel 2b and then press-fit. The lower carrier 101 is for carrying the liquid crystal display module 2a, and the upper carrier 102 is for carrying the touch panel 2b. The upper bearing base 102 is connected and fixed to the alignment adjusting device 103, and the alignment adjusting device 103 adjusts three axial directions of X, Y and Z of the upper bearing base 102, so that the upper bearing block is processed. The touch panel 2b and the liquid crystal display module 2a are aligned with each other, and a downward force is applied by the pressing device 104 to press the touch panel 2b and the liquid crystal display module 2a.

該殼體20內部具有一腔室201,用以容納該下部承載座 101、該上部承載座102、該對位調整裝置103及該壓合裝置104。該抽真空裝置30是連通於該腔室201,該抽真空裝置30可以抽取該腔室201內的空氣而使該腔室201內形成一真空狀態。The housing 20 has a chamber 201 therein for receiving the lower carrier 101. The upper carrier 102, the alignment adjusting device 103, and the pressing device 104. The vacuuming device 30 is connected to the chamber 201. The vacuuming device 30 can extract air in the chamber 201 to form a vacuum state in the chamber 201.

本創作的主要改良在於,承載該液晶顯示模組2a之該下部承載座101的至少一區域是由磁鐵構成,並藉由磁吸方式吸附固定該液晶顯示模組2a。在本創作中,該液晶顯示模組2a的其中一元件(圖中未示)可以由導磁性材料製成,該液晶顯示模組2a通過該液晶顯示模組2a中由導磁性材料所製成的該元件吸附固定於該磁鐵上。或者,該液晶顯示模組2a的邊框上更可以卡固有至少一治具(圖中未示),該治具係由導磁性材料製成,該液晶顯示模組2a通過該治具吸附固定於該磁鐵上。或者,該液晶顯示模組2a的邊框上更可以卡固有至少一治具(圖中未示),該治具上設置有至少一磁吸件(圖中未示),該液晶顯示模組2a通過該治具上的至少一磁吸件吸附固定於該磁鐵上。該磁吸件可以為永久磁鐵或由導磁性材料所製成之薄片。該導磁性材料包含鐵、鈷、鎳或其組合。以下舉出三種實施例來對本創作真空貼合設備1中的下部承載座101進行詳細的說明。The main improvement of the present invention is that at least one region of the lower carrier 101 carrying the liquid crystal display module 2a is composed of a magnet, and the liquid crystal display module 2a is adsorbed and fixed by magnetic attraction. In the present invention, one of the components (not shown) of the liquid crystal display module 2a can be made of a magnetically permeable material, and the liquid crystal display module 2a is made of a magnetically permeable material in the liquid crystal display module 2a. The component is adsorbed and fixed to the magnet. Alternatively, at least one jig (not shown) may be embedded in the frame of the liquid crystal display module 2a. The jig is made of a magnetic conductive material, and the liquid crystal display module 2a is adsorbed and fixed by the jig. On the magnet. Alternatively, at least one jig (not shown) may be integrated on the frame of the liquid crystal display module 2a, and the jig is provided with at least one magnetic member (not shown), and the liquid crystal display module 2a The magnet is adsorbed and fixed by at least one magnetic member on the jig. The magnetic member may be a permanent magnet or a sheet made of a magnetically permeable material. The magnetically permeable material comprises iron, cobalt, nickel or a combination thereof. Three embodiments will be hereinafter described in detail to describe the lower carrier 101 in the vacuum bonding apparatus 1 of the present invention.

[實施例1][Example 1]

本創作真空貼合設備1中的下部承載座101之第一種態樣,請參閱第1圖,其顯示本創作第一實施例中真空貼合設備1之示意圖。於圖示中,該下部承載座101是由複數個電磁鐵1011及複數個承載柱1012所構成的,當該等電磁鐵1011通電時,會產生磁力而吸附固定該液晶顯示模組2a,斷電後則無磁力的吸引而可輕易的取下。The first aspect of the lower carrier 101 in the vacuum bonding apparatus 1 of the present invention is shown in Fig. 1, which shows a schematic view of the vacuum bonding apparatus 1 in the first embodiment of the present invention. In the figure, the lower carrier 101 is composed of a plurality of electromagnets 1011 and a plurality of carrier posts 1012. When the electromagnets 1011 are energized, a magnetic force is generated to adsorb and fix the liquid crystal display module 2a. After the electricity, it can be easily removed without magnetic attraction.

[實施例2][Embodiment 2]

本創作真空貼合設備1中的下部承載座101之第二種態樣,請參閱第2圖,其顯示本創作第二實施例中真空貼合設備1之示意圖。於圖示中,該下部承載座101主要是以永久磁鐵1013構成一平台,且在該平台中埋設有複數個頂升裝置1014,透過該等頂升裝置1014的頂升使該液晶顯示模組2a上升而脫離該永久磁鐵1013的吸引。In the second aspect of the lower carrier 101 of the present vacuum bonding apparatus 1, please refer to FIG. 2, which shows a schematic view of the vacuum bonding apparatus 1 in the second embodiment of the present invention. In the illustration, the lower carrier 101 is mainly composed of a permanent magnet 1013, and a plurality of jacking devices 1014 are embedded in the platform, and the liquid crystal display module is driven by the jacking of the jacking device 1014. 2a rises and is released from the attraction of the permanent magnet 1013.

[實施例3][Example 3]

本創作真空貼合設備1中的下部承載座101之第三種態樣,請參閱第3圖,其顯示本創作第三實施例中真空貼合設備1之示意圖。於圖示中,該下部承載座101主體上是一基座1016,該基座1016的周圍埋設有複數個下降裝置1015,該等下降裝置1015上各設置有一永久磁鐵1013。於工作狀態下,該等永久磁鐵1013的頂面與該基座1016的頂面是一平整面,當工作完畢後,透過該等下降裝置1015的下降可以使得該等永久磁鐵1013脫離該液晶顯示模組2a。A third aspect of the lower carrier 101 in the vacuum bonding apparatus 1 of the present invention is shown in Fig. 3, which shows a schematic view of the vacuum bonding apparatus 1 in the third embodiment of the present invention. In the figure, the main body of the lower bearing base 101 is a base 1016. A plurality of lowering devices 1015 are embedded around the base 1016. Each of the lowering devices 1015 is provided with a permanent magnet 1013. In the working state, the top surface of the permanent magnets 1013 and the top surface of the base 1016 are a flat surface. When the operation is completed, the lowering of the lowering device 1015 can cause the permanent magnets 1013 to be separated from the liquid crystal display. Module 2a.

如上所述,本創作真空貼合設備1中的下部承載座101的至少一區域是由磁鐵構成,藉由磁吸方式來吸附固定該液晶顯示模組2a,再透過習知的對位調整裝置103及壓合裝置104將該觸控面板2b與該液晶顯示模組2a對準貼壓成為一觸控式液晶顯示模組2,此種改良的下部承載座101除了可以改善習知以吸盤吸持該液晶顯示模組2a所產生之偏移、增加對位的精度而提供可靠的貼合品質以外,更因為其裝置價格低廉而可以降低生產成本。As described above, at least one region of the lower carrier 101 in the vacuum bonding apparatus 1 of the present invention is composed of a magnet, and the liquid crystal display module 2a is adsorbed and fixed by magnetic attraction, and then passed through a conventional alignment adjusting device. 103 and the pressing device 104 aligns the touch panel 2b and the liquid crystal display module 2a into a touch-type liquid crystal display module 2, and the improved lower carrier 101 can improve the conventional suction cup. In addition to the offset generated by the liquid crystal display module 2a, the accuracy of the alignment is increased, and the reliable bonding quality is provided, and the production cost can be reduced because the device is inexpensive.

雖然本創作已用較佳實施例揭露如上,然其並非用以限定本創作,本創作所屬技術領域中具有通常知識者,在不脫離本創作之精神和 範圍內,當可作各種之更動與潤飾,因此本創作之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention, and the present invention has ordinary knowledge in the art without departing from the spirit of the present invention. In the scope of the application, the scope of protection of this creation shall be subject to the definition of the scope of the patent application.

1‧‧‧真空貼合設備1‧‧‧Vacuum laminating equipment

2‧‧‧觸控式液晶顯示模組2‧‧‧Touch LCD Module

2a‧‧‧液晶顯示模組2a‧‧‧LCD module

2b‧‧‧觸控面板2b‧‧‧Touch panel

10‧‧‧對位壓合系統10‧‧‧ alignment press system

20‧‧‧殼體20‧‧‧shell

30‧‧‧抽真空裝置30‧‧‧ Vacuuming device

101‧‧‧下部承載座101‧‧‧Lower carrier

102‧‧‧上部承載座102‧‧‧Upper carrier

103‧‧‧對位調整裝置103‧‧‧ alignment adjustment device

104‧‧‧壓合裝置104‧‧‧ Pressing device

201‧‧‧腔室201‧‧‧ chamber

1011‧‧‧電磁鐵1011‧‧‧Electromagnet

1012‧‧‧承載柱1012‧‧‧Loading column

Claims (13)

一種真空貼合設備,用於對一板狀模組及一基板進行貼合,該真空貼合設備包括:一對位壓合系統,用於對準該板狀模組與該基板的相對位置而後進行壓合,該對位壓合系統包括:一下部承載座,用以承載該板狀模組;以及一上部承載座,用以承載該基板;一殼體,該殼體內部具有一腔室,該下部承載座及該上部承載座容置於該殼體的該腔室內;以及一抽真空裝置,連通於該腔室,該抽真空裝置用於對該腔室進行抽真空,其中該下部承載座的至少一區域係由磁鐵構成,用以磁吸該板狀模組。A vacuum bonding device for bonding a plate-shaped module and a substrate, the vacuum bonding device comprising: a pair of position pressing systems for aligning the relative positions of the plate-shaped module and the substrate And then pressing, the alignment pressing system comprises: a lower carrier for carrying the plate module; and an upper carrier for carrying the substrate; a casing having a cavity inside the casing a chamber, the lower carrier and the upper carrier are housed in the chamber of the housing; and a vacuuming device is connected to the chamber, the vacuuming device is configured to evacuate the chamber, wherein the At least one region of the lower carrier is formed of a magnet for magnetically absorbing the plate-like module. 如請求項1所述之真空貼合設備,其中該板狀模組的其中一元件係由導磁性材料製成,該板狀模組通過該板狀模組中由導磁性材料所製成的該元件吸附固定於該磁鐵上。The vacuum bonding apparatus of claim 1, wherein one of the components of the plate-shaped module is made of a magnetically permeable material, and the plate-shaped module is made of a magnetically permeable material in the plate-shaped module. The component is adsorbed and fixed to the magnet. 如請求項1所述之真空貼合設備,其中該板狀模組的邊框上更卡固有至少一治具,該治具係由導磁性材料製成,該板狀模組通過該治具吸附固定於該磁鐵上。The vacuum bonding apparatus according to claim 1, wherein the frame of the plate-shaped module is further provided with at least one jig, and the jig is made of a magnetic conductive material, and the plate-shaped module is adsorbed by the jig. Fixed to the magnet. 如請求項1所述之真空貼合設備,其中該板狀模組的邊框上更卡固有至少一治具,該治具上設置有至少一磁吸件,該板狀模組通過該治具上的至少一磁吸件吸附固定於該磁鐵上。The vacuum bonding apparatus of claim 1, wherein the frame of the plate-shaped module has at least one jig in the card, and the jig is provided with at least one magnetic member, and the plate-shaped module passes the jig At least one magnetic member is adsorbed and fixed on the magnet. 如請求項4所述之真空貼合設備,其中該磁吸件係永久磁鐵。The vacuum bonding apparatus of claim 4, wherein the magnetic member is a permanent magnet. 如請求項4所述之真空貼合設備,其中該磁吸件係由導磁性材料所製成之薄片。The vacuum bonding apparatus of claim 4, wherein the magnetic member is a sheet made of a magnetically permeable material. 3或6所述之真空貼合設備,其中該導磁性材料包含鐵、鈷、 鎳或其組合。The vacuum bonding apparatus of 3 or 6, wherein the magnetic conductive material comprises iron, cobalt, Nickel or a combination thereof. 如請求項1所述之真空貼合設備,其中該板狀模組係液晶顯示模組。The vacuum bonding apparatus of claim 1, wherein the plate module is a liquid crystal display module. 如請求項1所述之真空貼合設備,其中該基板係觸控面板。The vacuum bonding apparatus of claim 1, wherein the substrate is a touch panel. 如請求項1所述之真空貼合設備,其中該磁鐵係永久磁鐵。The vacuum bonding apparatus of claim 1, wherein the magnet is a permanent magnet. 如請求項10所述之真空貼合設備,其中該下部承載座更包括至少一頂升裝置,用以藉由該頂升裝置的頂升使該板狀模組上升而脫離該永久磁鐵的吸引。The vacuum bonding apparatus of claim 10, wherein the lower carrier further comprises at least one lifting device for lifting the plate-shaped module from the attraction of the permanent magnet by the lifting of the lifting device . 如請求項10所述之真空貼合設備,其中該下部承載座更包括至少一下降裝置,該永久磁鐵係設置於該下降裝置上,用以藉由該下降裝置的下降使該永久磁鐵脫離該板狀模組。The vacuum bonding apparatus of claim 10, wherein the lower carrier further comprises at least one lowering device, the permanent magnet being disposed on the lowering device for disengaging the permanent magnet by the lowering of the lowering device Plate module. 如請求項1所述之真空貼合設備,其中該磁鐵係電磁鐵。The vacuum bonding apparatus of claim 1, wherein the magnet is an electromagnet.
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