CN109703163B - Vacuum laminating machine - Google Patents
Vacuum laminating machine Download PDFInfo
- Publication number
- CN109703163B CN109703163B CN201811605213.1A CN201811605213A CN109703163B CN 109703163 B CN109703163 B CN 109703163B CN 201811605213 A CN201811605213 A CN 201811605213A CN 109703163 B CN109703163 B CN 109703163B
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- China
- Prior art keywords
- cover plate
- substrate
- support pin
- position state
- lower cover
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- 238000010030 laminating Methods 0.000 title claims abstract description 17
- 239000000758 substrate Substances 0.000 claims abstract description 85
- 238000001179 sorption measurement Methods 0.000 description 10
- 239000000463 material Substances 0.000 description 7
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000005034 decoration Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B41/00—Arrangements for controlling or monitoring lamination processes; Safety arrangements
Landscapes
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Hooks, Suction Cups, And Attachment By Adhesive Means (AREA)
- Manipulator (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
The invention discloses a vacuum laminating machine, which comprises a main machine table, wherein an upper cover plate and a lower cover plate which are arranged oppositely up and down are arranged in the main machine table and are used for respectively adsorbing an upper substrate and a lower substrate to be laminated; wherein the main machine table is also internally provided with a first supporting pin which has a first position state and a second position state; wherein in the first position, the first support pin is located between the opposite surfaces of the upper and lower cover plates and can catch the upper substrate falling from the upper cover plate; in the second position, the first support pin is located outside the area between the opposite surfaces of the upper cover plate and the lower cover plate, so that the upper cover plate and the lower cover plate can approach each other to attach the upper substrate and the lower substrate which are respectively adsorbed by the upper cover plate and the lower cover plate. The invention has the advantage of solving the problem that the upper substrate falls on the lower substrate to cause position deviation between the upper substrate and the lower substrate, and further the upper substrate and the lower substrate are scrapped after being attached due to the position deviation of the upper substrate and the lower substrate after being further attached.
Description
Technical Field
The invention relates to the technical field of display panel manufacturing, in particular to a vacuum laminating machine.
Background
In the packaging process of the TFT-LCD industry, a Vacuum Aligner System (VAS for short) is usually used to integrate two substrates into a box. In the prior art, one substrate is adsorbed on an upper cover plate of vacuum laminating equipment, the other substrate is adsorbed on a lower cover plate, then a vacuum pump is used for vacuumizing, and then an alignment box is pressed in a vacuum environment. Generally, a glue is applied to the substrate to bond the upper and lower substrates.
The machine station works by adsorbing the upper and lower substrates through the adsorption devices on the upper and lower cover plates and then performing alignment and pressing. However, with the use of the machine, the adsorption force of the adsorption device to the substrate is weakened, which may cause the substrate adsorbed by the upper cover plate to fall onto the substrate of the lower cover plate in the vacuum-pumping stage, and further cause the position deviation of the upper and lower substrates, and even cause the upper and lower substrates to be scrapped if the subsequent pressing step between the upper and lower substrates is continued.
Therefore, there is a need to develop a new vacuum laminating machine to overcome the defects of the prior art.
Disclosure of Invention
The invention aims to provide a vacuum laminating machine which can solve the problems that in the prior art, as the adsorption force of an adsorption device to a substrate is weakened, the substrate adsorbed by an upper cover plate falls onto the substrate of a lower cover plate in a vacuumizing stage, so that the position deviation of the upper substrate and the lower substrate is caused, and even the upper substrate and the lower substrate are scrapped.
In order to achieve the above object, the present invention provides a vacuum laminating machine, comprising a main machine table, wherein an upper cover plate and a lower cover plate which are arranged oppositely up and down are arranged in the main machine table and are used for respectively adsorbing an upper substrate and a lower substrate to be laminated; wherein the main machine table is also internally provided with a first supporting pin which has a first position state and a second position state;
wherein in the first position, the first support pin is located between the opposite surfaces of the upper and lower cover plates and can catch the upper substrate falling from the upper cover plate; in the second position, the first support pin is located outside the area between the opposite surfaces of the upper cover plate and the lower cover plate, so that the upper cover plate and the lower cover plate can approach each other to attach the upper substrate and the lower substrate which are respectively adsorbed by the upper cover plate and the lower cover plate.
Further, in various embodiments, wherein the first support pin is provided with a pressure sensor, whether the upper substrate dropped thereon exists is known through pressure change.
Further, in different embodiments, the device further comprises a control unit, which is connected to the pressure sensor and can receive data of the pressure sensor, and when the control unit learns the change of the pressure change data of the pressure sensor, the control unit stops the mutual approaching operation between the upper cover plate and the lower cover plate.
Further, in different embodiments, the control unit is further connected with an alarm unit for giving an alarm instruction to the control unit.
For example, when the control unit finds that the adsorption force of the upper cover plate on the substrate is insufficient and the problem of 'sheet dropping' occurs according to the pressure change data of the pressure sensor, the control unit informs the alarm unit to give an alarm so as to remind an external operator to perform corresponding part maintenance or replacement. The alarm unit may be a sound and light alarm unit, or a voice alarm unit, and is specifically determined according to the needs, and is not limited.
Further, in various embodiments, a robot is further connected to the control unit for removing the upper substrate dropped on the first support pin.
Further, in various embodiments, wherein the first support tip is rotationally transitionable between the first position state and the second position state.
Further, in various embodiments, the first support pin can rotate by an angle ranging from 0 to 180 degrees.
Further, in various embodiments, wherein the first support tip transitions between the first position and the second position by telescoping.
Further, in various embodiments, the material of the first support tip is a stainless steel material, an organic composite material or an organic material, which may be specific and may be determined as needed, and is not limited to these three materials.
Further, in various embodiments, the apparatus further comprises a second support pin disposed opposite to the first support pin, and having a first position state and a second position state for receiving the dropped upper substrate together with the first support pin.
Further, in various embodiments, wherein the second support tip is provided with a pressure sensor.
Further, in various embodiments, the shape, number of the support pins and the moving manner may be determined as needed, and are not limited as long as the upper substrate dropped due to insufficient suction force can be securely received.
Compared with the prior art, the invention has the beneficial effects that: the invention provides a vacuum laminating machine.A pair of oppositely arranged supporting pins are arranged in a main machine table, and the supporting pins have a first position state and a second position state; the first support pin is positioned between the opposite surfaces of the upper cover plate and the lower cover plate in the first position state and can be used for receiving the upper base plate dropped from the upper cover plate, so that the problems that the upper base plate is dropped onto the lower base plate, position deviation occurs between the upper base plate and the lower base plate, and the upper base plate and the lower base plate are scrapped after being attached due to the further attachment of the position deviation of the upper base plate and the lower base plate are solved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic cross-sectional view of a vacuum laminator provided in embodiment 1 of the present invention;
FIG. 2 is a schematic cross-sectional view of a support pin in a first position according to embodiment 1 of the present invention;
FIG. 3 is a schematic cross-sectional view of the upper base plate with the support pins dropped in embodiment 1 of the present invention;
FIG. 4 is a schematic cross-sectional view of the support pin in the second position according to embodiment 1 of the present invention;
fig. 5 is a schematic top view of a vacuum laminator according to embodiment 2 of the present invention;
FIG. 6 is a schematic top view of the support pin in the first position according to embodiment 2 of the present invention;
FIG. 7 is a schematic top view of the support pins of example 3 of the present invention catching a dropped upper substrate;
fig. 8 is a schematic top view illustrating a support pin in a second position according to embodiment 2 of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Specific structural and functional details disclosed herein are merely representative and are provided for purposes of describing example embodiments of the present invention. The present invention may, however, be embodied in many alternate forms and should not be construed as limited to only the embodiments set forth herein.
In the description of the present invention, it is to be understood that the terms "center", "lateral", "upper", "lower", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified. Furthermore, the term "comprises" and any variations thereof is intended to cover non-exclusive inclusions.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used herein, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
Example 1
Referring to fig. 1, the present invention provides a vacuum laminating machine, which includes a main machine table 1, an upper cover plate 21, a lower cover plate 22, a first support pin 41 and a second support pin 42, wherein the upper cover plate 21 and the lower cover plate 22 are disposed opposite to each other in an up-down direction and respectively adsorb an upper substrate 31 and a lower substrate 32 to be laminated.
Referring to fig. 2, fig. 2 is a cross-sectional view of the first support pin 41 and the second support pin 42 in the first position state, and in the first position state, the first support pin 41 and the second support pin 42 are located between the opposite surfaces of the upper cover plate 21 and the lower cover plate 22.
Referring to fig. 3, when the upper substrate 31 falls due to insufficient suction force of the upper cover 21, fig. 3 is a cross-sectional view of the embodiment where the first support pins 41 and the second support pins 42 catch the falling upper substrate 21.
When the upper substrate does not fall, the first support pins 41 and the second support pins 42 rotate to the second position, please refer to fig. 4, which is a cross-sectional view of the first support pins 41 and the second support pins 42 in the second position in the embodiment shown in fig. 4.
The first support pin 41 and the second support pin 42 are provided with pressure sensors, and whether the 'dropping piece' exists on the first support pin or not can be known through pressure change. The main machine table 1 is further provided with a control unit which is connected with the pressure sensor and can receive data of the pressure sensor, and when the control unit knows the pressure change data of the pressure sensor, the control unit stops the mutual approaching operation between the upper cover plate and the lower cover plate.
Furthermore, the control unit is also connected with an alarm unit for sending an alarm instruction to the control unit. When the control unit finds that the adsorption force of the upper cover plate on the base plate is insufficient according to the pressure change data of the pressure sensor, and the problem of 'sheet falling' occurs, the control unit informs the alarm unit to give an alarm so as to remind an external operator to maintain or replace corresponding parts. And a robot is further connected to the control unit for removing the upper substrate 31 dropped on the first support pins 41.
The following describes a bonding operation process of the vacuum bonding machine according to a preferred embodiment of the present invention:
when the bonding operation is performed, the upper substrate 31 is first adsorbed on the upper cover plate 21, the lower substrate 32 is adsorbed on the lower substrate 22, and then the first support pin 41 and the second support pin 42 rotate by 90 degrees to move to the first position state.
Then the main machine table 1 is vacuumized, if the upper substrate 21 falls, the first supporting pin 41 and the second supporting pin 42 can receive the falling upper substrate 21, the pressure data of the pressure sensor changes, then the control unit stops the mutual approaching operation between the upper cover plate and the lower cover plate, then the main machine table 1 stops vacuuming, the cavity is opened, and the manipulator removes the upper substrate 31 falling from the first supporting pin 41 and the second supporting pin 42; meanwhile, the control unit sends an alarm instruction to the alarm unit, and the alarm unit gives an alarm to remind an external operator to replace the adsorption device.
If the upper substrate 21 is not dropped, the first support pins 41 and the second support pins 42 will rotate to the second position, and then the two cover plates will approach each other to attach the upper substrate 32 and the lower substrate 33 to be attached. And the substrate is circulated in sequence to prevent the substrate from dropping and being scrapped.
Example 2
Referring to fig. 5, the present invention provides a vacuum laminating machine, which includes a main machine table 1, an upper cover plate 21, a lower cover plate 22, a first support pin 43 and a second support pin 44, wherein the upper cover plate 21 and the lower cover plate 22 are disposed opposite to each other in an up-down direction and respectively absorb an upper substrate 31 and a lower substrate 32 to be laminated.
Referring to fig. 6, fig. 6 is a plan view of the first support pin 43 and the second support pin 44 in the first position state, and in the first position state, the first support pin 43 and the second support pin 44 are located between the opposite surfaces of the upper cover plate 21 and the lower cover plate 22.
Referring to fig. 7, when the upper substrate 31 falls due to insufficient suction force of the upper cover 21, fig. 7 is a top view of the embodiment where the first support pins 43 and the second support pins 44 catch the falling upper substrate 21.
When the upper substrate does not fall off, the first support pins 43 and the second support pins 44 move to the second position state in a telescopic manner, please refer to fig. 8, and fig. 8 is a top view of the first support pins 43 and the second support pins 44 in the second position state according to the embodiment.
The first support pin 43 and the second support pin 44 are provided with pressure sensors, and whether the 'dropping' of the sheet is generated or not can be known through pressure change. The main machine table 1 is further provided with a control unit which is connected with the pressure sensor and can receive data of the pressure sensor, and when the control unit knows the pressure change data of the pressure sensor, the control unit stops the mutual approaching operation between the upper cover plate and the lower cover plate. The control unit is also connected with an alarm unit for sending an alarm instruction to the control unit. When the control unit finds that the adsorption force of the upper cover plate on the base plate is insufficient according to the pressure change data of the pressure sensor, and the problem of 'sheet falling' occurs, the control unit informs the alarm unit to give an alarm so as to remind an external operator to maintain or replace corresponding parts. The control unit is also connected with a robot for removing the upper substrate 31 dropped on the first support pins 41.
The following describes a bonding operation process of the vacuum bonding machine according to a preferred embodiment of the present invention:
in the bonding operation, the upper substrate 31 is first adsorbed on the upper cover plate 21, the lower substrate 32 is adsorbed on the lower substrate 22, and then the first support pin 43 and the second support pin 44 are moved to the first position state in a telescopic manner.
Then the main machine table 1 is vacuumized, if the upper substrate 21 falls, the first supporting pin 43 and the second supporting pin 44 can receive the falling upper substrate 21, the pressure data of the pressure sensor changes, then the control unit stops the mutual approaching operation between the upper cover plate and the lower cover plate, then the main machine table 1 stops vacuuming, the chamber is opened, and the manipulator removes the upper substrate 31 falling on the first supporting pin 43 and the second supporting pin 44; meanwhile, the control unit sends an alarm instruction to the alarm unit, and the alarm unit gives an alarm to remind an external operator to replace the adsorption device.
If the upper substrate 21 does not fall, the first support pin 43 and the second support pin 44 will move to the second position state, and then the two cover plates approach each other to attach the upper substrate 32 and the lower substrate 33 to be attached. And the substrate is circulated in sequence to prevent the substrate from dropping and being scrapped.
In other embodiments, the shape, number of the support pins and the moving manner may be determined as needed, and are not limited as long as the upper substrate dropped due to insufficient suction force can be securely received.
In various embodiments, the material of the first support tip may be a stainless steel material, or an organic composite material or an organic material, and the material may be determined according to the needs, and is not limited to these three materials.
The invention has the beneficial effects that: the invention provides a vacuum laminating machine.A pair of oppositely arranged supporting pins are arranged in a main machine table, and the supporting pins have a first position state and a second position state; the first support pin is positioned between the opposite surfaces of the upper cover plate and the lower cover plate in the first position state and can be used for receiving the upper base plate dropped from the upper cover plate, so that the problems that the upper base plate is dropped onto the lower base plate, position deviation occurs between the upper base plate and the lower base plate, and the upper base plate and the lower base plate are scrapped after being attached due to the further attachment of the position deviation of the upper base plate and the lower base plate are solved.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (7)
1. A vacuum laminating machine is characterized by comprising a main machine table, wherein an upper cover plate and a lower cover plate which are arranged oppositely up and down are arranged in the main machine table and are used for respectively adsorbing an upper substrate and a lower substrate to be laminated; wherein the main machine table is also internally provided with a first supporting pin which has a first position state and a second position state; the first support pin is provided with a pressure sensor, and whether the dropped upper substrate exists on the first support pin is known through pressure change; wherein the first support pin is in the first position state, the first support pin is positioned between the opposite surfaces of the upper cover plate and the lower cover plate and can be used for receiving the upper base plate falling from the upper cover plate; in the second position state, the first supporting pin is positioned outside the area between the opposite surfaces of the upper cover plate and the lower cover plate, so that the upper cover plate and the lower cover plate can approach each other to attach the upper substrate and the lower substrate which are respectively adsorbed by the upper cover plate and the lower cover plate; the vacuum laminating machine further comprises a second supporting pin, the second supporting pin is opposite to the first supporting pin, and the second supporting pin also has a first position state and a second position state and is used for jointly receiving the dropped upper substrate together with the first supporting pin.
2. The vacuum laminating machine according to claim 1, further comprising a control unit connected to the pressure sensor and capable of receiving data from the pressure sensor, wherein the control unit stops the operation of moving the upper and lower cover plates toward each other when it learns the change of the pressure change data from the pressure sensor.
3. The vacuum laminating machine according to claim 2, wherein the control unit is further connected with an alarm unit for giving an alarm instruction thereto.
4. The vacuum laminator according to claim 2, wherein a robot is further connected to the control unit for removing the upper substrate dropped from the first support pin.
5. The vacuum laminator according to claim 1, wherein the first support pin is rotationally switchable between the first position state and the second position state.
6. The vacuum laminator according to claim 1, wherein the first support pin is telescopically switchable between the first position and the second position.
7. The vacuum laminating machine of claim 1, wherein the second support tip is provided with a pressure sensor.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811605213.1A CN109703163B (en) | 2018-12-26 | 2018-12-26 | Vacuum laminating machine |
| PCT/CN2019/084022 WO2020133839A1 (en) | 2018-12-26 | 2019-04-24 | Vacuum aligner machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811605213.1A CN109703163B (en) | 2018-12-26 | 2018-12-26 | Vacuum laminating machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109703163A CN109703163A (en) | 2019-05-03 |
| CN109703163B true CN109703163B (en) | 2020-04-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811605213.1A Active CN109703163B (en) | 2018-12-26 | 2018-12-26 | Vacuum laminating machine |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN109703163B (en) |
| WO (1) | WO2020133839A1 (en) |
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| JP2003131241A (en) * | 2001-10-24 | 2003-05-08 | Matsushita Electric Ind Co Ltd | Panel alignment method of liquid crystal substrate |
| CN2763837Y (en) * | 2004-12-30 | 2006-03-08 | 群康科技(深圳)有限公司 | LCD panel |
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| JP3486862B2 (en) * | 1999-06-21 | 2004-01-13 | 株式会社 日立インダストリイズ | Substrate assembly method and apparatus |
| JP2005107143A (en) * | 2003-09-30 | 2005-04-21 | Seiko Epson Corp | Method for assembling substrate, and apparatus therefor |
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| TWI503603B (en) * | 2013-07-26 | 2015-10-11 | Mirle Automation Corp | Vacuum bonding apparatus and vacuum bonding method |
| KR101664090B1 (en) * | 2014-12-08 | 2016-10-10 | (주)다인스 | Vacuum laminator and method for laminating using the same |
| CN104730743B (en) * | 2015-03-31 | 2018-07-27 | 合肥鑫晟光电科技有限公司 | Vacuum abutted equipment |
| CN105082717A (en) * | 2015-09-11 | 2015-11-25 | 武汉华星光电技术有限公司 | Vacuum pasting device and base plate pasting method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003131241A (en) * | 2001-10-24 | 2003-05-08 | Matsushita Electric Ind Co Ltd | Panel alignment method of liquid crystal substrate |
| JP4598463B2 (en) * | 2004-09-21 | 2010-12-15 | 芝浦メカトロニクス株式会社 | Vacuum apparatus, substrate bonding apparatus, and substrate bonding method |
| CN2763837Y (en) * | 2004-12-30 | 2006-03-08 | 群康科技(深圳)有限公司 | LCD panel |
| CN1811544A (en) * | 2005-01-27 | 2006-08-02 | 芝浦机械电子装置股份有限公司 | Sticking device of substrates, judging method for substrates sticking, and method for substrates sticking |
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Also Published As
| Publication number | Publication date |
|---|---|
| WO2020133839A1 (en) | 2020-07-02 |
| CN109703163A (en) | 2019-05-03 |
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Address after: 9-2 Tangming Avenue, Guangming New District, Shenzhen City, Guangdong Province Patentee after: TCL China Star Optoelectronics Technology Co.,Ltd. Address before: 9-2 Tangming Avenue, Guangming New District, Shenzhen City, Guangdong Province Patentee before: Shenzhen China Star Optoelectronics Technology Co.,Ltd. |