WO2020107821A1

WO2020107821A1 - Panel cutting and splitting apparatus and method

Info

Publication number: WO2020107821A1
Application number: PCT/CN2019/087877
Authority: WO
Inventors: 郑俊丰; 龙冲
Original assignee: 武汉华星光电技术有限公司
Priority date: 2018-11-30
Filing date: 2019-05-22
Publication date: 2020-06-04
Also published as: CN109437536B; CN109437536A

Abstract

A panel cutting and splitting apparatus and method. The panel cutting and splitting apparatus comprises a cutting assembly and a support platform. The support platform comprises a plurality of movable support units. Each support unit can support a cut sub-panel to move horizontally in a direction perpendicular to a cut line such that the two adjacent sub-panels are split along the cut line. The panels are spaced apart and split in a horizontal direction to prevent the edges thereof from getting struck or colliding during a panel splitting process, thereby reducing aesthetic damage.

Description

Splitting device and splitting method

Technical field

The present application relates to the technical field of liquid crystal panel production, in particular to a device and method for cutting and splitting.

Background technique

In the prior art, when manufacturing a display device, a large-sized display substrate or display panel needs to be cut. After the cutting is completed, the cut panel needs to be split, and the small-sized display substrate or display panel after splitting is used to manufacture the display device .

In the cutting and splitting process of the existing display device, after the cutting is completed, the personnel split or the machine directly splits through the mechanical arm. As shown in FIG. 1, the cutting assembly 11 forms a certain depth of cutting notch 13 on the panel 10 by cutting, However, at this time, the panel 10 itself has not cracked, so after the cutting is completed, a force of 14 directions needs to be applied to the cut panel 10 to split the panel 10 along the cutting notch 13 to form two parts 101 and 102. The panel 101 The edge 1011 near the notch 13 and the edge 1021 of the panel 102 near the notch 13 may cause squeezing, collision, poor appearance, and even fragments.

Therefore, it is a technical problem to be urgently solved by those skilled in the art to provide a technique that can prevent the edges of the panel from being squeezed and collided during the splitting process to cause a poor appearance.

technical problem

The present application provides a device for cutting splits and a method for cutting splits, so as to alleviate the technical problem of poor appearance caused by the edge extrusion and collision of the existing panel during the splitting process.

Technical solution

To solve the above problems, the technical solutions provided by this application are as follows:

This application provides a device for cutting and splitting, including:

Cutting assembly, used to cut the panel to form a cutting line;

The carrying platform includes a plurality of movable carrying units, each carrying unit is used to carry a cut sub-panel, a side surface of the carrying unit carrying the sub-panel includes an adsorption area, and the adsorption area is provided with An adsorption hole, when the carrying unit adsorbs the sub-panel, the adsorption area is in contact with the product area of the sub-panel, and each of the carrying units can carry the cut sub-panel along the cutting line Horizontal movement in the vertical direction causes the two adjacent sub-panels to split along the cutting line.

Wherein, the adsorption holes are vacuum adsorption holes, and the adsorption holes are evenly arranged in the adsorption area.

In the cutting and splitting device of the present application, the area of one side of each carrying unit carrying the sub-panel is equal to the area of the carrying sub-panel.

In the cutting and splitting device of the present application, the area of one side of each carrying unit carrying the sub-panel is smaller than the area of the sub-panel carried by it.

In the cutting and splitting device of the present application, the cutting and splitting device further includes a control switch, and the control switch is used to control the opening and closing of the adsorption hole.

In the cutting and splitting device of the present application, the cutting and splitting device further includes a monitoring assembly for monitoring whether the carrying platform is fixed with the panel, and triggering the control switch when the panel is detected turn on.

In the cutting and splitting device of the present application, each of the adsorption holes is provided with a filter screen.

This application also provides a device for cutting and splitting, which includes:

Cutting assembly, used to cut the panel to form a cutting line;

In the cutting and splitting device of the present application, the suction hole is a vacuum suction hole.

In the cutting and splitting device of the present application, the adsorption holes are evenly arranged in the adsorption zone.

In the cutting and splitting device of the present application, the monitoring assembly includes a pressure sensor provided on the carrying platform.

In the cutting and splitting device of the present application, the monitoring assembly includes an optical sensor disposed on the carrying platform.

In the cutting and splitting device of the present application, the monitoring assembly includes an acoustic wave sensor provided on the carrying platform.

At the same time, the present application provides a method for cutting and splitting a panel, which uses the above-mentioned cutting and splitting device to cut and split a panel, including:

Step S1: Place the panel on the carrying platform;

Step S2: Open the suction hole on the bearing unit, so that the suction hole fixes the panel;

Step S3: Control the cutting assembly to cut the panel to form a cutting line;

Step S4: each of the bearing units carries a cut sub-panel horizontally along a direction perpendicular to the cutting line, so that two adjacent sub-panels are split along the cutting line.

In the slicing method of the present application, the panel may be an array substrate, a color film substrate, a liquid crystal panel into a box, and an OLED display panel.

In the slicing method of the present application, after step S4, the method further includes:

Step S5: the suction hole is closed, and the mechanical arm grabs the sub-panels on each carrying unit to carry it.

Beneficial effect

The present application provides a cutting and splitting device and a cutting and splitting method. The cutting and splitting device includes a cutting assembly for cutting a panel to form a cutting line; a bearing platform includes a plurality of movable bearing units, each of the bearing units For carrying a cut sub-panel, a side surface of the carrying unit carrying the panel is provided with an adsorption hole, and each of the carrying units can carry the cut one sub-panel along with the cutting The horizontal movement of the line in the vertical direction causes the two adjacent sub-panels to split along the cutting line. By adding suction holes, the panel can be accurately cut, grasped and transported. By splitting the splits horizontally, the edges of the panel can be prevented from being squeezed and collided during the process of splitting and transporting, reducing the appearance and reliability risks. The automatic splintering of the platform can realize unmanned operation, reducing the manpower requirements of the factory and the risk of human operation errors.

BRIEF DESCRIPTION

In order to more clearly explain the embodiments or the technical solutions in the prior art, the following will briefly introduce the drawings used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only inventions. For some embodiments, those of ordinary skill in the art can obtain other drawings based on these drawings without paying any creative labor.

Figure 1 is a schematic diagram of the structure of the traditional split mode;

2 is a first schematic structural view of a splitting device provided by an embodiment of the present application;

FIG. 3 is a second schematic structural diagram of a splitting device provided by an embodiment of the present application

4 is a schematic flowchart of a method for cutting a split provided by an embodiment of the present application;

FIG. 5 is a schematic structural diagram of the first stage in the process of cutting a sliver provided by an embodiment of the present application; FIG.

FIG. 6 is a schematic structural diagram of a second stage in the process of cutting a sliver provided by an embodiment of the present application; FIG.

FIG. 7 is a schematic structural diagram of a third stage in the process of cutting a sliver provided by an embodiment of the present application;

8 is a schematic structural diagram of a fourth stage in the process of cutting a sliver provided by an embodiment of the present application;

9 is a schematic structural diagram of a fifth stage in the process of cutting a sliver provided by an embodiment of the present application;

FIG. 10 is a schematic structural diagram of a sixth stage in the process of cutting a sliver provided by an embodiment of the present application.

Embodiments of the invention

The descriptions of the following embodiments refer to additional drawings to illustrate specific embodiments that can be implemented in the present application. Directional terms mentioned in this application, such as [upper], [lower], [front], [back], [left], [right], [inner], [outer], [side], etc., are for reference only Attach the direction of the schema. Therefore, the directional language used is to illustrate and understand this application, not to limit this application. In the figure, units with similar structures are indicated by the same reference numerals.

The present application is directed to the fact that the existing splitting method will cause the edge of the panel to be squeezed, have a poor appearance, or even be fragmented. This embodiment can alleviate this defect.

An embodiment of the present application provides a cutting and splitting device, which includes a cutting assembly and a carrying platform. The cutting assembly is used to cut the panel to form a cutting line, and the cutting line divides the panel into a plurality of sub-panels. It should be noted that in the entire cutting process, the cutting line left by the cutting assembly The panel will not be completely cut off, that is, the multiple sub-panels are not completely disconnected, and the splitting is required after the sequence.

The bearing platform includes a plurality of movable bearing units, and each of the bearing units can carry one cut sub-panel horizontally along a direction perpendicular to the cutting line, so that two adjacent sub-panels The cutting line is split.

Specifically, one side surface of the carrying unit carrying the sub-panel in the embodiment of the present application includes an adsorption area, and the adsorption area is provided with adsorption holes. In order to improve the efficiency of producing the panel, the entire panel is often used at the same time. A plurality of product areas are made, and the plurality of product areas are separated by a residual material area, and then the split pieces are cut in the residual material area to form a plurality of sub-panels. When the carrying unit adsorbs the sub-panel, each adsorption area is in contact with the corresponding product area.

In the embodiment of the present application, the suction hole is a vacuum suction hole, and the carrying platform vacuum adsorbs the split panel to be cut with a plurality of sucking holes, so that the panel is fixed on the carrying platform without shaking or deviation shift.

In the embodiment of the present application, in order to enable the panel to be cut to be adsorbed firmly on the carrying platform, thereby avoiding cutting errors, the adsorption holes are evenly arranged in the adsorption area, for example, any two adjacent The size and spacing of the adsorption holes are equal to ensure stable adsorption force.

In the embodiment of the present application, the cutting and splitting device further includes a control switch, and the control switch controls the opening and closing of the adsorption hole. After the panel is placed on the carrying platform, it is opened, then cut and split, and then the control hole is closed after the split is completed, so that the panel will not be misaligned during cutting and splitting, and there is no need for multiple alignment Calibration can achieve precise cutting, grasping and handling of glass.

In the embodiment of the present application, the cutting and splitting device further includes a monitoring assembly, and the monitoring assembly is used to monitor whether the carrying platform is fixed with the panel. The monitoring component may be a pressure sensor, an optical sensor, an acoustic wave sensor or the like, which is arranged on the carrying platform.

When it is detected that the panel is placed on the carrying platform, the control switch is triggered to open, and the adsorption hole is also opened. The adsorption hole firmly adsorbs the panel on the carrying platform, so that The cutting of the panel is more accurate.

When it is detected that the panel split is completed, the control switch is triggered to close, and the suction hole is also closed accordingly. The panel can be removed from the bearing platform to enter the next process.

In the embodiment of the present application, each of the adsorption holes is provided with a filter screen, which may specifically be a high-precision fine filter screen, which can prevent foreign objects on the platform and glass debris from entering the adsorption holes.

In the embodiment of the present application, the area of one side of each carrying unit carrying the sub-panel is equal to the area of the carrying sub-panel, that is, each of the carrying units is in contact with each other.

In one embodiment, the area of one side of each carrying unit carrying the sub-panel is smaller than the area of the carrying sub-panel carried by it, that is, there is a certain distance between each of the carrying units For contact, it suffices to ensure that the suction holes on the bearing unit can adsorb and fix the sub-panel.

In one embodiment, when four sub-panels are simultaneously manufactured on the entire panel, that is, when the product area of the panel is 4, please refer to FIG. 2 for a schematic diagram of the structure of the cutting and splitting device. In FIG. 2, the cutting and splitting device includes a carrying platform 20 and a cutting assembly 21, the cutting assembly 21 is used to cut the panel to form a cutting line, the cutting line divides the panel into 4 sub-panels, 4 The sub-panels are not completely disconnected, the carrying platform 20 includes four movable carrying units 200, each carrying unit 200 carries one of the sub-panels, and each carrying unit 200 carries the sub One side surface of the panel includes an adsorption area 201, the adsorption area 201 is provided with an adsorption hole 2011, the four adsorption areas 201 in the bearing platform 20 will be in contact with the four product areas of the panel, each of the bearing The unit 200 can carry the cut sub-panel horizontally along a direction perpendicular to the cutting line, so that the sub-panel is split along the cutting line to become 4 independent sub-panels.

In one embodiment, when nine sub-panels are fabricated on the entire panel at the same time, the schematic structural diagram of the cutting and splitting device is shown in FIG. 3. In FIG. 3, the cutting and splitting device includes a carrying platform 30 and a cutting assembly 31, the cutting assembly 31 is used to cut the panel to form a cutting line, the cutting line divides the panel into 9 sub-panels, 9 The sub-panels are not completely disconnected. The carrying platform 30 includes nine movable carrying units 300, each carrying unit 300 carrying one sub-panel, and each carrying unit 300 carrying sub-panels One side surface includes an adsorption area 301, the adsorption area 301 is provided with an adsorption hole 3011, nine adsorption areas 301 in the carrying platform 30 will be in contact with nine product areas of the sub-panel, each of the carrying units 300 can carry the cut sub-panel to move horizontally in a direction perpendicular to the cutting line, so that the sub-panel is split along the cutting line to become 9 independent sub-panels.

It should be noted that this application does not limit the arrangement of the adsorption holes in the adsorption area, and the arrangement of the adsorption holes in FIGS. 2 and 3 is only for illustration. In addition, the diameter of the suction hole is not limited, and the supporting platform 100 can simply adsorb the panel to be cut through the suction hole.

Of course, FIGS. 2 and 3 are only two structures of the cutting and splitting device, and the specific structure of the cutting and splitting device is not limited to the situation shown in FIGS. 2 and 3 and can be designed according to actual application requirements.

As shown in FIG. 4, an embodiment of the present application provides a method for cutting a split, the method includes the following steps;

Step S1: Place the panel on the carrying platform;

Step S3: Control the cutting assembly to cut the panel to form a cutting line;

The cutting split method provided by specific embodiments of the present application will be described in detail below with reference to the drawings.

As shown in FIG. 5, a cutting and splitting device is firstly provided. The cutting and splitting device includes a carrying platform 50 and a cutting assembly 51. The carrying platform 50 includes nine independent movable carrying units 501, 502, 503, 504, 505, 506, 507, 508, and 509, one side surface of each carrying unit carrying panel includes an adsorption area 510, and the adsorption area 510 is provided with an adsorption hole 5101.

As shown in FIG. 6, a panel 60 to be cut is provided. The panel 60 includes nine independent product areas 610, and the nine product areas 610 are separated by a residual material area 620.

The panel may be an array substrate, a color film substrate, a liquid crystal panel into a box, and an OLED display panel.

As shown in FIG. 7, the panel 60 is placed on the carrying platform 50 such that the nine product areas 610 of the panel 60 and the nine adsorption areas of the carrying platform 50 (not shown in the figure) In a pair of positions, the adsorption holes 5101 on the carrying platform 50 are opened to adsorb and fix 9 product areas.

As shown in FIG. 8, the cutting assembly 51 is controlled to cut on the remaining material area 620 of the panel 60, leaving a cutting line 611, a cutting line 612, a cutting line 613, and a cutting line 614 on the panel 60, The cutting line 611 and the cutting line 612 are parallel to each other, the cutting line 613 and the cutting line 614 are parallel to each other, the cutting line 611 and the cutting line 613 are perpendicular to each other, the cutting line 611, the The cutting line 612, the cutting line 613, and the cutting line 614 leave a cutting gap between nine product areas, so that the panel is divided into nine sub-panels 601, 602, 603, 604, 605, 606, 607, 608 and 609. It should be noted that, in the entire cutting process, the cutting line left by the cutting assembly 51 does not completely cut off the panel, that is, the sub-panels are not completely disconnected.

As shown in FIG. 9, keeping the bearing unit 504, the bearing unit 505, and the bearing unit 506 stationary, move the bearing unit 501, the bearing unit 502, the bearing unit 503 along with the The cutting line 611 moves perpendicular to the first direction 615, so that the sub-panel 601 carried on the carrying unit 501 and the sub-panel 604 carried on the carrying unit 504 are broken, and the The sub-panel 602 is broken away from the sub-panel 605 carried on the carrying unit 505, the sub-panel 603 carried on the carrying unit 503 and the sub-panel 606 carried on the carrying unit 506 are broken open.

At the same time, moving the carrying unit 507, the carrying unit 508, the carrying unit 509 along the second direction 616 perpendicular to the cutting line 612, so that the sub-panel 67 carried on the carrying unit 507 Breaking away from the sub-panel 604 carried on the carrying unit 504, breaking the sub-panel 608 carried on the carrying unit 508 and the sub-panel 605 carried on the carrying unit 505, the carrying The sub-panel 609 carried on the unit 509 is separated from the sub-panel 606 carried on the carrying unit 506.

As shown in FIG. 10, keeping the bearing unit 502, the bearing unit 505, and the bearing unit 508 stationary, move the bearing unit 501, the bearing unit 504, and the bearing unit 507 along with the The third direction 617 perpendicular to the cutting line 613 moves, so that the sub-panel 601 carried on the carrying unit 501 and the sub-panel 602 carried on the carrying unit 502 are broken, and the carried on the carrying unit 504 The sub-panel 604 is broken away from the sub-panel 605 carried on the carrying unit 505, the sub-panel 607 carried on the carrying unit 507 and the sub-panel 608 carried on the carrying unit 508 are broken open.

At the same time, moving the carrying unit 503, the carrying unit 506, the carrying unit 509 along the second direction 618 perpendicular to the cutting line 614, so that the sub-panel 603 carried on the carrying unit 503 Breaking away from the sub-panel 602 carried on the carrying unit 502, breaking the sub-panel 606 carried on the carrying unit 506 and the sub-panel 605 carried on the carrying unit 505, the carrying The sub-panel 609 carried on the unit 509 is broken away from the sub-panel 608 carried on the carrying unit 508.

Through the above-mentioned splitting step, the panel 60 is broken into 9 independent sub-panels. After the splitting is completed, the suction hole 5101 is closed, and the robotic arm can grab the sub-panels on each of the carrying units for transportation .

It should be noted that this cutting method and moving sequence are only examples, but this application is not limited to this, and the specific cutting method and moving method can be adjusted as needed.

In addition, the size and shape of the sub-panels after cutting in this embodiment are the same, but this application is not limited to this, and it is also possible to cut splits on the panel to form sub-panels with different sizes, that is, the size and shape of each bearing unit may Similarly, those skilled in the art can adjust according to actual needs.

According to the above embodiment, it is known that:

Embodiments of the present application provide a cutting and splitting device and a cutting and splitting method. The cutting and splitting device includes a cutting assembly for cutting a panel to form a cutting line; a carrying platform includes a plurality of movable carrying units, each of which The carrying unit is used to carry a cut sub-panel, and the side surface of the carrying unit carrying the panel is provided with an adsorption hole, and each of the carrying units can carry the cut one sub-panel along with The cutting line moves horizontally in a vertical direction to split two adjacent sub-panels along the cutting line. By adding suction holes, the panel can be accurately cut, grasped and transported. By splitting the splits horizontally, the edges of the panel can be prevented from being squeezed and collided during the process of splitting and transporting. The automatic splintering of the platform can realize unmanned operation, reducing the manpower requirements of the factory and the risk of human operation errors.

In summary, although the present application has been disclosed as preferred embodiments above, the above preferred embodiments are not intended to limit the present application. Those of ordinary skill in the art can make various changes without departing from the spirit and scope of the present application Such changes and retouching, so the scope of protection of this application shall be subject to the scope defined by the claims.

Claims

A splitting device includes:

Cutting assembly, used to cut the panel to form a cutting line;

The carrying platform includes a plurality of movable carrying units, each carrying unit is used to carry a cut sub-panel, a side surface of the carrying unit carrying the sub-panel includes an adsorption area, and the adsorption area is provided with An adsorption hole, when the carrying unit adsorbs the sub-panel, the adsorption area is in contact with the product area of the sub-panel, and each of the carrying units can carry the cut sub-panel along the cutting line Horizontal movement in the vertical direction causes the two adjacent sub-panels to split along the cutting line.

Wherein, the adsorption holes are vacuum adsorption holes, and the adsorption holes are evenly arranged in the adsorption area.
The cutting and splitting device according to claim 1, wherein an area of one side of each carrying unit carrying the sub-panel is equal to an area of the carrying sub-panel.
The cutting and splitting device according to claim 1, wherein an area of one side of each carrying unit carrying the sub-panel is smaller than an area of the sub-panel carried by it.
The cutting and splitting device according to claim 1, wherein the cutting and splitting device further comprises a control switch for controlling the opening and closing of the suction hole.
The cutting and splitting device according to claim 1, wherein the cutting and splitting device further comprises a monitoring assembly for monitoring whether the load platform is fixed with the panel, and triggers when the panel is detected The control switch is turned on.
The cutting and splitting device according to claim 1, wherein each of the adsorption holes is provided with a filter screen.
A splitting device includes:

Cutting assembly, used to cut the panel to form a cutting line;

The carrying platform includes a plurality of movable carrying units, each carrying unit is used to carry a cut sub-panel, a side surface of the carrying unit carrying the sub-panel includes an adsorption area, and the adsorption area is provided with An adsorption hole, when the carrying unit adsorbs the sub-panel, the adsorption area is in contact with the product area of the sub-panel, and each of the carrying units can carry the cut sub-panel along the cutting line Horizontal movement in the vertical direction causes the two adjacent sub-panels to split along the cutting line.
The cutting and splitting device according to claim 7, wherein an area of one side of each carrying unit carrying the sub-panel is equal to an area of the carrying sub-panel.
The cutting and splitting device according to claim 7, wherein an area of one side of each carrying unit carrying the sub-panel is smaller than an area of the sub-panel carried by it.
The cutting and splitting device according to claim 7, wherein the suction hole is a vacuum suction hole.
The cutting and splitting device according to claim 7, wherein the suction holes are uniformly arranged in the suction area.
The cutting and splitting device according to claim 7, wherein the cutting and splitting device further comprises a control switch for controlling the opening and closing of the suction hole.
The cutting and splitting device according to claim 12, wherein the cutting and splitting device further comprises a monitoring assembly for monitoring whether the load platform is fixed with the panel, and triggers when the panel is detected The control switch is turned on.
The cutting and splitting device according to claim 13, wherein the monitoring assembly includes a pressure sensor provided on the carrying platform.
The cutting and splitting device according to claim 13, wherein the monitoring assembly includes an optical sensor disposed on the carrying platform.
The cutting and splitting device according to claim 13, wherein the monitoring assembly includes an acoustic wave sensor provided on the carrying platform.
The cutting and splitting device according to claim 7, wherein each of the adsorption holes is provided with a filter screen.
A method for cutting a sliver, wherein using the cutting sliver device according to any one of claims 1 to 6 to split a panel includes the following steps:

Step S1: Place the panel on the carrying platform;

Step S2: Open the suction hole on the bearing unit, so that the suction hole fixes the panel;

Step S3: Control the cutting assembly to cut the panel to form a cutting line;

Step S4: each of the bearing units carries a cut sub-panel horizontally along a direction perpendicular to the cutting line, so that two adjacent sub-panels are split along the cutting line.
The slicing method according to claim 18, wherein the panel may be an array substrate, a color film substrate, a liquid crystal panel into a box, and an OLED display panel.
The slicing method according to claim 18, wherein after the step S4, the method further comprises:

Step S5: the suction hole is closed, and the mechanical arm grabs the sub-panels on each carrying unit to carry it.