CN109437536A - Cutting splitting device and cutting splitting method - Google Patents
Cutting splitting device and cutting splitting method Download PDFInfo
- Publication number
- CN109437536A CN109437536A CN201811458135.7A CN201811458135A CN109437536A CN 109437536 A CN109437536 A CN 109437536A CN 201811458135 A CN201811458135 A CN 201811458135A CN 109437536 A CN109437536 A CN 109437536A
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- Prior art keywords
- panel
- cutting
- sub
- load bearing
- bearing unit
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
It includes cutting assembly that the present invention, which provides a kind of cutting splitting device and cutting splitting method, the cutting splitting device, is cut to cutting line for carrying out to panel；Carrying platform, including multiple movable load bearing units, each load bearing unit is used to carry the sub-panel after a cutting, the load bearing unit carries and is provided with adsorption hole on a side surface of the panel, the sub-panel that each load bearing unit can carry after cutting is moved horizontally along the direction vertical with the cutting line, and adjacent two sub-panel is made to split along the cutting line.By increasing adsorption hole, the accurate cutting to panel, crawl can be achieved and carry, it is scattered sliver by horizontal direction, panel be can avoid in sliver, handling process, edge is squeezed, is collided, bad order and reliability risk are reduced, while unmanned operation may be implemented in the automatic sliver of platform, reduces factory's manpower demand and manual operation is made a mistake risk.
Description
Technical field
The present invention relates to liquid crystal display panel production technical field more particularly to a kind of cutting splitting device and cutting splitting sides
Method.
Background technique
The prior art needs to cut the display base plate of big version or display panel when making display device, cutting
After the completion, need to carry out the panel after cutting sliver, the display base plate or display panel of the small pieces after sliver are aobvious for making
Showing device.
During the cutting of existing display equipment and sliver, personnel's sliver or board pass through machinery after the completion of cutting
The direct sliver of arm, as shown in Figure 1, cutting assembly 11 forms the cutting notch 13 of certain depth by cutting on the faceplate 10, but
Panel 10 itself splits not yet at this time, so needing to apply the panel 10 after cutting the power in 14 directions after the completion of cutting, making
Panel 10 splits along cutting notch 13, forms 101 and 102 two parts panels, panel 101 is close to 1011 He of the edge of notch 13
Panel 102 can generate extruding, collision close to the edge of notch 13 1021, bad order or even fragmentation occur.
Therefore it provides a kind of avoidable panel is during sliver, edge squeezes, collision and cause the skill of bad order
Art is those skilled in the art's technical problem urgently to be resolved.
Summary of the invention
The present invention provides a kind of cutting splitting device and cutting splitting method, to alleviate existing panel during sliver,
The technical issues of edge squeezes, collides and cause bad order.
To solve the above problems, technical solution provided by the invention is as follows:
The present invention provides a kind of cutting splitting device, comprising:
Cutting assembly is cut to cutting line for carrying out to panel；
Carrying platform, including multiple movable load bearing units, after each load bearing unit is for carrying a cutting
Sub-panel, the side surface that the load bearing unit carries the sub-panel includes adsorption zone, and the adsorption zone is provided with adsorption hole,
When the load bearing unit adsorbs the sub-panel, the adsorption zone is in contact with the product zone of the sub-panel, each described
The sub-panel that load bearing unit can carry after cutting is moved horizontally along the direction vertical with cutting line, is made described in adjacent two
Sub-panel splits along the cutting line.
In cutting splitting device of the invention, each load bearing unit carry the sub-panel side area and its
The area equation of the sub-panel carried.
In cutting splitting device of the invention, the side area that each load bearing unit carries the sub-panel is less than
The area of its sub-panel carried.
In cutting splitting device of the invention, the adsorption hole is vacuum absorption holes.
In cutting splitting device of the invention, the adsorption hole is uniformly arranged in the adsorption zone.
In cutting splitting device of the invention, the cutting splitting device further includes control switch, the control switch
For controlling the on and off of the adsorption hole.
In cutting splitting device of the invention, filter screen is provided in each adsorption hole.
Meanwhile the present invention provides a kind of cutting splitting method, carries out cutting to panel using above-mentioned cutting splitting device and splits
Piece, comprising:
Step S1: plate placement on the carrying platform；
Step S2: opening the adsorption hole on load bearing unit, so that the fixed panel of the adsorption hole；
Step S3: control cutting assembly carries out the panel to be cut to cutting line；
Step S4: each load bearing unit carries the sub-panel after one piece of cutting along the side vertical with the cutting line
To moving horizontally, adjacent two sub-panel is made to split along the cutting line.
In cutting splitting method of the invention, the panel can be array substrate, color membrane substrates, the liquid crystal surface at box
Plate and OLED display panel.
In cutting splitting method of the invention, after the step S4 further include:
Step S5: closing the adsorption hole, and mechanical arm grabs the realization of the sub-panel on each load bearing unit and removes
Fortune.
The invention has the benefit that the present invention provides a kind of cutting splitting device and cutting splitting method, the cutting
Sliver apparatus includes cutting assembly, is cut to cutting line for carrying out to panel；Carrying platform, including multiple movable hold
Carrier unit, each load bearing unit are used to carry the sub-panel after a cutting, and the load bearing unit carries the panel
Be provided with adsorption hole on one side surface, each load bearing unit can carry a sub-panel after cutting along with institute
It states the vertical direction of cutting line to move horizontally, adjacent two sub-panel is made to split along the cutting line.By increasing adsorption hole,
The accurate cutting to panel, crawl can be achieved and carry, scattered sliver by horizontal direction, can avoid panel in sliver, carrying
In the process, edge squeeze, collision, reduce bad order and reliability risk, at the same the automatic sliver of platform may be implemented it is unmanned
Operation reduces factory's manpower demand and manual operation and makes a mistake risk.
Detailed description of the invention
It, below will be to embodiment or the prior art in order to illustrate more clearly of embodiment or technical solution in the prior art
Attached drawing needed in description is briefly described, it should be apparent that, the accompanying drawings in the following description is only some of invention
Embodiment for those of ordinary skill in the art without creative efforts, can also be attached according to these
Figure obtains other attached drawings.
Fig. 1 is the structural schematic diagram of traditional sliver mode；
Fig. 2 is the structural schematic diagram of cutting splitting device provided in an embodiment of the present invention；
Fig. 3 is the another structural schematic diagram of cutting splitting device provided in an embodiment of the present invention
Fig. 4 is the flow diagram of cutting splitting method provided in an embodiment of the present invention；
Fig. 5 a- Fig. 5 f is the structural representation of the different phase during cutting splitting method provided in an embodiment of the present invention
Figure.
Specific embodiment
The explanation of following embodiment is referred to the additional illustration, the particular implementation that can be used to implement to illustrate the present invention
Example.The direction term that the present invention is previously mentioned, such as [on], [under], [preceding], [rear], [left side], [right side], [interior], [outer], [side]
Deng being only the direction with reference to annexed drawings.Therefore, the direction term used be to illustrate and understand the present invention, rather than to
The limitation present invention.The similar unit of structure is with being given the same reference numerals in the figure.
The present invention will lead to face plate edge for existing sliver mode and generate extruding, bad order or even fragmentation occurs, this
Embodiment can alleviate the defect.
The embodiment of the present invention provides a kind of cutting splitting device comprising cutting assembly and carrying platform.The cutting group
For part for carrying out being cut to cutting line to panel, the panel is divided into multiple sub-panels by the cutting line, needs to illustrate
, in entire cutting process, the cutting line that the cutting assembly leaves can't completely cut through panel, i.e., multiple
It is not fully disconnected between sub-panel, postorder is needed to carry out sliver again.
The carrying platform includes multiple movable load bearing units, after each load bearing unit can carry a cutting
The sub-panel moved horizontally along the direction vertical with the cutting line, make adjacent two sub-panel along the cutting line
It splits.
Specifically, it includes absorption that the load bearing unit in the embodiment of the present invention, which carries a side surface of the sub-panel,
Area, the adsorption zone are provided with adsorption hole, and in order to improve the efficiency of production panel, often production is more simultaneously on whole panel
A product zone is separated out by clout between multiple product zones, and then in clout area, cutting splitting forms multiple sub-panels.Work as institute
When stating the load bearing unit absorption sub-panel, each adsorption zone is in contact with the corresponding product zone.
In embodiments of the present invention, the adsorption hole is vacuum absorption holes, and the carrying platform is with multiple adsorption hole vacuum
Sliver panel to be cut is adsorbed, the panel is fixed on the carrying platform and shakes or deviate without generating.
In embodiments of the present invention, in order to enable what panel to be cut consolidated to be adsorbed on the carrying platform, from
And avoid generating cutting error, the adsorption hole is uniformly arranged in the adsorption zone, such as any two adjacent adsorption hole
Size spacing it is equal, with guarantee adsorption capacity stablize.
In embodiments of the present invention, the cutting splitting device further includes control switch, described in the control switch control
Adsorption hole it is on and off.The opening after the panel is placed on the carrying platform, then cut, sliver, sliver
The control hole is turned off after the completion, and deviation will not occur during cutting and sliver for such panel, without multiple contraposition
Calibration is, it can be achieved that cutting, grabbing and carrying to the accurate of glass.
In embodiments of the present invention, it is provided with filter screen in each adsorption hole, specifically can be the fine mistake of high-precision
Strainer can prevent platform foreign matter and glass chip from entering in adsorption hole.
In embodiments of the present invention, each load bearing unit carry the sub-panel side area and its carried
The area equation of the sub-panel contacts with each other between that is, each load bearing unit.
In one embodiment, the side area that each load bearing unit carries the sub-panel is less than what it was carried
The area of the sub-panel has a certain distance between that is, each load bearing unit, is mutually not in contact with each other, as long as holding described in guaranteeing
The adsorption hole on carrier unit, which can adsorb, secures the above sub-panel.
In one embodiment, when making 4 sub-panels simultaneously on whole panel, i.e., the product zone of panel is 4
When, the structural schematic diagram of cutting splitting device is shown in Figure 2.In Fig. 2, the cutting splitting device includes carrying platform
20 and cutting assembly 21, the cutting assembly 21 is used to carry out being cut to panel cutting line, and the cutting line will be described
Panel is divided into 4 sub-panels, is not fully disconnected between 4 sub-panels, and the carrying platform 20 includes 4 movable carryings
Unit 200, each load bearing unit 200 carry a sub-panel, and each load bearing unit 200 carries the sub- face
One side surface of plate includes adsorption zone 201, and the adsorption zone 201 is provided with adsorption hole 2011, and four in the carrying platform 20
4 product zones respectively with panel are in contact by a adsorption zone 201, after each load bearing unit 200 can carry cutting
The sub-panel is moved horizontally along the direction vertical with the cutting line, and the sub-panel is made to split along the cutting line, at
For 4 independent sub-panels.
In one embodiment, when making 9 sub-panels simultaneously on entire panel, the knot of the cutting splitting device
Structure schematic diagram is shown in Figure 3.In Fig. 3, the cutting splitting device includes carrying platform 30 and cutting assembly 31, described
Cutting assembly 31 is used to be cut to panel cutting line, and the panel is divided into 9 sub-panels by the cutting line, and 9
It is not fully disconnected between a sub-panel, the carrying platform 30 includes 9 movable load bearing units 300, each described to hold
Carrier unit 300 carries a sub-panel, and it includes adsorption zone that each load bearing unit 300, which carries a side surface of sub-panel,
301, the adsorption zone 301 is provided with adsorption hole 3011,9 adsorption zones 301 in the carrying platform 30 will respectively with sub- face
9 product zones of plate are in contact, and the sub-panel that each load bearing unit 300 can carry after cutting is cut along with described
The vertical direction of secant moves horizontally, and the sub-panel is made to split along the cutting line, becomes 9 independent sub-panels.
It should be noted that the present invention is not defined the arrangement mode of adsorption hole in adsorption zone, adsorbed in Fig. 2, Fig. 3
The arrangement mode in hole is only to illustrate.In addition, not being defined to the aperture of adsorption hole, the carrying platform 100 can be made to pass through suction
Attached hole adsorbs panel to be cut.
Certainly, Fig. 2 and Fig. 3 is only two kinds of structures of cutting splitting device, the specific structure of cutting splitting device not office
It is limited to situation shown in Fig. 2 and Fig. 3, can be designed according to practical application request.
As shown in figure 4, the described method comprises the following steps the embodiment of the invention provides a kind of cutting splitting method；
Step S1: plate placement on the carrying platform；
Step S2: opening the adsorption hole on load bearing unit, so that the fixed panel of the adsorption hole；
Step S3: control cutting assembly carries out the panel to be cut to cutting line；
Step S4: each load bearing unit carries the sub-panel after one piece of cutting along the side vertical with the cutting line
To moving horizontally, adjacent two sub-panel is made to split along the cutting line.
The cutting splitting method of specific embodiment of the invention offer is provided with reference to the accompanying drawing.
As shown in Figure 5 a, a cutting splitting device is first provided, the cutting splitting device includes carrying platform 50 and cutting
Component 51, the carrying platform 50 include 9 independent movable load bearing units 501,502,503,504,505,506,507,
508,509, a side surface of each load bearing unit bearing panel includes adsorption zone 510, and the adsorption zone 510 is provided with suction
Attached hole 5101.
As shown in Figure 5 b, then a panel 60 to be cut is provided, the panel 60 includes 9 independent product zones 610,9
It is separated between product zone 610 by clout area 620.
The panel can be array substrate, color membrane substrates, liquid crystal display panel and OLED display panel at box.
As shown in Figure 5 c, the panel 60 is placed on the carrying platform 50, makes 9 product zones of the panel 60
610 align one by one with 9 adsorption zones (not marking in figure) of the carrying platform 50, open the absorption on the carrying platform 50
Hole 5101 makes its absorption fix 9 product zones.
As fig 5d, control cutting assembly 51 is cut in the clout area 620 of the panel 60, described
Cutting line 611, cutting line 612, cutting line 613, cutting line 614, the cutting line 611 and the cutting line are left on panel 60
612 are parallel to each other, and the cutting line 613 is parallel to each other with the cutting line 614, the cutting line 611 and the cutting line 613
Be mutually perpendicular to, the cutting line 611, the cutting line 612, the cutting line 613, the cutting line 614 9 product zones it
Between leave cutting notch so that the panel is divided into 9 sub-panels 601,602,603,604,605,606,607,608,609,
It should be noted that the cutting line that the cutting assembly 51 leaves can't be complete by panel in entire cutting process
It cuts off, i.e., is not fully disconnected between multiple sub-panels.
As depicted in fig. 5e, keep the load bearing unit 504, the load bearing unit 505, the load bearing unit 506 motionless, it will
The load bearing unit 501, the load bearing unit 502, the load bearing unit 503 are along vertical with the cutting line 611 first
Direction 615 is mobile, so that the sub-panel 601 carried on the load bearing unit 501 and carrying on the load bearing unit 504
The sub-panel 604 is broken apart, and the sub-panel 602 carried on the load bearing unit 502 and is held on the load bearing unit 505
The sub-panel 605 carried is broken apart, the sub-panel 603 carried on the load bearing unit 503 and the load bearing unit 506
The sub-panel 606 of upper carrying is broken apart.
Meanwhile by the load bearing unit 507, the load bearing unit 508, the load bearing unit 509 along with the cutting
The vertical second direction 616 of line 612 is mobile, so that the sub-panel 67 carried on the load bearing unit 507 and the carrying
The sub-panel 604 carried on unit 504 is broken apart, the sub-panel 608 carried on the load bearing unit 508 with it is described
The sub-panel 605 carried on load bearing unit 505 is broken apart, the sub-panel 609 carried on the load bearing unit 509 with
The sub-panel 606 carried on the load bearing unit 506 is broken apart.
As shown in figure 5f, keep the load bearing unit 502, the load bearing unit 505, the load bearing unit 508 motionless, it will
The load bearing unit 501, the load bearing unit 504, the load bearing unit 507 are along the third vertical with the cutting line 613
Direction 617 is mobile, so that the sub-panel 601 carried on the load bearing unit 501 and carrying on the load bearing unit 502
The sub-panel 602 is broken apart, and the sub-panel 604 carried on the load bearing unit 504 and is held on the load bearing unit 505
The sub-panel 605 carried is broken apart, the sub-panel 607 carried on the load bearing unit 507 and the load bearing unit 508
The sub-panel 608 of upper carrying is broken apart.
Meanwhile by the load bearing unit 503, the load bearing unit 506, the load bearing unit 509 along with the cutting
The vertical second direction 618 of line 614 is mobile, so that the sub-panel 603 carried on the load bearing unit 503 and the carrying
The sub-panel 602 carried on unit 502 is broken apart, the sub-panel 606 carried on the load bearing unit 506 with it is described
The sub-panel 605 carried on load bearing unit 505 is broken apart, the sub-panel 609 carried on the load bearing unit 509 with
The sub-panel 608 carried on the load bearing unit 508 is broken apart.
By above-mentioned cutting splitting step, the panel 60 fragments into 9 independent sub-panels, after the completion of sliver, closes
The adsorption hole 5101 is closed, mechanical arm can grab the sub-panel on each load bearing unit and realize carrying.
It should be noted that this cutting mode and mobile sequence are only citings, but invention is not limited thereto, specific to cut
Mode and move mode can adjust as needed.
In addition, the sub-panel size shape after cutting in the present embodiment is identical, but invention is not limited thereto, can also
With the different sub-panel of the cutting splitting formation size on panel, i.e., the size shape of each load bearing unit can also be different, this
Field technical staff can adjust according to actual demand.
According to above-described embodiment:
The embodiment of the present invention provides a kind of cutting splitting device and cutting splitting method, and the cutting splitting device includes cutting
Component is cut, is cut to cutting line for carrying out to panel；Carrying platform, including multiple movable load bearing units, Mei Gesuo
State load bearing unit for carry one cut after sub-panel, the load bearing unit carries to be arranged on a side surface of the panel
There is adsorption hole, each load bearing unit can carry a sub-panel after cutting along vertical with the cutting line
Direction moves horizontally, and adjacent two sub-panel is made to split along the cutting line.By increasing adsorption hole, it can be achieved that panel
It precisely cutting, crawl and carries, is scattered sliver by horizontal direction, can avoid panel in sliver, handling process, edge squeezes
Pressure, collision reduce bad order and reliability risk, while unmanned operation may be implemented in the automatic sliver of platform, reduces factory
Manpower demand and manual operation are made a mistake risk.
In conclusion although the present invention has been disclosed above in the preferred embodiment, but above preferred embodiment is not to limit
The system present invention, those skilled in the art can make various changes and profit without departing from the spirit and scope of the present invention
Decorations, therefore protection scope of the present invention subjects to the scope of the claims.
Claims (10)
1. a kind of cutting splitting device characterized by comprising
Cutting assembly is cut to cutting line for carrying out to panel；
Carrying platform, including multiple movable load bearing units, each load bearing unit are used to carry the sub- face after a cutting
Plate, the side surface that the load bearing unit carries the sub-panel includes adsorption zone, and the adsorption zone is provided with adsorption hole, works as institute
When stating the load bearing unit absorption sub-panel, the adsorption zone is in contact with the product zone of the sub-panel, each carrying
The sub-panel that unit can carry after cutting is moved horizontally along the direction vertical with cutting line, makes the adjacent two sub- face
Plate splits along the cutting line.
2. cutting splitting device according to claim 1, which is characterized in that each load bearing unit carries the sub- face
The area equation of the side area of plate and its sub-panel carried.
3. cutting splitting device according to claim 1, which is characterized in that each load bearing unit carries the sub- face
The side area of plate is less than the area of its sub-panel carried.
4. cutting splitting device according to claim 1, which is characterized in that the adsorption hole is vacuum absorption holes.
5. cutting splitting device according to claim 1, which is characterized in that the adsorption hole is uniform in the adsorption zone
Setting.
6. cutting splitting device according to claim 1, which is characterized in that the cutting splitting device further includes that control is opened
It closes, the control switch is for controlling the on and off of the adsorption hole.
7. cutting splitting device according to claim 1, which is characterized in that be provided with filtering in each adsorption hole
Net.
8. a kind of cutting splitting method, which is characterized in that using such as cutting splitting device as claimed in any one of claims 1 to 6
Sliver is carried out to panel, is included the following steps:
Step S1: plate placement on the carrying platform；
Step S2: opening the adsorption hole on load bearing unit, so that the fixed panel of the adsorption hole；
Step S3: control cutting assembly carries out the panel to be cut to cutting line；
Step S4: each load bearing unit carries the sub-panel after one piece of cutting along the direction water vertical with the cutting line
Translation is dynamic, and adjacent two sub-panel is made to split along the cutting line.
9. cutting splitting method according to claim 6, which is characterized in that the panel can be array substrate, color film
Substrate, liquid crystal display panel and OLED display panel at box.
10. cutting splitting method according to claim 6, which is characterized in that after the step S4 further include:
Step S5: closing the adsorption hole, and mechanical arm grabs the sub-panel on each load bearing unit and realizes carrying.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811458135.7A CN109437536B (en) | 2018-11-30 | 2018-11-30 | Cutting and splitting device and cutting and splitting method |
| PCT/CN2019/087877 WO2020107821A1 (en) | 2018-11-30 | 2019-05-22 | Panel cutting and splitting apparatus and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811458135.7A CN109437536B (en) | 2018-11-30 | 2018-11-30 | Cutting and splitting device and cutting and splitting method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109437536A true CN109437536A (en) | 2019-03-08 |
| CN109437536B CN109437536B (en) | 2021-01-15 |
Family
ID=65556095
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811458135.7A Active CN109437536B (en) | 2018-11-30 | 2018-11-30 | Cutting and splitting device and cutting and splitting method |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN109437536B (en) |
| WO (1) | WO2020107821A1 (en) |
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| CN110349502A (en) * | 2019-06-27 | 2019-10-18 | 深圳市华星光电半导体显示技术有限公司 | Substrate breaking device |
| WO2020107821A1 (en) * | 2018-11-30 | 2020-06-04 | 武汉华星光电技术有限公司 | Panel cutting and splitting apparatus and method |
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Also Published As
| Publication number | Publication date |
|---|---|
| WO2020107821A1 (en) | 2020-06-04 |
| CN109437536B (en) | 2021-01-15 |
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