CN107199410A - A kind of laser cutting device and its cutting method - Google Patents
A kind of laser cutting device and its cutting method Download PDFInfo
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- CN107199410A CN107199410A CN201710613754.8A CN201710613754A CN107199410A CN 107199410 A CN107199410 A CN 107199410A CN 201710613754 A CN201710613754 A CN 201710613754A CN 107199410 A CN107199410 A CN 107199410A
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- laser
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- platform
- cut
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
- C03B33/076—Laminated glass comprising interlayers
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/08—Severing cooled glass by fusing, i.e. by melting through the glass
- C03B33/082—Severing cooled glass by fusing, i.e. by melting through the glass using a focussed radiation beam, e.g. laser
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/54—Glass
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention provides a kind of laser cutting device and its cutting method, including loading assemblies, the first duplex manipulator, break bar cutting assembly, front laser cutting component, turn-over component, reverse side laser cutting component, the second duplex manipulator, laser sliver component and sorter assemblies.Because front laser cutting component and reverse side laser cutting component are cut by laser using bessel beam to the sample, and the bessel beam after focusing on is the longer focus on light beam of depth of focus, therefore, compared with Gaussian beam, sample to be cut that can be thicker to thickness is effectively cut, so as to expand the application of laser cutting device.Also, it is to be separable into product and waste material to carry out cutting twice to sample respectively using laser cutting component and laser sliver component in the present invention, and cutting efficiency is higher.In addition, the laser cutting device in the present invention have the advantages that Cutting Road it is narrow, cutting after product surface chipping it is small, taper is small, isostatic pressing strength is high and cleavable special-shaped product.
Description
Technical field
The present invention relates to laser cutting technique field, more specifically to a kind of laser cutting device and its cutting side
Method.
Background technology
Bilayer combination glass, refers to the double glazing being bonded together by two single-glasses by optical cement etc., it is
It is widely used in the fields such as FPD, liquid crystal panel, car-mounted display and intelligence wearing.Because bilayer combination glass is thicker, such as
Integral thickness is more than 2mm, therefore, it can only be split by the way of break bar cutting in the prior art.
But, because the mode that break bar is cut has, Cutting Road is wider, waste of materials, the product surface chipping after cutting
Greatly, it is impossible to cut the problems such as special-shaped product and big break bar loss, therefore, be unfavorable for the segmentation and application of bilayer combination glass.
Although a kind of method of the laser cutting product of use laser emitting is disclosed in the prior art, and this method has
Have the advantages that Cutting Road it is narrow, cutting after the small and cleavable special-shaped product of product surface chipping, still, due to laser emitting
Laser is Gaussian beam, therefore, and under the short limitation of Focal Depth for Gaussian Beam, above-mentioned laser cutting method can not be thicker to thickness
Bilayer combination glass effectively split.
The content of the invention
In view of this, the invention provides a kind of laser cutting device and its cutting method, to solve existing middle laser
The Focal Depth for Gaussian Beam of device outgoing is short, it is impossible to the problem of product thicker to thickness is effectively cut.
To achieve the above object, the present invention provides following technical scheme：
A kind of laser cutting device, including loading assemblies, the first duplex manipulator, break bar cutting assembly, front laser are cut
Cut component, turn-over component, reverse side laser cutting component, the second duplex manipulator, laser sliver component and sorter assemblies；
The loading assemblies are treated for taking out sample to be cut from magazine, and the sample to be cut being placed on
Fetch bit is put；
The first duplex manipulator is used to the sample to be cut for treating that fetch bit is put being carried to the break bar cutting
The break bar Cutting platform of component, and sample after the break bar Cutting platform upper slitter wheel is cut is carried to the front laser and cuts
Cut the laser-scribing platform of component；
The break bar cutting assembly is used to carry out break bar cutting to the sample to be cut；
The front that the front laser cutting component is used for the sample after being cut using bessel beam to the break bar is entered
Row laser cutting；
The turn-over component is used to overturn the sample, and the sample is carried into the reverse side laser cutting component
Laser-scribing platform；
The reverse side laser cutting component is used to be cut by laser the reverse side of the sample using bessel beam, institute
The cutting path that the positive cutting path of sample is stated with the sample reverse side is overlapped, the path of the laser cutting and the break bar
The path of cutting is different；
The second duplex manipulator is used to the sample after the laser cutting being carried to the laser sliver component
Sliver platform, and the sample after sliver on the sliver platform is carried to the rewinding platform of the sorter assemblies；
The laser sliver component is used to cut the sample progress secondary laser after the laser cutting using Gaussian beam
Cut, to carry out sliver separation to the sample, wherein path and the cutting of the obverse and reverse of secondary laser cutting
Path is identical；
The sorter assemblies are used to carry out sorting rewinding to the finished product of the sample on the rewinding platform.
It is preferred that, the break bar cutting assembly includes the first machine body, be fixed on first machine body the
One mechanism member, the first motion platform being fixed in first mechanism member, the break bar being arranged on first motion platform
Cutting platform, the break bar cutting head being fixed on above the break bar Cutting platform and the first contraposition part；
First motion platform is used to drive the sample on the break bar Cutting platform and the break bar Cutting platform
Moved along X-axis, Y-axis and Z axis；
The break bar cutting head is used to carry out break bar cutting to the sample；
The first contraposition part is used to be directed at the cutting position of the break bar cutting head, so that the break bar is cut
Cut head and break bar cutting is carried out to the sample along preset path.
It is preferred that, the front cutting assembly and the reverse side cutting assembly all include the second machine body, are fixed on institute
State the second mechanism member on the second machine body, the second motion platform being fixed in second mechanism member, be arranged on it is described
Laser-scribing platform on second motion platform, the laser cutting head being fixed on above the laser-scribing platform and the second contraposition
Part；
Second motion platform is used to drive the sample on the laser-scribing platform and the laser-scribing platform
Moved along X-axis, Y-axis and Z axis；
The laser cutting head is used for outgoing bessel beam, and sample progress laser is cut using bessel beam
Cut；
The second contraposition part is used to be directed at the cutting position of the laser cutting head, so that the laser is cut
The bessel beam for cutting an outgoing is cut by laser along preset path to the sample.
It is preferred that, the light path where the laser cutting head includes picosecond laser, beam shaping system and the first optically focused
Mirror；
The picosecond laser is used for shoot laser, and the laser is Gaussian beam；
The beam shaping system is used to the Gaussian beam being converted to bessel beam；
First condenser is used to the bessel beam focusing on the sample.
It is preferred that, the laser sliver component includes the 3rd machine body, be fixed on the 3rd machine body the
Three mechanism members, the 3rd motion platform being fixed in the 3rd mechanism member, the sliver being arranged on the 3rd motion platform
Platform, the sliver cutting head being fixed on above the sliver platform and the 3rd contraposition part；
3rd motion platform is for driving the sample on the sliver platform and the sliver platform along X-axis, Y-axis
With Z axis motion；
The sliver cutting head is used for outgoing Gaussian beam, and the sample is cut by laser using Gaussian beam；
The 3rd contraposition part is used to align the cutting position of the sliver cutting head, so that the sliver is cut
The Gaussian beam for cutting an outgoing is cut by laser along preset path to the sample.
It is preferred that, the loading assemblies include feed frame, the hoistable platform being arranged on the feed frame and feeding
Module；
The hoistable platform is used to place the magazine for being mounted with multiple samples to be cut；
The feeding module is used to take out the sample to be cut from the magazine, and by the sample to be cut
It is placed on and treats that fetch bit is put.
It is preferred that, the first duplex manipulator and the second duplex manipulator are all included with the carrying for carrying module
Main body and the duplex mechanical arm for being arranged in the carrying main body and being moved under the control of the carrying module；
The duplex mechanical arm includes the first mechanical arm and second mechanical arm of linkage, the first mechanical arm and described the
The all suctions with pipette samples of two mechanical arms have.
It is preferred that, the turn-over component includes turn-over part and blanking mechanical hand, and the turn-over part is described for overturning
Sample, the blanking mechanical hand is used to the sample being carried to the laser-scribing platform that the reverse side is cut by laser component；
The blanking mechanical hand includes with the main body for carrying module and set on the body and in the main body
The lower mobile mechanical arm of control, the mechanical arm has the carrying sucker of pipette samples.
It is preferred that, the sorter assemblies include machine cabinet body, the rewinding platform being arranged on the machine cabinet body, are placed on
The rewinding basket of the rewinding platform side and the robot for being arranged on the rewinding platform opposite side；The robot is used for institute
The finished product for stating the sample on rewinding platform is sorted in the rewinding basket.
A kind of cutting method of laser cutting device, applied to the laser cutting device described in as above any one, including：
Loading assemblies take out sample to be cut from magazine, and the sample to be cut is placed on treats that fetch bit is put；
First duplex manipulator cuts the break bar that the sample to be cut for treating that fetch bit is put is carried to break bar cutting assembly
Cut platform；
The break bar cutting assembly carries out break bar cutting to the sample to be cut；
Sample after the first duplex manipulator cuts the break bar Cutting platform upper slitter wheel is carried to the front
It is cut by laser the laser-scribing platform of component；
The positive of sample after the front laser cutting component is cut using bessel beam to the break bar is swashed
Light is cut；
The turn-over component overturns the sample, and the sample is carried into the laser that the reverse side is cut by laser component
Cutting platform；
The reverse side laser cutting component is cut by laser using bessel beam to the reverse side of the sample, the sample
The positive cutting path of product is overlapped with the cutting path of the sample reverse side, and the path of the laser cutting is cut with the break bar
Path it is different；
Sample after the laser cutting is carried to the sliver of the laser sliver component by the second duplex manipulator
Platform；
The laser sliver component carries out secondary laser to the sample after the laser cutting first using Gaussian beam and cut
Cut, to carry out sliver separation to the sample, wherein path and the cutting of the obverse and reverse of secondary laser cutting
Path is identical；
Sample after secondary laser cutting is carried to the rewinding platform of sorter assemblies by the second duplex manipulator；
The sorter assemblies carry out sorting rewinding to the finished product of the sample on the rewinding platform.
Compared with prior art, technical scheme provided by the present invention has advantages below：
Laser cutting device provided by the present invention and its cutting method, front laser cutting component and reverse side laser cutting
Component is cut by laser using bessel beam to the sample, is gathered because the bessel beam after focusing is that depth of focus is longer
Defocused laser beam, therefore, compared with Gaussian beam, sample to be cut that can be thicker to thickness is effectively cut, so as to expand
The application of laser cutting device.
Also, sample is cut twice respectively using laser cutting component and laser sliver component in the embodiment of the present invention
Cut and be separable into product and waste material, cutting efficiency is higher.In addition, the laser cutting device in the embodiment of the present invention has Cutting Road
Product surface chipping after narrow, cutting is small, taper is small, isostatic pressing strength is high and the advantages of cleavable special-shaped product.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is the accompanying drawing used required in technology description to be briefly described, it should be apparent that, drawings in the following description are only this
The embodiment of invention, for those of ordinary skill in the art, on the premise of not paying creative work, can also basis
The accompanying drawing of offer obtains other accompanying drawings.
Fig. 1 is the structural representation of laser cutting device provided in an embodiment of the present invention；
Fig. 2 is the structural representation of break bar cutting assembly provided in an embodiment of the present invention；
Fig. 3 is the structural representation of front cutting assembly provided in an embodiment of the present invention or reverse side cutting assembly；
Fig. 4 is the structural representation of laser sliver component 8 provided in an embodiment of the present invention；
Fig. 5 is the structural representation of loading assemblies provided in an embodiment of the present invention；
Fig. 6 is the structural representation of the first duplex manipulator provided in an embodiment of the present invention or the second duplex manipulator；
Fig. 7 is the structural representation of blanking mechanical hand provided in an embodiment of the present invention；
Fig. 8 is the structural representation of sorter assemblies provided in an embodiment of the present invention；
Fig. 9 is the flow chart of the cutting method of laser cutting device provided in an embodiment of the present invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.It is based on
Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under the premise of creative work is not made
Embodiment, belongs to the scope of protection of the invention.
The embodiments of the invention provide a kind of laser cutting device, as shown in figure 1, the laser cutting device includes feeding group
Part 1, the first duplex manipulator 2, break bar cutting assembly 3, front laser cutting component 4, turn-over component 5, reverse side laser cutting group
Part 6, the second duplex manipulator 7, laser sliver component 8 and sorter assemblies 9；
The loading assemblies 1 are used to take out sample A to be cut from magazine 10, and the sample A to be cut is put
Put and treating that fetch bit puts；
The first duplex manipulator 2 is cut for the sample A to be cut for treating that fetch bit is put to be carried into the break bar
Cut the break bar Cutting platform 30 of component 3, and the sample A after the upper slitter wheel of break bar Cutting platform 30 is cut be carried to it is described just
Face is cut by laser the laser-scribing platform 40 of component 4；
The break bar cutting assembly 3 is used to carry out break bar cutting to the sample A to be cut；
The front laser cutting component 4 is used for the front of the sample A after being cut using bessel beam to the break bar
It is cut by laser；
The turn-over component 5 is used to overturn the sample A, and the sample A is carried into the reverse side laser cutting group
The laser-scribing platform 60 of part 6；
The reverse side laser cutting component 6 is used to be cut by laser the reverse side of the sample A using bessel beam,
The positive cutting paths of sample A are overlapped with the cutting path of the sample A reverse side, the path of the laser cutting with it is described
The path of break bar cutting is different；
The second duplex manipulator 7 is used to the sample A after the laser cutting being carried to the laser sliver component 8
Sliver platform 80；
The laser sliver component 8 is used to carry out secondary laser to the sample A after the laser cutting using Gaussian beam
Cutting, to carry out sliver separation to the sample A, wherein path and the obverse and reverse of secondary laser cutting are cut
Cut path identical；
The second duplex manipulator 7 is additionally operable to the sample A after the secondary laser is cut and is carried to the sorting group
The rewinding platform 90 of part 9；
The sorter assemblies 9 are used to carry out sorting rewinding to the finished product of the sample A on the rewinding platform 90.
It should be noted that the laser cutting device in Fig. 1 includes two break bar cutting assemblies 3 and positioned at two break bars
Turn-over component 0 between cutting assembly 3, one of break bar cutting assembly 3 is used to carry out break bar cutting to sample A front,
Another break bar cutting assembly 3 is used to carry out sample A reverse side break bar cutting, and turn-over component 0 is used to turn over sample A
Face, and the Cutting platform of sample A from a break bar cutting assembly 3 is carried to the Cutting platform of another break bar cutting assembly 3,
But, the present invention is not limited to this, in other embodiments, and laser cutting device can only include a break bar cutting assembly
3。
In addition, the sample A to be cut in the embodiment of the present invention is preferably bilayer combination glass, the bilayer combination glass can
To apply in fields such as FPD, liquid crystal panel, car-mounted display and intelligence wearings.
In the present embodiment, as shown in Fig. 2 break bar cutting assembly 3 includes the first machine body 31, is fixed on first machine
The first mechanism member 32 in device main body 31, the first motion platform 33 being fixed in first mechanism member 32, be arranged on it is described
Break bar Cutting platform 30 on first motion platform 33, the and of break bar cutting head 34 for being fixed on the top of break bar Cutting platform 30
First contraposition part 35；
First motion platform 33 is used to drive the break bar Cutting platform 30 and the break bar Cutting platform 30
Sample A moved along X-axis, Y-axis and Z axis；The break bar cutting head 34 is used to carry out break bar cutting to the sample A；Described
One contraposition part 35 is used to be directed at the cutting position of the break bar cutting head 34 so that the break bar cutting head 34 along
Preset path carries out break bar cutting to the sample A.
In the present embodiment, as shown in figure 3, the front cutting assembly 4 includes the second machine body 41, is fixed on described the
The second mechanism member 42 on two machine bodies 41, the second motion platform 43 being fixed in second mechanism member 42, it is arranged on
Laser-scribing platform 40 on second motion platform 43, the laser cutting head for being fixed on the top of laser-scribing platform 40
44 and second align part 45；
Second motion platform 43 is used to drive the laser-scribing platform 40 and the laser-scribing platform 40
Sample A moved along X-axis, Y-axis and Z axis；The laser cutting head 44 is used for outgoing bessel beam, and uses bessel beam
The sample A is cut by laser；The second contraposition part 45 is used to enter the cutting position of the laser cutting head 44
Row alignment, cuts so that the bessel beam of the outgoing of the laser cutting head 44 carries out laser along preset path to the sample A
Cut.
In the present embodiment, the light path where the laser cutting head 44 includes picosecond laser, beam shaping system and the
One condenser；The picosecond laser is used for shoot laser, and the laser is Gaussian beam；The beam shaping system is used for will
The Gaussian beam is converted to bessel beam；First condenser is used to the bessel beam focusing on the sample
On.
In the present embodiment, beam shaping system include being successively set on axial cone prism in picosecond laser light extraction light path,
Beam expanding lens and second condenser lens.Wherein, axial cone prism is used to the Gaussian beam of picosecond laser outgoing being converted to Bezier light
Beam；Beam expanding lens is used to expand the bessel beam of axial cone prism outgoing；Second condenser lens are used for beam expanding lens outgoing
Bessel beam is focused.
Alternatively, what the beam expanding lens in the present embodiment included being successively set in picosecond laser light extraction light path is first saturating
Mirror, the second lens and the 3rd lens, wherein, the first lens are planoconvex spotlight, and the second lens are planoconvex spotlight, and the 3rd lens are flat
Concavees lens.Certainly, the present invention is not limited to this, in other embodiments, beam expanding lens can also include planoconvex spotlight and
One plano-concave lens, will not be repeated here.
In the present embodiment, bessel beam is expanded using beam expanding lens and using second condenser lens to Bezier light
Beam is focused, and can adjust the diameter of bessel beam focal beam spot, is that bessel beam enters into the first condenser
Line focusing provides advantage.Alternatively, the first condenser in the present embodiment is located on the focal plane of second condenser lens, when
So, the present invention is not limited to this.In the present embodiment, the first condenser is convex lens.Optionally, first condenser is thing
Mirror, the object lens are made up of multiple convex lens.Certainly, the present invention is not limited to this.
In the present embodiment, as shown in figure 4, the laser sliver component 8 includes the 3rd machine body 81, is fixed on described the
The 3rd mechanism member 82 on three machine bodies 81, the 3rd motion platform 83 being fixed in the 3rd mechanism member 82, it is arranged on
Sliver platform 80 on 3rd motion platform 83, the sliver cutting head 84 and the 3rd for being fixed on the top of sliver platform 80
Align part 85；
3rd motion platform 83 is used to drive the sample A edges on the sliver platform 80 and the sliver platform 80
X-axis, Y-axis and Z axis motion；The sliver cutting head 84 is used for outgoing Gaussian beam, and the sample A is entered using Gaussian beam
Row laser cutting；The 3rd contraposition part 85 is used to align the cutting position of the sliver cutting head 84, so that institute
The Gaussian beam for stating the outgoing of sliver cutting head 84 is cut by laser along preset path to the sample A.
Because the structure of reverse side cutting assembly 6 is identical with the structure of front cutting assembly 4, therefore, herein no longer to reverse side
The mechanism of cutting assembly 6 is repeated.It should be noted that the first mechanism member 32, the second mechanism member 42 and the 3rd mechanism member 82
All it is marble mechanism member.The first contraposition contraposition contraposition part 85 of part 45 and the 3rd of part 35, second all includes CCD
(Charge-coupled Device, charge coupled cell) image capturing system and to bit correction system, ccd image collection system
Unite for the image for gathering sample A and cutting head in real time, bit correction system is used for the position of cutting head and default cleavage
Put carry out alignment correction.
In the present embodiment, as shown in figure 5, the loading assemblies 1 include feed frame 11, are arranged on the feed frame 11
On hoistable platform 12 and feeding module 13；
The hoistable platform 12 is used to place the magazine 10 for being mounted with multiple sample A to be cut；
The feeding module 13 is used to take out the sample A to be cut from the magazine 10, and will be described to be cut
Sample A be placed on and treat that fetch bit is put.
Wherein, hoistable platform 12 can rise or fall, so that the sample A to be cut in magazine 10 can be by feeding mould
Group 13 is taken out.
In the present embodiment, as shown in fig. 6, the first duplex manipulator 2 and the second duplex manipulator 7 all include tool
There is the carrying main body 71 for carrying module 70 and be arranged in the carrying main body 71 and moved down in the control of the carrying module 70
Dynamic duplex mechanical arm 72；
The duplex mechanical arm 72 includes the first mechanical arm 720 and second mechanical arm 721 of linkage, the first mechanical arm
720 and the second mechanical arm 721 all with pipette samples A suction tool 722.
It should be noted that the carrying module 70 in the present embodiment is preferably slide rail, mechanical arm is preferably that can be slided along slide rail
Dynamic sliding block.Certainly, the present invention is not limited to this.
In the present embodiment, as shown in figure 1, turn-over component 5 includes turn-over part 50 and blanking mechanical hand 51, the turn-over portion
Part 50 is used to overturn the sample A, and the blanking mechanical hand 51 is used to the sample A being carried to the reverse side laser cutting group
The laser-scribing platform 60 of part 6.As shown in fig. 7, the blanking mechanical hand 51 is included with the He of main body 511 for carrying module 510
The mechanical arm 512 for being arranged in the main body 511 and being moved under the control of the carrying module 510, the mechanical arm 512 has
There is pipette samples A carrying sucker 513.
In the present embodiment, as shown in figure 8, the sorter assemblies 9 include machine cabinet body 91, are arranged on the machine cabinet body 91
On rewinding platform 90, be placed on the rewinding basket 92 of the side of rewinding platform 90 and be arranged on the opposite side of rewinding platform 90
Robot 93；The robot 93 is used to the finished product of the sample A on the rewinding platform 90 being sorted to the rewinding basket
In 92.
Application process exemplified by applying the bilayer combination glass in liquid crystal display panel to laser cutting device below
Illustrate.Wherein, the bilayer combination glass in liquid crystal display panel includes the glass substrate and color membrane substrates on array base palte
On glass substrate.Multiple display units can be produced on same panel by liquid crystal display panel during making, so
Counter plate progress cutting is divided into display unit independent one by one again afterwards, and each display unit can be applied in display.
First, multiple i.e. sample A magazines 10 of big panel be will be loaded with to be placed on hoistable platform 12, then lifted flat
Magazine 10 is elevated to specified location by platform 12, and feeding module 13 takes out sample A from magazine 10, and sample A is carried to waits to take
Position.Duplex mechanical arm 72 in first duplex manipulator 2 is slided to the left along module 70 is carried, and slides second mechanical arm 721
Move and treat that fetch bit is put, and the suction in second mechanical arm 721 is had 722 pipette samples A.Afterwards, duplex mechanical arm 72 is along carrying
Module 70 is slided to the right, second mechanical arm 721 is slided into the top of break bar Cutting platform 30, and sample A is placed on into break bar
On Cutting platform 30.
Then, break bar cutting is carried out to sample A using break bar cutting assembly 3, specifically, to array base palte on a panel greatly
On glass substrate carry out part cutting, to expose the binding area of array base palte, so as to by FPC (Flexible Printed
Circuit, FPC) etc. device be bundled on array base palte.
After the completion of break bar cutting, duplex mechanical arm 72 is slided to the left along module 70 is carried, the suction in second mechanical arm 721
Tool 722 is drawn the suction tool 722 treated in the sample A to be cut that fetch bit is put, first mechanical arm 720 and drawn on break bar Cutting platform 30
Break bar cutting after sample A, afterwards, duplex mechanical arm 72 along carry module 70 slide to the right, second mechanical arm 721 will be treated
The sample A of cutting is placed on break bar Cutting platform 30, and the sample A after first mechanical arm 720 cuts break bar is placed on front
On the laser-scribing platform 40 for being cut by laser component 4.
Front laser cutting component 4 uses bessel beam along front of the preset path to the sample A after break bar cutting
It is cut by laser, after the completion of the cutting of front, the mechanical arm 512 on blanking mechanical hand 51 can to the left be slided along module 510 is carried
Dynamic, mechanical arm 512 is slided into behind the top of the laser-scribing platform 40 of front laser cutting component 4, and carrying sucker 513 can be drawn
Sample A on laser-scribing platform 40, mechanical arm 512 can to the right be slided along module 510 is carried afterwards, and sample A is placed
On the platform of turn-over part 50, turn-over part 50 is carried out after turn-over to sample A, and sample A will be allowed to be changed into reverse side from facing up
After upwards, the pipette samples A again of carrying sucker 513, mechanical arm 512 continues on carrying module 510 and slided to the right, by sample A
On the laser-scribing platform 60 for being carried to reverse side laser cutting component 6, reverse side is cut by laser component 6 and use bessel beam pair
Sample A reverse side is cut by laser, wherein, the cutting path of the positive cutting paths of sample A and sample A reverse side is weighed completely
Close, still, path that the path of laser cutting cut with break bar is simultaneously differed, and laser cutting purpose is to cut into a big panel of opening
Independent display unit one by one.
Afterwards, the duplex mechanical arm 72 in the second duplex manipulator 7 is slided to the left along module 70 is carried, and makes the second machinery
The suction tool 722 that arm 721 is slided into the top of laser-scribing platform 60 of reverse side laser cutting component 6, second mechanical arm 721 is drawn
After sample A after laser cutting, duplex mechanical arm 72 is slided to the right along module 70 is carried, and slides into second mechanical arm 721
The top of sliver platform 80, and sample A is placed on the sliver platform 80 of laser sliver component 8, adopt laser sliver component 8
Secondary laser cutting is carried out to the sample A after laser cutting with Gaussian beam, to carry out sliver separation to sample A, wherein, it is secondary
The path of laser cutting is identical with the cutting path of obverse and reverse, so that sample A is separated along the path sliver.
Afterwards, duplex mechanical arm 72 is slided to the left along module 70 is carried, and the suction tool 722 in second mechanical arm 721 is drawn
Suction tool 722 in sample A after laser cutting, first mechanical arm 720 draws the sample A after sliver, then duplex mechanical arm 72
Slided to the right along module 70 is carried, sample A is placed on the sliver platform 80 of laser sliver component 8 by second mechanical arm 721,
Sample A after sliver is placed on rewinding platform 90 by first mechanical arm 720.Sorter assemblies 9 are to sample A on rewinding platform 90
Finished product carries out sorting rewinding, i.e., sample A finished product is sorted in rewinding basket 92 using robot 93, sample A is cut down
Waste material be sorted in waste product basket.
Laser cutting device provided in an embodiment of the present invention, front laser cutting component and reverse side laser cutting component are used
Bessel beam is cut by laser to the sample, because the bessel beam after focusing is the longer focus on light beam of depth of focus,
Therefore, compared with Gaussian beam, sample to be cut that can be thicker to thickness is effectively cut, so as to expand laser cutting
The application of equipment.
Also, sample is cut twice respectively using laser cutting component and laser sliver component in the embodiment of the present invention
Cut and be separable into product and waste material, cutting efficiency is higher.In addition, the laser cutting device in the embodiment of the present invention has Cutting Road
Product surface chipping after narrow, cutting is small, taper is small, isostatic pressing strength is high and the advantages of cleavable special-shaped product.
The embodiment of the present invention additionally provides a kind of cutting method of laser cutting device, is provided applied to above-described embodiment
Laser cutting device, as shown in figure 9, this method includes：
S901：Loading assemblies take out sample to be cut from magazine, and the sample to be cut is placed on waits to take
Position；
S902：The sample to be cut for treating that fetch bit is put is carried to the knife of break bar cutting assembly by the first duplex manipulator
Take turns Cutting platform；
S903：The break bar cutting assembly carries out break bar cutting to the sample to be cut；
S904：Sample after break bar Cutting platform upper slitter wheel cutting is carried to described by the first duplex manipulator
The laser-scribing platform of front laser cutting component；
S905：The front laser cutting component is entered using bessel beam to the front of the sample after break bar cutting
Row laser cutting；
S906：The turn-over component overturns the sample, and the sample is carried into the reverse side laser cutting component
Laser-scribing platform；
S907：The reverse side laser cutting component is cut by laser using bessel beam to the reverse side of the sample,
The positive cutting path of sample is overlapped with the cutting path of the sample reverse side, the path of the laser cutting and the knife
The path for taking turns cutting is different；
S908：Sample after the laser cutting is carried to the laser sliver component by the second duplex manipulator
Sliver platform；
S909：The laser sliver component is carried out secondary sharp using Gaussian beam to the sample after the laser cutting first
Light is cut, to carry out sliver separation to the sample, wherein the path of secondary laser cutting and the obverse and reverse
Cutting path is identical；
S910：Sample after secondary laser cutting is carried to the rewinding of sorter assemblies by the second duplex manipulator
Platform；
S911：The sorter assemblies carry out sorting rewinding to the finished product of the sample on the rewinding platform.
The idiographic flow of laser cutting in the present embodiment is same as the previously described embodiments, will not be repeated here.
The cutting method of laser cutting device provided in an embodiment of the present invention, front laser cutting component and reverse side laser are cut
Cut component to be cut by laser the sample using bessel beam, because the bessel beam after focusing is that depth of focus is longer
Focus on light beam, therefore, compared with Gaussian beam, sample to be cut that can be thicker to thickness is effectively cut, so as to expand
The application of laser cutting device.
Also, sample is cut twice respectively using laser cutting component and laser sliver component in the embodiment of the present invention
Cut and be separable into product and waste material, cutting efficiency is higher.In addition, the sample after cutting in the embodiment of the present invention has Cutting Road
Product surface chipping after narrow, cutting is small, taper is small, isostatic pressing strength is high and the advantages of cleavable special-shaped product.
The embodiment of each in this specification is described by the way of progressive, and what each embodiment was stressed is and other
Between the difference of embodiment, each embodiment identical similar portion mutually referring to.For device disclosed in embodiment
For, because it is corresponded to the method disclosed in Example, so description is fairly simple, related part is said referring to method part
It is bright.
The foregoing description of the disclosed embodiments, enables professional and technical personnel in the field to realize or using the present invention.
A variety of modifications to these embodiments will be apparent for those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, it is of the invention
The embodiments shown herein is not intended to be limited to, and is to fit to and principles disclosed herein and features of novelty phase one
The most wide scope caused.
Claims (10)
1. a kind of laser cutting device, it is characterised in that including loading assemblies, the first duplex manipulator, break bar cutting assembly, just
Face laser cutting component, turn-over component, reverse side laser cutting component, the second duplex manipulator, laser sliver component and sorting group
Part；
The loading assemblies treat fetch bit for taking out sample to be cut from magazine, and the sample to be cut being placed on
Put；
The first duplex manipulator is used to the sample to be cut for treating that fetch bit is put being carried to the break bar cutting assembly
Break bar Cutting platform, and by the break bar Cutting platform upper slitter wheel cut after sample be carried to the positive laser cutting group
The laser-scribing platform of part；
The break bar cutting assembly is used to carry out break bar cutting to the sample to be cut；
Swashed in the front that the front laser cutting component is used for the sample after being cut using bessel beam to the break bar
Light is cut；
The turn-over component is used to overturn the sample, and the sample is carried into the laser that the reverse side is cut by laser component
Cutting platform；
The reverse side laser cutting component is used to be cut by laser the reverse side of the sample using bessel beam, the sample
The positive cutting path of product is overlapped with the cutting path of the sample reverse side, and the path of the laser cutting is cut with the break bar
Path it is different；
The second duplex manipulator is used for the sliver that the sample after the laser cutting is carried to the laser sliver component
Platform, and the sample after sliver on the sliver platform is carried to the rewinding platform of the sorter assemblies；
The laser sliver component is used to carry out secondary laser cutting to the sample after the laser cutting using Gaussian beam, with
Sliver separation is carried out to the sample, wherein path and the cutting path phase of the obverse and reverse of secondary laser cutting
Together；
The sorter assemblies are used to carry out sorting rewinding to the finished product of the sample on the rewinding platform.
2. equipment according to claim 1, it is characterised in that the break bar cutting assembly includes the first machine body, consolidated
The first mechanism member being scheduled on first machine body, the first motion platform being fixed in first mechanism member, setting
Break bar Cutting platform on first motion platform, the break bar cutting head and being fixed on above the break bar Cutting platform
One contraposition part；
First motion platform is for driving the sample on the break bar Cutting platform and the break bar Cutting platform along X
Axle, Y-axis and Z axis motion；
The break bar cutting head is used to carry out break bar cutting to the sample；
The first contraposition part is used to be directed at the cutting position of the break bar cutting head, so that the break bar cutting head
Break bar cutting is carried out to the sample along preset path.
3. equipment according to claim 1, it is characterised in that the front cutting assembly and the reverse side cutting assembly are all
Including the second machine body, the second mechanism member being fixed on second machine body, it is fixed in second mechanism member
The second motion platform, be arranged on second motion platform laser-scribing platform, be fixed on the laser-scribing platform
The laser cutting head of top and the second contraposition part；
Second motion platform is for driving the sample on the laser-scribing platform and the laser-scribing platform along X
Axle, Y-axis and Z axis motion；
The laser cutting head is used for outgoing bessel beam, and the sample is cut by laser using bessel beam；
The second contraposition part is used to be directed at the cutting position of the laser cutting head, so that the laser cutting head
The bessel beam of outgoing is cut by laser along preset path to the sample.
4. equipment according to claim 3, it is characterised in that the light path where the laser cutting head includes picosecond laser
Device, beam shaping system and the first condenser；
The picosecond laser is used for shoot laser, and the laser is Gaussian beam；
The beam shaping system is used to the Gaussian beam being converted to bessel beam；
First condenser is used to the bessel beam focusing on the sample.
5. equipment according to claim 1, it is characterised in that the laser sliver component includes the 3rd machine body, consolidated
The 3rd mechanism member being scheduled on the 3rd machine body, the 3rd motion platform being fixed in the 3rd mechanism member, setting
Sliver platform on the 3rd motion platform, the sliver cutting head and the 3rd contraposition part being fixed on above the sliver platform
Part；
3rd motion platform is for driving the sample on the sliver platform and the sliver platform along X-axis, Y-axis and Z
Axle is moved；
The sliver cutting head is used for outgoing Gaussian beam, and the sample is cut by laser using Gaussian beam；
The 3rd contraposition part is used to align the cutting position of the sliver cutting head, so that the sliver cutting head
The Gaussian beam of outgoing is cut by laser along preset path to the sample.
6. equipment according to claim 1, it is characterised in that the loading assemblies include feed frame, be arranged on it is described
Hoistable platform and feeding module on feed frame；
The hoistable platform is used to place the magazine for being mounted with multiple samples to be cut；
The feeding module is used to take out the sample to be cut from the magazine, and the sample to be cut is placed
Treating that fetch bit puts.
7. equipment according to claim 1, it is characterised in that the first duplex manipulator and second duplex machinery
Hand all includes with the carrying main body for carrying module and is arranged in the carrying main body and under the control of the carrying module
Mobile duplex mechanical arm；
The duplex mechanical arm includes the first mechanical arm and second mechanical arm of linkage, the first mechanical arm and second machine
The all suctions with pipette samples of tool arm have.
8. equipment according to claim 1, it is characterised in that the turn-over component includes turn-over part and blanking mechanical
Hand, the turn-over part is used to overturn the sample, and the blanking mechanical hand swashs for the sample to be carried into the reverse side
The laser-scribing platform of light cutting assembly；
The blanking mechanical hand includes with the main body for carrying module and set on the body and in the control of the main body
The mechanical arm of lower movement, the mechanical arm has the carrying sucker of pipette samples.
9. equipment according to claim 1, it is characterised in that the sorter assemblies include machine cabinet body, be arranged on it is described
Rewinding platform on machine cabinet body, it is placed on the rewinding basket of the rewinding platform side and is arranged on the rewinding platform opposite side
Robot；The robot is used to the finished product of the sample on the rewinding platform being sorted in the rewinding basket.
10. a kind of cutting method of laser cutting device, it is characterised in that applied to swashing described in any one of claim 1 to 9
Light cutting equipment, including：
Loading assemblies take out sample to be cut from magazine, and the sample to be cut is placed on treats that fetch bit is put；
First duplex manipulator cuts the break bar that the sample to be cut for treating that fetch bit is put is carried to break bar cutting assembly flat
Platform；
The break bar cutting assembly carries out break bar cutting to the sample to be cut；
Sample after the first duplex manipulator cuts the break bar Cutting platform upper slitter wheel is carried to the front laser
The laser-scribing platform of cutting assembly；
The front laser cutting component carries out laser to the front of the sample after break bar cutting using bessel beam and cut
Cut；
The turn-over component overturns the sample, and the sample is carried into the laser cutting that the reverse side is cut by laser component
Platform；
The reverse side laser cutting component is cut by laser using bessel beam to the reverse side of the sample, and the sample is just
The cutting path in face is overlapped with the cutting path of the sample reverse side, the road that the path of the laser cutting is cut with the break bar
Footpath is different；
Sample after the laser cutting is carried to the sliver platform of the laser sliver component by the second duplex manipulator；
The laser sliver component carries out secondary laser cutting using Gaussian beam to the sample after the laser cutting first, with
Sliver separation is carried out to the sample, wherein path and the cutting path phase of the obverse and reverse of secondary laser cutting
Together；
Sample after secondary laser cutting is carried to the rewinding platform of sorter assemblies by the second duplex manipulator；
The sorter assemblies carry out sorting rewinding to the finished product of the sample on the rewinding platform.
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|---|---|---|---|
| CN201710613754.8A CN107199410B (en) | 2017-07-25 | 2017-07-25 | A kind of laser cutting device and its cutting method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710613754.8A CN107199410B (en) | 2017-07-25 | 2017-07-25 | A kind of laser cutting device and its cutting method |
Publications (2)
| Publication Number | Publication Date |
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| CN107199410A true CN107199410A (en) | 2017-09-26 |
| CN107199410B CN107199410B (en) | 2019-04-02 |
Family
ID=59912118
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| CN201710613754.8A Active CN107199410B (en) | 2017-07-25 | 2017-07-25 | A kind of laser cutting device and its cutting method |
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| CN110563320B (en) * | 2019-09-26 | 2022-08-30 | 深圳市韵腾激光科技有限公司 | Large-breadth glass cutting and splitting device adopting laser |
| CN111718113A (en) * | 2020-06-28 | 2020-09-29 | 深圳泰德激光科技有限公司 | Glass cutting equipment |
| CN111718113B (en) * | 2020-06-28 | 2024-04-19 | 深圳泰德激光技术股份有限公司 | Glass cutting apparatus |
| CN111844478A (en) * | 2020-06-29 | 2020-10-30 | 深圳市鸿昇自动化设备有限公司 | Mobile phone screen cutting and processing equipment and mobile phone screen cutting and processing method |
| CN111844478B (en) * | 2020-06-29 | 2022-03-18 | 深圳市鸿昇自动化设备有限公司 | Mobile phone screen cutting and processing equipment and mobile phone screen cutting and processing method |
| CN113210840A (en) * | 2021-05-31 | 2021-08-06 | 深圳泰德激光科技有限公司 | Laser lobe of a leaf device |
| CN113210839A (en) * | 2021-05-31 | 2021-08-06 | 深圳泰德激光科技有限公司 | Laser filamentation device |
| CN113772942A (en) * | 2021-09-28 | 2021-12-10 | 苏州科韵激光科技有限公司 | Glass laser cutting device and method |
| CN113772942B (en) * | 2021-09-28 | 2023-08-15 | 苏州科韵激光科技有限公司 | Glass laser cutting device and method |
| CN114160997A (en) * | 2021-12-29 | 2022-03-11 | 广东华奕激光技术有限公司 | Double-sided laser cutting machine |
| CN114309996A (en) * | 2022-03-10 | 2022-04-12 | 广东创兴精密制造股份有限公司 | Processing system with feeding, cutting and sorting functions |
| CN116275567B (en) * | 2023-01-19 | 2024-01-12 | 常州英诺激光科技有限公司 | PCB laser board separating system and method |
| CN116275567A (en) * | 2023-01-19 | 2023-06-23 | 常州英诺激光科技有限公司 | PCB laser board separating system and method |
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Address after: 523770 Second Floor, 3 Kusai Science Park, No. 8 Fumin South Road, Foxin Community, Dalang Town, Dongguan City, Guangdong Province Patentee after: Dongguan Shengxiong Laser Advanced Equipment Co., Ltd. Address before: 523000 First Floor, Building A, 53 Fofu Road, Foziwa Village, Dalang Town, Dongguan City, Guangdong Province Patentee before: Dongguan Strong Laser Co., Ltd. |
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