CN110202271A - Laser cutting method - Google Patents
Laser cutting method Download PDFInfo
- Publication number
- CN110202271A CN110202271A CN201810166062.8A CN201810166062A CN110202271A CN 110202271 A CN110202271 A CN 110202271A CN 201810166062 A CN201810166062 A CN 201810166062A CN 110202271 A CN110202271 A CN 110202271A
- Authority
- CN
- China
- Prior art keywords
- workpiece
- laser
- rack
- plate
- lead screw
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0426—Fixtures for other work
- B23K37/0435—Clamps
Abstract
The present invention proposes a kind of laser cutting method, it is the following steps are included: provide a laser cutting device, laser cutting device includes board, transport mechanism, cutting mechanism, stands mechanism and sliver mechanism, cutting mechanism includes mobile platform and laser cutter, and sliver mechanism includes fixed fixture and at least one heating laser；Transport mechanism picks and places workpiece to mobile platform；Laser cutter emits laser beam to be precut to the workpiece being located on mobile platform and form pre-incision lines；Transport mechanism the workpiece after precuting will be picked and placed from mobile platform to stand mechanism on and carry out standing preset time；Transport mechanism picks and places the workpiece after standing to fixed fixture from mechanism is stood；Each heating laser transmitting laser beam is to heat the workpiece being located in fixed fixture along pre-incision lines, so that workpiece be made to carry out sliver under the impact of thermal stress along pre-incision lines and realize the cutting to workpiece.Above-mentioned laser cutting method cutting yield is high.
Description
Technical field
The present invention relates to a kind of cutting method, especially a kind of laser for the carry out cutting processing to glass pieces is cut
Segmentation method.
Background technique
Existing glass cutting equipment mainly cuts workpiece using traditional glass cutter.However, above-mentioned cutting
Glass pieces are also easy to produce chipping, and the edge strength of glass pieces is weak, subsequent also to need CNC cutting process, increase processing procedure, mention
High cost.Meanwhile processing method is carried out to glass pieces using laser, fragment is also easy to produce during complex process and sliver
Phenomenon reduces the yield of processing.
Summary of the invention
In view of the above situation, it is necessary to which a kind of laser cutting method that cutting yield is high is provided.
A kind of laser cutting method comprising following steps:
A laser cutting device is provided, which includes board, transport mechanism, cutting mechanism, stands mechanism
And sliver mechanism, the transport mechanism, the cutting mechanism, the standing mechanism and the sliver mechanism are set on the board, the cutting
Mechanism includes the mobile platform and laser cutter being set on the board, and the mobile platform is for placing workpiece and driving the work
Part is mobile, and for emitting laser beams, which includes fixed fixture and at least one heating laser to the laser cutter,
The heating laser can heat the workpiece；
The transport mechanism picks and places the workpiece to the mobile platform；
The laser cutter emits laser beam so that the workpiece being located on the mobile platform is precut and be formed pre-
Cutting line；
The transport mechanism picks and places the workpiece after precuting from the mobile platform in the standing mechanism and carrying out
Stand preset time；
The transport mechanism picks and places the workpiece after standing to the fixed fixture from mechanism is stood；
Each heating laser transmitting laser beam is to carry out the workpiece being located in the fixed fixture along pre-incision lines
Heating, so that the workpiece be made to carry out sliver under the impact of thermal stress along pre-incision lines and realize the cutting to the workpiece.
Above-mentioned laser cutting method is fixed and is stood in advance to the workpiece after precuting by the standing mechanism in board
If the time, so that workpiece be made to be released effectively the thermal stress generated during precut, make workpiece in the heated of sliver mechanism
The thermal stress generated in journey is uniform, avoids fragmentation, improves the yield of cutting.
Detailed description of the invention
Fig. 1 is the stereoscopic schematic diagram of the laser cutting device of an embodiment of the present invention.
Fig. 2 is the stereoscopic schematic diagram of the feed mechanism of the laser cutting device in Fig. 1.
Fig. 3 is the stereoscopic schematic diagram of the standing mechanism of the laser cutting device in Fig. 1.
Fig. 4 is the stereoscopic schematic diagram of the cutting agency of the laser cutting device in Fig. 1.
Fig. 5 is that the process of the laser cutting method using the laser cutting device in Fig. 1 of an embodiment of the present invention is shown
It is intended to.
Main element symbol description
The present invention that the following detailed description will be further explained with reference to the above drawings.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that the described embodiment is only a part of the embodiment of the present invention, instead of all the embodiments.Based on this
Embodiment in invention, every other reality obtained by those of ordinary skill in the art without making creative efforts
Example is applied, shall fall within the protection scope of the present invention.
It should be noted that it can be when an element or component are considered as " connection " another element or component
It is directly connected to another element or component or may be simultaneously present the element or component being centrally located.When an element or group
Part is considered as " setting exist " another element or component, it, which can be, is set up directly on another element or component or can
The element or component being centrally located can be existed simultaneously.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term " and or " used herein includes one or more phases
Any and all combinations of the listed item of pass.
Referring to Fig. 1, the laser cutting device 100 that laser cutting method first embodiment of the present invention uses is used for work
Part 200 carries out cutting processing.Laser cutting device 100 include board 10, feed mechanism 20, transport mechanism 30, cutting mechanism 40,
Stand mechanism 50, sliver mechanism 60 and cutting agency 70.Feed mechanism 20, cutting mechanism 40, stands mechanism at transport mechanism 30
50, sliver mechanism 60 and cutting agency 70 are set on board 10.Feed mechanism 20 is used to successively carry out the workpiece 200 that pile is folded
Feeding.Transport mechanism 30 is for being transmitted workpiece 200.Cutting mechanism 40 be used for along predetermined cut path to workpiece 200 into
Row is precut.Mechanism 50 is stood to be used to the workpiece 200 after the processing of cutting mechanism 40 carrying out standing heat dissipation.Sliver mechanism 60 uses
In the workpiece 200 after standing is heated and make above-mentioned workpiece 200 along cutting path carry out sliver and achieve the purpose that cutting.
Workpiece 200 after cutting agency 70 is used to cut carries out blanking.In the present embodiment, workpiece 200 is glass plate.
Board 10 includes the first rack 11, the first support plate 12, the second rack 13, the second support plate 14, third rack 15
And third support plate 16.The substantially rectangular frame of first rack 11.First support plate 12 is set in the first rack 11.Second machine
The substantially rectangular frame of frame 13.Second rack 13 is set to the side of the first rack 11 and one end close to the first rack 11.The
11 groups of l-shaped of two racks 13 and the first rack.Second support plate 14 is set in the second rack 13.The substantially square of third rack 15
Shape frame.Third rack 15 is close to the second rack 13 and the first rack 11.Third support plate 16 is set in third rack 15.On
Material mechanism 20, transport mechanism 30 and standing mechanism 50 are set in the first support plate 12.Cutting agency 70 is set to the second support
Plate 14.Cutting mechanism 40 and sliver mechanism 60 are set in third support plate 16.In the present embodiment, the second support plate 14, which runs through, to be opened
Equipped with through-hole 141.
Please refer to Fig. 1 and Fig. 2, feed mechanism 20 include fixed plate 21, feed screw nut 22, lead screw 23, at least one
Guide rod 24, mounting plate 25, feeding actuator 26, supporting plate 27 and protective frame 28.Fixed plate 21 is set to the first support of board 10
Plate 12 is towards on the side of the first rack 11.Feed screw nut 22 is arranged in the substantial middle in fixed plate 21 and being located at fixed plate 21
Position.Lead screw 23 is arranged on feed screw nut 22 and screws togather with feed screw nut 22.Each guide rod 24 is slidably arranged in fixed plate
On 21.Mounting plate 25 is set on one end of each guide rod 24 and is located in the first rack 11.Feeding actuator 26 is set to peace
It is connected in loading board 25 and with one end of lead screw 23 to drive lead screw 23 to rotate.Supporting plate 27 is set to the other end of each guide rod 24
Above and with lead screw 23 it is connected far from one end of mounting plate 25.Supporting plate 27 is for placing multiple workpiece 200.Protective frame 28 is set to
It is protected on supporting plate 27 with the multiple workpiece 200 folded to pile.The lead screw 23 of rotation drives support under the action of feed screw nut 22
Plate 27 is mobile to drive the multiple workpiece 200 being located on supporting plate 27 to be moved.In the present embodiment, the quantity of guide rod 24 is two
A, feeding actuator 26 is servo motor.
Referring to Fig. 1, transport mechanism 30 includes the first transfer robot 31 and the second transfer robot 32.First passes
Manipulator 31 and the second transfer robot 32 is sent to be set in turn in one side in the first support plate 12 and close to the first support plate 12
Edge (does not indicate).First transfer robot 31 is used to successively pick and place the multiple workpiece 200 being located on supporting plate 27 to cutting mechanism
40 and will it is precut after workpiece 200 pick and place to standing in mechanism 50.Second transfer robot 32, which can will be located at, stands mechanism
It picks and places in the pick-and-place to sliver mechanism 60 of workpiece 200 on 50 and by the workpiece 200 in sliver mechanism 60 is located to cutting agency 70
On.
Cutting mechanism 40 includes mobile platform 41 and laser cutter 42.Mobile platform 41 is set in the first support plate 12
And close to feed mechanism 20.Mobile platform 41 is used to fix the workpiece 200 of the first transfer robot 31 transmission and is able to drive work
Part 200 moves in the two-dimensional direction according to default route.Laser cutter 42 is set in third support plate 16.Laser cutter
42 are used to emit picosecond laser beam to be precut to the workpiece 200 being located on mobile platform 41 and form pre-incision lines.This
In embodiment, laser cutter 42 can process multiple equidistant aperture (not shown) to workpiece 200 along predetermined cut path,
And above-mentioned multiple equidistant keyhole formation pre-incision lines.
Please refer to Fig. 1 and Fig. 3, stands mechanism 50 and include fixed frame 51, loading plate 52, multiple locating pieces 53 and two
Clamp assemblies 54.Fixed frame 51 is set in the first support plate 12 of board 10.Loading plate 52 is set on fixed frame 51.Carrying
Container 521 is offered on plate 52.Container 521 is opened on side of the loading plate 52 far from fixed frame 51 and is located at loading plate
52 substantial middle positions.Container 521 is used to accommodate the workpiece 200 placed after precuting.Loading plate is arranged in multiple locating pieces 53
To be positioned to the workpiece 200 being located in container 521 on 52 and close to the opposite sides edge (not indicating) of loading plate 52.
Two clamp assemblies 54 are set to the other opposite sides edge (not indicating) on loading plate 52 and respectively close to loading plate 52.Often
A clamp assemblies 54 include at least one clamping actuator 541 and clamping piece 542.Each clamping actuator 541 is set to carrying
One side edge (not indicating) on plate 52 and close to container 521.Clamping piece 542 be set on each clamping actuator 541 and
It is each clamping actuator 541 driving under move with support be located at container 521 in workpiece 200, thus to workpiece 200 into
Row grips.In the present embodiment, the quantity of the clamping actuator 541 of each clamp assemblies 54 is three, clamps actuator 541
For straight line cylinder.
As shown in Figure 1, sliver mechanism 60 includes fixed fixture 61 and at least one heating laser 62.Fixed fixture 61 is set
It is placed in the first support plate 12 of board 10.Fixed fixture 61 is for the workpiece 200 after fixed placement standing.At least one heating
Laser 62 is set in the third support plate 16 of board 10 and towards fixed fixture 61.Each heating laser 62 can emit
Laser beam is to heat the workpiece 200 being located in fixed fixture 61 along pre-incision lines, to make workpiece 200 along pre-incision lines
It carries out sliver and realizes the cutting to workpiece 200.In the present embodiment, heating laser 62 is carbon dioxide laser.
Please refer to Fig. 1 and Fig. 4, cutting agency 70 includes intermediate station 71, blanking mechanical hand 72, blanking component 73 and material
Dish platform 74.Intermediate station 71 is set in the first support plate 12 of board 10 to place the workpiece after sliver 200.Blanking mechanical hand 72
It is set in the second support plate 14 of board 10.Blanking mechanical hand 72 can be by the workpiece 200 after sliver on intermediate station 71
It picks and places to blanking component 73.Blanking component 73 includes the first fixing piece 731, at least one guide rod 732, the second fixing piece
733, lead screw 734, feed screw nut 735, blanking actuator 736 and bracket 737.First fixing piece 731 is substantially in long strip-board shape.The
One fixing piece 731 is set to the second support plate 14 towards the side of the second rack 13.One end of each guide rod 732 is set to
On one fixing piece 731.Second fixing piece 733 is substantially in long strip-board shape.Second fixing piece 733 is set to each guide rod 732
The other end.The both ends of lead screw 734 are rotatably arranged in respectively on the first fixing piece 731 and the second fixing piece 733.Feed screw nut
735 are sheathed on lead screw 734 and screw togather with lead screw 734.Blanking actuator 736 is set on the second fixing piece 733 and and lead screw
734 one end is connected.Blanking actuator 736 can drive lead screw 734 to rotate, to keep feed screw nut 735 mobile.Bracket
737 are set on feed screw nut 735 and move through through-hole 141 under the drive of feed screw nut 735.Bracket 737 is for putting
Set charging tray 300.Charging tray platform 74 is set in the second support plate 14 of board 10 and close to through-hole 141.Charging tray platform 74 is for placing
The folded multiple charging trays 300 of pile.In the present embodiment, blanking actuator 736 is servo motor.
Please refer to Fig. 1 to Fig. 5, the present invention is swashed using above-mentioned laser cutting device 100 to what workpiece 200 was cut
The better embodiment of light cutting method the following steps are included:
Step S101: multiple 200 piles of workpiece are laminated on the supporting plate 27 of feed mechanism 20.
Specifically, feeding actuator 26 drives the rotation of lead screw 23 to drive supporting plate 27 close to the first transfer robot 31.
The S102: the first transfer robot of step 31 will be located at the workpiece 200 on supporting plate 27 and pick and place to the shifting of cutting mechanism 40
On moving platform 41.
Step S103: laser cutter 42 emits laser beam to carry out pre-cut to the workpiece 200 being located on mobile platform 41
It cuts and forms pre-incision lines.
Specifically, laser cutter 42 emits laser beam focus on the workpiece 200 being located on mobile platform 41, and movement is flat
Platform 41 drives workpiece 200 to move in the two-dimensional direction according to preset track, so that laser cutter 42 be enable to cut along default
It cuts path and equidistant aperture (not shown), and above-mentioned multiple equidistant keyhole formation pre-incision lines is processed to workpiece 200.
Step S104: the first transfer robot 31 of transport mechanism 30 will it is precut after workpiece 200 from mobile platform 41
In upper pick-and-place to standing mechanism 50 and carry out standing preset time.
Specifically, the workpiece 200 after the first transfer robot 31 will be precut is picked and placed from mobile platform 41 to standing machine
In the container 521 of structure 50 and between multiple locating pieces 53, the clamping actuator 541 of each clamp assemblies 54 drives clamping
Part 542 supports the workpiece 200 in container 521, thus when being gripped to workpiece 200 and carrying out standing default
Between.
In the present embodiment, the range for standing preset time positioned at the workpiece 200 stood in mechanism 50 is 300 seconds to 350 seconds.
Step S105: the second transfer robot 32 of transport mechanism 30 takes the workpiece 200 after standing from mechanism 50 is stood
It puts to the fixed fixture 61 of sliver mechanism 60.
Step S106: each heating laser 62 emit laser beam with to the workpiece 200 being located in fixed fixture 61 along pre-
Cutting line is heated, so that workpiece 200 be made to carry out sliver under the impact of thermal stress along pre-incision lines and realize to workpiece 200
Cutting.
The S107: the second transfer robot of step 32 and cutting agency 70 carry out blanking to the workpiece 200 after sliver.
Specifically, the second transfer robot 32 picks and places the workpiece after sliver from fixed fixture 61 to cutting agency 70
On intermediate station 71, blanking mechanical hand 72 will successively be located at the workpiece 200 on intermediate station 71 and pick and place to the charging tray being located on bracket 737
In 300, blanking actuator 736 drives the rotation of lead screw 734 to drive bracket 737 and charging tray 300 mobile, to complete blanking and receipts
Material.
It is to be appreciated that step S107 can be removed, by the workpiece 200 after cutting is manually carried out rewinding, have no effect on
The cutting of workpiece 200.
Laser cutting device 100 includes board 10, feed mechanism 20, transport mechanism 30, cutting mechanism 40, stands mechanism
50, sliver mechanism 60 and cutting agency 70, but not limited to this, in other embodiments, feed mechanism 20 and cutting agency 70 can
With removal, the directly communicated mechanism 30 of workpiece 200 is placed on cutting mechanism 40, has no effect on the cutting of workpiece 200.
Standing mechanism 50 includes fixed frame 51, loading plate 52, multiple locating pieces 53 and two clamp assemblies 54, but is not limited to
This, in other embodiments, multiple locating pieces 53 can remove, and workpiece 200 is placed directly on loading plate 52, have no effect on folder
Hold the gripping to workpiece 200 of component 54.
Feed mechanism 20 includes fixed plate 21, feed screw nut 22, lead screw 23, at least one guide rod 24, mounting plate 25, feeding
Actuator 26, supporting plate 27 and protective frame 28, but not limited to this, in other embodiments, at least one guide rod 24 and protective frame 28
It can remove, mounting plate 25 is set to one end on lead screw 23 and close to lead screw 23, and lead screw 23 can be 25 turns with respect to mounting plate
It is dynamic, it has no effect on lead screw 23 and drives supporting plate 27 mobile.
Cutting agency 70 includes intermediate station 71, blanking mechanical hand 72, blanking component 73 and charging tray platform 74, but not limited to this,
In other embodiments, charging tray platform 74 can remove, charging tray 300 by being manually placed directly on the supporting plate 27 of blanking component 73,
Charging tray 300 is had no effect on to be placed on the supporting plate 27 of blanking component 73.
Above-mentioned laser cutting device 100 and laser cutting method on board 10 by being arranged standing mechanism 50 to pre-cut
Workpiece 200 after cutting is fixed and stands preset time, generates during precut so that workpiece 200 be made to be released effectively
Thermal stress, the thermal stress for generating workpiece 200 in the heating process of sliver mechanism 60 is uniform, avoids fragmentation, improves cutting
Yield.
In addition, those skilled in the art can also do other variations in spirit of that invention, certainly, these are smart according to the present invention
The variation that mind is done, should all be included in scope of the present invention.
Claims (12)
1. a kind of laser cutting method comprising following steps:
A laser cutting device is provided, which includes board, transport mechanism, cutting mechanism, stands mechanism and split
Piece mechanism, the transport mechanism, the cutting mechanism, the standing mechanism and the sliver mechanism are set on the board, the cutting mechanism
Including the mobile platform and laser cutter being set on the board, the mobile platform is for placing workpiece and the workpiece being driven to move
Dynamic, for emitting laser beams, which includes fixed fixture and at least one heating laser to the laser cutter, should be added
Thermal laser device can heat the workpiece；
The transport mechanism picks and places the workpiece to the mobile platform；
The laser cutter emits laser beam so that the workpiece being located on the mobile platform is precut and be formed precut
Line；
The transport mechanism picks and places the workpiece after precuting from the mobile platform in the standing mechanism and standing
Preset time；
The transport mechanism picks and places the workpiece after standing to the fixed fixture from the standing mechanism；
Each heating laser transmitting laser beam to be heated to the workpiece being located in the fixed fixture along pre-incision lines,
To make the workpiece carry out sliver under the impact of thermal stress along pre-incision lines and realize the cutting to the workpiece.
2. laser cutting method as described in claim 1, it is characterised in that: the workpiece in the standing mechanism stands pre-
If the range of time is 300 seconds to 350 seconds.
3. laser cutting method as described in claim 1, it is characterised in that: the laser cutter emits laser beam focus in position
In on the workpiece on mobile platform, which drives the workpiece to move in the two-dimensional direction according to preset track, thus
Enable the laser cutter along predetermined cut path equidistant apertures multiple to the work pieces process, and above-mentioned multiple equidistant
The keyhole formation pre-incision lines.
4. laser cutting method as described in claim 1, it is characterised in that: the standing mechanism include fixed frame, loading plate and
Two clamp assemblies, on the board, which is set on the fixed frame to place the workpiece fixed mount setting, and two
The clamp assemblies are set to the opposite sides edge on the loading plate and respectively close to the loading plate, and each clamp assemblies include
Clamping piece and at least one clamping actuator, each clamping actuator are set on the loading plate and close to the one of the loading plate
Side edge, the clamping piece are set on each clamping actuator and move under the driving of the corresponding clamping actuator to support
It holds the workpiece and the workpiece is gripped and the workpiece is made to stand preset time.
5. laser cutting method as claimed in claim 4, it is characterised in that: offer container on the loading plate, the receiving
Slot is opened in the loading plate far from the side of the fixed frame and positioned at the loading plate central location, which puts for accommodating
Set the workpiece after precuting.
6. laser cutting method as claimed in claim 5, it is characterised in that: the standing mechanism further includes multiple locating pieces, more
The other opposite sides edge on the loading plate and close to the loading plate is arranged in the container in a locating piece
Workpiece is positioned.
7. laser cutting method as claimed in claim 6, it is characterised in that: the board include the first rack, the first support plate,
Second rack, the second support plate, third rack and third support plate, first rack, second rack and the third rack are all
For rectangular frame, which is set in first rack, second rack be set to the side of first rack and
Close to one end of first rack, second rack and the first rack group l-shaped, second support plate are set to second machine
On frame, which is set in the third rack close to second rack and first rack, the third support plate, the biography
Send mechanism, the mobile platform and the fixed mount setting in first support plate, the laser cutter and the sliver mechanism are arranged
In in the third support plate.
8. laser cutting method as claimed in claim 7, it is characterised in that: the laser cutting device further includes feed mechanism,
The feed mechanism includes fixed plate, feed screw nut, lead screw, mounting plate, feeding actuator and supporting plate, the fixed plate be set to this
For one support plate towards on the side of first rack, which is arranged in the center in the fixed plate and being located at the fixed plate
Position, the lead screw are arranged on the feed screw nut and screw togather with the feed screw nut, which is set on the lead screw and close
One end of the lead screw, the feeding actuator are set on the mounting plate and are connected with one end of the lead screw to drive the lead screw to turn
Dynamic, which is connected with the lead screw far from one end of the mounting plate, and the supporting plate is for placing multiple workpiece, the silk of rotation
Thick stick drives the supporting plate mobile under the action of the feed screw nut to drive the multiple workpiece being located on the supporting plate to be moved.
9. laser cutting method as claimed in claim 8, it is characterised in that: the feed mechanism further include at least one guide rod and
Protective frame, each guide rod are slidably arranged in the fixed plate, which is set on one end of each guide rod, the support
Plate is set on the other end of each guide rod, which is set on the supporting plate and is protected with the multiple workpiece folded to pile
Shield.
10. laser cutting method as claimed in claim 9, it is characterised in that: second support plate, should through through-hole is offered
Laser cutting device further includes cutting agency, which is used to carry out blanking and rewinding, the blanking to the workpiece after sliver
Mechanism includes intermediate station, blanking mechanical hand and blanking component, after which is set in first support plate to place sliver
The workpiece, which is set in second support plate, which, which can will be located on the intermediate station, split
The workpiece after piece is picked and placed to the blanking component, which consolidates including the first fixing piece, at least one guide rod, second
Determine part, lead screw, feed screw nut, blanking actuator and bracket, first fixing piece be set to second support plate towards this second
One end of the side of rack, each guide rod is set on first fixing piece, which is set to each this and leads
To the other end of bar, the both ends of the lead screw are rotatably arranged in respectively on first fixing piece and second fixing piece, the lead screw
Nut is sheathed on the lead screw and screws togather with the lead screw, the blanking actuator be set on second fixing piece and with the lead screw
One end is connected, which can drive the lead screw to rotate, which is set on the feed screw nut and in the lead screw
The through-hole is moved through under the drive of nut, the bracket is for placing charging tray.
11. laser cutting method as claimed in claim 10, it is characterised in that: the cutting agency further includes charging tray platform, the material
Dish platform is set in second support plate and close to the through-hole, which is used to place the folded multiple charging trays of pile.
12. laser cutting method as claimed in claim 10, it is characterised in that: the transport mechanism includes the first transfer robot
With the second transfer robot, first transfer robot and second transfer robot be set in turn in first support plate and
Close to an edge of first support plate, which is used to successively take the multiple workpiece being located on the supporting plate
Put on the mobile platform of the cutting mechanism and will it is precut after the workpiece pick and place to the loading plate of the standing mechanism, this
Two transfer robots can pick and place the workpiece being located on the loading plate in the fixed fixture of the sliver mechanism and will be located at should
Workpiece in fixed fixture is picked and placed to the intermediate station.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810166062.8A CN110202271B (en) | 2018-02-28 | 2018-02-28 | Laser cutting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810166062.8A CN110202271B (en) | 2018-02-28 | 2018-02-28 | Laser cutting method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110202271A true CN110202271A (en) | 2019-09-06 |
| CN110202271B CN110202271B (en) | 2021-06-25 |
Family
ID=67778941
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810166062.8A Active CN110202271B (en) | 2018-02-28 | 2018-02-28 | Laser cutting method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110202271B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111718113A (en) * | 2020-06-28 | 2020-09-29 | 深圳泰德激光科技有限公司 | Glass cutting equipment |
| WO2021056191A1 (en) * | 2019-09-24 | 2021-04-01 | 大族激光科技产业集团股份有限公司 | Laser processing system |
| CN114163117A (en) * | 2021-12-01 | 2022-03-11 | 成都晶华光电科技股份有限公司 | Laser splitting device for cutting optical glass |
| CN114163118A (en) * | 2021-12-01 | 2022-03-11 | 成都晶华光电科技股份有限公司 | Secondary laser splitting device for cutting optical glass |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20010065390A (en) * | 1999-12-29 | 2001-07-11 | 구자홍 | A apparatus for cut-off of glass by laser beam |
| JP2003088977A (en) * | 2002-03-29 | 2003-03-25 | Hamamatsu Photonics Kk | Laser beam machining method |
| CN1991484A (en) * | 2005-12-29 | 2007-07-04 | Lg.菲利浦Lcd株式会社 | Apparatus and method for cutting liquid crystal display device and method for fabricating liquid crystal display device using the same |
| CN101279403A (en) * | 2007-04-06 | 2008-10-08 | 富士迈半导体精密工业（上海）有限公司 | Laser processing method |
| CN101439928A (en) * | 2007-11-23 | 2009-05-27 | 三星康宁精密琉璃株式会社 | Glass substrate laser cutting apparatus |
| CN101712529A (en) * | 2008-09-29 | 2010-05-26 | 康宁股份有限公司 | Laser separation of glass sheets |
| CN103817442A (en) * | 2013-12-05 | 2014-05-28 | 深圳市大族激光科技股份有限公司 | Method and system for laser cutting of corner |
| CN104470866A (en) * | 2012-07-11 | 2015-03-25 | 旭硝子株式会社 | Method for manufacturing small-sized sheet, structural element, and method for manufacturing structural element |
| CN106994564A (en) * | 2017-04-27 | 2017-08-01 | 东莞市盛雄激光设备有限公司 | A kind of laser cutting device and its cutting method |
| CN107199410A (en) * | 2017-07-25 | 2017-09-26 | 东莞市盛雄激光设备有限公司 | A kind of laser cutting device and its cutting method |
-
2018
- 2018-02-28 CN CN201810166062.8A patent/CN110202271B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20010065390A (en) * | 1999-12-29 | 2001-07-11 | 구자홍 | A apparatus for cut-off of glass by laser beam |
| JP2003088977A (en) * | 2002-03-29 | 2003-03-25 | Hamamatsu Photonics Kk | Laser beam machining method |
| CN1991484A (en) * | 2005-12-29 | 2007-07-04 | Lg.菲利浦Lcd株式会社 | Apparatus and method for cutting liquid crystal display device and method for fabricating liquid crystal display device using the same |
| CN101279403A (en) * | 2007-04-06 | 2008-10-08 | 富士迈半导体精密工业（上海）有限公司 | Laser processing method |
| CN101439928A (en) * | 2007-11-23 | 2009-05-27 | 三星康宁精密琉璃株式会社 | Glass substrate laser cutting apparatus |
| CN101712529A (en) * | 2008-09-29 | 2010-05-26 | 康宁股份有限公司 | Laser separation of glass sheets |
| CN104470866A (en) * | 2012-07-11 | 2015-03-25 | 旭硝子株式会社 | Method for manufacturing small-sized sheet, structural element, and method for manufacturing structural element |
| CN103817442A (en) * | 2013-12-05 | 2014-05-28 | 深圳市大族激光科技股份有限公司 | Method and system for laser cutting of corner |
| CN106994564A (en) * | 2017-04-27 | 2017-08-01 | 东莞市盛雄激光设备有限公司 | A kind of laser cutting device and its cutting method |
| CN107199410A (en) * | 2017-07-25 | 2017-09-26 | 东莞市盛雄激光设备有限公司 | A kind of laser cutting device and its cutting method |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021056191A1 (en) * | 2019-09-24 | 2021-04-01 | 大族激光科技产业集团股份有限公司 | Laser processing system |
| CN111718113A (en) * | 2020-06-28 | 2020-09-29 | 深圳泰德激光科技有限公司 | Glass cutting equipment |
| WO2022001284A1 (en) * | 2020-06-28 | 2022-01-06 | 深圳泰德激光科技有限公司 | Glass cutting apparatus |
| CN111718113B (en) * | 2020-06-28 | 2024-04-19 | 深圳泰德激光技术股份有限公司 | Glass cutting apparatus |
| CN114163117A (en) * | 2021-12-01 | 2022-03-11 | 成都晶华光电科技股份有限公司 | Laser splitting device for cutting optical glass |
| CN114163118A (en) * | 2021-12-01 | 2022-03-11 | 成都晶华光电科技股份有限公司 | Secondary laser splitting device for cutting optical glass |
| CN114163118B (en) * | 2021-12-01 | 2023-09-01 | 成都晶华光电科技股份有限公司 | Secondary laser splitting device for cutting optical glass |
| CN114163117B (en) * | 2021-12-01 | 2023-10-20 | 成都晶华光电科技股份有限公司 | Laser splitting device for cutting optical glass |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110202271B (en) | 2021-06-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110204187A (en) | Laser cutting device | |
| CN110202271A (en) | Laser cutting method | |
| US7828031B2 (en) | Apparatus and method for aligning and fixing ribbon on a solar cell | |
| JP2634531B2 (en) | Printed wiring board mounting equipment | |
| CN214518237U (en) | Full-automatic laser processing equipment | |
| CN210818367U (en) | Shaver tool bit assembly line | |
| CN214289470U (en) | Automatic cutting detection device | |
| CN115647825B (en) | Welding strip carrier, welding strip carrier assembly, welding equipment and welding method | |
| CN113555756B (en) | Full-automatic wire stripping and welding production line equipment for electronic wire | |
| KR101897382B1 (en) | Prepreg cutting and laminating device | |
| JP2017104931A (en) | Plate material processing system and plate material processing method | |
| KR20200063007A (en) | Lamination apparatus of temporary bonding film and method thereof | |
| CN211366090U (en) | Board arranging equipment | |
| CN110621441A (en) | Feeding device and feeding method | |
| CN212161841U (en) | Laser nondestructive cutting equipment for photovoltaic cell | |
| TWI687289B (en) | Electronic component crimping device and test classification equipment containing the same | |
| KR20110117848A (en) | Strip loading apparatus for semiconductor package manufacturing equipment | |
| CN113148655A (en) | Glass processing production line and loading attachment thereof | |
| JP6955013B2 (en) | Laser irradiation device and substrate transfer device | |
| CN211072247U (en) | Welding equipment for saw blade and tool bit | |
| CN217775884U (en) | Laser processing apparatus | |
| JP6747861B2 (en) | Wire harness production line | |
| CN219928172U (en) | Bale breaker | |
| CN214322116U (en) | Automatic assembling equipment | |
| CN108625047A (en) | Lockstitch button holder work station |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20210303 Address after: 518109 Guangzhou Guanlan Foxconn Hongguan Science Park B workshop 5 C09 buildings 4 floors, C07 buildings 2 floors, C08 buildings 3 floors 4 floors, C04 buildings 1 floors Applicant after: SHENZHENSHI YUZHAN PRECISION TECHNOLOGY Co.,Ltd. Address before: 518109 Longhua Office, Longhua District, Shenzhen City, Guangdong Province Applicant before: HONGFUZHUN PRECISION INDUSTRY (SHENZHEN) Co.,Ltd. |
|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 518109 Foxconn H5 plant 101, No. 2, Donghuan 2nd Road, Fukang community, Longhua street, Longhua District, Shenzhen, Guangdong Province; plant 5, building C09, 4th floor, building C07, 2nd floor, building C08, 3rd floor, 4th floor, building C04, zone B, Foxconn Hongguan science and Technology Park, Fucheng Dasan community, Guanlan street, Guangdong Province Patentee after: Fulian Yuzhan Technology (Shenzhen) Co.,Ltd. Address before: 518109 Guangzhou Guanlan Foxconn Hongguan Science Park B workshop 5 C09 buildings 4 floors, C07 buildings 2 floors, C08 buildings 3 floors 4 floors, C04 buildings 1 floors Patentee before: SHENZHENSHI YUZHAN PRECISION TECHNOLOGY Co.,Ltd. |