CN109279769A - A kind of OLED double glazing cutting splitting processing method and production line - Google Patents
A kind of OLED double glazing cutting splitting processing method and production line Download PDFInfo
- Publication number
- CN109279769A CN109279769A CN201811224652.8A CN201811224652A CN109279769A CN 109279769 A CN109279769 A CN 109279769A CN 201811224652 A CN201811224652 A CN 201811224652A CN 109279769 A CN109279769 A CN 109279769A
- Authority
- CN
- China
- Prior art keywords
- cutting
- machine
- double glazing
- oled
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Laser Beam Processing (AREA)
Abstract
The present invention relates to OLED glass manufacturing areas, and in particular to a kind of OLED double glazing cutting splitting processing method and production line.The OLED double glazing includes the substrate and cover board mutually bonded.By combining OLED double glazing cutting splitting processing method and production line, realizes automated production, improve production efficiency.In cutting processing, first using the critical path of laser cutting real estate and cover board face, processing cover board face is then gone instead of laser cutting using break bar cutting.Laser cutting in this way is combined with break bar cutting, the problem of damage can be caused to the ITO route on real estate when not only avoiding laser cutting cover board face, the problem of also solving deformation of products after cutting, reduces chipping size after sliver, greatly improves the quality of product.
Description
Technical field
The present invention relates to OLED glass manufacturing areas, and in particular to a kind of OLED double glazing cutting splitting processing method and
Production line.
Background technique
The OLED product of client is pasted together by way of brush coating by substrate, cover board this layer glass, substrate
On be printed with ITO route and viewing area circuit, cover board are covered on substrate.For consumer product and automation demanding, now need
It is a kind of to be able to achieve high-quality product, processing method of highly-efficient processing and production line.
Summary of the invention
The technical problem to be solved in the present invention is that in view of the above drawbacks of the prior art, providing a kind of OLED bilayer glass
Glass cutting splitting processing method and production line, it is intended to which high-quality, efficient processing is carried out to OLED double glazing.
The technical solution adopted by the present invention to solve the technical problems is: providing a kind of OLED double glazing cutting splitting and adds
Work method and production line, the OLED double glazing include the substrate and cover board mutually bonded, comprising the following steps:
S1, automatic charging: the face-up OLED double glazing of substrate is added into automatic charging machine and is transported to next work
Position；
S2, ink printing: ink is passed through into the empty avoiding position near press printing to substrate viewing area；
S3, UV solidification: ink is dried using UV curing；
S4, laser cutting substrate: laser is carried out to substrate according to preset first cutting path using laser cutting device
Cutting；
S5, overturning OLED double glazing: the turnover mechanism in laser cutting device overturns OLED double glazing, makes cover board
Up；
S6, laser cutting cover board: laser is carried out to cover board according to preset second cutting path using laser cutting device
Cutting；
S7, break bar cut cover board: carrying out break bar to cover board according to preset third cutting path using break bar cutting machine and cut
It cuts；
S8, automatic sliver: OLED double glazing is overturn and automatic breaking machine is used to carry out sliver.
Still more preferably scheme of the invention is: the OLED double glazing cutting splitting processing method further includes being convenient for
The coding process that workpiece is tracked；The coding process is located between UV curing process and laser cutting substrate process.
Still more preferably scheme of the invention is: the OLED double glazing cutting splitting processing method further includes being used for
Distinguish the sorting process of qualified workpiece and unqualified workpiece；After the sorting process is located at automatic sliver process.
Still more preferably scheme of the invention is: including be arranged successively and workpiece sequentially through automatic charging machine, print
Brush machine, UV curing, laser cutting device, break bar cutting machine and automatic breaking machine；It is double-deck that the automatic charging machine completes OLED
The supplement and conveying of glass；Ink is printed onto the empty avoiding position near substrate viewing area by the printing machine；The UV curing
For ink to be dried；The laser cutting device completes the laser cutting to substrate and cover board；The break bar cutting machine is completed
Break bar cutting to cover board；The automatic breaking machine is used to carry out sliver to the OLED double glazing after cutting.
Still more preferably scheme of the invention is: the automatic charging machine is double-station interaction feeder.
Still more preferably scheme of the invention is: the OLED double glazing cutting splitting production line further includes for excellent
The corner machine of metaplasia producing line area occupied；The corner machine is between printing machine and UV curing.
Still more preferably scheme of the invention is: the OLED double glazing cutting splitting production line further include for
The ink jet numbering machine of bar code is sprayed on substrate；The ink jet numbering machine is between UV curing and laser cutting device.
Still more preferably scheme of the invention is: the laser cutting device includes swashing for the first of cutting substrate face
Light cutting machine and second laser cutting machine for cutting cover board face；The first laser cutting machine and second laser cutting machine
It is set side by side and is located between ink jet numbering machine and break bar cutting machine.
Still more preferably scheme of the invention is: the first laser cutting machine and second laser cutting machine include machine
Frame, marble platform, lifting focusing component, two-dimentional straight line component, outer optical path component, laser, cutting head, CCD positioning component
With cutting absorbent module；The marble platform is mounted on the rack；The lifting focusing component, two-dimentional straight line component and outer light
Road component is installed in marble platform；The laser is mounted on the rack；The cutting absorbent module is mounted on two dimension
On straight line component；The CCD component and cutting head are commonly mounted on lifting focusing component.
Still more preferably scheme of the invention is: the OLED double glazing cutting splitting production line further includes for inciting somebody to action
The pigeonholes that OLED double glazing after sliver is sorted；After the pigeonholes is located at automatic breaking machine.
The beneficial effects of the present invention are by mutually tying OLED double glazing cutting splitting processing method with production line
It closes, realizes automated production, improve production efficiency.In cutting processing, first using laser cutting real estate and cover board face
Then critical path goes to processing cover board face instead of laser cutting using break bar cutting.Laser cutting in this way is cut with break bar
The problem of cutting and combine, causing damage to the ITO route on real estate when not only avoiding laser cutting cover board face, also solves
After cutting the problem of deformation of products, chipping size after sliver is reduced, the quality of product is greatly improved.
Detailed description of the invention
Present invention will be further explained below with reference to the attached drawings and examples, in attached drawing:
Fig. 1 is the OLED double glazing cutting splitting processing method flow chart of the embodiment of the present invention；
Fig. 2 is the OLED double glazing cutting splitting production line schematic diagram of the embodiment of the present invention；
Fig. 3 is schematic diagram of the OLED double glazing of the embodiment of the present invention after printing and UV solidifies；
Fig. 4 is status diagram of the OLED double glazing of the embodiment of the present invention after coding；
Fig. 5 is status diagram of the OLED double glazing of the embodiment of the present invention after being cut by laser substrate；
Fig. 6 is status diagram of the OLED double glazing of the embodiment of the present invention after being cut by laser cover board；
Fig. 7 is status diagram of the OLED double glazing of the embodiment of the present invention after break bar cuts cover board；
Fig. 8 is the cutting path sectional view of the OLED double glazing of the embodiment of the present invention；
Fig. 9 is the main view of the middle flake products after the sliver sorting of the embodiment of the present invention；
Figure 10 is the left view of the middle flake products after the sliver sorting of the embodiment of the present invention.
Specific embodiment
Now in conjunction with attached drawing, elaborate to presently preferred embodiments of the present invention.
As shown in Figure 1, the OLED double glazing cutting splitting processing method of the present embodiment, specifically includes the following steps:
S1, automatic charging: the face-up OLED double glazing of substrate is added into automatic charging machine 1 and is transported to next work
Position；
S2, ink printing: ink is printed onto the empty avoiding position near substrate viewing area by printing machine 2；
S3, UV solidification: ink is dried using UV curing 4；
S4, coding: tracking code 61 is sprayed in real estate；
S5, laser cutting substrate: using laser cutting device 7 according to it is preset first cutting 711 diameter of road to substrate 131 into
Row laser cutting；
S6, overturning OLED double glazing: the turnover mechanism in laser cutting device 7 overturns OLED double glazing, makes to cover
Plate face is upward；
S7, laser cutting cover board: using laser cutting device 7 according to preset second cutting path 721 to cover board 132 into
Row laser cutting；
S8, break bar cut cover board: being carried out according to preset third cutting path 91 to cover board 132 using break bar cutting machine 9
Break bar cutting；
S9, automatic sliver: OLED double glazing is overturn and automatic breaking machine 11 is used to carry out sliver；
S10, sorting: qualified product and rejected product are sorted.
As shown in Fig. 2, the OLED double glazing cutting splitting production line in the present embodiment, specifically includes and be arranged successively and work
Part sequentially through automatic charging machine 1, printing machine 2, corner machine 3, UV curing 4, the ink jet numbering machine equipped with coding feeding manipulator 5
6, laser cutting device 7, break bar cutting machine 9, tipper 10, automatic breaking machine 11 and pigeonholes 12.
Specifically, the workpiece OLED double glazing in the present embodiment includes the substrate 131 and cover board 132 mutually bonded.It is whole
Each equipment and concrete operating principle are described as follows in a production line:
Full material material casket is manually placed on upper material position using material casket or so double-station interaction material-uploading style by automatic charging machine 1
Elevation and subsidence mechanical hand support plate on, elevation and subsidence mechanical subordinate drop contacts feeding transport roller with workpiece (substrate is face-up), logical
It crosses roller rotation the workpiece contacted with roller is transported on roller line, workpiece is transported to by the upper of printing machine 2 by roller line
Material position.Its in the middle of the roller line is mounted on the alternating feeding that double-station material casket in left and right is realized in transverse moving left and right mechanism.
Printing machine 2 is docked by belt assembly line with the conveying roll line of the automatic charging machine 1 of previous station.Workpiece flows into
After the upper material position of printing machine 2, it is carried out by first positioning mechanism just to position, it is ensured that the location of workpiece and setting are consistent, on workpiece
MRAK point the first CCD positioning component within sweep of the eye.OLED double glazing is carried out by the first CCD positioning component again
Vision positioning, by the vacuum suction jig in conveying servo mould group by Workpiece transfer to printing station.Printing by steel mesh, brush knife,
Servo lifting mould group and brush knife dynamical system complete ink printing jointly.First pass through servo lifting mould group driving steel mesh decline contact
Real estate, then the printing of brush knife dynamical system driving brush knife, ink is printed on substrate 131 by the opening on steel mesh.Print
Pattern 21 after brush is shown in Fig. 3.The position of real estate printing ink is in the reverse side face position of substrate viewing area, can play light-blocking
Effect, it is ensured that viewing area shows to be more clear.After being completed for printing, brush knife and steel mesh rise, and OLED double glazing passes through conveying
Servo mould group is transplanted on the blanking bit stream waterline of printing machine 2, is docked with 0 ° of direction assembly line of the corner machine 3 of next station.
0 ° of direction assembly line of corner machine 3 is docked with the blanking bit stream waterline of previous station print machine 2, and workpiece flows into corner
After machine 3,90 ° of direction assembly lines, which rise, jacks up workpiece, disengages it from 0 ° of direction assembly line, and 90 ° of direction assembly lines drive workpiece stream
Enter UV curing 4.Certainly, which can be matched according to specific plant layout.
UV curing 4 is docked using mesh belt assembly line with the corner machine 3 of previous station, after workpiece flows into, controls mesh belt stream
Water linear velocity, it is ensured that workpiece enter outflow the curing time it is enough, guarantee ink drying.UV solidification uses electrically heated mode
The ink printed on real estate is toasted.
Coding feeding manipulator 5 is docked with the assembly line blanking section of UV curing 4, and coding feeding manipulator 5 is by cross
Absorption mould group is moved, electric cylinders and vacuum adsorption mechanism composition are gone up and down.Go up and down electric cylinders driving vacuum adsorption mechanism decline, absorption UV solidification
Then the workpiece of material position under the assembly line of machine 4 is transplanted on coding assembly line feeding station by the first traversing servo mould group.Coding stream
Waterline is divided into 3 stations such as feeding station, coding station and discharge station.Coding station inspection sensor show the station without
When material, the product of feeding station is transported to coding station, coding station inspection sensor sensing to signal, resistance by assembly line rotation
It keeps off cylinder and stretches out and stop workpiece, jacking pushing tow positioning cylinder group movement cooperates the first positioning for completing workpiece with stop cylinder.Second
CCD positioning component and ink jet numbering machine 6 are commonly mounted in two-dimentional servo mould group, and two-dimentional servo mould group drives the 2nd CCD positioning component
It is mobile to complete workpiece vision positioning, it is then return to coding starting point and moves the coding completed in real estate by predefined paths.Coding
It finishes, stop cylinder retraction, assembly line, which is continued to rotate, flows to discharge station for workpiece, and discharge station sensor detects workpiece
When, positioning cylinder movement carries out just positioning to product, and post laser is facilitated to cut.Coding assembly line discharge station and laser cutting
Machine 7 realizes product transfer by reclaimer robot.Work status after coding is as shown in figure 4, the tracking code 61 is used in enterprise
Real-time production data library is established in portion's production management, convenient to be tracked to product.
Laser cutting device 7 includes for the first laser cutting machine 71 in cutting substrate face and for cutting cover board face
Second laser cutting machine 72；The first laser cutting machine 71 is set side by side with second laser cutting machine 72 and is located at ink jet numbering machine 6
Between break bar cutting machine 9.Realize that workpiece turns by the second traversing servo mould group and turnover mechanism between two laser cutting machines
Fortune.The first laser cutting machine 71 and second laser cutting machine 72 include laser, outer optical path, lifting focusing component, cut
It cuts head, the 3rd CCD positioning component, take out dirt system, marble platform, two-dimentional linear platform, cutting adsorption jig, interior electrical control
System.Laser is infrared picosecond laser, is mounted on rack.Cutting adsorption jig is fixed on two-dimentional linear motor, third
CCD positioning component and cutting head are commonly mounted on lifting focusing component.Go up and down focusing component, outer optical path, two-dimentional linear motor
It is commonly mounted in marble platform, marble platform is then supported by rack.Workpiece is by reclaimer robot from coding assembly line
Feeding is put into the cutting adsorption jig of first laser cutting machine 71, and two-dimentional linear platform is moved under the 3rd CCD positioning component
Side carries out vision positioning to workpiece by the 3rd CCD positioning component, then according to the first cutting path 711 being preset in equipment,
Substrate 131 is cut by laser, wherein the first cutting path 711 is with reference to the solid line in Fig. 5.Two-dimentional straight line after cutting
Platform is moved to lower material position.The traversing servo mould of second be mounted between first laser cutting machine 71 and second laser cutting machine 72
It is overturn in group feeding to the turnover mechanism being mounted on second laser cutting machine 72, so that cover board is face-up.It will after overturning
Workpiece is put into the adsorption jig of second laser cutting machine 72, then is determined by the 3rd CCD positioning component of second laser cutting machine 72
Position, then be cut by laser, move again to lower material position, wherein the second cutting path 721 is with reference to the dotted line in Fig. 6.Pass through laser
Cutting meets the production and application demand of product to reduce chipping quantity of the crucial cutting path after sliver.
Product transfer is realized by break bar feeding manipulator 8 between second laser cutting machine 72 and break bar cutting machine 9.Break bar
After the Cutting platform of cutting machine 9 receives the workpiece that transfer comes, it is just fixed that the cylinder being mounted on Cutting platform carries out product
Position, then Y-axis servo mould group driving Cutting platform is moved at the 4th CCD positioning component is regarded by the 4th CCD positioning component
Feel positioning, positioning rear-guard moving knife head system cuts cover board 172 according to third cutting path 91.Due to being printed on substrate
IT0 route, to avoid laser cutting from causing IT0 line impairment, all cutting paths being overlapped with ITO route are all made of break bar and cut
It cuts.Cutting, which finishes, is moved to lower material position.Product of the third cutting path 91 with reference to the chain-dotted line in Fig. 7, after break bar cutting
State is as shown in Figure 8.
More preferably, realize that tipper 10 can pass through elder generation by tipper 10 between automatic breaking machine 11 and break bar cutting machine 9
Translation overturns again or first overturns the mode translated again, and workpiece is transported to automatic breaking machine 11 from the lower material position of break bar cutting machine 9
Upper material position.Traversing movement can be realized that rotary movement can be by rotary cylinder or the high-power tune with speed reducer by servo manipulator
Speed motor is realized.Certainly, artificial overturning also may be used.
After the sliver platform of automatic breaking machine 11 receives workpiece supplied materials, Y-axis servo mould group drives sliver platform mobile
Positioned at the 5th CCD positioning component, after positioning Z axis servo mould group driving chopper to laser, break bar cutting path into
Row sliver.Chopper is by the soft materials processing and fabricating such as polyurethane.Sliver finishes, and Y-axis servo mould group driving sliver platform is moved to down
Then material position takes pigeonholes 12 away by the workpiece after sliver is manually passed through the packing paper being placed on sliver platform in advance together
On, then by manually being sorted to product and waste material, qualified product and rejected product, middle flake products state such as Fig. 9 after sorting,
Shown in Figure 10.
By combining OLED double glazing cutting splitting processing method and production line, realizes automated production, improve
Production efficiency.Before cutting, by adsorbing each OLED double glazing, solves the problems, such as supplied materials buckling deformation.In cutting processing
When, first using the critical path of laser cutting real estate and cover board face, then go to process instead of laser cutting using break bar cutting
Cover board face.Laser cutting in this way is combined with break bar cutting, can be to substrate when not only avoiding laser cutting cover board face
The problem of ITO route on face causes the problem of damage, also solves deformation of products after cutting, reduces chipping ruler after sliver
It is very little, greatly improve the quality of product.
It should be understood that the above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations, to ability
It for field technique personnel, can modify to technical solution illustrated in the above embodiments, or special to part of technology
Sign is equivalently replaced；And all such modifications and replacement, it should all belong to the protection domain of appended claims of the present invention.
Claims (10)
1. a kind of OLED double glazing cutting splitting processing method, the OLED double glazing include the substrate mutually bonded
(131) and cover board (132), which comprises the following steps:
S1, automatic charging: the face-up OLED double glazing of substrate is added into automatic charging machine (1) and is transported to next work
Position；
S2, ink printing: ink is printed onto the empty avoiding position near substrate viewing area by printing machine (2)；
S3, UV solidification: ink is dried using UV curing (4)；
S4, laser cutting substrate: use laser cutting device (7) according to preset first cutting path (711) to substrate (131)
It is cut by laser；
S5, overturning OLED double glazing: the turnover mechanism in laser cutting device (7) overturns OLED double glazing, makes cover board
Up；
S6, laser cutting cover board: use laser cutting device (7) according to preset second cutting path (721) to cover board (132)
It is cut by laser；
S7, break bar cut cover board: using break bar cutting machine (9) according to preset third cutting path (91) to cover board (132) into
The cutting of row break bar；
S8, automatic sliver: OLED double glazing is overturn and automatic breaking machine (11) is used to carry out sliver.
2. OLED double glazing cutting splitting processing method according to claim 1, which is characterized in that the OLED is double-deck
Glass-cutting sliver processing method further includes the coding process convenient for being tracked to workpiece；The coding process is located at UV solidification
Between process and laser cutting substrate process.
3. according to OLED double glazing cutting splitting processing method described in claim requirement 2, which is characterized in that the OLED
Double glazing cutting splitting processing method further includes the sorting process for distinguishing qualified workpiece Yu unqualified workpiece；The sorting
After process is located at automatic sliver process.
4. a kind of OLED double glazing cutting splitting production line, which is characterized in that including be arranged successively and workpiece sequentially through
Automatic charging machine (1), printing machine (2), UV curing (4), laser cutting device (7), break bar cutting machine (9) and automatic breaking machine
(11)；The automatic charging machine (1) completes the supplement and conveying of OLED double glazing；Ink is printed by the printing machine (2)
Empty avoiding position near substrate viewing area；The UV curing (4) is for drying ink；The laser cutting device (7) is complete
The laser cutting of pairs of substrate (131) and cover board (132)；The break bar cutting machine (9) completes to cut the break bar of cover board (132)
It cuts；The automatic breaking machine (11) is used to carry out sliver to the OLED double glazing after cutting.
5. OLED double glazing cutting splitting production line according to claim 4, which is characterized in that the automatic charging machine
It (1) is double-station interaction feeder.
6. OLED double glazing cutting splitting production line according to claim 5, which is characterized in that the OLED bilayer glass
Glass cutting splitting production line further includes the corner machine (3) for optimizing production line area occupied；The corner machine (3) is located at printing
Between machine (2) and UV curing (4).
7. according to the described in any item OLED double glazing cutting splitting production lines of claim 4-6, which is characterized in that described
OLED double glazing cutting splitting production line further includes the ink jet numbering machine (6) for spraying bar code on substrate (131)；The spray
Ink recorder (6) is located between UV curing (4) and laser cutting device (7).
8. OLED double glazing cutting splitting production line according to claim 7, which is characterized in that the laser cutting is set
Standby (7) include the second laser cutting machine for the first laser cutting machine (71) in cutting substrate face and for cutting cover board face
(72)；The first laser cutting machine (71) and second laser cutting machine (72) are set side by side and are located at ink jet numbering machine (6) and break bar
Between cutting machine (9).
9. OLED double glazing cutting splitting production line according to claim 8, which is characterized in that the first laser is cut
Cutting mill (71) and second laser cutting machine (72) include rack, marble platform, lifting focusing component, two-dimentional straight line component,
Outer optical path component, laser, cutting head, CCD positioning component and cutting absorbent module；The marble platform is mounted on rack
On；The lifting focusing component, two-dimentional straight line component and outer optical path component are installed in marble platform；The laser peace
Dress is on the rack；The cutting absorbent module is mounted on two-dimentional straight line component；The CCD component and cutting head are commonly mounted on
It goes up and down on focusing component.
10. OLED double glazing cutting splitting production line according to claim 9, which is characterized in that the OLED is double-deck
Glass-cutting sliver production line further includes the pigeonholes (12) for sorting the OLED double glazing after sliver；Described point
It picks after platform (12) be located at automatic breaking machine (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811224652.8A CN109279769A (en) | 2018-10-19 | 2018-10-19 | A kind of OLED double glazing cutting splitting processing method and production line |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811224652.8A CN109279769A (en) | 2018-10-19 | 2018-10-19 | A kind of OLED double glazing cutting splitting processing method and production line |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109279769A true CN109279769A (en) | 2019-01-29 |
Family
ID=65177634
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811224652.8A Pending CN109279769A (en) | 2018-10-19 | 2018-10-19 | A kind of OLED double glazing cutting splitting processing method and production line |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109279769A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110647962A (en) * | 2019-10-29 | 2020-01-03 | 曲睿卿 | Glass paperless marking tracing system and method |
| CN111470764A (en) * | 2020-04-11 | 2020-07-31 | 东莞市裕莱机械有限公司 | Plate glass cutting and spraying integrated machine |
| CN111499172A (en) * | 2020-04-15 | 2020-08-07 | 大族激光科技产业集团股份有限公司 | Method and device for processing double-layer glass |
| CN111844478A (en) * | 2020-06-29 | 2020-10-30 | 深圳市鸿昇自动化设备有限公司 | Mobile phone screen cutting and processing equipment and mobile phone screen cutting and processing method |
| CN112299696A (en) * | 2020-09-11 | 2021-02-02 | 深圳市吉祥云科技有限公司 | Cutting method and cutting equipment for wave slicing |
| WO2021056191A1 (en) * | 2019-09-24 | 2021-04-01 | 大族激光科技产业集团股份有限公司 | Laser processing system |
| CN113800758A (en) * | 2020-06-12 | 2021-12-17 | 大族激光科技产业集团股份有限公司 | Laser cutting method and laser cutting device for glass module |
| CN115304288A (en) * | 2022-10-08 | 2022-11-08 | 武汉智虹光电科技有限公司 | Ultra-thin flexible glass sheet forming and packaging production device and method |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2199007A4 (en) * | 2007-10-16 | 2011-02-09 | Mitsuboshi Diamond Ind Co Ltd | Method of machining u-shaped groove of substrate of fragile material, removal method, boring method and chamfering method using the same method |
| CN102162946A (en) * | 2011-03-30 | 2011-08-24 | 贺术春 | Method for manufacturing liquid crystal cell of outer stamp-pad ink |
| CN201971737U (en) * | 2011-01-13 | 2011-09-14 | 苏州德龙激光有限公司 | Device for cutting glass |
| CN102305978A (en) * | 2011-08-31 | 2012-01-04 | 深圳市长江力伟股份有限公司 | Production system of silicon substrate liquid crystal display screen and production method thereof |
| CN104591531A (en) * | 2015-01-20 | 2015-05-06 | 信利半导体有限公司 | Cutting process |
| CN107199410A (en) * | 2017-07-25 | 2017-09-26 | 东莞市盛雄激光设备有限公司 | A kind of laser cutting device and its cutting method |
-
2018
- 2018-10-19 CN CN201811224652.8A patent/CN109279769A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2199007A4 (en) * | 2007-10-16 | 2011-02-09 | Mitsuboshi Diamond Ind Co Ltd | Method of machining u-shaped groove of substrate of fragile material, removal method, boring method and chamfering method using the same method |
| CN201971737U (en) * | 2011-01-13 | 2011-09-14 | 苏州德龙激光有限公司 | Device for cutting glass |
| CN102162946A (en) * | 2011-03-30 | 2011-08-24 | 贺术春 | Method for manufacturing liquid crystal cell of outer stamp-pad ink |
| CN102305978A (en) * | 2011-08-31 | 2012-01-04 | 深圳市长江力伟股份有限公司 | Production system of silicon substrate liquid crystal display screen and production method thereof |
| CN104591531A (en) * | 2015-01-20 | 2015-05-06 | 信利半导体有限公司 | Cutting process |
| CN107199410A (en) * | 2017-07-25 | 2017-09-26 | 东莞市盛雄激光设备有限公司 | A kind of laser cutting device and its cutting method |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021056191A1 (en) * | 2019-09-24 | 2021-04-01 | 大族激光科技产业集团股份有限公司 | Laser processing system |
| CN110647962A (en) * | 2019-10-29 | 2020-01-03 | 曲睿卿 | Glass paperless marking tracing system and method |
| CN111470764A (en) * | 2020-04-11 | 2020-07-31 | 东莞市裕莱机械有限公司 | Plate glass cutting and spraying integrated machine |
| CN111499172A (en) * | 2020-04-15 | 2020-08-07 | 大族激光科技产业集团股份有限公司 | Method and device for processing double-layer glass |
| CN111499172B (en) * | 2020-04-15 | 2022-07-22 | 大族激光科技产业集团股份有限公司 | Method and device for processing double-layer glass |
| CN113800758A (en) * | 2020-06-12 | 2021-12-17 | 大族激光科技产业集团股份有限公司 | Laser cutting method and laser cutting device for glass module |
| CN113800758B (en) * | 2020-06-12 | 2023-06-13 | 深圳市大族半导体装备科技有限公司 | Laser cutting method and laser cutting device for glass module |
| CN111844478A (en) * | 2020-06-29 | 2020-10-30 | 深圳市鸿昇自动化设备有限公司 | Mobile phone screen cutting and processing equipment and mobile phone screen cutting and processing method |
| CN111844478B (en) * | 2020-06-29 | 2022-03-18 | 深圳市鸿昇自动化设备有限公司 | Mobile phone screen cutting and processing equipment and mobile phone screen cutting and processing method |
| CN112299696A (en) * | 2020-09-11 | 2021-02-02 | 深圳市吉祥云科技有限公司 | Cutting method and cutting equipment for wave slicing |
| CN115304288A (en) * | 2022-10-08 | 2022-11-08 | 武汉智虹光电科技有限公司 | Ultra-thin flexible glass sheet forming and packaging production device and method |
| CN115304288B (en) * | 2022-10-08 | 2022-12-27 | 武汉智虹光电科技有限公司 | Ultra-thin flexible glass sheet forming and packaging production device and method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109279769A (en) | A kind of OLED double glazing cutting splitting processing method and production line | |
| CN106739542A (en) | A kind of full-automatic rapidly and efficiently surface of revolution Digital ink-jet printer | |
| CN103419405B (en) | A kind of paper box shaping device | |
| CN105538779B (en) | Corrugated case linkage-production method and production line | |
| CN204020240U (en) | Continuous coding production line | |
| CN107187201A (en) | A kind of complex-curved digital rotary printing detection all-in-one of full-automatic six colors sixteen work station | |
| CN110524411B (en) | Big board grinds cleaning system | |
| CN110421982A (en) | Printing-packing integral machine | |
| CN205891458U (en) | Dyestripping equipment | |
| CN110757316A (en) | Automatic change and grind cleaning line | |
| CN108128502A (en) | Carton automatic code spraying system | |
| CN206718742U (en) | A kind of full-automatic rapidly and efficiently surface of revolution Digital ink-jet printer | |
| CN215852314U (en) | Film tearing machine | |
| CN100389891C (en) | Panel cleaning apparatus and producing method for panel | |
| CN107352817B (en) | Automatic laminating device and method for automobile laminated glass | |
| CN210339244U (en) | Brake block spouts a yard conveying mechanism | |
| CN117103866A (en) | Aluminum foil coding device and method | |
| KR100575559B1 (en) | Coverlay attach system | |
| CN215799167U (en) | Product cutting production line | |
| CN212604047U (en) | Lithium battery surface spray printing equipment | |
| CN111025693B (en) | COF integrated circuit packaging cleaning line body | |
| CN207902867U (en) | Carton automatic code spraying system | |
| CN213623865U (en) | Glass breaking and laminating equipment | |
| CA3069663C (en) | Assembly method and plant of a photovoltaic panel of the back-contact type, with printing on the cells combined with loading and pre-fixing | |
| CN211103387U (en) | Big board grinds cleaning system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190129 |
|
| RJ01 | Rejection of invention patent application after publication |