CN112299696A - Cutting method and cutting equipment for wave slicing - Google Patents
Cutting method and cutting equipment for wave slicing Download PDFInfo
- Publication number
- CN112299696A CN112299696A CN202010959063.5A CN202010959063A CN112299696A CN 112299696 A CN112299696 A CN 112299696A CN 202010959063 A CN202010959063 A CN 202010959063A CN 112299696 A CN112299696 A CN 112299696A
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- Prior art keywords
- wave
- vacuum adsorption
- film
- vacuum
- cutting
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Classifications
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
- C03B33/074—Glass products comprising an outer layer or surface coating of non-glass material
Abstract
The invention discloses a cutting method of a wave slice, which comprises the following steps: attaching the PE film on the convex surface of the wave separation sheet by using an automatic film attaching device; attaching the surface of the wavelength division sheet with the PE film to a vacuum adsorption seat; utilizing a vacuum pump to enable the vacuum adsorption seat to generate negative pressure so as to adsorb the warped edge of the wave piece on the vacuum adsorption base; and cutting the wave slice positioned on the vacuum adsorption seat by using a laser device. The invention is beneficial to avoiding damaging the wavelength division plate. In addition, the invention also discloses a cutting device for the wave slice.
Description
Technical Field
The invention relates to the technical field of wavelength division slice cutting, in particular to a cutting method and cutting equipment for wavelength division slices.
Background
As shown in fig. 1, the wave slice is made of quartz glass with a thickness of about 0.2mm, and two surfaces of the glass are respectively coated with metal component films with different thicknesses, so that the two surfaces of the wave slice can receive forces with different magnitudes to cause severe warping (namely, the periphery of the wave slice can turn towards one side of the film), and meanwhile, the film coated on the wave slice has the function of reflecting light, and laser can only be shot into the wave slice from a concave surface for cutting.
When the existing wave division piece is subjected to laser cutting, a professional jig is generally used for fixing the wave division piece, and a pressing and holding component on the jig is used for pressing and holding a warping edge on the wave division piece, so that the wave division piece is in a flattening state. However, this way of fixing the wave segments may result in uneven stressing of the wave segments, thereby damaging the wave segments.
Disclosure of Invention
The invention mainly aims to provide a cutting method of a wave slice, and aims to solve the technical problem that the wave slice is easy to damage in the conventional fixed wave slice mode.
In order to achieve the above object, the present invention provides a method for cutting a wave slice, the method comprising:
attaching the PE film on the convex surface of the wave separation sheet by using an automatic film attaching device;
attaching the surface of the wavelength division sheet with the PE film to a vacuum adsorption seat;
utilizing a vacuum pump to enable the vacuum adsorption seat to generate negative pressure so as to adsorb the warped edge of the wave piece on the vacuum adsorption base;
and cutting the wave slice positioned on the vacuum adsorption seat by using a laser device.
Preferably, after the step of attaching the PE film to the convex surface of the wave piece by using the automatic film attaching device, the method further includes:
and detecting bubbles of the laminated wave fragments by using a visual detection device.
Preferably, the step of attaching the surface of the wavelength division sheet on which the film is attached, which has the PE film, to the vacuum adsorption holder includes:
the method comprises the following steps of placing wave fragments positioned on an automatic film sticking machine on a vacuum adsorption seat by using a manipulator;
the manipulator is used for clamping an annular shape matched with the warping edge of the wave division sheet and can be abutted against the warping edge of the wave division sheet.
Preferably, after the step of generating negative pressure on the vacuum adsorption base by using the vacuum pump to adsorb the warped edge of the wave piece on the vacuum adsorption base, the method further comprises:
acquiring air pressure data on the vacuum adsorption seat;
the vacuum pump adjusts power according to the air pressure data so that the air pressure data on the vacuum adsorption seat maintains a preset air pressure range.
Preferably, the preset air pressure range is 0.4-0.5 MPa.
The invention further provides wave slicing cutting equipment which comprises a workbench, an automatic film sticking device, a vacuum adsorption seat, a vacuum pump, a laser device and a manipulator, wherein the automatic film sticking device, the vacuum adsorption seat, the vacuum pump, the laser device and the manipulator are arranged on the workbench, the vacuum pump is communicated with the vacuum adsorption seat, the laser device is positioned right above the vacuum adsorption seat, and the manipulator can convey the wave slices positioned on the automatic film sticking device to the vacuum adsorption seat.
Preferably, the cutting device further comprises a visual detection device arranged on the workbench, and can detect bubbles of the wave fragments on the automatic film pasting device.
Preferably, the cutting device further comprises a pressing mechanism arranged on the workbench, an annular pressure head matched with the warping edge of the wave separation sheet is arranged on the pressing mechanism, and the annular pressure head can abut against the wave separation sheet on the vacuum adsorption seat.
According to the cutting method of the wave fragments provided by the embodiment of the invention, the PE film is adhered to the convex surface (namely the side surface with the thicker coating film) of the wave fragments, so that the vacuum adsorption seat can conveniently adsorb the wave fragments in a memorable manner, the warped edges of the wave fragments are uniformly stressed to be in a flattening state under the action of vacuum negative pressure, the wave fragments are prevented from being damaged, and the cutting of the wave fragments is facilitated. Meanwhile, the wave division plate is not provided with a shielding area, so that the cutting is more convenient.
Drawings
FIG. 1 is a schematic structural diagram of a wave slice;
FIG. 2 is a schematic flow chart of an embodiment of a method for cutting a wavelength division plate according to the present invention;
FIG. 3 is a schematic structural diagram of an embodiment of a cutting apparatus for wavelength division multiplexing according to the present invention; .
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be illustrative of the present invention and should not be construed as limiting the present invention, and all other embodiments that can be obtained by one skilled in the art based on the embodiments of the present invention without inventive efforts shall fall within the scope of protection of the present invention.
The invention provides a cutting method of a wave slice, as shown in fig. 2, the cutting method comprises the following steps:
and step S10, attaching the PE film on the convex surface of the wave slice by using an automatic film attaching device.
In this step, the automatic film pasting device can select different specifications according to the size of the wave fragments, the PE film can also select different types according to actual conditions, and the PE film can be attached to the wave fragments (i.e., the PE film is removed and then remains on the wave fragments), and the mode of placing the wave fragments and the PE film in the automatic film pasting device can be manual or corresponding mechanical arms. When the wave separation sheet and the PE film are placed by the manipulator, in order to completely coincide the PE film with the wave separation sheet, the position of the wave separation sheet can be firstly identified by the visual inspection device, and then the manipulator can place the PE film according to the identified information.
And step S20, attaching the surface of the wavelength division sheet with the PE film to the vacuum adsorption seat.
In the step, the mode of conveying the wave separation sheet subjected to film pasting from the automatic film pasting device to the vacuum adsorption seat can be manual conveying or mechanical arm conveying. The mode that the wave separating sheet is specifically placed on the vacuum adsorption seat is that the PE film on the wave separating sheet is attached to the vacuum adsorption seat.
In step S30, the vacuum suction base is made to generate negative pressure by the vacuum pump to suck the warped edge of the wave slice onto the vacuum suction base.
In this step, after the PE film on the wave splitter is attached to the vacuum adsorption base, a vacuum pump is used to generate a negative pressure of a predetermined magnitude on the vacuum bottom adsorption base, so that the wave splitter is flattened by the vacuum negative pressure. Of course, the vacuum pump may be started before the wave slice is placed, so that flattening of the wave slice is more facilitated. At this time, the pressure value generated on the vacuum adsorption seat is maintained at 0.4-0.5 Mpa to adsorb the warped side of the wavelength division plate.
And step S40, cutting the wave slice on the vacuum adsorption seat by using a laser device.
In this step, after the wavelength division sheet is flattened, the wavelength division sheet can be cut by using the laser device, and the specification and the type of the laser device can be selected according to actual conditions.
In this embodiment, through pasting the PE membrane on the convex surface (the side that the coating film is thicker) of wave piece to be convenient for vacuum adsorption seat to adsorb wave piece record nature, so that the warpage limit of wave piece evenly atress to the exhibition flat state under the effect of vacuum negative pressure, with this avoid damaging the wave piece, made things convenient for the cutting of wave piece. Meanwhile, the wave division plate is not provided with a shielding area, so that the cutting is more convenient. Of course, the devices can be arranged on the same workbench or can be arranged separately, and the devices can be assembled in sequence to form a production line mode, namely, two adjacent devices are directly provided with conveying lines and then manually transferred through a manipulator.
In a preferred embodiment, after the step of attaching the PE film to the convex surface of the wave slice by using the automatic film attaching device, the method further includes:
and detecting bubbles of the laminated wave fragments by using a visual detection device.
In this step, the mode of detecting the bubbles by the visual detection device may be that a side surface of the adhesive film on the wave division plate is firstly photographed, and then the photographed picture is compared with a standard picture, so as to judge whether the bubbles exist, thereby being beneficial to avoiding uneven stress of the wave division plate when the vacuum absorption seat absorbs the wave division plate.
In a preferred embodiment, the step of attaching the surface of the wavelength division sheet with the PE film to the vacuum chuck includes:
the method comprises the following steps of placing wave fragments positioned on an automatic film sticking machine on a vacuum adsorption seat by using a manipulator;
the manipulator is used for clamping an annular shape matched with the warping edge of the wave division sheet and can be abutted against the warping edge of the wave division sheet.
In this step, snatch the ripples burst through the manipulator and be favorable to improving work efficiency, also be favorable to avoiding damage the ripples burst when artifical transportation ripples burst simultaneously, as for the mode that the manipulator snatched the ripples burst preferred mode that adopts vacuum adsorption to be favorable to avoiding damaging the ripples burst when snatching the ripples burst. At the moment, the reverse side action of the wave separation sheet can be realized through the cooperation of the two mechanical arms, so that the wave separation sheet is conveniently placed on the vacuum adsorption seat through the PE film.
In a preferred embodiment, after the step of generating negative pressure by the vacuum suction base using the vacuum pump to suck the warped edge of the wave slice onto the vacuum suction base, the method further includes:
acquiring air pressure data on the vacuum adsorption seat;
the vacuum pump adjusts power according to the air pressure data so that the air pressure data on the vacuum adsorption seat maintains a preset air pressure range.
In this step, through the atmospheric pressure data on the real-time collection vacuum adsorption seat to the power of conveniently controlling the vacuum pump, with this messenger vacuum adsorption seat maintains and predetermines the atmospheric pressure scope.
The invention further provides a cutting device for wave fragments, as shown in fig. 3, the cutting device comprises a workbench 10, and an automatic film pasting device 20, a vacuum adsorption seat 30, a vacuum pump, a laser device 40 and a manipulator 50 which are arranged on the workbench 10, wherein the vacuum pump is communicated with the vacuum adsorption seat 30, the laser device 40 is positioned right above the vacuum adsorption seat 30, and the manipulator 50 can transport the wave fragments positioned on the automatic film pasting device 20 to the vacuum adsorption seat 30.
In this embodiment, the automatic film pasting device 20 may select different specifications according to the size of the wavelength division sheet, and the PE film may also select different types according to the actual situation, so as to be pasted on the wavelength division sheet (i.e., after the PE film is removed, the PE film may remain on the wavelength division sheet). The feeding mode of the automatic film sticking device 20 can be manual feeding, and can also be feeding by using an external manipulator, when the external manipulator is used for transporting the wave fragments and the PE film, in order to completely coincide the PE film and the wave fragments, the position of the wave fragments can be identified by using a CCD assembly, and then the external manipulator can place the PE film according to the identified information. The automatic film sticking device 20 is transported to the vacuum adsorption seat 30 through the mechanical arm 50 to complete the film sticking of the wavelength division sheet, the mode that the wavelength division sheet is placed on the vacuum adsorption seat 30 is that the PE film on the wavelength division sheet is attached to the vacuum adsorption seat 30, and the number of the mechanical arm 50 is preferably two at the moment, so that the turning of the wavelength division sheet is facilitated. After the PE film on the wave splitter is attached to the vacuum suction holder 30, a vacuum pump is used to generate a negative pressure of a predetermined magnitude on the vacuum bottom suction holder, so that the wave splitter is flattened by the vacuum negative pressure. Of course, the vacuum pump may be started before the wave slice is placed, so that flattening of the wave slice is more facilitated. At this time, the warped edge of the waveguide plate can be flattened by maintaining the pressure value generated on the vacuum suction base 30 at 0.4-0.5 Mpa. After the wavelength division sheet is flattened, the wavelength division sheet can be cut by using the laser device 40, and the specification and the type of the laser device 40 can be selected according to actual conditions. In this embodiment, the PE film is adhered to the convex surface (i.e., the side surface where the coating film is thick) of the wave fragments, so that the vacuum adsorption seat 30 can adsorb the wave fragments in a memorable manner, and the warped edges of the wave fragments are uniformly stressed under the action of vacuum negative pressure to be in a flattened state, so that the wave fragments are damaged, and the cutting of the wave fragments is facilitated. Meanwhile, the wave division plate is not provided with a shielding area, so that the cutting is more convenient.
In a preferred embodiment, as shown in fig. 3, the cutting apparatus further comprises a visual inspection device 60 disposed on the worktable 10, and the visual inspection device 60 is located directly above the automatic film pasting device 20, so as to facilitate bubble detection of the film pasting wavelength division sheet on the automatic film pasting device 20. The mode of detecting the bubbles by the visual detection device 60 may be to photograph one side of the adhesive film on the wave separating plate, and then compare the photographed photograph with a standard picture, thereby determining whether bubbles exist, which is favorable for avoiding uneven stress of the wave separating plate when the vacuum absorption seat 30 absorbs the wave separating plate.
In a preferred embodiment, the cutting device further includes a pressing mechanism disposed on the worktable, and the pressing mechanism has an annular pressing head adapted to the warped edge of the wave-separating sheet, and the annular pressing head can abut against the wave-separating sheet on the vacuum suction seat 30.
In this embodiment, annular pressure head and wave fragment's warpage limit looks adaptation can, and the side of preferred annular pressure head with warpage limit butt is provided with the flexible layer simultaneously, specifically can be the thickness layer that constitutes by silica gel to be favorable to avoiding annular pressure head to damage the wave fragment, as for the mode of drive annular pressure head can be the form of manipulator.
The above is only a part or preferred embodiment of the present invention, and neither the text nor the drawings should limit the scope of the present invention, and all equivalent structural changes made by the present specification and the contents of the drawings or the related technical fields directly/indirectly using the present specification and the drawings are included in the scope of the present invention.
Claims (8)
1. A method of cutting a wave slice, comprising:
attaching the PE film on the convex surface of the wave separation sheet by using an automatic film attaching device;
attaching the surface of the wavelength division sheet with the PE film to a vacuum adsorption seat;
utilizing a vacuum pump to enable the vacuum adsorption seat to generate negative pressure so as to adsorb the warped edge of the wave piece on the vacuum adsorption base;
and cutting the wave slice positioned on the vacuum adsorption seat by using a laser device.
2. The cutting method according to claim 1, further comprising, after the step of attaching the PE film on the convex surface of the wave-slicing sheet by using an automatic film attaching device:
and detecting bubbles of the laminated wave fragments by using a visual detection device.
3. The cutting method according to claim 1, wherein the step of attaching the PE film to the vacuum suction base on the surface of the wavelength division sheet on which the film is attached comprises:
the method comprises the following steps of placing wave fragments positioned on an automatic film sticking machine on a vacuum adsorption seat by using a manipulator;
the manipulator is used for clamping an annular shape matched with the warping edge of the wave division sheet and can be abutted against the warping edge of the wave division sheet.
4. The cutting method according to claim 1, further comprising, after the step of generating a negative pressure on the vacuum suction base by using a vacuum pump to suck the warped edge of the wave plate onto the vacuum suction base:
acquiring air pressure data on the vacuum adsorption seat;
the vacuum pump adjusts power according to the air pressure data so that the air pressure data on the vacuum adsorption seat maintains a preset air pressure range.
5. The cutting method according to claim 4, wherein the predetermined pressure is in a range of 0.4 to 0.5 MPa.
6. The utility model provides a cutting equipment of ripples burst, its characterized in that is in including workstation and setting automatic pad pasting device, vacuum adsorption seat, vacuum pump, laser device and manipulator on the workstation, the vacuum pump with vacuum adsorption seat intercommunication, laser device is located directly over the vacuum adsorption seat, the manipulator can be with being located ripples burst on the automatic pad pasting device transports extremely on the vacuum adsorption seat.
7. The cutting apparatus according to claim 6, further comprising a visual inspection device provided on the table, and capable of performing bubble inspection on the wave fragments located on the automatic film sticking device.
8. The cutting device according to claim 6, further comprising a pressing mechanism arranged on the workbench, wherein the pressing mechanism is provided with an annular pressure head matched with the warped edge of the wave separation plate, and the annular pressure head can abut against the wave separation plate on the vacuum suction seat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010959063.5A CN112299696A (en) | 2020-09-11 | 2020-09-11 | Cutting method and cutting equipment for wave slicing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010959063.5A CN112299696A (en) | 2020-09-11 | 2020-09-11 | Cutting method and cutting equipment for wave slicing |
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| Publication Number | Publication Date |
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| CN112299696A true CN112299696A (en) | 2021-02-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010959063.5A Pending CN112299696A (en) | 2020-09-11 | 2020-09-11 | Cutting method and cutting equipment for wave slicing |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204747781U (en) * | 2015-05-14 | 2015-11-11 | 深圳光韵达激光应用技术有限公司 | Adsorb tool and laser cutting equipment |
| CN105271790A (en) * | 2015-11-18 | 2016-01-27 | 湖南普照爱伯乐平板显示器件有限公司 | Manufacturing method for flexible glass |
| CN108188590A (en) * | 2017-12-28 | 2018-06-22 | 武汉华星光电半导体显示技术有限公司 | The cutting method of flexible media |
| CN109279769A (en) * | 2018-10-19 | 2019-01-29 | 大族激光科技产业集团股份有限公司 | A kind of OLED double glazing cutting splitting processing method and production line |
| CN209759307U (en) * | 2018-12-27 | 2019-12-10 | 大族激光科技产业集团股份有限公司 | Automatic positioning jig assembly for sheet glass |
-
2020
- 2020-09-11 CN CN202010959063.5A patent/CN112299696A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204747781U (en) * | 2015-05-14 | 2015-11-11 | 深圳光韵达激光应用技术有限公司 | Adsorb tool and laser cutting equipment |
| CN105271790A (en) * | 2015-11-18 | 2016-01-27 | 湖南普照爱伯乐平板显示器件有限公司 | Manufacturing method for flexible glass |
| CN108188590A (en) * | 2017-12-28 | 2018-06-22 | 武汉华星光电半导体显示技术有限公司 | The cutting method of flexible media |
| CN109279769A (en) * | 2018-10-19 | 2019-01-29 | 大族激光科技产业集团股份有限公司 | A kind of OLED double glazing cutting splitting processing method and production line |
| CN209759307U (en) * | 2018-12-27 | 2019-12-10 | 大族激光科技产业集团股份有限公司 | Automatic positioning jig assembly for sheet glass |
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Application publication date: 20210202 |
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