CN107199410B - A kind of laser cutting device and its cutting method - Google Patents
A kind of laser cutting device and its cutting method Download PDFInfo
- Publication number
- CN107199410B CN107199410B CN201710613754.8A CN201710613754A CN107199410B CN 107199410 B CN107199410 B CN 107199410B CN 201710613754 A CN201710613754 A CN 201710613754A CN 107199410 B CN107199410 B CN 107199410B
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- laser
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- component
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
- C03B33/076—Laminated glass comprising interlayers
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/08—Severing cooled glass by fusing, i.e. by melting through the glass
- C03B33/082—Severing cooled glass by fusing, i.e. by melting through the glass using a focussed radiation beam, e.g. laser
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/54—Glass
Abstract
The present invention provides a kind of laser cutting device and its cutting methods, including loading assemblies, the first duplex manipulator, break bar cutting assembly, front laser cutting component, turn-over component, reverse side laser cutting component, the second duplex manipulator, laser sliver component and sorter assemblies.Since front laser cutting component and reverse side laser cutting component are cut by laser the sample using bessel beam, and the bessel beam after focusing is the longer focus on light beam of depth of focus, therefore, compared with Gaussian beam, sample to be cut that can be thicker to thickness is effectively cut, to expand the application range of laser cutting device.Also, cutting twice is carried out to sample respectively using laser cutting component and laser sliver component in the present invention and is separable into product and waste material, cutting efficiency is higher.In addition, the laser cutting device in the present invention have many advantages, such as Cutting Road it is narrow, cutting after product surface chipping it is small, taper is small, isostatic pressing strength is high and cleavable special-shaped product.
Description
Technical field
The present invention relates to laser cutting technique fields, more specifically to a kind of laser cutting device and its cutting side
Method.
Background technique
Bilayer combination glass refers to the double glazing being bonded together by two single-glasses by optical cement etc.,
It is widely used in the fields such as FPD, liquid crystal display panel, car-mounted display and intelligence wearing.Since bilayer combination glass is thicker, such as
Integral thickness is greater than 2mm, therefore, can only be split by the way of break bar cutting to it in the prior art.
But since the mode of break bar cutting has, Cutting Road is wider, wastes material, the product surface chipping after cutting
Greatly, the problems such as special-shaped product and big break bar loss cannot be cut, therefore, it is unfavorable for the segmentation and application of bilayer combination glass.
Although disclosing a kind of method of laser cutting product using laser emitting in the prior art, and this method has
Have the advantages that Cutting Road it is narrow, cutting after the small and cleavable special-shaped product of product surface chipping, still, due to laser emitting
Laser is Gaussian beam, and therefore, under the short limitation of Focal Depth for Gaussian Beam, above-mentioned laser cutting method can not be thicker to thickness
Bilayer combination glass effectively divided.
Summary of the invention
In view of this, the present invention provides a kind of laser cutting device and its cutting method, to solve existing middle laser
The Focal Depth for Gaussian Beam of device outgoing is short, cannot the product thicker to thickness the problem of effectively being cut.
To achieve the above object, the invention provides the following technical scheme:
A kind of laser cutting device, including loading assemblies, the first duplex manipulator, break bar cutting assembly, front laser are cut
Cut component, turn-over component, reverse side laser cutting component, the second duplex manipulator, laser sliver component and sorter assemblies；
The loading assemblies for taking out sample to be cut from magazine, and by the sample to be cut be placed on to
Fetch bit is set；
The first duplex manipulator is used to for the sample to be cut set to fetch bit to be carried to the break bar and cut
The break bar Cutting platform of component, and the sample after break bar Cutting platform upper slitter wheel cutting is carried to the front laser and is cut
Cut the laser-scribing platform of component；
The break bar cutting assembly is used to carry out break bar cutting to the sample to be cut；
It is described front laser cutting component be used for using bessel beam to the break bar cutting after sample front into
Row laser cutting；
The turn-over component is carried to the reverse side laser cutting component for overturning the sample, and by the sample
Laser-scribing platform；
The reverse side laser cutting component is used to be cut by laser the reverse side of the sample using bessel beam, institute
It states the positive cutting path of sample to be overlapped with the cutting path of the sample reverse side, the path of the laser cutting and the break bar
The path of cutting is different；
The second duplex manipulator is used to the sample after the laser cutting being carried to the laser sliver component
Sliver platform, and the sample after sliver on the sliver platform is carried to the rewinding platform of the sorter assemblies；
The laser sliver component is used to carry out secondary laser to the sample after the laser cutting using Gaussian beam to cut
It cuts, to carry out sliver separation to the sample, wherein the cutting in the path of secondary laser cutting and the obverse and reverse
Path is identical；
The sorter assemblies are for carrying out sorting rewinding to the finished product of the sample on the rewinding platform.
Preferably, the break bar cutting assembly include the first machine body, be fixed on first machine body
One mechanism member, the first motion platform being fixed in first mechanism member, the break bar being arranged on first motion platform
Cutting platform, the break bar cutting head being fixed on above the break bar Cutting platform and the first contraposition component；
First motion platform is used to drive the sample on the break bar Cutting platform and the break bar Cutting platform
It is moved along X-axis, Y-axis and Z axis；
The break bar cutting head is used to carry out break bar cutting to the sample；
The first contraposition component is for being directed at the cutting position of the break bar cutting head, so that the break bar is cut
It cuts head and break bar cutting is carried out to the sample along preset path.
Preferably, the front cutting assembly and the reverse side cutting assembly all include the second machine body, are fixed on institute
It states the second mechanism member on the second machine body, the second motion platform being fixed in second mechanism member, be arranged described
Laser-scribing platform on second motion platform, the laser cutting head being fixed on above the laser-scribing platform and the second contraposition
Component；
Second motion platform is used to drive the sample on the laser-scribing platform and the laser-scribing platform
It is moved along X-axis, Y-axis and Z axis；
The laser cutting head carries out laser to the sample using bessel beam and cuts for being emitted bessel beam
It cuts；
The second contraposition component is for being directed at the cutting position of the laser cutting head, so that the laser is cut
The bessel beam for cutting head outgoing is cut by laser the sample along preset path.
Preferably, the optical path where the laser cutting head includes picosecond laser, beam shaping system and the first optically focused
Mirror；
The picosecond laser is used for shoot laser, and the laser is Gaussian beam；
The beam shaping system is used to the Gaussian beam being converted to bessel beam；
First condenser is used to the bessel beam focusing on the sample.
Preferably, the laser sliver component include third machine body, be fixed on the third machine body
Three mechanism members, the third motion platform being fixed in the third mechanism member, the sliver being arranged on the third motion platform
Platform, the sliver cutting head being fixed on above the sliver platform and third align component；
The third motion platform is for driving the sample on the sliver platform and the sliver platform along X-axis, Y-axis
It is moved with Z axis；
The sliver cutting head is cut by laser the sample for being emitted Gaussian beam, and using Gaussian beam；
The third contraposition component is for aligning the cutting position of the sliver cutting head, so that the sliver is cut
The Gaussian beam for cutting head outgoing is cut by laser the sample along preset path.
Preferably, the loading assemblies include feed frame, the hoistable platform being arranged on the feed frame and feeding
Mould group；
The hoistable platform is for placing the magazine for being mounted with multiple samples to be cut；
The feeding mould group from the magazine for taking out the sample to be cut, and by the sample to be cut
It is placed on and is set to fetch bit.
Preferably, the first duplex manipulator and the second duplex manipulator all include with the carrying for carrying mould group
Main body and the duplex mechanical arm for being arranged in the carrying main body and being moved under the control of the carrying mould group；
The duplex mechanical arm includes the first mechanical arm and second mechanical arm of linkage, the first mechanical arm and described the
All there is two mechanical arms the suction of pipette samples to have.
Preferably, the turn-over component includes turn-over component and blanking mechanical hand, and the turn-over component is described for overturning
Sample, the blanking mechanical hand are used to for the sample being carried to the laser-scribing platform of the reverse side laser cutting component；
The blanking mechanical hand includes with the main body for carrying mould group and being arranged on the body and in the main body
The lower mobile mechanical arm of control, the mechanical arm have the carrying sucker of pipette samples.
Preferably, the sorter assemblies include machine cabinet body, the rewinding platform being arranged on the machine cabinet body, are placed on
The rewinding basket of rewinding platform side and the robot that the rewinding platform other side is set；The robot is used for institute
The finished product for stating the sample on rewinding platform is sorted in the rewinding basket.
A kind of cutting method of laser cutting device is applied to described in any item laser cutting devices as above, comprising:
Loading assemblies take out sample to be cut from magazine, and the sample to be cut is placed on and is set to fetch bit；
First duplex manipulator cuts the break bar that the sample to be cut set to fetch bit is carried to break bar cutting assembly
Cut platform；
The break bar cutting assembly carries out break bar cutting to the sample to be cut；
Sample after the first duplex manipulator cuts the break bar Cutting platform upper slitter wheel is carried to the front
It is cut by laser the laser-scribing platform of component；
The front laser cutting component is swashed using front of the bessel beam to the sample after break bar cutting
Light cutting；
The turn-over component overturns the sample, and the sample is carried to the laser of the reverse side laser cutting component
Cutting platform；
The reverse side laser cutting component is cut by laser the reverse side of the sample using bessel beam, the sample
The positive cutting path of product is overlapped with the cutting path of the sample reverse side, and the path of the laser cutting and the break bar are cut
Path it is different；
Sample after the laser cutting is carried to the sliver of the laser sliver component by the second duplex manipulator
Platform；
The laser sliver component carries out secondary laser to the sample after the laser cutting for the first time using Gaussian beam and cuts
It cuts, to carry out sliver separation to the sample, wherein the cutting in the path of secondary laser cutting and the obverse and reverse
Path is identical；
Sample after secondary laser cutting is carried to the rewinding platform of sorter assemblies by the second duplex manipulator；
The sorter assemblies carry out sorting rewinding to the finished product of the sample on the rewinding platform.
Compared with prior art, the technical scheme provided by the invention has the following advantages:
Laser cutting device provided by the present invention and its cutting method, front laser cutting component and reverse side laser cutting
Component is cut by laser the sample using bessel beam, since the bessel beam after focusing is that depth of focus is longer poly-
Defocused laser beam, therefore, compared with Gaussian beam, sample to be cut that can be thicker to thickness is effectively cut, to expand
The application range of laser cutting device.
Also, sample is cut twice respectively using laser cutting component and laser sliver component in the embodiment of the present invention
It cuts and is separable into product and waste material, cutting efficiency is higher.In addition, the laser cutting device in the embodiment of the present invention has Cutting Road
The advantages that product surface chipping narrow, after cutting is small, taper is small, isostatic pressing strength is high and cleavable special-shaped product.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
The embodiment of invention for those of ordinary skill in the art without creative efforts, can also basis
The attached drawing of offer obtains other attached drawings.
Fig. 1 is the structural schematic diagram of laser cutting device provided in an embodiment of the present invention；
Fig. 2 is the structural schematic diagram of break bar cutting assembly provided in an embodiment of the present invention；
Fig. 3 is the structural schematic diagram of front cutting assembly provided in an embodiment of the present invention or reverse side cutting assembly；
Fig. 4 is the structural schematic diagram of laser sliver component 8 provided in an embodiment of the present invention；
Fig. 5 is the structural schematic diagram of loading assemblies provided in an embodiment of the present invention；
Fig. 6 is the structural schematic diagram of the first duplex manipulator provided in an embodiment of the present invention or the second duplex manipulator；
Fig. 7 is the structural schematic diagram of blanking mechanical hand provided in an embodiment of the present invention；
Fig. 8 is the structural schematic diagram of sorter assemblies provided in an embodiment of the present invention；
Fig. 9 is the flow chart of the cutting method of laser cutting device provided in an embodiment of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
The embodiment of the invention provides a kind of laser cutting devices, as shown in Figure 1, the laser cutting device includes feeding group
Part 1, the first duplex manipulator 2, break bar cutting assembly 3, front laser cutting component 4, turn-over component 5, reverse side laser cutting group
Part 6, the second duplex manipulator 7, laser sliver component 8 and sorter assemblies 9；
The loading assemblies 1 put the sample A to be cut for taking out sample A to be cut from magazine 10
It sets and is set to fetch bit；
The first duplex manipulator 2 is cut for the sample A to be cut set to fetch bit to be carried to the break bar
Cut the break bar Cutting platform 30 of component 3, and by the sample A after the 30 upper slitter wheel of break bar Cutting platform cutting be carried to it is described just
The laser-scribing platform 40 of face laser cutting component 4；
The break bar cutting assembly 3 is used to carry out break bar cutting to the sample A to be cut；
The front laser cutting component 4 is used for the front using bessel beam to the sample A after break bar cutting
It is cut by laser；
The sample A is carried to the reverse side laser cutting group for overturning the sample A by the turn-over component 5
The laser-scribing platform 60 of part 6；
The reverse side laser cutting component 6 is used to be cut by laser the reverse side of the sample A using bessel beam,
The positive cutting path of sample A is overlapped with the cutting path of the sample A reverse side, the path of the laser cutting with it is described
The path of break bar cutting is different；
The second duplex manipulator 7 is used to the sample A after the laser cutting being carried to the laser sliver component 8
Sliver platform 80；
The laser sliver component 8 is used to carry out secondary laser to the sample A after the laser cutting using Gaussian beam
Cutting, to carry out sliver separation to the sample A, wherein path and the obverse and reverse of secondary laser cutting are cut
It is identical to cut path；
Sample A after the second duplex manipulator 7 is also used to cut the secondary laser is carried to the sorting group
The rewinding platform 90 of part 9；
The sorter assemblies 9 are for carrying out sorting rewinding to the finished product of the sample A on the rewinding platform 90.
It should be noted that the laser cutting device in Fig. 1 including two break bar cutting assemblies 3 and is located at two break bars
Turn-over component 0 between cutting assembly 3, one of break bar cutting assembly 3 are used to carry out break bar cutting to the front of sample A,
Another break bar cutting assembly 3 is used to carry out break bar cutting to the reverse side of sample A, and turn-over component 0 is for turning over sample A
Face, and sample A is carried to the Cutting platform of another break bar cutting assembly 3 from the Cutting platform of a break bar cutting assembly 3,
But the present invention is not limited to this, in other embodiments, laser cutting device can only include a break bar cutting assembly
3。
In addition, the sample A to be cut in the embodiment of the present invention is preferably bilayer combination glass, which can
To apply in fields such as FPD, liquid crystal display panel, car-mounted display and intelligence wearings.
In the present embodiment, as shown in Fig. 2, break bar cutting assembly 3 includes the first machine body 31, is fixed on first machine
The first mechanism member 32 in device main body 31, is arranged described the first motion platform 33 being fixed in first mechanism member 32
Break bar Cutting platform 30 on first motion platform 33,34 and of break bar cutting head for being fixed on 30 top of break bar Cutting platform
First contraposition component 35；
First motion platform 33 is for driving the break bar Cutting platform 30 and the break bar Cutting platform 30
Sample A moved along X-axis, Y-axis and Z axis；The break bar cutting head 34 is used to carry out break bar cutting to the sample A；Described
One contraposition component 35 for being aligned to the cutting position of the break bar cutting head 34 so that the break bar cutting head 34 along
Preset path carries out break bar cutting to the sample A.
In the present embodiment, as shown in figure 3, the front cutting assembly 4 includes the second machine body 41, is fixed on described the
The second mechanism member 42 on two machine bodies 41, the second motion platform 43 being fixed in second mechanism member 42, setting exist
Laser-scribing platform 40 on second motion platform 43, the laser cutting head for being fixed on 40 top of laser-scribing platform
44 and second align component 45；
Second motion platform 43 is for driving the laser-scribing platform 40 and the laser-scribing platform 40
Sample A moved along X-axis, Y-axis and Z axis；The laser cutting head 44 uses bessel beam for being emitted bessel beam
The sample A is cut by laser；The second contraposition component 45 be used for the cutting position of the laser cutting head 44 into
Row alignment, so that the bessel beam that the laser cutting head 44 is emitted carries out laser to the sample A along preset path and cuts
It cuts.
In the present embodiment, the optical path where the laser cutting head 44 includes picosecond laser, beam shaping system and the
One condenser；The picosecond laser is used for shoot laser, and the laser is Gaussian beam；The beam shaping system is used for will
The Gaussian beam is converted to bessel beam；First condenser is used to the bessel beam focusing on the sample
On.
In the present embodiment, beam shaping system include be successively set on axial cone prism that picosecond laser goes out in light optical path,
Beam expanding lens and second condenser lens.Wherein, axial cone prism is used to the Gaussian beam that picosecond laser is emitted being converted to Bezier light
Beam；The bessel beam that beam expanding lens is used to be emitted axial cone prism expands；What second condenser lens were used to be emitted beam expanding lens
Bessel beam is focused.
Optionally, the beam expanding lens in the present embodiment includes being successively set on picosecond laser goes out in light optical path first thoroughly
Mirror, the second lens and the third lens, wherein the first lens are plano-convex lens, and the second lens are plano-convex lens, and the third lens are flat
Concavees lens.Certainly, the present invention is not limited to this, in other embodiments, beam expanding lens can also include plano-convex lens and
One plano-concave lens, details are not described herein.
In the present embodiment, bessel beam is expanded using beam expanding lens and using second condenser lens to Bezier light
Beam is focused, the diameter of adjustable bessel beam focal beam spot, for bessel beam enter the first condenser into
Line focusing provides advantage.Optionally, the first condenser in the present embodiment is located on the focal plane of second condenser lens, when
So, the present invention is not limited to this.In the present embodiment, the first condenser is convex lens.Optionally, which is object
Mirror, the object lens are made of multiple convex lens.Certainly, the present invention is not limited to this.
In the present embodiment, as shown in figure 4, the laser sliver component 8 includes third machine body 81, is fixed on described the
Third mechanism member 82 on three machine bodies 81, the third motion platform 83 being fixed in the third mechanism member 82, setting exist
Sliver platform 80 on the third motion platform 83, the sliver cutting head 84 and third for being fixed on 80 top of sliver platform
Align component 85；
The third motion platform 83 is used to drive the edge sample A on the sliver platform 80 and the sliver platform 80
X-axis, Y-axis and Z axis movement；The sliver cutting head 84 for being emitted Gaussian beam, and using Gaussian beam to the sample A into
Row laser cutting；The third contraposition component 85 is for aligning the cutting position of the sliver cutting head 84, so that institute
The Gaussian beam for stating the outgoing of sliver cutting head 84 is cut by laser the sample A along preset path.
Since the structure of reverse side cutting assembly 6 is identical as the structure of front cutting assembly 4, herein no longer to reverse side
The mechanism of cutting assembly 6 is repeated.It should be noted that the first mechanism member 32, the second mechanism member 42 and third mechanism member 82
It is all marble mechanism member.It all includes CCD that first contraposition component 35, second, which aligns component 45 and third contraposition component 85,
(Charge-coupled Device, charge coupled cell) image capturing system and to bit correction system, ccd image acquisition system
System is used for the position of cutting head and default cleavage bit correction system for acquiring the image of sample A and cutting head in real time
Set carry out alignment correction.
In the present embodiment, as shown in figure 5, the loading assemblies 1 include feed frame 11, are arranged in the feed frame 11
On hoistable platform 12 and feeding mould group 13；
The hoistable platform 12 is for placing the magazine 10 for being mounted with multiple sample A to be cut；
The feeding mould group 13 is used to take out the sample A to be cut from the magazine 10, and will be described to be cut
Sample A be placed on and set to fetch bit.
Wherein, hoistable platform 12 can rise or fall, so that the sample A to be cut in magazine 10 can be by feeding mould
Group 13 is taken out.
In the present embodiment, as shown in fig. 6, the first duplex manipulator 2 and the second duplex manipulator 7 all include tool
There is the carrying main body 71 for carrying mould group 70 and is arranged in the carrying main body 71 and is moved down in the control for carrying mould group 70
Dynamic duplex mechanical arm 72；
The duplex mechanical arm 72 includes the first mechanical arm 720 and second mechanical arm 721 of linkage, the first mechanical arm
720 and the second mechanical arm 721 all with pipette samples A suction tool 722.
It should be noted that the carrying mould group 70 in the present embodiment is preferably sliding rail, mechanical arm preferably can be sliding along sliding rail
Dynamic sliding block.Certainly, the present invention is not limited to this.
In the present embodiment, as shown in Figure 1, turn-over component 5 includes turn-over component 50 and blanking mechanical hand 51, the turn-over portion
Part 50 is used to the sample A being carried to the reverse side laser cutting group for overturning the sample A, the blanking mechanical hand 51
The laser-scribing platform 60 of part 6.As shown in fig. 7, the blanking mechanical hand 51 includes with 511 He of main body for carrying mould group 510
The mechanical arm 512 for being arranged in the main body 511 and moving under the control for carrying mould group 510, the mechanical arm 512 have
There is the carrying sucker 513 of pipette samples A.
In the present embodiment, as shown in figure 8, the sorter assemblies 9 include machine cabinet body 91, are arranged in the machine cabinet body 91
On rewinding platform 90, be placed on 90 side of rewinding platform rewinding basket 92 and be arranged in 90 other side of rewinding platform
Robot 93；The robot 93 is used to the finished product of sample A described on the rewinding platform 90 being sorted to the rewinding basket
In 92.
Below to the application process of laser cutting device for applying the bilayer combination glass in liquid crystal display panel
It is illustrated.Wherein, the bilayer combination glass in liquid crystal display panel includes the glass substrate and color membrane substrates in array substrate
On glass substrate.Multiple display units can be produced on same panel by liquid crystal display panel during production, so
Cutting is carried out to panel again afterwards and is divided into independent display unit one by one, each display unit can be applied in display.
It is placed on hoistable platform 12 firstly, a multiple panel i.e. magazines 10 of sample A greatly will be mounted with, then lifting is flat
Magazine 10 is elevated to designated position by platform 12, and feeding mould group 13 takes out sample A from magazine 10, and sample A is carried to wait take
Position.Duplex mechanical arm 72 in first duplex manipulator 2 slides to the left along mould group 70 is carried, and keeps second mechanical arm 721 sliding
It moves and is set to fetch bit, and the suction in second mechanical arm 721 is made to have 722 pipette samples A.Later, duplex mechanical arm 72 is along carrying
Mould group 70 is slided to the right, so that second mechanical arm 721 is slided into the top of break bar Cutting platform 30, and sample A is placed on break bar
On Cutting platform 30.
Then, break bar cutting is carried out to sample A using break bar cutting assembly 3, specifically, to array substrate on panel greatly
On glass substrate carry out part cutting, to expose the binding area of array substrate, so as to by FPC (Flexible Printed
Circuit, flexible circuit board) etc. devices be bundled in array substrate.
After the completion of break bar cutting, duplex mechanical arm 72 slides to the left along mould group 70 is carried, the suction in second mechanical arm 721
Tool 722 draws the sample A to be cut set to fetch bit, and the suction tool 722 in first mechanical arm 720 is drawn on break bar Cutting platform 30
Break bar cutting after sample A, later, duplex mechanical arm 72 slides to the right along mould group 70 is carried, and second mechanical arm 721 will be to
The sample A of cutting is placed on break bar Cutting platform 30, and the sample A after first mechanical arm 720 cuts break bar is placed on front
It is cut by laser on the laser-scribing platform 40 of component 4.
Front laser cutting component 4 is using bessel beam along preset path to the front of the sample A after break bar cutting
It is cut by laser, after the completion of the cutting of front, the mechanical arm 512 on blanking mechanical hand 51 can be slided to the left along mould group 510 is carried
Dynamic, after mechanical arm 512 slides into the top of the laser-scribing platform 40 of front laser cutting component 4, carrying sucker 513 can be drawn
Sample A on laser-scribing platform 40, mechanical arm 512 can slide to the right along mould group 510 is carried later, and sample A is placed
On the platform of turn-over component 50, after turn-over component 50 carries out turn-over to sample A, sample A will be allowed to become reverse side from facing up
After upwards, the pipette samples A again of carrying sucker 513, mechanical arm 512, which continues on, to be carried mould group 510 and slides to the right, by sample A
It is carried on the laser-scribing platform 60 of reverse side laser cutting component 6, reverse side laser cutting component 6 is made to use bessel beam pair
The reverse side of sample A is cut by laser, wherein the cutting path of the positive cutting path of sample A and sample A reverse side is completely heavy
It closes, still, the path that path and the break bar of laser cutting are cut is not identical, and laser cutting purpose is to be cut into a panel greatly
Independent display unit one by one.
Later, the duplex mechanical arm 72 in the second duplex manipulator 7 slides to the left along mould group 70 is carried, and makes the second machinery
Arm 721 slides into 60 top of laser-scribing platform of reverse side laser cutting component 6, and the suction tool 722 in second mechanical arm 721 is drawn
After sample A after laser cutting, duplex mechanical arm 72 slides to the right along mould group 70 is carried, and slides into second mechanical arm 721
The top of sliver platform 80, and sample A is placed on the sliver platform 80 of laser sliver component 8, adopt laser sliver component 8
Secondary laser cutting is carried out to the sample A after laser cutting with Gaussian beam, to carry out sliver separation to sample A, wherein secondary
The path of laser cutting and the cutting path of obverse and reverse are identical, so that sample A is separated along the path sliver.
Later, duplex mechanical arm 72 slides to the left along mould group 70 is carried, and the suction tool 722 in second mechanical arm 721 is drawn
Sample A after laser cutting, the suction tool 722 in first mechanical arm 720 draw the sample A after slivers, then duplex mechanical arm 72
It being slided to the right along mould group 70 is carried, sample A is placed on the sliver platform 80 of laser sliver component 8 by second mechanical arm 721,
Sample A after sliver is placed on rewinding platform 90 by first mechanical arm 720.Sorter assemblies 9 are to sample A on rewinding platform 90
Finished product carries out sorting rewinding, i.e., the finished product of sample A is sorted in rewinding basket 92 using robot 93, sample A is cut down
Waste material be sorted in waste product basket.
Laser cutting device provided in an embodiment of the present invention, front laser cutting component and reverse side laser cutting component use
Bessel beam is cut by laser the sample, since the bessel beam after focusing is the longer focus on light beam of depth of focus,
Therefore, compared with Gaussian beam, sample to be cut that can be thicker to thickness is effectively cut, to expand laser cutting
The application range of equipment.
Also, sample is cut twice respectively using laser cutting component and laser sliver component in the embodiment of the present invention
It cuts and is separable into product and waste material, cutting efficiency is higher.In addition, the laser cutting device in the embodiment of the present invention has Cutting Road
The advantages that product surface chipping narrow, after cutting is small, taper is small, isostatic pressing strength is high and cleavable special-shaped product.
The embodiment of the invention also provides a kind of cutting methods of laser cutting device, are applied to provided by the above embodiment
Laser cutting device, as shown in figure 9, this method comprises:
S901: loading assemblies take out sample to be cut from magazine, and the sample to be cut is placed on wait take
Position；
The sample to be cut set to fetch bit is carried to the knife of break bar cutting assembly by the S902: the first duplex manipulator
Take turns Cutting platform；
S903: the break bar cutting assembly carries out break bar cutting to the sample to be cut；
S904: the sample after break bar Cutting platform upper slitter wheel cutting is carried to described by the first duplex manipulator
The laser-scribing platform of front laser cutting component；
S905: it is described front laser cutting component using bessel beam to the break bar cutting after sample front into
Row laser cutting；
S906: the turn-over component overturns the sample, and the sample is carried to the reverse side and is cut by laser component
Laser-scribing platform；
S907: the reverse side laser cutting component is cut by laser the reverse side of the sample using bessel beam,
The positive cutting path of sample is overlapped with the cutting path of the sample reverse side, the path of the laser cutting and the knife
The path for taking turns cutting is different；
S908: the sample after the laser cutting is carried to the laser sliver component by the second duplex manipulator
Sliver platform；
S909: the laser sliver component carries out the sample after the laser cutting for the first time using Gaussian beam secondary sharp
Light cutting, to carry out sliver separation to the sample, wherein the path of secondary laser cutting and the obverse and reverse
Cutting path is identical；
S910: the sample after secondary laser cutting is carried to the rewinding of sorter assemblies by the second duplex manipulator
Platform；
S911: the sorter assemblies carry out sorting rewinding to the finished product of the sample on the rewinding platform.
The detailed process of laser cutting in the present embodiment is same as the previously described embodiments, and details are not described herein.
The cutting method of laser cutting device provided in an embodiment of the present invention, front laser cutting component and reverse side laser are cut
It cuts component to be cut by laser the sample using bessel beam, since the bessel beam after focusing is that depth of focus is longer
Focus on light beam, therefore, compared with Gaussian beam, sample to be cut that can be thicker to thickness is effectively cut, to expand
The application range of laser cutting device.
Also, sample is cut twice respectively using laser cutting component and laser sliver component in the embodiment of the present invention
It cuts and is separable into product and waste material, cutting efficiency is higher.In addition, the sample after cutting in the embodiment of the present invention has Cutting Road
The advantages that product surface chipping narrow, after cutting is small, taper is small, isostatic pressing strength is high and cleavable special-shaped product.
Each embodiment in this specification is described in a progressive manner, the highlights of each of the examples are with other
The difference of embodiment, the same or similar parts in each embodiment may refer to each other.For device disclosed in embodiment
For, since it is corresponded to the methods disclosed in the examples, so being described relatively simple, related place is said referring to method part
It is bright.
The foregoing description of the disclosed embodiments enables those skilled in the art to implement or use the present invention.
Various modifications to these embodiments will be readily apparent to those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, of the invention
It is not intended to be limited to the embodiments shown herein, and is to fit to and the principles and novel features disclosed herein phase one
The widest scope of cause.
Claims (10)
1. a kind of laser cutting device, which is characterized in that including loading assemblies, the first duplex manipulator, break bar cutting assembly, just
Face is cut by laser component, turn-over component, reverse side laser cutting component, the second duplex manipulator, laser sliver component and sorting group
Part；
The sample to be cut is placed on to fetch bit by the loading assemblies for taking out sample to be cut from magazine
It sets；
The first duplex manipulator is used to the sample to be cut set to fetch bit being carried to the break bar cutting assembly
Break bar Cutting platform, and the sample after break bar Cutting platform upper slitter wheel cutting is carried to the positive laser cutting group
The laser-scribing platform of part；
The break bar cutting assembly is used to carry out break bar cutting to the sample to be cut；
The front laser cutting component is used to swash using front of the bessel beam to the sample after break bar cutting
Light cutting；
The turn-over component is carried to the laser that the reverse side is cut by laser component for overturning the sample, and by the sample
Cutting platform；
The reverse side laser cutting component is used to be cut by laser the reverse side of the sample using bessel beam, the sample
The positive cutting path of product is overlapped with the cutting path of the sample reverse side, and the path of the laser cutting and the break bar are cut
Path it is different, wherein the path of the break bar cutting include for the glass substrate in array substrate on big panel into
Row part is cut, and to expose the path in the binding area of the array substrate, the path of the laser cutting includes for by institute
State the path that big panel is cut into independent display unit one by one；
The second duplex manipulator is carried to the sliver of the laser sliver component for the sample after being cut by laser reverse side
Platform, and the sample after sliver on the sliver platform is carried to the rewinding platform of the sorter assemblies；
The laser sliver component is used to carry out secondary laser cutting to the sample after reverse side laser cutting using Gaussian beam, with
Sliver separation is carried out to the sample, wherein the path of secondary laser cutting and the cutting path phase of the obverse and reverse
Together；
The sorter assemblies are for carrying out sorting rewinding to the finished product of the sample on the rewinding platform.
2. equipment according to claim 1, which is characterized in that the break bar cutting assembly includes the first machine body, consolidates
The first mechanism member for being scheduled on first machine body, the first motion platform being fixed in first mechanism member, setting
In the break bar Cutting platform on first motion platform, the break bar cutting head and that is fixed on above the break bar Cutting platform
One contraposition component；
First motion platform is for driving the sample on the break bar Cutting platform and the break bar Cutting platform along X
Axis, Y-axis and Z axis movement；
The break bar cutting head is used to carry out break bar cutting to the sample；
The first contraposition component is for being directed at the cutting position of the break bar cutting head, so that the break bar cutting head
Break bar cutting is carried out to the sample along preset path.
3. equipment according to claim 1, which is characterized in that the front cutting assembly and the reverse side cutting assembly are all
Including the second machine body, the second mechanism member being fixed on second machine body, it is fixed in second mechanism member
The second motion platform, be arranged on second motion platform laser-scribing platform, be fixed on the laser-scribing platform
The laser cutting head of top and the second contraposition component；
Second motion platform is for driving the sample on the laser-scribing platform and the laser-scribing platform along X
Axis, Y-axis and Z axis movement；
The laser cutting head is cut by laser the sample for being emitted bessel beam, and using bessel beam；
The second contraposition component is for being directed at the cutting position of the laser cutting head, so that the laser cutting head
The bessel beam of outgoing is cut by laser the sample along preset path.
4. equipment according to claim 3, which is characterized in that the optical path where the laser cutting head includes picosecond laser
Device, beam shaping system and the first condenser；
The picosecond laser is used for shoot laser, and the laser is Gaussian beam；
The beam shaping system is used to the Gaussian beam being converted to bessel beam；
First condenser is used to the bessel beam focusing on the sample.
5. equipment according to claim 1, which is characterized in that the laser sliver component includes third machine body, consolidates
The third mechanism member that is scheduled on the third machine body, the third motion platform being fixed in the third mechanism member, setting
In the sliver platform on the third motion platform, the sliver cutting head and third contraposition part that are fixed on above the sliver platform
Part；
The third motion platform is for driving the sample on the sliver platform and the sliver platform along X-axis, Y-axis and Z
Axis movement；
The sliver cutting head is cut by laser the sample for being emitted Gaussian beam, and using Gaussian beam；
The third contraposition component is for aligning the cutting position of the sliver cutting head, so that the sliver cutting head
The Gaussian beam of outgoing is cut by laser the sample along preset path.
6. equipment according to claim 1, which is characterized in that the loading assemblies include feed frame, are arranged described
Hoistable platform and feeding mould group on feed frame；
The hoistable platform is for placing the magazine for being mounted with multiple samples to be cut；
The feeding mould group is placed for taking out the sample to be cut from the magazine, and by the sample to be cut
It is set to fetch bit.
7. equipment according to claim 1, which is characterized in that the first duplex manipulator and second duplex are mechanical
Hand all includes with the carrying main body for carrying mould group and being arranged in the carrying main body and under the control for carrying mould group
Mobile duplex mechanical arm；
The duplex mechanical arm includes the first mechanical arm and second mechanical arm of linkage, the first mechanical arm and second machine
All there is tool arm the suction of pipette samples to have.
8. equipment according to claim 1, which is characterized in that the turn-over component includes turn-over component and blanking mechanical
Hand, the turn-over component swash for overturning the sample, the blanking mechanical hand for the sample to be carried to the reverse side
The laser-scribing platform of light cutting assembly；
The blanking mechanical hand includes with the main body for carrying mould group and being arranged on the body and in the control of the main body
The mechanical arm of lower movement, the mechanical arm have the carrying sucker of pipette samples.
9. equipment according to claim 1, which is characterized in that the sorter assemblies include machine cabinet body, are arranged described
Rewinding platform on machine cabinet body, the rewinding basket for being placed on rewinding platform side and it is arranged in the rewinding platform other side
Robot；The robot is for the finished product of the sample on the rewinding platform to be sorted in the rewinding basket.
10. a kind of cutting method of laser cutting device, which is characterized in that it is described in any item sharp to be applied to claim 1 to 9
Light cutting equipment, comprising:
Loading assemblies take out sample to be cut from magazine, and the sample to be cut is placed on and is set to fetch bit；
First duplex manipulator cuts the break bar that the sample to be cut set to fetch bit is carried to break bar cutting assembly flat
Platform；
The break bar cutting assembly carries out break bar cutting to the sample to be cut；
Sample after the first duplex manipulator cuts the break bar Cutting platform upper slitter wheel is carried to the front laser
The laser-scribing platform of cutting assembly；
The front laser cutting component carries out laser using front of the bessel beam to the sample after break bar cutting and cuts
It cuts；
The turn-over component overturns the sample, and the sample is carried to the laser cutting of the reverse side laser cutting component
Platform；
The reverse side laser cutting component is cut by laser the reverse side of the sample using bessel beam, and the sample is just
The cutting path in face is overlapped with the cutting path of the sample reverse side, the road in the path of the laser cutting and break bar cutting
Diameter is different；
Sample after reverse side is cut by laser by the second duplex manipulator is carried to the sliver platform of the laser sliver component；
The laser sliver component carries out secondary laser cutting to the sample after reverse side laser cutting using Gaussian beam, to institute
It states sample and carries out sliver separation, wherein the path of secondary laser cutting is identical as the cutting path of the obverse and reverse；
Sample after secondary laser cutting is carried to the rewinding platform of sorter assemblies by the second duplex manipulator；
The sorter assemblies carry out sorting rewinding to the finished product of the sample on the rewinding platform.
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| CN201710613754.8A CN107199410B (en) | 2017-07-25 | 2017-07-25 | A kind of laser cutting device and its cutting method |
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| CN107745188A (en) * | 2017-09-30 | 2018-03-02 | 深圳信息职业技术学院 | A kind of picosecond laser process equipment |
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| CN109909627A (en) * | 2019-03-20 | 2019-06-21 | 大族激光科技产业集团股份有限公司 | A kind of laser process equipment of SiC boule |
| CN110294592A (en) * | 2019-08-07 | 2019-10-01 | 安徽金视界光电科技有限公司 | A kind of LCD glass-cutting system |
| CN110560924B (en) * | 2019-08-23 | 2021-08-20 | 大族激光科技产业集团股份有限公司 | Automatic system based on laser cutting |
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Address after: 523770 Second Floor, 3 Kusai Science Park, No. 8 Fumin South Road, Foxin Community, Dalang Town, Dongguan City, Guangdong Province Patentee after: Dongguan Shengxiong Laser Advanced Equipment Co., Ltd. Address before: 523000 First Floor, Building A, 53 Fofu Road, Foziwa Village, Dalang Town, Dongguan City, Guangdong Province Patentee before: Dongguan Strong Laser Co., Ltd. |