JP2606880B2 - Thermocompression bonding equipment - Google Patents

Thermocompression bonding equipment

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Publication number
JP2606880B2
JP2606880B2 JP63122604A JP12260488A JP2606880B2 JP 2606880 B2 JP2606880 B2 JP 2606880B2 JP 63122604 A JP63122604 A JP 63122604A JP 12260488 A JP12260488 A JP 12260488A JP 2606880 B2 JP2606880 B2 JP 2606880B2
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JP
Japan
Prior art keywords
substrate
substrates
electrode
suction
thermocompression bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP63122604A
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Japanese (ja)
Other versions
JPH01292316A (en
Inventor
勝也 大谷
啓司 山根
顕 石津
勝彦 樽井
史郎 三宅
Original Assignee
三菱電機株式会社
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Priority to JP63122604A priority Critical patent/JP2606880B2/en
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Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は熱圧着装置に関し、特に、上下一対の電極
よりなる液晶表示素子の表示パターンの形成に用いる装
置に関するもので、特に、大型の共通電極基板を用いて
素子を一括形成する製造方法(マルチセル製造方法)
や、高精細のパターン形成を必要とするアクティブマト
リックス型液晶表示素子や、大型高精細ドットマトリッ
クス等の液晶表示素子の製造方法に適したものである。
Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermocompression bonding apparatus, and more particularly to an apparatus used for forming a display pattern of a liquid crystal display element having a pair of upper and lower electrodes. Manufacturing method in which elements are collectively formed using an electrode substrate (multi-cell manufacturing method)
Also, the present invention is suitable for a method of manufacturing an active matrix type liquid crystal display element which requires formation of a high definition pattern, and a liquid crystal display element such as a large high definition dot matrix.
〔従来の技術〕[Conventional technology]
従来、液晶表示素子の上下一対の電極基板を加熱圧着
により貼り合わせる方法は、いずれか一方の基板にエポ
キシ樹脂などのシール材を印刷し、上下一対の電極基板
を、その重ね合わせマークが一致するよう位置修正して
重ね合わせた後に熱圧着する方法が採られている。
Conventionally, a method of bonding a pair of upper and lower electrode substrates of a liquid crystal display element by heating and pressing is to print a sealing material such as an epoxy resin on one of the substrates, and to align the pair of upper and lower electrode substrates with their overlapping marks. A method is adopted in which the positions are corrected so as to be overlapped and then thermocompression-bonded.
第3図と第4図は特公昭60−46411号公報に示された
従来のマルチ製造方法による液晶表示素子を示す図であ
り、第3図は電極基板の重ね合わせ後の状態、第4図は
電極基板の加熱圧着後の状態を示す断面図である。
3 and 4 are views showing a liquid crystal display device according to the conventional multi-manufacturing method disclosed in Japanese Patent Publication No. Sho 60-46411, and FIG. FIG. 3 is a cross-sectional view showing a state after the thermocompression bonding of the electrode substrate.
図において、21は液晶表示素子の上側電極基板、22は
該基板21に形成された上側電極パターン、23は上記液晶
表示素子の下側電極基板、24は該基板23に形成された下
側電極パターン、25は液晶のシール材、26は熱圧着時該
上下の基板のずれを防止するための仮止め接着材、A,B
はマルチセルの切断線を示す。
In the figure, 21 is an upper electrode substrate of the liquid crystal display element, 22 is an upper electrode pattern formed on the substrate 21, 23 is a lower electrode substrate of the liquid crystal display element, and 24 is a lower electrode formed on the substrate 23. Pattern, 25 is a liquid crystal sealing material, 26 is a temporary fixing adhesive for preventing displacement of the upper and lower substrates during thermocompression bonding, A, B
Indicates a multi-cell cutting line.
このような液晶表示素子では、上記仮止め接着剤26が
ない場合、重ね合わせ時に上下一対の基板を高精度に重
ねていても熱圧着時にシール材樹脂の粘性流動により圧
着面方向に上下基板が移動し上下電極パターンずれが発
生する。
In such a liquid crystal display element, when the above-mentioned temporary fixing adhesive 26 is not provided, even when a pair of upper and lower substrates are overlapped with high accuracy at the time of superposition, the upper and lower substrates are pressed in the direction of the compression surface due to the viscous flow of the sealing resin during thermocompression. It moves and the upper and lower electrode patterns are shifted.
この仮止め接着剤26は周辺シール材25の外周部に常温
で硬化し得る瞬間もしくは短時間硬化接着剤であり、セ
ルの形成はこの仮止め接着材26により仮止めしてから熱
圧着し、第4図のように切断線AまたはBの部分から切
断して複数個のセルを切り出すことにより行う。
This temporary fixing adhesive 26 is an instant or short-time curing adhesive that can be cured at room temperature on the outer peripheral portion of the peripheral sealing material 25, and the cell is formed by temporarily fixing with the temporary fixing adhesive 26 and then thermocompression bonding. As shown in FIG. 4, the cutting is performed by cutting a plurality of cells by cutting from the portion of the cutting line A or B.
〔発明が解決しようとする課題〕[Problems to be solved by the invention]
ところが上記のような周辺仮止め接着剤を用いる方法
では、第3図のような重ね合わせ時のシール剤の厚さは
一般に20〜30μm程度であり、仮止め接着剤の厚さもほ
ぼ同じ厚さになる。また熱圧着後の上下基板間の間隔は
5〜10μm程度まで圧着されるが、仮止め接着剤は常温
で既に硬化しているために外周部が必然的に厚くなる。
However, in the method using the peripheral temporary fixing adhesive as described above, the thickness of the sealant at the time of superposition as shown in FIG. 3 is generally about 20 to 30 μm, and the thickness of the temporary fixing adhesive is almost the same. become. Further, the space between the upper and lower substrates after the thermocompression bonding is pressure-bonded to about 5 to 10 μm. However, since the temporary fixing adhesive has already been cured at room temperature, the outer peripheral portion is necessarily thick.
この周辺部のセル厚さの不均一は、マルチセル製造方
法では外周部を切り離してしまうために問題にはなら
ず、また10〜12インチのサイズの大型ドットマトリック
ス液晶表示素子製造方法などの例でも同様に有効寸法の
外周に仮止め接着剤で固定した後に圧着し外周部を切り
離す方法が一般的であるため、同様に問題とならない
が、外周部に仮止め接着剤を用いる方法では仮止め接着
剤によるコストアップを招き、また有効表示面に比べ基
板外周寸法に余裕のない場合など外周部の基板間隔のふ
くれが問題となってくる。
This non-uniform cell thickness in the peripheral portion does not cause a problem because the outer peripheral portion is cut off in the multi-cell manufacturing method, and even in a method such as a method for manufacturing a large dot matrix liquid crystal display element having a size of 10 to 12 inches. Similarly, it is common practice to fix the outer periphery of the effective dimensions with a temporary fixing adhesive and then press it off to separate the outer periphery, so there is no problem in the same way. The cost increases due to the agent, and the bulging of the substrate interval on the outer peripheral portion becomes a problem when there is no margin in the outer peripheral size of the substrate compared to the effective display surface.
この発明は上記のような問題点を解決するためになさ
れたもので、加熱圧着時、重ね合わせた上,下電極基板
の電極パターンのズレを防止でき、これにより仮止め接
着剤を使用せずに両基板を高い位置精度で固着できる熱
圧着装置を提供することを目的とする。
The present invention has been made in order to solve the above-mentioned problems, and it is possible to prevent the displacement of the electrode pattern of the upper and lower electrode substrates during heating and pressure bonding, thereby eliminating the use of a temporary fixing adhesive. Another object of the present invention is to provide a thermocompression bonding apparatus that can fix both substrates with high positional accuracy.
〔課題を解決するための手段〕[Means for solving the problem]
その表面に電極パターンを有する上,下一対の電極基
板を周辺シール材を介して精密に重ね合わせた基板重合
体を、加熱するとともに上記両基板を圧接してこれらを
固着する熱圧着装置において、上記上,下一対の電極基
板を、その表面に有する真空吸着穴でそれぞれ吸着固定
して、上記加熱、及び該両基板の圧接を行う一対の上,
下基板吸着板と、上記基板吸着板の吸着力を上記圧接力
の増加に応じて増加させる吸着力調整手段とを備えたも
のである。
In a thermocompression bonding apparatus, a substrate polymer in which a pair of upper and lower electrode substrates having an electrode pattern on the surface thereof are precisely overlapped with each other via a peripheral sealing material is heated, and the two substrates are pressed against each other to fix them. The pair of upper and lower electrode substrates are respectively suction-fixed by vacuum suction holes provided on the surface thereof, and the above-mentioned pair of upper and lower electrodes for performing the above-mentioned heating and pressing the two substrates are pressed.
A lower substrate suction plate; and a suction force adjusting means for increasing a suction force of the substrate suction plate in accordance with an increase in the pressing force.
〔作用〕[Action]
この発明においては、シール材を介して重ね合わされ
た上下一対の電極基板を加熱圧着する際、該両基板を基
板吸着板により吸着固定して加熱圧着するようにしたか
ら、加熱圧着時のシール材の粘性流動による不特定な方
向へのパターンのずれを抑えることができ、これにより
仮止め接着剤を使用せずに上記両電極基板を固着するこ
とができる。
In the present invention, when a pair of upper and lower electrode substrates superimposed via a sealing material is thermocompression-bonded, the two substrates are suction-fixed by a substrate suction plate and thermocompression-bonded. The displacement of the pattern in an unspecified direction due to the viscous flow can be suppressed, whereby the two electrode substrates can be fixed without using a temporary fixing adhesive.
〔実施例〕〔Example〕
以下、この発明の実施例を図について説明する。 Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
第1図はこの発明の一実施例による液晶表示素子の製
造方法に用いる熱圧着装置の概略構成を示し、第2図は
該装置の圧着部を示す拡大断面図である。これらの図に
おいて、13は真空ポンプ14を有するベースフレームで、
このフレーム13には上側吸着板の真空圧保持タンク15、
下側吸着板の真空圧保持タンク16が取付けられている。
1は該ベースフレーム13上に微調整装置12を介して配設
されたベース台、9は上記ベースフレーム13上方に配置
されたヘッドフレームで、このフレーム9には空気圧制
御系10,真空圧制御系11が設けられている。また8は該
ヘッドフレーム9の中央に取り付けられたエアーシリン
ダ、7は上記ヘッドフレーム9の下側に配置された昇降
フレームで、フローティングジョイント6により上記エ
アーシリンダ8の先端と接続されている。
FIG. 1 shows a schematic configuration of a thermocompression bonding apparatus used in a method of manufacturing a liquid crystal display element according to an embodiment of the present invention, and FIG. 2 is an enlarged sectional view showing a compression bonding section of the apparatus. In these figures, 13 is a base frame having a vacuum pump 14,
The frame 13 has a vacuum pressure holding tank 15 for the upper suction plate,
A vacuum pressure holding tank 16 for the lower suction plate is attached.
1 is a base table arranged on the base frame 13 via the fine adjustment device 12, 9 is a head frame arranged above the base frame 13, and this frame 9 has an air pressure control system 10, a vacuum pressure control A system 11 is provided. Reference numeral 8 denotes an air cylinder mounted at the center of the head frame 9, and reference numeral 7 denotes an elevating frame arranged below the head frame 9, which is connected to the tip of the air cylinder 8 by a floating joint 6.
また3a,3bはそれぞれ上記ベース台1上面,昇降フレ
ーム7下面に、断熱板2a,2bを介して配設されたヒータ
ブロック、4a,4bはそれぞれこれらのヒータブロック3a,
3bの対向する面に取付けられた上側,及び下側基板吸着
板で、それぞれの基板吸着面5a,5bには真空吸着穴17が
形成され、これらの穴は上記真空圧保持タンク15,16に
連結されている。
3a and 3b are heater blocks disposed on the upper surface of the base 1 and the lower surface of the elevating frame 7 via heat insulating plates 2a and 2b, respectively, and 4a and 4b are heater blocks 3a and 4b, respectively.
A vacuum suction hole 17 is formed in each of the substrate suction surfaces 5a and 5b on the upper and lower substrate suction plates attached to the opposing surfaces of 3b, and these holes are formed in the vacuum pressure holding tanks 15 and 16 respectively. Are linked.
また21,23は上記基板吸着板4a,4bに吸着された一対の
上側,下側電極基板であり、これらは例えば、ガラスな
どの透明基板の片側表面にIn2OxあるいはSnOxなどの透
明導電被膜を蒸着法などにより形成し、さらに写真蝕刻
法などにより、所望の上電極パターン22、下電極パター
ン24を形成してなるものである。なお、この過程におけ
る電極基板上の位置精度を含めたパターニング精度は例
えば、電卓用サイズで約20μm程度である。また5,10イ
ンチのアクティブマトリックス液晶表示素子レベルでは
約5μmのパターニング精度である。
Reference numerals 21 and 23 denote a pair of upper and lower electrode substrates adsorbed on the substrate adsorption plates 4a and 4b, for example, a transparent conductive film such as In 2 Ox or SnOx on one surface of a transparent substrate such as glass. Is formed by vapor deposition or the like, and desired upper electrode patterns 22 and lower electrode patterns 24 are formed by photolithography or the like. The patterning accuracy including the positional accuracy on the electrode substrate in this process is, for example, about 20 μm in a calculator size. On the level of a 5,10-inch active matrix liquid crystal display element, the patterning accuracy is about 5 μm.
次に動作について説明する。 Next, the operation will be described.
この装置で加熱圧着される電極基板21,23は、予め電
極基板表面に液晶の配向処理を施された後、一方の電極
基板の外周にシール材25がスクリーン印刷で形成され、
さらに各々の基板が対向するように配置され、適当な光
学系を備えた重ね合わせ装置により、位置合わせマーク
を基準として重ね合わされている。
Electrode substrates 21 and 23 to be heated and pressed by this device are subjected to a liquid crystal alignment treatment on the electrode substrate surface in advance, and then a seal material 25 is formed on the outer periphery of one of the electrode substrates by screen printing,
Further, the respective substrates are arranged so as to face each other, and are superimposed on a positioning mark as a reference by a superimposing device having an appropriate optical system.
この時の重ね合わせの精度は必要に応じて十分高くす
る必要があり、たとえば通常の電卓サイズでは±20μm
以下の精度で良いが、5,10インチのアクティブマトリッ
クス液晶表示素子レベルでは±5μm以下が必要であ
る。
The overlay accuracy at this time must be sufficiently high as required, for example, ± 20 μm for a normal calculator size.
The following accuracy is good, but at the level of the active matrix liquid crystal display device of 5,10 inches, ± 5 μm or less is required.
そしてこのように高精度に重ね合わされた一対の電極
基板21,23を、第1図の加熱圧着装置の下側の基板吸着
板4b上にセットし真空吸着固定する。この時、加熱圧着
装置のヒータブロック3は180℃に設定されている。
The pair of electrode substrates 21 and 23 thus superimposed with high precision are set on the substrate suction plate 4b below the thermocompression bonding apparatus in FIG. 1 and fixed by vacuum suction. At this time, the temperature of the heater block 3 of the thermocompression bonding apparatus is set to 180 ° C.
次に、エアシリンダ8及び空気圧制御系10で圧力制御
しながら昇降フレームを下げ、上電極基板21と基板吸着
板4aとが接触した状態で上基板21の真空吸着を開始し、
加圧力の増加にともなって真空制御系11により上基板21
の真空吸着力を増加させほぼシール材の硬化が完了する
時間(例えば10分間)保持する。
Next, the lifting frame is lowered while controlling the pressure by the air cylinder 8 and the air pressure control system 10, and the vacuum suction of the upper substrate 21 is started in a state where the upper electrode substrate 21 is in contact with the substrate suction plate 4a.
With the increase of the pressing force, the upper substrate 21 is controlled by the vacuum control system 11.
The vacuum suction force is increased and the time for which the hardening of the sealing material is almost completed (for example, 10 minutes) is maintained.
この加熱圧着過程において、上記のような真空吸着固
定を採らずに圧着した場合はシール材の加熱流動によ
り、不特定な方向に50〜100μm程度のパターンずれが
発生するが上記のような真空吸着固定を採用することに
よりパターンずれは±5μm以下となる。
In the heat-compression bonding process, when the pressure-bonding is performed without using the vacuum suction fixing as described above, a pattern shift of about 50 to 100 μm occurs in an unspecified direction due to the heat flow of the sealing material. By adopting the fixation, the pattern shift becomes ± 5 μm or less.
このように本実施例では、重ね合わせマークを基準に
して高精度に重ね合わせた上下一対の電極基板21,23を
加熱圧着する過程において、電極基板21,23を真空吸着
固定し、圧着圧力(圧接力)を加える時、空気圧制御系
10、真空圧制御系11により、圧着圧力の増加と供に真空
吸着圧を増加させ、シール剤25の粘性流動による基板の
移動を抑えるようにしたので、加熱圧着時電極パターン
22,24がシール材の粘性流動により不特定な方向へずれ
るのを防止でき、これにより仮止め用の接着材26を用い
ることなく基板圧着を行うことができ、この結果基板サ
イズの全面に均一な基板間隙の制御が可能となり、製造
歩留まりの向上や、有効表示面積を拡大することができ
るなどの効果がある。
As described above, in the present embodiment, in the process of thermocompression-bonding the pair of upper and lower electrode substrates 21 and 23 which are superimposed with high precision based on the superposition mark, the electrode substrates 21 and 23 are fixed by vacuum suction and the pressure ( Pneumatic control system when applying pressure
10.The vacuum pressure control system 11 increases the vacuum suction pressure in conjunction with the increase in the compression pressure, and suppresses the movement of the substrate due to the viscous flow of the sealant 25.
22 and 24 can be prevented from shifting in an unspecified direction due to the viscous flow of the sealing material, whereby the substrate can be pressure-bonded without using the adhesive 26 for temporary fixing, and as a result, the entire surface of the substrate can be uniformly pressed. This makes it possible to control the gap between the substrates, thereby improving the production yield and increasing the effective display area.
〔発明の効果〕〔The invention's effect〕
以上のように本発明に係る熱圧着装置によれば、その
表面に真空吸着穴を有し、シール材を介して重ね合わさ
れた上下一対の電極基板を吸着固定して加熱圧着する上
下一対の基板吸着板を設け、該両電極基板の加熱圧着時
これらを吸着固定するとともに、上記基板吸着板の吸着
力を加圧力の増加に応じて増加させるようにしたので、
加熱圧着時、シール剤の粘性流動による基板の移動を抑
えることができ、これにより仮止め接着剤を使用せずに
上下電極パターンの加熱圧着を行うことができ、この結
果製造歩留まりの向上、有効表示面積の拡大を図ること
ができる。
As described above, according to the thermocompression bonding apparatus according to the present invention, a pair of upper and lower substrates that have a vacuum suction hole on the surface thereof, and heat-press and fix a pair of upper and lower electrode substrates stacked via a sealing material. Since the suction plate is provided and these are fixed by suction when the two electrode substrates are heated and pressed, the suction force of the substrate suction plate is increased according to the increase in the pressing force.
At the time of thermocompression bonding, the movement of the substrate due to the viscous flow of the sealant can be suppressed, whereby the thermocompression bonding of the upper and lower electrode patterns can be performed without using a temporary fixing adhesive. As a result, the production yield is improved and effective. The display area can be increased.
【図面の簡単な説明】[Brief description of the drawings]
第1図はこの発明の一実施例による熱圧着装置の構成を
示す概念図、第2図は該装置の圧着部の拡大断面図、第
3図は従来方法において電極基板を重ね合わせた状態を
示す図、第4図は従来方法における電極基板の加熱圧着
後の状態を示す断面図である。 1……熱圧着装置のベース台、2a,2b……断熱板、3a,3b
……ヒータブロック、4a,4b……上,下基板吸着板、5a,
5b……上,下基板吸着面、6……加圧シリンダのフロー
テイングジョイント、7……昇降フレーム、8……エア
シリンダ、9……ヘッドフレーム、10……空気圧制御
系、11……真空圧制御系、12……微調整装置、13……ベ
ースフレーム、14……真空ポンプ、15……上部真空タン
ク、16……下部真空タンク、21……上電極基板、22……
上電極パターン、23……下電極基板、24……下電極パタ
ーン、25……シール材。 なお、図中同一符号は同一又は相当部分を示す。
FIG. 1 is a conceptual diagram showing a configuration of a thermocompression bonding apparatus according to an embodiment of the present invention, FIG. 2 is an enlarged cross-sectional view of a compression bonding section of the apparatus, and FIG. FIG. 4 is a cross-sectional view showing the state of the electrode substrate after the thermocompression bonding in the conventional method. 1 …… The base of thermocompression bonding equipment, 2a, 2b …… Insulation plate, 3a, 3b
... heater block, 4a, 4b ... upper and lower substrate suction plates, 5a,
5b: Upper and lower substrate suction surfaces, 6: Floating joint of pressure cylinder, 7: Lifting frame, 8: Air cylinder, 9: Head frame, 10: Air pressure control system, 11: Vacuum Pressure control system, 12 Fine adjustment device, 13 Base frame, 14 Vacuum pump, 15 Upper vacuum tank, 16 Lower vacuum tank, 21 Upper electrode substrate, 22
Upper electrode pattern, 23: Lower electrode substrate, 24: Lower electrode pattern, 25: Sealing material. In the drawings, the same reference numerals indicate the same or corresponding parts.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 樽井 勝彦 兵庫県尼崎市塚口本町8丁目1番1号 三菱電機株式会社材料研究所内 (72)発明者 三宅 史郎 兵庫県尼崎市塚口本町8丁目1番1号 三菱電機株式会社材料研究所内 (56)参考文献 特開 昭59−144597(JP,A) 特開 平1−142532(JP,A) ──────────────────────────────────────────────────続 き Continued on the front page (72) Katsuhiko Tarui 8-1-1, Tsukaguchi Honcho, Amagasaki-shi, Hyogo Inside Materials Research Laboratory, Mitsubishi Electric Corporation (72) Inventor Shiro Miyake 8-1-1, Tsukaguchi-Honcho, Amagasaki-shi, Hyogo No. 1 Inside the Materials Research Laboratory of Mitsubishi Electric Corporation (56) References JP-A-59-144597 (JP, A) JP-A-1-142532 (JP, A)

Claims (1)

    (57)【特許請求の範囲】(57) [Claims]
  1. 【請求項1】その表面に電極パターンを有する上,下一
    対の電極基板を周辺シール材を介して精密に重ね合わせ
    た基板重合体を、加熱するとともに上記両基板を圧接し
    てこれらを固着する熱圧着装置において、 上記上,下一対の電極基板を、その表面に有する真空吸
    着穴でそれぞれ吸着固定して、上記加熱、及び該両基板
    の圧接を行う一対の上,下基板吸着板と、 上記基板吸着板の吸着力を上記圧接力の増加に応じて増
    加させる吸着力調整手段とを備えたことを特徴とする熱
    圧着装置。
    1. A substrate polymer in which a pair of upper and lower electrode substrates having an electrode pattern on their surfaces are precisely overlapped with each other via a peripheral sealing material is heated, and both substrates are pressed against each other to fix them. In a thermocompression bonding apparatus, the pair of upper and lower electrode substrates are respectively suction-fixed by vacuum suction holes provided on the surface thereof, and the pair of upper and lower substrate suction plates for performing the heating and press-contacting the two substrates, A thermocompression bonding apparatus, comprising: a suction force adjusting means for increasing a suction force of the substrate suction plate in accordance with an increase in the pressing force.
JP63122604A 1988-05-19 1988-05-19 Thermocompression bonding equipment Expired - Lifetime JP2606880B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63122604A JP2606880B2 (en) 1988-05-19 1988-05-19 Thermocompression bonding equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63122604A JP2606880B2 (en) 1988-05-19 1988-05-19 Thermocompression bonding equipment

Publications (2)

Publication Number Publication Date
JPH01292316A JPH01292316A (en) 1989-11-24
JP2606880B2 true JP2606880B2 (en) 1997-05-07

Family

ID=14840052

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63122604A Expired - Lifetime JP2606880B2 (en) 1988-05-19 1988-05-19 Thermocompression bonding equipment

Country Status (1)

Country Link
JP (1) JP2606880B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100929168B1 (en) * 2009-04-29 2009-12-01 윤근천 The press stage that use to encapsulating for an organic light-emitting diode manufacturing instrument
CN104339813A (en) * 2013-07-26 2015-02-11 盟立自动化股份有限公司 Vacuum attachment equipment and attaching method

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH056431U (en) * 1991-07-12 1993-01-29 新東工業株式会社 Pressurized hot platen equipment for liquid crystal panel manufacturing
JPH0533133U (en) * 1991-10-15 1993-04-30 日本電気株式会社 Jig for liquid crystal panel liquid crystal injection

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6323880B2 (en) * 1983-02-03 1988-05-18 Canon Kk

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100929168B1 (en) * 2009-04-29 2009-12-01 윤근천 The press stage that use to encapsulating for an organic light-emitting diode manufacturing instrument
CN104339813A (en) * 2013-07-26 2015-02-11 盟立自动化股份有限公司 Vacuum attachment equipment and attaching method

Also Published As

Publication number Publication date
JPH01292316A (en) 1989-11-24

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