Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
  • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
  • H01L21/52—Mounting semiconductor bodies in containers
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
  • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
  • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J7/00—Adhesives in the form of films or foils
  • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
  • C09J7/38—Pressure-sensitive adhesives [PSA]
  • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
  • C09J7/385—Acrylic polymers
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
  • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
  • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
  • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/67005—Apparatus not specifically provided for elsewhere
  • H01L21/67011—Apparatus for manufacture or treatment
  • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
  • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
  • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
  • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
  • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T428/00—Stock material or miscellaneous articles
  • Y10T428/14—Layer or component removable to expose adhesive
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T428/00—Stock material or miscellaneous articles
  • Y10T428/14—Layer or component removable to expose adhesive
  • Y10T428/1462—Polymer derived from material having at least one acrylic or alkacrylic group or the nitrile or amide derivative thereof [e.g., acrylamide, acrylate ester, etc.]
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T428/00—Stock material or miscellaneous articles
  • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
  • Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
  • Y10T428/24364—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.] with transparent or protective coating
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T428/00—Stock material or miscellaneous articles
  • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
  • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
  • Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T428/00—Stock material or miscellaneous articles
  • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T428/00—Stock material or miscellaneous articles
  • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
  • Y10T428/2809—Web or sheet containing structurally defined element or component and having an adhesive outermost layer including irradiated or wave energy treated component
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T428/00—Stock material or miscellaneous articles
  • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
  • Y10T428/2852—Adhesive compositions

Definitions

• the present invention relates to an adhesive tape that is provided with a removable adhesive agent layer on one side of a base film.
• An assembling process of a semiconductor device comprises the steps of: cutting and separating (dicing) a semiconductor wafer and the like into respective chips, after patterning; mounting the chips on a substrate or the like; and sealing them with a resin or the like.
• a semiconductor wafer is adhered and fixed by an adhesive tape in advance, and then it is diced along a chip shape.
• the chip is peeled off (picked up) from the adhesive tape and then fixed on a substrate or the like with an adhesive agent for adhering and fixing.
• the tapes used for the above purposes include a usual pressure-sensitive adhesive-type tape, and a tape having a reduced adhesive force when it is hardened or cured by radiation, such as ultraviolet (UV) rays, electronic rays, and the like. Both of these types of tapes are required to have sufficient adhesive force so that the tape is not peeled off from the wafer upon dicing, and they are also required to have peeling capability to be easily peeled off from the wafer upon picking up.
• UV ultraviolet
• These adhesive tapes enable a so-called direct die bonding for, after dicing, picking up a chip with a removable adhesive layer adhered on the rear side of the chip, mounting the chip on a substrate or the like, and curing and adhering the chip by heating or the like.
• the coating process of an adhesive can be omitted.
• the removable adhesion agent or adhesive agent used for these adhesive tapes is in a coating liquid state with low viscosity and low wettability to a tape base, and thus it has the problem of poor yield. Further, the above adhesion or adhesive agent is low in adhesion strength, compared with an existing adhesive or bonding agent for die bonding. Thus it is difficult to obtain reliability from the above adhesion or adhesive agent.
• the laminate-type tape As means to obtain adhesion reliability and provide dicing performance, it is proposed to use a laminate of a die bonding adhesive layer and a dicing tape.
• this laminate-type tape has the problem that it is difficult to control the peeling ability between the adhesive and the dicing tape.
• a die bonding adhesive with high adhesion reliability generally requires heat adhesion upon temporarily fixing it to a wafer.
• the laminate-type tape has the problem of increase of peeling ability between the dicing tape and the die-bonding-sheet adhesive layer due to such a heat adhesion, thereby causing a raise of the pickup failure ratio after the dicing.
• a die bond sheet is heat-adhered to a wafer in-advance, and a dicing tape is laminated to the die bonding adhesive layer adhered to the wafer, before use.
• a surface protective tape for back-grinding is usually bonded to a side of the wafer on which no die bonding sheet or dicing tape is bonded.
• the heating temperature is generally about 40° C. or more, for example, about 60° C. Similarly to the above, this causes the problem of increased peeling force between the die bonding adhesive layer and the dicing tape.
• the present invention resides in a wafer-adhering adhesive tape, which has a radiation-curable removable adhesive layer on a surface of a base, wherein the radiation-curable removable adhesive layer is mainly composed of an acrylic-series copolymer having, in a principal chain, at least a radiation-curable carbon-carbon double bond containing group, a hydroxyl group, and a group containing a carboxyl group, respectively, and the radiation-curable removable adhesive layer has a gel fraction of 60% or greater.
• the present invention resides in a wafer-adhering adhesive tape, which has a radiation-curable removable adhesive layer and a die-bonding adhesive layer, in this order, on a surface of a base, wherein the radiation-curable removable adhesive layer is mainly composed of an acrylic-series copolymer having, in a principal chain, at least a radiation-curable carbon-carbon double bond containing group, a hydroxyl group, and a group containing a carboxyl group, respectively, and the radiation-curable removable adhesive layer has a gel fraction of 60% or greater.
• the term “being mainly composed of” means that a main component of a removable adhesive component in the radiation-curable removable adhesive layer, which layer is comprised of the removable adhesive component, a hardening agent and a polymerization initiator, is the acrylic-series copolymer having a carbon-carbon double bond containing group, a hydroxyl group, and a carboxyl group, respectively.
• 60% by mass or more of the radiation-curable removable adhesive layer is generally composed of the acrylic-series copolymer having a carbon-carbon double bond containing group, a hydroxyl group, and a carboxyl group, respectively.
• the “removable adhesive” means an agent capable of adhering and being removed after treatment such as curing, while an “adhesive” means an agent capable of adhering only.
• the “radiation-curable removable adhesive” means a removable adhesive capable of being removed or pealed off by hardening by irradiation of radiation such as UV, after application of the removable adhesive to a wafer and the like.
• an adhesive tape that comprises an adhesive or adhesion composition, which is mainly composed of an acrylic-series polymer having at least a radiation-curable carbon-carbon double bond containing group, a hydroxyl group, and a group containing a carboxyl group, respectively, in a principal chain, and which composition has a gel fraction of 60% or greater; and, if necessary, further laminating a die-bonding adhesive layer with the above adhesive tape.
• an adhesive tape that comprises an adhesive or adhesion composition, which is mainly composed of an acrylic-series polymer having at least a radiation-curable carbon-carbon double bond containing group, a hydroxyl group, and a group containing a carboxyl group, respectively, in a principal chain, and which composition has a gel fraction of 60% or greater; and, if necessary, further laminating a die-bonding adhesive layer with the above adhesive tape.
• the present invention has been accomplished based on this finding.
• the wafer adhering adhesive tape of the present invention can be made by forming a radiation curable removable adhesive layer on a base surface, in which the removable adhesive layer is mainly composed of the acrylic-series copolymer having at least a radiation curable carbon-carbon double bond containing group, a hydroxyl group and a carboxyl group-containing group, respectively, in the principal chain, and in which the adhesive layer has a gel fraction of 60% or greater.
• a die-bonding adhesive layer may be form on the base surface, and it is preferred to form the radiation curable removable adhesive layer and the die-bonding adhesive layer, in order, on the base surface.
• the acrylic-series copolymer (hereinafter, referred to as “acrylic copolymer (A)”) having at least a radiation curable carbon-carbon double bond containing group, a hydroxyl group, and a group containing a carboxyl group, respectively, in the principal chain, which copolymer can be used in the present invention, may be any one prepared by any manner.
• the acrylic copolymer (A) can be obtained, by subjecting a copolymer (A1), which comprises a (meth)acrylic acid ester, a hydroxyl group-containing unsaturated compound, a carboxyl group-containing unsaturated compound, and the like, to addition reaction with a compound (A2) that has a functional group addition-reactive to a functional group in the copolymer (A1) and that has a carbon-carbon double bond, in which a carbon chain of the copolymer (A1) is to be a principal chain.
• a copolymer (A1) which comprises a (meth)acrylic acid ester, a hydroxyl group-containing unsaturated compound, a carboxyl group-containing unsaturated compound, and the like.
• a compound (A2) that has a functional group addition-reactive to a functional group in the copolymer (A1) and that has a carbon-carbon double bond, in which a carbon chain of the copolymer (A1) is to be
• the (meth)acrylic acid ester included are, for example, hexyl acrylate, n-octyl acrylate, isooctyl acrylate, 2-ethylhexyl acrylate, dodecyl acrylate, decyl acrylate, each having 6 to 12 carbon atoms, or monomers having 5 or less carbon atoms, such as pentyl acrylate, n-butyl acrylate, isobutyl acrylate, ethyl acrylate, and methyl acrylate, or methacrylates like these.
• the glass transition temperature becomes lower, thereby enabling manufacture of monomers of a desired transition temperature.
• a low molecular compound having a carbon-carbon double bond such as vinyl acetate, styrene, and acrylonitrile, can be blended within the range of 5% by mass or less.
• hydroxyl group-containing unsaturated compound examples include 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl acrylate, 2-hydroxypropyl methacrylate, and the like.
• carboxyl group-containing unsaturated compound examples include acrylic acid, methacrylic acid, and the like.
• the functional group in the above-described compound (A2) having an addition reactive functional group and a carbon-carbon double bond in a case that the functional group in the copolymer (A1) is a carboxyl group or a cyclic acid anhydride group, included are a hydroxyl group, an epoxy group, an isocyanato group, and the like; or in a case that the functional group in the copolymer (A1) is a hydroxyl group, included are a cyclic acid anhydride group, an isocyanato group, and the like; or in a case that the functional group in the copolymer (A1) is an amino group, included is an isocyanato group, and the like.
• the compound (A2) include acrylic acid, methacrylic acid, cinnamic acid, itaconic acid, fumaric acid, phthalic acid, 2-hydroxyalkyl acrylates, 2-hydroxyalkyl methacrylates, glycol monoacrylates, glycol monomethacrylates, N-methylol acrylamide, N-methylol methacrylamide, allyl alcohol, N-alkylaminoethyl acrylates, N-alkylaminoethyl methacrylates, acrylamides, methacrylamides, maleic anhydride, itaconic anhydride, fumaric anhydride, phthalic anhydride, glycidyl acrylate, glycidyl methacrylate, allyl glycidyl ether, and polyisocyanate compounds in which isocyanato groups are partially urethanated with a monomer having a hydroxyl group or carboxyl group and a photopolymerizable carbon-carbon double bond.
• a ketone-series, ester-series, alcohol-series, or aromatic-series solvent can be used as an organic solvent.
• a preferable solvent is a usual good solvent for an acrylic-series polymer, which solvent has a boiling point of 60 to 120° C.
• the preferable solvent include toluene, ethyl acetate, isopropyl alcohol, benzene methylcellosolve, ethylcellosolve, acetone, methyl ethyl ketone, and the like.
• a polymerization initiator use may be generally made of a radical generating agent of azobis-series, such as ⁇ , ⁇ ′-azobisisobutyronitrile, and organic peroxide-series, such as benzoylperoxide.
• a catalyst a polymerization inhibitor can be optionally added, if necessary.
• an acrylic-series copolymer (A) with a desired molecular weight, by controlling a polymerization temperature and a polymerization time, and then carrying out an addition reaction at a functional group.
• the control of the molecular weight it is preferred to use a mercaptan-series or carbon tetrachloride-series solvent.
• this copolymerization is not limited to a solution polymerization, but it may also be performed in other ways such as bulk polymerization, suspension polymerization, and the like.
• the acrylic-series copolymer (A) can be obtained.
• the mass average molecular weight of the acrylic-series copolymer (A) is preferably about 300,000 to about 1,000,000. If the molecular weight is too small, the cohesive force by irradiation of a radiation becomes lesser, thus a misalignment of elements (chips) may occur easily upon dicing the wafer, and image recognition may be difficult. Further, to prevent this misalignment of elements as much as possible, it is preferable that the molecular weight is 400,000 or more. If the molecular weight is too large, there is a possibility of gelation upon synthesis and coating.
• the molecular weight in the present invention means a mass average molecular weight in terms of polystyrene.
• an amount to be introduced of a photopolymerizable carbon-carbon double bond in the acrylic-series copolymer (A) may be varied according, for example, to use conditions thereof such as a UV irradiation amount and the like, and it is not limited, as long as it reaches an amount to give the effect of sufficiently lowering the adhesive force after radiation curing.
• the amount of the photopolymerizable carbon-carbon double bond to be introduced is preferably 0.5 to 2.0 meq/g, more preferably 0.8 to 1.5 meq/g. If the double bond amount is too small, the effect of reducing the adhesive ability after irradiation of a radiation becomes smaller.
• the acrylic-series copolymer (A) itself may be insufficient in stability and may be made difficult to manufacture.
• the gel fraction of the radiation-curable removable adhesive layer can be controlled by the average molecular weight of the acrylic-series copolymer (A) and the amount of the hardening agent to be blended.
• the gel fraction is 60% or greater, and more preferably 80% or greater. If the gel fraction is too small, the removable adhesive component may be slightly moved on the contact interface, thus making it difficult to obtain stability on the peeling force with the lapse of time.
• the acrylic-series copolymer (A) has a hydroxyl group and a carboxyl group-containing group, each of which is unreacted, in the principal chain. It is preferable that the acrylic-series copolymer (A) has a hydroxyl group so that a hydroxyl group value is from 5 to 10, more preferably from 20 to 70, since the adhesive ability after irradiation of a radiation is reduced, to thus further decrease the risk of picking-up mistakes. Further, it is preferable that the acrylic-series copolymer (A) has a carboxyl group so that an acid value is from 0.5 to 30, since the tape recovery (restoration) ability is improved, to thus make it easy to cope with a tape housing-type mechanism for a used tape.
• the acid value is more preferably 1 to 10.
• the hydroxyl group value of the acrylic-series copolymer (A) is too low, the adhesive ability after irradiation of a radiation is not sufficiently reduced, or if too high, the flowability of the removable adhesive after irradiation of a radiation is damaged. Further, if the acid value is too low, the tape recovery ability is not sufficiently improved, or if too high, the flowability of the removable adhesive is damaged.
• a photo polymerization initiator such as isopropyl benzoin ether, isobutyl benzoin ether, benzophenone, Michler's ketone, chlorothioxanthone, dodecyl thioxanthone, dimethyl thioxanthone, diethyl thioxanthone, benzyl dimethyl ketal, ⁇ -hydroxycyclohexyl phenyl ketone, 2-hydroxymethylphenylpropane, and the like.
• the amount of the photo polymerization initiator to be blended is preferably 0.01 to 5 mass parts, to 100 mass parts of the acrylic-series polymer.
• the radiation curable removable adhesive layer may contain, if necessary, another additional component including, for example, a hardening agent such as a polyisocyanate compound and the like.
• a hardening agent such as a polyisocyanate compound and the like.
• the amount of the hardening agent to be blended is preferably 0.5 to 10 mass parts, to 100 mass parts of the acrylic-series polymer that is the main component.
• the thickness of the radiation-curable removable adhesive layer is preferably 5 to 50 ⁇ m.
• the base that can be used in the present invention may be a film of any material having a radiation transmission ability.
• the film include those made, for example, of a homopolymer or copolymer of an ⁇ -olefin, such as polyethylene, polypropylene, an ethylene/propylene copolymer, polybuten, an ethylene/vinyl acetate copolymer, an ethylene/acrylate copolymer, or an ionomer; an engineering plastic, such as polyethylene terephthalates, a polycarbonate, or poly(methyl methacrylate); or a thermoplastic elastomer, such as polyurethane, styrene/ethylene/buten, or a penten-series copolymer.
• a mixture or double or higher layer of two or more kinds selected from the above compound group may be used.
• the thickness of the base film to be used is preferably 50 to 200 ⁇ m.
• the wafer-adhering adhesive tape By laminating the thus-obtained adhesive tape and a die-bonding adhesive, it is possible to make the wafer-adhering adhesive tape with higher performance.
• the die-bonding adhesive an acrylic/epoxy-series die bonding adhesive or the like can be used.
• the removable adhesive layer By heat adhering the wafer-adhering adhesive tape to a semiconductor wafer, sufficient adhesive ability is obtained in the dicing step so not to peel off or remove the wafer, the die-bonding adhesive layer, the radiation-curable removable adhesive layer, and the base film each other.
• the removable adhesive layer can be easily peeled off from chips attached to the die-bonding adhesive layer via radiation hardening.
• the peeling force of the die-bonding adhesive layer and the radiation-curable removable adhesive layer upon dicing is preferably 0.5 to 10 N/25 mm, and the peeling force between the chip attached to the die-bonding adhesive layer and the tape attached with the removable adhesive layer after irradiation of a radiation is preferably 0.5 to 0.05 N/25 mm.
• the radiation curable removable adhesive layer and the die-bonding adhesive layer are formed on the surface of a base, in this order from the base side.
• a bonding adhesive gent which is usually used for die-bonding, such as a film-like bonding adhesive mainly composed of an epoxy resin, can be used.
• the thickness of the die-bonding adhesive layer is preferably 5 to 50 ⁇ m.
• the wafer-adhering adhesive tape of the present invention has sufficient adhesive ability that the radiation-curable removable adhesive layer is not peeled off from a die-bonding adhesive layer and a wafer, when dicing; it allows easy removal of the removable adhesive layer and a chip attached to the die-bonding adhesive layer by radiation and hardening, when picking up; and it gives sufficient adhesive ability between the resultant chip and a substrate or the like, when mounting; thereby it enables a so-called direct die bonding
• the wafer-adhering adhesive tape of the present invention can be used as a dicing tape upon dicing, and it can be used with the adhesive layer easily peeled off upon mounting, thereby to enable a direct die-bonding, and the wafer-adhering adhesive tape is excellent in storage stability.
• the wafer-adhering adhesive tape of the present invention can be preferably used as the above dicing tape.
• an interval between elements is sufficiently made after stretching, while obtaining the effects of reducing adhesive force after radiation hardening.
• a copolymer was prepared by solution radical polymerization of 65 mass parts of butyl acrylate, 25 mass parts of 2-hydroxyethyl acrylate, and 10 mass parts of acrylic acid, as raw materials. Then, to the thus-obtained copolymer, 2-isocyanatethyl methacrylate was added dropwise and reacted therewith, to prepare a copolymer A. In this manner, the amount of 2-isocyanatethyl methacrylate to be added dropwise and the reaction time of the solution radical polymerization are properly adjusted, to prepare copolymers A1 to A5, respectively, which were different in carbon-carbon double bond amounts and molecular weights.
• a polyisocyanate compound (trade name: Coronet L, produced by Japan Polyurethane) as a hardening agent, and ⁇ -hydroxycyclohexyl phenyl ketone as a photo polymerization initiator were admixed in a mixing ratio, as shown in the following Table 1, to thereby obtain a radiation-curable removable adhesive, respectively.
• Each of the removable adhesives was coated on a high-density polyethylene resin film (100 ⁇ m) such that the removable adhesive thickness after drying would be 10 ⁇ m, to prepare an adhesive tape, respectively.
• Each of these adhesive tapes and a film-like adhesive (for die bonding) mainly composed of an epoxy resin with 25- ⁇ m thickness were laminated at a room temperature, to prepare respective wafer-adhering adhesive tapes of Examples 1 to 4 and Comparative Example 1, as shown in Table 1.
• the amount of carbon-carbon double bond contained in about 10 g of the heated and dried removable adhesive was measured and quantitatively determined by a mass increasing method by bromine addition reaction in a dark place in vacuo.
• the above-prepared wafer-adhering adhesive tape was heat adhered to a wafer for 10 seconds at 80° C., then a silicon wafer of a diameter of 5 inches was full-cut into a size of 3 mm ⁇ 3 mm, and the thus-cut wafer was subjected to ultraviolet-radiation hardening (irradiation not on a pattern shape but on the entire wafer). Then, the resultant wafer was stretched in a wafer expanding machine (air pressure: 2.0 kg/cm 2 ), and the lengths of element intervals in longitudinal and transverse directions upon being stretched were measured, to estimate the average values.
• the lengths of element intervals included a blade thickness of 40 ⁇ m upon dicing.
• the expandability is evaluated as below, based on the size (q) of element interval.
• the above-prepared wafer-adhering adhesive tape was heat adhered to a wafer for 10 seconds at 80° C., and then diced-to 10 mm ⁇ 10 mm. Afterwards, ultraviolet rays of 200 mJ/cm 2 were irradiated to the removable adhesive layer by an air-cooling-type high-pressure mercury lamp (80 W/cm, irradiation distance: 10 cm). Then a picking-up test was carried out by a die bonder machine (produced by NEC Machinery, trade name: CPS-100 FM), to obtain a picking-up success ratio at 100 picked-up chips.
• a die bonder machine produced by NEC Machinery, trade name: CPS-100 FM
• Peeling ability before and after UV irradiation were measured according to JIS Z0237 (UV irradiation amount: 1000 mJ/cm 2 ).
• the wafer-adhering adhesive tape was heat adhered to a mirror surface of a silicon wafer heated to 80° C., and then the peeling force between the die-bonding adhesive layer and the adhesive tape was measured. The test was carried out under the conditions of a peeling angle of 90° and a peeling speed of 50 mm/min.
• the above-prepared wafer-adhering adhesive tape was heat adhered to a wafer for 10 seconds at 80° C., and diced to 10 mm ⁇ 10 mm. Afterwards, ultraviolet rays of 200 mJ/cm 2 were irradiated to the removable adhesive layer by an air-cooling-type high-pressure mercury lamp (80 W/cm, irradiation distance: 10 cm). Then, after the thus-irradiated wafer-adhering adhesive tape was stood for 2 weeks under room temperature conditions (25° C., 60% RH), the picking-up success ratio was obtained. Storage stability is evaluated and shown with this picking-up success ratio (%).
• Examples 1 to 3 according to the present invention showed that, in addition to that both of the picking-up success ratio and the storage stability were each 100%, the expandability was also good. Further, Example 4 indicated that the element interval upon expansion was slightly poor, but the picking-up success ratio and the storage stability were each 100%. Contrary to these, Comparative Example 1 showed that the storage stability was conspicuously poor.
• the wafer-adhering adhesive tape of the present invention can be used as a dicing tape upon dicing, and it can be used with the adhesive layer easily peeled off upon mounting, to thereby enable a direct die-bonding, and that the inventive wafer-adhering adhesive tape is excellent in storage stability.
• an example of the wafer-adhering adhesive tape in which the ratio of a carbon-carbon double bond contained in the radiation-curable removable adhesive layer was too low, was prepared and tested in the same manner as Example 1, excepted that the ratio of carbon-carbon double bond was changed to 0.3 meq/g.
• the picking-up success ratio obtained in this example was 25%.
• the peeling forces before and after UV irradiation were 1.42 N/25 mm and 0.4 N/25 mm, respectively.
• the removable adhesive same as that in Example 1 was coated on a high-density polyethylene resin film (thickness: 100 ⁇ m) such that the adhesive thickness after drying would be 10 ⁇ m, to prepare an adhesive tape.
• a silicon wafer of 5-inch diameter, on which a surface protective tape for grinding was attached was provided.
• a film-like adhesive (for die bonding) with 25- ⁇ m thickness was heat adhered for 10 seconds at 80° C.
• the above-prepared adhesive tape was attached to a (die-bonding) adhesive layer attached to the wafer.
• the resultant silicon wafer adhered with the adhesive tape was subjected to heat treatment for 100 seconds at 60° C., to peel off the surface protective tape from the wafer.
• this silicon wafer was full-cut into a size of 3 mm ⁇ 3 mm, UV-irradiation hardened, and expanded, and then subjected to the picking-up test. As a result, good expandability and picking-up property, as in Example 1, were exhibited. Further, it was found that the storage stability of the adhesive tape was also good.
• the adhesive tape of the present invention can also be preferably used.
• the wafer-adhering adhesive tape of the present invention is preferable, for example, as a semiconductor wafer-adhering adhesive tape that is used in an adhering process for fixing a wafer or the like, dicing it, and lap-jointing it with a substrate or a semiconductor chip, when a semiconductor device, such as a silicon wafer or the like, is manufactured.

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• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• General Physics & Mathematics (AREA)
• Manufacturing & Machinery (AREA)
• Computer Hardware Design (AREA)
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• 2004
  • 2004-02-03 WO PCT/JP2004/001038 patent/WO2004069951A1/ja not_active Application Discontinuation
  • 2004-02-03 EP EP04707652A patent/EP1591504B1/en not_active Expired - Lifetime
  • 2004-02-03 KR KR1020057014333A patent/KR101170845B1/ko active IP Right Grant
  • 2004-02-03 CN CNB2004800035062A patent/CN100358962C/zh not_active Expired - Lifetime
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• 2005
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