US20050236739A1 - Step and flash imprint lithography - Google Patents

Step and flash imprint lithography Download PDF

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Publication number
US20050236739A1
US20050236739A1 US11/062,420 US6242005A US2005236739A1 US 20050236739 A1 US20050236739 A1 US 20050236739A1 US 6242005 A US6242005 A US 6242005A US 2005236739 A1 US2005236739 A1 US 2005236739A1
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composition
polymerizable
mold
recited
further includes
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US11/062,420
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Carlton Willson
Matthew Colburn
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University of Texas System
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University of Texas System
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Priority to US09/266,663 priority Critical patent/US6334960B1/en
Priority to US09/908,765 priority patent/US6719915B2/en
Priority to US80605104A priority
Priority to US97828504A priority
Application filed by University of Texas System filed Critical University of Texas System
Priority to US11/062,420 priority patent/US20050236739A1/en
Assigned to BOARD OF REGENTS, THE UNIVERSITY OF TEXAS SYSTEM reassignment BOARD OF REGENTS, THE UNIVERSITY OF TEXAS SYSTEM ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: COLBURN, MATTHEW E, WILLSON, CARLTON GRANT
Publication of US20050236739A1 publication Critical patent/US20050236739A1/en
Application status is Abandoned legal-status Critical

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/003Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor characterised by the choice of material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00Manufacture or treatment of nanostructures
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • B29C2043/023Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves
    • B29C2043/025Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves forming a microstructure, i.e. fine patterning
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061Etching masks
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00Nanotechnology
    • Y10S977/84Manufacture, treatment, or detection of nanostructure
    • Y10S977/887Nanoimprint lithography, i.e. nanostamp
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00Nanotechnology
    • Y10S977/84Manufacture, treatment, or detection of nanostructure
    • Y10S977/895Manufacture, treatment, or detection of nanostructure having step or means utilizing chemical property
    • Y10S977/896Chemical synthesis, e.g. chemical bonding or breaking
    • Y10S977/897Polymerization

Abstract

A method of forming a relief image in a structure comprising a substrate and a transfer layer formed thereon comprises covering the transfer layer with a polymerizable fluid composition, and then contacting the polymerizable fluid composition with a mold having a relief structure formed therein such that the polymerizable fluid composition fills the relief structure in the mold. The polymerizable fluid composition is subjected to conditions to polymerize polymerizable fluid composition and form a solidified polymeric material therefrom on the transfer layer. The mold is then separated from the solid polymeric material such that a replica of the relief structure in the mold is formed in the solidified polymeric material; and the transfer layer and the solidified polymeric material are subjected to an environment to selectively etch the transfer layer relative to the solidified polymeric material such that a relief image is formed in the transfer layer.

Description

    CROSS-REFERENCE TO RELATED APPLICATIONS
  • The present application is a continuation of U.S. patent application Ser. No. 10/978,285, filed Oct. 29, 2004, which is a continuation of U.S. patent application Ser. No. 10/806,051, filed Mar. 22, 2004, which is a divisional application of U.S. patent application Ser. No. 09/908,765, now U.S. Pat. No. 6,719,915, which is a continuation patent application of U.S. patent application Ser. No. 09/266,663, now U.S. Pat. No. 6,334,960, all having Carlton Grant Willson and Matthew Earl Colburn listed as inventors.
  • STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT
  • The U.S. Government has a paid-up license in this invention and the right in limited circumstances to require the patent owner to license others on reasonable terms as provided for by the terms of MDA-972-97-3-0007 awarded by the Defense Advanced Research Projects Agency (DARPA).
  • FIELD OF THE INVENTION
  • The invention generally relates to using lithography techniques in fabricating various microstructures.
  • BACKGROUND OF THE INVENTION
  • There is currently a strong trend toward fabricating small structures and downsizing existing structures, which is commonly referred to as microfabrication. One area in which microfabrication has had a sizeable impact is in the microelectronic area. In particular, the downsizing of microelectronic structures has generally allowed the structures to be less expensive, have higher performance, exhibit reduced power consumption, and contain more components for a given dimension relative to conventional electronic devices. Although microfabrication has been widely active in the electronics industry, it has also been applied to other applications, such as biotechnology, optics, mechanical systems, sensing devices, and reactors.
  • Lithographic techniques are often employed in device microfabrication. See S. Wolf et al., Silicon Processing for the VLSI Era, Volume 1-Process Technology, (1986), pp. 407-413. Using microcircuit fabrication as an example, photoresist materials are applied to a substrate. Next, the resist layer is selectively exposed to a form of radiation. An exposure tool and mask are often used to affect the desired selective exposure. Patterns in the resist are formed when the substrate undergoes a subsequent “developing” step. The areas of resist remaining after development protect the substrate regions which they cover. Locations from which resist has been removed can be subjected to a variety of additive (e.g., lift-off) or subtractive (e.g., etching) processes that transfer the pattern onto the substrate surface.
  • There is a current move toward developing photolithography techniques that may allow for forming microscale devices with small features. Whiteside et al., Agnew. Chem. Int. Ed., 1998, 37, pp. 550-575 propose various techniques. One proposed technique involves the self-assembly of monolayers. Self-assembled monolayers (SAMs) typically form spontaneously by chemisorption and self-organization of functionalized, long-chain organic molecules onto the surfaces of appropriate substrates. SAMs are usually prepared by immersing a substrate in a solution containing a ligand that is reactive toward the surface, or by exposing the substrate to a vapor of the reactive species. The self-assembly of monolayers is potentially advantageous in that ordered structures may form rapidly.
  • An imprint lithography process that teaches producing nanostructures with 10 nm feature sizes is proposed by Chou et al., Microelectronic Engineering, 35, (1995), pp. 237-240. In particular, Chou et al. teach pressing a mold having nanostructures formed therein into a thin resist cast that is present on the surface of a substrate. The resist cast is designed to conform to the mold shape. The mold is then removed from the resist cast and the substrate having the resist cast present thereon is etched such that the mold pattern is transferred to the substrate.
  • Chou et al. teach using (poly)methyl methacrylate for the resist cast. The use of this material, however, may be disadvantageous in that it is potentially difficult to form some structures in varying pattern densities. Moreover, it is perceived that the etch selectivity may be potentially undesirable for common microelectronic device processing.
  • In view of the above, there is a need in the art for an imprint lithography process that allows for the formation of nanostructures having high resolution for a wide range of pattern densities. It would be particularly desirable if the nanostructures could be formed in a more efficient manner relative to prior art processes.
  • SUMMARY OF THE INVENTION
  • The present invention addresses the potential problems of the prior art, and in one aspect provides a method of forming a relief image in a structure that comprises a substrate and a transfer layer formed thereon. The method applies to forming structures with nanoscale patterns. The method comprises covering the transfer layer with a polymerizable fluid composition; contacting the polymerizable fluid composition with a mold having a relief structure formed therein such that the polymerizable fluid composition fills the relief structure in the mold; subjecting the polymerizable fluid composition to conditions to polymerize the polymerizable fluid composition and to form a solidified polymeric material therefrom on the transfer layer; separating the mold from the solidified polymeric material such that a replica of the relief structure in the mold is formed in the solidified polymeric material; and finally subjecting the transfer layer and the solidified polymeric material to an environment that allows for the selective etching of the transfer layer relative to the solidified polymeric material such that a relief image is formed in the transfer layer.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIGS. 1A through 1D illustrate a method for forming a relief structure in a substrate in accordance with the invention.
  • DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • The present invention now will be described more fully hereinafter with reference to the accompanying drawings and specification in which preferred embodiments of the invention are shown. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. In the drawings, the thickness of layers and regions are exaggerated for clarity. Like numbers refer to like elements throughout. It will also be understood that when a layer is referred to as being “on” another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may also be present.
  • In one aspect, the invention relates to at least one method of forming a relief image in a structure comprising a substrate and a transfer layer formed thereon. The method comprises covering the transfer layer with a polymerizable fluid composition. The polymerizable fluid composition is then contacted by a mold having a relief structure formed therein such that the polymerizable fluid composition fills the relief structures in the mold. The polymerizable fluid composition is then subjected to conditions so as to polymerize the polymerizable fluid composition and to form a solidified polymeric material therefrom on the transfer layer. Stated differently, the polymerizable fluid composition becomes chemically crosslinked or cured so as to form a thermoset material (i.e., solidified polymeric material). The mold is then separated from the solidified polymeric material such that a replica of the relief structure in the mold is formed in the solidified polymeric material. The transfer layer and the solidified polymeric material are then subjected to an environment such that the transfer layer is selectively etched relative to the solidified polymeric material. As a result, a relief image is formed in the transfer layer. The method of the invention is advantageous in that a number of devices may be fabricated therefrom utilizing processes known to one skilled in the art, such as, but not limited to, microelectronic devices, information storage devices, printed wiring boards, flat panel displays, micromachines, and charge couple devices.
  • The substrate used in the above invention may comprise a number of different materials, such as, but not limited to, silicon, plastics, gallium arsenide, mercury telluride, and composites thereof. The transfer layers are formed from materials known in the art, such as, for example, thermoset polymers, thermoplastic polymers, polyepoxies, polyamides, polyurethanes, polycarbonates, polyesters, and combinations thereof. The transfer layer is fabricated in such a manner so as to possess a continuous, smooth, relatively defect-free surface that may exhibit excellent adhesion to the polymerizable fluid. As appreciated by one skilled in the art, the term “transfer layer” refers to a layer containing material that may be etched so as to transfer an image to the underlying substrate from the polymerizable fluid composition as described in detail herein.
  • The polymerizable fluid composition that is polymerized and solidified in accordance with the methods of the invention typically comprises a polymerizable material, a diluent, and other materials employed in polymerizable fluids, such as, but not limited to, to initiators and other materials. Polymerizable (or crosslinkable) materials which may be used in the methods of the invention preferably encompass various silicon-containing materials that are often present themselves in the forms of polymers. The silicon-containing materials include, but are not limited to, silanes, silyl ethers, silyl esters, functionalized siloxanes, silsesquioxanes, and mixtures thereof. Silicon-containing materials which are employed preferably are organosilicons. The silicon-containing materials preferably contain the element silicon in an amount greater than about 8 percent based on the weight of the polymerizable fluid composition, and more preferably greater than about 10 weight percent.
  • The polymers which may be present in the polymerizable fluid composition preferably include various reactive pendant groups. Examples of pendant groups include, but are not limited to, epoxy groups, ketene acetyl groups, acrylate groups, methacrylate groups, and combinations of the above. Although not wishing to be bound by any theory, it is believed that the polymerizable fluid composition may react accordingly to a variety of reaction mechanisms, such as, but not limited to, acid catalysis, free radical catalysis, or 2+2 photocycloaddition.
  • The mold used in the methods of the invention may be formed from various conventional methods. Typically, the materials are selected such that the mold is transparent which allows the polymerizable fluid composition covered by the mold to be exposed to an external radiation source. For example, the mold may comprise materials, such as, but not limited to, quartz, silicon, organic polymers, siloxanes polymers, borosilicate glass, fluorocarbon polymers, metal, and combinations of the above. Preferably, the mold comprises quartz. To facilitate release of the mold from the solid polymeric material, the mold may be treated with a surface modifying agent. Surface modifying agents which may be employed include those which are known in the art. An example of a surface modifying agent is a fluorocarbon silylating agent. These surface modifying agents or release materials my be applied, for example, from plasma sources, a Chemical Vapor Deposition method (CVD), such as analogs of paralene, or a treatment involving a solution.
  • It should be appreciated that one skilled in the art may select the substrate, the mold, the polymerizable fluid composition, the surface modifying agent, as well as any other materials, such that the method of the invention optimally functions according to the specific needs of the end user.
  • The methods of the invention will now be described in greater detail to the accompanying drawings in which a preferred embodiment of the invention is shown. FIG. 1A illustrates a step-by-step sequence for carrying out the method of the invention. A structure 30 is present which includes a substrate 10 having a transfer layer 20 positioned thereon. As shown, a mold 40 is aligned over transfer layer 20 such that a gap 50 is formed between mold 40 and transfer layer 20. Mold 40 has a nanoscale relief structure formed therein having an aspect ratio preferably ranging from about 0.1 to about 10, and more preferably from about 0.5 to about 2. Specifically, the relief structures in mold 40 preferably have a width w1 ranging from about 10 nm to about 5000 μm. The relief structures are separated from each other by a distance d1, preferably ranging from about 10 nm to about 5000 μm.
  • A polymerizable fluid composition 60 then contacts transfer layer 20 and mold 40 so as to fill gap 50 therebetween, as shown in FIG. 1B. Polymerizable fluid composition 60 may have a low viscosity such that it may fill gap 50 in an efficient manner. Preferably, the viscosity of polymerizable fluid composition 60 ranges from about 0.01 cps to about 1000 cps measured at 25° C., and more preferably from about 0.01 cps to about 1 cps measured at this same temperature.
  • Referring now to FIG. 1C, mold 40 is then moved closer to transfer layer 20 to expel excess polymerizable fluid composition 60 such that edges 41 a through 41 f of mold 40 come into contact with transfer layer 20. Polymerizable fluid composition 60 is then exposed to conditions to sufficiently polymerize the fluid. Preferably, polymerizable fluid composition 60 is exposed to radiation sufficient to polymerize the fluid composition and to form a solidified polymeric material, represented by 70 in FIG. 1C. More specifically, polymerizable fluid composition 60 is exposed to ultraviolet light, although other means for polymerizing the fluid may be employed, such as, for example, heat or other forms of radiation. The selection of a method of initiating the polymerization of the fluid composition is known to one skilled in the art, and typically depends on the specific application which is desired.
  • Mold 40 then leaves solidified polymeric material 70 on transfer layer 20, as shown in FIG. 1D. Transfer layer 20 is then selectively etched relative to solidified polymeric material 70 such that a relief image 80 corresponding to the image in mold 40 is formed in transfer layer 20. The etching step is depicted in FIG. 1C. The etching selectivity of transfer layer 20 relative to solidified polymeric material 70 preferably ranges from about 1.5 to about 100. As an example, the selective etching or the ion milling may be carried out by subjecting transfer layer 20 and solidified polymeric material 70 to an environment, such as, but not limited to, an argon ion stream, an oxygen-containing plasma, a reactive ion etching gas, a halogen-containing gas, a sulfur dioxide-containing gas, and combinations of the above.
  • Residual material, denoted as 90, which may be in the form of (1) a portion of polymerizable fluid composition 60; (2) a portion of solidified polymeric material 70; or (3) combinations of (1) and (2) might be present in the gaps within in relief image 80. The method of the invention therefore may further comprise the step of subjecting residual material 90 to conditions such that residual material 90 is removed (e.g., a clean-up etch). The clean-up etch may be carried out using known techniques. Additionally, it should be appreciated that this step may be carried out during various stages of the method of the invention. For example, the removal of the residual material may be carried out prior to the step of subjecting the transfer layer and the solidified polymeric material to an environment wherein the transfer layer is selectively etched relative to the solidified polymeric material. Various environments may be employed during the clean-up etch, such as, for example, argon ion milling, fluorine-containing plasma, reactive ion etch gas, and combinations thereof.
  • In the drawings and specification, there have been disclosed typical preferred embodiments of the invention, and although specific terms are employed, they are used in a generic and descriptive sense only and not for the purposes of limitation. The scope of the invention being set forth in the following claims.

Claims (18)

1. A method of forming a layer on a surface, said method comprising:
flowing a polymerizable composition between said surface and a mold in contact with said polymerizable composition by providing said polymerizable composition with a viscosity in a range 0.01 to 100 centipoise at 250 Celsius so that said polymerizable composition conforms to a shape of said mold;
solidifying said polymerizable composition, defining a solidified composition; and
increasing a distance between said solidified composition and said mold.
2. The method as recited in claim 1 wherein flowing further includes providing said polymerizable composition with a viscosity in a range of 1 to 5 centipoise, inclusive, at 25° Celsius.
3. The method as recited in claim 1 wherein flowing further includes applying said polymerizable composition to said surface and placing said mold proximate to said polymerizable fluid composition.
4. The method as recited in claim 1 wherein flowing further includes applying said polymerizable composition to said surface and pressing a side of said mold into said polymerizable fluid composition, with said side including a plurality of trenches, with solidifying further including providing said solidified material with a pattern complementary to a shape of said side.
5. The method as recited in claim 1 wherein flowing further includes applying said polymerizable composition to said surface and pressing a side of said mold into said polymerizable fluid composition, with said side including a plurality of trenches, and solidifying further includes providing said solidified material with a pattern complementary to a shape of said side and further including providing a substrate having a transfer layer disposed thereon, with said transfer layer defining said surface, and transferring said pattern into said transfer layer.
6. The method as recited in claim 5 further including transferring said pattern into said substrate.
7. A method of forming a layer on a surface, said method comprising:
placing a mold proximate to a surface with a polymerizable composition being disposed therebetween, said mold having a side with a plurality of trenches formed therein;
flowing said polymerizable composition between said surface and said mold to have said polymerizable composition fill said trenches conforming to a shape of said side by providing said polymerizable composition with a viscosity in a range 0.01 to 100 centipoise at 250° Celsius;
solidifying said polymerizable composition, defining a solidified composition having a solidified shape complementary to said shape of said side; and
increasing a distance between said solidified composition and said mold.
8. The method as recited in claim 7 wherein flowing further includes providing said polymerizable composition with a viscosity in a range of 1 to 5 centipoise, inclusive, at 25° Celsius.
9. The method as recited in claim 7 wherein flowing further includes applying said polymerizable composition to said surface and pressing said side into said polymerizable fluid composition.
10. The method as recited in claim 7 wherein flowing further includes applying said polymerizable composition to said surface and pressing said side of said mold into said polymerizable fluid composition, and further including providing a substrate having a transfer layer disposed thereon, with said transfer layer defining said surface, and transferring said pattern into said transfer layer.
11. The method as recited in claim 10 further including transferring said pattern into said substrate.
12. A composition, comprising:
a polymerizable material having a viscosity in a range of 0.01 to 100 centipoise at 25° Celsius.
13. The composition as recited in claim 12 wherein said polymerizable material has a viscosity in a range of 1 to 5 centipoise, inclusive, at 25° Celsius.
14. The composition as recited in claim 12 wherein said polymerizable material further includes organosilicons.
15. The composition as recited in claim 12 wherein said polymerizable material further includes silicon-containing material in an amount greater than about 8 to 10 percent by weight.
16. The composition as recited in claim 12 wherein said polymerizable composition further includes silicon-containing materials selected from a set of materials consisting essentially of silanes, silyl ethers, silyl esters, functionalized siloxanes, silsesquioxanes.
17. The composition as recited in claim 12 wherein said polymerizable material further includes components selected from a set consisting essentially of epoxy groups, ketene acetyl groups, acrylate groups and methacrylate groups.
18. The composition as recited in claim 12 wherein said polymerizable material further includes an initiator component to facilitate solidification of said polymerizable material in response to predetermined radiation.
US11/062,420 1999-03-11 2005-02-22 Step and flash imprint lithography Abandoned US20050236739A1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US09/266,663 US6334960B1 (en) 1999-03-11 1999-03-11 Step and flash imprint lithography
US09/908,765 US6719915B2 (en) 1999-03-11 2001-07-19 Step and flash imprint lithography
US80605104A true 2004-03-22 2004-03-22
US97828504A true 2004-10-29 2004-10-29
US11/062,420 US20050236739A1 (en) 1999-03-11 2005-02-22 Step and flash imprint lithography

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/062,420 US20050236739A1 (en) 1999-03-11 2005-02-22 Step and flash imprint lithography
US13/364,101 US20120133078A1 (en) 1999-03-11 2012-02-01 Step and Flash Imprint Lithography

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US97828504A Continuation 2004-10-29 2004-10-29

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US13/364,101 Continuation US20120133078A1 (en) 1999-03-11 2012-02-01 Step and Flash Imprint Lithography

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US20050236739A1 true US20050236739A1 (en) 2005-10-27

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US09/266,663 Expired - Lifetime US6334960B1 (en) 1999-03-11 1999-03-11 Step and flash imprint lithography
US09/908,765 Expired - Lifetime US6719915B2 (en) 1999-03-11 2001-07-19 Step and flash imprint lithography
US11/062,420 Abandoned US20050236739A1 (en) 1999-03-11 2005-02-22 Step and flash imprint lithography
US13/364,101 Abandoned US20120133078A1 (en) 1999-03-11 2012-02-01 Step and Flash Imprint Lithography

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US09/266,663 Expired - Lifetime US6334960B1 (en) 1999-03-11 1999-03-11 Step and flash imprint lithography
US09/908,765 Expired - Lifetime US6719915B2 (en) 1999-03-11 2001-07-19 Step and flash imprint lithography

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US13/364,101 Abandoned US20120133078A1 (en) 1999-03-11 2012-02-01 Step and Flash Imprint Lithography

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EP (1) EP1228401B1 (en)
JP (1) JP2002539604A (en)
AT (1) AT301846T (en)
DE (1) DE60021909T2 (en)
WO (1) WO2000054107A1 (en)

Cited By (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050270312A1 (en) * 2004-06-03 2005-12-08 Molecular Imprints, Inc. Fluid dispensing and drop-on-demand dispensing for nano-scale manufacturing
US20070017631A1 (en) * 2005-07-22 2007-01-25 Molecular Imprints, Inc. Method for adhering materials together
US20070231981A1 (en) * 2006-04-03 2007-10-04 Molecular Imprints, Inc. Patterning a Plurality of Fields on a Substrate to Compensate for Differing Evaporation Times
US7307118B2 (en) * 2004-11-24 2007-12-11 Molecular Imprints, Inc. Composition to reduce adhesion between a conformable region and a mold
US20080174046A1 (en) * 2002-07-11 2008-07-24 Molecular Imprints Inc. Capillary Imprinting Technique
US20080308971A1 (en) * 2007-06-18 2008-12-18 Molecular Imprints, Inc. Solvent-Assisted Layer Formation for Imprint Lithography
US20090014917A1 (en) * 2007-07-10 2009-01-15 Molecular Imprints, Inc. Drop Pattern Generation for Imprint Lithography
US20090115110A1 (en) * 2007-11-02 2009-05-07 Molecular Imprints, Inc. Drop Pattern Generation for Imprint Lithography
US20090140445A1 (en) * 2007-12-04 2009-06-04 Molecular Imprints High Throughput Imprint Based on Contact Line Motion Tracking Control
US20090200710A1 (en) * 2008-02-08 2009-08-13 Molecular Imprints, Inc. Extrusion reduction in imprint lithography
US20090243153A1 (en) * 2008-04-01 2009-10-01 Molecular Imprints, Inc. Large Area Roll-To-Roll Imprint Lithography
US20100003830A1 (en) * 2008-01-10 2010-01-07 Masamitsu Itoh Imprint mask manufacturing method, imprint mask manufacturing device, and semiconductor device manufacturing method
US7670529B2 (en) 2005-12-08 2010-03-02 Molecular Imprints, Inc. Method and system for double-sided patterning of substrates
US7670530B2 (en) 2006-01-20 2010-03-02 Molecular Imprints, Inc. Patterning substrates employing multiple chucks
US7691313B2 (en) 2002-11-13 2010-04-06 Molecular Imprints, Inc. Method for expelling gas positioned between a substrate and a mold
US20100098859A1 (en) * 2008-10-21 2010-04-22 Molecular Imprints, Inc. Drop Pattern Generation with Edge Weighting
US20100109195A1 (en) * 2008-11-05 2010-05-06 Molecular Imprints, Inc. Release agent partition control in imprint lithography
US20100112220A1 (en) * 2008-11-03 2010-05-06 Molecular Imprints, Inc. Dispense system set-up and characterization
US7759407B2 (en) 2005-07-22 2010-07-20 Molecular Imprints, Inc. Composition for adhering materials together
US7837921B2 (en) 2004-01-23 2010-11-23 Molecular Imprints, Inc. Method of providing desirable wetting and release characteristics between a mold and a polymerizable composition
US7906058B2 (en) 2005-12-01 2011-03-15 Molecular Imprints, Inc. Bifurcated contact printing technique
US7939131B2 (en) 2004-08-16 2011-05-10 Molecular Imprints, Inc. Method to provide a layer with uniform etch characteristics
US7981481B2 (en) 2004-09-23 2011-07-19 Molecular Imprints, Inc. Method for controlling distribution of fluid components on a body
US8012395B2 (en) 2006-04-18 2011-09-06 Molecular Imprints, Inc. Template having alignment marks formed of contrast material
US20110215503A1 (en) * 2004-11-24 2011-09-08 Molecular Imprints, Inc. Reducing Adhesion between a Conformable Region and a Mold
US8142703B2 (en) 2005-10-05 2012-03-27 Molecular Imprints, Inc. Imprint lithography method
CN102508408A (en) * 2011-10-27 2012-06-20 无锡英普林纳米科技有限公司 Dual-solidification nanoimprint lithography transporting layer material
US8211214B2 (en) 2003-10-02 2012-07-03 Molecular Imprints, Inc. Single phase fluid imprint lithography method
US8215946B2 (en) 2006-05-18 2012-07-10 Molecular Imprints, Inc. Imprint lithography system and method
CN103378231A (en) * 2012-04-23 2013-10-30 奈米晶光电股份有限公司 Method for production of selective growth masks using imprint lithography
US8586126B2 (en) 2008-10-21 2013-11-19 Molecular Imprints, Inc. Robust optimization to generate drop patterns in imprint lithography which are tolerant of variations in drop volume and drop placement
US8647554B2 (en) 2004-06-15 2014-02-11 Molecular Imprints, Inc. Residual layer thickness measurement and correction
US8808808B2 (en) 2005-07-22 2014-08-19 Molecular Imprints, Inc. Method for imprint lithography utilizing an adhesion primer layer
US9223202B2 (en) 2000-07-17 2015-12-29 Board Of Regents, The University Of Texas System Method of automatic fluid dispensing for imprint lithography processes

Families Citing this family (358)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8128856B2 (en) * 1995-11-15 2012-03-06 Regents Of The University Of Minnesota Release surfaces, particularly for use in nanoimprint lithography
US20040137734A1 (en) * 1995-11-15 2004-07-15 Princeton University Compositions and processes for nanoimprinting
US6334960B1 (en) 1999-03-11 2002-01-01 Board Of Regents, The University Of Texas System Step and flash imprint lithography
US6780001B2 (en) * 1999-07-30 2004-08-24 Formfactor, Inc. Forming tool for forming a contoured microelectronic spring mold
US6939474B2 (en) * 1999-07-30 2005-09-06 Formfactor, Inc. Method for forming microelectronic spring structures on a substrate
US6873087B1 (en) * 1999-10-29 2005-03-29 Board Of Regents, The University Of Texas System High precision orientation alignment and gap control stages for imprint lithography processes
US7432634B2 (en) 2000-10-27 2008-10-07 Board Of Regents, University Of Texas System Remote center compliant flexure device
SE516194C2 (en) * 2000-04-18 2001-12-03 Obducat Ab Substrates for and process for the production of structures
SG142150A1 (en) * 2000-07-16 2008-05-28 Univ Texas High-resolution overlay alignment systems for imprint lithography
AU8098001A (en) * 2000-08-01 2002-02-13 Univ Texas Methods for high-precision gap and orientation sensing between a transparent template and substrate for imprint lithography
US8016277B2 (en) * 2000-08-21 2011-09-13 Board Of Regents, The University Of Texas System Flexure based macro motion translation stage
KR101031528B1 (en) 2000-10-12 2011-04-27 더 보드 오브 리전츠 오브 더 유니버시티 오브 텍사스 시스템 Template for room temperature, low pressure micro- and nano- imprint lithography
SE519573C2 (en) * 2001-07-05 2003-03-11 Obducat Ab Stamp with anti-adhesion layer and methods of forming and ways to repair such a stamp
SG187992A1 (en) 2001-07-25 2013-03-28 Univ Princeton Nanochannel arrays and their preparation and use for high throughput macromolecular analysis
US9678038B2 (en) 2001-07-25 2017-06-13 The Trustees Of Princeton University Nanochannel arrays and their preparation and use for high throughput macromolecular analysis
JP2003109915A (en) * 2001-09-28 2003-04-11 National Institute Of Advanced Industrial & Technology Method and device for performing in-print lithography in releasable atmosphere
US20030071016A1 (en) * 2001-10-11 2003-04-17 Wu-Sheng Shih Patterned structure reproduction using nonsticking mold
EP1441868A4 (en) * 2001-10-11 2006-08-30 Brewer Science Inc Patterned structure reproduction using nonsticking mold
KR20030057067A (en) * 2001-12-28 2003-07-04 엘지.필립스 엘시디 주식회사 A method of forming pattern using printing process
AU2003269813A1 (en) 2002-04-16 2003-12-31 Princeton University Gradient structures interfacing microfluidics and nanofluidics, methods for fabrication and uses thereof
JP2003218658A (en) * 2002-01-17 2003-07-31 Nec Corp Method for manufacturing surface acoustic wave element and semiconductor device
US20030186405A1 (en) * 2002-04-01 2003-10-02 The Ohio State University Research Foundation Micro/nano-embossing process and useful applications thereof
US7652574B2 (en) * 2002-04-08 2010-01-26 Sayegh Adel O Article surveillance tag having a vial
US6730617B2 (en) 2002-04-24 2004-05-04 Ibm Method of fabricating one or more tiers of an integrated circuit
US7037639B2 (en) * 2002-05-01 2006-05-02 Molecular Imprints, Inc. Methods of manufacturing a lithography template
US6964793B2 (en) * 2002-05-16 2005-11-15 Board Of Regents, The University Of Texas System Method for fabricating nanoscale patterns in light curable compositions using an electric field
US20030235787A1 (en) * 2002-06-24 2003-12-25 Watts Michael P.C. Low viscosity high resolution patterning material
US7179079B2 (en) 2002-07-08 2007-02-20 Molecular Imprints, Inc. Conforming template for patterning liquids disposed on substrates
US6926929B2 (en) * 2002-07-09 2005-08-09 Molecular Imprints, Inc. System and method for dispensing liquids
US6908861B2 (en) * 2002-07-11 2005-06-21 Molecular Imprints, Inc. Method for imprint lithography using an electric field
MY164487A (en) 2002-07-11 2017-12-29 Molecular Imprints Inc Step and repeat imprint lithography processes
US6932934B2 (en) * 2002-07-11 2005-08-23 Molecular Imprints, Inc. Formation of discontinuous films during an imprint lithography process
US7077992B2 (en) * 2002-07-11 2006-07-18 Molecular Imprints, Inc. Step and repeat imprint lithography processes
US6900881B2 (en) * 2002-07-11 2005-05-31 Molecular Imprints, Inc. Step and repeat imprint lithography systems
US7027156B2 (en) * 2002-08-01 2006-04-11 Molecular Imprints, Inc. Scatterometry alignment for imprint lithography
US7070405B2 (en) * 2002-08-01 2006-07-04 Molecular Imprints, Inc. Alignment systems for imprint lithography
US7071088B2 (en) * 2002-08-23 2006-07-04 Molecular Imprints, Inc. Method for fabricating bulbous-shaped vias
US6936194B2 (en) * 2002-09-05 2005-08-30 Molecular Imprints, Inc. Functional patterning material for imprint lithography processes
US20040065252A1 (en) * 2002-10-04 2004-04-08 Sreenivasan Sidlgata V. Method of forming a layer on a substrate to facilitate fabrication of metrology standards
US8349241B2 (en) * 2002-10-04 2013-01-08 Molecular Imprints, Inc. Method to arrange features on a substrate to replicate features having minimal dimensional variability
EP2233564A3 (en) * 2002-10-30 2012-11-21 Hitachi, Ltd. Cell culture sheet comprising a functional substrate with a group of columnar micro-pillars and its manufacturing method
AU2003291443A1 (en) 2002-11-12 2004-06-03 Princeton University Compositions and processes for nanoimprinting
US6929762B2 (en) * 2002-11-13 2005-08-16 Molecular Imprints, Inc. Method of reducing pattern distortions during imprint lithography processes
US7641840B2 (en) * 2002-11-13 2010-01-05 Molecular Imprints, Inc. Method for expelling gas positioned between a substrate and a mold
MY133312A (en) 2002-11-13 2007-11-30 Molecular Imprints Inc A chucking system and method for modulation shapes of substrates
US6900126B2 (en) 2002-11-20 2005-05-31 International Business Machines Corporation Method of forming metallized pattern
US6980282B2 (en) * 2002-12-11 2005-12-27 Molecular Imprints, Inc. Method for modulating shapes of substrates
US7365103B2 (en) * 2002-12-12 2008-04-29 Board Of Regents, The University Of Texas System Compositions for dark-field polymerization and method of using the same for imprint lithography processes
US20040112862A1 (en) * 2002-12-12 2004-06-17 Molecular Imprints, Inc. Planarization composition and method of patterning a substrate using the same
US6871558B2 (en) * 2002-12-12 2005-03-29 Molecular Imprints, Inc. Method for determining characteristics of substrate employing fluid geometries
AU2003300865A1 (en) * 2002-12-13 2004-07-09 Molecular Imprints, Inc. Magnification corrections employing out-of-plane distortions on a substrate
JP2004241397A (en) * 2003-01-23 2004-08-26 Dainippon Printing Co Ltd Thin film transistor and its manufacturing process
US20040168613A1 (en) * 2003-02-27 2004-09-02 Molecular Imprints, Inc. Composition and method to form a release layer
US7452574B2 (en) * 2003-02-27 2008-11-18 Molecular Imprints, Inc. Method to reduce adhesion between a polymerizable layer and a substrate employing a fluorine-containing layer
JP4317375B2 (en) * 2003-03-20 2009-08-19 株式会社日立製作所 Nanoprint apparatus and fine structure transfer method
US7179396B2 (en) * 2003-03-25 2007-02-20 Molecular Imprints, Inc. Positive tone bi-layer imprint lithography method
US20040202865A1 (en) * 2003-04-08 2004-10-14 Andrew Homola Release coating for stamper
US7410904B2 (en) * 2003-04-24 2008-08-12 Hewlett-Packard Development Company, L.P. Sensor produced using imprint lithography
US7396475B2 (en) * 2003-04-25 2008-07-08 Molecular Imprints, Inc. Method of forming stepped structures employing imprint lithography
US6951173B1 (en) * 2003-05-14 2005-10-04 Molecular Imprints, Inc. Assembly and method for transferring imprint lithography templates
EP2177951A1 (en) * 2003-05-14 2010-04-21 Molecular Imprints, Inc. Method, system, holder and assembly for transferring templates during imprint lithography processes
US6805054B1 (en) 2003-05-14 2004-10-19 Molecular Imprints, Inc. Method, system and holder for transferring templates during imprint lithography processes
US7157036B2 (en) * 2003-06-17 2007-01-02 Molecular Imprints, Inc Method to reduce adhesion between a conformable region and a pattern of a mold
US7150622B2 (en) * 2003-07-09 2006-12-19 Molecular Imprints, Inc. Systems for magnification and distortion correction for imprint lithography processes
KR100606532B1 (en) * 2003-08-02 2006-07-31 동부일렉트로닉스 주식회사 Method For Manufacturing Semiconductor Devices
DE10340608A1 (en) 2003-08-29 2005-03-24 Infineon Technologies Ag Polymer formulation and method of making a dielectric layer
ES2383689T3 (en) * 2003-09-23 2012-06-25 California Institute Of Technology Photocurable perfluoropolyethers for use as novel materials in microfluidic devices
US7136150B2 (en) * 2003-09-25 2006-11-14 Molecular Imprints, Inc. Imprint lithography template having opaque alignment marks
US7090716B2 (en) * 2003-10-02 2006-08-15 Molecular Imprints, Inc. Single phase fluid imprint lithography method
US7261830B2 (en) * 2003-10-16 2007-08-28 Molecular Imprints, Inc. Applying imprinting material to substrates employing electromagnetic fields
US20050084804A1 (en) * 2003-10-16 2005-04-21 Molecular Imprints, Inc. Low surface energy templates
US7122482B2 (en) * 2003-10-27 2006-10-17 Molecular Imprints, Inc. Methods for fabricating patterned features utilizing imprint lithography
US20050098534A1 (en) * 2003-11-12 2005-05-12 Molecular Imprints, Inc. Formation of conductive templates employing indium tin oxide
US20050106321A1 (en) * 2003-11-14 2005-05-19 Molecular Imprints, Inc. Dispense geometery to achieve high-speed filling and throughput
EP1538482B1 (en) * 2003-12-05 2016-02-17 Obducat AB Device and method for large area lithography
US9040090B2 (en) 2003-12-19 2015-05-26 The University Of North Carolina At Chapel Hill Isolated and fixed micro and nano structures and methods thereof
KR20120105062A (en) 2003-12-19 2012-09-24 더 유니버시티 오브 노쓰 캐롤라이나 엣 채플 힐 Methods for fabricating isolated micro- and nano- structures using soft or imprint lithography
KR101010431B1 (en) * 2003-12-27 2011-01-21 엘지디스플레이 주식회사 Method and Apparatus for Fabricating Flat Panel Display
US20050158419A1 (en) * 2004-01-15 2005-07-21 Watts Michael P. Thermal processing system for imprint lithography
US20050156353A1 (en) * 2004-01-15 2005-07-21 Watts Michael P. Method to improve the flow rate of imprinting material
US20050160011A1 (en) * 2004-01-20 2005-07-21 Molecular Imprints, Inc. Method for concurrently employing differing materials to form a layer on a substrate
US7060625B2 (en) * 2004-01-27 2006-06-13 Hewlett-Packard Development Company, L.P. Imprint stamp
US7462292B2 (en) * 2004-01-27 2008-12-09 Hewlett-Packard Development Company, L.P. Silicon carbide imprint stamp
US8158728B2 (en) 2004-02-13 2012-04-17 The University Of North Carolina At Chapel Hill Methods and materials for fabricating microfluidic devices
CA2555912A1 (en) * 2004-02-13 2005-09-15 The University Of North Carolina At Chapel Hill Functional materials and novel methods for the fabrication of microfluidic devices
US7019835B2 (en) * 2004-02-19 2006-03-28 Molecular Imprints, Inc. Method and system to measure characteristics of a film disposed on a substrate
US8076386B2 (en) * 2004-02-23 2011-12-13 Molecular Imprints, Inc. Materials for imprint lithography
US7906180B2 (en) * 2004-02-27 2011-03-15 Molecular Imprints, Inc. Composition for an etching mask comprising a silicon-containing material
US20050189676A1 (en) * 2004-02-27 2005-09-01 Molecular Imprints, Inc. Full-wafer or large area imprinting with multiple separated sub-fields for high throughput lithography
US7122079B2 (en) * 2004-02-27 2006-10-17 Molecular Imprints, Inc. Composition for an etching mask comprising a silicon-containing material
US7730834B2 (en) * 2004-03-04 2010-06-08 Asml Netherlands B.V. Printing apparatus and device manufacturing method
JP4481698B2 (en) * 2004-03-29 2010-06-16 キヤノン株式会社 Processing equipment
JP4393244B2 (en) * 2004-03-29 2010-01-06 キヤノン株式会社 Imprint device
DE102004028851B4 (en) * 2004-03-31 2006-04-13 Infineon Technologies Ag Method and device for measuring a surface profile of a sample
US20050230882A1 (en) * 2004-04-19 2005-10-20 Molecular Imprints, Inc. Method of forming a deep-featured template employed in imprint lithography
US8235302B2 (en) * 2004-04-20 2012-08-07 Nanolnk, Inc. Identification features
US7140861B2 (en) * 2004-04-27 2006-11-28 Molecular Imprints, Inc. Compliant hard template for UV imprinting
US20080055581A1 (en) * 2004-04-27 2008-03-06 Rogers John A Devices and methods for pattern generation by ink lithography
CN102004393B (en) 2004-04-27 2013-05-01 伊利诺伊大学评议会 Composite patterning devices for soft lithography
EP1594001B1 (en) * 2004-05-07 2015-12-30 Obducat AB Device and method for imprint lithography
US20050253307A1 (en) * 2004-05-11 2005-11-17 Molecualr Imprints, Inc. Method of patterning a conductive layer on a substrate
US7186656B2 (en) * 2004-05-21 2007-03-06 Molecular Imprints, Inc. Method of forming a recessed structure employing a reverse tone process
US7323417B2 (en) * 2004-09-21 2008-01-29 Molecular Imprints, Inc. Method of forming a recessed structure employing a reverse tone process
US7504268B2 (en) * 2004-05-28 2009-03-17 Board Of Regents, The University Of Texas System Adaptive shape substrate support method
US20050274219A1 (en) * 2004-06-01 2005-12-15 Molecular Imprints, Inc. Method and system to control movement of a body for nano-scale manufacturing
US20060005657A1 (en) * 2004-06-01 2006-01-12 Molecular Imprints, Inc. Method and system to control movement of a body for nano-scale manufacturing
US20050275311A1 (en) * 2004-06-01 2005-12-15 Molecular Imprints, Inc. Compliant device for nano-scale manufacturing
US20050276919A1 (en) * 2004-06-01 2005-12-15 Molecular Imprints, Inc. Method for dispensing a fluid on a substrate
US20050270516A1 (en) * 2004-06-03 2005-12-08 Molecular Imprints, Inc. System for magnification and distortion correction during nano-scale manufacturing
US7943491B2 (en) * 2004-06-04 2011-05-17 The Board Of Trustees Of The University Of Illinois Pattern transfer printing by kinetic control of adhesion to an elastomeric stamp
EP1759422A4 (en) 2004-06-04 2011-04-06 Univ Illinois Methods and devices for fabricating and assembling printable semiconductor elements
US20050272599A1 (en) * 2004-06-04 2005-12-08 Kenneth Kramer Mold release layer
US7799699B2 (en) 2004-06-04 2010-09-21 The Board Of Trustees Of The University Of Illinois Printable semiconductor structures and related methods of making and assembling
US7521292B2 (en) 2004-06-04 2009-04-21 The Board Of Trustees Of The University Of Illinois Stretchable form of single crystal silicon for high performance electronics on rubber substrates
US20050277066A1 (en) * 2004-06-10 2005-12-15 Le Ngoc V Selective etch process for step and flash imprint lithography
JP2006013400A (en) * 2004-06-29 2006-01-12 Canon Inc Method and apparatus for detecting relative positional deviation between two objects
US7785526B2 (en) * 2004-07-20 2010-08-31 Molecular Imprints, Inc. Imprint alignment method, system, and template
US20060017876A1 (en) * 2004-07-23 2006-01-26 Molecular Imprints, Inc. Displays and method for fabricating displays
US8088293B2 (en) * 2004-07-29 2012-01-03 Micron Technology, Inc. Methods of forming reticles configured for imprint lithography
US7309225B2 (en) * 2004-08-13 2007-12-18 Molecular Imprints, Inc. Moat system for an imprint lithography template
US7105452B2 (en) * 2004-08-13 2006-09-12 Molecular Imprints, Inc. Method of planarizing a semiconductor substrate with an etching chemistry
US7282550B2 (en) * 2004-08-16 2007-10-16 Molecular Imprints, Inc. Composition to provide a layer with uniform etch characteristics
US7641468B2 (en) * 2004-09-01 2010-01-05 Hewlett-Packard Development Company, L.P. Imprint lithography apparatus and method employing an effective pressure
US20070164476A1 (en) * 2004-09-01 2007-07-19 Wei Wu Contact lithography apparatus and method employing substrate deformation
SG147418A1 (en) * 2004-09-21 2008-11-28 Molecular Imprints Inc Method of forming an in-situ recessed structure
US7547504B2 (en) * 2004-09-21 2009-06-16 Molecular Imprints, Inc. Pattern reversal employing thick residual layers
US7252777B2 (en) * 2004-09-21 2007-08-07 Molecular Imprints, Inc. Method of forming an in-situ recessed structure
US7241395B2 (en) * 2004-09-21 2007-07-10 Molecular Imprints, Inc. Reverse tone patterning on surfaces having planarity perturbations
US7041604B2 (en) * 2004-09-21 2006-05-09 Molecular Imprints, Inc. Method of patterning surfaces while providing greater control of recess anisotropy
US7205244B2 (en) * 2004-09-21 2007-04-17 Molecular Imprints Patterning substrates employing multi-film layers defining etch-differential interfaces
US7244386B2 (en) * 2004-09-27 2007-07-17 Molecular Imprints, Inc. Method of compensating for a volumetric shrinkage of a material disposed upon a substrate to form a substantially planar structure therefrom
AT533085T (en) * 2004-10-08 2011-11-15 Dow Corning Phase changing compositions using lithographic processes
US20060081557A1 (en) 2004-10-18 2006-04-20 Molecular Imprints, Inc. Low-k dielectric functional imprinting materials
US7163888B2 (en) * 2004-11-22 2007-01-16 Motorola, Inc. Direct imprinting of etch barriers using step and flash imprint lithography
US7630067B2 (en) * 2004-11-30 2009-12-08 Molecular Imprints, Inc. Interferometric analysis method for the manufacture of nano-scale devices
KR20070084250A (en) 2004-11-30 2007-08-24 아사히 가라스 가부시키가이샤 Mold and process for production of substrates having transferred micropatterns thereon
US7292326B2 (en) * 2004-11-30 2007-11-06 Molecular Imprints, Inc. Interferometric analysis for the manufacture of nano-scale devices
US7357876B2 (en) * 2004-12-01 2008-04-15 Molecular Imprints, Inc. Eliminating printability of sub-resolution defects in imprint lithography
US20060115999A1 (en) * 2004-12-01 2006-06-01 Molecular Imprints, Inc. Methods of exposure for the purpose of thermal management for imprint lithography processes
US7281919B2 (en) * 2004-12-07 2007-10-16 Molecular Imprints, Inc. System for controlling a volume of material on a mold
CN100468814C (en) * 2004-12-15 2009-03-11 鸿富锦精密工业(深圳)有限公司;鸿海精密工业股份有限公司 Organic luminescent display
US7125495B2 (en) * 2004-12-20 2006-10-24 Palo Alto Research Center, Inc. Large area electronic device with high and low resolution patterned film features
US7676088B2 (en) * 2004-12-23 2010-03-09 Asml Netherlands B.V. Imprint lithography
US7686970B2 (en) * 2004-12-30 2010-03-30 Asml Netherlands B.V. Imprint lithography
US20060144814A1 (en) * 2004-12-30 2006-07-06 Asml Netherlands B.V. Imprint lithography
US20060145398A1 (en) * 2004-12-30 2006-07-06 Board Of Regents, The University Of Texas System Release layer comprising diamond-like carbon (DLC) or doped DLC with tunable composition for imprint lithography templates and contact masks
US7490547B2 (en) * 2004-12-30 2009-02-17 Asml Netherlands B.V. Imprint lithography
US20060144274A1 (en) * 2004-12-30 2006-07-06 Asml Netherlands B.V. Imprint lithography
US7354698B2 (en) * 2005-01-07 2008-04-08 Asml Netherlands B.V. Imprint lithography
US20070299176A1 (en) * 2005-01-28 2007-12-27 Markley Thomas J Photodefinable low dielectric constant material and method for making and using same
US7636999B2 (en) * 2005-01-31 2009-12-29 Molecular Imprints, Inc. Method of retaining a substrate to a wafer chuck
US7635263B2 (en) * 2005-01-31 2009-12-22 Molecular Imprints, Inc. Chucking system comprising an array of fluid chambers
WO2006084202A2 (en) * 2005-02-03 2006-08-10 The University Of North Carolina At Chapel Hill Low surface energy polymeric material for use in liquid crystal displays
US20060177535A1 (en) * 2005-02-04 2006-08-10 Molecular Imprints, Inc. Imprint lithography template to facilitate control of liquid movement
US7922474B2 (en) * 2005-02-17 2011-04-12 Asml Netherlands B.V. Imprint lithography
US8097400B2 (en) * 2005-02-22 2012-01-17 Hewlett-Packard Development Company, L.P. Method for forming an electronic device
JP2006245072A (en) * 2005-02-28 2006-09-14 Canon Inc Mold for transferring pattern and transfer device
US7277619B2 (en) * 2005-03-04 2007-10-02 Hewlett-Packard Development Company, L.P. Nano-imprinted photonic crystal waveguide
US7523701B2 (en) * 2005-03-07 2009-04-28 Asml Netherlands B.V. Imprint lithography method and apparatus
EP1700680A1 (en) * 2005-03-09 2006-09-13 EPFL Ecole Polytechnique Fédérale de Lausanne Easy release fluoropolymer molds for micro- and nano-pattern replication
US7611348B2 (en) * 2005-04-19 2009-11-03 Asml Netherlands B.V. Imprint lithography
US7762186B2 (en) * 2005-04-19 2010-07-27 Asml Netherlands B.V. Imprint lithography
DE602006015628D1 (en) * 2005-04-21 2010-09-02 Asahi Glass Co Ltd Em pattern and manufacturing method therefor
WO2006114369A2 (en) 2005-04-27 2006-11-02 Obducat Ab Means for transferring a pattern to an object
JP4736522B2 (en) * 2005-04-28 2011-07-27 旭硝子株式会社 Method of manufacturing processed substrate processed by etching
JP4742665B2 (en) * 2005-04-28 2011-08-10 旭硝子株式会社 Method of manufacturing processed substrate processed by etching
US7767129B2 (en) * 2005-05-11 2010-08-03 Micron Technology, Inc. Imprint templates for imprint lithography, and methods of patterning a plurality of substrates
US7442029B2 (en) * 2005-05-16 2008-10-28 Asml Netherlands B.V. Imprint lithography
US20060266916A1 (en) * 2005-05-25 2006-11-30 Molecular Imprints, Inc. Imprint lithography template having a coating to reflect and/or absorb actinic energy
US7692771B2 (en) * 2005-05-27 2010-04-06 Asml Netherlands B.V. Imprint lithography
US20060267231A1 (en) * 2005-05-27 2006-11-30 Asml Netherlands B.V. Imprint lithography
US7418902B2 (en) * 2005-05-31 2008-09-02 Asml Netherlands B.V. Imprint lithography including alignment
KR101117987B1 (en) * 2005-06-07 2012-03-06 엘지디스플레이 주식회사 Apparatus and Method for Fabricating Flat Panel Display Device
JP3958344B2 (en) * 2005-06-07 2007-08-15 キヤノン株式会社 Imprint apparatus, imprint method, and chip manufacturing method
US7927089B2 (en) * 2005-06-08 2011-04-19 Canon Kabushiki Kaisha Mold, apparatus including mold, pattern transfer apparatus, and pattern forming method
US7854873B2 (en) * 2005-06-10 2010-12-21 Obducat Ab Imprint stamp comprising cyclic olefin copolymer
ES2317159T3 (en) * 2005-06-10 2009-04-16 Obducat Ab Model replication with intermediate seal.
US7377764B2 (en) * 2005-06-13 2008-05-27 Asml Netherlands B.V. Imprint lithography
DE102005045331A1 (en) * 2005-06-16 2006-12-28 Süss MicroTec AG Removal of thin structured polymer layers by atmospheric plasma
US20060284156A1 (en) * 2005-06-16 2006-12-21 Thomas Happ Phase change memory cell defined by imprint lithography
US7256131B2 (en) * 2005-07-19 2007-08-14 Molecular Imprints, Inc. Method of controlling the critical dimension of structures formed on a substrate
US7708924B2 (en) * 2005-07-21 2010-05-04 Asml Netherlands B.V. Imprint lithography
US8846195B2 (en) * 2005-07-22 2014-09-30 Canon Nanotechnologies, Inc. Ultra-thin polymeric adhesion layer
US20070023976A1 (en) * 2005-07-26 2007-02-01 Asml Netherlands B.V. Imprint lithography
US20090304992A1 (en) * 2005-08-08 2009-12-10 Desimone Joseph M Micro and Nano-Structure Metrology
US7766640B2 (en) * 2005-08-12 2010-08-03 Hewlett-Packard Development Company, L.P. Contact lithography apparatus, system and method
US20070074635A1 (en) * 2005-08-25 2007-04-05 Molecular Imprints, Inc. System to couple a body and a docking plate
US7665981B2 (en) * 2005-08-25 2010-02-23 Molecular Imprints, Inc. System to transfer a template transfer body between a motion stage and a docking plate
US20070064384A1 (en) * 2005-08-25 2007-03-22 Molecular Imprints, Inc. Method to transfer a template transfer body between a motion stage and a docking plate
KR100758699B1 (en) * 2005-08-29 2007-09-14 재단법인서울대학교산학협력재단 Method for forming high aspect ratio nanostructure and method for forming nano pattern using the same
US7419611B2 (en) * 2005-09-02 2008-09-02 International Business Machines Corporation Processes and materials for step and flash imprint lithography
US7488771B2 (en) * 2005-09-02 2009-02-10 International Business Machines Corporation Stabilization of vinyl ether materials
JP4330168B2 (en) * 2005-09-06 2009-09-16 キヤノン株式会社 Mold, imprint method, and chip manufacturing method
US7670534B2 (en) 2005-09-21 2010-03-02 Molecular Imprints, Inc. Method to control an atmosphere between a body and a substrate
US7259102B2 (en) * 2005-09-30 2007-08-21 Molecular Imprints, Inc. Etching technique to planarize a multi-layer structure
WO2008060266A2 (en) * 2005-10-03 2008-05-22 Massachusetts Institute Of Technology Nanotemplate arbitrary-imprint lithography
JP4533358B2 (en) 2005-10-18 2010-09-01 キヤノン株式会社 Imprint method, imprint apparatus and chip manufacturing method
US7878791B2 (en) * 2005-11-04 2011-02-01 Asml Netherlands B.V. Imprint lithography
US8011915B2 (en) 2005-11-04 2011-09-06 Asml Netherlands B.V. Imprint lithography
US7677877B2 (en) * 2005-11-04 2010-03-16 Asml Netherlands B.V. Imprint lithography
US7803308B2 (en) * 2005-12-01 2010-09-28 Molecular Imprints, Inc. Technique for separating a mold from solidified imprinting material
US7422981B2 (en) * 2005-12-07 2008-09-09 Canon Kabushiki Kaisha Method for manufacturing semiconductor device by using dual damascene process and method for manufacturing article having communicating hole
JP4827513B2 (en) * 2005-12-09 2011-11-30 キヤノン株式会社 Processing method
EP1795497B1 (en) 2005-12-09 2012-03-14 Obducat AB Apparatus and method for transferring a pattern with intermediate stamp
US20070138699A1 (en) * 2005-12-21 2007-06-21 Asml Netherlands B.V. Imprint lithography
US7517211B2 (en) 2005-12-21 2009-04-14 Asml Netherlands B.V. Imprint lithography
TWI432904B (en) * 2006-01-25 2014-04-01 Dow Corning Epoxy formulations for use in lithography techniques
CN101506413A (en) 2006-03-03 2009-08-12 伊利诺伊大学评议会 Methods of making spatially aligned nanotubes and nanotube arrays
US8001924B2 (en) 2006-03-31 2011-08-23 Asml Netherlands B.V. Imprint lithography
WO2007117524A2 (en) * 2006-04-03 2007-10-18 Molecular Imprints, Inc. Method of concurrently patterning a substrate having a plurality of fields and alignment marks
US20070228608A1 (en) * 2006-04-03 2007-10-04 Molecular Imprints, Inc. Preserving Filled Features when Vacuum Wiping
US7802978B2 (en) 2006-04-03 2010-09-28 Molecular Imprints, Inc. Imprinting of partial fields at the edge of the wafer
US20070231421A1 (en) * 2006-04-03 2007-10-04 Molecular Imprints, Inc. Enhanced Multi Channel Alignment
US8850980B2 (en) 2006-04-03 2014-10-07 Canon Nanotechnologies, Inc. Tessellated patterns in imprint lithography
US7547398B2 (en) * 2006-04-18 2009-06-16 Molecular Imprints, Inc. Self-aligned process for fabricating imprint templates containing variously etched features
WO2007124007A2 (en) * 2006-04-21 2007-11-01 Molecular Imprints, Inc. Method for detecting a particle in a nanoimprint lithography system
KR20070105040A (en) 2006-04-25 2007-10-30 엘지.필립스 엘시디 주식회사 Resist composition, method of fabricating resist pattern using the same and array substrate fabricated using the same
KR20090031349A (en) * 2006-04-28 2009-03-25 렌슬러 폴리테크닉 인스티튜트 Siloxane epoxy polymers for redistribution layer applications
US20080160129A1 (en) * 2006-05-11 2008-07-03 Molecular Imprints, Inc. Template Having a Varying Thickness to Facilitate Expelling a Gas Positioned Between a Substrate and the Template
JP2007329276A (en) * 2006-06-07 2007-12-20 Tokyo Ohka Kogyo Co Ltd Method for forming resist pattern by nanoimprint lithography
US20070298176A1 (en) * 2006-06-26 2007-12-27 Dipietro Richard Anthony Aromatic vinyl ether based reverse-tone step and flash imprint lithography
US8015939B2 (en) * 2006-06-30 2011-09-13 Asml Netherlands B.V. Imprintable medium dispenser
US8318253B2 (en) * 2006-06-30 2012-11-27 Asml Netherlands B.V. Imprint lithography
WO2008011051A1 (en) * 2006-07-17 2008-01-24 Liquidia Technologies, Inc. Nanoparticle fabrication methods, systems, and materials
CN100400555C (en) 2006-08-25 2008-07-09 南京大学 Solidifiable composition material by ultraviolet light and application
US7946837B2 (en) * 2006-10-06 2011-05-24 Asml Netherlands B.V. Imprint lithography
US7830498B2 (en) * 2006-10-10 2010-11-09 Hewlett-Packard Development Company, L.P. Hydraulic-facilitated contact lithography apparatus, system and method
US7768628B2 (en) * 2006-10-12 2010-08-03 Hewlett-Packard Development Company, L.P. Contact lithography apparatus and method
US7618752B2 (en) * 2006-10-12 2009-11-17 Hewlett-Packard Development Company, L.P. Deformation-based contact lithography systems, apparatus and methods
US20080102380A1 (en) * 2006-10-30 2008-05-01 Mangat Pawitter S High density lithographic process
US20080110557A1 (en) * 2006-11-15 2008-05-15 Molecular Imprints, Inc. Methods and Compositions for Providing Preferential Adhesion and Release of Adjacent Surfaces
KR101308441B1 (en) * 2006-11-29 2013-09-16 엘지디스플레이 주식회사 Appartus For Fabricating Thin Film Pattern And Method For Fabricating Using The Same
KR101370969B1 (en) * 2006-11-30 2014-03-10 엘지디스플레이 주식회사 Photocurable organic material
US20080131705A1 (en) * 2006-12-01 2008-06-05 International Business Machines Corporation Method and system for nanostructure placement using imprint lithography
CN101755237B (en) * 2006-12-05 2014-04-09 纳诺泰拉公司 Method for patterning surface
KR101636750B1 (en) 2007-01-17 2016-07-06 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 Optical systems fabricated by printing-based assembly
WO2008118861A2 (en) * 2007-03-23 2008-10-02 The University Of North Carolina At Chapel Hill Discrete size and shape specific organic nanoparticles designed to elicit an immune response
AU2008232616B2 (en) * 2007-03-28 2014-08-07 Bionano Genomics, Inc. Methods of macromolecular analysis using nanochannel arrays
US20080264672A1 (en) * 2007-04-26 2008-10-30 Air Products And Chemicals, Inc. Photoimprintable Low Dielectric Constant Material and Method for Making and Using Same
US7641467B2 (en) * 2007-05-02 2010-01-05 Asml Netherlands B.V. Imprint lithography
JP2009001002A (en) 2007-05-24 2009-01-08 Asahi Glass Co Ltd Mold, its manufacturing method, and manufacturing method for base material having transfer micro-pattern
JP2009034926A (en) * 2007-08-02 2009-02-19 Sumitomo Electric Ind Ltd Resin pattern formation method
JP5473266B2 (en) * 2007-08-03 2014-04-16 キヤノン株式会社 Imprint method, substrate processing method, and semiconductor device manufacturing method by substrate processing method
US20090038636A1 (en) * 2007-08-09 2009-02-12 Asml Netherlands B.V. Cleaning method
US7854877B2 (en) 2007-08-14 2010-12-21 Asml Netherlands B.V. Lithography meandering order
US8144309B2 (en) * 2007-09-05 2012-03-27 Asml Netherlands B.V. Imprint lithography
NL1036034A1 (en) 2007-10-11 2009-04-15 Asml Netherlands Bv Imprint lithography.
US7906274B2 (en) * 2007-11-21 2011-03-15 Molecular Imprints, Inc. Method of creating a template employing a lift-off process
JP5727788B2 (en) * 2007-11-21 2015-06-03 モレキュラー・インプリンツ・インコーポレーテッド Porous templates and imprint stacks for nanoimprint lithography
US7986493B2 (en) * 2007-11-28 2011-07-26 Seagate Technology Llc Discrete track magnetic media with domain wall pinning sites
TW200937389A (en) 2007-12-06 2009-09-01 Intevac Inc System and method for commercial fabrication of patterned media
JP5433152B2 (en) * 2008-01-18 2014-03-05 東京応化工業株式会社 Film-forming composition for room temperature imprint, structure manufacturing method and structure
US9323143B2 (en) * 2008-02-05 2016-04-26 Canon Nanotechnologies, Inc. Controlling template surface composition in nano-imprint lithography
US20090212012A1 (en) * 2008-02-27 2009-08-27 Molecular Imprints, Inc. Critical dimension control during template formation
KR101755207B1 (en) 2008-03-05 2017-07-19 더 보드 오브 트러스티즈 오브 더 유니버시티 오브 일리노이 Stretchable and foldable electronic devies
US8470701B2 (en) * 2008-04-03 2013-06-25 Advanced Diamond Technologies, Inc. Printable, flexible and stretchable diamond for thermal management
CN102066089B (en) * 2008-04-18 2016-02-10 麻省理工学院 The wedge shape imprinted pattern of irregular surface is formed
WO2010005707A1 (en) * 2008-06-16 2010-01-14 The Board Of Trustees Of The University Of Illinois Medium scale carbon nanotube thin film integrated circuits on flexible plastic substrates
US8043085B2 (en) 2008-08-19 2011-10-25 Asml Netherlands B.V. Imprint lithography
NL2003347A (en) * 2008-09-11 2010-03-16 Asml Netherlands Bv Imprint lithography.
US20100072671A1 (en) * 2008-09-25 2010-03-25 Molecular Imprints, Inc. Nano-imprint lithography template fabrication and treatment
US8470188B2 (en) * 2008-10-02 2013-06-25 Molecular Imprints, Inc. Nano-imprint lithography templates
US8886334B2 (en) * 2008-10-07 2014-11-11 Mc10, Inc. Systems, methods, and devices using stretchable or flexible electronics for medical applications
US8389862B2 (en) 2008-10-07 2013-03-05 Mc10, Inc. Extremely stretchable electronics
US8097926B2 (en) 2008-10-07 2012-01-17 Mc10, Inc. Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy
US8372726B2 (en) * 2008-10-07 2013-02-12 Mc10, Inc. Methods and applications of non-planar imaging arrays
US9289132B2 (en) * 2008-10-07 2016-03-22 Mc10, Inc. Catheter balloon having stretchable integrated circuitry and sensor array
NL2003380A (en) * 2008-10-17 2010-04-20 Asml Netherlands Bv Imprint lithography apparatus and method.
US8415010B2 (en) * 2008-10-20 2013-04-09 Molecular Imprints, Inc. Nano-imprint lithography stack with enhanced adhesion between silicon-containing and non-silicon containing layers
US20100104852A1 (en) * 2008-10-23 2010-04-29 Molecular Imprints, Inc. Fabrication of High-Throughput Nano-Imprint Lithography Templates
US8877073B2 (en) * 2008-10-27 2014-11-04 Canon Nanotechnologies, Inc. Imprint lithography template
US8361546B2 (en) * 2008-10-30 2013-01-29 Molecular Imprints, Inc. Facilitating adhesion between substrate and patterned layer
CN101477304B (en) * 2008-11-04 2011-08-17 南京大学 Stamping method for copying high-resolution nano-structure on complicated shape surface
KR101293133B1 (en) * 2008-12-04 2013-08-12 코닌클리케 필립스 일렉트로닉스 엔.브이. Imprint lithography apparatus and method
EP2199855B1 (en) * 2008-12-19 2016-07-20 Obducat Methods and processes for modifying polymer material surface interactions
EP2199854B1 (en) * 2008-12-19 2015-12-16 Obducat AB Hybrid polymer mold for nano-imprinting and method for making the same
JP5692992B2 (en) * 2008-12-19 2015-04-01 キヤノン株式会社 Structure manufacturing method and inkjet head manufacturing method
NL2003871A (en) * 2009-02-04 2010-08-05 Asml Netherlands Bv Imprint lithography.
NL2003875A (en) 2009-02-04 2010-08-05 Asml Netherlands Bv Imprint lithography method and apparatus.
JP5301648B2 (en) 2009-02-27 2013-09-25 三井化学株式会社 Transfer body and method for producing the same
NL2004265A (en) 2009-04-01 2010-10-04 Asml Netherlands Bv Imprint lithography apparatus and method.
NL2004266A (en) 2009-04-27 2010-10-28 Asml Netherlands Bv An actuator.
TWI592996B (en) 2009-05-12 2017-07-21 美國伊利諾大學理事會 Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays
NL2004409A (en) * 2009-05-19 2010-11-22 Asml Netherlands Bv Imprint lithography apparatus.
JP5574802B2 (en) * 2009-06-03 2014-08-20 キヤノン株式会社 Manufacturing method of structure
JP5060517B2 (en) * 2009-06-24 2012-10-31 東京エレクトロン株式会社 Imprint system
NL2004680A (en) * 2009-07-06 2011-01-10 Asml Netherlands Bv Imprint lithography apparatus.
NL2004735A (en) * 2009-07-06 2011-01-10 Asml Netherlands Bv Imprint lithography apparatus and method.
NL2004681A (en) * 2009-07-06 2011-01-10 Asml Netherlands Bv Imprint lithography apparatus.
NL2004932A (en) * 2009-07-27 2011-01-31 Asml Netherlands Bv Imprint lithography template.
NL2004685A (en) * 2009-07-27 2011-01-31 Asml Netherlands Bv Imprint lithography apparatus and method.
NL2004945A (en) * 2009-08-14 2011-02-15 Asml Netherlands Bv Imprint lithography apparatus and method.
NL2004949A (en) * 2009-08-21 2011-02-22 Asml Netherlands Bv Inspection method and apparatus.
KR101470710B1 (en) 2009-08-26 2014-12-08 미쓰이 가가쿠 가부시키가이샤 Fluorine-containing cyclic olefin polymer composition, transcript obtained from said composition, and manufacturing method therefor
JP5515516B2 (en) * 2009-08-27 2014-06-11 大日本印刷株式会社 Nanoimprint method, pattern forming body, and nanoimprint apparatus
US8499810B2 (en) * 2009-08-27 2013-08-06 Transfer Devices Inc. Molecular transfer lithography apparatus and method for transferring patterned materials to a substrate
NL2005007A (en) * 2009-08-28 2011-03-01 Asml Netherlands Bv Imprint lithography method and apparatus.
JP5443103B2 (en) * 2009-09-10 2014-03-19 株式会社東芝 Pattern formation method
NL2005254A (en) * 2009-09-22 2011-03-23 Asml Netherlands Bv Imprint lithography method and apparatus.
NL2005263A (en) * 2009-09-29 2011-03-30 Asml Netherlands Bv Imprint lithography.
NL2005259A (en) * 2009-09-29 2011-03-30 Asml Netherlands Bv Imprint lithography.
US20110218756A1 (en) * 2009-10-01 2011-09-08 Mc10, Inc. Methods and apparatus for conformal sensing of force and/or acceleration at a person's head
WO2011041727A1 (en) 2009-10-01 2011-04-07 Mc10, Inc. Protective cases with integrated electronics
NL2005265A (en) * 2009-10-07 2011-04-11 Asml Netherlands Bv Imprint lithography apparatus and method.
US20110084417A1 (en) 2009-10-08 2011-04-14 Molecular Imprints, Inc. Large area linear array nanoimprinting
NL2005266A (en) 2009-10-28 2011-05-02 Asml Netherlands Bv Imprint lithography.
WO2011066450A2 (en) * 2009-11-24 2011-06-03 Molecular Imprints, Inc. Adhesion layers in nanoimprint lithography
US8691124B2 (en) 2009-11-24 2014-04-08 Asml Netherlands B.V. Alignment and imprint lithography
US9726973B2 (en) 2009-11-30 2017-08-08 Asml Netherlands B.V. Imprint lithography apparatus and method
NL2005436A (en) * 2009-11-30 2011-05-31 Asml Netherlands Bv Inspection method and apparatus.
TWI458126B (en) * 2009-12-10 2014-10-21 Nat Inst Chung Shan Science & Technology Method for forming thin-film structure of light-emitting device by nanoimprint
US9936574B2 (en) 2009-12-16 2018-04-03 The Board Of Trustees Of The University Of Illinois Waterproof stretchable optoelectronics
US10441185B2 (en) 2009-12-16 2019-10-15 The Board Of Trustees Of The University Of Illinois Flexible and stretchable electronic systems for epidermal electronics
JP5658271B2 (en) 2009-12-18 2015-01-21 エーエスエムエル ネザーランズ ビー.ブイ. Imprint lithography
NL2005735A (en) * 2009-12-23 2011-06-27 Asml Netherlands Bv Imprint lithographic apparatus and imprint lithographic method.
JP5033867B2 (en) * 2009-12-28 2012-09-26 株式会社日立ハイテクノロジーズ Fine structure, method for producing fine structure, and polymerizable resin composition for producing fine structure
JP5532939B2 (en) * 2010-01-14 2014-06-25 大日本印刷株式会社 Optical imprint mold and optical imprint method using the same
WO2011094317A2 (en) * 2010-01-26 2011-08-04 Molecular Imprints, Inc. Micro-conformal templates for nanoimprint lithography
US20110189329A1 (en) * 2010-01-29 2011-08-04 Molecular Imprints, Inc. Ultra-Compliant Nanoimprint Lithography Template
JP2011165950A (en) * 2010-02-10 2011-08-25 Toshiba Corp Pattern verification method, pattern generation method, device fabrication method, pattern verification program, and pattern verification system
NL2005865A (en) * 2010-02-16 2011-08-17 Asml Netherlands Bv Imprint lithography.
NL2005975A (en) 2010-03-03 2011-09-06 Asml Netherlands Bv Imprint lithography.
CN105496423A (en) * 2010-03-17 2016-04-20 伊利诺伊大学评议会 Implantable biomedical devices on bioresorbable substrates
NL2005992A (en) * 2010-03-22 2011-09-23 Asml Netherlands Bv Imprint lithography.
NL2006004A (en) * 2010-03-25 2011-09-27 Asml Netherlands Bv Imprint lithography.
JP5408014B2 (en) * 2010-04-14 2014-02-05 大日本印刷株式会社 Contact angle measurement method and nanoimprint method using the same
NL2006454A (en) 2010-05-03 2011-11-07 Asml Netherlands Bv Imprint lithography method and apparatus.
KR101675843B1 (en) 2010-05-04 2016-11-30 엘지디스플레이 주식회사 Flat display device and method of fabricating the same
NL2006747A (en) 2010-07-26 2012-01-30 Asml Netherlands Bv Imprint lithography alignment method and apparatus.
US9864279B2 (en) 2010-08-05 2018-01-09 Asml Netherlands B.V. Imprint lithography
US9310700B2 (en) 2010-08-13 2016-04-12 Asml Netherlands B.V. Lithography method and apparatus
NL2007128A (en) 2010-08-16 2012-02-20 Asml Netherlands Bv Imprint lithography inspection method and apparatus.
WO2012025316A1 (en) 2010-08-26 2012-03-01 Asml Netherlands B.V. Imprint lithography method and imprintable medium
JP5760412B2 (en) * 2010-12-08 2015-08-12 大日本印刷株式会社 imprint method and imprint apparatus
US8450131B2 (en) 2011-01-11 2013-05-28 Nanohmics, Inc. Imprinted semiconductor multiplex detection array
WO2012097163A1 (en) 2011-01-14 2012-07-19 The Board Of Trustees Of The University Of Illinois Optical component array having adjustable curvature
US9765934B2 (en) 2011-05-16 2017-09-19 The Board Of Trustees Of The University Of Illinois Thermally managed LED arrays assembled by printing
KR102000302B1 (en) 2011-05-27 2019-07-15 엠씨10, 인크 Electronic, optical and/or mechanical apparatus and systems and methods for fabricating same
US8934965B2 (en) 2011-06-03 2015-01-13 The Board Of Trustees Of The University Of Illinois Conformable actively multiplexed high-density surface electrode array for brain interfacing
JP6231489B2 (en) 2011-12-01 2017-11-15 ザ ボード オブ トラスティーズ オブ ザ ユニヴァーシティー オブ イリノイ Transition devices designed to undergo programmable changes
CN105283122A (en) 2012-03-30 2016-01-27 伊利诺伊大学评议会 Appendage mountable electronic devices conformable to surfaces
US9171794B2 (en) 2012-10-09 2015-10-27 Mc10, Inc. Embedding thin chips in polymer
US10189983B2 (en) 2012-12-28 2019-01-29 Toyo Gosei Co., Ltd. Curable resin composition, resin mold for imprinting, method for photo imprinting, method for manufacturing semiconductor integrated circuit, and method for manufacturing fine optical element
WO2014136731A1 (en) 2013-03-04 2014-09-12 東洋合成工業株式会社 Composition, resin mold, optical imprinting method, method for manufacturing optical element, and method for manufacturing electronic element
JP5744260B2 (en) * 2014-02-21 2015-07-08 東洋合成工業株式会社 Photocurable composition, mold, resin, method for producing optical element, and method for producing semiconductor integrated circuit
JP2017531840A (en) 2014-09-29 2017-10-26 マジック リープ,インコーポレイティド Structure and method for outputting light of different wavelengths from a waveguide
JP6011671B2 (en) * 2015-04-02 2016-10-19 大日本印刷株式会社 Imprint substrate and imprint method
US10167546B2 (en) 2015-04-29 2019-01-01 3M Innovative Properties Company Swellable film forming compositions and methods of nanoimprint lithography employing same
CA2989409A1 (en) 2015-06-15 2016-12-22 Magic Leap, Inc. Virtual and augmented reality systems and methods
US10488753B2 (en) 2015-09-08 2019-11-26 Canon Kabushiki Kaisha Substrate pretreatment and etch uniformity in nanoimprint lithography
US10134588B2 (en) 2016-03-31 2018-11-20 Canon Kabushiki Kaisha Imprint resist and substrate pretreatment for reducing fill time in nanoimprint lithography
US10095106B2 (en) * 2016-03-31 2018-10-09 Canon Kabushiki Kaisha Removing substrate pretreatment compositions in nanoimprint lithography
US10509313B2 (en) 2016-06-28 2019-12-17 Canon Kabushiki Kaisha Imprint resist with fluorinated photoinitiator and substrate pretreatment for reducing fill time in nanoimprint lithography
JP2019522368A (en) 2016-07-14 2019-08-08 モーフォトニクス ホールディング ベスローテン フェノーツハップMorphotonics Holding B.V. Apparatus for imprinting individual substrates with flexible stamps
CN106542494B (en) * 2016-09-26 2017-12-26 西北工业大学 A kind of method for preparing the not contour micro-nano structure of multilayer
US10371896B2 (en) 2016-12-22 2019-08-06 Magic Leap, Inc. Color separation in planar waveguides using dichroic filters
US10317793B2 (en) 2017-03-03 2019-06-11 Canon Kabushiki Kaisha Substrate pretreatment compositions for nanoimprint lithography
WO2019145418A1 (en) 2018-01-26 2019-08-01 Morphotonics Holding B.V. Process and equipment for texturing discrete substrates

Citations (91)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3810874A (en) * 1969-03-10 1974-05-14 Minnesota Mining & Mfg Polymers prepared from poly(perfluoro-alkylene oxide) compounds
US4512848A (en) * 1984-02-06 1985-04-23 Exxon Research And Engineering Co. Procedure for fabrication of microstructures over large areas using physical replication
US4614667A (en) * 1984-05-21 1986-09-30 Minnesota Mining And Manufacturing Company Composite low surface energy liner of perfluoropolyether
US4617238A (en) * 1982-04-01 1986-10-14 General Electric Company Vinyloxy-functional organopolysiloxane compositions
US4731155A (en) * 1987-04-15 1988-03-15 General Electric Company Process for forming a lithographic mask
US4826943A (en) * 1986-07-25 1989-05-02 Oki Electric Industry Co., Ltd. Negative resist material
US4931351A (en) * 1987-01-12 1990-06-05 Eastman Kodak Company Bilayer lithographic process
US4959252A (en) * 1986-09-29 1990-09-25 Rhone-Poulenc Chimie Highly oriented thermotropic optical disc member
US5028366A (en) * 1988-01-12 1991-07-02 Air Products And Chemicals, Inc. Water based mold release compositions for making molded polyurethane foam
US5110514A (en) * 1989-05-01 1992-05-05 Soane Technologies, Inc. Controlled casting of a shrinkable material
US5126006A (en) * 1990-10-30 1992-06-30 International Business Machines Corp. Plural level chip masking
US5206983A (en) * 1991-06-24 1993-05-04 Wisconsin Alumni Research Foundation Method of manufacturing micromechanical devices
US5240550A (en) * 1990-09-21 1993-08-31 U.S. Philips Corp. Method of forming at least one groove in a substrate layer
US5242711A (en) * 1991-08-16 1993-09-07 Rockwell International Corp. Nucleation control of diamond films by microlithographic patterning
US5259926A (en) * 1991-09-24 1993-11-09 Hitachi, Ltd. Method of manufacturing a thin-film pattern on a substrate
US5318870A (en) * 1989-10-18 1994-06-07 Massachusetts Institute Of Technology Method of patterning a phenolic polymer film without photoactive additive through exposure to high energy radiation below 225 nm with subsequent organometallic treatment and the associated imaged article
US5331020A (en) * 1991-11-14 1994-07-19 Dow Corning Limited Organosilicon compounds and compositions containing them
US5425848A (en) * 1993-03-16 1995-06-20 U.S. Philips Corporation Method of providing a patterned relief of cured photoresist on a flat substrate surface and device for carrying out such a method
US5439766A (en) * 1988-12-30 1995-08-08 International Business Machines Corporation Composition for photo imaging
US5480047A (en) * 1993-06-04 1996-01-02 Sharp Kabushiki Kaisha Method for forming a fine resist pattern
US5512131A (en) * 1993-10-04 1996-04-30 President And Fellows Of Harvard College Formation of microstamped patterns on surfaces and derivative articles
US5527662A (en) * 1990-05-24 1996-06-18 Matsushita Electric Industrial Co., Ltd. Process for forming fine pattern
US5542978A (en) * 1994-06-10 1996-08-06 Johnson & Johnson Vision Products, Inc. Apparatus for applying a surfactant to mold surfaces
US5545367A (en) * 1992-04-15 1996-08-13 Soane Technologies, Inc. Rapid prototype three dimensional stereolithography
US5594042A (en) * 1993-05-18 1997-01-14 Dow Corning Corporation Radiation curable compositions containing vinyl ether functional polyorganosiloxanes
US5601641A (en) * 1992-07-21 1997-02-11 Tse Industries, Inc. Mold release composition with polybutadiene and method of coating a mold core
US5629095A (en) * 1993-05-18 1997-05-13 Dow Corning Corporation Radiation curable compositions containing vinyl ether functional polysiloxanes and methods for the preparation
US5669303A (en) * 1996-03-04 1997-09-23 Motorola Apparatus and method for stamping a surface
US5725788A (en) * 1996-03-04 1998-03-10 Motorola Apparatus and method for patterning a surface
US5772905A (en) * 1995-11-15 1998-06-30 Regents Of The University Of Minnesota Nanoimprint lithography
US5776748A (en) * 1993-10-04 1998-07-07 President And Fellows Of Harvard College Method of formation of microstamped patterns on plates for adhesion of cells and other biological materials, devices and uses therefor
US5820769A (en) * 1995-05-24 1998-10-13 Regents Of The University Of Minnesota Method for making magnetic storage having discrete elements with quantized magnetic moments
US5888650A (en) * 1996-06-03 1999-03-30 Minnesota Mining And Manufacturing Company Temperature-responsive adhesive article
US5895263A (en) * 1996-12-19 1999-04-20 International Business Machines Corporation Process for manufacture of integrated circuit device
US5948470A (en) * 1997-04-28 1999-09-07 Harrison; Christopher Method of nanoscale patterning and products made thereby
US5965237A (en) * 1997-10-20 1999-10-12 Novartis Ag Microstructure device
US6046056A (en) * 1996-06-28 2000-04-04 Caliper Technologies Corporation High throughput screening assay systems in microscale fluidic devices
US6074827A (en) * 1996-07-30 2000-06-13 Aclara Biosciences, Inc. Microfluidic method for nucleic acid purification and processing
US6117708A (en) * 1998-02-05 2000-09-12 Micron Technology, Inc. Use of residual organic compounds to facilitate gate break on a carrier substrate for a semiconductor device
US6133396A (en) * 1997-01-10 2000-10-17 The Regents Of The University Of Michigan Highly processable hyperbranched polymer precursors to controlled chemical and phase purity fully dense SiC
US6132632A (en) * 1997-09-11 2000-10-17 International Business Machines Corporation Method and apparatus for achieving etch rate uniformity in a reactive ion etcher
US6168845B1 (en) * 1999-01-19 2001-01-02 International Business Machines Corporation Patterned magnetic media and method of making the same using selective oxidation
US6180239B1 (en) * 1993-10-04 2001-01-30 President And Fellows Of Harvard College Microcontact printing on surfaces and derivative articles
US6190929B1 (en) * 1999-07-23 2001-02-20 Micron Technology, Inc. Methods of forming semiconductor devices and methods of forming field emission displays
US6204343B1 (en) * 1996-12-11 2001-03-20 3M Innovative Properties Company Room temperature curable resin
US6218316B1 (en) * 1998-10-22 2001-04-17 Micron Technology, Inc. Planarization of non-planar surfaces in device fabrication
US6274294B1 (en) * 1999-02-03 2001-08-14 Electroformed Stents, Inc. Cylindrical photolithography exposure process and apparatus
US6304364B1 (en) * 1997-06-11 2001-10-16 President & Fellows Of Harvard College Elastomeric light valves
US6309580B1 (en) * 1995-11-15 2001-10-30 Regents Of The University Of Minnesota Release surfaces, particularly for use in nanoimprint lithography
US6334960B1 (en) * 1999-03-11 2002-01-01 Board Of Regents, The University Of Texas System Step and flash imprint lithography
US6344105B1 (en) * 1999-06-30 2002-02-05 Lam Research Corporation Techniques for improving etch rate uniformity
US6355198B1 (en) * 1996-03-15 2002-03-12 President And Fellows Of Harvard College Method of forming articles including waveguides via capillary micromolding and microtransfer molding
US20020042027A1 (en) * 1998-10-09 2002-04-11 Chou Stephen Y. Microscale patterning and articles formed thereby
US6391217B2 (en) * 1999-12-23 2002-05-21 University Of Massachusetts Methods and apparatus for forming submicron patterns on films
US20020132482A1 (en) * 2000-07-18 2002-09-19 Chou Stephen Y. Fluid pressure imprint lithography
US6468642B1 (en) * 1995-10-03 2002-10-22 N.V. Bekaert S.A. Fluorine-doped diamond-like coatings
US6503914B1 (en) * 2000-10-23 2003-01-07 Board Of Regents, The University Of Texas System Thienopyrimidine-based inhibitors of the Src family
US6517977B2 (en) * 2001-03-28 2003-02-11 Motorola, Inc. Lithographic template and method of formation and use
US6517995B1 (en) * 1999-09-14 2003-02-11 Massachusetts Institute Of Technology Fabrication of finely featured devices by liquid embossing
US6518189B1 (en) * 1995-11-15 2003-02-11 Regents Of The University Of Minnesota Method and apparatus for high density nanostructures
US6518168B1 (en) * 1995-08-18 2003-02-11 President And Fellows Of Harvard College Self-assembled monolayer directed patterning of surfaces
US6541356B2 (en) * 2001-05-21 2003-04-01 International Business Machines Corporation Ultimate SIMOX
US6544594B2 (en) * 1999-09-10 2003-04-08 Nano-Tex, Llc Water-repellent and soil-resistant finish for textiles
US20030080472A1 (en) * 2001-10-29 2003-05-01 Chou Stephen Y. Lithographic method with bonded release layer for molding small patterns
US6565776B1 (en) * 1999-06-11 2003-05-20 Bausch & Lomb Incorporated Lens molds with protective coatings for production of contact lenses and other ophthalmic products
US6580172B2 (en) * 2001-03-02 2003-06-17 Motorola, Inc. Lithographic template and method of formation and use
US20040009673A1 (en) * 2002-07-11 2004-01-15 Sreenivasan Sidlgata V. Method and system for imprint lithography using an electric field
US20040008334A1 (en) * 2002-07-11 2004-01-15 Sreenivasan Sidlgata V. Step and repeat imprint lithography systems
US20040007799A1 (en) * 2002-07-11 2004-01-15 Choi Byung Jin Formation of discontinuous films during an imprint lithography process
US20040022888A1 (en) * 2002-08-01 2004-02-05 Sreenivasan Sidlgata V. Alignment systems for imprint lithography
US20040021254A1 (en) * 2002-08-01 2004-02-05 Sreenivasan Sidlgata V. Alignment methods for imprint lithography
US20040021866A1 (en) * 2002-08-01 2004-02-05 Watts Michael P.C. Scatterometry alignment for imprint lithography
US6696220B2 (en) * 2000-10-12 2004-02-24 Board Of Regents, The University Of Texas System Template for room temperature, low pressure micro-and nano-imprint lithography
US20040036201A1 (en) * 2000-07-18 2004-02-26 Princeton University Methods and apparatus of field-induced pressure imprint lithography
US20040046288A1 (en) * 2000-07-18 2004-03-11 Chou Stephen Y. Laset assisted direct imprint lithography
US20040046271A1 (en) * 2002-09-05 2004-03-11 Watts Michael P.C. Functional patterning material for imprint lithography processes
US20040065252A1 (en) * 2002-10-04 2004-04-08 Sreenivasan Sidlgata V. Method of forming a layer on a substrate to facilitate fabrication of metrology standards
US6721529B2 (en) * 2001-09-21 2004-04-13 Nexpress Solutions Llc Release agent donor member having fluorocarbon thermoplastic random copolymer overcoat
US6737489B2 (en) * 2001-05-21 2004-05-18 3M Innovative Properties Company Polymers containing perfluorovinyl ethers and applications for such polymers
US20040110856A1 (en) * 2002-12-04 2004-06-10 Young Jung Gun Polymer solution for nanoimprint lithography to reduce imprint temperature and pressure
US20040124566A1 (en) * 2002-07-11 2004-07-01 Sreenivasan Sidlgata V. Step and repeat imprint lithography processes
US20040131718A1 (en) * 2000-07-18 2004-07-08 Princeton University Lithographic apparatus for fluid pressure imprint lithography
US20040137734A1 (en) * 1995-11-15 2004-07-15 Princeton University Compositions and processes for nanoimprinting
US6774183B1 (en) * 2000-04-27 2004-08-10 Bostik, Inc. Copolyesters having improved retained adhesion
US20040156108A1 (en) * 2001-10-29 2004-08-12 Chou Stephen Y. Articles comprising nanoscale patterns with reduced edge roughness and methods of making same
US6776094B1 (en) * 1993-10-04 2004-08-17 President & Fellows Of Harvard College Kit For Microcontact Printing
US20040170770A1 (en) * 2003-02-27 2004-09-02 Molecular Imprints, Inc. Method to reduce adhesion between a polymerizable layer and a substrate employing a fluorine-containing layer
US6790905B2 (en) * 2001-10-09 2004-09-14 E. I. Du Pont De Nemours And Company Highly repellent carpet protectants
US20040192041A1 (en) * 2003-03-27 2004-09-30 Jun-Ho Jeong UV nanoimprint lithography process using elementwise embossed stamp and selectively additive pressurization
US20040197843A1 (en) * 2001-07-25 2004-10-07 Chou Stephen Y. Nanochannel arrays and their preparation and use for high throughput macromolecular analysis
US6802870B2 (en) * 2001-05-25 2004-10-12 3M Innovative Properties Company Method for imparting soil and stain resistance to carpet

Family Cites Families (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3807027A (en) 1972-03-31 1974-04-30 Johns Manville Method of forming the bell end of a bell and spigot joint
US3811665A (en) 1972-09-05 1974-05-21 Bendix Corp Flexural pivot with diaphragm means
US3807029A (en) 1972-09-05 1974-04-30 Bendix Corp Method of making a flexural pivot
US4062600A (en) 1976-04-05 1977-12-13 Litton Systems, Inc. Dual-gimbal gyroscope flexure suspension
US4098001A (en) 1976-10-13 1978-07-04 The Charles Stark Draper Laboratory, Inc. Remote center compliance system
DE2800476A1 (en) 1977-01-07 1978-07-13 Instruments Sa Mass prodn. method for grids, graticules etc. - using revolving drum, belt carrying resin and UV light source for polymerisation process
US4155169A (en) 1978-03-16 1979-05-22 The Charles Stark Draper Laboratory, Inc. Compliant assembly system device
JPS6053675B2 (en) 1978-09-20 1985-11-27 Fuji Photo Film Co Ltd
US4202107A (en) 1978-10-23 1980-05-13 Watson Paul C Remote axis admittance system
US4337579A (en) 1980-04-16 1982-07-06 The Charles Stark Draper Laboratory, Inc. Deformable remote center compliance device
US4355469A (en) 1980-11-28 1982-10-26 The Charles Stark Draper Laboratory, Inc. Folded remote center compliance device
US4414750A (en) 1981-10-19 1983-11-15 The Charles Stark Draper Laboratory, Inc. Single stage remote center compliance device
JPH049379B2 (en) 1982-10-19 1992-02-20
US4451507A (en) 1982-10-29 1984-05-29 Rca Corporation Automatic liquid dispensing apparatus for spinning surface of uniform thickness
US4694703A (en) 1984-06-28 1987-09-22 Lear Siegler, Inc. Circumferentially oriented flexure suspension
JPH0558007B2 (en) * 1985-04-16 1993-08-25 Ube Industries
NL8600809A (en) 1986-03-28 1987-10-16 Philips Nv Method of providing a mold with a release layer.
US4929083A (en) 1986-06-19 1990-05-29 Xerox Corporation Focus and overlay characterization and optimization for photolithographic exposure
JPH0565303B2 (en) 1986-12-26 1993-09-17 Nippon Thompson Co Ltd
JPH01196749A (en) 1988-01-30 1989-08-08 Hoya Corp Manufacture of substrate for optical information recording medium
JPH0354569A (en) * 1989-07-24 1991-03-08 Dainippon Printing Co Ltd Formation of resist pattern
US5072126A (en) 1990-10-31 1991-12-10 International Business Machines Corporation Promixity alignment using polarized illumination and double conjugate projection lens
JPH04239684A (en) * 1991-01-24 1992-08-27 G T C:Kk Method for forming of fine pattern
JPH0553289A (en) 1991-08-22 1993-03-05 Nec Corp Production of phase shift reticle
US5317386A (en) 1991-09-06 1994-05-31 Eastman Kodak Company Optical monitor for measuring a gap between two rollers
JPH05109618A (en) * 1991-10-18 1993-04-30 Ricoh Co Ltd Manufacture of substrate for graphoepitaxy use
US5204739A (en) 1992-02-07 1993-04-20 Karl Suss America, Inc. Proximity mask alignment using a stored video image
EP0568478A1 (en) 1992-04-29 1993-11-03 International Business Machines Corporation Darkfield alignment system using a confocal spatial filter
US5348616A (en) 1993-05-03 1994-09-20 Motorola, Inc. Method for patterning a mold
US5900160A (en) 1993-10-04 1999-05-04 President And Fellows Of Harvard College Methods of etching articles via microcontact printing
NL9401260A (en) 1993-11-12 1995-06-01 Cornelis Johannes Maria Van Ri Membrane for microfiltration, ultra-filtration, gas separation and catalysis, method of manufacturing such a membrane, mold for the manufacture of such a membrane, as well as a variety of separation systems comprising such a membrane.
US5528118A (en) 1994-04-01 1996-06-18 Nikon Precision, Inc. Guideless stage with isolated reaction stage
US5425964A (en) 1994-07-22 1995-06-20 Rockwell International Corporation Deposition of multiple layer thin films using a broadband spectral monitor
US5515167A (en) 1994-09-13 1996-05-07 Hughes Aircraft Company Transparent optical chuck incorporating optical monitoring
DE19509452A1 (en) 1995-03-22 1996-09-26 Inst Mikrotechnik Mainz Gmbh Demolding tool for molding of microstructured components
JP3624476B2 (en) 1995-07-17 2005-03-02 セイコーエプソン株式会社 Manufacturing method of semiconductor laser device
US5566584A (en) 1995-08-31 1996-10-22 Beta Squared, Inc. Flexure support for a fixture positioning device
US5545570A (en) 1995-09-29 1996-08-13 Taiwan Semiconductor Manufacturing Company Method of inspecting first layer overlay shift in global alignment process
JP2842362B2 (en) 1996-02-29 1999-01-06 日本電気株式会社 Overlay measurement method
JP3832891B2 (en) 1996-03-28 2006-10-11 日本トムソン株式会社 XY table using linear electromagnetic actuator
US5802914A (en) 1996-05-30 1998-09-08 Eastman Kodak Company Alignment mechanism using flexures
US5779799A (en) 1996-06-21 1998-07-14 Micron Technology, Inc. Substrate coating apparatus
US6039897A (en) 1996-08-28 2000-03-21 University Of Washington Multiple patterned structures on a single substrate fabricated by elastomeric micro-molding techniques
JPH1096808A (en) * 1996-09-24 1998-04-14 Nippon Telegr & Teleph Corp <Ntt> Formation of fine pattern
US6143412A (en) 1997-02-10 2000-11-07 President And Fellows Of Harvard College Fabrication of carbon microstructures
DE19710420C2 (en) 1997-03-13 2001-07-12 Helmut Fischer Gmbh & Co Method and device for measuring the thicknesses of thin layers by means of X-ray fluorescence
JPH1115156A (en) * 1997-06-24 1999-01-22 Hitachi Chem Co Ltd Photosensitive resin composition and manufacture of semiconductor element
US5912049A (en) 1997-08-12 1999-06-15 Micron Technology, Inc. Process liquid dispense method and apparatus
US5877861A (en) 1997-11-14 1999-03-02 International Business Machines Corporation Method for overlay control system
US5991022A (en) 1997-12-09 1999-11-23 N&K Technology, Inc. Reflectance spectrophotometric apparatus with toroidal mirrors
TW352421B (en) 1998-04-27 1999-02-11 United Microelectronics Corp Method and process of phase shifting mask
US6204922B1 (en) 1998-12-11 2001-03-20 Filmetrics, Inc. Rapid and accurate thin film measurement of individual layers in a multi-layered or patterned sample
US6873087B1 (en) 1999-10-29 2005-03-29 Board Of Regents, The University Of Texas System High precision orientation alignment and gap control stages for imprint lithography processes
US6355994B1 (en) 1999-11-05 2002-03-12 Multibeam Systems, Inc. Precision stage
US6091485A (en) 1999-12-15 2000-07-18 N & K Technology, Inc. Method and apparatus for optically determining physical parameters of underlayers

Patent Citations (99)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3810874A (en) * 1969-03-10 1974-05-14 Minnesota Mining & Mfg Polymers prepared from poly(perfluoro-alkylene oxide) compounds
US4617238A (en) * 1982-04-01 1986-10-14 General Electric Company Vinyloxy-functional organopolysiloxane compositions
US4512848A (en) * 1984-02-06 1985-04-23 Exxon Research And Engineering Co. Procedure for fabrication of microstructures over large areas using physical replication
US4614667A (en) * 1984-05-21 1986-09-30 Minnesota Mining And Manufacturing Company Composite low surface energy liner of perfluoropolyether
US4826943A (en) * 1986-07-25 1989-05-02 Oki Electric Industry Co., Ltd. Negative resist material
US4959252A (en) * 1986-09-29 1990-09-25 Rhone-Poulenc Chimie Highly oriented thermotropic optical disc member
US4931351A (en) * 1987-01-12 1990-06-05 Eastman Kodak Company Bilayer lithographic process
US4731155A (en) * 1987-04-15 1988-03-15 General Electric Company Process for forming a lithographic mask
US5028366A (en) * 1988-01-12 1991-07-02 Air Products And Chemicals, Inc. Water based mold release compositions for making molded polyurethane foam
US5439766A (en) * 1988-12-30 1995-08-08 International Business Machines Corporation Composition for photo imaging
US5110514A (en) * 1989-05-01 1992-05-05 Soane Technologies, Inc. Controlled casting of a shrinkable material
US5318870A (en) * 1989-10-18 1994-06-07 Massachusetts Institute Of Technology Method of patterning a phenolic polymer film without photoactive additive through exposure to high energy radiation below 225 nm with subsequent organometallic treatment and the associated imaged article
US5527662A (en) * 1990-05-24 1996-06-18 Matsushita Electric Industrial Co., Ltd. Process for forming fine pattern
US5240550A (en) * 1990-09-21 1993-08-31 U.S. Philips Corp. Method of forming at least one groove in a substrate layer
US5126006A (en) * 1990-10-30 1992-06-30 International Business Machines Corp. Plural level chip masking
US5206983A (en) * 1991-06-24 1993-05-04 Wisconsin Alumni Research Foundation Method of manufacturing micromechanical devices
US5242711A (en) * 1991-08-16 1993-09-07 Rockwell International Corp. Nucleation control of diamond films by microlithographic patterning
US5259926A (en) * 1991-09-24 1993-11-09 Hitachi, Ltd. Method of manufacturing a thin-film pattern on a substrate
US5331020A (en) * 1991-11-14 1994-07-19 Dow Corning Limited Organosilicon compounds and compositions containing them
US5545367A (en) * 1992-04-15 1996-08-13 Soane Technologies, Inc. Rapid prototype three dimensional stereolithography
US5601641A (en) * 1992-07-21 1997-02-11 Tse Industries, Inc. Mold release composition with polybutadiene and method of coating a mold core
US5425848A (en) * 1993-03-16 1995-06-20 U.S. Philips Corporation Method of providing a patterned relief of cured photoresist on a flat substrate surface and device for carrying out such a method
US5861467A (en) * 1993-05-18 1999-01-19 Dow Corning Corporation Radiation curable siloxane compositions containing vinyl ether functionality and methods for their preparation
US5629095A (en) * 1993-05-18 1997-05-13 Dow Corning Corporation Radiation curable compositions containing vinyl ether functional polysiloxanes and methods for the preparation
US5594042A (en) * 1993-05-18 1997-01-14 Dow Corning Corporation Radiation curable compositions containing vinyl ether functional polyorganosiloxanes
US5480047A (en) * 1993-06-04 1996-01-02 Sharp Kabushiki Kaisha Method for forming a fine resist pattern
US5776748A (en) * 1993-10-04 1998-07-07 President And Fellows Of Harvard College Method of formation of microstamped patterns on plates for adhesion of cells and other biological materials, devices and uses therefor
US6180239B1 (en) * 1993-10-04 2001-01-30 President And Fellows Of Harvard College Microcontact printing on surfaces and derivative articles
US5512131A (en) * 1993-10-04 1996-04-30 President And Fellows Of Harvard College Formation of microstamped patterns on surfaces and derivative articles
US6776094B1 (en) * 1993-10-04 2004-08-17 President & Fellows Of Harvard College Kit For Microcontact Printing
US5542978A (en) * 1994-06-10 1996-08-06 Johnson & Johnson Vision Products, Inc. Apparatus for applying a surfactant to mold surfaces
US5956216A (en) * 1995-05-24 1999-09-21 Regents Of The University Of Minnesota Magnetic storage having discrete elements with quantized magnetic moments
US5820769A (en) * 1995-05-24 1998-10-13 Regents Of The University Of Minnesota Method for making magnetic storage having discrete elements with quantized magnetic moments
US6518168B1 (en) * 1995-08-18 2003-02-11 President And Fellows Of Harvard College Self-assembled monolayer directed patterning of surfaces
US6468642B1 (en) * 1995-10-03 2002-10-22 N.V. Bekaert S.A. Fluorine-doped diamond-like coatings
US6309580B1 (en) * 1995-11-15 2001-10-30 Regents Of The University Of Minnesota Release surfaces, particularly for use in nanoimprint lithography
US20040137734A1 (en) * 1995-11-15 2004-07-15 Princeton University Compositions and processes for nanoimprinting
US5772905A (en) * 1995-11-15 1998-06-30 Regents Of The University Of Minnesota Nanoimprint lithography
US6518189B1 (en) * 1995-11-15 2003-02-11 Regents Of The University Of Minnesota Method and apparatus for high density nanostructures
US6809356B2 (en) * 1995-11-15 2004-10-26 Regents Of The University Of Minnesota Method and apparatus for high density nanostructures
US5669303A (en) * 1996-03-04 1997-09-23 Motorola Apparatus and method for stamping a surface
US5725788A (en) * 1996-03-04 1998-03-10 Motorola Apparatus and method for patterning a surface
US6355198B1 (en) * 1996-03-15 2002-03-12 President And Fellows Of Harvard College Method of forming articles including waveguides via capillary micromolding and microtransfer molding
US5888650A (en) * 1996-06-03 1999-03-30 Minnesota Mining And Manufacturing Company Temperature-responsive adhesive article
US6046056A (en) * 1996-06-28 2000-04-04 Caliper Technologies Corporation High throughput screening assay systems in microscale fluidic devices
US6074827A (en) * 1996-07-30 2000-06-13 Aclara Biosciences, Inc. Microfluidic method for nucleic acid purification and processing
US6204343B1 (en) * 1996-12-11 2001-03-20 3M Innovative Properties Company Room temperature curable resin
US5895263A (en) * 1996-12-19 1999-04-20 International Business Machines Corporation Process for manufacture of integrated circuit device
US6133396A (en) * 1997-01-10 2000-10-17 The Regents Of The University Of Michigan Highly processable hyperbranched polymer precursors to controlled chemical and phase purity fully dense SiC
US5948470A (en) * 1997-04-28 1999-09-07 Harrison; Christopher Method of nanoscale patterning and products made thereby
US6304364B1 (en) * 1997-06-11 2001-10-16 President & Fellows Of Harvard College Elastomeric light valves
US6132632A (en) * 1997-09-11 2000-10-17 International Business Machines Corporation Method and apparatus for achieving etch rate uniformity in a reactive ion etcher
US5965237A (en) * 1997-10-20 1999-10-12 Novartis Ag Microstructure device
US6117708A (en) * 1998-02-05 2000-09-12 Micron Technology, Inc. Use of residual organic compounds to facilitate gate break on a carrier substrate for a semiconductor device
US20030034329A1 (en) * 1998-06-30 2003-02-20 Chou Stephen Y. Lithographic method for molding pattern with nanoscale depth
US20020042027A1 (en) * 1998-10-09 2002-04-11 Chou Stephen Y. Microscale patterning and articles formed thereby
US6713238B1 (en) * 1998-10-09 2004-03-30 Stephen Y. Chou Microscale patterning and articles formed thereby
US20040118809A1 (en) * 1998-10-09 2004-06-24 Chou Stephen Y. Microscale patterning and articles formed thereby
US6218316B1 (en) * 1998-10-22 2001-04-17 Micron Technology, Inc. Planarization of non-planar surfaces in device fabrication
US6168845B1 (en) * 1999-01-19 2001-01-02 International Business Machines Corporation Patterned magnetic media and method of making the same using selective oxidation
US6274294B1 (en) * 1999-02-03 2001-08-14 Electroformed Stents, Inc. Cylindrical photolithography exposure process and apparatus
US6334960B1 (en) * 1999-03-11 2002-01-01 Board Of Regents, The University Of Texas System Step and flash imprint lithography
US6719915B2 (en) * 1999-03-11 2004-04-13 Board Of Regents, The University Of Texas System Step and flash imprint lithography
US6565776B1 (en) * 1999-06-11 2003-05-20 Bausch & Lomb Incorporated Lens molds with protective coatings for production of contact lenses and other ophthalmic products
US6344105B1 (en) * 1999-06-30 2002-02-05 Lam Research Corporation Techniques for improving etch rate uniformity
US6190929B1 (en) * 1999-07-23 2001-02-20 Micron Technology, Inc. Methods of forming semiconductor devices and methods of forming field emission displays
US6544594B2 (en) * 1999-09-10 2003-04-08 Nano-Tex, Llc Water-repellent and soil-resistant finish for textiles
US6517995B1 (en) * 1999-09-14 2003-02-11 Massachusetts Institute Of Technology Fabrication of finely featured devices by liquid embossing
US6391217B2 (en) * 1999-12-23 2002-05-21 University Of Massachusetts Methods and apparatus for forming submicron patterns on films
US6774183B1 (en) * 2000-04-27 2004-08-10 Bostik, Inc. Copolyesters having improved retained adhesion
US20040131718A1 (en) * 2000-07-18 2004-07-08 Princeton University Lithographic apparatus for fluid pressure imprint lithography
US20040046288A1 (en) * 2000-07-18 2004-03-11 Chou Stephen Y. Laset assisted direct imprint lithography
US20040036201A1 (en) * 2000-07-18 2004-02-26 Princeton University Methods and apparatus of field-induced pressure imprint lithography
US20020132482A1 (en) * 2000-07-18 2002-09-19 Chou Stephen Y. Fluid pressure imprint lithography
US6696220B2 (en) * 2000-10-12 2004-02-24 Board Of Regents, The University Of Texas System Template for room temperature, low pressure micro-and nano-imprint lithography
US6503914B1 (en) * 2000-10-23 2003-01-07 Board Of Regents, The University Of Texas System Thienopyrimidine-based inhibitors of the Src family
US6580172B2 (en) * 2001-03-02 2003-06-17 Motorola, Inc. Lithographic template and method of formation and use
US6517977B2 (en) * 2001-03-28 2003-02-11 Motorola, Inc. Lithographic template and method of formation and use
US6541356B2 (en) * 2001-05-21 2003-04-01 International Business Machines Corporation Ultimate SIMOX
US6737489B2 (en) * 2001-05-21 2004-05-18 3M Innovative Properties Company Polymers containing perfluorovinyl ethers and applications for such polymers
US6802870B2 (en) * 2001-05-25 2004-10-12 3M Innovative Properties Company Method for imparting soil and stain resistance to carpet
US20040197843A1 (en) * 2001-07-25 2004-10-07 Chou Stephen Y. Nanochannel arrays and their preparation and use for high throughput macromolecular analysis
US6721529B2 (en) * 2001-09-21 2004-04-13 Nexpress Solutions Llc Release agent donor member having fluorocarbon thermoplastic random copolymer overcoat
US6790905B2 (en) * 2001-10-09 2004-09-14 E. I. Du Pont De Nemours And Company Highly repellent carpet protectants
US20040156108A1 (en) * 2001-10-29 2004-08-12 Chou Stephen Y. Articles comprising nanoscale patterns with reduced edge roughness and methods of making same
US20030080471A1 (en) * 2001-10-29 2003-05-01 Chou Stephen Y. Lithographic method for molding pattern with nanoscale features
US20030080472A1 (en) * 2001-10-29 2003-05-01 Chou Stephen Y. Lithographic method with bonded release layer for molding small patterns
US20040009673A1 (en) * 2002-07-11 2004-01-15 Sreenivasan Sidlgata V. Method and system for imprint lithography using an electric field
US20040124566A1 (en) * 2002-07-11 2004-07-01 Sreenivasan Sidlgata V. Step and repeat imprint lithography processes
US20040007799A1 (en) * 2002-07-11 2004-01-15 Choi Byung Jin Formation of discontinuous films during an imprint lithography process
US20040008334A1 (en) * 2002-07-11 2004-01-15 Sreenivasan Sidlgata V. Step and repeat imprint lithography systems
US20040022888A1 (en) * 2002-08-01 2004-02-05 Sreenivasan Sidlgata V. Alignment systems for imprint lithography
US20040021254A1 (en) * 2002-08-01 2004-02-05 Sreenivasan Sidlgata V. Alignment methods for imprint lithography
US20040021866A1 (en) * 2002-08-01 2004-02-05 Watts Michael P.C. Scatterometry alignment for imprint lithography
US20040046271A1 (en) * 2002-09-05 2004-03-11 Watts Michael P.C. Functional patterning material for imprint lithography processes
US20040065252A1 (en) * 2002-10-04 2004-04-08 Sreenivasan Sidlgata V. Method of forming a layer on a substrate to facilitate fabrication of metrology standards
US20040110856A1 (en) * 2002-12-04 2004-06-10 Young Jung Gun Polymer solution for nanoimprint lithography to reduce imprint temperature and pressure
US20040170770A1 (en) * 2003-02-27 2004-09-02 Molecular Imprints, Inc. Method to reduce adhesion between a polymerizable layer and a substrate employing a fluorine-containing layer
US20040192041A1 (en) * 2003-03-27 2004-09-30 Jun-Ho Jeong UV nanoimprint lithography process using elementwise embossed stamp and selectively additive pressurization

Cited By (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9223202B2 (en) 2000-07-17 2015-12-29 Board Of Regents, The University Of Texas System Method of automatic fluid dispensing for imprint lithography processes
US7708926B2 (en) 2002-07-11 2010-05-04 Molecular Imprints, Inc. Capillary imprinting technique
US20080174046A1 (en) * 2002-07-11 2008-07-24 Molecular Imprints Inc. Capillary Imprinting Technique
US7691313B2 (en) 2002-11-13 2010-04-06 Molecular Imprints, Inc. Method for expelling gas positioned between a substrate and a mold
US20090272875A1 (en) * 2003-06-17 2009-11-05 Molecular Imprints, Inc. Composition to Reduce Adhesion Between a Conformable Region and a Mold
US8152511B2 (en) 2003-06-17 2012-04-10 Molecular Imprints, Inc. Composition to reduce adhesion between a conformable region and a mold
US8211214B2 (en) 2003-10-02 2012-07-03 Molecular Imprints, Inc. Single phase fluid imprint lithography method
US8268220B2 (en) 2004-01-23 2012-09-18 Molecular Imprints, Inc. Imprint lithography method
US20110031651A1 (en) * 2004-01-23 2011-02-10 Molecular Imprints, Inc. Desirable wetting and release between an imprint lithography mold and a polymerizable composition
US7837921B2 (en) 2004-01-23 2010-11-23 Molecular Imprints, Inc. Method of providing desirable wetting and release characteristics between a mold and a polymerizable composition
US20050270312A1 (en) * 2004-06-03 2005-12-08 Molecular Imprints, Inc. Fluid dispensing and drop-on-demand dispensing for nano-scale manufacturing
US8647554B2 (en) 2004-06-15 2014-02-11 Molecular Imprints, Inc. Residual layer thickness measurement and correction
US7939131B2 (en) 2004-08-16 2011-05-10 Molecular Imprints, Inc. Method to provide a layer with uniform etch characteristics
US7981481B2 (en) 2004-09-23 2011-07-19 Molecular Imprints, Inc. Method for controlling distribution of fluid components on a body
US7307118B2 (en) * 2004-11-24 2007-12-11 Molecular Imprints, Inc. Composition to reduce adhesion between a conformable region and a mold
US20110215503A1 (en) * 2004-11-24 2011-09-08 Molecular Imprints, Inc. Reducing Adhesion between a Conformable Region and a Mold
US8557351B2 (en) 2005-07-22 2013-10-15 Molecular Imprints, Inc. Method for adhering materials together
US8808808B2 (en) 2005-07-22 2014-08-19 Molecular Imprints, Inc. Method for imprint lithography utilizing an adhesion primer layer
US20070017631A1 (en) * 2005-07-22 2007-01-25 Molecular Imprints, Inc. Method for adhering materials together
US7759407B2 (en) 2005-07-22 2010-07-20 Molecular Imprints, Inc. Composition for adhering materials together
US8142703B2 (en) 2005-10-05 2012-03-27 Molecular Imprints, Inc. Imprint lithography method
US7906058B2 (en) 2005-12-01 2011-03-15 Molecular Imprints, Inc. Bifurcated contact printing technique
US7670529B2 (en) 2005-12-08 2010-03-02 Molecular Imprints, Inc. Method and system for double-sided patterning of substrates
US7670530B2 (en) 2006-01-20 2010-03-02 Molecular Imprints, Inc. Patterning substrates employing multiple chucks
US20070231981A1 (en) * 2006-04-03 2007-10-04 Molecular Imprints, Inc. Patterning a Plurality of Fields on a Substrate to Compensate for Differing Evaporation Times
US8142850B2 (en) 2006-04-03 2012-03-27 Molecular Imprints, Inc. Patterning a plurality of fields on a substrate to compensate for differing evaporation times
US8012395B2 (en) 2006-04-18 2011-09-06 Molecular Imprints, Inc. Template having alignment marks formed of contrast material
US8215946B2 (en) 2006-05-18 2012-07-10 Molecular Imprints, Inc. Imprint lithography system and method
US20080308971A1 (en) * 2007-06-18 2008-12-18 Molecular Imprints, Inc. Solvent-Assisted Layer Formation for Imprint Lithography
US8142702B2 (en) 2007-06-18 2012-03-27 Molecular Imprints, Inc. Solvent-assisted layer formation for imprint lithography
US20090014917A1 (en) * 2007-07-10 2009-01-15 Molecular Imprints, Inc. Drop Pattern Generation for Imprint Lithography
US8119052B2 (en) 2007-11-02 2012-02-21 Molecular Imprints, Inc. Drop pattern generation for imprint lithography
US20090115110A1 (en) * 2007-11-02 2009-05-07 Molecular Imprints, Inc. Drop Pattern Generation for Imprint Lithography
US8945444B2 (en) 2007-12-04 2015-02-03 Canon Nanotechnologies, Inc. High throughput imprint based on contact line motion tracking control
US20090140445A1 (en) * 2007-12-04 2009-06-04 Molecular Imprints High Throughput Imprint Based on Contact Line Motion Tracking Control
US8097539B2 (en) * 2008-01-10 2012-01-17 Kabushiki Kaisha Toshiba Imprint mask manufacturing method for nanoimprinting
US8658537B2 (en) * 2008-01-10 2014-02-25 Kabushiki Kaisha Toshiba Mask manufacturing method for nanoimprinting
US8653483B2 (en) 2008-01-10 2014-02-18 Kabushiki Kaisha Toshiba Mask manufacturing device
US20100003830A1 (en) * 2008-01-10 2010-01-07 Masamitsu Itoh Imprint mask manufacturing method, imprint mask manufacturing device, and semiconductor device manufacturing method
US8502171B2 (en) 2008-01-10 2013-08-06 Kabushiki Kaisha Toshiba Mask manufacturing device
US20090200710A1 (en) * 2008-02-08 2009-08-13 Molecular Imprints, Inc. Extrusion reduction in imprint lithography
US8361371B2 (en) 2008-02-08 2013-01-29 Molecular Imprints, Inc. Extrusion reduction in imprint lithography
US20090243153A1 (en) * 2008-04-01 2009-10-01 Molecular Imprints, Inc. Large Area Roll-To-Roll Imprint Lithography
US8187515B2 (en) 2008-04-01 2012-05-29 Molecular Imprints, Inc. Large area roll-to-roll imprint lithography
US8586126B2 (en) 2008-10-21 2013-11-19 Molecular Imprints, Inc. Robust optimization to generate drop patterns in imprint lithography which are tolerant of variations in drop volume and drop placement
US8512797B2 (en) 2008-10-21 2013-08-20 Molecular Imprints, Inc. Drop pattern generation with edge weighting
US20100098859A1 (en) * 2008-10-21 2010-04-22 Molecular Imprints, Inc. Drop Pattern Generation with Edge Weighting
US20100112220A1 (en) * 2008-11-03 2010-05-06 Molecular Imprints, Inc. Dispense system set-up and characterization
US20100109195A1 (en) * 2008-11-05 2010-05-06 Molecular Imprints, Inc. Release agent partition control in imprint lithography
US8637587B2 (en) 2008-11-05 2014-01-28 Molecular Imprints, Inc. Release agent partition control in imprint lithography
CN102508408A (en) * 2011-10-27 2012-06-20 无锡英普林纳米科技有限公司 Dual-solidification nanoimprint lithography transporting layer material
CN103378231A (en) * 2012-04-23 2013-10-30 奈米晶光电股份有限公司 Method for production of selective growth masks using imprint lithography

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US20010040145A1 (en) 2001-11-15
WO2000054107A1 (en) 2000-09-14

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