US12219694B2 - Battery wiring module - Google Patents

Battery wiring module Download PDF

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Publication number
US12219694B2
US12219694B2 US17/773,946 US202017773946A US12219694B2 US 12219694 B2 US12219694 B2 US 12219694B2 US 202017773946 A US202017773946 A US 202017773946A US 12219694 B2 US12219694 B2 US 12219694B2
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Prior art keywords
wiring
surface wiring
back surface
front surface
conduction part
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US17/773,946
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English (en)
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US20220377881A1 (en
Inventor
Hideo Takahashi
Shinichi Takase
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Sumitomo Wiring Systems Ltd
AutoNetworks Technologies Ltd
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Wiring Systems Ltd
AutoNetworks Technologies Ltd
Sumitomo Electric Industries Ltd
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Application filed by Sumitomo Wiring Systems Ltd, AutoNetworks Technologies Ltd, Sumitomo Electric Industries Ltd filed Critical Sumitomo Wiring Systems Ltd
Assigned to AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO WIRING SYSTEMS, LTD. reassignment AUTONETWORKS TECHNOLOGIES, LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: TAKAHASHI, HIDEO, TAKASE, SHINICHI
Publication of US20220377881A1 publication Critical patent/US20220377881A1/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/36—Arrangements for testing, measuring or monitoring the electrical condition of accumulators or electric batteries, e.g. capacity or state of charge [SoC]
    • G01R31/385—Arrangements for measuring battery or accumulator variables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
    • H01G11/10—Multiple hybrid or EDL capacitors, e.g. arrays or modules
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
    • H01M10/425—Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
    • H01M10/48—Accumulators combined with arrangements for measuring, testing or indicating the condition of cells, e.g. the level or density of the electrolyte
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
    • H01M10/48—Accumulators combined with arrangements for measuring, testing or indicating the condition of cells, e.g. the level or density of the electrolyte
    • H01M10/482—Accumulators combined with arrangements for measuring, testing or indicating the condition of cells, e.g. the level or density of the electrolyte for several batteries or cells simultaneously or sequentially
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
    • H01M50/204—Racks, modules or packs for multiple batteries or multiple cells
    • H01M50/207—Racks, modules or packs for multiple batteries or multiple cells characterised by their shape
    • H01M50/209—Racks, modules or packs for multiple batteries or multiple cells characterised by their shape adapted for prismatic or rectangular cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
    • H01M50/284—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders with incorporated circuit boards, e.g. printed circuit boards [PCB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
    • H01M50/298—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders characterised by the wiring of battery packs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50—Current conducting connections for cells or batteries
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50—Current conducting connections for cells or batteries
    • H01M50/502—Interconnectors for connecting terminals of adjacent batteries; Interconnectors for connecting cells outside a battery casing
    • H01M50/507—Interconnectors for connecting terminals of adjacent batteries; Interconnectors for connecting cells outside a battery casing comprising an arrangement of two or more busbars within a container structure, e.g. busbar modules
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50—Current conducting connections for cells or batteries
    • H01M50/502—Interconnectors for connecting terminals of adjacent batteries; Interconnectors for connecting cells outside a battery casing
    • H01M50/514—Methods for interconnecting adjacent batteries or cells
    • H01M50/516—Methods for interconnecting adjacent batteries or cells by welding, soldering or brazing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50—Current conducting connections for cells or batteries
    • H01M50/502—Interconnectors for connecting terminals of adjacent batteries; Interconnectors for connecting cells outside a battery casing
    • H01M50/519—Interconnectors for connecting terminals of adjacent batteries; Interconnectors for connecting cells outside a battery casing comprising printed circuit boards [PCB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50—Current conducting connections for cells or batteries
    • H01M50/502—Interconnectors for connecting terminals of adjacent batteries; Interconnectors for connecting cells outside a battery casing
    • H01M50/521—Interconnectors for connecting terminals of adjacent batteries; Interconnectors for connecting cells outside a battery casing characterised by the material
    • H01M50/522—Inorganic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50—Current conducting connections for cells or batteries
    • H01M50/569—Constructional details of current conducting connections for detecting conditions inside cells or batteries, e.g. details of voltage sensing terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
    • H01M10/425—Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing
    • H01M2010/4271—Battery management systems including electronic circuits, e.g. control of current or voltage to keep battery in healthy state, cell balancing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M2220/00—Batteries for particular applications
    • H01M2220/20—Batteries in motive systems, e.g. vehicle, ship, plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Definitions

  • a battery wiring module including a plurality of connecting members that are connected to electrode terminals of the power storage elements and a plurality of voltage detection lines for detecting the voltages of the power storage elements is attached to the plurality of power storage elements, and is able to monitor the voltages of the power storage elements.
  • the plurality of voltage detection lines are constituted using printed wirings of a flexible printed circuit board
  • the degree of freedom in routing the voltage detection lines is restricted, compared with the case where the plurality of voltage detection lines are respectively constituted by different coated wires.
  • the conceivable risk of short circuits via the jumper wires along with other issues make this countermeasure less than ideal.
  • a battery wiring module having a novel structure that is able to improve the degree of freedom in routing of voltage detection lines constituted by printed wirings of a flexible printed circuit board without the accompanying problem of short circuits is disclosed.
  • the degree of freedom in routing of voltage detection lines constituted by printed wirings of a flexible printed circuit board can be improved without the accompanying problem of short circuits.
  • FIG. 1 is a plan view showing a battery wiring module according to a first embodiment of the present disclosure.
  • FIG. 2 is an enlarged plan view of a front-back conduction part shown in FIG. 1 .
  • FIG. 4 is an enlarged cross-sectional view taken along line IV-IV in FIG. 2 .
  • FIG. 5 is an enlarged plan view showing a front-back conduction part of a battery wiring module according to a second embodiment.
  • a battery wiring module of the present disclosure is a battery wiring module to be arranged on a plurality of power storage elements each having an electrode terminal, the battery wiring module including a plurality of connecting members to be connected to the electrode terminals, and a flexible printed circuit board having a plurality of voltage detection lines for detecting voltages of the plurality of power storage elements via the plurality of connecting members, at least one of the plurality of voltage detection lines being constituted to include a front surface wiring and a back surface wiring respectively formed on a front surface and a back surface of the flexible printed circuit board, and a front-back conduction part passing through the flexible printed circuit board in a plate thickness direction and connecting the front surface wiring and the back surface wiring, and a resistance value per unit length of the front-back conduction part being less than or equal to a maximum resistance value per unit length of the front surface wiring and the back surface wiring.
  • At least one of a plurality of voltage detection lines is constituted to include a front surface wiring and a back surface wiring respectively formed on the front surface and the back surface of a flexible printed circuit board, and a front-back conduction part connecting the front and back surface wirings.
  • the desired arrangement can thereby be realized by suitably combining and connecting front surface wirings with back surface wirings via front-back conduction parts.
  • the maximum resistance value per unit length of the front and back surface wirings may be the resistance value of wiring configuration portions of the wirings, and does not include current limiting regions such as chip fuses and positive temperature coefficient thermistors intermediately positioned in the wirings.
  • the front-back conduction part has an elliptical shape whose long axis is in a lengthwise direction of the front surface wiring and the back surface wiring.
  • the front-back conduction part By forming the front-back conduction part in an elliptical shape whose long axis is in the lengthwise direction of the front and back surface wirings, a large cross-sectional area of the front-back conduction part can be secured with respect to the front and back surface wirings whose wiring width is limited.
  • the resistance value per unit length of the front-back conduction part can be advantageously reduced, and setting this resistance value to less than or equal to the maximum resistance value per unit length of the front and back surface wirings can be easily realized.
  • the front-back conduction part is constituted by at least one via consisting of a through hole passing through a multilayer wiring region where the front surface wiring and the back surface wiring overlap each other in projection in the plate thickness direction of the flexible printed circuit board and a metal plating layer adhered to a peripheral wall of the through hole to form a tubular shape and respectively connected, on an upper end side and a lower end side, to the front surface wiring and the back surface wiring.
  • the connecting bus bar 18 and the output bus bar 20 are formed by pressing a metal plate material into a predetermined shape.
  • a metal having high thermal conductivity and low electrical resistance such as copper, a copper alloy, aluminum and an aluminum alloy can be selected as appropriate.
  • a plating layer not shown may be formed on the surface of the connecting bus bar 18 and the output bus bar 20 .
  • any suitable metal such as tin, nickel and solder can be selected.
  • the connecting bus bar 18 connects adjacent electrode terminals 16 in a state of straddling the adjacent electrode terminals 16 .
  • the output bus bar 20 is connected to one electrode terminal 16 and outputs power to an external device not shown.
  • five connecting bus bars 18 connect adjacent electrode terminals 16 .
  • the plurality of power storage elements 12 are connected in series by these connecting bus bars 18 .
  • the connecting bus bars 18 , the output bus bars 20 and the electrode terminals 16 are electrically and physically connected by a known technique such as soldering, welding and bolting.
  • the numbers 0 to 6 given to the connecting bus bars 18 and the output bus bars 20 indicate the order of the respective potentials of the six storage elements 12 to which the connecting bus bars 18 and the output bus bars 20 are connected.
  • the potential of the electrode terminal 16 connected to the output bus bar 20 numbered 0 is the lowest, and increases in order from 1 to 5, with the potential of the electrode terminal 16 connected to the output bus bar 20 numbered 6 being the highest.
  • the conventional problem of it being difficult to arrange front surface wirings 30 described later in potential order is resolved.
  • a connector 22 is provided at the connecting end portion of the battery wiring module 14 .
  • the connector 22 is connected to an external device not shown that includes a circuit or microcomputer for use in voltage detection therein.
  • the battery wiring module 14 is placed on the upper surface of the six power storage elements 12 .
  • the battery wiring module 14 according to the present embodiment includes a two-layer board 24 having flexibility and the connector 22 connected to the two-layer board 24 .
  • the front-back conduction part 32 is formed in a multilayer wiring region 36 where the front surface wiring 30 and the back surface wiring 34 overlap each other at one end portion in the lengthwise direction, in projection in the plate thickness direction (direction perpendicular to the page in FIG. 2 ) of the two-layer board 24 .
  • the front-back conduction part 32 is constituted by one via 43 consisting of a through hole 38 passing through this multilayer wiring region 36 in the plate thickness direction and a metal plating layer 42 adhered to a peripheral wall 40 of the through hole 38 to form a tubular shape.
  • the upper and lower end sides of the front-back conduction part 32 in the plate thickness direction are respectively connected to the front surface wiring 30 and the back surface wiring 34 .
  • the long axis in the lengthwise direction it becomes possible to secure a large cross-sectional area of the front-back conduction part 32 with respect to the front and back surface wirings 30 and 34 having a constant wiring width.
  • the above configuration enables the resistance value per unit length of the front-back conduction part 32 to be advantageously reduced. Therefore, setting this resistance value to less than or equal to the maximum resistance value per unit length of the front surface wiring 30 and the back surface wiring 34 can be easily realized.
  • the boundary of the metal plating layer 42 is indicated with a virtual line.
  • FIGS. 3 ( a )- 3 ( c ) the manufacturing process of the front-back conduction part 32 will be described using FIGS. 3 ( a )- 3 ( c ) .
  • a double-sided copper-clad laminate 48 having a flexible insulating base film 44 made of polyimide or the like and a copper foil 46 affixed using an adhesive layer 45 to both surfaces of the insulating base film 44 is prepared.
  • the through hole 38 that passes through the double-sided copper-clad laminate 48 is formed by performing a process such as NC drilling or laser beam machining on the double-sided copper-clad laminate 48 (see FIG. 3 ( a ) ).
  • plating e.g., copper electroplating
  • the metal plating layer 42 is thereby formed on the copper foil 46 and the peripheral wall 40 of the through hole 38 , and the copper foil 46 formed on both surfaces of the insulating base film 44 is electrically connected.
  • the conductive films (metal plating layer 42 and copper foil 46 ) on both surfaces of the insulating base film 44 are processed into a predetermined pattern by a subtractive method (see FIG. 3 ( b ) ). More specifically, after forming a resist layer (not shown) such as a dry film resist so as to cover the metal plating layer 42 and the through hole 38 , the resist layer is exposed and developed by a photofabrication technique to process the resist layer into a predetermined pattern. After forming the front surface wiring 30 and the back surface wiring 34 by etching the metal plating layer 42 and the copper foil 46 using the patterned resist layer as a mask, the resist layer is separated.
  • a resist layer such as a dry film resist
  • the metal plating layer 42 of the via 43 can thereby be secured.
  • the front-back conduction part 32 has an elliptical shape whose long axis is in the lengthwise direction, the metal plating layer 42 is formed thickly at both ends in the lengthwise direction, and the peripheral wall 40 constituting the front-back conduction part 32 is elongated in the lengthwise direction. Therefore, the resistance value per unit length of the front-back conduction parts 32 is reduced, and setting this resistance value to less than or equal to the maximum resistance value per unit length of the front surface wiring 30 and the back surface wiring 34 is advantageously realized.
  • the maximum resistance value here refers to the resistance value of wiring configuration portions of the wirings, and does not include current limiting regions such as chip fuses or positive temperature coefficient thermistors intermediately positioned in the wirings.
  • the front-back conduction parts 56 and 58 whose resistance value per unit length is less than or equal to the maximum resistance value per unit length of the front surface wirings 30 and the back surface wirings 34 can thereby be realized without increasing the plating thickness of the vias 43 . Therefore, the front-back conduction parts 56 and 58 with lower conduction resistance can be provided at lower cost.
  • one battery wiring module 14 arranged on a plurality of power storage elements 12 is described as an example, but the disclosure is not limited thereto.
  • the present disclosure can also be applied to two battery wiring modules 14 respectively arranged on one side and the other side of the plurality of power storage elements 12 .
  • arranging the front surface wirings 30 in potential order is no longer an issue, and resistance adjustment parts that are connected to the voltage detection lines being constituted by the back surface wirings 34 , for example, enables the difference in electrical resistance of voltage detection lines of various wiring lengths that is described in Patent Document 1 to be easily eliminated. Improvement in the degree of freedom in routing of voltage detection lines constituted by printed wirings of a flexible printed circuit board can thereby be achieved.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Battery Mounting, Suspending (AREA)
  • Connection Of Batteries Or Terminals (AREA)
  • Electric Double-Layer Capacitors Or The Like (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
US17/773,946 2019-11-13 2020-09-30 Battery wiring module Active 2041-05-22 US12219694B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019205196A JP7360089B2 (ja) 2019-11-13 2019-11-13 電池配線モジュール
JP2019-205196 2019-11-13
PCT/JP2020/037166 WO2021095388A1 (ja) 2019-11-13 2020-09-30 電池配線モジュール

Publications (2)

Publication Number Publication Date
US20220377881A1 US20220377881A1 (en) 2022-11-24
US12219694B2 true US12219694B2 (en) 2025-02-04

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Application Number Title Priority Date Filing Date
US17/773,946 Active 2041-05-22 US12219694B2 (en) 2019-11-13 2020-09-30 Battery wiring module

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US (1) US12219694B2 (https=)
JP (1) JP7360089B2 (https=)
CN (1) CN114651369B (https=)
WO (1) WO2021095388A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230261333A1 (en) * 2020-07-14 2023-08-17 Autonetworks Technologies, Ltd. Wiring module

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114824859B (zh) * 2022-01-05 2025-06-27 浙江新富尔电子有限公司 一种接电组件和新能源汽车电池检测模组
JP7712251B2 (ja) * 2022-12-05 2025-07-23 矢崎総業株式会社 積層回路体、及び、バスバモジュール
KR20240088377A (ko) * 2022-12-13 2024-06-20 삼성에스디아이 주식회사 이차 전지 모듈
DE112024001499T5 (de) 2023-05-31 2026-02-26 Murata Manufacturing Co., Ltd. Flexible vorrichtung

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09181453A (ja) 1995-12-21 1997-07-11 Sony Corp 多層配線基板及びその製造方法
JP2001068856A (ja) 1999-06-22 2001-03-16 Asahi Chem Ind Co Ltd 絶縁樹脂シート及びその製造方法
WO2014024452A1 (ja) 2012-08-09 2014-02-13 三洋電機株式会社 バッテリシステム及びこのバッテリシステムを備える電動車両並びに蓄電装置
JP2017045845A (ja) 2015-08-26 2017-03-02 イビデン株式会社 回路基板及び回路基板の製造方法
US20180358820A1 (en) * 2017-06-07 2018-12-13 Denso Corporation Monitoring device
US20190198944A1 (en) * 2017-12-25 2019-06-27 Denso Corporation Monitoring apparatus for battery cells

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06216488A (ja) * 1993-01-19 1994-08-05 Canon Inc プリント配線板及びその加工方法
JP2000151111A (ja) * 1998-08-31 2000-05-30 Toppan Printing Co Ltd 半導体装置用基板
JP2007250616A (ja) * 2006-03-14 2007-09-27 Epson Imaging Devices Corp フレキシブル回路基板、フレキシブル回路基板の製造方法、及び電気光学装置、並びに電子機器
JP5490713B2 (ja) * 2007-11-29 2014-05-14 エルジー・ケム・リミテッド 安全性部材を使用するｐｃｍを含むバッテリーパック
JP5710152B2 (ja) * 2010-04-15 2015-04-30 日本メクトロン株式会社 多層フレキシブルプリント配線板の製造方法
JP5518624B2 (ja) * 2010-08-10 2014-06-11 日本メクトロン株式会社 プリント配線板及びその製造方法
JP2013062451A (ja) * 2011-09-15 2013-04-04 Hitachi Cable Ltd フレキシブル配線基板およびフレキシブル配線基板の製造方法
JP2014075457A (ja) * 2012-10-03 2014-04-24 Sumitomo Electric Printed Circuit Inc プリント配線板及びその製造方法
JP6257889B2 (ja) * 2012-10-23 2018-01-10 日本メクトロン株式会社 バスバー付きフレキシブルプリント配線板およびその製造方法、並びにバッテリシステム
JP2016127248A (ja) * 2015-01-08 2016-07-11 日本特殊陶業株式会社 多層配線基板
CN110247056A (zh) * 2018-03-30 2019-09-17 宁德时代新能源科技股份有限公司 一种集流体，其极片和电化学装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09181453A (ja) 1995-12-21 1997-07-11 Sony Corp 多層配線基板及びその製造方法
JP2001068856A (ja) 1999-06-22 2001-03-16 Asahi Chem Ind Co Ltd 絶縁樹脂シート及びその製造方法
WO2014024452A1 (ja) 2012-08-09 2014-02-13 三洋電機株式会社 バッテリシステム及びこのバッテリシステムを備える電動車両並びに蓄電装置
US20150137824A1 (en) 2012-08-09 2015-05-21 Sanyo Electric Co., Ltd. Battery system, and electric vehicle and electricity storage device both having said battery system
JP2017045845A (ja) 2015-08-26 2017-03-02 イビデン株式会社 回路基板及び回路基板の製造方法
US20180358820A1 (en) * 2017-06-07 2018-12-13 Denso Corporation Monitoring device
US20190198944A1 (en) * 2017-12-25 2019-06-27 Denso Corporation Monitoring apparatus for battery cells
JP2019114464A (ja) 2017-12-25 2019-07-11 株式会社デンソー 監視装置

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
Flexible printed circuit board (Year: 2014). *
International Search Report issued in International Bureau of WIPO Patent Application No. PCT/JP2020/037166, dated Dec. 15, 2020, along with an English translation thereof.
Multilayer flexible board (Year: 2011). *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230261333A1 (en) * 2020-07-14 2023-08-17 Autonetworks Technologies, Ltd. Wiring module
US12506227B2 (en) * 2020-07-14 2025-12-23 Autonetworks Technologies, Ltd. Wiring module

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