US10925148B2 - Printed circuit board assembly - Google Patents

Printed circuit board assembly Download PDF

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Publication number
US10925148B2
US10925148B2 US15/664,369 US201715664369A US10925148B2 US 10925148 B2 US10925148 B2 US 10925148B2 US 201715664369 A US201715664369 A US 201715664369A US 10925148 B2 US10925148 B2 US 10925148B2
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United States
Prior art keywords
circuit board
printed circuit
heat radiating
electronic component
layer
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US15/664,369
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English (en)
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US20180042100A1 (en
Inventor
Seok-Hun Kang
In-beom KIM
Bo-Ram Kim
Soo-Hong Kim
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Samsung Electronics Co Ltd
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Samsung Electronics Co Ltd
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Assigned to SAMSUNG ELECTRONICS CO., LTD. reassignment SAMSUNG ELECTRONICS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KANG, SEOK-HUN, KIM, BO-RAM, KIM, IN-BEOM, KIM, SOO-HONG
Publication of US20180042100A1 publication Critical patent/US20180042100A1/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1056—Metal over component, i.e. metal plate over component mounted on or embedded in PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • Apparatuses consistent with the present disclosure relate to a printed circuit board assembly having improved heat radiating performance.
  • various kinds of electronic devices may include a printed circuit board assembly including a printed circuit board (PCB) and a plurality of electronic components mounted on the PCB.
  • PCB printed circuit board
  • a electronic component in which a plurality of elements, such as a central processing unit (CPU) or an integrated circuit (IC), are integrated generates a lot of heat during operation, and the generated heat may cause malfunction in other components around the electronic component and the electronic device including other components.
  • a heat sink made of a metal material having high thermal conductivity is in provided contact with a surface of the electronic component to induce heat radiation.
  • the heat sink cools the electronic component by convecting the heat generated from the electronic component to the air.
  • a related art heat sink was able to increase receptible thermal capacity by enlarging a size to increase heat radiating performance, or to efficiently transfer the heat to the air by forming a large number of heat radiation fins to increase a contact area with external air.
  • Exemplary embodiments overcome the above disadvantages and other disadvantages not described above. Also, the present disclosure is not required to overcome the disadvantages described above, and an exemplary embodiment may not overcome any of the problems described above.
  • Exemplary embodiments provide a printed circuit board assembly having improved heat radiating performance along with miniaturization of a heat radiating member.
  • a printed circuit board assembly includes a printed circuit board; an electronic component mounted on the printed circuit board; a heat radiating member which contacts the electronic component and is configured to receive and conduct heat generated by the electronic component; and at least one connection part connecting the printed circuit board and the heat radiating member to each other and configured to transfer the heat conducted through the heat radiating member to the printed circuit board.
  • a printed circuit board assembly includes a printed circuit board including a ground layer; an electronic component mounted on a side of the printed circuit board; and a heat radiating member connected to the electronic component and configured to radiate heat conducted from the electronic component, wherein the heat radiating member comprises at least one connection part connected to the ground layer to conduct the heat conducted from the electronic component to the ground layer.
  • a printed circuit board assembly includes a printed circuit board including a wiring pattern; an electronic component mounted on the wiring pattern of the printed circuit board; and a heat radiating member which contacts the electronic component, wherein the heat radiating member includes a plurality of connection parts connected to the printed circuit board to conduct heat conducted from the electronic component to the printed circuit board, and the plurality of connection parts are radially disposed around the electronic component without interfering with the wiring pattern.
  • FIG. 1 is a perspective view of a printed circuit board assembly according to an exemplary embodiment
  • FIG. 2 is an exploded perspective view of the printed circuit board assembly illustrated in FIG. 1 ;
  • FIG. 3 is a cross-sectional view schematically illustrating a cross section taken along the line I-I of the printed circuit board assembly illustrated in FIG. 1 ;
  • FIG. 4 is a cross-sectional view schematically illustrating a cross section of a printed circuit board assembly according to another exemplary embodiment
  • FIG. 5 is a cross-sectional view schematically illustrating a cross section of a printed circuit board assembly according to still another exemplary embodiment.
  • FIG. 6 is a cross-sectional view schematically illustrating a cross section of a printed circuit board assembly according to still another exemplary embodiment.
  • the present disclosure may be variously modified within a technical scope of the present disclosure through the exemplary embodiments described below, and the modified exemplary embodiments fall within the technical scope of the present disclosure.
  • the related components of components that perform the same operation in the respective exemplary embodiments are indicated by the same or extension numeral.
  • FIG. 1 is a perspective view of a printed circuit board assembly 1 according to an exemplary embodiment
  • FIG. 2 is an exploded perspective view in which a printed circuit board 10 and a heat radiating member 20 of the printed circuit board assembly 1 illustrated in FIG. 1 are separated.
  • the heat radiating member 20 is mainly illustrated for convenience of explanation, and other components are schematically illustrated.
  • the printed circuit board assembly 1 may include the printed circuit board 10 , the heat radiating member 20 , and an electronic component 30 which generates heat during operation thereof.
  • the printed circuit board assembly 1 may be applied to various electronic devices such as, for example, a television (TV), a smartphone, a personal computer (PC), a notebook PC, a digital broadcasting terminal, a camera, a personal digital assistant (PDA), a washing machine, a dish washer, a refrigerator, and the like.
  • TV television
  • smartphone personal computer
  • PC personal computer
  • notebook PC digital broadcasting terminal
  • camera a camera
  • PDA personal digital assistant
  • washing machine a dish washer, a refrigerator, and the like.
  • the printed circuit board 10 may have a flat plate (planar) form so that the electronic component 30 may be mounted thereon, and may be formed in various forms and sizes, as needed. Further, the printed circuit board 10 may be a rigid printed circuit board (PCB) or a flexible PCB. In addition, the printed circuit board 10 may be a single-sided PCB or a double-sided PCB, and may be a multilayer PCB.
  • PCB printed circuit board
  • the printed circuit board 10 may be a single-sided PCB or a double-sided PCB, and may be a multilayer PCB.
  • the electronic component 30 may be mounted on a surface of the printed circuit board 10 as illustrated in FIG. 1 , and in addition to this, a large number of electronic components and a large number of elements 40 may be mounted on the surface of the printed circuit board 10 by a surface mounting method and/or an insertion mounting method.
  • the electronic component 30 will be described, for example, as a heat-generating electronic component 30 that generates a large amount of heat during the operation such as a central processing unit (CPU) or an integrated circuit (IC) among various electronic components which may be mounted on the printed circuit board 10 , and the various electronic components which may be mounted on the printed circuit board 10 other than the electronic component 30 as a heat source will be collectively referred to as a plurality of elements 40 .
  • a heat-generating electronic component 30 that generates a large amount of heat during the operation
  • CPU central processing unit
  • IC integrated circuit
  • the electronic component 30 and the plurality of elements 40 that are mounted on the printed circuit board 10 illustrated in FIGS. 1 and 2 are illustrative and the present disclosure is not limited thereto, and the number of electronic component and elements mounted on the printed circuit board 10 and an arrangement thereof may be variously modified.
  • the plurality of elements 40 may include various kinds of active elements and/or passive elements.
  • the electronic component 30 and the plurality of elements 40 may be mounted on the printed circuit board 10 using methods such as a ball grid array (BGA) method, a pin grid array (PGA) method, a tape carrier package (TCP) method, a chip-on-board (COB) method, a quad flat package (QFP) method, a quad flat non-leaded (QFN) method, and the like.
  • BGA ball grid array
  • PGA pin grid array
  • TCP tape carrier package
  • COB chip-on-board
  • QFP quad flat package
  • QFN quad flat non-leaded
  • the printed circuit board 10 may include a wiring pattern 11 printed on a surface thereof so that the electronic component 30 and the plurality of elements 40 which are mounted thereon are electrically connected to each other.
  • An electrical circuit of the printed circuit board 10 may be formed through the wiring pattern 11 , and the formation of the electrical circuit through the wiring pattern 11 may be performed through processes such as pre-processing, exposure, etching, delaminating, and the like.
  • FIGS. 1 and 2 schematically illustrate only a portion of the wiring pattern 11 for convenience of explanation, the wiring pattern 11 may be configured in various forms on the printed circuit board 10 , and when the printed circuit board is a double-sided printed circuit board or a multilayer printed circuit board, the wiring pattern may be included in a plurality of layers included in the printed circuit board.
  • the heat radiating member 20 may be disposed on one side of the printed circuit board 10 .
  • the heat radiating member 20 may be disposed on a side of the printed circuit board 10 on which the electronic component 30 is mounted.
  • the heat radiating member 20 may have a flat plate form that may cover a portion of one side of the printed circuit board 10 on which the electronic component 30 is mounted.
  • the heat radiating member 20 may be formed in various forms and sizes, as needed, and may be a configuration that covers the entirety of the printed circuit board 10 .
  • FIGS. 1 and 2 illustrate, for example, the case in which the electronic component 30 and the plurality of elements 40 are mounted on a top surface of the printed circuit board 10 , and the heat radiating member 20 covering a portion of the printed circuit board 10 is disposed on the electronic component 30 , the arrangement and the shape of the heat radiating member 20 may also variously modified depending on the arrangement of the electronic component 30 mounted on the printed circuit board 10 .
  • a bottom surface of the heat radiating member 20 is in surface-contact with the top surface of the electronic component 30 , such that the heat radiating member 20 receives the heat generated from the electronic component 30 according to an operation of the electronic component 30 to discharge the heat to the outside.
  • the electronic component 30 may radiate the heat through the heat radiating member 20 , thereby obtaining a cooling effect.
  • other components disposed around the electronic component 30 and an electronic device including other components may be protected from a malfunction caused by the heat of the electronic component 30 through the heat radiating operation of the heat radiating member 20 .
  • the heat radiating member 20 may be formed of a material having high thermal conductivity, and may be, for example, formed of a metal such as aluminum, copper, silver, lead, or the like.
  • the heat radiating member 20 may be disposed on the electronic component 30 mounted on the printed circuit board 10 in a state in which the heat radiating member 20 is in surface-contact with the electronic component 30 .
  • a central portion of the heat radiating member 20 may be disposed at a position corresponding to the electronic component 30 so that the heat transferred from the electronic component 30 may be efficiently emitted to the outside (air or a ground pattern formed on the PCB) as the heat is spread from the central portion of the heat radiating member 20 to a peripheral portion thereof.
  • the heat generated from the electronic component 30 may be transferred to the heat radiating member 20 , and the heat transferred to the heat radiating member 20 may be spread along the peripheral portion of the heat radiating member 20 from the central portion thereof to be discharged to the outside of the heat radiating member 20 .
  • a thermal interface material may be disposed between the heat radiating member 20 and a bonding part of the electronic component 30 , and conduction efficiency of the heat conducted to the heat radiating member 20 from the electronic component 30 may be maximized through the thermal interface material (TIM).
  • the thermal interface material may be formed of a material having a high thermal conductivity, and may for example, include a polymer-metal complex material, a ceramic complex material, and a carbon based complex material.
  • the thermal interface material may be formed of a material that an epoxy and a carbon fiber filler are mixed, silicon nitride (Si3N4), an epoxy, and boron nitride (BN).
  • thermal interface material may be distinguished into a grease type, a glue type, a pad type, and the like, depending on a form thereof.
  • thermal interface material may have flexibility or may be formed of a flexible material.
  • the thermal interface material is configured to have flexibility and disposed between the heat radiating member 20 and the electronic component 30 to fill the voids, an area for transferring the heat may be increased, and consequently, the heat transfer from the electronic component 30 to the heat radiating member 20 may be more efficiently performed.
  • the heat conducted to the heat radiating member 20 may be spread within the heat radiating member 20 . Since the heat spread within the heat radiating member 20 is convected to the outside through all regions of the heat radiating member 20 , the heat generated from the electronic component 30 may be discharged to the outside of the printed circuit board assembly 1 .
  • the heat radiating member 20 may include a heat radiating plate 21 having approximately a flat plate shape that may be connected to or in contact with the electronic component 30 , and at least one connection part supporting the heat radiating plate 21 .
  • connection part is formed integrally with the heat radiating member 20
  • connection part is not limited thereto, but may be coupled to the heat radiating plate 21 through a separate coupling part.
  • the heat radiating plate 21 may have a flat plate shape, and the electronic component 30 may be disposed on the central portion of the heat radiating plate 21 so as to be in contact with the heat radiating plate 21 , as described above.
  • the heat conducted to the heat radiating plate 21 may be spread within the heat radiating plate 21 in a direction away from the electronic component 30 , and the spread heat may be effectively discharged to the outside over the entire area of the heat radiating plate 21 having the flat plate shape.
  • the heat radiating plate 21 may include a plurality of element holes H that penetrate through the heat radiating plate 21 .
  • Various kinds of elements mounted on the printed circuit board 10 may have different sizes and heights, respectively, and some elements mounted around the electronic component 30 may also be configured to have heights higher than that of the electronic component 30 .
  • the heat radiating plate 21 may be disposed to be higher than the component having the highest height among the electronic component 30 and the plurality of elements 40 which are mounted on the printed circuit board 10 , and consequently, the heat radiating plate 21 , and the electronic component 30 and the plurality of elements 40 which are mounted on the printed circuit board 10 are in contact with each other, thereby making it possible to prevent an occurrence of electrical short, or the like.
  • the heat radiating plate 21 may be in contact with or interfere with the elements 40 disposed below the heat radiating plate 21 and the electrical short may occur, which may cause malfunction in the operation of the plurality of elements 40 .
  • the heat radiating plate 21 disposed on the electronic component 30 may include the plurality of element holes H formed in the positions corresponding to the arrangements of some elements 40 which may interfere with the heat radiating plate 21 .
  • the elements 40 having the heights higher than the height of the electronic component 30 may be disposed in the plurality of element holes H, and consequently, the heat radiating plate 21 may be in contact with the electronic component 30 without interfering with the plurality of elements 40 .
  • the heat radiating plate 21 from being disposed on the elements susceptible to heat by disposing the elements susceptible to the heat on the positions of the printed circuit board 10 corresponding to the plurality of element holes H, and consequently, it is possible to prevent the element susceptible to the heat from being damaged by the heat transferred to the heat radiating plate 21 .
  • FIGS. 1 and 2 illustrate the example in which the plurality of elements 40 are disposed in the plurality of element holes H, other elements may also be disposed in the plurality of element holes H or may be disposed below the heat radiating plate 21 .
  • connection part supporting the heat radiating plate 21 may include a plurality of connection parts, i.e., a first connection part 221 , a second connection part 222 , and a third connection part 223 .
  • the number of connection parts may be one or more in consideration of the size or heat radiating performance of the heat radiating plate 21 .
  • connection parts may be formed integrally with each other.
  • the connection parts may be formed through a plate work of partially blanking the positions in which the first connection part 221 , the second connection part 222 , and the third connection part 223 are to be formed on the heat radiating plate 21 and then multi-bending the blanked portions.
  • the first connection part 221 , the second connection part 222 , and the third connection part 223 may be disposed at the peripheral portion of the heat radiating plate 21 outside of the center of the heat radiating plate 21 to support the heat radiating plate 21 on the printed circuit board 10 .
  • the first connection part 221 , the second connection part 222 , and the third connection part 223 may include a first supporting part 2211 , a second supporting part 2221 , and a third supporting part (not shown), respectively, that support the heat radiating plate 21 , and a first contact part 2212 , a second contact part 2222 , and a third contact part (not shown), respectively, that are bent from the first supporting part 2211 , the second supporting part 2221 , and the third supporting part, respectively, as illustrated in FIG. 3 .
  • first supporting part 2211 , the second supporting part 2221 , and the third supporting part, and the first contact part 2212 , the second contact part 2222 , and the third contact part may be disposed in the positions in which the above-mentioned plurality of element holes H are formed.
  • the heat radiating member 20 in which the heat radiating plate 21 , the first connection part 221 , the second connection part 222 , and the third connection part 223 are formed integrally with each other may be easily manufactured by blanking the element holes H in the heat radiating plate 21 having the flat plate shape and bending some of the heat radiating plate 21 configuring a boundary of the element holes H to the first supporting part 2211 , the second supporting part 2221 , and the third supporting part, and the first contact part 2212 , the second contact part 2222 , and the third contact part.
  • the first connection part 221 , the second connection part 222 , and the third connection part 223 may be formed of a metal having high thermal conductivity similarly to the heat radiating plate 21 .
  • the respective connection parts may be coupled to the heat radiating plate 21 through a coupling part (e.g., a screw, a rivet, or welding), and in this case, the coupling part may also be formed of the metal having high thermal conductivity similarly to the heat radiating plate 21 .
  • the heat radiating member 20 may be in contact with or coupled to a first contact surface 101 , a second surface 102 , and a third contact surface 103 on the printed circuit board 10 through the first contact part 2212 , the second contact part 2222 , and the third contact part, respectively.
  • the first contact part 2212 , the second contact part 2222 , and the third contact part may have a large area so as to maximize contact areas with the first contact surface 101 , the second contact surface 102 , and the third contact surface 103 , respectively.
  • first supporting part 2211 , the second supporting part 2221 , and the third supporting part may also be directly in contact with the first contact surface 101 , the second contact surface 102 , and the third contact surface 103 , respectively, without the first contact part 2212 , the second contact part 2222 , and the third contact part.
  • the heat conducted to the heat radiating plate 21 may be transferred to the printed circuit board 10 through the first contact surface 101 , the second contact surface 102 , and the third contact surface 103 connected to the first connection part 221 , the second connection part 222 , and the third connection part 223 , respectively.
  • the heat conducted to the heat radiating plate 21 from the electronic component 30 may pass through the first supporting part 2211 , the second supporting part 2221 , and the third supporting part and may be transferred to the first contact surface 101 , the second contact surface 102 , and the third contact surface 103 through the first contact part 2212 , the second contact part 2222 , and the third contact part, respectively, and the heat transferred to the first contact surface 101 , the second contact surface 102 , and the third contact surface 103 may be spread through the printed circuit board 10 , thereby making it possible to improve heat radiating performance of the printed circuit board assembly 1 .
  • the first contact surface 101 , the second contact surface 102 , and the third contact surface 103 may be disposed radially around the electronic component 30 that generates the heat, and correspondingly, the first connection part 221 , the second connection part 222 , and the third connection part 223 may also be disposed radially around the central portion of the heat radiating plate 21 on which the electronic component 30 is disposed.
  • the heat conducted to the central portion of the heat radiating plate 21 that is, the heat transferred to the first contact surface 101 , the second contact surface 102 , and the third contact surface 103 may be easily spread into an entire region of the printed circuit board 10 by the radial array of the connection parts as described above.
  • first contact surface 101 , the second contact surface 102 , and the third contact surface 103 may be formed in consideration of the arrangement of the plurality of elements 40 mounted on the printed circuit board 10 so that the first connection part 221 , the second connection part 222 , and the third connection part 223 may be easily coupled to the first contact surface 101 , the second contact surface 102 , and the third contact surface 103 , respectively.
  • the first contact surface 101 , the second contact surface 102 , and the third contact surface 103 may be disposed on the printed circuit board 10 without interfering with the electronic component 30 and the plurality of elements 40 , and may also be disposed on the printed circuit board 10 without interfering with the wiring pattern 11 .
  • the first contact surface 101 , the second contact surface 102 , and the third contact surface 103 may be radially disposed around the electronic component 30 and may have an elongated shape which is extended in a direction away from the electronic component 30 .
  • the first contact part 2212 , the second contact part 2222 , and the third contact part which are in contact with the first contact surface 101 , the second contact surface 102 , and the third contact surface 103 may also be elongated in the direction away from the electronic component 30 corresponding to the shape of the first contact surface 101 , the second contact surface 102 , and the third contact surface 103 .
  • the heat transfer from the first contact part 2212 , the second contact part 2222 , and the third contact part to the first contact surface 101 , the second contact surface 102 , and the third contact surface 103 , respectively, may be facilitated.
  • first contact surface 101 , the second contact surface 102 , and the third contact surface 103 may be radially disposed around the electronic component 30 , and may have various shapes which do not interfere with the wiring pattern 11 .
  • a plurality of via holes 1011 , 1021 , and 1031 that penetrate through the printed circuit board 10 may be respectively provided in the first contact surface 101 , the second contact surface 102 , and the third contact surface 103 of the printed circuit board 10 .
  • the plurality of via holes 1011 , 1021 , and 1031 provided in the first contact surface 101 , the second contact surface 102 , and the third contact surface 103 may also be disposed in the direction away from the electronic component 30 .
  • the heat of the heat radiating plate 21 may be transferred to the plurality of via holes 1011 , 1021 , and 1031 from the first connection part 221 , the second connection part 222 , and the third connection part 223 connected to the first contact surface 101 , the second contact surface 102 , and the third contact surface 103 , respectively.
  • the plurality of via holes 1011 , 1021 , and 1031 are extended in directions away from the electronic component 30 , thereby making it possible to more efficiently transfer the heat of the heat radiating plate 21 to the plurality of via holes 1011 , 1021 , and 1031 .
  • a heat radiating structure through the plurality of via holes 1011 , 1021 , and 1031 will be described in detail below with reference to FIG. 3 .
  • a first thermal interface material 51 , a second thermal interface material 52 , and a third thermal interface material 53 may be respectively disposed between the first contact surface 101 , the second contact surface 102 , and the third contact surface 103 and the first contact part 2212 , the second contact part 2222 , and the third contact part.
  • first thermal interface material 51 the second thermal interface material 52 , and the third thermal interface material 53 may be the same as or similar to the above-mentioned thermal interface material disposed between the heat radiating member 20 and the electronic component 30 , an overlapped description will be omitted.
  • the first thermal interface material 51 , the second thermal interface material 52 , and the third thermal interface material 53 formed of a material having high thermal conductivity may respectively fill voids between the first contact surface 101 , the second contact surface 102 , and the third contact surface 103 and the first contact part 2212 , the second contact part 2222 , and the third contact part.
  • an effect of the heat transfer from the first connection part 221 , the second connection part 222 , and the third connection part 223 to the first contact surface 101 , the second contact surface 102 , and the third contact surface 103 may be further increased through the first thermal interface material 51 , the second thermal interface material 52 , and the third thermal interface material 53 .
  • the first thermal interface material 51 , the second thermal interface material 52 , and the third thermal interface material 53 illustrated in FIG. 2 are shown as a pad type having shapes respectively corresponding to the shapes of the first contact surface 101 , the second contact surface 102 , and the third contact surface 103 and the first contact part 2212 , the second contact part 2222 , and the third contact part, but the first thermal interface material 51 , the second thermal interface material 52 , and the third thermal interface material 53 may be respectively coated between the first contact surface 101 , the second contact surface 102 , and the third contact surface 103 and the first contact part 2212 , the second contact part 2222 , and the third contact part as a grease type or a glue type.
  • FIG. 3 is a cross-sectional view schematically illustrating a cross section taken along the line I-I of the printed circuit board assembly 1 illustrated in FIG. 1 .
  • the printed circuit board 10 illustrated in FIG. 3 is illustrated, for example, as a multilayer printed circuit board including a first layer 111 , a second layer 112 , a third layer 113 , a fourth layer 114 , a first insulating layer 121 , a second insulating layer 122 , and a core layer 131 .
  • the printed circuit board 10 may include the first layer 111 on which the electronic component 30 and the elements 40 are mounted, and the second layer 112 , the third layer 113 and the fourth layer 114 which are sequentially stacked below the first layer 111 , the first insulating layer 121 may be disposed between the first layer 111 and the second layer 112 , the core layer 131 may be disposed between the second layer 112 and the third layer 113 , and the second insulating layer 122 may be disposed between the third layer 113 and the fourth layer 114 .
  • the first layer 111 , the second layer 112 , the third layer 113 and the fourth layer 114 may be formed of a conductive copper foil, and consequently, a circuit layer may be configured.
  • first insulating layer 121 , the second insulating layer 122 , and the core layer 131 may be formed of an insulative material, and consequently, the first layer 111 , the second layer 112 , the third layer 113 and the fourth layer 114 may be insulated from each other.
  • the electronic component 30 and the plurality of elements 40 may be mounted on the first layer 111 of the printed circuit board 10 , on which an electrical signal line such as the wiring pattern 11 may be disposed.
  • the electronic component 30 may include an electronic component body 31 and a plurality of connectors 32 , and may be mounted on the first layer 111 through the plurality of connectors 32 .
  • the plurality of elements 40 may also include an element body 41 and a plurality of connectors 42 , and may be mounted on the first layer 111 through the plurality of connectors 42 .
  • the plurality of connectors 32 of the electronic component 30 and the plurality of connectors 42 of the elements 40 may include solder bumps or solder balls.
  • the second layer 112 may be a ground layer formed of a conductive metal covering an entire area of the printed circuit board 10 .
  • the second layer 112 prevents the electrical signals applied to the first layer 111 , the third layer 113 , and the fourth layer 114 from being affected by peripheral devices, thereby making it possible to maintain signal quality.
  • the third layer 113 may be a power layer including a power wiring that supplies power to the printed circuit board 10
  • the fourth layer 114 which is a structure similar to the first layer 111 , may have an electrical signal line disposed thereon.
  • a plurality of electronic components and a plurality of elements may be mounted on the electrical signal line of the fourth layer 114 , and a heat radiating member may be additionally disposed on the fourth layer 114 , thereby making it possible to additionally radiate heat generated from the electronic component that generates the heat, mounted on the fourth layer 114 .
  • a configuration of the printed circuit board 10 configured in a multilayer of the first layer 111 , the second layer 112 , the third layer 113 and the fourth layer 114 illustrated in FIG. 3 is illustrative, and may be variously modified, as needed.
  • the first contact surface 101 , the second contact surface 102 , and the third contact surface 103 which may be connected to the first connection part 221 , the second connection part 222 , and the third connection part 223 of the heat radiating member 20 may be radially disposed on the first layer 111 of the printed circuit board 10 .
  • the plurality of via holes 1011 , 1021 , and 1031 may be disposed in the first contact surface 101 , the second contact surface 102 , and the third contact surface 103 in the direction away from the electronic component 30 .
  • other via holes V electrically connecting between a plurality of layers may be further included in the printed circuit board 10 rather than the plurality of via holes 1011 , 1021 , and 1031 disposed in the first contact surface 101 , the second contact surface 102 , and the third contact surface 103 .
  • FIG. 3 illustrates only a plurality of via holes 1011 disposed in the first contact surface 101 and a plurality of via holes 1021 provided in the second contact surface 102 , and a plurality of via holes 1031 ( FIG. 2 ) provided in the third contact surface 103 may be the same configuration of the plurality of via holes 1011 and 1021 provided in the first contact surface 101 and the second contact surface 102 .
  • the plurality of via holes 1011 , 1021 , and 1031 provided in the first contact surface 101 , the second contact surface 102 , and the third contact surface 103 may be disposed in the direction away from the central portion of the printed circuit board 10 on which the electronic component 30 is mounted.
  • the plurality of via holes 1011 , 1021 , and 1031 may penetrate through the first to fourth layers 111 , 112 , 113 , and 114 .
  • the plurality of via holes 1011 , 1021 , and 1031 may be covered or plated with a conductive material.
  • the plurality of via holes 1011 , 1021 , and 1031 may include inner circumference surfaces plated with the conductive material.
  • the via holes 1011 and 1021 may include inner circumference surfaces 1012 and 1022 , respectively, as shown in FIG. 3 . Consequently, the first to fourth layers 111 , 112 , 113 , and 114 may be electrically connected to each other through the plurality of via holes 1011 , 1021 , and 1031 .
  • the inner circumference surfaces of the plurality of via holes 1011 , 1021 , and 1031 may be covered or plated with a material having high thermal conductivity.
  • the inner circumference surfaces of the plurality of via holes 1011 , 1021 , and 1031 may be covered with a metal such as aluminum, copper, or the like, and may be formed of the same material as the heat radiating member 20 .
  • heat transferred to the plurality of via holes 1011 , 1021 , and 1031 may be spread into the printed circuit board 10 along the inner circumference surfaces.
  • a detailed process in which the heat generated from the electronic component 30 is spread through the heat radiating member 20 is as follows.
  • the heat generated through the electronic component 30 may be conducted to the heat radiating plate 21 coupled to the electronic component 30 , and the heat conducted to the heat radiating plate 21 may be outwardly spread from the central portion of the heat radiating plate 21 .
  • the heat spread through the inside of the heat radiating plate 21 may be convected to an upper portion of the heat radiating plate 21 to be discharged to the outside.
  • the heat radiating plate 21 may include a plurality of heat radiating fins which outwardly protrude, and a heat exchange area with the outside is increased through the plurality of heat radiating fins, thereby making it possible to further increase the effect of the heat transfer to the outside.
  • a portion of the heat conducted to the heat radiating plate 21 may be transferred to the first connection part 221 , the second connection part 222 , and the third connection part 223 .
  • the heat transferred to the first connection part 221 , the second connection part 222 , and the third connection part 223 may be transferred to the first contact part 2212 , the second contact part 2222 , and the third contact part through the first supporting part 2211 , the second supporting part 2221 , and the third supporting part, respectively.
  • the heat may be transferred to the first contact surface 101 , the second contact surface 102 , and the third contact surface 103 from the first contact part 2212 , the second contact part 2222 , and the third contact part, respectively, and consequently, and the heat of the heat radiating member 20 may be transferred to the printed circuit board 10 .
  • most of the heat transferred to the heat radiating member 20 from the electronic component 30 may be discharged through the heat radiating plate 21 formed in the flat plate shape so that the heat exchange with the outside is easily performed.
  • the heat radiating performance through the heat radiating member 20 may be degraded when the heat in the heat radiating member 20 is saturated.
  • the heat radiating performance of the entirety of the printed circuit board assembly 1 may be maintained by spreading the saturated heat of the heat radiating member 20 to the printed circuit board 10 through the first connection part 221 , the second connection part 222 , and the third connection part 223 and the first contact surface 101 , the second contact surface 102 , and the third contact surface 103 .
  • the heat transfer to the first contact surface 101 , the second contact surface 102 , and the third contact surface 103 from the first contact part 2212 , the second contact part 2222 , and the third contact part may be more effectively performed through the first thermal interface material 51 , the second thermal interface material 52 , and the third thermal interface material 53 .
  • the heat transferred to the first contact surface 101 , the second contact surface 102 , and the third contact surface 103 may be spread into the entire region of the printed circuit board 10 through the plurality of via holes 1011 , 1021 , and 1031 provided in the first contact surface 101 , the second contact surface 102 , and the third contact surface 103 , respectively.
  • the heat transferred to the first contact surface 101 , the second contact surface 102 , and the third contact surface 103 of the first layer 111 may be spread into the printed circuit board 10 through the plurality of via holes 1011 , 1021 , and 1031 of the first contact surface 101 , the second contact surface 102 , and the third contact surface 103 .
  • the heat transferred to the first contact surface 101 , the second contact surface 102 , and the third contact surface 103 may be sequentially conducted to the first insulating layer 121 , the second layer 112 , the core layer 131 , the third layer 113 , the second insulating layer 122 , and the fourth layer 114 from the first layer 111 through the inner circumference surfaces of the plurality of via holes 1011 , 1021 , and 1031 .
  • a portion of the heat transferred to the first contact surface 101 , the second contact surface 102 , and the third contact surface 103 may be convected through an inner space of the plurality of via holes 1011 , 1021 , and 1031 disposed in the first contact surface 101 , the second contact surface 102 , and the third contact surface 103 and be spread into the printed circuit board 10 .
  • the second layer 112 configured as the ground layer that may cover the entire region of the printed circuit board 10 may be formed of a metal such as aluminum or copper having high thermal conductivity.
  • the heat transferred to the second layer 112 through the plurality of via holes 1011 , 1021 , and 1031 may be more efficiently spread into the entire region of the printed circuit board 10 through the second layer 112 having high thermal conductivity, and consequently, the heat radiating performance of the printed circuit board assembly 1 may be improved.
  • thermal conductivity to the second layer 112 from the plurality of via holes 1011 , 1021 , and 1031 may be further increased by additionally disposing a thermal interface material between the inner circumference surfaces of the plurality of via holes 1011 , 1021 , and 1031 and the second layer 112 .
  • the plurality of elements 40 may also be connected to the second layer 112 covering the entire region of the printed circuit board 10 , the heat spread through the second layer 112 may also be transferred to the plurality of elements 40 connected to the second layer 112 .
  • the heat transferred to the plurality of elements 40 may also be discharged to the outside through the plurality of elements 40 mounted on the surface of the printed circuit board 10 .
  • the heat transferred to the first contact surface 101 , the second contact surface 102 , and the third contact surface 103 may also be spread through the third layer 113 , the fourth layer 114 , the first insulating layer 121 , the second insulating layer 122 , and the core layer 131 which are connected to the plurality of via holes 1011 , 1021 , and 1031 , the heat radiating performance of the printed circuit board assembly 1 may be improved.
  • the plurality of via holes 1011 , 1021 , and 1031 provided in the first contact surface 101 , the second contact surface 102 , and the third contact surface 103 may be formed to penetrate through only some layers of the printed circuit board 10 , rather than the entire printed circuit board 10 .
  • a plurality of layers configuring the printed circuit board 10 may be thermally separated as needed by configuring separate layers to which the heat is not transferred from the plurality of via holes 1011 , 1021 , and 1031 of the first contact surface 101 , the second contact surface 102 , and the third contact surface 103 .
  • the heat of the heat radiating member 20 may be additionally spread through the second layer 112 by providing the plurality of via holes 1011 , 1021 , and 1031 in the first contact surface 101 , the second contact surface 102 , and the third contact surface 103 to be connected up to the second layer 112 from the first layer 111 , and third layer 113 and the fourth layer 114 may be configured so that the heat is not transferred from the heat radiating member 20 .
  • the components susceptible to the heat are centrally connected to each other on the third layer 113 and the fourth layer 114 , thereby making it possible to prevent the components susceptible to the heat from being damaged by a heat radiation through the second layer 112 .
  • FIG. 4 is a cross-sectional view schematically illustrating a cross section of a printed circuit board assembly 2 according to another exemplary embodiment.
  • the printed circuit board assembly 2 may include the printed circuit board 10 , a heat radiating member 60 , the electronic component 30 which generates a large amount of heat during operation thereof, and the plurality of elements 40 .
  • the printed circuit board 10 , the electronic component 30 , and the plurality of elements 40 are the same as the configurations of the printed circuit board assembly 1 according to the exemplary embodiment described above, repeated description thereof will be omitted.
  • the heat radiating member 60 may include a heat radiating plate 61 and at least one connection part coupled to the heat radiating plate 61 to support the heat radiating plate 61 .
  • connection part supporting the heat radiating plate 61 may include a plurality of connection parts, for example, a first connection part 621 , a second connection part 622 , and a third connection part.
  • FIG. 4 does not illustrate the third connection part
  • a configuration of the third connection part is the same as the first connection part 621 and the second connection part 622 .
  • the first connection part 621 , the second connection part 622 , and the third connection part may be disposed at one side of the heat radiating plate 61 to support the heat radiating plate 61 on the printed circuit board 10 .
  • the first connection part 621 , the second connection part 622 , and the third connection part may include a first supporting part 6211 , a second supporting part 6221 , and a third supporting part (not shown) that support the heat radiating plate 61 , and a first contact part 6212 , a second contact part 6222 , and a third contact part (not shown) that are bent from the first supporting part 6211 , the second supporting part 6221 and the third supporting part.
  • FIG. 4 does not illustrate the third supporting part, a configuration of the third supporting part is the same as the first supporting part 6211 and the second supporting part 6221 . Further, although FIG. 4 does not illustrate the third contact part, a configuration of the third contact part is the same as the first contact part 6212 and the second connection parts 6222 .
  • first connection part 621 , the second connection part 622 , and the third connection part may include a plurality of connection pins 6213 , 6223 , and 6233 coupled to the first contact part 6212 , the second contact part 6222 , and the third contact part.
  • the plurality of connection pins 6213 , 6223 , and 6233 are structures that protrude from the first to third contact parts 6212 , 6222 , and 6232 , and lengths of the plurality of connection pins 6213 , 6223 , and 6233 may be formed to correspond to lengths of the plurality of via holes 1011 , 1021 , and 1031 of the first contact surface 101 , the second contact surface 102 , and the third contact surface 103 .
  • the plurality of connection pins 6213 , 6223 , and 6233 may be inserted into the plurality of via holes 1011 , 1021 , and 1031 provided in the first contact surface 101 , the second contact surface 102 , and the third contact surface 103 .
  • the plurality of connection pins 6213 , 6223 , and 6233 may be configured to have the same number as the plurality of via holes 1011 , 1021 , and 1031 of the first contact surface 101 , the second contact surface 102 , and the third contact surface 103 , and may be disposed to correspond to the arrangement of the plurality of via holes 1011 , 1021 , and 1013 .
  • connection pins 6213 , 6223 , and 6233 are inserted into the plurality of via holes 1011 , 1021 , and 1031 of the first contact surface 101 , the second contact surface 102 , and the third contact surface 103 , thereby making it possible to more firmly couple the heat radiating member 60 to the first contact surface 101 , the second contact surface 102 , and the third contact surface 103 .
  • connection pins 6213 , 6223 , and 6233 may be formed of a metal such as aluminum, copper, or silver having high thermal conductivity.
  • the heat may be easily conducted to the plurality of connection pins 6213 , 6223 , and 6233 from the first contact part 6212 , the second contact part 6222 , and the third contact part.
  • connection pins 6213 , 6223 , and 6233 are inserted into the plurality of via holes 1011 , 1021 , and 1031 of the first contact surface 101 , the second contact surface 102 , and the third contact surface 103 , thereby making it possible to more effectively transfer the heat to the plurality of via holes 1011 , 1021 , and 1031 .
  • the first thermal interface material 51 , the second thermal interface material 52 , and the third thermal interface material 53 may be formed of a flexible material, and the plurality of connection pins 6213 , 6223 , and 6233 may penetrate through the first thermal interface material 51 , the second thermal interface material 52 , and the third thermal interface material 53 .
  • a thermal interface material may be additionally filled in the plurality of via holes 1011 , 1021 , and 1031 into which the plurality of connection pins 6213 , 6223 , and 6233 are inserted, thereby making it possible to further increase thermal conductivity from the plurality of connection pins 6213 , 6223 , and 6233 to the plurality of via holes 1011 , 1021 , and 1031 .
  • the plurality of connection pins 6213 , 6223 , and 6233 of the heat radiating member 60 are directly inserted into the plurality of via holes 1011 , 1021 , and 1031 of the first contact surface 101 , the second contact surface 102 , and the third contact surface 103 , the heat of the heat radiating member 60 may be more effectively spread into the printed circuit board 10 , and consequently, heat radiating performance of the printed circuit board assembly 2 may be improved.
  • FIG. 5 is a cross-sectional view schematically illustrating a cross section of a printed circuit board assembly 3 according to still another exemplary embodiment.
  • the printed circuit board assembly 3 may include a heat radiating member 70 , a printed circuit board 80 , the electronic component 30 which generates a large amount of heat during operation thereof, and the plurality of elements 40 .
  • the heat radiating member 70 may include a heat radiating plate 71 and at least one connection part coupled to the heat radiating plate 71 to support the heat radiating plate 71 .
  • connection part supporting the heat radiating plate 71 may include a plurality of connection parts, for example, a first connection part 721 , a second connection part 722 , and a third connection part.
  • FIG. 5 does not illustrate the third connection part, a configuration of the third connection part is the same as that of the first connection part 721 and the second connection part 722 .
  • the first connection part 721 , the second connection part 722 , and the third connection part may be disposed at one side of the heat radiating plate 71 to support the heat radiating plate 71 on the printed circuit board 80 .
  • the printed circuit board 80 may include a first layer 811 on which the electronic component 30 and the elements 40 are mounted, and a second layer 812 , a third layer 813 , and a fourth layer 814 which are sequentially stacked below the first layer 811 , a first insulating layer 821 may be disposed between the first layer 811 and the second layer 812 , a core layer 831 may be disposed between the second layer 812 and the third layer 813 , and a second insulating layer 822 may be disposed between the third layer 813 and the fourth layer 814 .
  • the first layer 811 , the second layer 812 , the third layer 813 , and the fourth layer 814 may be formed of a conductive copper foil, and consequently, a circuit layer may be configured.
  • first insulating layer 821 , the second insulating layer 822 , and the core layer 831 may be formed of an insulative material, and consequently, the first layer 811 , the second layer 812 , the third layer 813 , and the fourth layer 814 may be insulated from each other.
  • the printed circuit board 80 is a multilayer printed circuit board having the configuration similar to the printed circuit board 10 illustrated in FIGS. 3 and 4 , where the electronic component 30 and the plurality of elements 40 may be mounted on the first layer 811 , on which an electrical signal line such as the wiring pattern may be disposed.
  • the second layer 812 may be a ground layer formed of a conductive metal covering an entire region of the printed circuit board 80
  • the third layer 813 may be a power layer including a power wiring that supplies power to the printed circuit board 80
  • the fourth layer 814 which is a structure similar to the first layer, may have the electrical signal line disposed thereon.
  • the printed circuit board 80 may include a step part that recessed toward the second layer 812 from the first layer 811 .
  • the step part may include a first step part S 1 , a second step part S 2 and a third step part (not shown) provided at positions corresponding to the arrangement of the first connection part 721 , the second connection part 722 , and the third connection part of the heat radiating member 70 .
  • the first step part S 1 , the second step part S 2 and the third step part may be formed to be extended in the direction away from the electronic component 30 , similarly to the first contact surface 101 , the second contact surface 102 , and the third contact surface 103 according to an exemplary embodiment described above, and may be radially disposed around the electronic component 30 .
  • a portion of the second layer 812 may be directly exposed to the outside of the printed circuit board 80 through the first step part S 1 , the second step part S 2 and the third step part.
  • first connection part 721 , the second connection part 722 , and the third connection part of the heat radiating member 70 may be directly in contact with the portion of the second layer 812 through the first step part S 1 , the second step part S 2 and the third step part.
  • the first connection part 721 , the second connection part 722 , and the third connection part may include a first supporting part 7211 , a second supporting part 7221 , and a third supporting part (not shown), respectively, that support the heat radiating plate 71 , and first contact part 7212 , the second contact part 7222 , and the third contact part that are bent from the first supporting part 7211 , the second supporting part 7221 , and the third supporting part.
  • the first supporting part 7211 , the second supporting part 7221 , and the third supporting part may connect between the heat radiating plate 71 which is in contact with the electronic component 30 and the first contact part 7212 , the second contact part 7222 , and the third contact part which are in contact with the second layer 812 , thereby making it possible to support the heat radiating plate 71 from the second layer 812 .
  • the first contact part 7212 , the second contact part 7222 , and the third contact part may have shapes corresponding to those of the first to third step parts S 1 , S 2 , and S 3 .
  • the first contact part 7212 , the second contact part 7222 , and the third contact part may be formed to be extended in the direction away from the electronic component 30 , and may be radially disposed around the electronic component 30 .
  • first thermal interface material 51 , the second thermal interface material 52 , and the third thermal interface material 53 may be respectively disposed between the first contact part 7212 , the second contact part 7222 , and the third contact part and the second layer 812 which is in contact with the first contact part 7212 , the second contact part 7222 , and the third contact part.
  • the heat transfer from the first contact part 7212 , the second contact part 7222 , and the third contact part to the second layer 812 may be easily performed.
  • the heat generated from the electronic component 30 may be conducted into the heat radiating plate 71 and may be spread through the interior of the heat radiating plate 71 .
  • a portion of the heat conducted to the heat radiating plate 71 may be transferred to the first connection part 721 , the second connection part 722 , and the third connection part, and may be transferred to the first contact part 7212 , the second contact part 7222 , and the third contact part coupled to the first connection part 721 , the second connection part 722 , and the third connection part, respectively.
  • the first contact part 7212 , the second contact part 7222 , and the third contact part may be directly connected to the second layer 812 through the first step part S 1 , the second step part S 2 , and the third step part, and heat of the first contact part 7212 , the second contact part 7222 , and the third contact part may be directly conducted to the second layer 812 .
  • first thermal interface material 51 , the second thermal interface material 52 , and the third thermal interface material 53 fill voids between the first contact part 7212 , the second contact part 7222 , and the third contact part and the second layer 812 , thereby making it possible to more efficiently transfer the heat of the heat radiating member 70 to the second layer 812 .
  • the heat transferred to the second layer 812 may be transferred to the core layer 831 , the third layer 813 , the second insulating layer 822 , and the fourth layer 814 through a plurality of via holes, and consequently, overall heat radiating performance of the printed circuit board assembly 3 may be improved.
  • FIG. 6 is a cross-sectional view schematically illustrating a cross section of a printed circuit board assembly 4 according to still another exemplary embodiment.
  • the printed circuit board assembly 4 may include a printed circuit board 10 ′, the heat radiating member 20 , the electronic component 30 which generates heat during operation thereof, and the plurality of elements 40 .
  • the heat radiating member 20 the electronic component 30 , and the plurality of elements 40 are the same as the configurations of the printed circuit board assembly 1 according to an exemplary embodiment described above, an overlapped description will be omitted.
  • the printed circuit board 10 ′ illustrated in FIG. 6 may include a first layer 111 ′ on which the electronic component 30 and the plurality of elements 40 are mounted and the electrical signal line such as the wiring pattern 11 may be disposed, and a second layer 112 ′ that may include the power layer and the ground layer.
  • the printed circuit board 10 ′ may include an insulating layer 121 ′ disposed between the first layer 111 ′ and the second layer 112 ′ to insulate the first layer 111 ′ and the second layer 112 ′ from each other.
  • a first contact surface 101 ′, a second contact surface 102 ′, and a third contact surface (not shown) which may be connected to the first connection part 221 , the second connection part 222 , and the third connection part 223 of the heat radiating member 20 may be radially disposed on the first layer 111 ′ of the printed circuit board 10 ′.
  • a plurality of via holes for example, a via hole 1011 ′ and a via hole 1021 ′, disposed in a direction away from the electronic component 30 may be provided in the first contact surface 101 ′, the second contact surface 102 ′, and the third contact surface, and the plurality of via holes may include inner circumference surfaces, for example, inner circumference surfaces 1012 ′ and 1022 ′, covered with a material having high thermal conductivity.
  • the heat transferred to the first contact surface 101 ′, the second contact surface 102 ′, and the third contact surface from the heat radiating member 20 may be transferred to the second layer 112 ′ through the plurality of via holes 1011 ′ and 1021 ′, and the heat transferred to the second layer 112 ′ may be discharged to the outside.
  • one side of the printed circuit board 10 ′ on which the electronic component 30 is mounted may convect the heat to an upper side of the printed circuit board 10 ′ through the heat radiating plate 21 of the heat radiating member 20 .
  • the heat is transferred to the first to third contact surfaces 101 ′, 102 ′, and 103 ′ from the first connection part 221 , the second connection part 222 , and the third connection part 223 , and the heat transferred to the first contact surface 101 ′, the second contact surface 102 ′, and the third contact surface is transferred to the second layer 112 ′, which is opposite to the first layer 111 ′, through the plurality of via holes 1011 ′ and 1021 ′, thereby making it possible to discharge the heat to a lower side of the printed circuit board 10 ′.
  • the printed circuit board 10 ′ according to the present exemplary embodiment is formed in a single layer unlike the printed circuit board 10 having the multilayer structure illustrated in FIG. 3 , a thickness of the printed circuit board 10 ′ may be thinner, and the structure of the printed circuit board 10 ′ may also be simplified.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Combustion & Propulsion (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
US15/664,369 2016-08-08 2017-07-31 Printed circuit board assembly Active 2037-08-06 US10925148B2 (en)

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KR1020160100589A KR102674888B1 (ko) 2016-08-08 2016-08-08 인쇄회로기판 조립체
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EP (1) EP3459324A4 (zh)
KR (1) KR102674888B1 (zh)
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CN110557881A (zh) * 2018-05-31 2019-12-10 南昌欧菲生物识别技术有限公司 电路板组件、光电模组、深度相机及电子装置
CN112804851A (zh) * 2019-10-28 2021-05-14 华为终端有限公司 一种电子设备
KR20210073817A (ko) * 2019-12-11 2021-06-21 동우 화인켐 주식회사 인쇄 회로 기판, 이를 포함하는 안테나 구조체 및 이를 포함하는 화상 표시 장치
CN113299193B (zh) * 2021-05-26 2022-03-22 惠科股份有限公司 显示模组及显示装置

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EP3459324A4 (en) 2019-06-12
CN107708286B (zh) 2022-01-11
WO2018030664A1 (en) 2018-02-15
KR20180016799A (ko) 2018-02-20
CN107708286A (zh) 2018-02-16
KR102674888B1 (ko) 2024-06-14
US20180042100A1 (en) 2018-02-08
EP3459324A1 (en) 2019-03-27

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