US10777485B2 - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
US10777485B2
US10777485B2 US16/375,976 US201916375976A US10777485B2 US 10777485 B2 US10777485 B2 US 10777485B2 US 201916375976 A US201916375976 A US 201916375976A US 10777485 B2 US10777485 B2 US 10777485B2
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Prior art keywords
coolers
bolt
pair
semiconductor device
bolts
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US16/375,976
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US20190318981A1 (en
Inventor
Yuya Takano
Fumiki Tanahashi
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Toyota Motor Corp
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Toyota Motor Corp
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Assigned to TOYOTA JIDOSHA KABUSHIKI KAISHA reassignment TOYOTA JIDOSHA KABUSHIKI KAISHA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: TAKANO, YUYA, TANAHASHI, FUMIKI
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L23/4012—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws for stacked arrangements of a plurality of semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4031—Packaged discrete devices, e.g. to-3 housings, diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/117—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N

Definitions

  • the teaching disclosed herein relates to a semiconductor device in which a plurality of coolers are arranged in a line and each of semiconductor modules is interposed between a corresponding pair of the coolers adjacent each other.
  • Patent Literature 1 Japanese Patent Application Publication No. 2007-66820 (Patent Literature 1) and Japanese Patent Application Publication No. 2012-238681 (Patent Literature 2) describes a semiconductor device including a plurality of coolers arranged in a line, and semiconductor modules each of which is interposed between a corresponding pair of the coolers adjacent to each other. Each of the semiconductor modules is cooled from its both sides by a coolant flowing in the corresponding pair of the coolers. To increase cooling efficiency, the semiconductor device is pressed in a stacking direction of the coolers and the semiconductor modules.
  • the semiconductor device in Patent Literature 1 has a compressed spring inserted between a casing and a stack of the coolers and the semiconductor modules, and is pressed by a force of the compressed spring in the stacking direction.
  • tabs are respectively provided at both ends of each of the coolers.
  • the tabs are provided at both ends of each cooler in a direction intersecting the stacking direction of the coolers and the semiconductor modules.
  • the coolers are fixed to each other by bolts penetrating the tabs in the stacking direction.
  • the semiconductor device is pressed by the bolts in the stacking direction.
  • Patent Literature 3 describes a semiconductor device in which a pair of coolers interposes a semiconductor module therebetween.
  • the pair of coolers is fixed by bolts penetrating the coolers in their stacking direction.
  • the bolts penetrate a coolant flow path in each of the coolers.
  • the semiconductor device in Patent Literature 3 is also pressed by the bolts in the stacking direction.
  • the semiconductor device in Patent Literature 1 requires a space for disposing the leaf spring.
  • the semiconductor device in Patent Literature 2 has its size increased due to the tabs.
  • the semiconductor device in Patent Literature 3 is provided with holes in each cooler through which the bolts penetrate, and thus requires gaskets (or O rings) for sealing gaps between the bolts and the holes.
  • the teaching disclosed herein relates to improvements in a semiconductor device in which pairs of coolers each of which interposes a semiconductor module therebetween are bolted in their stacking direction.
  • a semiconductor device disclosed herein may comprise a plurality of coolers arranged in a line, semiconductor modules, and a pair of connecting pipes.
  • Each of the coolers may include a first flow path through which a coolant flows.
  • Each of the semiconductor modules may be interposed between a corresponding pair of the coolers adjacent to each other.
  • Each of the pair of connecting pipes may communicate with the first flow paths in the coolers adjacent to each other.
  • the pair of connecting pipes may be located respectively at both sides of the semiconductor modules in a direction intersecting a stacking direction of the coolers and the semiconductor modules.
  • a pair of coolant holes may be provided at one of the coolers located at one end in the stacking direction, and each of the coolant holes may overlap corresponding one of the pair of connecting pipes in a view along the stacking direction.
  • a pair of second flow paths may extend respectively from the coolant holes to one of the coolers located at other end in the stacking direction.
  • a bolt-head retainer and an internally threaded portion may be provided in each of the second flow paths.
  • Each of the bolt-head retainers has a bolt inserted therein and retains a head of the bolt, and each of the internally threaded portions fixes the bolt.
  • the coolers between the bolt-head retainers and the internally threaded portions may be fixed by the bolts.
  • the coolers and the semiconductor modules are pressed against each other by a fastening load of the bolts.
  • each of the second flow paths is provided with the bolt-head retainer and the internally threaded portion. Therefore, the bolts are entirely accommodated in the second flow paths, fix the coolers to each other in the second flow paths, and apply pressure to the coolers and the semiconductor modules.
  • the semiconductor device disclosed herein does not require the tabs described in Patent Literature 2. Moreover, the bolts pass through the coolers in the second flow paths. Therefore, there is no need to newly provide bolt holes in the coolers for allowing the bolts to pass therethrough, and thus there is no need to seal gaps between the bolts and the bolt holes as in the semiconductor device in Patent Literature 3.
  • the semiconductor device disclosed herein may be of a type in which all of the coolers are fixed to each other by the bolts, or may be of a type in which only some of the coolers are fixed to each other by the bolts.
  • a compressed spring may be interposed between each of the bolt-head retainers and corresponding one of the heads of the bolts. Even when the bolts are somewhat loosened, the compressed springs can maintain the force to press the plurality of coolers in the stacking direction.
  • FIG. 1 is a perspective view of a semiconductor device in an embodiment (with bolts removed).
  • FIG. 2 is a cross-sectional view of the semiconductor device along an XY-plane.
  • FIG. 3 is a cross-sectional view taken along a line III-III in FIG. 2 .
  • FIG. 4 is a cross-sectional view taken along a line IV-IV in FIG. 2 .
  • FIG. 5 is a cross-sectional view of a semiconductor device in a first variant.
  • FIG. 6 is a cross-sectional view of a semiconductor device in a second variant.
  • FIG. 1 shows a perspective view of the semiconductor device 2 .
  • FIG. 2 shows a cross-sectional view of the semiconductor device 2 along an XY-plane in a coordinate system in FIG. 1 .
  • the semiconductor device 2 is a device in which a plurality of semiconductor modules 30 and a plurality of coolers 3 are bound by bolts 6 a , 6 b .
  • FIG. 1 shows a state in which the bolts 6 a , 6 b (which will be described later) are removed.
  • the bolts 6 a , 6 b are respectively inserted into coolant holes 5 a , 5 b (will be described later), and fix the plurality of coolers.
  • Each of the semiconductor modules 30 houses two transistors 31 connected in series (see FIG. 2 ).
  • the reference signs 30 , 31 are given only to the semiconductor module located at a right end, and are omitted for the remaining semiconductor modules.
  • a positive terminal 30 a , a negative terminal 30 b , and an intermediate terminal 30 c extend from one surface of each of the semiconductor modules 30 .
  • the positive terminal 30 a , the negative terminal 30 b , and the intermediate terminal 30 c are electrically conductive respectively with a positive electrode, a negative electrode, and a midpoint of the series connection of the two transistors 31 .
  • the reference signs 30 a to 30 c are given only to the terminals of the semiconductor module 30 located at the right end, and are omitted for the terminals of the remaining semiconductor modules.
  • the semiconductor device 2 which includes the plurality of semiconductor modules 30 each housing the series connection of the transistors, is used as a main component of an inverter or a voltage converter, for example.
  • the plurality of coolers 3 is arranged in a line in an X direction in the drawings, and each of the semiconductor modules 30 is interposed between a corresponding pair of the coolers 3 adjacent to each other.
  • the coolers 3 and the semiconductor modules 30 are alternately stacked one by one.
  • a reference sign 3 a is used for indicating the cooler 3 located at a left end in FIG. 2
  • a reference sign 3 b is used for indicating the cooler 3 located at the right end in FIG. 2 .
  • Each of the coolers 3 includes a flow path (a first flow path 12 ) through which a coolant passes.
  • the reference sign 12 is given only to the first flow path in the cooler 3 b located at the right end, and is omitted for the first flow paths in the remaining coolers.
  • the coolers 3 adjacent to each other are connected by a pair of connecting pipes 4 a , 4 b .
  • the reference signs 4 a , 4 b are given only to the connecting pipes located at the left end, and are omitted for the remaining connecting pipes.
  • Each pair of the connecting pipes 4 a , 4 b communicates with the first flow paths in the adjacent coolers 3 .
  • the connecting pipes 4 a , 4 b are located respectively at both sides of the semiconductor modules 30 in a direction (a Y direction in the drawings) intersecting a stacking direction (the X direction in the drawings) of the coolers 3 and the semiconductor modules 30 .
  • the stacking direction (the X direction in the drawings) of the coolers 3 and the semiconductor modules 30 may hereinafter be simply termed “stacking direction”.
  • the coolant holes 5 a , 5 b are provided at the cooler 3 a located at one end in the stacking direction.
  • the coolant hole 5 a is provided to overlap the connecting pipes 4 a in a view along the stacking direction.
  • the coolant hole 5 b is provided to overlap the connecting pipes 4 b in a view along the stacking direction.
  • a second flow path 13 is provided so as to extend straight from the coolant holes 5 a ( 5 b ) to the cooler 3 b located at the other end in the stacking direction, through the plurality of connecting pipes 4 a ( 4 b ) and the coolers 3 .
  • Each of the second flow paths 13 communicates with the first flow paths 12 in the coolers 3 .
  • a bolt-head retainer 7 is provided in each of the coolant holes 5 a , 5 b .
  • the bolt-head retainers 7 do not close the second flow paths 13 .
  • an internally threaded portion 8 is provided at a right end of each of the second flow paths 13 .
  • the internally threaded portions 8 do not close the second flow paths 13 , either.
  • the semiconductor device 2 cools the plurality of semiconductor modules 30 in a concentrated manner.
  • a cooling structure of the semiconductor device 2 will be described.
  • the coolant holes 5 a , 5 b are connected to a coolant circulation device, which is not shown.
  • a coolant is supplied from the coolant circulation device through one of the coolant holes, namely, the coolant hole 5 a .
  • the coolant is distributed to all of the coolers 3 (the first flow paths 12 ) through the second flow path 13 at a connecting pipes 4 a side. While passing through the first flow paths 12 , the coolant absorbs heat from the semiconductor modules 30 adjacent to the coolers 3 .
  • the coolant that has absorbed heat returns to the coolant circulation device through the second flow path 13 at a connecting pipes 45 side and the coolant hole 5 b . Since each of the semiconductor modules 30 is cooled from its both sides, the semiconductor device 2 has good cooling performance for the semiconductor modules 30 .
  • the coolant is a liquid, and is typically water or an anti-freeze solution.
  • the semiconductor modules 30 and the coolers 3 are preferably kept in contact strongly with one another.
  • the semiconductor modules 30 and the coolers 3 are bound by the bolts 6 a , 6 b , and are pressed in the stacking direction thereby.
  • the bolts 6 a , 6 b are entirely accommodated in the second flow paths 13 , respectively. Therefore, there is no need to ensure space for the bolts outside the coolers 3 , which provides good space efficiency.
  • the bolts 6 a , 6 b penetrate the coolers 3 through the second flow paths 13 , respectively.
  • the semiconductor device 2 there is no need to newly provide holes, through which the bolts 6 a , 6 b penetrate, in outer walls of the coolers 3 . In other words, the semiconductor device 2 does not need to newly include sealing means for the bolts 6 a , 6 b.
  • the bolt-head retainer 7 that has the bolt 6 a ( 6 b ) inserted therein and retain a head 61 of the bolt 6 a ( 6 b ) is provided in the coolant hole 5 a ( 5 b ), namely, in the second flow path 13 .
  • the internally threaded portion 8 to which the bolt 6 a ( 6 b ) is fixed, is provided in the cooler 3 b located opposite to the coolant holes 5 a , 5 b (in other words, at ends of the second flow paths 13 ).
  • FIG. 3 shows a cross section taken along a line III-III in FIG. 2 , namely, a cross section of one of the bolt-head retainers 7 .
  • the bolt-head retainer 7 has its both ends jointed to an inner side of the coolant hole 5 a .
  • a gap is ensured between the bolt-head retainer 7 and an inner surface of the coolant hole 5 a .
  • the bolt-head retainer 7 does not close the second flow path 13 .
  • the coolant can pass over the bolt-head retainer 7 .
  • the bolt-head retainer 7 is provided with a through hole 7 a through which the bolt 6 a is inserted.
  • FIG. 3 depicts the head 61 of the bolt 6 a by an imaginary line. As shown in FIG. 3 , the through hole 7 a is smaller than the head 61 . Therefore, the head 61 of the bolt 6 a that has passed through the through hole 7 a is retained by the bolt-head retainer 7 .
  • the bolt-head retainer 7 is constituted of a metal such as aluminum or copper, and is joined to the inner surface of the coolant hole 5 a by welding.
  • FIG. 4 shows a cross section taken along a line IV-IV in FIG. 2 , namely, a cross section of one of the internally threaded portions 8 .
  • the internally threaded portion 8 includes an internally threaded hole 8 a provided with an internally threaded groove.
  • the bolt 6 a is fixed to the internally threaded hole 8 a .
  • the second flow path 13 and the first flow path 12 are linked through a lateral side of the internally threaded portion 8 .
  • a chain double-dashed line in FIG. 4 indicates a boundary (a boundary merely for convenience sake) between the first flow path 12 and the second flow path 13 .
  • the internally threaded portion 8 is constituted of a metal such as aluminum or copper, and is joined to an inner surface of the cooler 3 b by welding.
  • the bolt 6 a is entirely accommodated in the second flow path 13 by the bolt-head retainer 7 and the internally threaded portion 8 which, are located in the second flow path 13 . Therefore, there is no need to provide a space for the bolt outside the coolers 3 , and there is no need to provide a sealing structure dedicated to the bolt 6 a.
  • the coolers 3 between the head 61 retained at the bolt-head retainer 7 and the internally threaded portion 8 to which the bolt 6 a ( 6 b ) is fixed are tightened by the bolt 6 a ( 6 b ).
  • This tightening force presses the coolers 3 and the semiconductor modules 30 , and brings the coolers 3 and the semiconductor modules 30 into contact strongly with one another.
  • FIG. 5 shows a cross-sectional view of a semiconductor device 2 a in a first variant.
  • a compressed spring 62 is interposed between each of the bolt-head retainers 7 and corresponding one of the heads 61 of the bolts 6 a , 6 b .
  • the compressed spring 62 applies load on the head 61 toward the coolant hole 5 a ( 5 b ).
  • the load of the compressed spring 62 pushes the bolt-head retainer 7 toward the internally threaded portion 8 . Consequently, the coolers 3 between the bolt-head retainers 7 and the internally threaded portions 8 are pressed in the stacking direction.
  • the compressed spring 62 can maintain the force to press the plurality of coolers 3 in the stacking direction.
  • FIG. 6 shows a cross-sectional view of a semiconductor device 2 b in a second variant.
  • the semiconductor device 2 in the embodiment all of the stacked coolers 3 are fixed to each other by the bolts 6 a , 6 b .
  • the semiconductor device 2 b in the second variant some of the coolers 3 are fixed by the bolts.
  • the semiconductor device 2 b includes bolt-head retainers 57 in the cooler 3 c that is next to the cooler 3 a located at the left end. Moreover, the semiconductor device 2 b includes internally threaded portions 58 respectively in the connecting pipes 4 a , 4 b connected to the cooler 3 b located at the right end. Neither the bolt-head retainers 57 nor the internally threaded portions 58 closes the second flow paths 13 .
  • Each of bolts 56 a , 56 b has its head 61 retained by its corresponding bolt-head retainer 57 and has its tip fixed to the internally threaded portion 58 .
  • the coolers 3 located between the bolt-head retainers 57 and the internally threaded portions 58 i.e., the coolers 3 except for the coolers 3 a , 3 b
  • the coolers 3 and the semiconductor modules 30 are brought into intimate contact with one another.
  • the coolers 3 except for the coolers 3 a , 3 b are fixed to each other by the bolts 56 a , 56 b .
  • the coolers 3 a , 3 b may be pressed by another means.

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
US16/375,976 2018-04-12 2019-04-05 Semiconductor device Active US10777485B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-077017 2018-04-12
JP2018077017A JP6973256B2 (ja) 2018-04-12 2018-04-12 半導体装置

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US20190318981A1 US20190318981A1 (en) 2019-10-17
US10777485B2 true US10777485B2 (en) 2020-09-15

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20200196484A1 (en) * 2017-05-31 2020-06-18 Hanon Systems Heat exchanger for cooling electrical device

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JP2007166820A (ja) 2005-12-15 2007-06-28 Denso Corp 電力変換装置
JP2009212137A (ja) 2008-02-29 2009-09-17 Nissan Motor Co Ltd 発熱素子の冷却装置
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JP2012238681A (ja) 2011-05-11 2012-12-06 Denso Corp 電力変換装置
US20160064304A1 (en) * 2014-09-02 2016-03-03 Toyota Jidosha Kabushiki Kaisha Semiconductor device and manufacturing method of semiconductor device
US20160064305A1 (en) * 2014-08-28 2016-03-03 Toyota Jidosha Kabushiki Kaisha Semiconductor device and method of manufacturing the same
US20160079145A1 (en) * 2014-09-12 2016-03-17 Denso Corporation Electric power converter and method for manufacturing the same
US20160329264A1 (en) * 2012-12-07 2016-11-10 Abb Technology Ltd Semiconductor assembly

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JP2014112583A (ja) * 2012-12-05 2014-06-19 Toyota Motor Corp 冷却器付き半導体モジュール
JP6323557B2 (ja) * 2014-07-17 2018-05-16 富士電機株式会社 半導体装置
JP2016127774A (ja) * 2015-01-08 2016-07-11 トヨタ自動車株式会社 電力変換器
JP6544221B2 (ja) * 2015-12-09 2019-07-17 株式会社デンソー 電力変換装置
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US20010033477A1 (en) * 2000-04-19 2001-10-25 Seiji Inoue Coolant cooled type semiconductor device
JP2007166820A (ja) 2005-12-15 2007-06-28 Denso Corp 電力変換装置
JP2009212137A (ja) 2008-02-29 2009-09-17 Nissan Motor Co Ltd 発熱素子の冷却装置
US20120001341A1 (en) * 2010-06-30 2012-01-05 Denso Corporation Semiconductor device
JP2012238681A (ja) 2011-05-11 2012-12-06 Denso Corp 電力変換装置
US20160329264A1 (en) * 2012-12-07 2016-11-10 Abb Technology Ltd Semiconductor assembly
US20160064305A1 (en) * 2014-08-28 2016-03-03 Toyota Jidosha Kabushiki Kaisha Semiconductor device and method of manufacturing the same
US20160064304A1 (en) * 2014-09-02 2016-03-03 Toyota Jidosha Kabushiki Kaisha Semiconductor device and manufacturing method of semiconductor device
JP2016051874A (ja) 2014-09-02 2016-04-11 トヨタ自動車株式会社 半導体装置及びその製造方法
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20200196484A1 (en) * 2017-05-31 2020-06-18 Hanon Systems Heat exchanger for cooling electrical device
US11439040B2 (en) * 2017-05-31 2022-09-06 Hanon Systems Heat exchanger for cooling electrical device

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JP2019186430A (ja) 2019-10-24
JP6973256B2 (ja) 2021-11-24
CN110379788B (zh) 2022-11-15
US20190318981A1 (en) 2019-10-17
CN110379788A (zh) 2019-10-25

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